CN208862209U - 一种连接器及其应用的pcb板 - Google Patents

一种连接器及其应用的pcb板 Download PDF

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CN208862209U
CN208862209U CN201821577530.2U CN201821577530U CN208862209U CN 208862209 U CN208862209 U CN 208862209U CN 201821577530 U CN201821577530 U CN 201821577530U CN 208862209 U CN208862209 U CN 208862209U
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terminal
plastic body
slot
sets
connector
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徐启桂
赵锷
盛志刚
周胜先
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Amphenol East Asia Electronic Technology Shenzhen Ltd
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Amphenol East Asia Electronic Technology Shenzhen Ltd
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Priority to US16/415,456 priority patent/US10944189B2/en
Priority to US17/195,403 priority patent/US11757215B2/en
Priority to US18/365,875 priority patent/US20240106140A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727—Coupling devices presenting arrays of contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/75—Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/006—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本实用新型公开了一种连接器及其应用的PCB板，连接器包括基座、第一信号传输组件、端子九、第二信号传输组件，所述第一信号传输组件、端子九、第二信号传输组件装配连接基座，第一信号传输组件、第二信号传输组件的端子采用焊接引脚的方式，焊接引脚与PCB板表贴焊接，避免了连接器与PCB板组合过程中出现端子变形、刮花等现象，同时满足了高速信号传输时对连接器端子高密度的要求，所述PCB板设置成可双面或单面设计焊盘用以表贴焊接连接器的各端子，节约了安装空间并增加连接器密度，也减少了布线的难度，也减少了布线对电气性能的影响。本实用新型结构简单，安装方便。

Description

一种连接器及其应用的PCB板
技术领域
本实用新型涉及一种连接器及其应用的PCB板。
背景技术
高速传输电子连接器通常用于支持网络、服务器、通信设备、数据存储设备应用，随着对数据传输带宽需求的不断提升，对连接器的端子的密度也提出更高的要求，多层连接器应用而生，目前市场上广泛应用的叠层的高速传输电子连接器与PCB的连接方式使用压入式的安装工艺，此工艺需要在PCB上面打穿孔，连接器的压入式触脚通过过盈配合与PCB孔连接，此类连接器在与PCB过盈配合安装的过程中经常出现跪脚、镀层刮花等现象，影响生产效率和信号传输质量；也有为了提高通信设备上面连接器的密度，PCB设计成正反两面都安装叠层的高速传输电子连接器。但是，在相同的面积PCB上面，需要打穿孔的数量就会更多，这样会造成PCB加工的难度提高，同时造成PCB 布线难度加大，还会影响电气性能如信号完整性。
