CN202070851U - Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device - Google Patents
Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device Download PDFInfo
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- CN202070851U CN202070851U CN 201120166358 CN201120166358U CN202070851U CN 202070851 U CN202070851 U CN 202070851U CN 201120166358 CN201120166358 CN 201120166358 CN 201120166358 U CN201120166358 U CN 201120166358U CN 202070851 U CN202070851 U CN 202070851U
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Abstract
A radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device comprises a base, a Z-axis lifting platform, a workbench and a cutting device, and is characterized in that: the cutting device comprises an ultraviolet laser, a laser focusing system, a mirror vibration system, a charge coupled device (CCD) framing and focusing system and a control system; the ultraviolet laser is connected with the laser focusing system, the laser focusing system is connected with the mirror vibration system, and the mirror vibration system is connected with the CCD framing and focusing system; and the control system comprises a central processing unit (CPU) control device and a transmission device, and the CPU control device is connected with the cutting device and the transmission device. The utility model is the R-F PCBA one-off cutting forming device, which cannot generate processing burr, generate no whitening phenomenon at the appearance of a reinforcement plate and the periphery of a bore, no crack between the reinforcement plate and the bore and no jumping and blocking phenomena of waste materials, and does not need a mould.
Description
[technical field]
The utility model relates to the device that has relative motion with the laser beam of laser beam processing and workpiece, refers to the disposable cutting forming device of a kind of R-F PCBA especially.
[background technology]
Along with machine, instrument and equipment is towards the trend of miniaturization development, such as at electronics, automobile, space flight, in the industries such as experiments of measuring equipment, the application of wiring board more and more widely, the output value is also increasing accordingly, the manufacturing element assembling of global electronic mainstream technology is that SMT (surface mounting technology) abbreviates PCBA as through the product behind the SMT at present, and the R-F (Rigid Flex) that is representing PCB industry highest level also begins beginning application widely in various high-end electronic products, so need faster, the processing method that precision is higher solves the moulding of R-F PCBA.General R-F PCBA wiring board cutting forming, traditional method are to come punching press FPC partly with mould.PCB partly then is that the mode of mechanical gong is processed, but the precision of die forming is low, the highest can only being controlled at+/-0.05mm, most+/-0.10mm.If misoperation also can cause in the process of mould punching press: the bad burr that 1, relatively are easy to generate, cause profile bad, in use cause short circuit easily; 2, layering whiting around stiffening plate profile and the endoporus has albinism; 3, crackle between reinforcement plate hole and the hole; 4, jump on the waste material, partly waste material does not fall down when punching sometimes, but upwards jumps; What have enters in the workpiece hole, also needs artificial the removing; The jumping that has causes and beats trace on counterdie, influences press work and normally carries out, and wastes a large amount of time; 5, waste material stops up; 6, Fen Yichong, two dashes, three dashes etc. and repeatedly die-cutly just can finish the work.And the Mold Making cycle is long, can not be general, need constantly to upgrade.R-F PCBA more is made up of FPC and PCB2 part because of it, and through plate face behind the SMT all portion expired part, so two parts must be made into different moulds, the difficulty of making is just bigger, the cycle is just longer.And in process, can't any damage be arranged, in this case, just need a kind of new device of exploitation to replace this traditional processing mode of mould the IC element.
[summary of the invention]
At the shortcoming of prior art, the purpose of this utility model is to provide a kind of can the generation not have between albinism, reinforcement plate hole and the hole flawless, waste material around processing burr, stiffening plate profile and the endoporus and do not go up the disposable cutting forming device of R-F PCBA that mould was not stopped up, need not in jumping.
The technical scheme that its technical problem that solves the utility model adopts is: the disposable cutting forming device of R-F PCBA, comprise support, Z axle hoistable platform, workbench and cutter sweep, upright slide rail is arranged on the support, Z axle hoistable platform is loaded on the upright slide rail movably, cutter sweep is loaded on the Z axle hoistable platform, stationary table is characterized in that on support: described cutter sweep comprises ultraviolet laser, laser focusing system, galvanometer system, ccd image location and focusing system and control system; Ultraviolet laser and laser focusing system link, and laser focusing system and galvanometer system link, and galvanometer system links with ccd image location and focusing system; Described control system comprises CPU control device and transmission device, and CPU control device and cutter sweep and transmission device link, the course of action of control cutter sweep and transmission device.
