KR102370860B1 - Copper alloy sheet material, connector, and method for manufacturing copper alloy sheet material - Google Patents

Abstract

[Task] By appropriately controlling the average length (AW) of corrugated motifs and the average depth (W) of corrugated motifs, which are measures of microscopic irregularities on the surface of the plate, it has excellent bending workability and abrasion resistance. To provide a copper alloy sheet suitable for a connector and terminal material, a relay, a switch, a socket, etc., such as a terminal material, for mounting on an automobile vehicle, a connector using the same, and a method for manufacturing the copper alloy sheet.
[Solutions] 1.00 to 6.00 mass % of Ni and 0.10 to 2.00 mass % of Si, the balance being copper and unavoidable impurities, the average length (AW) of the wavy motifs on the surface of the plate material is 5.00 μm or more, the average of the wavy motifs A copper alloy sheet having a depth (W) of 0.50 μm or more, a connector using the same, and a method for manufacturing the copper alloy sheet.

Description

Copper alloy plate, connector, and manufacturing method of copper alloy plate

The present invention relates to a copper alloy sheet material, a connector using the same, and a method for manufacturing the copper alloy sheet material, and in particular, has excellent bending workability and wear resistance, and is a lead frame, connector, and terminal material for vehicle-mounted parts and electric/electronic devices. , a copper alloy plate applied to a relay, a switch, a socket, etc., a connector using the same, and a method of manufacturing the copper alloy plate.

Conductivity, proof strength (yield stress), tensile strength, and bending properties required for copper alloy plates used for vehicle-mounted parts or lead frames for electrical and electronic devices, connectors, terminal materials, relays, switches, sockets, etc. It has machinability, stress relaxation resistance, and fatigue properties. In recent years, this required characteristic is increasing with size reduction, weight reduction, high functionalization, high density mounting, and temperature increase of a use environment of an electric/electronic device. In particular, since the demand for thinning the thickness of copper or copper alloy plate materials used for vehicle-mounted parts and parts for electric/electronic devices is increasing, the required strength level is higher.

In addition, materials used for components such as connectors, lead frames, relays, and switches constituting vehicle-mounted components and electrical/electronic components cannot withstand the stress applied during assembly or operation of vehicle-mounted components or electrical/electronic devices. high strength is required. In addition to this, since the use of vehicle mounting parts and the electrical/electronic parts are generally formed by bending, excellent bending workability is calculated|required.

As a method of strengthening a copper alloy sheet, there is precipitation strengthening in which a fine second phase is deposited in the material. This strengthening method is used in many alloy systems because it has the merit of simultaneously improving the electrical conductivity in addition to increasing the strength. However, with the miniaturization of parts used in electronic devices and automobiles these days, the copper alloy used is designed to be bent at a smaller radius with a higher strength material, and the copper alloy sheet material with excellent bending workability is strong. is being demanded Moreover, when bending is performed, the unevenness|corrugation in the vicinity of the surface of a material becomes large, and if a processing condition is made strict, a crack will generate|occur|produce from the recessed part as a starting point. Due to the development of cracks in the thickness direction, the cross-sectional area becomes small locally, the electrical resistance value increases when used as an electrical contact, and the material generates heat. Moreover, abrasion of a contact part will advance by this unevenness|corrugation. Therefore, while satisfy|filling each said required characteristic, it was calculated|required to improve abrasion resistance.

In these vehicle-mounted parts and copper alloy sheet materials for electric/electronic devices, several proposals have been made to achieve the required characteristics by controlling the metal structure (roughness, etc.) and texture of the surface layer portion. For example, in patent document 1, the fatigue life of a board|plate material is improved by controlling the maximum trough depth (Rv) of the board|plate material surface of a Cu-Ni-Si type|system|group alloy. In Patent Document 2, bending workability is achieved by controlling the ratio of the number of shear bands from the surface to a depth of 1/6t of the plate thickness in the plate thickness direction of the Cu-Ni-Si alloy to the number of shear bands in other portions in the direction of the thickness of the Cu-Ni-Si alloy. or the appearance of the bent part is improved. In patent document 3, bending workability is improved by controlling the area ratio and number (dispersion density) of the crystal grains which have Cube orientation of a Cu-Ni-Si type alloy.

In the invention described in Patent Document 1, the compressive residual stress on the surface of the plate material is 20 to 200 MPa, and the maximum trough depth (Rz) of the surface is 1.0 μm or less, thereby reducing the concave portion of the material in the fatigue test, and high strength The fatigue properties of copper alloy plates are reduced. However, in Patent Document 1, the improvement of bending workability and abrasion resistance is not paid attention and is not described. In addition, in Patent Document 1, no attention is paid to the control of the waviness motif on the surface of the plate material, and there is no suggestion at all about the relationship between this and bending workability or wear resistance.

In the invention described in Patent Document 2, the ratio of the number of shear bands in the surface layer from the surface to a depth of 1/6t of the plate thickness in the plate thickness direction and the other inside is controlled, and the number of shear bands in the plate material surface layer is , by setting the number of shear bands or less within the thickness of the sheet to improve the bending workability, and also to reduce the non-uniform deformation near the surface layer during bending, thereby improving the skin roughness of the GW bending surface. However, in Patent Document 2, no attention is paid to, and no description is made about, improvement of abrasion resistance. In addition, no attention is paid to the control of the wavy motif on the surface of the sheet material, and there is no suggestion at all about the relationship between this and bending workability or wear resistance.

In invention described in patent document 3, bending workability is improved by controlling the size and number of cube orientation crystal grains. However, in patent document 3, attention is not paid and it does not describe about the improvement of abrasion resistance. In addition, no attention is paid to the control of the wavy motif on the surface of the sheet material, and there is no suggestion at all about the relationship between this and bending workability or wear resistance. In addition, there is no suggestion at all about the distribution of the cube orientation crystal grains in the plate thickness direction and the relationship between bending workability and wear resistance.

Japanese Laid-Open Patent Publication No. 2005-48262 Japanese Patent Laid-Open No. 2011-214087 Publication WO2012/150702 A1

When a Corson-based alloy (Cu-Ni-Si-based alloy) plate material is processed and used as a contact part of a terminal, the appearance of the Corson-based alloy bending part is inferior to that of phosphor bronze, and the surface irregularities are large. There is a characteristic. This is because, when a bending test of the sheet material is performed, tensile stress is applied in the vicinity of the sheet thickness surface layer, and plastic deformation occurs. This deformation in the vicinity of the surface layer originates in the non-uniform deformation in the metal structure. And by this non-uniform deformation|transformation, when unevenness|corrugation generate|occur|produces and it uses as an electrical contact member, abrasion of a contact part will advance by this unevenness|corrugation. In addition, when normal roughening (for example, the buffing described in Patent Document 1) is performed on the surface of the sheet material, in the unevenness of the surface of the sheet material, the convex highest point and the deepest concave portion are transverse direction (processing direction or sheet width direction) ) is shortened, and the depth in the longitudinal direction (thickness direction) of the convex highest point and the concave deepest part becomes shallow, and abrasion at the time of using it as a contact part advances easily.