实用新型内容
为了克服现有技术的不足，本实用新型提供一种连接器及其应用的PCB板。
本实用新型解决其技术问题所采用的技术方案是：一种连接器，包括基座、第一信号传输组件、端子九、第二信号传输组件，所述第一信号传输组件、端子九、第二信号传输组件装配连接基座，所述第一信号传输组件包括第一上排端子组件、第一下排端子组件、第一吸波接地片，所述第一吸波接地片装配连接第一上排端子组件、第一下排端子组件，所述第一上排端子组件连接第一下排端子组件。
优选地，所述第一上排端子组件包括上排端子一、塑胶体一、塑胶体二，所述上排端子一固定连接塑胶体一、塑胶体二，所述塑胶体一设卡扣一，所述塑胶体二设卡扣二，所述塑胶体一设安装区一，所述上排端子一与安装区一相通，所述第一下排端子组件包括下排端子一、塑胶体三、塑胶体四，所述下排端子一固定连接塑胶体三、塑胶体四，所述塑胶体三设安装区二，所述下排端子一与安装区二相通，所述塑胶体一、塑胶体三装配连接，所述塑胶体二、塑胶体四装配连接，所述第一吸波接地片装配连接安装区一、安装区二，所述端子九包括端子本体、安装孔、摆动臂，所述安装孔在端子本体的上部，所述摆动臂设两个对向分布在端子本体的下部。
优选地，所述上排端子一包括串接的焊接引脚一、连接体一、抵触部一，所述上排端子一设多个且循环阵列，所述上排端子一设端子一和端子二，所述端子一和端子二间隔排布，所述下排端子一包括串接的焊接引脚二、连接体二、抵触部二，所述下排端子一设多个且循环阵列，所述下排端子一包括端子三和端子四，所述端子三和端子四间隔排布，所述焊接引脚一、焊接引脚二背向平行排布，所述抵触部一、抵触部二对向平行排布，所述第一吸波接地片与端子一、端子三相短接。
优选地，所述第二信号传输组件包括第二上排端子组件、第二下排端子组件、第二吸波接地片，所述第二吸波接地片装配连接第二上排端子组件、第二下排端子组件，所述第二上排端子组件连接第二下排端子组件，所述第二上排端子组件包括上排端子二、塑胶体六、塑胶体七，所述上排端子二固定连接塑胶体六、塑胶体七，所述塑胶体六设卡扣三，塑胶体六设安装区三，所述上排端子二与安装区三相通，所述第二下排端子组件包括下排端子二、塑胶体八，所述下排端子二固定连接塑胶体八，所述塑胶体六、塑胶体八装配连接，所述塑胶体八设安装区四，所述下排端子二与安装区四相通，所述第二吸波接地片装配连接安装区三、所述安装区四。
优选地，所述上排端子二包括串接的焊接引脚三、连接体三、抵触部三，所述上排端子二设多个且循环阵列，所述上排端子二设端子五和端子六，所述端子五和端子六间隔排布，所述下排端子二包括串接的焊接引脚四、连接体四、抵触部四，所述下排端子二设多个且循环阵列，所述下排端子二包括端子七和端子八，所述端子七和端子八间隔排布，所述焊接引脚三、焊接引脚四背向平行排布，所述抵触部三、抵触部四对向平行排布，所述第二吸波接地片短接端子五、端子七。
优选地，所述基座包括安装槽一、对插槽一、定位柱、卡槽、结构孔、卡扣槽、安装槽二、对插槽二、定位槽，所述卡扣槽、定位槽设置在基座内，所述卡槽设在基座的两侧，所述定位柱设在基座的底部，所述对插槽一、对插槽二纵向相互平行且设置在基座的前侧，所述安装槽一、安装槽二纵向相互平行且设置在基座内，所述安装槽二设限位槽，所述第二信号传输组件限定在限位槽内，所述结构孔设置在基座内，所述第一信号传输组件安装在基座的安装槽一内，所述第二信号传输组件装配连接安装槽二，所述端子九与卡槽固定连接。
优选地，所述卡扣槽包括卡扣槽一、卡扣槽二、卡扣槽三，所述卡扣一卡扣连接卡扣槽一内，所述卡扣二卡扣连接卡扣槽二，所述卡扣三卡扣连接卡扣槽三，所述定位槽设定位槽一、定位槽二，所述第一信号传输组件限定在定位槽一内，所述第二信号传输组件限定在定位槽二内，所述安装槽一的上部设散热槽，所述定位柱设两个或以上，所述端子九设多个，所述卡槽设多个，所述卡槽分布在基座的两侧。
优选地，所述第一上排端子组件、第一下排端子组件设第三吸波接地片，所述第三吸波接地片设一组或以上，第三吸波接地片装配连接第一上排端子组件、第一下排端子组件，所述塑胶体二设安装区五，所述塑胶体四设安装区六，所述第三吸波接地片装配在安装区五、安装区六，且第三吸波接地片与第一上排端子组件、第一下排端子组件短接，所述第三吸波接地片、第二吸波接地片、第一吸波接地片分别包括短接片、塑胶体五，所述短接片固定连接塑胶体五，所述短接片包括片主体和自主体延伸出来的多个弹臂。
