CN109856527A - Crystal round test approach, wafer tester and wafer test system - Google Patents
Crystal round test approach, wafer tester and wafer test system Download PDFInfo
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- CN109856527A CN109856527A CN201811613275.7A CN201811613275A CN109856527A CN 109856527 A CN109856527 A CN 109856527A CN 201811613275 A CN201811613275 A CN 201811613275A CN 109856527 A CN109856527 A CN 109856527A
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Abstract
This application discloses a kind of crystal round test approach, for testing the wafer to be measured including multiple tube cores, comprising: the tube core on wafer to be measured are divided into multiple tube core groups, each tube core group includes at least one tube core；Prestore the location information of each tube core group；Pumping signal is provided to multiple tube core groups；Obtain the test result data of multiple tube core groups；And parse to obtain the test result data of each tube core according to the location information and test result data of tube core group, reduce the number interactively communicated between automatic test machine and probe station, saves testing time and testing cost.The application provides a kind of wafer tester and wafer test system simultaneously.
Description
Technical field
The present invention relates to wafer test field, more particularly, to a kind of crystal round test approach, wafer tester and
Wafer test system.
Background technique
Wafer test (Chip Probing) is that semiconductor chip moves towards product and enters one of last several processes in market,
It all various aspects such as controls in time and Material Cost for processes such as encapsulation thereafter to play a crucial role.Wafer test
It usually requires to carry out electrical performance testing to the integrated circuit on wafer, to judge whether integrated circuit is good.
Equipment used in wafer test has automatic test machine (IC Tester), probe card (Probe Card), probe station
(Prober) interface (Mechanical Interface) and between automatic test machine and probe card.Wafer quilt in testing
When being transmitted on probe station chuck (chuck), probe station system is by its internal camera system to the feature chip on wafer
It carries out distinguishing confirmation initial position, after initial position obtains, probe station moves towards to carry out according to pre-set wafer figure (map)
Acupuncture treatment test, or acupuncture treatment test is carried out in wafer figure (map) according to the shift position that automatic test machine is sent, such as Fig. 1 institute
Show.
With the increase of contemporary integrated circuits complexity, wafer test cost is also increasing.Multi-channel test is to reduce wafer
One of best solution of testing cost.Multi-channel test completes the test assignment to multiple tube cores (die) within a certain period of time.
Need to carry out multiple communication interaction in existing wafer test, between automatic test machine and probe station, such as inquiry is currently
Effective position site, or inquiry current die coordinate information etc., increase the time of wafer test, reduce test effect
Rate.
So, it is controlled in view of testing cost, how to reduce the testing time, be a good problem to study.
Summary of the invention
In view of this, the present invention proposes a kind of crystal round test approach and wafer tester, it is based on existing automatic test
Machine, the more tube cores of multi-channel test.
According to a first aspect of the embodiments of the present invention, a kind of crystal round test approach is provided, includes multiple tube cores for testing
Wafer to be measured characterized by comprising
Tube core on the wafer to be measured is divided into multiple tube core groups, each tube core group includes at least one tube core；
Prestore the location information of each tube core group；
Pumping signal is provided to the multiple tube core group；
Obtain the test result data of the multiple tube core group；And
It parses to obtain the test of each tube core with the test result data of the tube core group according to the positional information
Result data.
Preferably, the crystal round test approach is for testing multiple wafers to be measured, wherein prestores each tube core
The location information the step of include: acquisition and the position for storing each tube core group in the first wafer to be measured
Information.
Preferably, the location information includes: tube core group coordinate and effective position site.
Preferably, it parses to obtain each tube core with the test result data of the tube core group according to the positional information
Test result data include: that the tube core of each tube core is obtained according to the tube core group coordinate and effective site location resolution
Coordinate, and the tube core coordinate is associated with the test result data of the tube core group to obtain the test result number of the tube core
According to.
Preferably, the test result data includes: tube core coordinate, tube core BIN and project data.
According to the second aspect of the invention, a kind of wafer tester is provided, is deployed on automatic test machine, for testing
Wafer to be measured including multiple tube cores characterized by comprising
Memory module, stores the location information of each tube core group on the wafer to be measured, and each tube core group includes
At least one tube core；
Signal provides module, for providing pumping signal to the multiple tube core group；
Data reception module, for obtaining the test result data of the multiple tube core group；And
Data resolution module parses to obtain each institute according to the positional information with the test result data of the tube core group
State the test result data of tube core.