In view of the problems of the prior art as described above, the present invention, by appropriately controlling the average length (AW) of the waveform motif and the average depth (W) of the waveform motif, which are measures of microscopic irregularities on the surface of the plate, bending workability and wear resistance Copper alloy sheet material suitable for lead frame, connector, terminal material, etc. for electric and electronic equipment, connector or terminal material for vehicle mounting, relay, switch, socket, etc., a connector using the same, and a method for manufacturing the copper alloy sheet material The task is to provide

The present inventors have researched on a copper alloy suitable for applications such as electric/electronic parts, automobile and vehicle mounting parts, and in the Cu-Ni-Si-based copper alloy, the bending surface properties for achieving good bending workability and wear resistance As a result of the investigation, by controlling the specific surface properties defined by the corrugated motif, the lengths of the convex peak and the deepest part in the convex direction are enlarged with respect to the unevenness of the surface of the plate material, and the convex peak and the concave part are enlarged. It can be seen that the depth in the longitudinal direction (thickness direction) of the deepest part is increased, and as a result, the surface after bending is deformed uniformly, thereby preventing the progress of local wear, and it can be seen that bending workability and wear resistance are greatly improved, It turned out that the excellent bending workability and the outstanding wear resistance can be obtained than the conventional one. Further, in addition to the control of the surface properties described above, it was found that there was also a correlation between bending workability and wear resistance in the accumulation ratio in the plate material surface layer up to a specific depth of the crystal grains having the Cube orientation, and the specific surface defined by the corrugation motif. In addition to controlling the properties, it was found that the improvement effect was further improved by controlling the abundance ratio of crystal grains having a Cube orientation in a specific range in the plate material surface layer portion up to a specific depth in the sheet thickness direction. The present invention has been completed based on these findings.

That is, according to the present invention, the means described below are provided:

(1) A copper alloy sheet material containing 1.00 to 6.00 mass % of Ni and 0.10 to 2.00 mass % of Si, the balance being copper and unavoidable impurities;

A copper alloy sheet material, characterized in that the wavy motif average length (AW) of the surface of the sheet material is 5.00 µm or more, and the wavy motif average depth (W) is 0.50 µm or more.

(2) 1.00 to 6.00 mass % of Ni and 0.10 to 2.00 mass % of Si, and at least selected from the group consisting of B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag and Sn. A copper alloy sheet material containing 0.005 to 3.000 mass % of one type in total, the balance being copper and unavoidable impurities,

A copper alloy sheet material, characterized in that the average length (AW) of the wavy motifs on the surface of the sheet material is 5.00 µm or more, and the average depth (W) of the corrugation motifs is 0.50 µm or more.

(3) in the surface layer portion from the surface of the copper alloy sheet to a position of 1/8 of the sheet thickness, crystal grains having a Cube orientation with respect to the rolled surface of the copper alloy sheet have an area ratio of 5.0% or more, (1 ) or the copper alloy sheet material according to (2).

(4) The copper alloy sheet material according to any one of (1) to (3), wherein the surface roughness (Ra) of the copper alloy sheet material is 0.20 µm or less.

(5) The copper alloy sheet material according to any one of (1) to (4), wherein the copper alloy sheet material has a dynamic friction coefficient of 0.5 or less after performing a sliding test of 30 reciprocations under a load of 100 g in the vertical direction of rolling of the copper alloy sheet material.

(6) The copper according to any one of (1) to (5), wherein in the 180° U-bending test of the copper alloy sheet material, the bending axis can be bent without cracks in either the rolling parallel direction or the rolling vertical direction. alloy plate.

(7) A connector comprising the copper alloy plate material according to any one of (1) to (6).

(8) contains 1.00 to 6.00 mass % of Ni and 0.10 to 2.00 mass % of Si, and at least selected from the group consisting of B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag and Sn. After melting and casting a copper alloy material containing 0.000 to 3.000 mass % of one type in total, the remainder being copper and unavoidable impurities [Step 1], homogenization heat treatment [Step 2], hot rolling [Step 3], water cooling [Process 4], cold rolling 1 [process 6], cold rolling 2 [process 7], roller leveler [process 8], intermediate solution heat treatment [process 9], aging precipitation heat treatment [process 10], cold A method of manufacturing a copper alloy sheet in which each step of rolling 3 [step 12] and final annealing [step 13] is performed in this order,

In the cold rolling 1 [Step 6], processing is performed at a total working rate of 50 to 90%,

In the cold rolling 2 [Step 7], the tension at the time of rolling is 50 to 400 MPa, the roll roughness (Ra) of the rolling mill is 0.5 μm or more, and the processing is performed at a total working rate of 30% or more,

The method for manufacturing a copper alloy sheet material, wherein the roller leveler [Step 8] performs processing such that the number of benders is 9 or more, and the intermesh as an indentation amount is 0.2% or more.

(9) the copper alloy material contains 0.005 to 3.000 mass% in total of at least one selected from the group consisting of B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag and Sn, (8) The manufacturing method of the copper alloy plate material as described in item|item.

(10) The method for manufacturing a copper alloy sheet material according to item (8) or (9), wherein chamfering [step 5] is performed between the water cooling [step 4] and the cold rolling 1 [step 6].

(11) The copper according to any one of (8) to (10), wherein pickling and polishing [Step 11] are performed between the aging precipitation heat treatment [Step 10] and the cold rolling 3 [Step 12]. A method for manufacturing an alloy plate.

Hereinafter, with reference to FIG. 1, it demonstrates.

Here, the "wavy motif average length (AW)" of the plate material surface means the concave (valley) of the motif from the convex (mountainous) highest point (calculation) (H _j ) of one motif with respect to the unevenness of the plate material surface. Let the horizontal length from the deep part (bottom of the valley) to another convex (mountainous) highest point (mountain) of the motif (H _j+1 ) be the length (AR _j ) of the waveform motif, Evaluation of length Refers to the arithmetic mean of the length. In addition, the "average depth (W) of a waveform motif" refers to the distance from the convex highest point (H _j ) of one motif through the deepest concave part of the motif to another convex highest point (H _{j + 1} ) of the motif. Let the distance (depth) from the highest point (ie, the calculation of either side) in the vertical direction (thickness direction) to the lowest point (ie, the bottom of the valley) as the depth of the waveform motif (W _j =H _{j + 1} ), It refers to the arithmetic mean value in the evaluation length with respect to this waveform motif depth. These waveform motif average length (AW) and average depth (W) of waveform motifs are motif parameters according to the definition of surface properties standardized by JIS (JIS B 0631:2000).

