ATE421716T1 - Oberflächen-triangulation und -profilierung - Google Patents

Oberflächen-triangulation und -profilierung

Info

Publication number
ATE421716T1
ATE421716T1 AT04784044T AT04784044T ATE421716T1 AT E421716 T1 ATE421716 T1 AT E421716T1 AT 04784044 T AT04784044 T AT 04784044T AT 04784044 T AT04784044 T AT 04784044T AT E421716 T1 ATE421716 T1 AT E421716T1
Authority
AT
Austria
Prior art keywords
low coherence
coherence interference
interference signal
interfaces
determination
Prior art date
Application number
AT04784044T
Other languages
English (en)
Inventor
Lega Xavier De
Groot Peter De
Michael Kuchel
Original Assignee
Zygo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zygo Corp filed Critical Zygo Corp
Application granted granted Critical
Publication of ATE421716T1 publication Critical patent/ATE421716T1/de

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02015Interferometers characterised by the beam path configuration
    • G01B9/02017Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02019Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different points on same face of object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02015Interferometers characterised by the beam path configuration
    • G01B9/02022Interferometers characterised by the beam path configuration contacting one object by grazing incidence
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02083Interferometers characterised by particular signal processing and presentation
    • G01B9/02084Processing in the Fourier or frequency domain when not imaged in the frequency domain
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02083Interferometers characterised by particular signal processing and presentation
    • G01B9/02087Combining two or more images of the same region
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/0209Low-coherence interferometers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70608Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70641Focus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049Technique, e.g. interferometric
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/30Grating as beam-splitter
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/70Using polarization in the interferometer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Mathematical Physics (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Transplanting Machines (AREA)
AT04784044T 2003-09-15 2004-09-15 Oberflächen-triangulation und -profilierung ATE421716T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US50293203P 2003-09-15 2003-09-15
US50293303P 2003-09-15 2003-09-15
US50290703P 2003-09-15 2003-09-15
US50293003P 2003-09-15 2003-09-15
US53943704P 2004-01-26 2004-01-26

Publications (1)

Publication Number Publication Date
ATE421716T1 true ATE421716T1 (de) 2009-02-15

Family

ID=34382261

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04784044T ATE421716T1 (de) 2003-09-15 2004-09-15 Oberflächen-triangulation und -profilierung

Country Status (8)

Country Link
US (7) US7289224B2 (de)
EP (3) EP1664931B1 (de)
JP (3) JP5340539B2 (de)
KR (3) KR101185473B1 (de)
AT (1) ATE421716T1 (de)
DE (1) DE602004019231D1 (de)
TW (4) TWI334921B (de)
WO (2) WO2005029192A2 (de)

