CN108983072A - Crystal round test approach, wafer tester and wafer test system - Google Patents
Crystal round test approach, wafer tester and wafer test system Download PDFInfo
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- CN108983072A CN108983072A CN201810862873.1A CN201810862873A CN108983072A CN 108983072 A CN108983072 A CN 108983072A CN 201810862873 A CN201810862873 A CN 201810862873A CN 108983072 A CN108983072 A CN 108983072A
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- tube core
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
This application discloses a kind of crystal round test approach, comprising: the tube core on wafer to be measured is divided into tube core group；Multiple tube core groups thereto provide pumping signal；Obtain the test result data of the multiple tube core group；And the test result data of each tube core is obtained according to the test result data of the multiple tube core group, wherein the multiple tube core group executes multi-channel test and returns to the test result data.It enables to be based on the existing test machine more tube cores of multi-channel test within a certain period of time by grouping, saves testing time and testing cost.The application provides a kind of wafer tester and wafer test system simultaneously.
Description
Technical field
The present invention relates to wafer test field, more particularly, to a kind of crystal round test approach, wafer tester and
Wafer test system
Background technique
Wafer test is that semiconductor chip moves towards product and enters one of last several processes in market, for encapsulation thereafter
Etc. processes all various aspects such as control in time and Material Cost and play a crucial role.Wafer test is usually required to wafer
On integrated circuit carry out electrical performance testing, to judge whether integrated circuit good.
With the increase of contemporary integrated circuits complexity, wafer test cost is also increasing.Multi-channel test is to reduce wafer
One of best solution of testing cost.Multi-channel test completes the test assignment to multiple tube cores (die) within a certain period of time.
Industry also provides various automatic test machines (ATE, Auto Testing Equipment) for multi-channel test.Automatically
Test machine includes high-end test machine and low side test machine, and high-end test machine, can be in the same time relative to low side test machine
More test assignments are completed, therefore the testing efficiency of high-end test machine is higher, but the market price of high-end test machine simultaneously
It is higher.Common low side test machine has most 2site, the automatic test machine of 4site, 8site, wherein site currently on the market
Number indicates that automatic test machine is able to carry out most tube core numbers of multi-channel test, and site number is bigger, and expression testing efficiency is higher, simultaneously
The market price of corresponding test machine is also more expensive.
So, controlled in view of testing cost, be based on existing test machine, how multi-channel test more multitube in certain time
Core is a good problem to study.
Summary of the invention
In view of this, the present invention proposes a kind of crystal round test approach and wafer tester, it is based on existing automatic test
Machine, the more tube cores of multi-channel test.
According to the first aspect of the invention, a kind of crystal round test approach is provided, comprising:
Tube core on wafer to be measured is divided into tube core group；
Multiple tube core groups thereto provide pumping signal；
Obtain the test result data of the multiple tube core group；And
The test result data of each tube core is obtained according to the test result data of the multiple tube core group,
Wherein, the multiple tube core group executes multi-channel test and returns to the test result data.
Preferably, the crystal round test approach further include:
According to the quantity of pad to be measured and the number of channels of automatic test machine and site number computer tube on each tube core
The number of core group.
Preferably, the automatic test machine has M channel, and each tube core group includes P tube core, and each tube core has N
A pad to be measured, the maximum site number that the automatic test machine has are K, then M, P, N and K meet relational expression: N*K*P≤M,
Wherein, N, K, M, P are positive integer.
Preferably, a channel of the automatic test machine corresponds to a pad to be measured.
Preferably, the test result data of the multiple tube core group includes multirow data, and each row of data includes a tube core
No. BIN of group.
Preferably, tube core on the wafer to be measured forms array, in the test data in array line number and
Columns positions a tube core and tube core group.
According to the second aspect of the invention, a kind of wafer tester is provided, is deployed on automatic test machine, for testing
Wafer to be measured, comprising:
Signal provides module, pumping signal is provided for multiple tube core groups on wafer to be measured, so that the multiple
Tube core group executes multi-channel test；
Data reception module obtains the test result data of the multiple tube core group；And
Data resolution module, it is every in each tube core group for being obtained according to the test result data of the multiple tube core group
The test result data of a tube core.
Preferably, the wafer tester further include:
Group number computing module, according to the number of channels of number of pads to be measured and the automatic test machine on each tube core
The tube core number that a tube core group includes is calculated with site number.
Preferably, the test result data includes multirow data, and each row of data includes No. BIN of a tube core group.
According to the third aspect of the invention we, a kind of wafer test system is provided, comprising: automatic test machine and described automatic
Multiple probe cards of test machine connection and the wafer to be measured connected with the probe card, the automatic test machine includes above-mentioned
Wafer tester.