In the copper alloy sheet material of the present invention, by controlling the average length (AW) of the corrugation motifs and the average depth (W) of the corrugation motifs on the surface of the sheet material, the Cube orientation of the surface layer portion of the sheet material up to a specific depth in the sheet thickness direction is preferably added. By controlling the area ratio of the grains, it has excellent bending workability and wear resistance, and is particularly suitable for connectors and terminal materials, relays, switches, sockets, etc. have Moreover, the manufacturing method of this invention is suitable as a method of manufacturing the said copper alloy plate material stably at low cost.

The above and other characteristics and advantages of the present invention will become more apparent from the following description with reference to the accompanying drawings as appropriate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the roughness motif A and the waveform motif B, and is a figure explaining the waveform motif average length AW and the waveform motif average depth W. As shown in FIG.
Fig. 2 is a schematic diagram for explaining the benders (nine in the figure) and the press-fitting amount (intermesh) in the roller leveler [Step 8] in one specific example of the manufacturing method of the present invention.
Fig. 3 is an electron micrograph (magnification of 500) showing the metal structure of the plate material surface layer portion in the case of cracks in Comparative Example 4;

A preferred embodiment of the copper alloy sheet material of the present invention will be described in detail. In addition, the "plate material" in this invention shall also include a "steel material".

[alloy composition]

First, the composition of the copper alloy constituting the plate material of the present invention will be described.

(essential additive)

The contents of essential addition elements Ni and Si to the copper alloy constituting the plate material of the present invention and their action are shown.

(Ni)

Ni is an element which is contained together with Si mentioned later, forms _Ni2Si phase which precipitated by aging precipitation heat processing, and contributes to the improvement of the intensity|strength of a copper alloy plate material. Content of Ni is 1.00-6.00 mass %, Preferably it is 1.20-5.50 mass %, More preferably, it is 1.50-5.00 mass %. By setting the Ni content in the above range, the Ni ₂ Si phase can be properly formed, and the mechanical strength (tensile strength or 0.2% yield strength) of the copper alloy sheet material can be increased. Moreover, electrical conductivity is also high. Moreover, the hot rolling workability is also favorable.

(Si)

Si is contained together with the Ni, forms a Ni ₂ Si phase precipitated by aging precipitation heat treatment, and contributes to the improvement of the strength of the copper alloy sheet material. Content of Si is 0.1-2.0 mass %, Preferably it is 0.20-1.80 mass %, More preferably, it is 0.50-1.50 mass %. As for the content of Si, in a stoichiometric ratio, Ni/Si=4.2 has the best balance between conductivity and strength. Therefore, as for content of Si, it is preferable to make Ni/Si become the range of 2.50-7.50, More preferably, it is 3.00-6.50. By making the content of Si into the above range, it is possible to increase the tensile strength of the copper alloy sheet material. In this case, excess Si is dissolved in the copper matrix and the conductivity of the copper alloy sheet is not reduced. Moreover, the castability at the time of casting and the rolling workability in hot and cold are also favorable, and casting cracks and rolling cracks do not generate|occur|produce.

(additive element)

Next, the types of sub-addition elements in the copper alloy constituting the plate material of the present invention and the effect of the addition will be described. In the present invention, it is not necessary to contain an additive element, but when it is contained, preferred examples of the additive element include B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag and Sn. If these elements are 3.000 mass % or less in total, since the deformation which reduces electrical conductivity does not raise|generate, it is preferable. In order to fully utilize the effect of addition and not to lower the electrical conductivity, the total amount is preferably 0.005 to 3.000 mass %, more preferably 0.010 to 2.800 mass %, and particularly preferably 0.030 to 2.500 mass %. Incidentally, when the total amount of these auxiliary additives is less than 0.005 mass %, they are treated as unavoidable impurities. The effect of adding each element is shown below.

(Mg, Sn, Zn)

Mg, Sn, and Zn improve stress relaxation resistance by adding them. Stress relaxation resistance is further improved by a synergistic effect when all are added than when each is added. Moreover, there is an effect that solder embrittlement is remarkably improved. Each content of Mg, Sn, and Zn becomes like this. Preferably it is 0.050-0.750 mass %, More preferably, it is 0.100-0.750 mass %.

(Mn, Ag, B, P)

When Mn, Ag, B, and P are added, hot workability is improved and strength is improved. Each content of Mn, Ag, B, and P is preferably 0.050 to 0.160 mass%, more preferably 0.050 to 0.150 mass%.

(Cr, Zr, Fe, Co)

Cr, Zr, Fe, and Co are finely precipitated in a compound or a single substance, and contribute to precipitation hardening. Moreover, as a compound, it precipitates to a size of 50 to 500 nm, and suppresses grain growth, thereby having an effect of making a grain size fine, thereby improving bending workability. Each content of Cr, Zr, Fe, and Co becomes like this. Preferably it is 0.050-0.500 mass %, More preferably, it is 0.100-0.450 mass %.

[Waveform motif]

The copper alloy sheet material of the present invention has a corrugation motif average length (AW) of 5.00 µm or more and a corrugation motif average depth (W) of 0.50 µm or more on the surface of the sheet material. As described above with reference to FIG. 1 , the waveform motif average length AW is preferably 5.50 μm or more. The waveform motif average depth W is preferably 0.55 μm or more. More preferably, the waveform motif average length AW is 6.00 µm or more, and the waveform motif average depth W is 0.60 µm or more. Although these upper limits are not specifically limited, Usually, the waveform motif average length AW is 10.00 micrometer or less, and the waveform motif average depth W is 1.10 micrometer or less. In the surface of the copper alloy sheet material, by controlling the average length (AW) of the wavy motifs to 5.00 µm or more and the average depth (W) of the corrugation motifs to 0.50 µm or more, the bending workability and wear resistance are excellent, electrical/electronic It is possible to obtain a copper alloy suitable for applications such as equipment and automobile loading parts. In this way, by appropriately controlling both the corrugated motif average length (AW) and the corrugated motif average depth (W), the surface after bending becomes a surface property that can be deformed uniformly, and extremely minute irregularities that become the starting point of wear It is thought that the wear resistance can be prevented and the wear resistance is improved by preventing the progress of local wear.