Families Citing this family (140)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6359144A (ja) * 1986-08-29 1988-03-15 Canon Inc ロ−カルエリアネツトワ−クの回線監視方式
US7057741B1 (en) * 1999-06-18 2006-06-06 Kla-Tencor Corporation Reduced coherence symmetric grazing incidence differential interferometer
WO2003038518A1 (en) 2001-10-30 2003-05-08 Pixelligent Technologies Llc Advanced exposure techniques for programmable lithography
US7869057B2 (en) * 2002-09-09 2011-01-11 Zygo Corporation Multiple-angle multiple-wavelength interferometer using high-NA imaging and spectral analysis
US7139081B2 (en) * 2002-09-09 2006-11-21 Zygo Corporation Interferometry method for ellipsometry, reflectometry, and scatterometry measurements, including characterization of thin film structures
US6623995B1 (en) * 2002-10-30 2003-09-23 Taiwan Semiconductor Manufacturing Company Optimized monitor method for a metal patterning process
US7271918B2 (en) * 2003-03-06 2007-09-18 Zygo Corporation Profiling complex surface structures using scanning interferometry
US7324214B2 (en) 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US7106454B2 (en) 2003-03-06 2006-09-12 Zygo Corporation Profiling complex surface structures using scanning interferometry
US7289224B2 (en) 2003-09-15 2007-10-30 Zygo Corporation Low coherence grazing incidence interferometry for profiling and tilt sensing
EP1526408A1 (de) * 2003-10-22 2005-04-27 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung, und eine Messeinrichtung
TWI335417B (en) 2003-10-27 2011-01-01 Zygo Corp Method and apparatus for thin film measurement
US7930206B2 (en) 2003-11-03 2011-04-19 Google Inc. System and method for enabling an advertisement to follow the user to additional web pages
GB0415766D0 (en) * 2004-07-14 2004-08-18 Taylor Hobson Ltd Apparatus for and a method of determining a characteristic of a layer or layers
US20060012582A1 (en) * 2004-07-15 2006-01-19 De Lega Xavier C Transparent film measurements
EP1779123A4 (de) * 2004-08-05 2007-11-21 Jack R Little Jr Hochauflösende zerstörungsfreie abbildung dielektrischer materialien
US7170584B2 (en) * 2004-11-17 2007-01-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102004062256A1 (de) * 2004-12-23 2006-07-13 Basf Ag Hochempfindliches Verfahren zur Detektion von Unterschieden zwischen den physikalisch messbaren Eigenschaften einer Probe und einer Referenz
WO2006078718A1 (en) * 2005-01-20 2006-07-27 Zygo Corporation Interferometer for determining characteristics of an object surface
US7884947B2 (en) 2005-01-20 2011-02-08 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
DE112006000392T5 (de) * 2005-02-18 2008-01-10 Hoya Corp. Prüfverfahren für lichtdurchlässigen Gegenstand
FR2883369B1 (fr) * 2005-03-18 2007-06-01 Sagem Dispositif de mesure optique par triangulation optique
JP4885212B2 (ja) * 2005-05-19 2012-02-29 ザイゴ コーポレーション 薄膜構造についての情報に関する低コヒーレンス干渉計信号を解析するための方法およびシステム
US7330258B2 (en) * 2005-05-27 2008-02-12 Innovative Technical Solutions, Inc. Spectrometer designs
US7411667B2 (en) * 2005-06-03 2008-08-12 Asml Netherlands B.V. Method for correcting disturbances in a level sensor light path
US7595891B2 (en) * 2005-07-09 2009-09-29 Kla-Tencor Corporation Measurement of the top surface of an object with/without transparent thin films in white light interferometry
US20070042510A1 (en) * 2005-08-19 2007-02-22 Wafermasters, Incorporated In situ process monitoring and control
JP2007067165A (ja) * 2005-08-31 2007-03-15 Matsushita Electric Ind Co Ltd 光照射条件抽出方法および光照射条件抽出装置およびはんだ付け装置
DE102006016131A1 (de) * 2005-09-22 2007-03-29 Robert Bosch Gmbh Interferometrische Messvorrichtung
US20090296099A1 (en) * 2005-09-22 2009-12-03 Kurt Burger Interferometric Layer Thickness Determination
US20070118361A1 (en) * 2005-10-07 2007-05-24 Deepen Sinha Window apparatus and method
WO2007044786A2 (en) * 2005-10-11 2007-04-19 Zygo Corporation Interferometry method and system including spectral decomposition
US7492450B2 (en) * 2005-10-24 2009-02-17 General Electric Company Methods and apparatus for inspecting an object
US7408649B2 (en) * 2005-10-26 2008-08-05 Kla-Tencor Technologies Corporation Method and apparatus for optically analyzing a surface
KR101321861B1 (ko) * 2005-11-15 2013-10-25 지고 코포레이션 광학적으로 분석되지 않은 표면 형상의 특징을 측정하는방법 및 간섭계
DE102005056914A1 (de) 2005-11-29 2007-05-31 Carl Zeiss Smt Ag Projektionsbelichtungsystem
EP1793243A1 (de) * 2005-12-05 2007-06-06 Leica Geosystems AG Verfahren zur Auflösung einer Phasenmehrdeutigkeit
US7542148B2 (en) * 2005-12-06 2009-06-02 Tokyo Electron Limited Method for measuring physical quantity of measurement object in substrate processing apparatus and storage medium storing program for implementing the method
US7697137B2 (en) * 2006-04-28 2010-04-13 Corning Incorporated Monolithic Offner spectrometer
WO2008011510A2 (en) * 2006-07-21 2008-01-24 Zygo Corporation Compensation of systematic effects in low coherence interferometry
JP5011302B2 (ja) * 2006-09-19 2012-08-29 オリンパスメディカルシステムズ株式会社 偏光測定装置
WO2008055060A2 (en) * 2006-10-27 2008-05-08 Zygo Corporation Vibration resistant interferometry
WO2008133650A2 (en) * 2006-11-07 2008-11-06 Rudolph Technologies, Inc. Method and system for providing a high definition triangulation system
CN1975386B (zh) * 2006-11-16 2010-10-13 南京大学 红外光谱仪的多次透射-反射测量附件
US7704565B2 (en) * 2006-11-22 2010-04-27 The Boeing Company Method of making a layered component with vector discrimination in a variable deposition rate process
