CN204680327U - High definition LED display module encapsulation construction - Google Patents
High definition LED display module encapsulation construction Download PDFInfo
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- CN204680327U CN204680327U CN201520246482.9U CN201520246482U CN204680327U CN 204680327 U CN204680327 U CN 204680327U CN 201520246482 U CN201520246482 U CN 201520246482U CN 204680327 U CN204680327 U CN 204680327U
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 19
- 238000010276 construction Methods 0.000 title claims abstract description 13
- 210000004027 cell Anatomy 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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Abstract
The utility model discloses a kind of high definition LED display module encapsulation construction, include pcb board, be connected to the multiple pixel cells arranged on pcb board front and in determinant, be connected to the QFN circuit at the pcb board back side, electric capacity and driving IC chip; The center distance of two adjacent pixel cells is 1.5mm.One-piece construction of the present utility model meets the requirement of market to high definition LED display sharpness, and encapsulating structure is rationally distributed, encapsulation precision is high, and the LED display module application scope after encapsulation is wide, can be used for the large screen display of indoor command dispatching system and the high definition display of motion picture screen.
Description
Technical field
The utility model relates to field of LED display, specifically a kind of high definition LED display module encapsulation construction.
Background technology
LED display developed rapidly in the whole world in the later stage eighties, become novel display media, the lattice pixels unit composition large-area displays screen that it utilizes light emitting diode to form, the feature such as high with reliability, long service life, adaptive capacity to environment are strong, cost performance is high, use cost is low, in short twenties years, shoot up one of main product becoming flat pannel display, is widely used in field of information display.Along with science and technology and expanding economy, market requires more and more higher to the sharpness of display screen, and the LED display pel spacing that the LED display manufacturing plant of present main flow adopts paster technique to manufacture is minimum, and for P5, (centre distance namely between two pixels is 5mm, pel spacing is less, in unit area, picture element density is higher, sharpness is also higher), can not meet the requirement of market to high definition LED display.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of high definition LED display module encapsulation construction, and meet the requirement of market to high definition LED display sharpness, and encapsulating structure is rationally distributed, encapsulation precision is high.
The technical solution of the utility model is:
High definition LED display module encapsulation construction, includes pcb board, is connected to the multiple pixel cells arranged on pcb board front and in determinant, is connected to the QFN circuit at the pcb board back side, electric capacity and driving IC chip; And the center distance of adjacent two pixel cells is 1.5mm.
Described each pixel cell includes substrate, be adhered to green LED chip, red LED chips and blue LED die that substrate laterally arranges in turn, and in above-mentioned three LED chips, the spacing of two adjacent LED chips is 0.1mm.
Described QFN circuit, electric capacity and driving IC chip are two, two described driving IC chip are connected to the middle part at the pcb board back side, two QFN circuit and two electric capacity are divided into two groups, lay respectively at above and below two driving IC chip, namely one of them QFN circuit and electric capacity are positioned at the top of two driving IC chip, and another QFN circuit and another electric capacity are positioned at the below of two driving IC chip.
The Surface coating of described driving IC chip has black glue-line; Described multiple pixel cell Surface coating have LED embedding glue-line.
Advantage of the present utility model:
(1), the center distance of adjacent in the utility model two pixel cells is 1.5mm, and the density of pixel unit is high, and sharpness improves accordingly, meets the requirement of client to high-definition display screen sharpness;
(2), in each pixel cell of the utility model the distance controlling of two adjacent LEDs chip is 0.1mm, controls the area that each pixel cell takies, makes pcb board can arrange more pixel cell, make it meet the requirement of sharpness further;
(3), QFN circuit of the present utility model, electric capacity, driving IC chip and LED chip be rationally distributed, and encapsulation precision is high, reduces the cost of more than 30% than traditional display screen;
(4), the technical indicator such as refresh rate of display screen can increase substantially.
One-piece construction of the present utility model meets the requirement of market to high definition LED display sharpness, and encapsulating structure is rationally distributed, encapsulation precision is high, LED display module application scope after encapsulation is wide, can be used for the large screen display of indoor command dispatching system, the high definition display of motion picture screen and the Projection Display etc. of replacement large conference room.
Accompanying drawing explanation
Fig. 1 is the structural representation at the utility model pcb board back side.
Fig. 2 is the structural representation in the utility model pcb board front.
Fig. 3 is the structural representation of each pixel cell of the utility model.
Embodiment
See Fig. 1 and Fig. 2, high definition LED display module encapsulation construction, include pcb board 1, be connected on pcb board 1 front and 128 pixel cells 2 arranged in determinant (8x16), be connected to two QFN circuit 3a at pcb board 1 back side, 3b, two electric capacity 4a, 4b and two driving IC chip 5, is coated on the LED embedding glue-line on 128 pixel cell 2 surfaces and is coated on the black glue-line on driving IC chip 5 surface; The center distance of two adjacent pixel cells 2 is 1.5mm; Two driving IC chip 5 are connected to the middle part at pcb board 1 back side, two QFN circuit 3a, 3b and two electric capacity 4a, 4b is divided into two groups, lay respectively at above and below two driving IC chip 5, namely one of them QFN circuit 3a and one electric capacity 4a is positioned at the top of two driving IC chip 5, and another QFN circuit 3b and another electric capacity 4b is positioned at the below of two driving IC chip 5;
See Fig. 3, each pixel cell 2 includes substrate 21, is adhered to green LED chip 22, red LED chips 23 and blue LED die 24 that substrate 21 laterally arranges in turn, and above-mentioned three LED chips 22,23, in 24, the spacing of two adjacent LED chips is 0.1mm.