[Surface roughness]

The copper alloy sheet material of the present invention preferably has a surface roughness (Ra) of 0.20 µm or less on the sheet material surface. The surface roughness (Ra) is more preferably 0.08 to 0.18 µm. On the surface of the copper alloy sheet, by controlling the surface roughness (Ra) to 0.20 µm or less, it is possible to improve bending workability and wear resistance. Here, surface roughness Ra is the arithmetic mean roughness prescribed|regulated by JIS　B　0631:2000.

[Area ratio of crystal grains having Cube orientation of the surface layer part in the thickness direction]

In the copper alloy sheet material of the present invention, in the crystal orientation analysis in EBSD measurement, Cube orientation {0 0 0 1} <1 0 0 0 0 0 It is preferable that the grains having > have an area ratio of 5.0% or more of the rolled surface of the plate material. The area ratio of the crystal grains having the Cube orientation of the plate material surface layer portion is more preferably 8.0% or more. Although the upper limit of the area ratio of the crystal grains which has a Cube orientation of a board|plate material surface layer part is not specifically limited, Usually, it is 30.0 % or less. In this invention, let the plate|board thickness be t, and let the depth area|region from the plate|board material surface 0t to the position of 1/8t in the plate|board thickness direction be the surface layer part of a board|plate material. In this specification, this surface layer part is also referred to as "surface layer part (0t to 1/8t)" for convenience. In addition, "a crystal grain having a cube orientation {0　0　1}<1　0　0>" is also abbreviated as a "Cube orientation crystal grain".

By controlling the distribution of the cube orientation grains in the vicinity of the plate material surface to 5.0% or more in the surface layer portions (0t to 1/8t), it is possible to improve wear resistance and improve bending workability. This is considered to be because the generation of shear bands generated in bending can be suppressed by controlling the area ratio of the Cube orientation crystal grains in the surface layer portions (0t to 1/8t) to 5.0% or more.

In order to improve the bending workability of a copper alloy plate material, the present inventors investigated the cause of the occurrence of the crack (refer FIG. 3) which generate|occur|produces in a bending work part. As a result, it was confirmed that the cause was that plastic deformation was locally developed to form a shear deformation zone, and micro-voids were generated and connected by local work hardening and reached the molding limit. As a countermeasure, it was found effective to increase the ratio of the crystal orientation in which work hardening hardly occurs in bending deformation. That is, it turned out that favorable bending workability was shown when the area ratio of Cube orientation crystal grains in a plate|board thickness direction surface layer part was 5 % or more. When the area ratio of Cube orientation crystal grains is more than the said lower limit, the above-mentioned effect is fully exhibited.

In this specification, a crack is a wound on the surface of a material, and means that the interface between crystal grains is spaced apart for one or more crystal grains.

When using a copper alloy plate material especially as a connector etc., the direction of a bending process may be processed either in the rolling parallel direction and rolling perpendicular|vertical direction in the board|plate material surface. Therefore, with respect to a copper alloy sheet material used as a connector material, etc., by reducing the anisotropy of strength and bending workability in the rolling parallel (RD or LD) and rolling vertical direction (TD) in the sheet material plane, when processing in any direction of the mold design and the advantages of stabilizing the spring force of the connector. From this point, the crystal grains having crystal orientations other than the Cube orientation have different crystal planes in the rolling parallel direction and the rolling vertical direction in the plane of the plate material. On the other hand, since cube orientation crystal grains first grown in the surface layer portion (0t to 1/8t) according to the present invention face the (100) plane in both RD and TD, the anisotropy of bending workability becomes small.

In addition, when the surface properties are controlled, the Cube orientation crystal grains are located at the bottom of the micro concave portion, that is, the valley of the depth of the wave motif, and the sheet material normal direction (ND) of the surface layer portion by bending processing, the sheet material width direction (rolling vertical direction, TD) and the sheet material processing direction (rolling parallel direction, RD) are responsible for deformation in each direction, thereby improving bending workability.

In order to clarify the cause of the occurrence of cracks during bending of the material, the present inventors investigated the metal structure of the cross section after bending deformation by electron microscopy and electron backscattering diffraction measurement (hereinafter also referred to as EBSD) in detail. . As a result, it was observed that, in the bending of the base material (plate material), the crystal grains were not deformed uniformly, but non-uniform deformation in which the deformation was concentrated only in a region of a specific crystal orientation proceeded. And it turns out that wrinkles and cracks with a depth of several micrometers generate|occur|produce on the surface (outside of bending) of the base material after bending by the non-uniform deformation|transformation. In addition, in 90° bending processing, deformation is imparted to the outermost surface of the plate material, whereas in 180° bending, not only the outermost surface of the thin plate material, but also in the region from the outermost surface of the plate material to the 1/8 position in the plate thickness direction. It can be seen that not only the crystal grains on the outermost surface but also the crystal grains up to the depth of 1/8 position in the plate thickness direction are involved in the local deformation region developing from the outermost surface. And, the local strain zone is not observed very much in Cube orientation grains, and it turns out that Cube orientation crystal grains have the effect of suppressing non-uniform deformation|transformation. As a result, it turns out that the unevenness|corrugation which generate|occur|produces on the board|plate surface is reduced and a crack is suppressed. On the other hand, crystal grains having orientation components other than the Cube orientation, such as the Brass orientation, are often accompanied by local deformation after bending deformation, and it can be seen that the bendability is adversely affected.

[Evaluation of texture distribution in the thickness direction]

About the area ratio of the Cube orientation crystal grains in a copper alloy, in order to investigate the distribution to the plate|board thickness direction, it measured by changing the grinding|polishing amount. In order to observe the structure of the surface layer portions (0t to 1/8t) in the plate thickness direction, the back surface of the test piece is masked, and only the surface is electrolytically polished. At this time, polishing is carried out paying attention to the point that the surface of the test piece is mirror-finished and the point that the amount of polishing is minimal. In fact, it turns out that by fine-tuning the polishing amount by electropolishing here, the structure of 0t to 1/8t can be grasped, and detailed analysis can be performed in the EBSD analysis. The measurement of the prepared test piece scanned the range of 300 micrometers x 300 micrometers in 0.1 micrometer step by the orientation analysis by EBSD, and measured the area ratio of Cube orientation crystal grains.

