CN108430165B

CN108430165B - PCB etching detection method

Info

Publication number: CN108430165B
Application number: CN201810153175.4A
Authority: CN
Inventors: 谢添华; 徐娟; 江武骏
Original assignee: Tianjin Sen Quick Circuit Technology Co Ltd; Shenzhen Fastprint Circuit Tech Co Ltd
Current assignee: Tianjin Sen Quick Circuit Technology Co Ltd; Shenzhen Fastprint Circuit Tech Co Ltd
Priority date: 2018-02-08
Filing date: 2018-02-08
Publication date: 2019-12-20
Anticipated expiration: 2038-02-08
Also published as: CN108430165A

Abstract

The invention discloses a PCB etching detection method, which comprises the following steps: sticking a protective film on the surface of the substrate; a plurality of through holes are formed in the protective film; etching one side of the substrate close to the protective film; and recording the etched depth of the side surface of the substrate close to the protective film. According to the PCB etching detection method, the protective film is attached to the surface of the substrate, the through holes are formed in the protective film, when the side face, close to the protective film, of the substrate is etched, the protective film can protect the substrate from being etched, meanwhile, the substrate is etched at the position, corresponding to the through holes, of the substrate, due to the fact that the through holes are multiple, multiple positions on the substrate can be etched, at the moment, the depth of each etched position can be recorded, and whether the substrate can be uniformly etched through the etching treatment can be known through comparing the depths of the etched positions. The PCB etching detection method can visually know the uniformity of etching treatment, and has a good detection effect.

Description

PCB etching detection method

Technical Field

The invention relates to the technical field of PCB (printed circuit board) testing, in particular to a PCB etching detection method.

Background

With the rapid development of electronic products towards miniaturization, high density, high integration and multiple functions, the requirements on printed wiring boards are higher and higher, and the manufacturing process of the PCB is more refined.

In the manufacturing process of the PCB, the PCB needs to be etched, and whether the etching equipment can uniformly etch the PCB or not can affect the performance of the PCB.

Disclosure of Invention

Based on this, the invention provides a PCB etching detection method with good detection effect to overcome the defects of the prior art.

The technical scheme is as follows:

a PCB etching detection method comprises the following steps:

sticking a protective film on the surface of the substrate;

a plurality of through holes are formed in the protective film;

etching one side of the substrate close to the protective film;

and recording the etched depth of the side surface of the substrate close to the protective film.

According to the PCB etching detection method, the protective film is attached to the surface of the substrate, the through holes are formed in the protective film, when the side face, close to the protective film, of the substrate is etched, the protective film can protect the substrate from being etched, meanwhile, the substrate is etched at the position, corresponding to the through holes, of the substrate, due to the fact that the through holes are multiple, multiple positions on the substrate can be etched, at the moment, the depth of each etched position can be recorded, and whether the substrate can be uniformly etched through the etching treatment can be known through comparing the depths of the etched positions. The PCB etching detection method can visually know the uniformity of etching treatment, and has a good detection effect.

Further, the through holes are arranged in an array.

Further, the etching treatment of the substrate on the side close to the protective film specifically includes the following steps:

and placing the substrate into a cavity of plasma etching equipment, and carrying out plasma etching treatment on one side of the substrate close to the protective film.

Further, the substrate is arranged in the cavity of the plasma etching equipment along the horizontal direction or the vertical direction.

Further, the substrate is matched with a cavity of the plasma etching equipment.

Further, the substrate includes a resin layer and a support layer, the protective film is disposed on a side of the resin layer away from the support layer, and the plasma etching is performed on a side of the substrate close to the protective film, and the method further includes the following steps:

and controlling the plasma etching time to enable all the processing holes etched on the resin layer to be blind holes.

Further, before recording the etched depth on the side surface of the substrate close to the protective film, the method further comprises the following steps:

and removing the protective film.

Further, the above recording the etched depth on the side of the substrate close to the protective film further comprises the following steps:

generating a profile of the etched depth at each location on the substrate.