In embodiments of the present invention, it enables to be based on existing automatic test machine multichannel within a certain period of time by grouping
More tube cores are tested, testing time and testing cost are saved.The parsing work of test result data is transferred to test automatically
Test device (i.e. test program) parsing on machine, also can reduce testing time and testing cost.
Detailed description of the invention
Description by referring to the following drawings to the embodiment of the present invention, the above and other purposes of the present invention, feature and
Advantage will be apparent from, in the accompanying drawings:
Fig. 1 and 2 shows the main view and side view of the wafer with multiple tube cores according to prior art；
Fig. 3 shows the schematic diagram of probe card according to prior art；
Fig. 4 shows the schematic diagram that the probe card of Fig. 3 contacts wafer shown in FIG. 1 with probe；
Fig. 5 shows the connection schematic diagram of automatic test machine according to prior art and probe card；
Fig. 6 shows the flow chart of the crystal round test approach of the embodiment of the present invention；
Fig. 7 shows the flow chart of the crystal round test approach of another embodiment of the present invention；
Fig. 8 shows the schematic diagram for the test device being deployed on automatic test machine.
Specific embodiment
Hereinafter reference will be made to the drawings, and the present invention will be described in more detail.In various figures, identical element is using similar attached
Icon is remembered to indicate.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.Furthermore, it is possible to be not shown certain
Well known part.
In the description of the present invention, it is to be understood that, term " first ", " second " etc. are used for description purposes only, without
It can be interpreted as indication or suggestion relative importance.In addition, in the description of the present invention, unless otherwise indicated, the meaning of " multiple "
It is two or more.
In the present invention, term " multi-channel test " can be understood as providing survey to the channel of multiple tube cores within a certain period of time
Examination data and the test process for receiving test result data.The concept of multi-channel test is more wide in range than the concept of concurrent testing, it
Test data not only is transmitted comprising while to multiple channels and receives the concurrent testing process of test result data, also comprising with string
Capable and the parallel combined mode transmits test data to multiple channels and receives the test process of test result data, and comprising
Under specific circumstances, serial transfer test data and the test process of test result data is received to one, channel channel.
In actual use, the efficiency and accuracy for taking into account data acquisition, select differently composed multichannel to survey in the different location of wafer
Examination.
Fig. 1 and 2 shows the main view and side view of the wafer with multiple tube cores according to prior art.Fig. 3 is shown
The schematic diagram of probe card according to prior art.Fig. 4 shows the probe card of Fig. 3 and contacts wafer shown in FIG. 1 with probe
Schematic diagram.
Referring to Fig. 1-4, wafer 100 is to form multiple array arrangements on 100 surface of wafer after semiconductor element technique
Tube core 101, multiple tube core 101 need to be after wafer test, it is determined whether is packaged or must remove calcellation.Often
Several pads (PAD) 102 are all drawn around a tube core 101 for applying voltage, electric current and detection during the test
Output signal.
Multiple pads are selected from several above-mentioned pads as pad to be measured, using probe card 200 to multiple to be measured
Pad (PAD) 102 applies voltage, electric current and detection output signal.As shown, probe card 200 is cantalever type probe, including
Probe base 201 and multiple probes, each probe include cantilever portion 202 and needle tip 203.In test, wafer 100 is moved into spy
200 lower section of needle card.The relative position for adjusting wafer 100 and probe card 200 makes each probe correspond to a pad to be measured
(PAD)102.Then, make needle tip 203 and the wafer 200 of probe close to each other, needle tip 203 is made to contact each weldering to be measured respectively
Disk (PAD) 201, to carry out the electric characteristics measurement of wafer.
It is noted that usually some redundancy pads can be arranged, therefore certainly on chip for the convenience of packaging and testing
When dynamicization is tested, not each pad of chip top can access the channel of automatic test machine as pad to be measured.
Fig. 5 shows the connection schematic diagram of automatic test machine according to prior art and probe card.
In automatic test, test machine 401 and multiple probe cards 401 are connected.Test machine 401 includes multiple logical
Road (is not shown) on figure, sends the pumping signal of electric current and voltage to probe card 401 by channel, and obtains from channel to be measured
The output signal of tube core.In above-mentioned automatic test course, each pad to be measured needs to occupy one on automatic test machine
Channel, but this does not imply that all channels all can be occupied in each automatic test course, under some cases,
Passage portion is in idle condition.Therefore, the maximum site number of test machine, which depends on the existing channel of automatic test machine, to hold
Port number needed for the most complete tube cores received.
It illustrates.
A kind of tube core of wafer has 30 pads (PAD) to be measured, and test machine has 128 channels, if the test machine
The maximum site number set is 4, then test machine can need 120 channels by multi-channel test 4 such tube cores simultaneously
(120<128).It is assumed that the tube core of another wafer has 15 pads (PAD) to be measured, if continuing to use this 128
The automatic test machine in channel, then it is 60 that the tube core, which can be performed simultaneously port number required for the multi-channel test of 4site, this
Mean to be in idle condition there are also 60 channels.And it is according to embodiments of the present invention, every two tube core can be arranged to one
Big tube core executes the multi-channel test of 4 site, since the big tube core has 15*2 pads to be measured, then executes 4 site's
Multi-channel test needs 30*4 channel (120 < 128), thus the maximum limit that the port number of automatic test machine and site number all obtain
The use of degree.