[EBSD Act]

The EBSD method is used for the analysis of the crystal orientation in the present invention. The EBSD method is an abbreviation of Electron BackScatter Diffraction, and is a crystal orientation analysis technique using reflected electron Kikuchi ray diffraction generated when a sample is irradiated with an electron beam in a scanning electron microscope (SEM). A sample area of 300 µm x 300 µm containing 200 or more crystal grains is scanned in 0.1 µm steps, and the crystal orientation of each crystal grain is analyzed. The measurement area and scan step are set to 300 x 300 µm and 0.1 µm from the size of the grains of the sample. The area ratio of each orientation is calculated by calculating the area of the grains having the normal line of the grain within ±10° from the ideal orientation of the cube orientation {0　0　1}<1　0　0>, It can be obtained as a ratio. Although the information obtained in the azimuth analysis by EBSD includes azimuth information up to a depth of several 10 nm where the electron beam penetrates the sample, since it is sufficiently small for the area being measured, it is described as an area ratio in this specification. . In addition, since the azimuth distribution changes in the plate thickness direction, it is preferable that the azimuth analysis by EBSD randomly selects several points in the plate thickness direction and averages them.

[Directions other than cube orientations]

In addition to the Cube orientation within the above range, in the plate thickness direction surface layer portion, the S orientation {3　2　1}<3　4　6>, the copper orientation {1　2　1}<1　-1　1>, the Brass orientation {1　1　0}< 1　-1　2>, Goss direction {1　1　0}<0　0　1>, R1 direction {2　3　6}<3　8　5>, RDW orientation {1　0　2}<0　-1　0>, etc. do. In the present invention, if the area ratio of the Cube orientation crystal grains in the surface layer part in the plate thickness direction with respect to the observation surface (rolled surface of the plate material) is within the above range, crystal grains having orientations other than these Cube orientations are included. thing is allowed

[Manufacturing method of copper alloy plate]

Next, the manufacturing method and preferable manufacturing conditions of the copper alloy plate material of this invention are demonstrated.

First, a conventional method for producing a precipitation type copper alloy will be described. In the conventional manufacturing method of a precipitation type copper alloy, a copper alloy material is melted and cast [Step 1] to obtain an ingot, and this is subjected to a homogenization heat treatment [Step 2], hot rolling [Step 3], water cooling [Step 4], face grinding [Step 5], cold rolling [Step 6'] is performed in this order to make a thin plate, and after performing an intermediate solution heat treatment [Step 9] in a temperature range of 700 to 1000 ° C to re-dissolve solute atoms, aging precipitation heat treatment [Step 10] and finish cold rolling [Step 12] to satisfy the required strength. In addition, after finish cold rolling [Step 12], final annealing [Step 13] to remove deformation may be performed. Also, an oxide film removal step (pickling/polishing [Step 11]) is sometimes performed between the aging precipitation heat treatment [Step 10] and the finish cold rolling [Step 12]. In this series of processes, the texture of the material is roughly determined by recrystallization occurring during the intermediate solution heat treatment, and finally determined by the orientation rotation occurring during the finish cold rolling. Moreover, the unevenness|corrugation (surface roughness) of the surface of a board|plate material is determined by the process of oxide film removal and finish cold rolling.

On the other hand, in the present invention, a copper alloy sheet material in which the waveform motif is controlled is manufactured through a manufacturing process not conventionally employed.

Specifically, after melting/casting [Step 1], homogenization heat treatment [Step 2], hot rolling [Step 3], water cooling [Step 4], and face-cutting [Step 5] (surface grinding is performed arbitrarily) is the same, but Thereafter, the processing steps performed before the intermediate solution heat treatment [Step 9] are different. That is, in the present invention, after water cooling [Step 4] and face-cutting [Step 5] (surface-cutting is performed arbitrarily), cold rolling 1 [Step 6] is performed to a total rolling ratio of 50 to 90%, and the following cold rolling By rolling 2 [Step 7], the tension at the time of rolling is 50 to 400 MPa, the roll roughness (Ra) of the rolling mill is 0.5 µm or more, the total rolling ratio is 30% or more, and the number of benders is 9 or more and a roller leveler [Step 8] is performed so that the press-fitting amount (intermesh) is 0.2% or more, thereby applying an appropriate deformation to the plate material surface layer portion. By passing through this processing step, the area ratio of the Cube orientation crystal grains in the surface layer portion (0t to 1/8t) in the recrystallized texture of the intermediate solution heat treatment [Step 9] increases. In addition, after the intermediate solution heat treatment [Step 9], the aging precipitation heat treatment [Step 10], Pickling/Grinding [Step 11] (Pickling/Grinding is arbitrarily performed), Cold Rolling 3 [Step 12] (Finishing cold rolling), And, the final annealing [Step 13] (temper annealing, strain relief annealing) is performed. On the other hand, cold rolling 1 [step 6] and cold rolling 2 [step 7] can be performed continuously. In addition, cold rolling 1 [step 6] and cold rolling 2 [step 7] may each be performed in a plurality of rolling passes, and in that case, the sum of the rolling rates in all the rolling passes becomes the above total rolling rate. .

Here, the reduction ratio (or rolling ratio, working ratio) is the rate of change of thickness when rolling is performed, and when the plate thickness before rolling is t ₁ and the plate thickness after rolling is t ₂ , the reduction ratio (%) is represented by the following formula.

Rolling reduction R(%) R= {1-(t ₂ /t ₁ )}×100

Below, the preferable conditions of each process are demonstrated in more detail.

First, it contains at least 1.0 to 6.0 mass% of Ni and 0.1 to 2.0 mass% of Si, and for other auxiliary elements, the elements are blended so as to contain them appropriately as needed, the remainder being Cu and unavoidable impurities. It is melted in a high-frequency melting furnace or the like, and this is cast [Step 1] at a cooling rate of 0.1 to 100°C/sec to obtain an ingot. This ingot is subjected to homogenization heat treatment [Step 2] for 3 minutes to 10 hours at 800 to 1020 ° C., followed by hot working [Step 3], followed by water quenching (equivalent to water cooling [Step 4]), and, if necessary, oxidized scale. For removal, chamfering [Step 5] is performed.

After that, cold rolling 1 [Step 6] with a total working rate of 50 to 90% is performed, and then, the tension at the time of rolling is 50 to 400 MPa, and the roll roughness (Ra) of the rolling mill is 0.5 µm or more, and the total Cold rolling 2 [Step 7] at a working rate of 50% or more is performed. Further, in the roller leveler [Step 8], the number of benders is set to 9 or more, and processing is applied so that the amount of press fit (intermesh) is 0.2% or more.