Further, the through holes are uniformly arranged at intervals.

Further, the size of protection film with the size of substrate matches, the corner of protection film all is equipped with the through-hole.

Drawings

FIG. 1 is a schematic diagram illustrating a PCB etching detection method according to an embodiment of the present invention;

FIG. 2 is a schematic flow chart illustrating a PCB etching detection method according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a protective film according to an embodiment of the invention.

Description of reference numerals:

100. the manufacturing method comprises the following steps of a substrate, 110, a resin layer, 111, machining holes, 120, a supporting layer, 200, a protective film, 210 and through holes.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It should be noted that the terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In one embodiment, as shown in fig. 1 and 2, the method for detecting the etching of the PCB includes the following steps:

attaching a protective film 200 to the surface of the substrate 100;

forming a plurality of through holes 210 in the protective film 200;

etching the substrate 100 on the side close to the protective film 200;

the depth to which the side of the substrate 100 adjacent to the protective film 200 is etched is recorded.

The PCB etching detection method, through pasting the protective film 200 on the surface of the base plate 100, and set up the via hole 210 on the protective film 200, when etching the side close to the protective film 200 of the base plate 100, the protective film 200 can protect the base plate 100 from being etched, at the same time, on the base plate 100 with the location corresponding to the via hole 210, the base plate 100 is etched, because there are a plurality of via holes 210, will result in the base plate 100 to be etched many places, can record the depth of each etched place at this moment, and through comparing the depth of each etched place, know whether the etching treatment can carry on the homogeneous etching to the base plate 100. The PCB etching detection method can visually know the uniformity of etching treatment, and has good detection effect.

Specifically, a plurality of through holes 210 are opened in the protective film 200 through a windowing process.

Alternatively, the protective film 200 may be attached to both sides of the substrate 100 and holes may be formed according to an etching apparatus or process. For detecting the uniformity of etching.

Optionally, the protective film 200 is a photosensitive dry film.

Specifically, the forming of the plurality of through holes 210 in the protective film 200 specifically includes the following steps:

the protective film 200 is sequentially subjected to exposure and development processes, so that a plurality of through holes 210 are formed in the protective film 200.

Optionally, the through hole 210 is a circular hole, and the aperture of the through hole 210 is 50 μm to 1000 μm. The detection effect is better at this moment.

Further, as shown in fig. 3, the through holes 210 are arranged in an array. When the etching process is performed on the substrate 100, the etched portions of the substrate 100 are also arranged in an array, so that the uniformity of the etching process at different positions of the substrate 100 can be better understood.

Further, the etching process performed on the substrate 100 near the protective film 200 specifically includes the following steps:

the substrate 100 is placed in a chamber of a plasma etching apparatus, and a plasma etching process is performed on a side of the substrate 100 close to the protective film 200.

In this embodiment, by placing the substrate 100 into the cavity of the plasma etching apparatus and performing the plasma etching, it can be known whether the plasma etching apparatus can perform uniform etching on all parts of the substrate 100 during the etching process, so as to evaluate the etching effect of the plasma etching apparatus.

Optionally, the plasma etching apparatus has a plurality of cavities for plasma etching, and at least two substrates 100 may be disposed, and the protective film 200 and the through hole 210 are respectively attached to the substrates for detecting different cavities in the plasma etching apparatus.

Further, the substrate 100 is disposed in a horizontal direction or a vertical direction within the chamber of the plasma etching apparatus. In this case, it is ensured that the test conditions are the same at various places on the substrate 100, so that the disturbance conditions are eliminated and the etching effect is better evaluated.

Further, the substrate 100 is matched with a chamber of a plasma etching apparatus. At this time, the substrate 100 can perform comprehensive detection on the etching effect in the cavity of the plasma etching apparatus, and the detection effect is better.