优选地，所述第一信号传输组件设纵向阵列的一个或多个，所述纵向阵列的一个或多个第一信号传输组件横向阵列一组或多组，所述第二信号传输组件设横向阵列的一个或多个，所述安装槽一、对插槽一、定位槽一设纵向阵列或横向的一个或多个，所述安装槽二、对插槽二、定位槽二设横向阵列的一个或多个，所述卡扣槽一、卡扣槽二、卡扣槽三设多个。
一种PCB板，所述PCB板应用于连接上述一种连接器，包括板体，所述板体设与定位柱对接的定位孔、与焊接引脚一和焊接引脚二连接的焊接盘一、与焊接引脚三和焊接引脚四连接的焊接盘二、与端子九连接的焊孔一，所述定位孔比定位柱的直径大，所述焊孔一的尺寸不大于端子九的尺寸，所述焊接盘一、焊接盘二设多个，所述定位孔、焊孔一设多个，所述焊接盘一的宽度大于焊接引脚一或焊接引脚二的宽度，所述焊接盘二的宽度大于焊接引脚三或焊接引脚四的宽度，相邻所述焊接盘一之间或相邻焊接盘二之间水平方向的中心距设 1.00mm-0.7mm，所述焊接盘一、焊接盘二分布在PCB板的正面或正反两面。
本实用新型的有益效果是：第一信号传输组件、第二信号传输组件的端子采用焊接引脚的方式，焊接引脚与PCB板表贴焊接，避免了连接器与PCB板组合过程中出现端子变形、刮花等现象，同时满足了高速信号传输时对连接器端子高密度的要求，所述PCB板设置成可双面焊盘用以连接连接器的各端子，节约了安装空间并增加连接器密度，也减少了布线的难度，也减少了布线对电气性能的影响。本实用新型结构简单，安装方便。
附图说明
下面结合附图和实施例对本实用新型进一步说明：
图1是本实用新型一种连接器及其应用的PCB板的结构示意图；
图2是本实用新型一种连接器局部结构示意图；
图3是本实用新型一种连接器爆炸图；
图4是本实用新型第一信号传输组件爆炸图；
图5是本实用新型第二信号传输组件爆炸图；
图6是本实用新型第一信号传输组件、第二一信号传输组件部分结构示意图；
图7是本实用新型短接片的结构示意图；
图8是本实用新型PCB板的结构示意图。
具体实施方式
参照图1至图7，本实用新型是这样实现的：一种连接器，包括基座1、第一信号传输组件2、端子九3、第二信号传输组件4，所述第一信号传输组件2、端子九3、第二信号传输组件4装配连接基座 1，所述第一信号传输组件2包括第一上排端子组件21、第一下排端子组件22、第一吸波接地片24，所述第一吸波接地片24装配连接第一上排端子组件21、第一下排端子组件22，所述第一上排端子组件21装配连接第一下排端子组件22，所述第一上排端子组件21设焊接引脚一2111，所述第一下排端子组件22设焊接引脚二2211，所述端子九3设四个。
所述第一信号传输组件2设纵向阵列的一个，所述纵向阵列的一个或第一信号传输组件2横向阵列一组，所述第二信号传输组件4设横向阵列的一个。
所述基座1采用LCP料制成，所述端子九3采用铜合金冲压制成。
所述第一上排端子组件21包括上排端子一211、塑胶体一212、塑胶体二215。所述上排端子一211固定连接塑胶体一212、塑胶体二215，所述塑胶体一212设卡扣一213，所述塑胶体二215的两侧各设卡扣二216两个，所述塑胶体一212设安装区一214，所述上排端子一211与安装区一214相通，所述第一下排端子组件22包括下排端子一221、塑胶体三222、塑胶体四225。所述下排端子一221 固定连接塑胶体三222、塑胶体四225，所述塑胶体三222设安装区二223，所述下排端子一221与安装区二223相通，所述塑胶体一212、塑胶体三222装配连接，所述塑胶体二215、塑胶体四225装配连接。
所述上排端子一211包括串接的焊接引脚一2111、连接体一 2112、抵触部一2113，所述上排端子一211设十九多个且水平方向循环阵列，所述上排端子一211设端子一2114和端子二2115，所述端子一2114和端子二2115间隔排布，所述下排端子一221包括串接的焊接引脚二2211、连接体二2212、抵触部二2213，所述下排端子一221设十九个且水平方向循环阵列，所述下排端子一221包括端子三2214和端子四2215，所述端子三2214和端子四2215间隔排布，所述焊接引脚一2111、焊接引脚二2211背向平行排布，所述抵触部一2113、抵触部二2213对向平行排布。