High definition LED display module encapsulation method, comprises the following steps:
(1), adopt surface mounting technology by two QFN circuit 3a, 3b and 2 electric capacity 4a, 4b is mounted on the back side of pcb board 1, mounted QFN circuit 3a, 3b and electric capacity 4a, the pcb board 1 of 4b needs to carry out electricity slurry clean-out operation, to remove in surface mount process the volatile matter be attached on pcb board 1, is beneficial to follow-up driving IC chip 5 and the routing operation of LED chip on pcb board;
(2), by automatic die Bonder, two driving IC chip 5 are bonded in the back side of pcb board, bonding agent is conducting resinl, the pcb board 1 of the driving IC chip that bondd 5 is first put into the baking oven filling nitrogen and is carried out high-temperature baking (temperature is 175 DEG C, time is 1 hour), conducting resinl is solidified, and then the electric connection of driving IC chip 5 and pcb board 1 is completed by bonding pattern, bonding lead adopts gold thread or copper cash;
(3), by automatic dispensing machine at the black glue of the Surface coating of driving IC chip 5, the pcb board of the black glue of coated mistake is put into the baking oven filling nitrogen and is carried out high-temperature baking (temperature is 150 DEG C, and the time is 20 minutes), makes black adhesive curing;
(4), by automatic bonding die LED chip is bonded on the substrate in each pixel cell in front of pcb board 1, each pixel cell will carry out 3 bonding dies altogether, by conducting resinl, red LED chips 23 is bonded in the centre of each pixel cell substrate 21 for the first time; Green LED chip 22 is bonded in the left side of each pixel cell substrate 21 by second time by insulating gel; By insulating gel, blue LED die 24 is bonded in the right side of each pixel cell substrate 21 for the third time; Each pixel cell substrate is of a size of 0.8*0.5mm
2, the size of three kinds of LED chips is 0.2*0.2mm
2, the spacing that is between chip and chip only has 0.1mm, and the spilling of conducting resinl and insulating gel can not contact with each other, to equipment precision and technological requirement high;
(5), the bonding pcb board 1 crossing LED chip is first put into the baking oven filling nitrogen and carry out high-temperature baking (temperature 175 DEG C, 1 hour time) make conducting resinl and insulating gel solidification, and the electric connection of green LED chip 22, red LED chips 23 and blue LED die 24 and pcb board 1 is realized by automated bonding machine, bonding lead can adopt gold thread or copper cash;
(6), by automatic dispensing machine coated LED transparent casting glue shielded on each pixel cell 2, finally pcb board 1 is put into the baking oven filling nitrogen and carry out high-temperature baking (temperature 120 DEG C, 10 minutes time), complete encapsulation.
Claims (4)
1. high definition LED display module encapsulation construction, include pcb board and be connected to the multiple pixel cells on pcb board, it is characterized in that: also include the QFN circuit, electric capacity and the driving IC chip that are connected to the pcb board back side, described multiple pixel cells are the front that determinant is connected to pcb board, and the center distance of adjacent two pixel cells is 1.5mm.
2. high definition LED display module encapsulation construction according to claim 1, it is characterized in that: described each pixel cell includes substrate, be adhered to green LED chip, red LED chips and blue LED die that substrate laterally arranges in turn, and in above-mentioned three LED chips, the spacing of two adjacent LED chips is 0.1mm.
3. high definition LED display module encapsulation construction according to claim 1, it is characterized in that: described QFN circuit, electric capacity and driving IC chip are two, two described driving IC chip are connected to the middle part at the pcb board back side, two QFN circuit and two electric capacity are divided into two groups, lay respectively at above and below two driving IC chip, namely one of them QFN circuit and electric capacity are positioned at the top of two driving IC chip, and another QFN circuit and another electric capacity are positioned at the below of two driving IC chip.
4. high definition LED display module encapsulation construction according to claim 1, is characterized in that: the Surface coating of described driving IC chip has black glue-line; Described multiple pixel cell Surface coating have LED embedding glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520246482.9U CN204680327U (en) | 2015-04-22 | 2015-04-22 | High definition LED display module encapsulation construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520246482.9U CN204680327U (en) | 2015-04-22 | 2015-04-22 | High definition LED display module encapsulation construction |
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| Publication Number | Publication Date |
|---|---|
| CN204680327U true CN204680327U (en) | 2015-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520246482.9U Expired - Fee Related CN204680327U (en) | 2015-04-22 | 2015-04-22 | High definition LED display module encapsulation construction |
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| Country | Link |
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| CN (1) | CN204680327U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104916232A (en) * | 2015-04-22 | 2015-09-16 | 安徽国晶微电子有限公司 | Package structure and package method for high definition LED display screen module |
| CN106097915A (en) * | 2016-08-22 | 2016-11-09 | 安徽天众电子科技有限公司 | A kind of production technology of LED display |
-
2015
- 2015-04-22 CN CN201520246482.9U patent/CN204680327U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104916232A (en) * | 2015-04-22 | 2015-09-16 | 安徽国晶微电子有限公司 | Package structure and package method for high definition LED display screen module |
| CN106097915A (en) * | 2016-08-22 | 2016-11-09 | 安徽天众电子科技有限公司 | A kind of production technology of LED display |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150930 |
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| CF01 | Termination of patent right due to non-payment of annual fee |