Further, as shown in fig. 1, the substrate 100 includes a resin layer 110 and a support layer 120, the protection film 200 is disposed on a side of the resin layer 110 away from the support layer 120, and the plasma etching is performed on a side of the substrate 100 close to the protection film 200, which further includes the following steps:

the plasma etching time is controlled so that all the processing holes 111 etched in the resin layer 110 are blind holes.

If the etched processing holes 111 on the resin layer 110 are through holes 210, the actual depth of the etched processing holes 111 cannot be known, and it cannot be evaluated whether the etched depths of the substrate 100 are uniformly distributed, so that it is ensured that the etched processing holes 111 on the resin layer 110 are all blind holes, the etching effect can be evaluated conveniently, and the detection effect is better.

Alternatively, the resin layer 110 may be an FR-4 resin board.

Alternatively, the support layer 120 may be a copper layer, and based on the support of the resin layer 110 on both sides of the support layer 120, a scene of the circuit board when being etched may be simulated. In addition, other materials, such as non-metallic materials, may be selected for the support layer 120.

Specifically, the substrate 100 is etched to the depth of the processing hole 111, and a height difference between the bottom of the processing hole 111 and the side of the resin layer 110 away from the support layer 120 may be measured using a 3D measuring instrument.

Further, as shown in fig. 1, before the etching depth on the side surface of the recording substrate 100 close to the protective film 200, the method further includes the following steps:

the protective film 200 is removed.

The protection layer 200 is also etched, so that the removal of the protection layer 200 facilitates the measurement of the etched depth on the substrate 100, thereby improving the detection efficiency.

Further, the above-mentioned etching depth of the side surface of the recording substrate 100 close to the protective film 200 further includes the following steps:

a profile of the depth etched across the substrate 100 is generated.

The effectiveness of the etching process can be evaluated by a profile and the process or settings of the etching process can be adjusted accordingly by the profile.

Further, the through holes 210 are uniformly spaced. In this case, after the etching process is performed on the substrate 100, the etched portions are uniformly distributed on the substrate 100, so that the etching uniformity can be better detected.

Further, the size of the protection film 200 matches the size of the substrate 100, and the through holes 210 are formed at the corners of the protection film 200. At this time, the etching process can be performed on the corners of the substrate 100, so that the etching uniformity can be comprehensively known, and the detection effect is better.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A PCB etching detection method is characterized by comprising the following steps:

sticking a protective film on the surface of the substrate, wherein the protective film is a photosensitive dry film;

sequentially carrying out exposure and development treatment on the protective film to form a plurality of through holes on the protective film;

the substrate comprises a resin layer and a supporting layer, the protective film is arranged on one side of the resin layer, which is far away from the supporting layer, etching treatment is carried out on one side of the substrate, which is close to the protective film, and all the processing holes etched in the resin layer are blind holes;

2. The PCB etching detection method of claim 1, wherein the through holes are arranged in an array.

3. The method for detecting etching of the PCB according to claim 1, wherein the etching process for the side of the substrate close to the protective film comprises the following steps:

4. The PCB etching detection method of claim 3, wherein the substrate is arranged in the cavity of the plasma etching equipment along a horizontal direction or a vertical direction.

5. The PCB etching detection method of claim 4, wherein the substrate is matched with a cavity of the plasma etching equipment.

6. The method for detecting etching of PCB board according to claim 3, wherein the plasma etching is performed on the side of the substrate close to the protection film, further comprising the following steps:

7. The PCB etching detection method of any one of claims 1 to 6, wherein before recording the etched depth on the side surface of the substrate close to the protective film, the method further comprises the following steps:

and removing the protective film.

8. The PCB etching detection method of any one of claims 1 to 6, wherein the recording of the etched depth on the side of the substrate close to the protective film further comprises the following steps:

generating a profile of the etched depth at each location on the substrate.

9. The PCB etching detection method of any one of claims 1 to 6, wherein the through holes are uniformly spaced.

10. The PCB etching detection method of any one of claims 1 to 6, wherein the size of the protective film is matched with that of the substrate, and the corners of the protective film are provided with the through holes.