In this cold rolling 1 [step 6], while controlling the unevenness|corrugation in the board|plate material surface, at the same time, the work distortion required for recrystallization is applied to the whole board|plate material. On the other hand, in cold rolling 2 [Step 7], compression deformation is applied in preference to the surface layer portion by adjusting the roughness of the rolling rolls in particular. In the following roller leveler [Step 8], compressive deformation is given priority to the surface layer, cube orientation is developed during solution heat treatment, and the average length of wavy motifs and average depth of wavy motifs are measured during processing with a roller leveler. control In addition, in the roller leveler [Step 8], a rolling texture is formed, and thus, a driving energy for grain growth of Cube orientation is provided in a subsequent intermediate solution heat treatment [Step 9] by strain-induced grain boundary movement.

Thereafter, in the intermediate solution heat treatment [Step 9], heat treatment is performed at 600 to 1000 ° C. for 5 seconds to 1 hour, and in the aging precipitation heat treatment [Step 10], heat treatment is performed at 300 to 700 ° C. for 5 minutes to 10 hours, and the Next, if necessary, the oxide film is removed in the pickling/polishing step [Step 11]. Although this pickling is not particularly limited, the immersion time is usually 5 to 100 seconds, preferably 10 to 30 seconds, with dilute acid. Examples of the dilute acid include dilute sulfuric acid with a concentration of 20% or less, dilute hydrochloric acid, or dilute nitric acid (for example, sulfuric acid + hydrogen peroxide), and these dilute acids are preferably used at a concentration of 10% or less. In the polishing, in order to remove the oxide film remaining on the surface of the plate, buffing is performed as necessary. Next, finish cold rolling with a working rate of 3 to 25% [Step 12], and temper annealing at 100 to 600° C. for 5 seconds to 10 hours [Step 13] are performed to obtain the copper alloy sheet material of the present invention.

Here, the surface roughness of the intermediate or final sheet product is also affected by the rolling roll roughness. The roughness of the rolling roll is transferred to the material, and the larger the roll, the larger the roughness of the rolling material tends to be. However, if the roughness of the roll is reduced, the advance rate becomes negative, and rolling is performed in a slipping state. In some cases, a phenomenon that adversely affects workability occurs. On the other hand, there is a limit to the roughness that can be controlled by the final rolling, and in the case of rolling with a rolling roll having the same roll roughness, the smaller the material roughness provided before the final rolling or the larger the reduction (working rate), the larger the final rolled product illuminance becomes smaller.

In one preferred embodiment of the present invention, in hot rolling [Step 3], in the temperature range from the reheating temperature to 700°C, processing for breaking the cast structure and segregation to obtain a uniform structure, and dynamic recrystallization Processing for refining crystal grains is performed. Thereafter, water cooling [Step 4] and, if necessary, chamfering [Step 5] is carried out. Next, in cold rolling 1 [Step 6], after rolling to a predetermined plate thickness at a working rate of 50 to 90%, preferably 70 to 90%, more preferably 80 to 90%, cold rolling 2 [Step 7], the tension is 50 to 400 MPa, preferably 100 to 400 MPa, more preferably 200 to 400 MPa, and the roll roughness (Ra) is 0.5 µm or more, preferably 0.55 µm or more and 1.5 µm or less, and the plate material Controls surface irregularities and gives deformation to the entire board. Further, in the roller leveler [Step 8], the number of benders is 9 or more, preferably 10 or more and 20 or less, and the press-fitting amount (intermesh) of the plate material is 0.2% or more, preferably 0.2 to 2.0%, More preferably, processing is applied so that it may be 0.5 to 1.5%. Thereby, in the recrystallized texture in the intermediate solution heat treatment [Step 9], the Cube orientation crystal grains in the surface layer portions (0t to 1/8t) increase. Here, if the total working rate of cold rolling 1 [Step 6] is too low, the working deformation of the entire sheet material is insufficient, and recrystallization in the intermediate solution heat treatment [Step 9] becomes insufficient. In cold rolling 2 [Step 7], shear deformation of the surface layer portions 0t to 1/8t is suppressed and compression deformation is introduced by adjusting the total working rate, the tension to the sheet material during rolling, and the roughness of the rolling roll. This becomes an important process in the growth of the Cube orientation in the recrystallization solution heat treatment [Step 9]. In addition, in the roller leveler [Step 8], by accumulating the compressive strain on the surface layer portion of the plate material, the rolled texture required for cube orientation growth is formed, and by controlling the number of benders and the amount of press fit (intermesh) of the roller leveler, It is possible to control the average length (AW) of the wavy motifs and the average depth (W) of the wavy motifs on the surface of the plate material. After the intermediate solution heat treatment [Step 9], aging precipitation heat treatment [Step 10] and, if necessary, pickling and polishing [Step 11] are performed. Thereafter, cold rolling 3 [Step 12] and final annealing [Step 13] are performed.

Here, the press-fit amount (intermesh) will be described with reference to FIG. 2 . The roller leveler 1 consists of a plurality of benders 2 (in the figure, 9 pieces of 4 upper rolls and 5 lower rolls), and the copper alloy sheet material 3 subjected to roller leveler treatment during manufacture is moved in the rolling direction ( RD) to mail order between vendors. The press-fitting amount (intermesh) is the inclination of the gap between the roller leveler upper roll and the lower roll. As for the roller leveler, the press-in amount becomes the largest at the inlet side (H in the figure), and the press-in amount becomes small over the outlet side. That is, the space|interval of a roller leveler upper roll and a lower roll spreads over the exit side. Let the inclination formed by the maximum press-in amount of this inlet side and the distance (L in the figure) between the inlet side and the outlet side of the upper roll be the press-in amount (intermesh). Let H be the input maximum press-in amount and L be the distance between the inlet side and the outlet side of the upper roll, the press-in amount (intermesh) h is expressed by the following formula.

Press-fitting amount (intermesh) h(%)　　h=(H/L)×100

[Thickness of plate]

Although there is no restriction|limiting in particular in the thickness of the copper alloy plate material of this invention, Preferably it is 0.04-0.50 mm, More preferably, it is 0.05-0.45 mm.

[Characteristics of copper alloy plate]

The copper alloy sheet material of the present invention may satisfy the characteristics required for, for example, a copper alloy sheet material for a connector. The copper alloy sheet material of the present invention preferably has the following characteristics.

● It is desirable that the coefficient of kinetic friction of the plate is 0.5 or less. Although there is no restriction|limiting in particular in a lower limit, Usually, it is made into 0.1 or more.

● It is preferable that 0.2% yield strength is 700 MPa or more. More preferably, it is 750 MPa or more. Although there is no restriction|limiting in particular in an upper limit, Usually, it is set as 1200 MPa or less.

● In the 180° U-bending test in which the bending workability is R/t=1.0, in any case where the axis of bending is in either the rolling parallel direction (BW bending) or the rolling vertical direction (GW bending), cracks appear on the surface after bending It is preferable not to occur.