The present invention is further described below by a specific embodiment.
Fig. 6 shows the flow chart of the crystal round test approach of the embodiment of the present invention.Specifically include following steps.
In step s 110, the tube core on wafer to be measured is divided into tube core group.
Referring to Fig. 1, multiple tube cores on wafer are segmented into multiple tube core groups.For example, by adjacent three pipes in array
Core point then obtains three tube core groups in a tube core group.
In the step s 120, multiple tube core groups thereto provide pumping signal.
Referring to the multiple tube core groups obtained based on step S110, referring to Fig. 3-5, automatic test machine is via probe card to tube core
Group provides pumping signal, after tube core group obtains pumping signal, executes die testing and returns to test result data.
In step s 130, the test result data of multiple tube core groups is obtained.
With continued reference to Fig. 3-5, automatic test machine obtains test result data from multiple tube core groups via probe card, test
Result data describes the test result of each tube core group.
In step S140, each tube core in each tube core group is obtained according to the test result data of multiple tube core groups
Test result data.
In this step, the test result data of automatic test machine parsing tube core group, therefrom obtains the test of each tube core
Result data.For example, if in a tube core group including three tube cores, respectively according to the test result data of the tube core group
To the test result data of three tube cores.
The test result data of tube core group and the test result number of tube core is provided below in the present embodiment in order to better understand
According to as exemplary introduction.
A kind of illustrative test result data is arranged two tube cores as tube core group, includes the following data item of multirow:
Record number, tube core group serial number, tube core group coordinate (X, Y), tube core group BIN, test item 1_ data 1, test
Project 1_ data 2, test item 2_ data 1, test item 2_ data 2 ... test item M_ data 1, test item M_ data
2。
Wherein, record number is unique identification, and tube core group coordinate (X, Y) indicates tube core group in the position of array, tube core group
No. BIN indicates the whether normal of tube core group.Remainder data item data 1 by tube core group first tube core export, data 2 by
Second tube core output.The test result data can be stored with document form.
It can be seen that the test result data of tube core group describes the test result of each tube core group, this test result is corresponding
For tester, not enough, because judging whether a tube core group is normal industrially without any value, it is necessary to will manage
Whether the tube core in core group normally judges, could and then remove abnormal tube core.
Therefore, according to embodiments of the present invention, the test result data of above-mentioned tube core group is decomposed into the test of each tube core
Result data.Specifically include following data item:
Record number, tube core 1, No. 1 coordinate (X1, Y1) of tube core, tube core No. 1 No. BIN, test item 1_ data 1 are surveyed
Examination project 2_ data 1 ... test item N_ data 1.
Record number, tube core 2, No. 2 coordinates (X2, Y2) of tube core, tube core No. 2 No. BIN, test item 1_ data 2 are surveyed
Examination project 2_ data 2 ... test item N_ data 2.
Here, whether tube core No. 1 No. BIN and No. 2 No. BIN expression tube cores No. 1 and No. 2 of tube core are normal.
As it can be seen that decomposing by data, the test result of each tube core can be obtained, that is, judges each tube core whether just
Often, and then abnormal tube core can be removed.
It is noted that the embodiment of the present invention in, the coordinate of tube core group and it includes tube core coordinate can convert.
Divide in a tube core group for example, two tube cores of the array with a line will be located at, then the coordinate and tube core of tube core group
Coordinate referring to following table.
Fig. 7 shows the flow chart of the crystal round test approach of another embodiment of the present invention.Specifically include step S100 and step
Rapid S110-S140.
Embodiment in step S110-S140 and Fig. 6 is identical, just repeats no more here.
Step S100 is according to pad to be measured (PAD) quantity of each tube core and the number of channels and site of automatic test machine
Number calculates the tube core number that a tube core group includes.
In the present embodiment, it under the premise of port number is met the requirements, calculates the tube core number that a tube core group includes and carries out
Grouping, so that automatic test machine carries out multi-channel test as far as possible with biggish site, so that parallel efficiency maximizes.
Illustrate step S100 by way of example below.
If automatic test machine has M channel, the tube core of a wafer has N number of pad (PAD) to be measured, and test machine is set
Fixed maximum site number is K then according to this step, and a big tube core is arranged in P tube core, then executes holding for K site
Row multi-channel test, wherein N*K*P≤M, N, K, M, P are positive integer.