所述相邻上排端子一211之间的中心距设0.8mm，所述上排端子一211从左边往右数第一个、第四个、第七个、第十三个、第十六个、第十九个端子设为端子一2114，其余为端子二2115，所述相邻下排端子一221之间的中心距设0.8mm，所述下排端子一221从左边往右数第一个、第四个、第七个、第十三个、第十六个、第十九个端子设为端子三2214，其余为端子四2215。所述上排端子一211、下排端子一221采用铜合金冲压而成。所述焊接引脚一2111、焊接引脚二 2211的宽度为0.25mm，所述第一吸波接地片24短接多个端子一2114、端子三2214，以降低在信号传输过程中插入损失和串音干扰。
所述第一上排端子组件21、第一下排端子组件22设第三吸波接地片25，所述第三吸波接地片25设两组，所述第三吸波接地片25 装配连接第一上排端子组件21、第一下排端子组件22，所述塑胶体二215设安装区五217，所述上排端子一211与安装区五217相通，所述塑胶体四225设安装区六226，所述下排端子一221与安装区六 226相通，所述第三吸波接地片25装配在安装区五217、安装区六 226，且第三吸波接地片25与端子一2114、端子三2214短接。所述第三吸波接地片25、安装区五217、安装区六226分别设两个。所述第一吸波接地片24、第三吸波接地片25短接多个端子一2114、端子三2214，以降低在信号传输过程中插入损失和串音干扰。
所述第二信号传输组件4包括第二上排端子组件41、第二下排端子组件42、第二吸波接地片44，所述第二吸波接地片44装配连接第二上排端子组件41、第二下排端子组件42，所述第二上排端子组件41装配连接第二下排端子组件42。
所述第二上排端子组件41包括上排端子二411、塑胶体六412、塑胶体七415，所述上排端子二411固定连接塑胶体六412、塑胶体七415，所述塑胶体六412设卡扣三413，塑胶体六412设安装区三 414，所述上排端子二411与安装区三414相通，所述第二下排端子组件42包括下排端子二421、塑胶体八422，所述下排端子二421固定连接塑胶体八422，所述塑胶体六412、塑胶体八422装配连接，所述塑胶体八422设安装区四423，所述下排端子二421与安装区四 423相通，所述第二吸波接地片44装配连接安装区三414、所述安装区四423，所述第二吸波接地片44与第一吸波接地片24的结构相同。
所述上排端子二411包括串接的焊接引脚三4111、连接体三 4112、抵触部三4113，所述上排端子二411设十九个且水平方向循环阵列，所述上排端子二411设端子五4114和端子六4115，所述端子五4114和端子六4115间隔排布，所述下排端子二421包括串接的焊接引脚四4211、连接体四4212、抵触部四4213，所述下排端子二 421设十九个且水平方向循环阵列，所述下排端子二421包括端子七 4214和端子八4215，所述端子七4214和端子八4215间隔排布，所述焊接引脚三4111、焊接引脚四4211背向平行排布，所述抵触部三 4113、抵触部四4213对向平行排布。所述第二吸波接地片44短接端子五4114、端子七4214。
所述相邻上排端子二411之间的中心距设0.8mm，所述上排端子二411从左边往右数第一个、第四个、第七个、第十三个、第十六个、第十九个端子设为端子五4114，其余为端子六4115，所述相邻下排端子二421之间的中心距设0.8mm，所述下排端子二421从左边往右数第一个、第四个、第七个、第十三个、第十六个、第十九个端子设为端子七4214，其余为端子八4215。所述上排端子二411、下排端子二421采用铜合金冲压制成。所述焊接引脚三4111、焊接引脚四4211的宽度为0.25mm。所述第二吸波接地片44短接端子五4114和端子七4214，以降低在信号传输过程中插入损失和串音干扰。
所述第一吸波接地片24装配连接安装区一214、安装区二223，所述第一吸波接地片24包括短接片241、塑胶体五242，所述短接片 241固定连接塑胶体五242，所述塑胶体五242装配连接在安装区一 214、安装区二223内。
所述短接片241包括片主体243和自主体243延伸出来的六个弹臂244，所述弹臂244与端子一2114、端子三2214相抵触，所述端子九3包括端子本体31、安装孔32、摆动臂33，所述安装孔32在端子本体31的上部，所述摆动臂33设两个对向分布在端子本体31 的下部。所述摆动臂33的外围尺寸为1.1mm。