Preferably, the wafer tester is for testing multiple wafers to be measured, wherein the data reception module
It is also used to obtain the location information of each tube core group in the first wafer to be measured, and is provided to the storage mould
Block.
Preferably, the location information includes: tube core group coordinate and effective position site.
Preferably, the data resolution module obtains often according to the tube core group coordinate and effective site location resolution
The tube core coordinate of a tube core, and the tube core coordinate is associated with the test result data of the tube core group to obtain the tube core
Test result data.
According to the third aspect of the invention we, a kind of wafer test system is provided, comprising: automatic test machine and described automatic
Multiple probe cards of test machine connection and the wafer to be measured connected with the probe card, the automatic test machine includes above-mentioned
Wafer tester.
When testing multiple wafers to be measured according to embodiments of the present invention, when testing first wafer to be measured by obtaining and storing
The location information of the tube core group of wafer to be measured, each tube core group include at least one tube core.Then it is surveyed in subsequent wafer to be measured
It parses to obtain the test result number of each tube core according to the test result data of the location information prestored and tube core group during examination
According to reducing the number that interactively communicates between automatic test machine and probe station in automation acupuncture treatment test process, save test
Time and testing cost improve testing efficiency.
Detailed description of the invention
Description by referring to the following drawings to the embodiment of the present invention, the above and other purposes of the present invention, feature and
Advantage will be apparent from, in the accompanying drawings:
Schematic diagram is moved towards in the acupuncture treatment that Fig. 1 shows wafer test according to prior art；
Fig. 2 and 3 shows the main view and side view of the wafer with multiple tube cores according to prior art；
Fig. 4 shows the schematic diagram of probe card according to prior art；
Fig. 5 shows the schematic diagram that the probe card of Fig. 4 contacts wafer shown in Fig. 2 with probe；
Fig. 6 shows the connection schematic diagram of automatic test machine according to prior art and probe station；
Fig. 7 shows the flow chart of the crystal round test approach of the embodiment of the present invention；
Fig. 8 shows single-path testing schematic diagram according to an embodiment of the present invention；
Fig. 9 shows multi-channel test schematic diagram according to an embodiment of the present invention；
Figure 10 shows the schematic diagram for the wafer tester being deployed on automatic test machine.
Specific embodiment
Hereinafter reference will be made to the drawings, and the present invention will be described in more detail.In various figures, identical element is using similar attached
Icon is remembered to indicate.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.Furthermore, it is possible to be not shown certain
Well known part.
In the description of the present invention, it is to be understood that, term " first ", " second " etc. are used for description purposes only, without
It can be interpreted as indication or suggestion relative importance.In addition, in the description of the present invention, unless otherwise indicated, the meaning of " multiple "
It is two or more.
In the present invention, term " multi-channel test " can be understood as providing survey to the channel of multiple tube cores within a certain period of time
Examination data and the test process for receiving test result data.The concept of multi-channel test is more wide in range than the concept of concurrent testing, it
Test data not only is transmitted comprising while to multiple channels and receives the concurrent testing process of test result data, also comprising with string
Capable and the parallel combined mode transmits test data to multiple channels and receives the test process of test result data, and comprising
Serial transfer test data under specific circumstances and the test process for receiving test result data.In actual use, it takes into account
The efficiency and accuracy of data acquisition, differently composed multi-channel test is selected in the different location of wafer.
Fig. 2 and 3 shows the main view and side view of the wafer with multiple tube cores according to prior art.Fig. 4 is shown
The schematic diagram of probe card according to prior art.Fig. 5 shows the probe card of Fig. 4 and contacts wafer shown in Fig. 2 with probe
Schematic diagram.
Referring to fig. 2-5, wafer 100 is to form multiple array arrangements on 100 surface of wafer after semiconductor element technique
Tube core 101, multiple tube core 101 need to be after wafer test, it is determined whether is packaged or must remove calcellation.Often
Several pads (PAD) 102 are all drawn around a tube core 101 for applying voltage, electric current and detection during the test
Output signal.
