CN103594464A - COB packaging structure of light-emitting diode - Google Patents
COB packaging structure of light-emitting diode Download PDFInfo
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- CN103594464A CN103594464A CN201310603826.2A CN201310603826A CN103594464A CN 103594464 A CN103594464 A CN 103594464A CN 201310603826 A CN201310603826 A CN 201310603826A CN 103594464 A CN103594464 A CN 103594464A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
The invention relates to a COB packaging structure of a light-emitting diode. The COB packaging structure comprises a substrate, n drive chips and n light-emitting diode chip sets, wherein each light-emitting diode chip set comprises N light-emitting diode chips, n and N are integers, n is larger than or equal to 1, N is larger than or equal to 1, the n drive chips and the n light-emitting diode chip sets are packaged on the front face of the substrate in a modular mode to form n sets of COB display modules, the n drive chips and the n light-emitting diode chip sets form lamp-driver co-plane devices in a one-to-one connection mode, a fixed number of bonding pads are arranged on the back face of the substrate, and all the drive chips and all the light-emitting diode chip sets are communicated with the bonding pads on the back face of the substrate in a routing and hole passing mode. The n lamp-driver co-plane devices are packaged to form a new COB device, the number of the bonding pads on the back face of the substrate is fixed and independent of the number of sets of the drive chips, and therefore a large number of pins are saved, external device cables are greatly reduced, and the higher density can be achieved compared with the density achieved through traditional packaging.
Description
Technical field
The present invention relates to light-emitting diode packaging technology field, more specifically, relate to a kind of COB encapsulating structure of light-emitting diode.
Background technology
In high-resolution, show industry, light-emitting diode (LED, Light Emitting Diode) point between chip is apart from size, determined the resolution of LED display under unit are, therefore under high-resolution demand, dwindle the spacing between adjacent LED pixel, become the improved direction of emphasis in industry.
Traditional driving chip and LED are positioned over PCB(printed circuit board, PrintedCircuitBoard) mode of both sides, in highly dense field, for every line being communicated with the driving chip pin of PCB reverse side, need the number of plies of PCB constantly to increase, PCB boring aperture constantly dwindles, and has started to challenge the enabling capabilities of PCB manufacturing, and the increasing considerably of PCB cost of bringing lamp plate, thereby increased the cost of whole screen and brought sizable difficulty for PCBA paster.
For the existing defect of above-mentioned traditional scheme, there is a kind of chip and coplanar encapsulation scheme of LED of driving in industry, this scheme is: as shown in Figure 1, N is organized to light-emitting diode chip for backlight unit 1 and one drives chip 2 to be encapsulated in same components and parts, being connected in encapsulation components and parts between the two completes, traditional light-emitting diode chip for backlight unit 5 and the wire that is connected that drives 2 of chips have been reduced, and both are positioned at same plane, the wire of encapsulation components and parts 9 inside connects more simple, thereby when high-resolution display application, reduce wiring difficulty, and reduced the requirement to the pcb board number of plies and precision.But this scheme also exists certain defect, it still cannot solve the problem of complex circuit to a greater extent, and the problem that reduces packaging cost, raising welding efficiency.
Summary of the invention
The present invention is at least one defect (deficiency) overcoming described in above-mentioned prior art, and a kind of COB encapsulating structure that can effectively reduce the light-emitting diode of LED outlet is provided.
For solving the problems of the technologies described above, technical scheme of the present invention is as follows:
A COB encapsulating structure, comprise that substrate, n drive chip and n LED chip, each LED chip comprises N light-emitting diode chip for backlight unit, wherein n, N are integer and n >=1, N≤1; N drives chip and n LED chip by MOMEMS, in the front of substrate, to form n group COB display module, n driving chip forms lamp with n LED chip in the mode being connected one to one and drives coplanar device group, the back side of substrate is provided with the pad of fixed number, and each drives chip and each LED chip to be communicated with the pad of substrate back by cabling via hole mode.
Compared with prior art, the beneficial effect of technical solution of the present invention is:
(1) 1 traditional lamp drives coplanar device group and is one and drives N light-emitting diode chip for backlight unit of chip drives, n drive chip pairing n*N organize LED chip the individual independently lamp of corresponding n drive coplanar device, pad number is more; And the present invention is by the design of substrate circuit, change into n lamp and drive a new COB module device of coplanar device package formation, the pad number of substrate back is fixed, it needs relevant with chip and circuit design, not relevant with the group number of driving chip, saved a large amount of number of pins, external devices line significantly reduces, greatly reduce the solder joint number of PCB design difficulty, reduction wiring difficulty and the reduction paster of assembling lamp plate, and the number of plies of PCB, required precision also reduce greatly, can realize the density higher compared with conventional package.Can save in addition SMT(Surface Mounted Technology, surface mounting technology) paster expense and reduction welding difficulty, reduce whole cost.