所述第一吸波接地片24与第二吸波接地片44、第三吸波接地片 25结构相同。
所述基座1包括安装槽一11、对插槽一12、定位柱13、卡槽14、结构孔15、卡扣槽16、安装槽二17、对插槽二18、定位槽19，所述卡扣槽16、定位槽19设置在基座1内，所述卡槽14设在基座1 的两侧，所述定位柱13设两个且在基座1的底部，所述定位柱13直径设为1.0mm。
所述对插槽一12、对插槽二18设置在基座1的前侧，所述抵触部一2113、抵触部二2213限定在对插槽一12内，所述抵触部三4113、抵触部四4213限定在对插槽二18内，所述安装槽一11、安装槽二 17设置在基座1内，所述安装槽二17设限位槽171，所述下排端子二421限定在限位槽171内，所述结构孔15设置在基座1内，所述结构孔15可以减少基座1的重量，同时可以通风散热，所述第一信号传输组件2安装在基座1的安装槽一11内，所述第二信号传输组件4装配连接安装槽二17，所述端子九3与卡槽14过盈装配连接。所述端子九3与PCB板焊接后，将连接器固定在PCB板上，还防止在连接器的第一信号传输组件2、第二信号传输组件4与PCB板表贴焊接的时候，连接器浮起来，造成虚焊等问题。
所述卡扣槽16包括卡扣槽一161、卡扣槽二162、卡扣槽三163，所述卡扣一213卡扣连接卡扣槽一161内，所述卡扣槽二162设四个，所述四个卡扣二216分别卡扣连接卡四个扣槽二162，，所述卡扣三 413卡扣连接卡扣槽三163，所述定位槽19设定位槽一191、定位槽二192，所述塑胶体二215、塑胶体四225限定在定位槽一191内，所述塑胶体七415限定在定位槽二192内，所述安装槽一11的上部设散热槽111，第一信号传输组件2信号传输过程中温度上升导致端子过热而影响传输速度，所述散热槽111可以使端子散热更快。所述端子九3设四个，所述卡槽14设四个，所述卡槽14非对称分布在基座1的两侧。
所述安装槽一11、对插槽一12、定位槽一191设纵向阵列和横向的一个，所述安装槽二17、对插槽二18、定位槽二192设横向阵列的一个，所述卡扣槽一161、卡扣槽二162各设一个，所述卡扣槽三163设4个。
参照图8，本实用新型中一种PCB板是这样实现的：所述PCB板应用于连接上述一种连接器，包括板体5，所述板体5设与定位柱13 对接的定位孔51、与焊接引脚一2111和焊接引脚二2211连接的焊接盘一52、与焊接引脚三4111和焊接引脚四4211连接的焊接盘二 53、与端子九3连接的焊孔一54。
所述定位孔51直径设1.1MM且设两个，所述焊孔一54设1.05MM 且设四个，所述焊接盘一52、焊接盘二53设各设两排，每排设十九个，所述焊接盘一52的宽度设0.35MM,所述焊接盘二53的宽度设 0.35MM，相邻所述焊接盘一52之间或相邻焊接盘二53之间水平方向的中心距设0.8MM，所述焊接盘一52、焊接盘二53分布在PCB板的正面。
在本实用新型中：第一信号传输组件2、第二信号传输组件4的端子采用焊接引脚的方式，所述焊接引脚一2111、焊接引脚二2211 与PCB板焊接盘一42相表贴，所述焊接引脚三4111、焊接引脚四4211 表贴焊接盘二53，避免了连接器与PCB板组合过程中出现端子变形、刮花等现象，同时满足了高速信号传输时对连接器端子高密度的要求，所述端子三2214和端子四2215间隔排布，所述端子三2214和端子四2215间隔排布，改善了在信号传输过程中其信号完整性，尤其是改善信号串扰问题。PCB焊盘的方式也减少了布线的难度，也减少了布线对电气性能的影响。本实用新型结构简单，安装方便。

Claims (10)

1.一种连接器，其特征是包括基座(1)、第一信号传输组件(2)、端子九(3)、第二信号传输组件(4)，所述第一信号传输组件(2)、端子九(3)、第二信号传输组件(4)装配连接基座(1)，所述第一信号传输组件(2)包括第一上排端子组件(21)、第一下排端子组件(22)、第一吸波接地片(24)，所述第一吸波接地片(24)装配连接第一上排端子组件(21)、第一下排端子组件(22)，所述第一上排端子组件(21)连接第一下排端子组件(22)。
