CN201371316Y - Multi-functional laser machining system - Google Patents
Multi-functional laser machining system Download PDFInfo
- Publication number
- CN201371316Y CN201371316Y CN 200920084491 CN200920084491U CN201371316Y CN 201371316 Y CN201371316 Y CN 201371316Y CN 200920084491 CN200920084491 CN 200920084491 CN 200920084491 U CN200920084491 U CN 200920084491U CN 201371316 Y CN201371316 Y CN 201371316Y
- Authority
- CN
- China
- Prior art keywords
- laser
- optical path
- laser machining
- light path
- scanning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model discloses a multi-functional laser machining system, which comprises a laser, a beam shaping module, a beam collimating system, a two-dimensional total-reflecting scanning galvanometer system and a scanning and focusing lens that are sequentially arranged on the same optical path; a three-dimensional worktable is arranged on the exit optical path of the scanning and focusing lens; an optical path conversion system is movably arranged on the exit optical path of the beam collimating system; and the focusing lens and a nozzle are sequentially arranged on the exit optical path of the optical path conversion system. The multi-functional laser machining system adopts an optical path conversion technology, integrates two laser machining modes into a whole, and improves the flexibility and applicable range of the laser machining. The multi-functional laser machining system can realize that one equipment executes two laser machining modes by adding or taking out the optical path conversion elements, reduces cost, improves efficiency and reinforces the laser machining capability.
Description
Technical field
The utility model belongs to the Laser Processing application, is specifically related to a kind of multifunction laser system of processing.
Background technology
Laser processing mode and equipment mainly are divided into two kinds at present: first kind of laser processing mode is that laser beam passes through condenser lens, the fixed laser focused beam is on the workpiece to be machined surface, mobile bidimensional or three-dimensional working platform or stationary work-table, or come mobile laser focused beam that surface of the work is carried out bidimensional or three-dimensional processing by bidimensional or three-dimensional light-conducting system.In addition, when carrying out fine finishining, can set up navigation system, accurately measure the size of dilatation amount, be proofreaied and correct automatically during cutting.First kind of laser processing mode is because the positioning accuracy and the repeatable accuracy of its workbench or light-conducting system can reach 1 micron or higher, adopt short focal length lens can obtain 1 micron or littler laser focal beam spot simultaneously, obtain narrower line width and bore diameter, and guarantee the uniformity of focal beam spot on whole processing breadth, therefore can obtain very high trickle machining accuracy.In addition, this laser processing mode have usually one with the coaxial or non-coaxial working nozzle of laser focused beam, add high-pressure inert gas, play a part deslagging and cooling and protection condenser lens or add oxygen, play the effect of combustion-supporting raising working (machining) efficiency.But it is slower that the defective of this method maximum is a process velocity, its reason is that three-dimensional working platform or three-dimensional light-conducting system quality are bigger, rapid processing and change direction and start/when stopping, with producing bigger inertia and vibrations, cause bigger error, especially when the less curve of processing radius of curvature, process velocity descends because of the inertia reason, make laser beam long with the interaction time of processing material, the heat affected area increases, and can't obtain higher crudy.In addition, process velocity will influence Laser Processing efficient more slowly, and this also is one of the important indicator that will consider in commercial Application.