● It is desirable that the conductivity be 25%IACS or higher. Although there is no restriction|limiting in particular in an upper limit, Usually, it is made into 60 %IACS or less.

On the other hand, detailed measurement conditions for each characteristic are as described in Examples unless otherwise specified.

Example

Hereinafter, the present invention will be described in more detail based on Examples, but the present invention is not limited thereto.

(Examples 1 to 17, Comparative Examples 1 to 18)

For Examples 1 to 17, Ni, Si, and necessary auxiliary elements were contained, respectively, so that the composition shown in Table 1-1 was obtained, and for Comparative Examples 1 to 18, the composition shown in Table 1-2 was contained, and the remainder was A copper alloy material composed of Cu and unavoidable impurities is melted by a high-frequency melting furnace, and this is cast [Step 1] at a cooling rate of 0.1 to 100°C/sec to obtain an ingot.

For Examples 1 to 17, plate materials were manufactured under the manufacturing conditions shown in Table 2-1. That is, the obtained ingot was subjected to homogenization heat treatment at 800 to 1020°C for 3 minutes to 10 hours [Step 2], followed by 1020 to 700 Hot working [Step 3] was performed at °C. Thereafter, water quenching (corresponding to water cooling [Step 4]) was performed, and chamfering [Step 5] was performed to remove oxide scale. After that, cold rolling 1 [Step 6] with a total working rate of 50 to 90%, then cold working with a total working rate of 30% or more, a roll roughness (Ra) of 0.5 µm or more, and a tension of 50 to 400 MPa Rolling 2 [Step 7] was performed. After that, in the roller leveler [Step 8], the number of vendors was 9 or more, and processing was applied so that the press-fitting amount (intermesh) of the plate material was 0.2% or more. Thereafter, an intermediate solution treatment [Step 9] was performed at 600 to 1000°C for 5 seconds to 1 hour. Thereafter, aging and precipitation heat treatment [Step 10] was performed at 300 to 700 DEG C for 5 minutes to 1 hour, followed by pickling and polishing [Step 11]. This pickling was carried out using sulfuric acid + hydrogen peroxide having a concentration of 0.1 to 5.0% as a dilute acid, and the immersion time was between 5 and 100 seconds to wash the plate material. The polishing was performed by buffing in order to remove the oxide film remaining on the surface of the sheet material. Thereafter, finish cold rolling [Step 12] at a rolling ratio of 3 to 25%, followed by temper annealing [Step 13] at 100 to 600 ° C. for 5 seconds to 10 hours [Step 13] is performed to obtain a copper alloy sheet material did. Here, the thickness of the final plate of the test material was set to 0.1 mm. In addition, after each heat treatment or rolling, acid washing and surface polishing were performed according to the oxidation and roughness state of the material surface, and correction by a tension leveler was performed according to the shape. The manufacturing conditions in each Example are shown in Table 2-1, and the characteristic of the obtained test material is shown in Table 2-2, respectively.

In addition, about each comparative example, except having changed the said manufacturing conditions as shown in Table 2-3, it carried out similarly to each Example, and manufactured the test material. The characteristics of each comparative example are shown in Table 2-4.

The following properties were investigated for these test materials.

a. Waveform motif average length [AW] and waveform motif average depth [W]

The average length of the corrugated motifs and the average depth of the corrugated motifs on the surface of the plate material were calculated from the surface roughness measurement results measured in accordance with the method specified in JIS B 0631:2000.

b. surface roughness

The surface roughness (Ra) was measured using the conditions of a surface roughness meter (trade name: Surfcoda SE3500) manufactured by Kosaka Kenkyusho Co., Ltd., a radius of 2 µm at the tip of the stylus, and a measuring force of 0.75 N or less. The surface roughness Ra judged the case where it was 0.2 micrometer or less as favorable, and judged the case where it exceeded 0.2 micrometer as bad.

c. Area ratio of cube orientation grains in the surface layer portion (0t to 1/8t)

The crystal orientation was measured by the EBSD method under the conditions of a measurement area of 300 µm × 300 µm and a scan step of 0.1 µm. In the analysis, the EBSD measurement result of 300 µm × 300 µm was divided into 25 blocks, and the area ratio of crystal grains having a Cube orientation in the surface layer portion (0t to 1/8t) of each block was confirmed as follows. The electron beam was generated from hot electrons from the W filament of the scanning electron microscope.

In addition, in the polishing before the EBSD measurement, in order to observe the structure of the surface layer portions (0t to 1/8t), the target portion structure was exposed by the electrolytic polishing. As this polished and exposed portion, three locations of 0t, 1/10t, and 1/8t were observed by EBSD. In all three places, the occupancy rate (that is, area ratio) with respect to the measurement visual field of a Cube orientation crystal grain was calculated|required, respectively. And the average value of the area ratio of these three places was calculated|required, and this was shown as "area ratio (%) of the Cube orientation crystal grains in the surface layer part" in the table|surface. The case where this value was 5.0 % or more was judged as favorable, and the case where it was less than 5.0 % was judged as bad.

d. Bending workability in 180° U-bending test

A BW test material was cut by punching by a press so that the width was 0.25 mm and a length of 1.50 mm perpendicular to the rolling direction, and the GW test material was cut by punching so that the width was 0.25 mm and a length of 1.50 mm parallel to the rolling direction. In this case, the bending axis of W is called GW (Good Way) so that it is perpendicular to the rolling direction, and W bending so that it is parallel to the rolling direction is called BW (Bad Way). After 90° W bending, the compression tester 180° U bending processing was performed. The bent surface was observed with a scanning electron microscope at a magnification of 100, and the presence or absence of cracks was investigated. A case in which cracks do not occur in either GW bending or BW bending is judged as good, marked as "A" in the table, and a case in which a crack occurs in at least one of GW bending and BW bending is judged to be defective. Indicated by "B".

e. Wear resistance (measurement of coefficient of dynamic friction)

As a measure of abrasion resistance, the coefficient of dynamic friction was measured and evaluated. Based on JCBA T311;2001 (Method for measuring the coefficient of dynamic friction of copper and copper alloy plates) of the Japan Copper Association, in the vertical direction of rolling of the plate, the probe load is 100 g, the sliding distance is 10 mm, and 30 reciprocating A sliding test was performed in The coefficient of kinetic friction after 30 reciprocations was measured. If the dynamic friction coefficient of the plate is 0.5 or less, it is judged good, and if it exceeds 0.5, it is judged as bad.

f. 0.2% Yield [YS]

In the bending modulus measurement, 0.2% yield strength (MPa) was calculated from the amount of indentation (displacement) up to the elastic limit of each test piece, and it was set as a measure of strength. E: flexural coefficient, t: plate thickness, L: distance between fixed end and load point, f: displacement (indentation depth), 0.2% yield strength is expressed by the following formula.