WO2008064470A1 (en) * 2006-11-27 2008-06-05 Roctest Ltée High selectivity band-pass interferometer with tuning capabilities
JP5137526B2 (ja) * 2006-12-22 2013-02-06 キヤノン株式会社 形状測定装置、形状測定方法、および露光装置
US7684050B2 (en) * 2006-12-22 2010-03-23 Canon Kabushiki Kaisha Shape measuring apparatus, shape measuring method, and exposure apparatus
EP2097713A4 (de) * 2006-12-22 2010-09-15 Zygo Corp Vorrichtung und verfahren zur messung von oberflächeneigenschaften
US7889355B2 (en) 2007-01-31 2011-02-15 Zygo Corporation Interferometry for lateral metrology
JP5013968B2 (ja) * 2007-02-21 2012-08-29 キヤノン株式会社 信号処理装置、プログラムおよび計測装置
WO2008151266A2 (en) * 2007-06-05 2008-12-11 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
JP2008309638A (ja) * 2007-06-14 2008-12-25 National Institute Of Advanced Industrial & Technology 寸法測定装置及び寸法測定方法
JP4936287B2 (ja) * 2007-06-14 2012-05-23 独立行政法人産業技術総合研究所 内径測定装置
US7619746B2 (en) * 2007-07-19 2009-11-17 Zygo Corporation Generating model signals for interferometry
US8072611B2 (en) 2007-10-12 2011-12-06 Zygo Corporation Interferometric analysis of under-resolved features
US7961647B2 (en) * 2007-11-13 2011-06-14 Avaya Inc. Detecting interfering packet streams in packet networks
US7720004B2 (en) * 2007-11-13 2010-05-18 Avaya Inc. Interfering packet streams in packet networks
KR101274517B1 (ko) * 2007-11-13 2013-06-13 지고 코포레이션 편광 스캐닝을 이용한 간섭계
US7720005B2 (en) * 2007-11-13 2010-05-18 Avaya Inc. Estimating network-layer topology using end-to-end measurements
US8126677B2 (en) 2007-12-14 2012-02-28 Zygo Corporation Analyzing surface structure using scanning interferometry
TWI454655B (zh) * 2007-12-31 2014-10-01 Ind Tech Res Inst 光譜影像處理方法
KR100988454B1 (ko) 2008-01-31 2010-10-18 에스엔유 프리시젼 주식회사 두께 측정방법
TWI485642B (zh) * 2008-02-26 2015-05-21 Epistar Corp 光電元件之客製化製造方法
JP5084558B2 (ja) * 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
US7847954B2 (en) * 2008-05-15 2010-12-07 Kla-Tencor Corporation Measuring the shape and thickness variation of a wafer with high slopes
JP5268425B2 (ja) * 2008-05-16 2013-08-21 キヤノン株式会社 表面形状測定装置及び露光装置
KR101010189B1 (ko) * 2008-06-30 2011-01-21 에스엔유 프리시젼 주식회사 두께 또는 표면형상 측정방법
US8120781B2 (en) 2008-11-26 2012-02-21 Zygo Corporation Interferometric systems and methods featuring spectral analysis of unevenly sampled data
US8654344B2 (en) * 2008-12-04 2014-02-18 Ecole Polytechnique Device for generating a secondary source by laser-material interaction comprising an optical device for controlling the orientation and the position of a surface in movement
US8107084B2 (en) 2009-01-30 2012-01-31 Zygo Corporation Interference microscope with scan motion detection using fringe motion in monitor patterns
FR2941780B1 (fr) * 2009-01-30 2011-04-01 Commissariat Energie Atomique Procede de mesure et procede de visualisation d'une surface d'onde par spectrophotometrie.
US20100245829A1 (en) * 2009-03-31 2010-09-30 Nikon Corporation System and method for compensating instability in an autofocus system
US8675205B2 (en) * 2009-06-15 2014-03-18 Artur G. Olszak Optical coherence tomography using spectrally controlled interferometry
JP2011040547A (ja) * 2009-08-10 2011-02-24 Canon Inc 計測装置、露光装置及びデバイスの製造方法
US8426119B2 (en) * 2009-10-21 2013-04-23 GM Global Technology Operations LLC Dynamic projection method for micro-truss foam fabrication
WO2011089010A1 (de) * 2010-01-22 2011-07-28 Universität Stuttgart Verfahren und anordnung zur robusten interferometrie
US20120008150A1 (en) 2010-04-23 2012-01-12 Nikon Corporation Autofocus system and method
US8462349B1 (en) * 2010-07-20 2013-06-11 Science Applications International Corporation System and method for a self-referencing interferometer
JP5663758B2 (ja) * 2010-08-17 2015-02-04 株式会社ミツトヨ 形状測定方法及び形状測定装置
WO2012024509A1 (en) * 2010-08-20 2012-02-23 First Solar, Inc. Position-sensitive metrology system
US8854628B2 (en) * 2010-09-22 2014-10-07 Zygo Corporation Interferometric methods for metrology of surfaces, films and underresolved structures
DE102010041556A1 (de) 2010-09-28 2012-03-29 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Mikrolithographie und Verfahren zur mikrolithographischen Abbildung
DE102010041558A1 (de) * 2010-09-28 2012-03-29 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Mikrolithographie sowie Verfahren zur mikrolithographischen Belichtung
JP5699221B2 (ja) * 2010-11-15 2015-04-08 ザイゴ コーポレーションZygo Corporation 仮想参照面を備えた干渉計
TWI479160B (zh) * 2010-12-20 2015-04-01 Hon Hai Prec Ind Co Ltd 測試裝置及方法
EP2482031A1 (de) * 2011-01-26 2012-08-01 Mitutoyo Research Center Europe B.V. Verfahren und Vorrichtung zur Durchführung von Foliendickenmessungen mit Weißlichtabtastinterferometrie
US8804129B2 (en) 2011-01-26 2014-08-12 Mitutoyo Corporation Method and apparatus for performing film thickness measurements using white light scanning interferometry
DE102011111900A1 (de) * 2011-08-30 2013-02-28 Dr. Johannes Heidenhain Gmbh Vorrichtung zur interferometrischen Abstandsbestimmung
NL2009273A (en) * 2011-08-31 2013-03-04 Asml Netherlands Bv Level sensor arrangement for lithographic apparatus, lithographic apparatus and device manufacturing method.
JP5959104B2 (ja) * 2011-09-27 2016-08-02 芝浦メカトロニクス株式会社 貼り合せ板状体検査装置及び方法
US8982362B2 (en) * 2011-10-04 2015-03-17 First Solar, Inc. System and method for measuring layer thickness and depositing semiconductor layers
DE102011085599B3 (de) * 2011-11-02 2012-12-13 Polytec Gmbh Vorrichtung und Verfahren zur interferometrischen Vermessung eines Objekts