Second kind of laser processing mode is laser beam by one by the xy bidimensional vertical processing work that points to of laser scanning head that scanning galvanometer system and scanning focused lens (as usual focus lamp or telecentric scanning lens) form that is all-trans.Xy bidimensional scanning galvanometer system moves under the control of computer, thereby workpiece is carried out planar shaping processing.Usually adopt by bidimensional or three-dimensional working platform and scanning galvanometer system and carry out processing jointly, improve the flexibility of Laser Processing, satisfy the needs of large format and three-dimensional processing.This processing mode also can accurately measure the size of dilatation amount by setting up navigation system, is proofreaied and correct automatically during cutting and improves machining accuracy.The advantage of this laser processing mode is that the scanning galvanometer control system has that output torque is big, rotary inertia is little, the fast advantages such as (can reach below 0.5 millisecond) of response speed.Not only can rapid processing, improve working (machining) efficiency, and when the less curve of processing radius of curvature, very fast because of sweep speed, make laser beam short with the interaction time of processing material, reduce the heat affected area and obtain crudy and higher working (machining) efficiency preferably.But its shortcoming at first is that precision is relatively poor, and repeatable accuracy is generally 8 milliradians.Next is a scanning light beam when departing from optical axis, can cause that beam quality is bad.For overcoming this shortcoming, be usually designed to the bigger long-focus lens of clear aperature and focus on, but can cause the groove broad.In addition, the inconsistent meeting of focused light class diameter in sweep limits cause line width or the punching diameter inconsistent.At last do not have deslagging and cooling or combustion-supporting raising working (machining) efficiency function because of adopting with the coaxial working nozzle of laser focused beam.All these defectives also can cause meticulous little machining accuracy and degradation.
Summary of the invention
In order to overcome above two kinds of defectives that laser processing mode had, make full use of their strong point, the utility model provides a kind of multifunction laser system of processing, this system can realize two kinds of laser processing modes, not only reduce cost, raise the efficiency, and strengthened the Laser Processing ability.
The multifunction laser system of processing that the utility model provides, comprise the laser instrument, light beam shaping module, passing through a collimating system, the bidimensional that are positioned at successively on the same light path be all-trans scanning galvanometer system and scanning focused lens, three-dimensional working platform be positioned at scanning focused lens emitting light path on; It is characterized in that, be all-trans at passing through a collimating system and bidimensional and be movably installed with the light path converting system between the scanning galvanometer system, condenser lens and nozzle are fixed on the emitting light path of light path converting system successively, and the laser beam that is come out by passing through a collimating system shines on the described three-dimensional working platform through condenser lens and nozzle after through the light path converting system.
Basic principle of the present utility model is to adopt the light path switch technology that above-mentioned two kinds of laser processing modes are combined, and utilizes their advantages separately to come complementation defective separately.For required precision is higher but the Laser Processing that process velocity is less demanding and the radius of curvature of curve is bigger (for example laser trimming of resistance, electric capacity and inductance and thin film sensor, the accurate scribing of monocrystalline silicon, sapphire and pottery or scribing etc.), by the light path switch technology, realize that first kind of laser processing mode carries out Laser Processing and handle; But rate request higher and the radius of curvature of curve less Laser Processing (for example flexible circuit of various geometries cutting not high for required precision, cutting and open covering film window etc.), by the light path switch technology, realize that second kind of laser processing mode carries out Laser Processing and handle.Therefore, compare with two kinds of above-mentioned methods, the multifunction laser system of processing has following advantage:
1. adopt the light path switch technology, first kind and second kind of laser processing mode are incorporated into one, improved the flexibility and the range of application of Laser Processing.
2. only increase the light path conversion element and just can realize two kinds of above-mentioned laser processing modes of equipment execution, not only reduce cost, raise the efficiency, and strengthened the Laser Processing ability.
Description of drawings
Structural representation during second kind of laser processing mode of concrete enforcement of the system that Fig. 1 provides for the utility model.
Structural representation during first kind of laser processing mode of the concrete enforcement of the system that Fig. 2 the utility model provides.
The specific embodiment
The system that the utility model provides adopts a light path converting system that above-mentioned first kind of laser processing mode and second kind of laser processing mode are combined as a whole, reach multi-functional machine, realize on the same stage carrying out the required precision height on the equipment but rate request is not high and required precision is not high but the purpose of the laser processing function that rate request is high.
Below by by embodiment the utility model being described in further detail, but following examples only are illustrative, and protection domain of the present utility model is not subjected to the restriction of these embodiment.
As shown in Figure 1, laser-processing system comprises laser instrument 1, light beam shaping module 2, passing through a collimating system 3, light path converting system 5, bidimensional be all-trans scanning galvanometer 6, scanning focused lens 7, condenser lens 8, nozzle 9, three-dimensional working platform 20, navigation system 12 and processing work 13.