(2) in the present invention, by n, drive chip and n*N group light emitting diode chip package to form new device, the cutting efficiency in the time of can effectively improving element manufacturing, improves testing efficiency, reduces cutting and testing cost.
(3) traditional pure COB shows that module is to carry out sealing glue position reason after chip and substrate (complete line) encapsulation, before sealing, can carry out circuit test, but after sealing, when there is bad lamp pearl and chip, cannot carry out colloid and peel off, can not reprocess.And the present invention is one by one little COB device, or the device of COB module, finally still can take the mode of paster to mount above PCBA veneer, as device, of the present invention can dismounting and change, the COB module device of n group, the cost that the cost that dismounting is reprocessed is also scrapped than whole large COB module is much lower, as long as change local bad module.And when COB device is enough little, also can take the mode of directly scrapping.So make the invention solves pure COB and show the problem of cannot reprocessing and the too high problem of disposable scrap cost of bringing in module situation, its repair rate is low, and disposable scrappage is low, greatly reduces production costs.
Accompanying drawing explanation
Fig. 1 is the structural representation that in the present invention, single lamp drives coplanar devices.
Fig. 2 is the structural representation of the COB encapsulating structure specific embodiment of a kind of light-emitting diode in the present invention.
Fig. 3 is the rearview of Fig. 2.
Fig. 4 is a plurality of device inside pin connection diagrams in the present invention.
Embodiment
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent;
For better explanation the present embodiment, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product;
To those skilled in the art, in accompanying drawing some known configurations and explanation thereof may to omit be understandable.
In description of the invention, it will be appreciated that, term " first ", " second " be only for describing object, and can not be interpreted as the quantity of indication or hint relative importance or implicit indicated technical characterictic.Thus, " first " of restriction is, one or more these features can be expressed or impliedly be comprised to the feature of " second ".In description of the invention, except as otherwise noted, the implication of " a plurality of " is two or more.
Below in conjunction with drawings and Examples, technical scheme of the present invention is described further.
As Figure 1-3, a kind of COB encapsulating structure of light-emitting diode, comprises that substrate 1, n drive chip 2 and n LED chip 3, and each LED chip comprises N light-emitting diode chip for backlight unit, and wherein n, N are integer and n >=1, N≤1; N drives chip 2 and n LED chip 3 by MOMEMS, in the front of substrate 1, to form COB demonstration module, n driving chip 2 forms lamp with n LED chip 3 in the mode being connected one to one and drives coplanar device group, the back side of substrate 1 is provided with the pad 11 of fixed number, and each drives chip 2 and each LED chip 3 to be communicated with the pad 11 at substrate 1 back side by cabling via hole mode.
The present invention is by the design of substrate 1 circuit, changing into N lamp drives coplanar device (CIS) and forms a new COB device, saved a large amount of number of pins, greatly reduce the PCB design difficulty of assembling lamp plate and the solder joint number that reduces paster, and can save SMT paster expense and reduce welding difficulty.
In specific implementation process, in LED chip, generally comprise the light-emitting diode chip for backlight unit of R, G, tri-kinds of colors of B.
In specific implementation process, LED chip 3 with drive between chip 2 and can be connected by Bonding mode or face-down bonding mode.
In specific implementation process, drive being connected and can also can passing through face-down bonding mode by Bonding mode between chip 2 and substrate 1, and pass through the design of cabling via hole and the pad 11 at substrate 1 back side together with.
In specific implementation process, pad 11 numbers at substrate 1 back side are fixed value, and this fixed value needs relevant, not relevant with the group number of driving LED with chip and circuit design.