Multiple pads are selected from several above-mentioned pads as pad to be measured, using probe card 200 to multiple to be measured
Pad (PAD) 102 applies voltage, electric current and detection output signal.As shown in figure 4, probe card 200 is cantalever type probe, packet
Probe base 201 and multiple probes are included, each probe includes cantilever portion 202 and needle tip 203.In test, wafer 100 is moved to
200 lower section of probe card.The relative position for adjusting wafer 100 and probe card 200 makes each probe correspond to a pad to be measured
(PAD)102.Then, make needle tip 203 and the wafer 200 of probe close to each other, needle tip 203 is made to contact each weldering to be measured respectively
Disk (PAD) 201, to carry out the electric characteristics measurement of wafer.
It is noted that usually some redundancy pads can be arranged, therefore certainly on chip for the convenience of packaging and testing
When dynamicization is tested, not each pad of chip top can access the channel of automatic test machine as pad to be measured.
Fig. 6 shows the connection schematic diagram of automatic test machine according to prior art and probe station.
In automatic test, the probe card 401 on automatic test machine 301 and probe station 402 is connected.It is automatic to survey
Test-run a machine 301 includes multiple channels (being not shown on figure), sends the pumping signal of electric current and voltage to probe card 401 by channel,
And the output signal of tube core to be measured is obtained from channel.Each pad to be measured need to occupy one on automatic test machine 301 it is logical
Road, but this does not imply that channel all in each automatic test course all can be occupied, part under some cases
Channel is in idle condition.The maximum site number of automatic test machine 301, which depends on the existing channel of automatic test machine, to be accommodated
Most complete tube cores needed for port number.
For example, the maximum site number that automatic test machine 301 is set is 8, then automatic test machine 301 at most can be simultaneously
8 tube cores of multi-channel test.If probe station 402 carries out acupuncture treatment test according to the trend of wafer figure as shown in Figure 1, then testing
When the tube core of the first row, 4 site work is needed, when testing the tube core of the second row, needs 6 site work, in test the
When the tube core of three rows, 8 site work are needed.Therefore in above-mentioned automatic test course, automatic test machine 301 and probe station
It needs to carry out multiple communication interaction between 402, such as inquires current effective position site, or the seat of inquiry current die
Data etc. are marked, the time of wafer test is increased, reduces testing efficiency.
The present invention is further described below by a specific embodiment.
Fig. 7 shows the flow chart of the crystal round test approach of the embodiment of the present invention, and the crystal round test approach is for testing
Multiple wafers to be measured.Specifically include following steps.
In step s 110, wafer to be measured is received.Exemplary, wafer to be measured is sent on probe station chuck (chuck),
Probe station system carries out the feature chip on wafer by its internal camera system to distinguish confirmation initial position.
In the step s 120, the location information of the tube core group of wafer to be measured is judged whether there is, and if it exists, then carry out step
S130；If it does not exist, then step S140 is carried out.
It is exemplary, the tube core on wafer to be measured is divided into multiple tube core groups, each tube core group includes at least one tube core.From
Dynamic test machine judges whether there is the matched location information of multiple tube cores with current wafer by reading external data library.It is external
Database is, for example, document data bank, SQL database, distribution NoSQL database, flow data system etc..
Exemplary, automatic test machine can also be judged whether there is multiple with current wafer by reading internal storage
The matched location information of tube core.Memory can be by any kind of volatibility or non-volatile memory device or their group
It closes and realizes, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM) is erasable to compile
Journey read-only memory (EPROM), programmable read only memory (PROM), read-only memory (ROM), magnetic memory, flash
Device, disk or CD.
In step s 130, the location information prestored is called.It is exemplary, if there is multiple tube cores with current wafer
The location information matched, then automatic test machine directly calls the position being matched to believe from external data base or internal storage
Breath.
In step S140, the location information of the tube core of wafer to be measured is obtained and stored.It is exemplary, if there is no with work as
The matched location information of multiple tube cores of preceding wafer, then probe station system is by its internal camera system to the tube core on wafer
Group is distinguished, is obtained the location information of tube core group and is sent to automatic test machine, automatic test machine will be on the location information
It reaches external data base or stores into internal storage, can be used for subsequent wafer testing procedure.