0.2% yield strength (　　YS= {(3 E/2)×t×(f/L)×1000}/L

If the 0.2% yield strength of the plate material is 700 MPa or more, it is judged good, and the case of less than 700 MPa is judged as bad.

g. Conductivity [EC]

In a thermostat maintained at 20°C (±0.5°C), the specific resistance was measured by the four-terminal method, and the electrical conductivity was calculated. In addition, the distance between terminals was 100 mm. The case where the electrical conductivity of the plate material is 25% IACS or more is judged good, and the case of less than 25% IACS is judged bad.

[Table 1-1]

[Table 1-2]

[Table 2-1]

[Table 2-2]

[Table 2-3]

[Table 2-4]

As is clear from the results shown in Table 2-2, in the alloy composition (Table 1-1) specified in the present invention, the copper alloy sheet material of each Example obtained by the manufacturing method (Table 2-1) specified in the present invention is, It satisfies the predetermined average corrugation motif length (AW) and the predetermined corrugation motif average depth (W), has high strength and high conductivity, and has good bending workability and abrasion resistance (dynamic friction coefficient). In addition, the surface roughness (Ra) of the plate material and the area ratio of cube crystal grains in the surface layer portion (0t to 1/8t) also showed desirable values. Therefore, the copper alloy sheet material of the present invention is a copper alloy sheet material suitable for a lead frame for electric/electronic devices, a connector, a terminal material, and the like, a connector and terminal material for an automobile vehicle mounted terminal, a relay, a switch, and the like.

On the other hand, as is clear from the result shown in Table 2-4, in the sample of each comparative example, some characteristics were inferior.

Comparative Examples 12 to 18 were inferior in either strength (0.2% yield strength) or electrical conductivity because the alloy composition was outside the scope of the present invention. In Comparative Examples 1 to 11, neither of the predetermined waveform motif average length (AW) nor the predetermined waveform motif average depth (W) were satisfied because at least one manufacturing condition was outside the scope of the present invention. , one or both of bending workability and abrasion resistance are inferior. Moreover, although not shown in Table 2-4, the said effect of this invention is anticipated also when Cube crystal grains do not oriented-accumulate.

Although the present invention has been described along with its embodiments, we do not intend to limit our invention in any detail of the description unless otherwise specified, and do not go against the spirit and scope of the invention as set forth in the appended claims, and interpret it broadly. i think it should be

This application claims the priority based on Japanese Patent Application No. 2014-062760 for which the patent application was carried out in Japan on March 25, 2014, This takes in the content as a part of description of this specification with reference to here.

1: Roller Leveler
2: vendor
3: Copper alloy plate (thing in the process of manufacturing)
H: Maximum indentation amount
L: Distance between entry-exit side of upper roll
RD: Rolling parallel direction of the plate

Claims (11)

A copper alloy sheet material containing 1.00 to 6.00 mass % of Ni and 0.10 to 2.00 mass % of Si, the balance being copper and unavoidable impurities,
Waviness motif average length (AW) of the surface of the copper alloy sheet is 5.00 μm to 9.80 μm, the average depth (W) of the wavy motif is 0.50 μm to 1.10 μm, and the surface roughness of the copper alloy sheet ( A copper alloy sheet material, characterized in that Ra) is 0.06 μm to 0.20 μm. 1.00 to 6.00 mass% of Ni, 0.10 to 2.00 mass% of Si, and at least one selected from the group consisting of B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag and Sn A copper alloy sheet material containing 0.005 to 3.000 mass % in total, the balance being copper and unavoidable impurities,
The average length (AW) of the corrugation motif on the surface of the copper alloy plate material is 5.00 µm to 9.80 µm, the average depth W of the corrugation motif is 0.50 µm to 1.10 µm, and the surface roughness (Ra) of the copper alloy plate material is 0.06 µm to Copper alloy plate, characterized in that 0.20㎛. 3. The method of claim 1 or 2,
A copper alloy sheet having an area ratio of 5.0% or more of crystal grains having a Cube orientation with respect to the rolled surface of the copper alloy sheet in the surface layer portion from the surface of the copper alloy sheet to a position of 1/8 of the sheet thickness. delete 3. The method of claim 1 or 2,
A copper alloy sheet having a dynamic friction coefficient of 0.5 or less after performing a sliding test of 30 reciprocations under a load of 100 g in the vertical direction of rolling of the copper alloy sheet. 3. The method of claim 1 or 2,
In the 180° U-bending test of the copper alloy sheet, the bending axis of the copper alloy sheet can be bent without cracks in either the rolling parallel direction or the rolling vertical direction. A connector made of the copper alloy plate material according to claim 1 or 2. 1.00 to 6.00 mass% of Ni, 0.10 to 2.00 mass% of Si, and at least one selected from the group consisting of B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag and Sn After dissolving and casting a copper alloy material containing 0.000 to 3.000 mass % in total and the remainder being copper and unavoidable impurities [Step 1], homogenization heat treatment [Step 2], hot rolling [Step 3], Water cooling [Step 4 ], cold rolling 1 [process 6], cold rolling 2 [process 7], roller leveler [process 8], intermediate solution heat treatment [process 9], aging precipitation heat treatment [process 10], cold rolling 3 [ Step 12] and final annealing [Step 13] as a method of manufacturing a copper alloy sheet material in this order,
In the cold rolling 1 [Step 6], processing is performed at a total working rate of 50 to 90%,
In the cold rolling 2 [Step 7], the tension at the time of rolling is 50 to 400 MPa, the roll roughness (Ra) of the rolling mill is 0.5 μm or more, and the processing is performed at a total working rate of 30% or more,
The method for producing a copper alloy sheet material, wherein the roller leveler [Step 8] performs processing such that the number of benders is 9 or more, and the intermesh as an indentation amount is 0.2% or more. 9. The method of claim 8,
The copper alloy material is B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag, and at least one selected from the group consisting of Sn in a total of 0.005 to 3.000 mass% of a copper alloy sheet material containing manufacturing method. 10. The method according to claim 8 or 9,
A method of manufacturing a copper alloy sheet in which face grinding [step 5] is performed between the water cooling [step 4] and the cold rolling 1 [step 6]. 10. The method according to claim 8 or 9,
A method of manufacturing a copper alloy sheet material in which pickling and polishing [step 11] are performed between the aging precipitation heat treatment [step 10] and the cold rolling 3 [step 12].

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