In specific implementation process, the pad 11 at substrate 1 back side can be designed as rectangle, also can be designed to as required circle and other shape, and its position can be placed on each limit of encapsulating structure or be placed on center.Its pad can closely drive chip side, also can be near side.When the pad 11 at substrate 1 back side is rectangle or other shape, can be designed as MLF device (bottom is without pin device).When the pad of bottom is when being circular, also can consider by planting ball mode, be made into rule or irregular BGA(ball grid array) device of encapsulation.When this COB encapsulating structure is encapsulated as MLF device, the encapsulation storehouse of the PCB that it is corresponding is designed according to MLF device.Consider that reworkable property and welding consider simultaneously, the pad pin in encapsulation storehouse extension to a certain degree can be increased to paste solder printing amount, increase soldering reliability.Can improve reworkable property simultaneously.When device is BGA encapsulation, the encapsulation storehouse correspondence of its PCB is designed to BGA encapsulation.When concrete application, position, shape, size, arrangement mode and the number of the pad 11 at substrate 1 back side needs to adjust with device function needs, device size and manufacturing process, and its variation should be included under protection of the present invention.
In specific implementation process, the present invention can select the function lamp plate of suitable substrate, encapsulating material, packaging technology and correspondence etc. according to actual needs.
In specific implementation process, circuit framework of the present invention can be the design of the common anode utmost point, common cathode design, and the connection between COB group can be series connection or in parallel and corresponding compound mode.A kind of preferred embodiment in, by driving lamp that chip is connected to form one to one with LED chip to drive the serial data output that previous lamp in coplanar device group drives coplanar device, be connected with the serial data input that a rear lamp drives coplanar device, drive identical pin on chip 2 to be connected in parallel, the pin after parallel connection externally shows as a signal pad.When carrying out a plurality of lamps while driving coplanar series connection, the number of pins of its output does not increase, externally still show as fixing several outputs, pad 11 numbers at substrate 1 back side are fixed, not with driving the quantity of chip and LED chip to increase, thereby number of pins is greatly reduced, and greatly reduce the PCB design difficulty of assembling lamp plate and the solder joint number of reduction paster.For example, as shown in Figure 4, device U1, U2, U3, U4 can regard the driving chip of LED as, also can regard four LED chip as and drive chip routing to be encapsulated as lamp to drive the device after coplanar; Wherein, drive chip to be generally and there is the chip that PWM GTG is controlled, the function pin that it comprises conventionally has: SIN(data inputs) pin, the output of SOUT(data) pin, SCLK(clock) pin, LAT(latch) pin, VDD(power supply) pin, GND(ground connection) pin, IREF pin, IREF pin can terminating resistor, for IC output channel size of current is set.As shown in Figure 4, the cascade system between device is serial mode: the SDO(serial data output of previous device) the SDI(serial data input of end input next stage device) end; Pin signal in parallel: in a module, the identical parallel connection of each device pin title together, externally shows as a signal pad, and whole module externally shows as 6 pad ends (SIN, SOUT, SCLK, LAT, VDD, GND).
The corresponding same or analogous parts of same or analogous label;
In accompanying drawing, describe position relationship for only for exemplary illustration, can not be interpreted as the restriction to this patent;
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all execution modes.All any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in the protection range of the claims in the present invention.
Claims (7)
1. a COB encapsulating structure for light-emitting diode, is characterized in that, comprises that substrate, n drive chip and n LED chip, and each LED chip comprises N light-emitting diode chip for backlight unit, and wherein n, N are integer and n >=1, N≤1; N drives chip and n LED chip by MOMEMS, in the front of substrate, to form n group COB display module, n driving chip forms lamp with n LED chip in the mode being connected one to one and drives coplanar device group, the back side of substrate is provided with the pad of fixed number, and each drives chip and each LED chip to be communicated with the pad of substrate back by cabling via hole mode.
2. the COB encapsulating structure of light-emitting diode according to claim 1, it is characterized in that, lamp drives the serial data output that previous lamp in coplanar device group drives coplanar device and is connected with the serial data input that a rear lamp drives coplanar device, drive identical pin on chip to be connected in parallel, the pin after parallel connection externally shows as a signal pad.
3. the COB encapsulating structure of light-emitting diode according to claim 1, is characterized in that, LED chip is connected by Bonding mode or face-down bonding mode with corresponding driving chip.
4. the COB encapsulating structure of light-emitting diode according to claim 1, is characterized in that, drives chip to be connected by Bonding mode or face-down bonding mode with substrate.
5. according to the COB encapsulating structure of the light-emitting diode described in claim 1 to 4 any one, it is characterized in that, the pad of substrate back is circular pad or square pad.
6. the COB encapsulating structure of light-emitting diode according to claim 5, is characterized in that, when the pad of substrate back is square pad, described COB encapsulating structure is packaged into MLF device.