Light path converting system 5 adopts movable installation, and its insertion and taking-up can adopt automatic control or Artificial Control method to implement.
When light path converting system 5 was inserted in the light path, laser instrument 1 gave off laser beam, and through light beam shaping module 2 shapings, the Energy distribution that changes laser beam mode improves boring or etching quality.Entered passing through a collimating system 3 by the laser beam of shaping, lasing beam diameter is amplified and be collimated into collimated light beam, pass through light path converting system 5 again, change the direction of laser beam.Light path converting system 5 is made up of the laser total reflective mirror, and its function is the direction that changes laser beam.When light path converting system 5 is inserted in the light path, laser beam is changed direction through light path converting system 5, drop into condenser lens 8, after line focus lens 8 focus on, converge on the surface of the work by coaxial nozzle 10, implement bidimensional or three-dimensional little processing by the workpiece 13 that 20 pairs of the control three-dimensional working platforms of computer are fixed on the workbench 20, thereby realize first kind of laser processing mode of Laser Processing.
When light path converting system 5 was taken out from light path, laser beam directly entered xy bidimensional scanning galvanometer system 6, converged to workpiece 13 surfaces that are fixed on the three-dimensional working platform 20 through scanning focused lens 7 and went up (seeing shown in Figure 2).The motion under computer software control of xy bidimensional scanning galvanometer system and three-dimensional working platform 20, workpiece 13 is carried out x-y two dimensional surface or quick laser scanning of 3 D stereo or boring processing, after finishing the processing of scanning field scope, three-dimensional working platform 20 moves a certain distance at the x-y two dimensional surface, repeat above process, up to this plane layer or three-dimensional completion of processing.Thereby realize second kind of laser processing mode of Laser Processing.
When carrying out fine finishining, this equipment can also be set up navigation system 12, navigation system 12 is made up of the CCD camera usually, have calibrating function and coordinate system transformation function from moving coordinate system, can accurately measure the size of the bidimensional dilatation amount of processing work, offer the be all-trans control system of scanning galvanometer 6 of bidimensional, proofreaied and correct automatically during cutting, guarantee that the laser beam run trace overlaps with track on the workpiece to be machined.Position fixing process can be finished once also automatically and can manually progressively finish.
The utility model not only is confined to the above-mentioned specific embodiment; persons skilled in the art are according to the disclosed content of the utility model; can adopt other multiple specific embodiment to implement the utility model; therefore; every employing the technical solution of the utility model and thinking; do some simple variations or change, all fall into the scope of the utility model protection.
Claims (2)
1, a kind of multifunction laser system of processing, comprise the laser instrument (1), light beam shaping module (2), passing through a collimating system (3), the bidimensional that are positioned at successively on the same light path be all-trans scanning galvanometer system (6) and scanning focused lens (7), three-dimensional working platform (20) is positioned at scanning focused lens (7)) emitting light path on; It is characterized in that, be all-trans at passing through a collimating system (3) and bidimensional and be movably installed with light path converting system (5) between the scanning galvanometer system (6), condenser lens (8) and nozzle (9) are fixed on the emitting light path of light path converting system (5) successively, and the laser beam that is come out by passing through a collimating system (3) shines on the described three-dimensional working platform (20) through condenser lens (8) and nozzle (9) after through light path converting system (5).