DE102012002174B4 (de) * 2012-02-07 2014-05-15 Schott Ag Vorrichtung und Verfahren zum Erkennen von Fehlstellen innerhalb des Volumens einer transparenten Scheibe und Verwendung der Vorrichtung
US10112258B2 (en) * 2012-03-30 2018-10-30 View, Inc. Coaxial distance measurement via folding of triangulation sensor optics path
DE102013203211A1 (de) * 2012-06-15 2013-12-19 Dr. Johannes Heidenhain Gmbh Vorrichtung zur interferentiellen Abstandsmessung
EP2677271B1 (de) * 2012-06-18 2017-04-26 Mitutoyo Corporation Breitband Interferometer zur Bestimmung einer Eigenschaft einer Dünnschicht
GB2508874B (en) * 2012-12-13 2017-09-20 Univ Of Huddersfield Interferometric apparatus and sample characteristic determining apparatus using such apparatus
US10054423B2 (en) * 2012-12-27 2018-08-21 Nova Measuring Instruments Ltd. Optical method and system for critical dimensions and thickness characterization
RU2522775C1 (ru) * 2013-02-12 2014-07-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Новосибирский национальный исследовательский государственный университет" (Новосибирский государственный университет, НГУ) Способ пассивной локализации ребер прямоугольного металлического параллелепипеда в инфракрасном излучении
US20160004058A1 (en) * 2013-03-15 2016-01-07 Leonard Rodenhausen Wayne Lightsheet microscopy with rotational-shear interferometry
WO2014204538A2 (en) * 2013-03-15 2014-12-24 Dueck Robert Three-beam coherent beam combining system
WO2014209987A1 (en) * 2013-06-26 2014-12-31 Zygo Corporation Coherence scanning interferometry using phase shifted interferometrty signals
US9377292B2 (en) 2013-08-06 2016-06-28 Zygo Corporation Interferometry employing refractive index dispersion broadening of interference signals
DE102014211004A1 (de) * 2014-06-10 2015-12-17 Dr. Johannes Heidenhain Gmbh Optische Positionsmesseinrichtung
JP6322069B2 (ja) * 2014-07-02 2018-05-09 Dmg森精機株式会社 変位検出装置
US9500468B2 (en) 2014-08-25 2016-11-22 Board Of Trustees Of Michigan State University Scanning interferometry technique for through-thickness evaluation in multi-layered transparent structures
CN107111870B (zh) 2014-10-27 2021-08-06 科磊股份有限公司 对计量目标成像的质量估计及改进
WO2016094851A1 (en) * 2014-12-12 2016-06-16 Sunedison Semiconductor Limited Systems and methods for performing phase shift interferometry while a wafer is vibrating
NL2016121A (en) * 2015-02-06 2016-09-29 Asml Netherlands Bv A method and apparatus for improving measurement accuracy
EP3262376B1 (de) * 2015-02-25 2024-01-10 The Charles Stark Draper Laboratory, Inc. Phasengesteuertes feld mit nullunterschied des optischen wegs
JP6702666B2 (ja) * 2015-07-28 2020-06-03 株式会社ミツトヨ 変位検出装置
TWI582382B (zh) * 2015-10-16 2017-05-11 高準精密工業股份有限公司 光學裝置
WO2017081541A1 (en) * 2015-11-11 2017-05-18 Scopio Lab Ltd. Microscope having a refractive index matching material
DE102016103605A1 (de) * 2016-03-01 2017-09-07 Heidelberg Engineering Gmbh Verfahren für die Signalverarbeitung bei der optischen Kohärenztomografie mit einer durchstimmbaren Lichtquelle
US10563973B2 (en) * 2016-03-28 2020-02-18 Kla-Tencor Corporation All surface film metrology system
WO2017183017A1 (en) * 2016-04-21 2017-10-26 Nova Measuring Instruments Ltd. Optical system and method for measurements of samples
US10234694B2 (en) 2016-07-15 2019-03-19 Canon U.S.A., Inc. Spectrally encoded probes
JP6762608B2 (ja) * 2016-09-06 2020-09-30 株式会社日立ハイテクサイエンス 走査型白色干渉顕微鏡を用いた三次元形状計測方法
US10571248B2 (en) * 2017-01-09 2020-02-25 Kla-Tencor Corporation Transparent film error correction pattern in wafer geometry system
JP6853572B2 (ja) * 2017-03-31 2021-03-31 株式会社日立ハイテクサイエンス 走査型白色干渉顕微鏡を用いた三次元形状計測方法
JP6876576B2 (ja) * 2017-08-17 2021-05-26 日本電子株式会社 三次元像構築方法
US11346747B2 (en) * 2017-10-27 2022-05-31 Harris Corporation QTIP—quantitative test interferometric plate
NL2020619B1 (en) 2018-01-16 2019-07-25 Illumina Inc Dual optical grating slide structured illumination imaging
US10529096B2 (en) * 2018-03-02 2020-01-07 Synaptive Medical (Barbados) Inc. System and method for characterizing tissue organization using polarization sensitive optical coherence tomography
JP7213876B2 (ja) * 2018-06-29 2023-01-27 株式会社荏原製作所 バンプ高さ測定装置、基板処理装置、バンプ高さ測定方法、記憶媒体
CN112368541B (zh) * 2018-07-18 2023-06-27 诺威有限公司 半导体器件的时域光学计量和检查
KR102680009B1 (ko) * 2018-09-07 2024-07-03 에스케이하이닉스 주식회사 반도체 패턴 계측 장치, 이를 이용한 반도체 패턴 계측 시스템 및 방법
TWI685640B (zh) * 2018-12-26 2020-02-21 財團法人工業技術研究院 光學同調斷層掃描裝置及其光學干涉儀
US10976151B2 (en) 2018-12-26 2021-04-13 Industrial Technology Research Institute Optical interferometer with reference arm longer than sample arm
TWI682150B (zh) * 2018-12-27 2020-01-11 財團法人工業技術研究院 自動校準光干涉裝置及光干涉裝置自動校準方法
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
JP7283324B2 (ja) * 2019-09-18 2023-05-30 株式会社島津製作所 欠陥検査装置
US11150195B2 (en) * 2019-09-25 2021-10-19 Onto Innovation Inc. Sample surface polarization modification in interferometric defect inspection
CN111356896B (zh) 2020-02-24 2021-01-12 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统和方法
WO2021168610A1 (en) * 2020-02-24 2021-09-02 Yangtze Memory Technologies Co., Ltd. Systems having light source with extended spectrum for semiconductor chip surface topography metrology
CN111406198B (zh) 2020-02-24 2021-02-19 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统和方法
CN111356897B (zh) 2020-02-24 2021-02-19 长江存储科技有限责任公司 用于半导体芯片表面形貌计量的系统和方法
CN113654653B (zh) * 2021-08-13 2023-06-09 中国工程物理研究院激光聚变研究中心 一种超快激光时空耦合特性的单次测量方法
CN116634254A (zh) * 2022-02-11 2023-08-22 深超光电(深圳)有限公司 成像系统及光学装置