7. the COB encapsulating structure of light-emitting diode according to claim 5, is characterized in that, when the pad of substrate back is circular pad, described COB encapsulating structure is packaged into ball grating array package device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310603826.2A CN103594464A (en) | 2013-11-25 | 2013-11-25 | COB packaging structure of light-emitting diode |
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| CN201310603826.2A CN103594464A (en) | 2013-11-25 | 2013-11-25 | COB packaging structure of light-emitting diode |
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| CN103594464A true CN103594464A (en) | 2014-02-19 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105042405A (en) * | 2015-05-29 | 2015-11-11 | 深圳市奥拓电子股份有限公司 | LED lamp panel module |
| CN105868723A (en) * | 2016-04-05 | 2016-08-17 | 深圳芯邦科技股份有限公司 | Multi-IC system and IC |
| CN106195659A (en) * | 2016-07-27 | 2016-12-07 | 佛山市国星光电股份有限公司 | A kind of COB light source and integration module and light fixture |
| CN106847803A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | A kind of surface-adhered type RGB LED encapsulation modules of integrated IC |
| CN107068039A (en) * | 2017-01-12 | 2017-08-18 | 张新民 | LED single pixel RGB display devices and LED show bar |
| WO2018176657A1 (en) * | 2017-03-28 | 2018-10-04 | 山东晶泰星光电科技有限公司 | Surface-mounted rgb-led packaging module and manufacturing method therefor |
| CN108730927A (en) * | 2018-06-17 | 2018-11-02 | 厦门天微电子有限公司 | A kind of four groups of LED lamp integral packaging methods |
| CN110473946A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Novel LED support and LED |
| EP3582262A1 (en) * | 2018-06-14 | 2019-12-18 | Shenzhen Zhixunda Optelectronics Co., Ltd. | Four-in-one mini-led module, display screen and manufacturing method |
| CN111599911A (en) * | 2020-05-27 | 2020-08-28 | 佛山市国星光电股份有限公司 | LED light-emitting unit and display panel |
| CN112968019A (en) * | 2020-12-23 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Substrate, display unit, display module, manufacturing method of display module and display screen |
| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105042405A (en) * | 2015-05-29 | 2015-11-11 | 深圳市奥拓电子股份有限公司 | LED lamp panel module |
| CN105868723A (en) * | 2016-04-05 | 2016-08-17 | 深圳芯邦科技股份有限公司 | Multi-IC system and IC |
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| CN106195659A (en) * | 2016-07-27 | 2016-12-07 | 佛山市国星光电股份有限公司 | A kind of COB light source and integration module and light fixture |
| CN107068039A (en) * | 2017-01-12 | 2017-08-18 | 张新民 | LED single pixel RGB display devices and LED show bar |
| CN106847803A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | A kind of surface-adhered type RGB LED encapsulation modules of integrated IC |
| WO2018176657A1 (en) * | 2017-03-28 | 2018-10-04 | 山东晶泰星光电科技有限公司 | Surface-mounted rgb-led packaging module and manufacturing method therefor |
| CN106847803B (en) * | 2017-03-28 | 2023-09-15 | 山东捷润弘光电科技有限公司 | Surface-mounted RGB-LED packaging module of integrated IC |
| CN110473946A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Novel LED support and LED |
| EP3582262A1 (en) * | 2018-06-14 | 2019-12-18 | Shenzhen Zhixunda Optelectronics Co., Ltd. | Four-in-one mini-led module, display screen and manufacturing method |
| US11024609B2 (en) | 2018-06-14 | 2021-06-01 | Shenzhen Zhixunda Optoelectronics Co., Ltd. | Four-in-one mini-LED module, display screen and manufacturing method |
| CN108730927A (en) * | 2018-06-17 | 2018-11-02 | 厦门天微电子有限公司 | A kind of four groups of LED lamp integral packaging methods |
| CN111599911A (en) * | 2020-05-27 | 2020-08-28 | 佛山市国星光电股份有限公司 | LED light-emitting unit and display panel |
| CN112968019A (en) * | 2020-12-23 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Substrate, display unit, display module, manufacturing method of display module and display screen |
| CN112968019B (en) * | 2020-12-23 | 2023-08-29 | 重庆康佳光电科技有限公司 | Substrate, display unit, display module, manufacturing method of display module and display screen |
| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
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Application publication date: 20140219 |