Described laser focusing system can comprise first speculum, second speculum, the 3rd speculum and the 4th speculum according to the binding order.
Described control system is controlled laser beam scan path, processing platform motion and is that different Working positions is set different parameters.
The control of the controlled system of described ccd image location and focusing system is used to discern the optical alignment target position on the R-F PCBA, realizes the accurate location and the automatic focus function of laser of processing.
Described workbench can be a vacuum absorbing platform, and platform is evacuated, and can be equipped with dust exhaust apparatus simultaneously with workpiece absorption in the above.
During work, ultraviolet laser sends laser according to the setting of control system, form the refraction of laser XY direction through first, second speculum, carry out the refraction of Z axle again through the 3rd speculum, the 4th speculum is sent into galvanometer system to laser then, and the track that galvanometer system is set according to control device cuts workpiece.And on workbench, fix R-F PCBA with falling the combination of " U " type tool and tool base plate, IC member slot position is arranged on the tool base plate, can well block R-F PCBA and carry out cutting processing, in the place of soft or hard in conjunction with different-thickness, Z axle hoistable platform moves up and down the focus characteristics of guaranteeing condenser lens according to the setting of control system and always works on the cut point, has so just reached the purpose of disposable cutting.
The utility model utilizes the high-energy-density of laser focused spot, destroy the strand of machined material, control device to FPC on the R-F PCBA and PCB partly respectively setup parameter (, sets different processing number of times and the slab place set focal shift etc.) as setting different laser energies realize that disposable shaping cuts the purpose of R-FPCBA.Control device control galvanometer runs up, and makes focus point scan two-dimensional curve with true ratio on platform, directly the need working position that cuts off R-F PCBA fast.
Because Ultra-Violet Laser has good absorption characteristic for the manufactured materials of R-F PCBA, the neat in edge that is enough to guarantee to cut out sample like this is clean, non-carbonized, characteristics such as no burr.Utilize the high-speed scanning of galvanometer, can accelerate the speed of processing greatly, utilize the focus characteristics of condenser lens, can focus on " laser knife " become quite little hot spot, to reach the precision that improves the workpiece profile.
The beneficial effects of the utility model are: can not produce workpiece does not have between albinism, reinforcement plate hole and the hole flawless, waste material around burr, stiffening plate profile and the endoporus and does not go up jumping and do not stop up, need not mould to the disposable cutting forming of R-FPCBA energy.
[description of drawings]
The utility model will be further described below in conjunction with accompanying drawing.
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is " U " type chute structural representation of the present utility model.
Among the figure: 1 is that ultraviolet laser, 2 is that first speculum, 3 is that Z axle hoistable platform, 4 is that the 3rd speculum, 5 is that second speculum, 6 is that galvanometer system, 7 is that the 4th speculum, 8 is that vacuum absorbing platform, 9 is that " U " type tool, 10 is the tool base plate.
[specific embodiment]
Referring to accompanying drawing, the disposable cutting forming device of the utility model R-F PCBA, comprise support, Z axle hoistable platform, workbench and cutter sweep, upright slide rail is arranged on the support, Z axle hoistable platform is loaded on the upright slide rail movably, cutter sweep is loaded on the Z axle hoistable platform, and stationary table is characterized in that on support: described cutter sweep comprises ultraviolet laser 1, laser focusing system, galvanometer system 6, ccd image location and focusing system and control system; Ultraviolet laser 1 links with laser focusing system, and laser focusing system and galvanometer system 6 link, and galvanometer system 6 links with ccd image location and focusing system; Described control system comprises CPU control device and transmission device, and CPU control device and cutter sweep and transmission device link, the course of action of control cutter sweep and transmission device.
In embodiment of the present utility model, described laser focusing system comprises first speculum 2, second speculum 5, the 3rd speculum 4 and the 4th speculum 7 in proper order according to binding.