Family Cites Families (181)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2612074A (en) 1949-03-30 1952-09-30 Prec Mecanique Paris Soc Interferometer
US4199219A (en) 1977-04-22 1980-04-22 Canon Kabushiki Kaisha Device for scanning an object with a light beam
US4188122A (en) 1978-03-27 1980-02-12 Rockwell International Corporation Interferometer
US4340306A (en) 1980-02-04 1982-07-20 Balasubramanian N Optical system for surface topography measurement
US4355903A (en) 1980-02-08 1982-10-26 Rca Corporation Thin film thickness monitor
DE3173451D1 (en) * 1981-09-17 1986-02-20 Ibm Deutschland Method for interferometric surface topography
DE3145633A1 (de) 1981-11-17 1983-08-11 Byk-Mallinckrodt Chemische Produkte Gmbh, 4230 Wesel Vorrichtung zur farbmessung
JPS58208610A (ja) * 1982-05-17 1983-12-05 ブリティッシュ・テクノロジー・グループ・リミテッド 物体の表面検査装置
US4523846A (en) 1982-09-10 1985-06-18 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Integrated optics in an electrically scanned imaging Fourier transform spectrometer
JPS59105508A (ja) * 1982-12-08 1984-06-18 Canon Inc 白色干渉膜厚測定方法
JPS60127403A (ja) * 1983-12-13 1985-07-08 Anritsu Corp 厚み測定装置
US4626103A (en) * 1984-03-29 1986-12-02 At&T Bell Laboratories Focus tracking system
US4618262A (en) * 1984-04-13 1986-10-21 Applied Materials, Inc. Laser interferometer system and method for monitoring and controlling IC processing
US4710642A (en) 1985-08-20 1987-12-01 Mcneil John R Optical scatterometer having improved sensitivity and bandwidth
US4639139A (en) 1985-09-27 1987-01-27 Wyko Corporation Optical profiler using improved phase shifting interferometry
US4818110A (en) 1986-05-06 1989-04-04 Kla Instruments Corporation Method and apparatus of using a two beam interference microscope for inspection of integrated circuits and the like
US4794550A (en) * 1986-10-15 1988-12-27 Eastman Kodak Company Extended-range moire contouring
JPS63263404A (ja) * 1987-04-21 1988-10-31 Nikon Corp 微細深さ測定方法及びその装置
US4806018A (en) 1987-07-06 1989-02-21 The Boeing Company Angular reflectance sensor
JPH0654217B2 (ja) * 1987-08-28 1994-07-20 株式会社日立製作所 干渉膜厚測定方法
US4869593A (en) 1988-04-22 1989-09-26 Zygo Corporation Interferometric surface profiler
US4923301A (en) 1988-05-26 1990-05-08 American Telephone And Telegraph Company Alignment of lithographic system
US4964726A (en) 1988-09-27 1990-10-23 General Electric Company Apparatus and method for optical dimension measurement using interference of scattered electromagnetic energy
US4948253A (en) 1988-10-28 1990-08-14 Zygo Corporation Interferometric surface profiler for spherical surfaces
GB8903725D0 (en) * 1989-02-18 1989-04-05 Cambridge Consultants Coherent tracking sensor
US5489986A (en) * 1989-02-28 1996-02-06 Nikon Corporation Position detecting apparatus
US5042949A (en) * 1989-03-17 1991-08-27 Greenberg Jeffrey S Optical profiler for films and substrates
US5042951A (en) * 1989-09-19 1991-08-27 Therma-Wave, Inc. High resolution ellipsometric apparatus
US4999014A (en) 1989-05-04 1991-03-12 Therma-Wave, Inc. Method and apparatus for measuring thickness of thin films
US5073018A (en) 1989-10-04 1991-12-17 The Board Of Trustees Of The Leland Stanford Junior University Correlation microscope
DE3942896A1 (de) 1989-12-23 1991-06-27 Zeiss Carl Fa Interferometrischer sensor zur messung von abstandsaenderungen einer kleinen flaeche
US5112129A (en) 1990-03-02 1992-05-12 Kla Instruments Corporation Method of image enhancement for the coherence probe microscope with applications to integrated circuit metrology
US5135307A (en) * 1990-05-30 1992-08-04 Hughes Danbury Optical System, Inc. Laser diode interferometer
US5158991A (en) 1990-08-24 1992-10-27 General Electric Company Epoxy-functionalized siloxane resin copolymers as controlled release additives
US5241369A (en) 1990-10-01 1993-08-31 Mcneil John R Two-dimensional optical scatterometer apparatus and process
US5129724A (en) 1991-01-29 1992-07-14 Wyko Corporation Apparatus and method for simultaneous measurement of film thickness and surface height variation for film-substrate sample
US5164790A (en) 1991-02-27 1992-11-17 Mcneil John R Simple CD measurement of periodic structures on photomasks
EP0502679B1 (de) * 1991-03-04 2001-03-07 AT&T Corp. Herstellungsverfahren von integrierten Halbleiterschaltungen unter Anwendung von latenten Bildern
DE4108944A1 (de) 1991-03-19 1992-09-24 Haeusler Gerd Verfahren und einrichtung zur beruehrungslosen erfassung der oberflaechengestalt von diffus streuenden objekten
US5153669A (en) 1991-03-27 1992-10-06 Hughes Danbury Optical Systems, Inc. Three wavelength optical measurement apparatus and method
US5194918A (en) 1991-05-14 1993-03-16 The Board Of Trustees Of The Leland Stanford Junior University Method of providing images of surfaces with a correlation microscope by transforming interference signals
US5173746A (en) * 1991-05-21 1992-12-22 Wyko Corporation Method for rapid, accurate measurement of step heights between dissimilar materials
US5133601A (en) 1991-06-12 1992-07-28 Wyko Corporation Rough surface profiler and method
US5204734A (en) 1991-06-12 1993-04-20 Wyko Corporation Rough surface profiler and method
JPH05304627A (ja) 1991-08-19 1993-11-16 Fuji Photo Film Co Ltd ビデオカメラのサイドグリップ
US5392749A (en) * 1991-10-11 1995-02-28 Caterpillar Inc. Hydraulically-actuated fuel injector system having separate internal actuating fluid and fuel passages
US5181080A (en) 1991-12-23 1993-01-19 Therma-Wave, Inc. Method and apparatus for evaluating the thickness of thin films
US5390023A (en) 1992-06-03 1995-02-14 Zygo Corporation Interferometric method and apparatus to measure surface topography
US5402234A (en) 1992-08-31 1995-03-28 Zygo Corporation Method and apparatus for the rapid acquisition of data in coherence scanning interferometry
US5539571A (en) * 1992-09-21 1996-07-23 Sdl, Inc. Differentially pumped optical amplifer and mopa device
US5384717A (en) 1992-11-23 1995-01-24 Ford Motor Company Non-contact method of obtaining dimensional information about an object
US5398113A (en) * 1993-02-08 1995-03-14 Zygo Corporation Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms
US5777742A (en) 1993-03-11 1998-07-07 Environmental Research Institute Of Michigan System and method for holographic imaging with discernible image of an object
DE4309056B4 (de) 1993-03-20 2006-05-24 Häusler, Gerd, Prof. Dr. Verfahren und Vorrichtung zur Ermittlung der Entfernung und Streuintensität von streuenden Punkten
US5386119A (en) 1993-03-25 1995-01-31 Hughes Aircraft Company Apparatus and method for thick wafer measurement
JPH074922A (ja) * 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
EP0767361B1 (de) 1993-07-22 2000-02-23 Applied Spectral Imaging Ltd. Verfahren und Vorrichtung zur Spektralen Bilderfassung
US5856871A (en) 1993-08-18 1999-01-05 Applied Spectral Imaging Ltd. Film thickness mapping using interferometric spectral imaging
US5481811A (en) 1993-11-22 1996-01-09 The Budd Company Universal inspection workpiece holder
US5483064A (en) * 1994-01-21 1996-01-09 Wyko Corporation Positioning mechanism and method for providing coaxial alignment of a probe and a scanning means in scanning tunneling and scanning force microscopy
US5459564A (en) * 1994-02-18 1995-10-17 Chivers; James T. Apparatus and method for inspecting end faces of optical fibers and optical fiber connectors
US5471303A (en) 1994-04-29 1995-11-28 Wyko Corporation Combination of white-light scanning and phase-shifting interferometry for surface profile measurements