2.如权利要求1所述一种连接器，其特征是所述第一上排端子组件(21)包括上排端子一(211)、塑胶体一(212)、塑胶体二(215)，所述上排端子一(211)固定连接塑胶体一(212)、塑胶体二(215)，所述塑胶体一(212)设卡扣一(213)，所述塑胶体二(215)设卡扣二(216)，所述塑胶体一(212)设安装区一(214)，所述上排端子一(211)与安装区一(214)相通，所述第一下排端子组件(22)包括下排端子一(221)、塑胶体三(222)、塑胶体四(225)，所述下排端子一(221)固定连接塑胶体三(222)、塑胶体四(225)，所述塑胶体三(222)设安装区二(223)，所述下排端子一(221)与安装区二(223)相通，所述塑胶体一(212)、塑胶体三(222)装配连接，所述塑胶体二(215)、塑胶体四(225)装配连接，所述第一吸波接地片(24)装配连接安装区一(214)、安装区二(223)，所述端子九(3)包括端子本体(31)、安装孔(32)、摆动臂(33)，所述安装孔(32)在端子本体(31)的上部，所述摆动臂(33)设两个对向分布在端子本体(31)的下部。
3.如权利要求2所述一种连接器，其特征是所述上排端子一(211)包括串接的焊接引脚一(2111)、连接体一(2112)、抵触部一(2113)，所述上排端子一(211)设多个且循环阵列，所述上排端子一(211)设端子一(2114)和端子二(2115)，所述端子一(2114)和端子二(2115)间隔排布，所述下排端子一(221)包括串接的焊接引脚二(2211)、连接体二(2212)、抵触部二(2213)，所述下排端子一(221)设多个且循环阵列，所述下排端子一(221)包括端子三(2214)和端子四(2215)，所述端子三(2214)和端子四(2215)间隔排布，所述焊接引脚一(2111)、焊接引脚二(2211)背向平行排布，所述抵触部一(2113)、抵触部二(2213)对向平行排布，所述第一吸波接地片(24)与端子一(2114)、端子三(2214)相短接。
4.如权利要求1所述一种连接器，其特征是所述第二信号传输组件(4)包括第二上排端子组件(41)、第二下排端子组件(42)、第二吸波接地片(44)，所述第二吸波接地片(44)装配连接第二上排端子组件(41)、第二下排端子组件(42)，所述第二上排端子组件(41)连接第二下排端子组件(42)，所述第二上排端子组件(41)包括上排端子二(411)、塑胶体六(412)、塑胶体七(415)，所述上排端子二(411)固定连接塑胶体六(412)、塑胶体七(415)，所述塑胶体六(412)设卡扣三(413)，塑胶体六(412)设安装区三(414)，所述上排端子二(411)与安装区三(414)相通，所述第二下排端子组件(42)包括下排端子二(421)、塑胶体八(422)，所述下排端子二(421)固定连接塑胶体八(422)，所述塑胶体六(412)、塑胶体八(422)装配连接，所述塑胶体八(422)设安装区四(423)，所述下排端子二(421)与安装区四(423)相通，所述第二吸波接地片(44)装配连接安装区三(414)、所述安装区四(423)。
5.如权利要求4所述一种连接器，其特征是所述上排端子二(411)包括串接的焊接引脚三(4111)、连接体三(4112)、抵触部三(4113)，所述上排端子二(411)设多个且循环阵列，所述上排端子二(411)设端子五(4114)和端子六(4115)，所述端子五(4114)和端子六(4115)间隔排布，所述下排端子二(421)包括串接的焊接引脚四(4211)、连接体四(4212)、抵触部四(4213)，所述下排端子二(421)设多个且循环阵列，所述下排端子二(421)包括端子七(4214)和端子八(4215)，所述端子七(4214)和端子八(4215)间隔排布，所述焊接引脚三(4111)、焊接引脚四(4211)背向平行排布，所述抵触部三(4113)、抵触部四(4213)对向平行排布，所述第二吸波接地片(44)短接端子五(4114)、端子七(4214)。