In step S150, pumping signal is provided to multiple tube core groups of wafer to be measured.Referring to fig. 4-6, automatic test machine
Pumping signal is provided to tube core group via probe card, after tube core group obtains pumping signal, die testing is executed and returns to test knot
Fruit data.
In step S160, the test result data of tube core group is obtained.With continued reference to Fig. 4-6, automatic test machine is via spy
Needle card obtains test result data from multiple tube core groups, and the test result data of tube core group describes the test of each tube core group
As a result.
In step S170, each tube core is obtained according to the test result data of the location information of tube core group and tube core group
Test result data.Exemplary, automatic test machine passes through the tube core group coordinate (X, Y) and site effective in parsing location information
The tube core coordinate for obtaining each tube core is set, and the test result data of tube core group will be decomposed into each tube core according to tube core coordinate
Test result data.Wherein, position of the tube core group coordinate representation tube core group in wafer, effective position site indicate probe card
The number in the channel being connect in automatic test with tube core.
The present embodiment in order to better understand, separately below as exemplary Jie by taking single-path testing and two-way test as an example
It continues.
If Fig. 8 shows single-path testing schematic diagram according to an embodiment of the present invention, Fig. 8 middle probe card includes site1.It is testing
The location information of tube core to be measured is stored in external data base or internal storage in the form of table 1 when first wafer to be measured
In, directly the test result data of corresponding tube core coordinate is filled into the table in subsequent wafer test to be measured.
Table 1
Fig. 9 shows multi-channel test schematic diagram according to an embodiment of the present invention, as shown in figure 9, probe card include site1 and
Site2, probe card carry out acupuncture treatment test according to step-by-step system shown in Fig. 9 arrow in automatic test course.
Tube core group coordinate and effective position site are stored in external number in the form of table 2 when testing first wafer to be measured
According in library or internal storage.Wherein, tube core group coordinate is, for example, site1 corresponding coordinate when having an acupuncture treatment test.It is surveyed in acupuncture treatment
It may include two tube cores to be measured, such as tube core to be measured (3,0) and tube core to be measured (3,1) during examination in a tube core group；?
A tube core to be measured, such as tube core to be measured (2,1) may be only included, it is therefore desirable to sit according to tube core group in wafer test to be measured
Mark and effective site location resolution obtain the coordinate of tube core to be measured, and the test result of corresponding tube core coordinate are filled into described
In table.
Table 2
A kind of data item that the test result data of illustrative tube core is following comprising multirow:
Record number, tube core coordinate (X1, Y1), tube core BIN, test item 1_ data, test item 2_ data ...
Test item N_ data.
Wherein, record number is unique identification, and tube core coordinate (X, Y) indicates tube core in the position of array, tube core BIN table
Whether normal show.The test result data can be stored with document form.
As it can be seen that automatic test machine is corresponded according to the location information and test result data that prestore, can obtain
The test result of each tube core, i.e. staff judge whether each tube core is normal according to the test result of each tube core, into
And abnormal tube core can be removed.
It is noted that the tube core group coordinate and tube core coordinate of multi-channel test can convert in the embodiment of the present invention.
For example, two tube cores point for being located at array same row are carried out multi-channel test in a tube core group, then tube core group
Coordinate and tube core coordinate are referring to table 3.
Table 3
In addition, the maximum site number of relationship and probe card in table 3 between y1, y2, y3 and y4 of tube core group coordinate and
The step-by-step system of probe card is related, such as in two-way test shown in Fig. 9, probe card is had an acupuncture treatment in a manner of interlacing stepping
Test, therefore the relationship between y1, y2, y3 and y4 are as follows: y2=y1+2, y3=y2+2, y4=y3+2.
Fig. 8 shows the schematic diagram for the wafer tester being deployed on automatic test machine.The automatic test machine is for surveying
Try multiple wafers to be measured.Test device 800 includes memory module 801, and signal provides module 801, data reception module 802, number
According to parsing module 803 and memory module 804.For convenience of understanding, a probe card 401 is also shown on figure.
Signal provides multiple tube cores of the module 801 for being supplied to pumping signal by probe card 401 on wafer to be measured
Group, to drive multiple tube core groups to be tested, each tube core group includes at least one tube core.