Such as the tube core of the wafer of the foregoing description has 15 pads (PAD) to be measured, test machine has 128 channels, such as
The maximum site number that the fruit test machine is set is 4, then two tube cores, then can be arranged to one big by 15*4 < 128/2
Tube core, then execute the multi-channel test of 4 site.And so on.Certainly, the tube core in chipset is not The more the better, also
Need to consider the application of pumping signal and the facilities of probe card.
Fig. 8 shows the schematic diagram for the test device being deployed on automatic test machine.Test device 800 is provided including signal
Module 801, data reception module 802 and data resolution module 803.For convenience of understanding, a probe card is also shown on figure
201。
Module 801 is provided, pumping signal is supplied to by multiple tube core groups on wafer to be measured by probe card 201, with driving
Tube core group is tested.
Data reception module 802 obtains test result data from multiple tube core groups by probe card 201.The test result number
It include the whether normal data item of tube core group according to the test result of tube core group is described.
Data resolution module 803 obtains the survey of each tube core in each tube core group according to the test result data of tube core group
Test result data.Data resolution module 803 obtains each tube core in tube core group by the test result data of parsing tube core group
Test result data.
It can be seen that according to embodiments of the present invention, tube core can be arbitrarily grouped, and according to packet parsing test result number
According to the test result data of tube core can be obtained.
In embodiments of the present invention, it enables to be based on existing automatic test machine multichannel within a certain period of time by grouping
More tube cores are tested, testing time and testing cost are saved.The parsing work of test result data is transferred to test automatically
Test device (i.e. test program) parsing on machine, also can reduce testing time and testing cost.
Preferably, above-mentioned wafer tester, further includes: group number computing module, according to the pad to be measured of each tube core
(PAD) number of channels and site number of quantity and automatic test machine calculate the tube core number that a tube core group includes.
Although the embodiment of the present invention is disclosed as above with preferred embodiment, its be not for limiting claim, it is any
Those skilled in the art without departing from the spirit and scope of the present invention, can make possible variation and modification, therefore this
The protection scope of invention should be subject to the range that the claims in the present invention are defined.
The above description is only a preferred embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art
For, the invention can have various changes and changes.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of crystal round test approach, comprising:
Tube core on wafer to be measured is divided into tube core group；
Multiple tube core groups thereto provide pumping signal；
Obtain the test result data of the multiple tube core group；And
The test result data of each tube core is obtained according to the test result data of the multiple tube core group,
Wherein, the multiple tube core group executes multi-channel test and returns to the test result data.
2. crystal round test approach according to claim 1, wherein further include:
According to the quantity of pad to be measured and the number of channels of automatic test machine and one pipe of site number calculating on each tube core
The tube core number that core group includes.
3. crystal round test approach according to claim 2, wherein the automatic test machine has M channel, each tube core
Group includes P tube core, and each tube core has N number of pad to be measured, and the maximum site number that the automatic test machine has is K, then M,
P, N and K meet relational expression: N*K*P≤M, wherein N, K, M, P are positive integer.
4. crystal round test approach according to claim 1, wherein a channel of the automatic test machine corresponds to one
Pad to be measured.
5. crystal round test approach according to claim 1, wherein the test result data of the multiple tube core group includes more
Row data, each row of data include No. BIN of a tube core group.
6. crystal round test approach according to claim 1, wherein the tube core on the wafer to be measured forms array, in institute
It states in test data with the line number and columns one tube core of positioning and tube core group in array.
7. a kind of wafer tester, is deployed on automatic test machine, for testing wafer to be measured, comprising:
Signal provides module, pumping signal is provided for multiple tube core groups on wafer to be measured, so that the multiple tube core
Group executes multi-channel test；
Data reception module obtains the test result data of the multiple tube core group；And
Data resolution module, for obtaining each pipe in each tube core group according to the test result data of the multiple tube core group
The test result data of core.
8. wafer tester according to claim 1, further includes:
Group number computing module, according to the number of channels of the quantity of the pad to be measured on each tube core and the automatic test machine and
Site number calculates the tube core number that a tube core group includes.
9. wafer tester according to claim 7, wherein the test result data includes multirow data, every row
Data include No. BIN of a tube core group.
10. a kind of wafer test system, comprising: multiple probe cards that automatic test machine is connected with the automatic test machine and
The wafer to be measured connected with the probe card,
The automatic test machine includes such as the described in any item wafer testers of claim 7-9.
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| CN201810862873.1A CN108983072B (en) | 2018-08-01 | 2018-08-01 | Wafer testing method, wafer testing device and wafer testing system |
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| CN201810862873.1A CN108983072B (en) | 2018-08-01 | 2018-08-01 | Wafer testing method, wafer testing device and wafer testing system |
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Address after: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Weigan Semiconductor Co.,Ltd. Address before: 5 / F, building C, swan block, Wuxi Software Park, 111 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Weil Semiconductor Co.,Ltd. |
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