6.如权利要求5所述一种连接器，其特征是所述基座(1)包括安装槽一(11)、对插槽一(12)、定位柱(13)、卡槽(14)、结构孔(15)、卡扣槽(16)、安装槽二(17)、对插槽二(18)、定位槽(19)，所述卡扣槽(16)、定位槽(19)设置在基座(1)内，所述卡槽(14)设在基座(1)的两侧，所述定位柱(13)设在基座(1)的底部，所述对插槽一(12)、对插槽二(18)纵向相互平行且设置在基座(1)的前侧，所述安装槽一(11)、安装槽二(17)纵向相互平行且设置在基座(1)内，所述安装槽二(17)设限位槽(171)，所述第二信号传输组件(4)限定在限位槽(171)内，所述结构孔(15)设置在基座(1)内，所述第一信号传输组件(2)安装在基座(1)的安装槽一(11)内，所述第二信号传输组件(4)装配连接安装槽二(17)，所述端子九(3)与卡槽(14)固定连接。
7.如权利要求6所述一种连接器，其特征是所述卡扣槽(16)包括卡扣槽一(161)、卡扣槽二(162)、卡扣槽三(163)，所述卡扣一(213)卡扣连接卡扣槽一(161)内，所述卡扣二(216)卡扣连接卡扣槽二(162)，所述卡扣三(413)卡扣连接卡扣槽三(163)，所述定位槽(19)设定位槽一(191)、定位槽二(192)，所述第一信号传输组件(2)限定在定位槽一(191)内，所述第二信号传输组件(4)限定在定位槽二(192)内，所述安装槽一(11)的上部设散热槽(111)，所述定位柱(13)设两个或以上，所述端子九(3)设多个，所述卡槽(14)设多个，所述卡槽(14)分布在基座(1)的两侧。
8.如权利要求7所述一种连接器，其特征是所述第一上排端子组件(21)、第一下排端子组件(22)设第三吸波接地片(25)，所述第三吸波接地片(25)设一组或以上，所述第三吸波接地片(25)装配连接第一上排端子组件(21)、第一下排端子组件(22)，所述塑胶体二(215)设安装区五(217)，所述塑胶体四(225)设安装区六(226)，所述第三吸波接地片(25)装配在安装区五(217)、安装区六(226)，且第三吸波接地片(25)与第一上排端子组件(21)、第一下排端子组件(22)短接，所述第三吸波接地片(25)、第二吸波接地片(44)、第一吸波接地片(24)分别包括短接片(241)、塑胶体五(242)，所述短接片(241)固定连接塑胶体五(242)，所述短接片(241)包括片主体(243)和自主体(243)延伸出来的多个弹臂(244)。
9.如权利要求8所述一种连接器，其特征是所述第一信号传输组件(2)设纵向阵列的一个或多个，所述纵向阵列的一个或多个第一信号传输组件(2)横向阵列一组或多组，所述第二信号传输组件(4)设横向阵列的一个或多个，所述安装槽一(11)、对插槽一(12)、定位槽一(191)设纵向阵列或横向的一个或多个，所述安装槽二(17)、对插槽二(18)、定位槽二(192)设横向阵列的一个或多个，所述卡扣槽一(161)、卡扣槽二(162)、卡扣槽三(163)设多个。
10.一种PCB板，其特征是所述PCB板应用于连接权利要求1-9所述一种连接器，包括板体(5)，所述板体(5)设与定位柱(13)对接的定位孔(51)、与焊接引脚一(2111)和焊接引脚二(2211)连接的焊接盘一(52)、与焊接引脚三(4111)和焊接引脚四(4211)连接的焊接盘二(53)、与端子九(3)连接的焊孔一(54)，所述定位孔(51)比定位柱(13)的直径大，所述焊孔一(54)的尺寸不大于端子九(3)的尺寸，所述焊接盘一(52)、焊接盘二(53)设多个，所述定位孔(51)、焊孔一(54)设多个，所述焊接盘一(52)的宽度大于焊接引脚一(2111)或焊接引脚二(2211)的宽度，所述焊接盘二(53)的宽度大于焊接引脚三(4111)或焊接引脚四(4211)的宽度，相邻所述焊接盘一(52)之间或相邻焊接盘二(53)之间水平方向的中心距设1.00mm-0.7mm，所述焊接盘一(52)、焊接盘二(53)分布在PCB板的正面或正反两面。
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CN117096641B (zh) * 2023-10-17 2024-02-09 苏州元脑智能科技有限公司 电源连接器组件、供电系统及服务器

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US10944189B2 (en) 2021-03-09

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