2, multifunction laser system of processing according to claim 1 is characterized in that: between nozzle (9) and scanning focused lens (7) navigation system (12) is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920084491 CN201371316Y (en) | 2009-03-27 | 2009-03-27 | Multi-functional laser machining system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920084491 CN201371316Y (en) | 2009-03-27 | 2009-03-27 | Multi-functional laser machining system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201371316Y true CN201371316Y (en) | 2009-12-30 |
Family
ID=41497400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920084491 Expired - Fee Related CN201371316Y (en) | 2009-03-27 | 2009-03-27 | Multi-functional laser machining system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201371316Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101905381A (en) * | 2010-07-05 | 2010-12-08 | 大连理工大学 | Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring |
| CN101518855B (en) * | 2009-03-27 | 2011-08-24 | 华中科技大学 | Multifunctional laser processing device |
| CN102248305A (en) * | 2011-04-02 | 2011-11-23 | 周明 | Equipment and process method for high speed precision laser drilling on crystalline silicon |
| CN108465939A (en) * | 2018-02-09 | 2018-08-31 | 深圳市华星光电半导体显示技术有限公司 | Laser etching device and its laser ablation method |
| CN109985860A (en) * | 2017-12-29 | 2019-07-09 | 南京理工大学 | A kind of the laser-induced cavitation cleaning device and method of array micropore |
| CN110091055A (en) * | 2019-05-16 | 2019-08-06 | 东莞理工学院 | A kind of machine vision automatic station-keeping system for laser scribing device |
-
2009
- 2009-03-27 CN CN 200920084491 patent/CN201371316Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101518855B (en) * | 2009-03-27 | 2011-08-24 | 华中科技大学 | Multifunctional laser processing device |
| CN101905381A (en) * | 2010-07-05 | 2010-12-08 | 大连理工大学 | Microstructure-type excimer laser delaminated processing method and device of ceramic material sealing ring |
| CN102248305A (en) * | 2011-04-02 | 2011-11-23 | 周明 | Equipment and process method for high speed precision laser drilling on crystalline silicon |
| CN109985860A (en) * | 2017-12-29 | 2019-07-09 | 南京理工大学 | A kind of the laser-induced cavitation cleaning device and method of array micropore |
| CN108465939A (en) * | 2018-02-09 | 2018-08-31 | 深圳市华星光电半导体显示技术有限公司 | Laser etching device and its laser ablation method |
| CN108465939B (en) * | 2018-02-09 | 2020-10-27 | 深圳市华星光电半导体显示技术有限公司 | Laser etching device and laser etching method thereof |
| CN110091055A (en) * | 2019-05-16 | 2019-08-06 | 东莞理工学院 | A kind of machine vision automatic station-keeping system for laser scribing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101518855B (en) | Multifunctional laser processing device | |
| CN105945422B (en) | A kind of ultrafast laser microfabrication system | |
| CN201371317Y (en) | Multi-functional laser machining equipment | |
| CN208391288U (en) | A kind of large complicated carved dynamic focusing laser-processing system | |
| CN201371316Y (en) | Multi-functional laser machining system | |
| CN201783759U (en) | Optical fiber laser or disc laser dynamic focusing scanning spot trajectory processing system | |
| CN103801838B (en) | The wide laser galvanometer scanning fast etching method of a kind of modified line | |
| CN101419336B (en) | Mirror-vibrating laser three-dimensional scanning system | |
| CN203471145U (en) | Laser processing device | |
| CN102166685B (en) | Three-coordinate galvanometer scanning laser processing head | |
| CN105081586A (en) | Laser processing method and device | |
| CN104668785A (en) | Laser rapid drilling device and laser rapid drilling method | |
| CN108723617B (en) | Laser processing method | |
| CN103801826B (en) | Laser processing focusing device, focusing method and laser processing equipment | |
| CN101913024A (en) | System and method for processing dynamic focusing scanning spot track of optical fiber laser or disk laser | |
| CN103406665A (en) | Laser processing device | |
| CN102653030B (en) | Multifunctional laser processing head | |
| CN105674914B (en) | Based on the freeform optics element shape measurement system and method from motion tracking | |
| CN202070851U (en) | Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device | |
| CN104384727A (en) | Device for processing aluminum oxide ceramic by fiber laser and method thereof | |
| CN109509602A (en) | A kind of laser resistance adjuster | |
| CN201677132U (en) | Automatic focusing device of laser processor | |
| CN211102140U (en) | Laser automatic focusing positioning device | |
| CN101497149A (en) | Laser flying focus scanning system | |
| CN108195292B (en) | Displacement measuring method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091230 Termination date: 20120327 |