In embodiment of the present utility model, described workbench is a vacuum absorbing platform 8, and combined tools 9 is housed on vacuum absorbing platform 8.
In embodiment of the present utility model, in the described CPU control device control software is arranged, this control software is used to control whole process.Because different (referring to the Fig. 2) on the material of FPC and PCB part and the thickness need be distinguished them in specific software, adopt different-energy to cut to unlike material and thickness in the time of with convenient processing.At first, utilize based on the software of R-F PCBA exploitation and open, the FPC among the figure partly is divided into different machined layer with PCB, so just can set different parameters each machined layer the former formula of R-F PCBA (files of DXF shelves).Then the formula of handling well is imported in the control software of machine, and in software, machined parameters is set for different layers.Main machined parameters comprises thickness, focal shift, processing number of times of laser frequency, pulse width, cutting speed, plate or the like.The plate of required processing is adsorbed on (as shown in Figure 1) on the platform.To be processed fixing steadily after, just can click the beginning button of controlling in the software, cut.The target that software can allow CCD seek automatically on the R-F PCBA is accurately located plank, look for full target after, device is successful location just, can effectively guarantee the machining accuracy of monoblock R-F PCBA like this.After locating successfully, the software meeting is according to the machined parameters of setting in the past, and control laser instrument ejaculation laser, vibration mirror scanning curve, platform move and process.After cutting is finished, see that the effect of cutting is further adjusted better parameter, till cutting effect the best.Optimal parameter just can be reused this parameter identical R-F PCBA has been cut after setting and finishing.The utilization of linear electric motors processing platform system is evacuated platform and processing plate and platform can not be produced relatively move; The ultraviolet laser of high frequency can reach the good cutting effect that gets; The galvanometer that runs up has improved the speed of cutting; High-precision galvanometer and platform relative motion have guaranteed the high accuracy of workpiece size.The finished product that processes like this, the precision height, and one the step finish, saved process time greatly.At first, processing in this way, neat in edge is clean, no burr, the form accuracy height, can reach+/-0.020mm, especially be fit to the cutting of minor radius profile.Secondly, traditional relatively mould impact style has high degree of flexibility, reduces Mold Making and replacing time, saves die cost.
Most critical in the utility model implementation process partly is: the R-F PCBA that mounts after finishing comes moulding in the mode of mould punching press, because R-F PCBA is different from other PCBA, its plate face FPC is partly very soft, gong cutter impetus can not be sturdy, be to carry out with the mode of mechanical gong, can only make male and female mold according to the shape of R-FPCBA moulding and carry out punching press.And PCB carries out with the mode of mechanical gong, and these two is combined industry and does not generally have good standing procedure, and the suitable difficulty of control yield.If but adopt the Ultra-Violet Laser one-shot forming just not have these problems, by means of moving up and down of z axle R-FPCBA is carried out focal length and accurately locate cutting, the tool base plate mills out blind groove on the part position having in the accurate tool of auxiliary combination system, last tool plate mills out the hollow out part position, guarantee that tight fixedly R-F PCBA is in the scope of Laser Processing, just can realize the moulding of R-F PCBA, make one falls " U " type chute and just can be completely fixed combined tools and quick replacing at tool base plate position, do like this and improved about 30% than traditional approach efficient, the formed product yield has reached more than 98%.Well solved PCB and SMT industry moulding problem about R-F PCBA.
Claims (3)
1. disposable cutting forming device of R-F PCBA, comprise support, Z axle hoistable platform, workbench and cutter sweep, upright slide rail is arranged on the support, Z axle hoistable platform is loaded on the upright slide rail movably, cutter sweep is loaded on the Z axle hoistable platform, stationary table is characterized in that on support: described cutter sweep comprises ultraviolet laser, laser focusing system, galvanometer system, ccd image location and focusing system and control system; Ultraviolet laser and laser focusing system link, and laser focusing system and galvanometer system link, and galvanometer system links with ccd image location and focusing system; Described control system comprises CPU control device and transmission device, and CPU control device and cutter sweep and transmission device link.