US5633714A (en) 1994-12-19 1997-05-27 International Business Machines Corporation Preprocessing of image amplitude and phase data for CD and OL measurement
US5555471A (en) 1995-05-24 1996-09-10 Wyko Corporation Method for measuring thin-film thickness and step height on the surface of thin-film/substrate test samples by phase-shifting interferometry
US5589938A (en) * 1995-07-10 1996-12-31 Zygo Corporation Method and apparatus for optical interferometric measurements with reduced sensitivity to vibration
US5703692A (en) 1995-08-03 1997-12-30 Bio-Rad Laboratories, Inc. Lens scatterometer system employing source light beam scanning means
US5602643A (en) 1996-02-07 1997-02-11 Wyko Corporation Method and apparatus for correcting surface profiles determined by phase-shifting interferometry according to optical parameters of test surface
US5640270A (en) 1996-03-11 1997-06-17 Wyko Corporation Orthogonal-scanning microscope objective for vertical-scanning and phase-shifting interferometry
GB9610471D0 (en) 1996-05-18 1996-07-24 Univ Nottingham Optical measurement
US5880838A (en) 1996-06-05 1999-03-09 California Institute Of California System and method for optically measuring a structure
US5923423A (en) 1996-09-12 1999-07-13 Sentec Corporation Heterodyne scatterometer for detecting and analyzing wafer surface defects
US5956141A (en) 1996-09-13 1999-09-21 Olympus Optical Co., Ltd. Focus adjusting method and shape measuring device and interference microscope using said focus adjusting method
US5757502A (en) 1996-10-02 1998-05-26 Vlsi Technology, Inc. Method and a system for film thickness sample assisted surface profilometry
JP3735426B2 (ja) * 1996-12-11 2006-01-18 株式会社東芝 不揮発性半導体記憶装置及びその製造方法
US5973784A (en) * 1997-01-08 1999-10-26 Electro-Optical Sciences, Inc. Common path, interferometric systems and methods using a birefringent material for topographic imaging
US5774224A (en) * 1997-01-24 1998-06-30 International Business Machines Corporation Linear-scanning, oblique-viewing optical apparatus
US5777740A (en) 1997-02-27 1998-07-07 Phase Metrics Combined interferometer/polarimeter
US5867276A (en) 1997-03-07 1999-02-02 Bio-Rad Laboratories, Inc. Method for broad wavelength scatterometry
US5784164A (en) 1997-03-20 1998-07-21 Zygo Corporation Method and apparatus for automatically and simultaneously determining best focus and orientation of objects to be measured by broad-band interferometric means
JPH1123229A (ja) * 1997-07-08 1999-01-29 Tokyo Seimitsu Co Ltd 膜厚測定方法
US20020015146A1 (en) * 1997-09-22 2002-02-07 Meeks Steven W. Combined high speed optical profilometer and ellipsometer
US6665078B1 (en) 1997-09-22 2003-12-16 Candela Instruments System and method for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern in thin film magnetic disks and silicon wafers
US6031615A (en) 1997-09-22 2000-02-29 Candela Instruments System and method for simultaneously measuring lubricant thickness and degradation, thin film thickness and wear, and surface roughness
US6392749B1 (en) 1997-09-22 2002-05-21 Candela Instruments High speed optical profilometer for measuring surface height variation
US5912741A (en) 1997-10-10 1999-06-15 Northrop Grumman Corporation Imaging scatterometer
US5963329A (en) 1997-10-31 1999-10-05 International Business Machines Corporation Method and apparatus for measuring the profile of small repeating lines
US5923425A (en) * 1997-11-20 1999-07-13 Tropel Corporation Grazing incidence interferometry for measuring transparent plane-parallel plates
US5900633A (en) * 1997-12-15 1999-05-04 On-Line Technologies, Inc Spectrometric method for analysis of film thickness and composition on a patterned sample
US6124141A (en) 1998-01-07 2000-09-26 International Business Machines Corporation Non-destructive method and device for measuring the depth of a buried interface
US5953124A (en) 1998-01-19 1999-09-14 Zygo Corporation Interferometric methods and systems using low coherence illumination
US6028670A (en) 1998-01-19 2000-02-22 Zygo Corporation Interferometric methods and systems using low coherence illumination
US6483580B1 (en) 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
DE19814057B4 (de) 1998-03-30 2009-01-02 Carl Zeiss Meditec Ag Anordnung zur optischen Kohärenztomographie und Kohärenztopographie
US6242739B1 (en) 1998-04-21 2001-06-05 Alexander P. Cherkassky Method and apparatus for non-destructive determination of film thickness and dopant concentration using fourier transform infrared spectrometry
US6275297B1 (en) 1998-08-19 2001-08-14 Sc Technology Method of measuring depths of structures on a semiconductor substrate
USH1972H1 (en) 1998-10-06 2001-07-03 Nikon Corporation Autofocus system using common path interferometry
JP2000121317A (ja) 1998-10-12 2000-04-28 Hitachi Electronics Eng Co Ltd 光干渉計の干渉位相検出方式
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6615072B1 (en) 1999-02-04 2003-09-02 Olympus Optical Co., Ltd. Optical imaging device
US6184984B1 (en) * 1999-02-09 2001-02-06 Kla-Tencor Corporation System for measuring polarimetric spectrum and other properties of a sample
TW490596B (en) * 1999-03-08 2002-06-11 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
KR100290086B1 (ko) * 1999-03-23 2001-05-15 윤덕용 백색광주사간섭법을 이용한 투명한 박막층의 3차원 두께 형상 측정 및 굴절률 측정 방법 및 그 기록매체
US6449066B1 (en) 1999-04-29 2002-09-10 Kaiser Optical Systems, Inc. Polarization insensitive, high dispersion optical element
US6888638B1 (en) * 1999-05-05 2005-05-03 Zygo Corporation Interferometry system having a dynamic beam steering assembly for measuring angle and distance
TW477897B (en) 1999-05-07 2002-03-01 Sharp Kk Liquid crystal display device, method and device to measure cell thickness of liquid crystal display device, and phase difference plate using the method thereof
US6507405B1 (en) * 1999-05-17 2003-01-14 Ultratech Stepper, Inc. Fiber-optic interferometer employing low-coherence-length light for precisely measuring absolute distance and tilt
US6249351B1 (en) * 1999-06-03 2001-06-19 Zygo Corporation Grazing incidence interferometer and method
US6381009B1 (en) * 1999-06-29 2002-04-30 Nanometrics Incorporated Elemental concentration measuring methods and instruments
US6195168B1 (en) 1999-07-22 2001-02-27 Zygo Corporation Infrared scanning interferometry apparatus and method
US6160621A (en) 1999-09-30 2000-12-12 Lam Research Corporation Method and apparatus for in-situ monitoring of plasma etch and deposition processes using a pulsed broadband light source
US6259521B1 (en) 1999-10-05 2001-07-10 Advanced Micro Devices, Inc. Method and apparatus for controlling photolithography parameters based on photoresist images
US6545761B1 (en) 1999-11-30 2003-04-08 Veeco Instruments, Inc. Embedded interferometer for reference-mirror calibration of interferometric microscope
DE10195052B3 (de) 2000-01-25 2015-06-18 Zygo Corp. Verfahren und Einrichtungen zur Bestimmung einer geometrischen Eigenschaft eines Versuchsgegenstands sowie optisches Profilmesssystem
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
LU90580B1 (fr) 2000-05-08 2001-11-09 Europ Economic Community M-thode d'identification d'un objet
US6597460B2 (en) 2000-05-19 2003-07-22 Zygo Corporation Height scanning interferometer for determining the absolute position and surface profile of an object with respect to a datum