Data reception module 802 is used to obtain test result data from multiple tube core groups by probe card 401.
Memory module 804 is used to store the location information of multiple tube core groups on the wafer to be measured.
Data resolution module 803 is used to obtain the tube core coordinate of each tube core according to the location information of the tube core group, and
It is associated with the tube core coordinate of each tube core to obtain the test result data of each tube core with the test result data of tube core group.
It can be seen that passing through when testing multiple wafers to be measured according to embodiments of the present invention when testing first wafer to be measured
The location information of the tube core group of wafer to be measured is obtained and stores, each tube core group includes at least one tube core.Then subsequent
It parses to obtain each tube core according to the test result data of the location information prestored and tube core group in wafer testing procedure to be measured
Test result data reduces the number interactively communicated between automatic test machine and probe station in automation acupuncture treatment test process,
Testing time and testing cost are saved, testing efficiency is improved.
Although the embodiment of the present invention is disclosed as above with preferred embodiment, its be not for limiting claim, it is any
Those skilled in the art without departing from the spirit and scope of the present invention, can make possible variation and modification, therefore this
The protection scope of invention should be subject to the range that the claims in the present invention are defined.
The above description is only a preferred embodiment of the present invention, is not intended to restrict the invention, for those skilled in the art
For, the invention can have various changes and changes.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of crystal round test approach, for testing the wafer to be measured including multiple tube cores characterized by comprising
Tube core on the wafer to be measured is divided into multiple tube core groups, each tube core group includes at least one tube core；
Prestore the location information of each tube core group；
Pumping signal is provided to the multiple tube core group；
Obtain the test result data of the multiple tube core group；And
It is parsed to obtain the test of each tube core according to the location information of the tube core group and the test result data
Result data.
2. crystal round test approach according to claim 1, which is characterized in that the crystal round test approach is multiple for testing
The wafer to be measured, wherein the step of prestoring the location information of each tube core include:
Obtain and store the location information of each tube core group in the first wafer to be measured.
3. crystal round test approach according to claim 1, wherein the location information include: tube core group coordinate and effectively
The position site.
4. crystal round test approach according to claim 3, wherein according to the location information of the tube core group and described
The test result data that test result data parses to obtain each tube core includes:
The tube core coordinate of each tube core is obtained according to the tube core group coordinate and effective site location resolution, and by the pipe
Core coordinate is associated with the test result data of the tube core group to obtain the test result data of the tube core.
5. crystal round test approach according to claim 4, wherein the test result data includes: tube core coordinate, tube core
No. BIN and project data.
6. a kind of wafer tester, is deployed on automatic test machine, special for testing the wafer to be measured including multiple tube cores
Sign is, comprising:
Memory module, stores the location information of each tube core group on the wafer to be measured, and each tube core group includes at least
One tube core；
Signal provides module, for providing pumping signal to the multiple tube core group；
Data reception module, for obtaining the test result data of the multiple tube core group；And
Data resolution module parses to obtain each institute according to the location information of the tube core group and the test result data
State the test result data of tube core.
7. wafer tester according to claim 6, which is characterized in that the wafer tester is multiple for testing
The wafer to be measured,
Wherein, the data reception module is also used to obtain the position of each tube core group in the first wafer to be measured
Information, and it is provided to the memory module.
8. wafer tester according to claim 6, wherein the location information include: tube core group coordinate and effectively
The position site.
9. wafer tester according to claim 8, wherein the data resolution module is according to the tube core group coordinate
The tube core coordinate of each tube core is obtained with effective site location resolution, and by the survey of the tube core coordinate and the tube core group
Test result data correlation is to obtain the test result data of the tube core.
10. a kind of wafer test system, comprising: multiple probe cards that automatic test machine is connected with the automatic test machine and
The wafer to be measured connected with the probe card,
The automatic test machine includes wafer tester as claim in any one of claims 6-9.
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| CN112666448A (en) * | 2020-12-18 | 2021-04-16 | 江苏艾科半导体有限公司 | DELP series probe station driving configuration method in chip CP test |
| CN114758962A (en) * | 2022-04-06 | 2022-07-15 | 北京燕东微电子科技有限公司 | Method for manufacturing chip |
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Application publication date: 20190607 |
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