2. the disposable cutting forming device of R-F PCBA according to claim 1 is characterized in that: described laser focusing system comprises first speculum (2), second speculum (5), the 3rd speculum (4) and the 4th speculum (7) in proper order according to binding.
3. the disposable cutting forming device of R-F PCBA according to claim 1 and 2 is characterized in that: described workbench is vacuum absorbing platform (8), and combined tools (9) is housed on vacuum absorbing platform (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120166358 CN202070851U (en) | 2011-05-24 | 2011-05-24 | Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120166358 CN202070851U (en) | 2011-05-24 | 2011-05-24 | Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device |
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| Publication Number | Publication Date |
|---|---|
| CN202070851U true CN202070851U (en) | 2011-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120166358 Expired - Fee Related CN202070851U (en) | 2011-05-24 | 2011-05-24 | Radio-frequency (R-F) printed circuit board assembly (PCBA) one-off cutting forming device |
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| CN (1) | CN202070851U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103406663A (en) * | 2013-08-19 | 2013-11-27 | 昆山远大精工机械有限公司 | Cutting torch driving type laser cutting device |
| CN103801826A (en) * | 2014-02-14 | 2014-05-21 | 中国电子科技集团公司第四十五研究所 | Laser processing focusing device, focusing method and laser processing equipment |
| CN106423648A (en) * | 2016-11-15 | 2017-02-22 | 东莞市北扬工业设计有限公司 | Working platform for automatic nano solution spraying device |
| CN107186354A (en) * | 2017-06-02 | 2017-09-22 | 深圳华创兆业科技股份有限公司 | The laser grooving system and method for IC-card |
| CN107186357A (en) * | 2017-06-02 | 2017-09-22 | 深圳华创兆业科技股份有限公司 | The laser cutting system and method for IC-card |
| CN108941898A (en) * | 2017-05-19 | 2018-12-07 | 维嘉数控科技（苏州）有限公司 | L shape crossbeam light channel structure and laser cutting machine |
| CN109848567A (en) * | 2019-01-30 | 2019-06-07 | 无锡深南电路有限公司 | A kind of radium-shine milling edge equipment and method of package substrate |
| CN111482718A (en) * | 2020-05-18 | 2020-08-04 | 名光智能科技(佛山)有限公司 | High-precision gantry laser cutting equipment |
-
2011
- 2011-05-24 CN CN 201120166358 patent/CN202070851U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103406663A (en) * | 2013-08-19 | 2013-11-27 | 昆山远大精工机械有限公司 | Cutting torch driving type laser cutting device |
| CN103801826A (en) * | 2014-02-14 | 2014-05-21 | 中国电子科技集团公司第四十五研究所 | Laser processing focusing device, focusing method and laser processing equipment |
| CN106423648A (en) * | 2016-11-15 | 2017-02-22 | 东莞市北扬工业设计有限公司 | Working platform for automatic nano solution spraying device |
| CN108941898A (en) * | 2017-05-19 | 2018-12-07 | 维嘉数控科技（苏州）有限公司 | L shape crossbeam light channel structure and laser cutting machine |
| CN107186354A (en) * | 2017-06-02 | 2017-09-22 | 深圳华创兆业科技股份有限公司 | The laser grooving system and method for IC-card |
| CN107186357A (en) * | 2017-06-02 | 2017-09-22 | 深圳华创兆业科技股份有限公司 | The laser cutting system and method for IC-card |
| CN107186357B (en) * | 2017-06-02 | 2019-09-06 | 深圳华创兆业科技股份有限公司 | The laser cutting system and method for IC card |
| CN107186354B (en) * | 2017-06-02 | 2019-09-06 | 深圳华创兆业科技股份有限公司 | The laser grooving system and method for IC card |
| CN109848567A (en) * | 2019-01-30 | 2019-06-07 | 无锡深南电路有限公司 | A kind of radium-shine milling edge equipment and method of package substrate |
| CN111482718A (en) * | 2020-05-18 | 2020-08-04 | 名光智能科技(佛山)有限公司 | High-precision gantry laser cutting equipment |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111214 Termination date: 20180524 |
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| CF01 | Termination of patent right due to non-payment of annual fee |