US6417109B1 (en) * 2000-07-26 2002-07-09 Aiwa Co., Ltd. Chemical-mechanical etch (CME) method for patterned etching of a substrate surface
US6775009B2 (en) 2000-07-27 2004-08-10 Zetetic Institute Differential interferometric scanning near-field confocal microscopy
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US6917433B2 (en) * 2000-09-20 2005-07-12 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
US6798511B1 (en) 2000-10-18 2004-09-28 Regents Of The University Of Minnesota Imaging ellipsometry
JP4279550B2 (ja) 2000-11-02 2009-06-17 ザイゴ コーポレーション 位相間隙分析を含む高さ走査干渉分析方法および装置
US6633389B1 (en) 2000-11-28 2003-10-14 Nanometrics Incorporated Profiling method
JP4583611B2 (ja) * 2001-01-11 2010-11-17 富士フイルム株式会社 斜入射干渉計装置
US6909509B2 (en) * 2001-02-20 2005-06-21 Zygo Corporation Optical surface profiling systems
US6721094B1 (en) * 2001-03-05 2004-04-13 Sandia Corporation Long working distance interference microscope
KR100393429B1 (ko) 2001-04-09 2003-08-02 한국과학기술원 각기 다른 금속 물질의 단차 측정을 위한 두 파장 백색광간섭법과 간섭계
DE10297689B4 (de) 2001-05-01 2007-10-18 The General Hospital Corp., Boston Verfahren und Gerät zur Bestimmung von atherosklerotischem Belag durch Messung von optischen Gewebeeigenschaften
US6624894B2 (en) * 2001-06-25 2003-09-23 Veeco Instruments Inc. Scanning interferometry with reference signal
US7382447B2 (en) * 2001-06-26 2008-06-03 Kla-Tencor Technologies Corporation Method for determining lithographic focus and exposure
US6741357B2 (en) 2001-08-14 2004-05-25 Seagate Technology Llc Quadrature phase shift interferometer with unwrapping of phase
JP4242767B2 (ja) 2001-09-21 2009-03-25 ケイマック 2次元型検出器を用いた薄膜特性測定装置及びその測定方法
US6714307B2 (en) 2001-10-16 2004-03-30 Zygo Corporation Measurement of complex surface shapes using a spherical wavefront
KR100437024B1 (ko) * 2001-10-18 2004-06-23 엘지전자 주식회사 박막 검사 방법 및 그 장치
US6630982B2 (en) * 2001-10-18 2003-10-07 Motorola, Inc. Color and intensity tunable liquid crystal device
US7030995B2 (en) * 2001-12-10 2006-04-18 Zygo Corporation Apparatus and method for mechanical phase shifting interferometry
US6856384B1 (en) 2001-12-13 2005-02-15 Nanometrics Incorporated Optical metrology system with combined interferometer and ellipsometer
US6934035B2 (en) 2001-12-18 2005-08-23 Massachusetts Institute Of Technology System and method for measuring optical distance
EP1470410B1 (de) 2002-01-24 2012-01-11 The General Hospital Corporation Vorrichtung und verfahren zur ortung und verminderung des rauschens von signalen in der niedrigkohärenzinterferometrie (lci) und der optische kohärenztomografie (oct) mittels paralleldetektion von spektralbändern
DE10229818A1 (de) * 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
AU2003214404A1 (en) 2002-03-14 2003-09-29 Taylor Hobson Limited Surface profiling apparatus
GB2385417B (en) 2002-03-14 2004-01-21 Taylor Hobson Ltd Surface profiling apparatus
US7068376B2 (en) * 2002-04-19 2006-06-27 Zygo Corporation Interferometry method and apparatus for producing lateral metrology images
AU2003241356A1 (en) * 2002-05-02 2003-11-17 Zygo Corporation Phase gap analysis for scanning interferometry
US7046371B2 (en) * 2002-06-17 2006-05-16 Zygo Corporation Interferometer having a coupled cavity geometry for use with an extended source
DE10392754T5 (de) * 2002-06-17 2005-08-25 Zygo Corp., Middlefield Interferometrisches optisches System und Verfahren, die eine optische Pfadlänge und einen Fokus bzw. Brennpunkt liefern, die gleichzeitig abgetastet werden
AU2003247725A1 (en) * 2002-07-01 2004-01-19 Lightgage, Inc. Interferometer system of compact configuration
US7139081B2 (en) * 2002-09-09 2006-11-21 Zygo Corporation Interferometry method for ellipsometry, reflectometry, and scatterometry measurements, including characterization of thin film structures
KR101223195B1 (ko) 2002-09-09 2013-01-21 지고 코포레이션 박막 구조의 특징화를 포함하여, 타원편광 측정, 반사 측정 및 산란 측정을 위한 간섭측정 방법 및 장치
US6925860B1 (en) 2003-02-21 2005-08-09 Nanometrics Incorporated Leveling a measured height profile
US7106454B2 (en) * 2003-03-06 2006-09-12 Zygo Corporation Profiling complex surface structures using scanning interferometry
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US7271918B2 (en) 2003-03-06 2007-09-18 Zygo Corporation Profiling complex surface structures using scanning interferometry
US6985232B2 (en) * 2003-03-13 2006-01-10 Tokyo Electron Limited Scatterometry by phase sensitive reflectometer
US7049156B2 (en) * 2003-03-19 2006-05-23 Verity Instruments, Inc. System and method for in-situ monitor and control of film thickness and trench depth
US6999180B1 (en) * 2003-04-02 2006-02-14 Kla-Tencor Technologies Corporation Optical film topography and thickness measurement
JP2004340680A (ja) * 2003-05-14 2004-12-02 Toray Eng Co Ltd 表面形状および/または膜厚測定方法及びその装置
US7102761B2 (en) 2003-06-13 2006-09-05 Zygo Corporation Scanning interferometry
US7061623B2 (en) * 2003-08-25 2006-06-13 Spectel Research Corporation Interferometric back focal plane scatterometry with Koehler illumination
US7289224B2 (en) 2003-09-15 2007-10-30 Zygo Corporation Low coherence grazing incidence interferometry for profiling and tilt sensing
TWI335417B (en) 2003-10-27 2011-01-01 Zygo Corp Method and apparatus for thin film measurement
WO2005067579A2 (en) * 2004-01-06 2005-07-28 Zygo Corporation Multi-axis interferometers and methods and systems using multi-axis interferometers
US20050179911A1 (en) 2004-02-17 2005-08-18 Digital Optics Corporation Aspheric diffractive reference for interferometric lens metrology
US7492469B2 (en) 2004-03-15 2009-02-17 Zygo Corporation Interferometry systems and methods using spatial carrier fringes
US7177030B2 (en) * 2004-04-22 2007-02-13 Technion Research And Development Foundation Ltd. Determination of thin film topography
US7321430B2 (en) 2004-04-22 2008-01-22 Zygo Corporation Vibration resistant interferometry
US7142311B2 (en) 2004-05-18 2006-11-28 Zygo Corporation Methods and systems for determining optical properties using low-coherence interference signals
US7119909B2 (en) 2004-06-16 2006-10-10 Veeco Instruments, Inc. Film thickness and boundary characterization by interferometric profilometry
US20060012582A1 (en) 2004-07-15 2006-01-19 De Lega Xavier C Transparent film measurements
US20060066842A1 (en) * 2004-09-30 2006-03-30 Saunders Winston A Wafer inspection with a customized reflective optical channel component
WO2006078718A1 (en) * 2005-01-20 2006-07-27 Zygo Corporation Interferometer for determining characteristics of an object surface
US7884947B2 (en) * 2005-01-20 2011-02-08 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
JP4885212B2 (ja) 2005-05-19 2012-02-29 ザイゴ コーポレーション 薄膜構造についての情報に関する低コヒーレンス干渉計信号を解析するための方法およびシステム
US7595891B2 (en) * 2005-07-09 2009-09-29 Kla-Tencor Corporation Measurement of the top surface of an object with/without transparent thin films in white light interferometry
WO2007044786A2 (en) * 2005-10-11 2007-04-19 Zygo Corporation Interferometry method and system including spectral decomposition
US7408649B2 (en) * 2005-10-26 2008-08-05 Kla-Tencor Technologies Corporation Method and apparatus for optically analyzing a surface
US20070127036A1 (en) * 2005-12-07 2007-06-07 Chroma Ate Inc. Interference measurement system self-alignment method
US7612891B2 (en) * 2005-12-15 2009-11-03 Veeco Instruments, Inc. Measurement of thin films using fourier amplitude
WO2008011510A2 (en) * 2006-07-21 2008-01-24 Zygo Corporation Compensation of systematic effects in low coherence interferometry

Also Published As

Publication number Publication date
EP1664932A2 (de) 2006-06-07
US20050078319A1 (en) 2005-04-14
US20100060898A1 (en) 2010-03-11
KR20060096054A (ko) 2006-09-05
KR101295207B1 (ko) 2013-08-09
WO2005029193A2 (en) 2005-03-31
KR20060084852A (ko) 2006-07-25
JP5587241B2 (ja) 2014-09-10
JP5340539B2 (ja) 2013-11-13
US20090096980A1 (en) 2009-04-16
US20050057757A1 (en) 2005-03-17
US20050078318A1 (en) 2005-04-14
US7289225B2 (en) 2007-10-30
US20080068614A1 (en) 2008-03-20
JP2011221027A (ja) 2011-11-04
JP2007506070A (ja) 2007-03-15
DE602004019231D1 (de) 2009-03-12
JP2007506071A (ja) 2007-03-15
EP2275868B1 (de) 2018-02-28
US8107085B2 (en) 2012-01-31
TWI331210B (en) 2010-10-01
EP2275868A1 (de) 2011-01-19
US7289224B2 (en) 2007-10-30
TWI334921B (en) 2010-12-21
US7298494B2 (en) 2007-11-20
US20050068540A1 (en) 2005-03-31
US7586620B2 (en) 2009-09-08
EP1664931B1 (de) 2009-01-21
EP1664931A2 (de) 2006-06-07
US7292346B2 (en) 2007-11-06
KR101185473B1 (ko) 2012-10-02
TW200528686A (en) 2005-09-01
TW200527145A (en) 2005-08-16
TW200517638A (en) 2005-06-01
WO2005029192A3 (en) 2005-09-29
TWI331211B (en) 2010-10-01
TW200526925A (en) 2005-08-16
TWI358614B (en) 2012-02-21
KR20120040260A (ko) 2012-04-26
WO2005029192A2 (en) 2005-03-31
WO2005029193A3 (en) 2005-10-06
US7456975B2 (en) 2008-11-25
EP1664932B1 (de) 2015-01-28

Similar Documents

Publication Publication Date Title
ATE421716T1 (de) Oberflächen-triangulation und -profilierung
ATE364165T1 (de) Verfahren zum messen einer objektgeometrie mittels eines koordinationsmessgerätes
DE502005004109D1 (de) Verfahren zur bestimmung der lage und der relativverschiebung eines objekts im raum
DE60230743D1 (de) Verfahren und vorrichtung zum erhalt von einen kanal betreffenden geometrischen daten
DE19880875D2 (de) Koordinatenmessgerät mit Tastelement und dieses vermessenden optischen Sensor
ATE467809T1 (de) Luftspalt messsystem und verfahren
NO20003006L (no) Mus
ATE329222T1 (de) Vorrichtung zur erfassung der kontur einer oberfläche einer knöchernen struktur
WO2006017837A3 (en) Process, system and software arrangement for determining at least one location in a sample using an optical coherence tomography
WO2004057266A8 (de) Interferometersystem für optische kohärenztomographie
WO2006082368A3 (en) A metrological instrument
GB2438333A (en) Apparatus and method for mechanical caliper measurements during drilling and logging-while-drilling operations
ATE372089T1 (de) Analyseverfahren von unregelmässigkeiten in menschlicher fortbewegung
WO2006125131A3 (en) Analyzing low-coherence interferometry signals for thin film structures
DE102004017232A1 (de) Interferometrische Messvorrichtung
WO2006036711A3 (en) Feature isolation for frequency-shifting interferometry
DE502007004432D1 (de) Verfahren und vorrichtung zum bestimmen von raumkoordinaten an einer vielzahl von messpunkten
ATE268674T1 (de) Vorrichtung und verfahren zur bestimmung von koordinaten und orientierung
DE50213775D1 (de) Positionsmesseinrichtung
DE602005005839D1 (de) Verwendung von oberflächenmesssonden
ATE481665T1 (de) Verfahren zum messen eines objektes mit einem koordinatenmessgerät mit bildverarbeitungssensor
EP0947828A3 (de) Verfahren und Apparat für verbesserte Inspektionsmessungen
ATE363662T1 (de) Verfahren und abstandserfassungsvorrichtung zum erfassen des projizierten abstandes zwischen einer abstandsmesseinrichtung und einem hindernis
SE0400145D0 (sv) An arrangement and method for assessing joints
DE602004021673D1 (de) Verfahren und vorrichtungen zur gewichtsmessung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties