WO2024183713A1

WO2024183713A1 - Display screen and electronic device

Info

Publication number: WO2024183713A1
Application number: PCT/CN2024/080082
Authority: WO
Inventors: 魏山山; 李健辉; 贺虎; 牛鹏程; 孟超; 龙浩晖
Original assignee: 华为技术有限公司
Priority date: 2023-03-07
Filing date: 2024-03-05
Publication date: 2024-09-12
Also published as: CN118629315A

Abstract

The present application provides a display screen and an electronic device. The display panel comprises an upper stack, a display panel, and a lower stack; the display panel comprises a first non-bending area, a bending area, and a second non-bending area which are connected in sequence; the first non-bending area and the second non-bending area are attached to two opposite surfaces of the lower stack; the upper stack is located on one side of the first non-bending area; the display panel comprises a substrate, a first metal layer, and a packaging and adjustment layer which are stacked; the modulus of the material of the packaging and adjustment layer ranges from 0.25 GPa to 118 GPa; the packaging and adjustment layer is used for adjusting the position of a neutral layer of the display panel in the bending area, so that the neutral layer is located in the first metal layer or is close to the first metal layer. According to the display screen of the present application, the neutral layer in the bending area is adjusted to be located in the first metal layer or be close to the first metal layer, so that the risk of breakage of the first metal layer in the bending area is reduced, and the size of the display screen is reduced.

Description

Displays and electronic devices

This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on March 7, 2023, with application number 202310246927.2, and priority to the Chinese patent application with the invention name “Display screen and electronic device”, all contents of which are incorporated by reference into this application.

Technical Field

The present application relates to the field of display technology, and in particular to a display screen, and an electronic device comprising the display screen.

Background Art

In order to increase the screen-to-body ratio of electronic devices, the fan-out area of the display panel is usually set to be flexible so that part of the fan-out area can be bent to the back of the display panel. The fan-out area at the back of the display panel is connected to the driver chip and transmits the display signal provided by the driver chip to the front of the display panel to realize the display function.

There are metal wires in the fan-out area. Stress concentration occurs when the metal wires are bent, which poses a risk of breakage. In the prior art, a micro coating layer (MCL) structure is usually made on the metal layer in the bending area to improve the structural rigidity of the metal layer. However, the material modulus of the micro coating is small, and its thickness is correspondingly large, which occupies the internal space of the electronic device.

Summary of the invention

The present application provides a display screen that can improve the structural rigidity of the metal layer in the bending area and reduce the volume of the display screen; the present application also provides an electronic device including the display screen.

In a first aspect, the present application provides a display screen, including an upper stack, a display panel, and a lower stack, wherein the display panel includes a first non-bending area, a bending area, and a second non-bending area connected in sequence, wherein the first non-bending area and the second non-bending area are respectively attached to opposite sides of the lower stack, and the upper stack is located on a side of the first non-bending area away from the lower stack;

The display panel includes a substrate, a first metal layer and a packaging adjustment layer stacked in sequence. The material modulus of the packaging adjustment layer is between 0.25GPa-118GPa. In the bending area, the packaging adjustment layer is used to adjust the neutral layer position of the display panel so that the neutral layer is located within the first metal layer, or the neutral layer is close to the first metal layer.

The display screen of the present application carries the display panel through the lower stack and protects the display panel through the upper stack, so that the display panel can be bent around the lower stack and attached to the two opposite sides of the lower stack. Among them, the display panel includes a substrate, a first metal layer and a packaging adjustment layer stacked in sequence. The first metal layer in the second non-bending area can be used to receive external signals, and the first metal layer transmits the signal to the first non-bending area through the bending area to realize the display function of the display panel.

The substrate is used to carry the first metal layer, and the encapsulation adjustment layer can be used to encapsulate and protect the first metal layer. In the bending area, the encapsulation adjustment layer can also be used to adjust the neutral layer position of the display panel. The display screen of the present application can adjust the neutral layer to the first metal layer, or the neutral layer is close to the first metal layer by setting the material modulus of the encapsulation adjustment layer between 0.25GPa-118GPa, thereby reducing or eliminating the tensile stress on the first metal layer. The display screen of the present application can avoid the phenomenon that the first metal layer is broken due to excessive tensile stress on the first metal layer, thereby ensuring the signal transmission function of the first metal layer in the bending area. And the material modulus of the encapsulation adjustment layer is large, and the thickness of the encapsulation adjustment layer can be controlled, which is conducive to the miniaturization of the display screen. The display screen of the present application is continuously laid on the substrate and the first metal layer in the first non-bending area, the bending area and the second non-bending area to ensure the signal transmission function of the first metal layer, and the support and protection function of the substrate to the first metal layer. On the other hand, the display screen of the present application is provided with a first back film and a second back film spaced apart from each other, subtracting the back film structure of the bending area, so as to adjust the neutral layer position of the bending area.

In one embodiment, the neutral layer in the bending region is located in the first metal layer or the packaging adjustment layer.

In this embodiment, the neutral layer of the bending zone is arranged in the first metal layer to reduce or eliminate the tensile stress borne by the first metal layer in the bending zone, thereby reducing the risk of fracture of the first metal layer in the bending zone. The neutral layer of the bending zone is arranged in the packaging adjustment layer so that the first metal layer in the bending zone is subjected to compressive stress. That is, the first metal layer in the bending zone does not bear tensile stress, which can also reduce the risk of fracture of the first metal layer in the bending zone.

In one embodiment, the packaging adjustment layer in the bending region includes a packaging layer and an adjustment layer, the packaging layer is located between the first metal layer and the adjustment layer, the packaging layer is used to cover and protect the first metal layer, and the packaging layer and the adjustment layer work together to adjust the position of the neutral layer. In one embodiment, the thickness of the packaging adjustment layer is between 5-25 μm.

In this embodiment, a packaging adjustment layer with a thickness of 5-25 μm is provided to avoid interference between the packaging adjustment layer and the upper stack, thereby ensuring the thickness of the upper stack and avoiding the situation where the packaging adjustment layer is too thick and occupies the space of the upper stack, thereby ensuring the strength of the upper stack.

In one embodiment, the projections of the display panel and the lower stack on the upper stack are respectively contained in the upper stack.

In this embodiment, an upper stacking layer is provided in which projections of the display panel and the lower stacking layer on the upper stacking layer can be respectively received by the upper stacking layer, so that the upper stacking layer can cover and protect the display panel and the lower stacking layer.

In one embodiment, a display area is provided in the first non-bending area, and the display area includes a functional layer, and the functional layer is located on the side of the packaging adjustment layer away from the first metal layer; the functional layer is a composite layer structure, the material of the adjustment layer is the same as at least part of the material in the functional layer, and the adjustment layer and the functional layer are manufactured synchronously.

In this embodiment, the functional layer of the composite layer structure is used to realize the specific function of the display area. The material of the adjustment layer is the same as at least part of the material in the functional layer and is manufactured simultaneously, which can reduce the manufacturing cost of the display screen and improve processing efficiency.

In one embodiment, the regulating layer includes a plurality of stacked sub-regulating layers, and a material in the sub-regulating layers is the same as at least one material in the functional layer.

In this embodiment, the adjustment layer may be a composite layer structure including a plurality of sub-adjustment layers, wherein the sub-adjustment layers are made of the same material as at least one of the functional layers, so that the sub-adjustment layers can be manufactured simultaneously with a part of the structure in the functional layer, thereby simplifying the manufacturing process of the display panel.

In one embodiment, the stacking order of the sub-regulating layers is the same as the manufacturing order of the corresponding materials in the functional layer.

In this embodiment, when the sub-regulating layer is manufactured synchronously with a part of the structure in the functional layer, the stacking order of the sub-regulating layer is the same as the manufacturing order of the corresponding materials in the functional layer.

In one embodiment, the material of the functional layer includes organic material, the material of the adjustment layer is all organic material, the thickness of the adjustment layer is between 15-25 μm, and the modulus of the material in the adjustment layer is between 0.25 GPa-12 GPa.

In one embodiment, the functional layer includes at least one of a filter layer, a touch layer, a thin film encapsulation layer, and a microlens array.

In this embodiment, the filter layer is used to reduce the reflected light of the external environment, the touch layer is used to realize the touch control of the user, the thin film encapsulation layer is used to prevent the pollution of the external environment, and the microlens array is used to improve the display effect of the display screen. The materials of the above functional layers are mostly organic materials, and the modulus of some materials in the above functional layers is relatively high. The use of some materials in the above functional layers to simultaneously make the adjustment layer can improve the modulus of the adjustment layer and reduce the thickness.

In one embodiment, the functional layer includes a filter layer, the filter layer includes a shading layer, a color filter unit, and a filter protection layer; the adjustment layer includes at least one of a first sub-adjustment layer with the same material as the shading layer, a second sub-adjustment layer with the same material as the color filter unit, and a third sub-adjustment layer with the same material as the filter protection layer.

In this embodiment, the materials of the light shielding layer, the color filter unit, and the filter protection layer can be used to simultaneously manufacture the first sub-adjusting layer, the second sub-adjusting layer, and the third sub-adjusting layer, respectively.

In one embodiment, the first sub-adjusting layer partially extends from the bending area into the first non-bending area, and the first sub-adjusting layer in the first non-bending area forms a boundary of the display area.

In this embodiment, since the material of the first sub-adjusting layer is the same as that of the light shielding layer, and the light shielding layer has a light shielding effect, the first sub-adjusting layer can be used to form the boundary of the display area. At the same time, the light shielding layer is made by processes such as gluing, exposure and development, and the manufacturing accuracy of the light shielding layer is high, so that the manufacturing accuracy of the boundary of the display area is also improved simultaneously.

In one embodiment, the material modulus of the filter layer is between 1.5 GPa and 12 GPa.

In one embodiment, the color filter unit includes a red filter unit, a green filter unit and a blue filter unit.

In one embodiment, the material modulus of the filter protection layer is 4.6 GPa; the material modulus of the color filter unit is between 1.5 GPa and 3.54 GPa; and the material modulus of the light shielding layer is 12 GPa.

In one embodiment, the functional layer includes a touch layer, the touch layer includes a stacked touch buffer layer, a touch insulating layer and a touch protection layer; the adjustment layer includes at least one of a fourth sub-adjustment layer made of the same material as the touch buffer layer, a fifth sub-adjustment layer made of the same material as the touch insulating layer, and a sixth sub-adjustment layer made of the same material as the touch protection layer.

In this embodiment, the materials of the touch buffer layer, the touch insulating layer and the touch protection layer can be used to simultaneously manufacture the fourth sub-adjustment layer, the fifth sub-adjustment layer and the sixth sub-adjustment layer, respectively.

In one embodiment, the material modulus of the touch layer is greater than or equal to 4.6 GPa.

In one embodiment, the material modulus of the touch buffer layer, the touch insulation layer, and the touch protection layer are all 4.6 GPa.

In one embodiment, the functional layer includes a microlens array, the microlens array includes a first lens layer and a second lens layer with different refractive indices; the adjustment layer includes a seventh sub-adjustment layer of the same material as the first lens layer, and/or includes an eighth sub-adjustment layer of the same material as the second lens layer.

In this embodiment, the materials of the first lens layer and the second lens layer with different refractive indices can be used to simultaneously manufacture the seventh sub-adjustment layer and The eighth sub-adjustment layer.

In one embodiment, the material modulus of the microlens array is between 0.25 GPa and 5.4 GPa.

In one embodiment, the material modulus of the first lens layer is 0.25 GPa; and the material modulus of the second lens layer is 5.4 GPa.

In one embodiment, the functional layer includes a thin film encapsulation layer, the thin film encapsulation layer includes an inkjet printing layer, and the adjustment layer includes a ninth sub-adjustment layer made of the same material as the inkjet printing layer.

In this embodiment, the material of the thin film encapsulation layer of the inkjet printing layer can be used to simultaneously manufacture the ninth sub-adjusting layer.

In one embodiment, the material modulus of the thin film encapsulation layer is greater than or equal to 3.4 GPa.

In one embodiment, the material modulus of the inkjet printed layer is 3.4 GPa.

In one embodiment, the substrate, the first metal layer and the packaging adjustment layer are continuously laid in the first non-bending area, the bending area and the second non-bending area.

In one embodiment, the packaging adjustment layer in the first non-bending area and the second non-bending area includes a packaging layer, and the packaging layer includes a stacked first pixel definition layer and a first planar layer, and the first planar layer is located between the first pixel definition layer and the first metal layer.

In this embodiment, the surface of the first metal layer is relatively rough, and the first flat layer is used to provide a relatively flat surface. The first pixel definition layer located in the display area is used to realize the positioning of the light-emitting unit. The first pixel definition layer located in the bending area is used to cooperate with the thickness and modulus of the substrate, the first metal layer, and the first flat layer to adjust the neutral layer to the first metal layer, or the neutral layer is close to the first metal layer.

In one embodiment, the packaging adjustment layer in the first non-bending area and the second non-bending area includes a packaging layer, the packaging layer includes a second flat layer, the functional layer includes a second metal layer, the second metal layer extends from the first non-bending area to the bending area and is constructed as a part of the adjustment layer.

In this embodiment, the second flat layer is used to achieve insulation between the first metal layer and the second metal layer, and the second metal layer can be patterned in the display area to form a structure such as an electrode or a transmission line. In addition, the material modulus of the second metal layer is relatively high, and the material of the second metal layer is used to simultaneously make the adjustment layer, so that the thickness of the adjustment layer can be reduced.

In one embodiment, the material modulus of the second planar layer is between 10 GPa and 15 GPa; and/or the material modulus of the second metal layer is between 72 GPa and 118 GPa.

In one embodiment, at least one pressure relief groove is provided in the second metal layer in the bending zone, the length direction of the pressure relief groove is parallel to the bending axis of the bending zone, and the pressure relief groove is used to reduce the bending stress of the second metal layer.

In this embodiment, the second metal layer is also made of metal material. The decompression groove is provided on the second metal layer to reduce the bending stress of the second metal layer in the bending area, thereby avoiding fracture caused by excessive bending stress of the second metal layer.

In one embodiment, the adjustment layer also includes a stacked second pixel definition layer and a third flat layer, the third flat layer covers the second metal layer, the third flat layer is located on the side of the second metal layer away from the second flat layer, and the third flat layer is also located between the second pixel definition layer and the second metal layer.

In one embodiment, the package adjustment layer in the bending region includes an adjustment region, the thickness of the adjustment region is between 15 μm and 25 μm, and the material modulus of the adjustment region is between 0.25 GPa and 12 GPa.

In one embodiment, the packaging adjustment layer in the first non-bending area includes a first packaging area, and the packaging adjustment layer in the second non-bending area includes a second packaging area. The first packaging area, the adjustment area and the second packaging area are connected in sequence along the plane direction of the display panel.

In this embodiment, the first non-bending area and the second non-bending area can be respectively encapsulated by the first encapsulation area and the second encapsulation area, and then the neutral layer can be adjusted by making an independent adjustment area in the bending area. Combined with the thickness and modulus of the adjustment area, the position of the neutral layer is adjusted under the premise of ensuring the overall thickness of the bending area.

In one embodiment, the display panel in the first non-bending area includes a first back film, and the display panel in the second non-bending area includes a second back film, and the first back film and the second back film are respectively attached to opposite sides of the lower stack.

In this embodiment, the first back film and the second back film are used to carry the substrate respectively to improve the structural stability of the display panel in the first non-bending area and the second non-bending area. In one embodiment, the upper stack includes a support layer and a cover plate stacked in sequence, the support layer is located between the cover plate and the display panel, and the projections of the display panel and the lower stack on the upper stack are accommodated in the support layer.

In this embodiment, a cover plate is provided in the upper stack so that the cover plate can contact the outside world and bear the external pressure. A support layer is provided in the upper stack so that the support layer is located between the cover plate and the display panel to support the cover plate. On the other hand, the projection on the upper stack is accommodated in the display panel and the lower stack in the support layer so that the support layer protects the display panel and the lower stack.

In one embodiment, an adhesive layer is provided between the upper stack and the display panel, the adhesive layer is contained in the first non-bending area, and the thickness of the adhesive layer is greater than or equal to the thickness of the adjustment layer.

In this embodiment, by providing an adhesive layer with a thickness greater than or equal to the thickness of the adjustment layer, and making the adhesive layer contained in the first non-bending area, interference between the adjustment layer and the upper stack is avoided, thereby ensuring the thickness of the upper stack and avoiding the occurrence of a problem caused by the upper stack being too thin. The compressive strength of the upper laminate is reduced.

In one embodiment, the upper stack includes a shielding layer, which is located between the supporting layer and the cover plate. The shielding layer is located on the side of the bending area close to the display panel. The shielding layer also partially extends into the first non-bending area, and the projection of the shielding layer on the adhesive layer partially overlaps with the adhesive layer.

In this embodiment, the projection of the shielding layer on the adhesive layer partially overlaps with the adhesive layer to shield the boundary of the adhesive layer.

In one embodiment, the lower stack includes a stacked liner and a support plate, the support plate is located between the liner and the upper stack, and the projection of the liner in the second non-bending area is accommodated in the second non-bending area.

In this embodiment, a support plate is provided in the lower stack to support the display panel, the adhesive layer and the upper stack. At the same time, a liner plate is provided in the lower stack to be stacked with the support plate, and the liner plate is located between the support plate and the second back film, and the projection of the liner plate in the second non-bending area is accommodated in the second non-bending area, so as to carry a driving chip electrically connected to the first metal layer in the second non-bending area.

In a second aspect, an embodiment of the present application provides an electronic device, including a housing and the display screen provided in the first aspect of the present application, wherein the display screen is embedded in the housing, and the display screen is used to realize the display function of the electronic device.

It can be understood that since the electronic device provided in the second aspect of the present application adopts the display screen provided in the first aspect of the present application, it also has the beneficial effect of being able to enhance the structural rigidity of the metal layer in the bending area and reduce the volume of the display screen.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

FIG2 is a schematic diagram of a planar structure of an electronic device provided in an embodiment of the present application;

FIG3 is a schematic diagram of the A-A cross-sectional structure of an electronic device provided in an embodiment of the present application;

FIG4 is a schematic diagram of the structure of a display screen provided in an embodiment of the present application;

FIG5 is a schematic diagram of the structure of a display panel of a display screen provided in an embodiment of the present application;

FIG6 is a schematic structural diagram of a B-section of a bending region of a display panel provided in an embodiment of the present application;

FIG7 is a schematic diagram of stress distribution of section B provided in one embodiment of the present application;

FIG8 is a schematic diagram of an unfolded structure in a display screen manufacturing process provided in an embodiment of the present application;

FIG9 is another schematic diagram of a structure of a display screen during manufacturing provided in one embodiment of the present application;

FIG10 is a schematic diagram of the structure of a first metal layer of a display screen provided in one embodiment of the present application;

FIG11 is a schematic structural diagram of a substrate of a display screen provided in one embodiment of the present application;

FIG12 is a schematic diagram of the structure of an upper stack of a display screen provided in an embodiment of the present application;

FIG13 is a schematic diagram of the structure of a lower stack of a display screen provided in one embodiment of the present application;

FIG14 is a schematic diagram of the structure of an adhesive layer of a display screen provided in one embodiment of the present application;

FIG15 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG16 is a schematic diagram of the structure of a display screen in the prior art;

FIG17 is another schematic diagram of the structure of a display screen in the prior art;

FIG18 is a schematic structural diagram of a B' cross section of a bending zone in the prior art;

FIG19 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG20 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG21 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG22 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG23 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG24 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG25 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG26 is another schematic diagram of the structure of a display screen provided in one embodiment of the present application;

FIG. 27 is another schematic diagram of the structure of a display screen provided in an embodiment of the present application.

DETAILED DESCRIPTION

The following embodiments of the present application provide a display screen, which includes an upper stack, a display panel, a lower stack, and an adhesive layer, wherein the adhesive layer is bonded between the upper stack and the display panel, and the lower stack is used to support the display panel.

The following embodiments of the present application also provide an electronic device including the display screen, the electronic device including but not limited to a tablet, a computer, a mobile phone, a wearable device, etc. The electronic device may include a housing and a display screen, the display screen being embedded in the housing to realize the electronic device. Display function. When the display screen is embedded in the housing, in order to increase the screen-to-body ratio of the electronic device, the display panel of the display screen of the present application can be bent around the lower stack and attached to the opposite sides of the lower stack. The following will be described in detail.

Please refer to FIG. 1 for a schematic structural diagram of an electronic device 200 provided in an embodiment of the present application.

As shown in FIG. 1 , the electronic device 200 provided in the present application is a mobile phone. In other embodiments, the electronic device 200 may also be other devices with a display function.

In this embodiment, the electronic device 200 includes a display screen 100 and a housing 201, and the display screen 100 is carried in the housing 201. It can be understood that the display screen 100 has a structure electrically connected to a driver chip (not shown in the figure). When the display screen 100 is electrically connected to the driver chip, the driver chip sends a signal to control the display screen 100 to emit light outward, thereby realizing the display function of the display screen 100, and further realizing the display function of the electronic device 200 of the present application.

Please refer to FIG. 2 which is a schematic diagram of a planar structure of an electronic device 200 provided in an embodiment of the present application.

As shown in FIG2 , the display screen 100 includes a display function area 101 and a frame area 102. The display function area 101 is located in the central area of the display screen 100, and is used to emit light outward to realize the display function of the electronic device 200 of the present application. The frame area 102 is located at the periphery of the display screen 100, and the frame area 102 does not have a display function.

The display screen 100 further includes a fan-out area 103. The fan-out area 103 is used to be electrically connected to a driver chip (not shown) in the electronic device 200. The signal sent by the driver chip is transmitted to the display function area 101 through the fan-out area 103, so that the display function area 101 is driven to emit light and display.

2 enlarges the boundary of the fan-out area 103 to facilitate description of the position of the fan-out area 103. In an actual electronic device 200, the projection of the fan-out area 103 on the frame area 102 should be contained within the frame area 102.

The frame area 102 is used to protect the fan-out area 103 to prevent the fan-out area 103 from being damaged by external impact, thereby ensuring effective transmission of signals.

Since the fan-out area 103 has no display function, it is understandable that the larger the projection area of the fan-out area 103 on the frame area 102, the larger the area occupied by the frame area 102 on the surface of the display screen 100. Correspondingly, the smaller the screen-to-body ratio of the display function area 101 is, the less conducive it is to improve the user experience.

Please refer to FIG. 3 for a schematic diagram of the A-A cross-sectional structure of an electronic device 200 provided in an embodiment of the present application.

As shown in FIG3 , the fan-out area 103 can be made of a flexible material, and the flexible fan-out area 103 can be bent. The electronic device 200 of the present application is arranged in the display screen 100 by bending the fan-out area 103 to reduce the projection area of the fan-out area 103 on the frame area 102, thereby increasing the screen-to-body ratio of the display function area 101 of the display screen 100 of the present application, thereby improving the display effect of the display screen 100 of the present application.

Specifically, regarding the bending condition of the fan-out area 103 and the connection condition with the corresponding display function area 101. Please refer to FIG. 4 for a schematic diagram of the structure of a display screen 100 provided in an embodiment of the present application.

As shown in FIG4 , the display screen 100 provided in the present application includes an upper stack 10, a display panel 20, and a lower stack 30. The lower stack 30 has a first surface 30a and a second surface 30b that are opposite to each other. The lower stack 30 is used to carry the display panel 20, and the display panel 20 can be bent around the lower stack 30 and attached to the first surface 30a and the second surface 30b of the lower stack 30. The upper stack 10 is located on the side of the display panel 20 away from the lower stack 30 to protect the display panel 20.

The display panel 20 includes a first non-bending area 20a, a bending area 20b, and a second non-bending area 20c connected in sequence. The first non-bending area 20a is located on the first surface 30a of the lower laminate 30, and the second non-bending area 20c is located on the second surface 30b of the lower laminate 30. The first non-bending area 20a is closer to the upper laminate 10 than the second non-bending area 20c, that is, the upper laminate 10 is located on the side of the first non-bending area 20a away from the lower laminate 30. The bending area 20b is connected between the first non-bending area 20a and the second non-bending area 20c.

The second non-bending area 20c can be electrically connected to a driving chip (not shown in the figure). When the driving chip inputs a signal into the second non-bending area 20c, the signal can be transmitted to the first non-bending area 20a via the bending area 20b. Based on the structure of the first non-bending area 20a for realizing the display function, when the signal sent by the driving chip is transmitted to the first non-bending area 20a, the first non-bending area 20a can be driven to realize the display function, thereby realizing the display function of the display panel 20.

It can be understood that in this embodiment, the second non-bending area 20c, the bending area 20b, and the portion of the first non-bending area 20a close to the bending area 20b correspond to the structure of the fan-out area 103 of the display screen 100. The portion of the first non-bending area 20a away from the bending area 20b corresponds to the structure of the display function area 101 of the display screen 100.

Please refer to FIG. 5 , which is a schematic structural diagram of a display panel 20 of a display screen 100 provided in an embodiment of the present application.

As shown in FIG5 , the display panel 20 includes a substrate 25, a first metal layer 22, and a packaging adjustment layer 21 stacked in sequence. The substrate 25 is closer to the lower stack 30 than the first metal layer 22, and the packaging adjustment layer 21 is located on a side away from the lower stack 30. The substrate 25, the first metal layer 22, and the packaging adjustment layer 21 are continuously laid in the first non-bending area 20a, the bending area 20b, and the second non-bending area 20c.

In the display screen 100 of the present application, the material modulus of the encapsulation adjustment layer 21 is set between 0.25GPa-118GPa, so that the encapsulation adjustment layer 21 has a higher modulus. In the bending area 20b, the encapsulation adjustment layer 21 is used to adjust the position of the neutral layer of the display panel 20. This involves the relevant principles of material mechanics, which will be described in detail below.

Please refer to FIG. 6 , which is a schematic structural diagram of a B-section of a bending region 20 b of a display panel 20 provided in an embodiment of the present application.

For ease of description, FIG6 shows the unfolded state of the bending zone 20b. As shown in FIG6 , the bending zone 20b will be subjected to a bending moment when bending, and the bending moment is indicated by an arc arrow, which indicates the bending tendency of the bending zone 20b under the action of the bending moment. In this embodiment, the bending zone 20b has an upward convex bending tendency. The bending zone 20b has a neutral layer L. The neutral layer L is a mechanical concept layer, and the bending zone 20b is neither subjected to tensile stress nor compressive stress at the neutral layer L. It can also be understood that the bending zone 20b will not be elongated or shortened due to bending at the neutral layer L. As shown in FIG6 , the structures on both sides of the neutral layer L of the bending zone 20b are the tensile stress zone S1 and the compressive stress zone S2, respectively. Among them, the internal stress of the tensile stress zone S1 after bending is tensile stress, and this part of the area will be stretched due to bending; the internal stress of the compressive stress zone S2 after bending is compressive stress, and this part of the area will be compressed due to bending. The farther the structure is from the neutral layer L, the greater its internal stress will be, and the degree of stretching or compression will also increase accordingly.

Please refer to FIG. 7 for a schematic diagram of stress distribution of section B provided in an embodiment of the present application.

According to the relevant principles of material mechanics, the tensile stress zone S1 located on one side of the neutral layer L is stretched and thus subjected to tensile stress; the compressive stress zone S2 located on the other side of the neutral layer L is stretched and thus subjected to tensile stress. Both compressive stress and tensile stress are represented by arrows. The starting point of the arrow is on the section M. The length of the arrow represents the magnitude of the compressive stress or tensile stress. The arrow pointing to the inside of the area represents compressive stress, and the arrow pointing to the outside of the area represents tensile stress. As shown in Figure 7, the farther away from the neutral layer L, the greater the compressive stress or tensile stress, which is reflected in the fact that the farther away from the neutral layer L, the longer the length of the arrow. The line connecting the end of the arrow representing the compressive stress and the end of the arrow representing the tensile stress intersects with the section M, and the intersection represents the position of the neutral layer L.

As shown in FIG7 , for the tensile stress zone S1 of the stretched structure, the deformation caused by stretching is the same for the structures at the same distance from the neutral layer L. However, if the modulus of the structure is increased, the stiffness of the structure with a higher modulus will be greater, and its ability to resist elastic deformation will be stronger. Based on the fact that the deformation that the structure needs to withstand remains unchanged, the structure with a higher modulus undergoes the same deformation and is prone to tensile fracture.

As for the compressed structural pressure stress zone S2, the deformation caused by compression is the same for the structures at the same distance from the neutral layer L. However, if the modulus of the structure is increased, the stiffness of the structure with a higher modulus will be greater, and its ability to resist elastic deformation will be stronger. Based on the fact that the deformation that the structure needs to bear remains unchanged, the structure with a higher modulus will be destroyed by compression if the same deformation occurs.

The position of the neutral layer L can be calculated based on the relevant theories of material mechanics, and can be calculated with the help of a simulation platform in practical applications. When the simulation platform is used to simulate the bending zone 20b of the display screen 100, the necessary inputs may include: a three-dimensional model of the bending zone 20b, the material modulus and thickness of the encapsulation adjustment layer 21, the material modulus and thickness of the first metal layer 22, the material modulus and thickness of the substrate 25, the bending radius of the bending zone 20b, and the bending arc length.

After a large number of simulation calculations, the applicant found that the use of a packaging adjustment layer 21 with a larger elastic modulus can make the neutral layer L of the bending area 20b located in the first metal layer 22, or the neutral layer L is close to the first metal layer 22. Based on the first metal layer 22 located in the bending area 20b, its main function is to transmit signals. It can be understood that when the first metal layer 22 is subjected to tensile stress, the first metal layer 22 may break due to excessive tensile stress, thereby making it difficult or impossible to transmit the signal transmitted from the second non-bending area 20c to the first non-bending area 20a. When the first metal layer 22 is subjected to compressive stress, even if the first metal layer 22 in the bending area 20b is destroyed due to compression, the performance of the material itself will not change, and it can still be used to transmit signals.

According to the above theory, the display screen 100 of the present application improves the material modulus of the encapsulation adjustment layer 21 in the bending zone 20b by setting the material modulus of the encapsulation adjustment layer 21 to be between 0.25GPa-118GPa. In the bending zone 20b, the encapsulation adjustment layer 21 with a larger modulus cooperates with the substrate 25 so that the neutral layer L in the bending zone 20b can be adjusted to the first metal layer 22, or the neutral layer L is close to the first metal layer 22.

When the neutral layer L is located in the first metal layer 22, the overall stress value in the first metal layer 22 is relatively small, and some positions in the first metal layer 22 (the part close to the substrate 25) are subjected to internal compressive stress. Such a structure can effectively reduce the risk of fracture of the first metal layer 22 in the bending area 20b.

When the neutral layer L is located in the packaging adjustment layer 21, the overall stress in the first metal layer 22 is compressive stress, which can also effectively reduce the risk of fracture of the first metal layer 22 in the bending area 20b. At the same time, if the neutral layer L is close to the first metal layer 22 in the packaging adjustment layer 21, the overall stress value in the first metal layer 22 is also relatively small, which can further improve the stress condition of the first metal layer 22 and ensure the reliable operation of the first metal layer 22;

When the neutral layer L is located in the substrate 25 and is close to the first metal layer 22, the overall stress in the first metal layer 22 is tensile stress, but the value of the tensile stress is relatively small, which can also control the risk of fracture of the first metal layer 22 in the bending area 20b to be reduced.

Therefore, the display screen 100 of the present application can control the neutral layer L to be located in the first metal layer 22, or to be close to the first metal layer, by optimizing the layer structure in the bending zone 20b. This can make the first metal layer 22 withstand smaller tensile stress or no tensile stress, thereby reducing the risk of fracture of the first metal layer 22 in the bending zone 20b.

As shown in FIG5 , the packaging adjustment layer 21 is continuously laid in the first non-bending area 20a, the bending area 20b, and the second non-bending area 20c. The substrate 25 and the first metal layer 22 are also continuously laid in the first non-bending area 20a, the bending area 20b, and the second non-bending area 20c. In the first non-bending area 20a and the second non-bending area 20c, the packaging adjustment layer 21 is used to package and protect the first metal layer 22.

In one embodiment, the display panel 20 further includes a back film 23. The back film 23 includes a first back film 231 and a second back film 232. The first back film 231 and the second back film 232 are spaced apart from each other. The first back film 231 is disposed in the first non-bending area 20a, the first back film 231 is located between the substrate 25 and the first surface 30a of the lower stack 30, and the first back film 231 is attached to the first surface 30a of the lower stack 30; the second back film 232 is disposed in the second non-bending area 20c, the second back film 232 is located between the substrate 25 and the second surface 30b of the lower stack 30, and the second back film 232 is attached to the second surface 30b of the lower stack 30. That is, the first back film 231 and the second back film 232 are attached to the opposite sides of the lower stack 30, respectively.

The first back film 231 and the second back film 232 are arranged at intervals, and the display panel 20 located in the bending zone 20b does not have a back film 23 structure. It can be understood that the back film 23 has a certain material modulus and thickness. When the display panel 20 in the bending zone 20b is provided with a back film 23 structure, the back film 23 will affect the position of the neutral layer L in the bending zone 20b, so that the neutral layer L moves toward the direction close to the substrate 25. Correspondingly, when the neutral layer L is located on the side close to the substrate 25, most of the areas in the first metal layer 22 are in a tensile state. In this embodiment, the display screen 100 does not set a back film 23 structure in the bending zone 20b, so that the neutral layer L can move toward the direction of the encapsulation adjustment layer 21, thereby making most of the areas in the first metal layer 22 under pressure, reducing the risk of the first metal layer 22 breaking.

In the manufacturing process of the display screen 100 of the present application, the interval between the first back film 231 and the second back film 232 can be made by the BF Hatching process. In this process, when manufacturing the display panel 20, a complete back film 23 is directly formed on the side of the display panel 20 away from the upper stack 10 (as shown in FIG8), and then the back film 23 located in the bending area 20b is cut and peeled by laser stripping technology, thereby forming a back film 23 with a first back film 231 and a second back film 232 arranged at intervals (as shown in FIG9).

In another embodiment, the spacing between the first back film 231 and the second back film 232 can also be made by the U-Film process. In this process, before the back film 23 is made on the display panel 20, the back film 23 is cut and opened, and then attached to the side of the display panel 20 away from the upper stack 10, so as to directly form the back film 23 with the first back film 231 and the second back film 232 arranged at intervals (as shown in FIG. 9 ).

When adjusting the position of the neutral layer L in the bending area 20b, the greater the material modulus of the encapsulation adjustment layer 21, the thinner the thickness of the corresponding encapsulation adjustment layer 21. It can be understood that the display screen 100 of the present application can reduce the thickness of the encapsulation adjustment layer 21 by setting the encapsulation adjustment layer 21 with a higher modulus, thereby reducing the space occupied by the encapsulation adjustment layer 21 in the electronic device 200.

Therefore, the display screen 100 of the present application sets a packaging adjustment layer 21 with a larger modulus on the side of the first metal layer 22 away from the substrate 25, and removes the back film 23 with a higher modulus and a thicker thickness on the side of the substrate 25, so as to adjust the neutral layer L of the bending area 20b to the first metal layer 22, or the neutral layer L is close to the first metal layer 22, thereby reducing or eliminating the tensile stress borne by the first metal layer 22 in the bending area 20b and reducing the risk of fracture of the first metal layer 22.

In one embodiment, the thickness of the encapsulation adjustment layer 21 is between 5 μm and 25 μm.

The thickness of the encapsulation adjustment layer 21 is relatively thin, which can avoid the interference between the encapsulation adjustment layer 21 and the upper stack 10, thereby ensuring the thickness of the upper stack 10. It avoids the phenomenon that the encapsulation adjustment layer 21 is too thick, occupying the space of the upper stack 10 and thus destroying the strength of the upper stack 10. It can be understood that if the strength of the upper stack 10 is too weak, the fan-out area 103 of the display screen 100 may be damaged, resulting in bright lines, flowery screen and other faults.

Please refer to FIG. 10 , which is a schematic structural diagram of a first metal layer 22 of a display screen 100 provided in an embodiment of the present application.

As shown in FIG10 , in one embodiment, the first metal layer 22 of the display panel 20 may include a stacked first titanium metal layer 221, an aluminum metal layer 222, and a second titanium metal layer 223. The second titanium metal layer 223 is closer to the substrate 25. In this embodiment, the material modulus of the first metal layer 22 is in the range of 72 GPa-118 GPa.

Please refer to FIG. 11 for a schematic structural diagram of a substrate 25 of a display screen 100 provided in an embodiment of the present application.

As shown in FIG11 , the substrate 25 of the display panel 20 includes a first substrate 251, a barrier layer 252, and a second substrate 253 stacked in sequence. The first substrate 251 is attached to the first metal layer 22, the second substrate 253 is close to the back film 23, and the back film 23 is partially attached to the second substrate 253. The first substrate 251 and the second substrate 253 cooperate with each other to carry the remaining layers and components. The barrier layer 252 is located between the first substrate 251 and the second substrate 253 to prevent contamination caused by the diffusion of impurities between the first substrate 251 and the second substrate 253.

In this embodiment, the first substrate 251 and the second substrate 253 may be made of polyimide (PI), and the material modulus of the first substrate 251 and the second substrate 253 is 5.7 GPa. In other embodiments, the first substrate 251 and the second substrate 253 may also be made of at least one of glass, quartz, sapphire, and transparent resin materials. In this embodiment, the barrier layer 252 may be made of silicon oxide, and the material modulus of the barrier layer 252 is 78 GPa. In other embodiments, the barrier layer 252 may also be made of other materials that can be used to prevent the diffusion of impurities between the first substrate 251 and the second substrate 253. The applicant does not make any special restrictions on this.

Please refer to FIG. 12 for a schematic structural diagram of an upper stack 10 of a display screen 100 provided in an embodiment of the present application.

As shown in FIG12 , the upper stack 10 includes a cover plate 11 and a support layer 12 , wherein the support layer 12 is closer to the display panel 20 than the cover plate 11 .

The cover plate 11 is used to contact the outside world and bear external pressure. The support layer 12 is arranged between the cover plate 11 and the display panel 20 to support the cover plate 11. At the same time, the cooperation between the support layer 12 and the cover plate 11 can also increase the compressive strength of the upper stack 10, avoiding the possibility of bright lines, screen noise and other faults in the display screen 100 of the present application due to the low compressive strength of the upper stack 10.

On the other hand, the support layer 12 can accommodate the projections of the display panel 20 and the lower stack 30 on the support layer 12, so that the support layer 12 can be used to protect the display panel 20 and the lower stack 30. It can be understood that when the display screen 100 of the present application has a touch function, the support layer 12 also has the function of transmitting the external pressure carried by the cover plate 11 to the display screen 100, so as to realize the touch function of the display screen 100.

In this embodiment, the support layer 12 includes at least one of a polarizer, an ultra-thin glass, and a buffer layer. In other embodiments, the support layer 12 may also be composed of other structures. The applicant does not make any special restrictions on this.

Please refer to FIG. 13 for a schematic structural diagram of a lower stack 30 of a display screen 100 provided in an embodiment of the present application.

As shown in Figure 13, the lower stack 30 includes a lining plate 31 and a support plate 32. Among them, the support plate 32 is closer to the first non-bending area 20a than the lining plate 31. The support plate 32 is used to support the display panel 20 and the upper stack 10 located on the side of the support plate 32 away from the lining plate 31. The lining plate 31 is located between the support plate 32 and the second non-bending area 20c, and is stacked with the support plate 32, and the projection of the lining plate 31 on the second non-bending area 20c is accommodated in the second non-bending area 20c. Based on the second non-bending area 20c, it is electrically connected to the driver chip. The lining plate 31 can also be used to carry a driver chip electrically connected to the second non-bending area 20c.

Please refer to FIG. 14 for a schematic structural diagram of an adhesive layer 40 of a display screen 100 provided in an embodiment of the present application.

As shown in FIG14 , the display screen 100 of the present application further includes an adhesive layer 40, which is located between the upper stack 10 and the display panel 20, and is used to bond the upper stack 10 and the display panel 20. The adhesive layer 40 is contained in the first non-bending area 20a, so as to ensure the bonding effect between the display panel 20 and the upper stack 10 while avoiding occupying the space required by the bending area 20b, thereby affecting the position adjustment of the neutral layer L in the bending area 20b.

At the same time, please refer to Figure 5. The thickness of the adhesive layer 40 should be greater than or equal to the thickness of the encapsulation adjustment layer 21 to avoid interference between the encapsulation adjustment layer 21 and the upper stack 10. The thickness of the adhesive layer 40 can ensure the thickness of the upper stack 10, avoiding the reduction of the compressive strength of the upper stack 10 due to the upper stack 10 being too thin. Since the material of the adhesive layer 40 should be a glue material with bonding function. It can be understood that in order to ensure the bonding effect of the adhesive layer 40, the thickness of the adhesive layer 40 should not be set too thick. Based on the relatively thin thickness of the encapsulation adjustment layer 21, the thickness of the adhesive layer 40 should also be set thinner to reduce the thickness of the display screen 100 of the present application. Exemplarily, the thickness of the adhesive layer 40 can be 25μm.

Please refer to FIG. 15 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG15 , the upper stack 10 of the display screen 100 of the present application further includes a shielding layer 13. The shielding layer 13 is located between the support layer 12 and the cover plate 11, and is located on the side of the bending area 20b close to the display panel 20. The shielding layer 13 partially extends into the first non-bending area 20a, and the projection of the shielding layer 13 on the adhesive layer 40 partially overlaps with the adhesive layer 40. It can be understood that the shielding layer 13 has a shielding effect, so as to shield the boundary of the adhesive layer 40. In a possible embodiment, the shielding layer 13 can be made of a photoresist material.

Please refer to FIG. 16 which is a schematic diagram of the structure of a display screen 100' in the prior art, and FIG. 17 which is another schematic diagram of the structure of a display screen 100' in the prior art.

Please refer to FIG. 5 , and it can be understood that the structure of the display screen 100 ′ in the prior art is basically the same as that of the display screen 100 of the present application. In the prior art, the display screen 100 ′ includes an upper stack 10 ′, a display panel 20 ′, a lower stack 30 ′, a micro coating layer 40 ′ (micro coating layer, MCL), and an adhesive layer 50 ′. The display panel 20 ′ includes a first non-bending area 20a ′, a bending area 20b ′, and a second non-bending area 20c ′ connected in sequence, and the first non-bending area 20a ′ and the second non-bending area 20c ′ are respectively attached to the opposite sides of the lower stack 30 ′, and the upper stack 10 ′ is located on the side of the first non-bending area 20a ′ away from the lower stack 30 ′. The adhesive layer 50 ′ is bonded between the upper stack 10 ′ and the display panel 20 ′, and the adhesive layer 50 ′ is contained in the first non-bending area 20a ′, so as to bond the upper stack 10 ′ and the display panel 20 ′.

The display panel 20' includes a back film 23', a substrate 24', a metal layer 22' and an encapsulation layer 21' stacked in sequence. The back film 23' includes a first back film 231' and a second back film 232' spaced apart from each other. The first back film 231' is located between the first non-bending area 20a' and the lower stack 30', and the second back film 232' is located between the second non-bending area 20c' and the lower stack 30'. The substrate 24' and the encapsulation layer 21' are arranged on both sides of the metal layer 22'.

Micro coating 40’ (micro coating layer, MCL) is generally made of photosensitive adhesive (UV adhesive), and the material modulus of the micro coating corresponding to this material is 0.2GPa.

The micro coating 40' is attached to the display panel 20' of the bending area 20b' and is located on the side of the encapsulation layer 21' away from the metal layer 22', and the two opposite ends of the micro coating 40' extend toward the first non-bending area 20a' and the second non-bending area 20c' respectively. Since the micro coating 40' is generally made of photosensitive adhesive, and the photosensitive adhesive has fluidity. It can be understood that the two opposite ends of the micro coating 40' extend toward the first non-bending area 20a' and the second non-bending area 20c' respectively, which is conducive to ensuring the thickness of the micro coating 40' located in the bending area 20b'.

In the prior art, the micro coating 40' with a relatively low modulus is thicker, thus occupying more space in the display screen 100'. It can be understood that, as shown in FIG16, when the neutral layer L' of the bending area 20b' is ensured to be located at the metal layer 22', the micro coating 40' is too thick, thus occupying the setting space of the upper stack 10', thereby making the upper stack 10' thinner, and further reducing the compressive strength of the upper stack 10'.

Please refer to the structural schematic diagram of the B’ section of the bending zone 20b’ in the prior art shown in Figure 18, wherein Figure 18 shows the B’ section of the bending zone 20b’ shown in Figure 17.

In order to ensure that the design of the micro coating 40' does not occupy the space of the upper stack 10'. As shown in Figures 17 and 18, the thickness of the micro coating 40' is lower than the thickness of the micro coating 40' shown in Figure 16, so that the neutral layer L' of the bending area 20b' is located on the substrate 24', so that the metal layer 22' is subjected to tensile stress. The elastic modulus of the metal layer 22' is relatively large, and the corresponding material stiffness is greater. When the metal layer 22' gradually forms the bending area 20b' as the display panel 20' is bent, the metal layer 22' located in the tensile stress area S1 will stretch when bent under the action of tensile stress. It can be understood that when the bending curvature of the bending area 20b' remains unchanged, the greater the stiffness of the metal layer 22', the greater the tensile stress it bears, and correspondingly, the greater the possibility of fracture.

It is understandable that if the metal layer 22’ breaks, it will make it difficult or impossible to transmit the signal transmitted from the second non-bending area 20c’ to the first non-bending area 20a’, thereby affecting the display function of the first non-bending area 20a’ and further affecting the display function of the display screen 100’.

Therefore, the display screen 100 of the present application is provided with a packaging adjustment layer 21 stacked with the first metal layer 22, so that the packaging adjustment layer 21 located in the first non-bending area 20a and the packaging adjustment layer 21 located in the bending area 20b have the same material. It can be understood that the packaging adjustment layer 21 is designed to have a modulus between 0.25GPa and 118GPa, which can make the material modulus of the packaging adjustment layer 21 greater than the material modulus of the micro coating 40', and make the thickness of the packaging adjustment layer 21 relatively thin.

Based on the relatively large modulus of the material used for the packaging adjustment layer 21 in the first non-bending area 20a, the modulus of the material of the packaging adjustment layer 21 in the bending area 20b is also relatively large. With the cooperation of the thickness of the packaging adjustment layer 21, the position of the neutral layer L in the bending area 20b changes, thereby reducing the risk of breakage of the first metal layer 22.

Please refer to FIG. 19 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG. 19 , in one embodiment, the encapsulation adjustment layer 21 includes an encapsulation layer 211 and an adjustment layer 212. The encapsulation layer 211 is continuously laid on the first non-bending area 20a, the bending area 20b, and the second non-bending area 20c, and the encapsulation layer 211 covers the surface of the first metal layer 22, so that the encapsulation layer 211 can protect the first metal layer 22. That is, the encapsulation adjustment layer 21 in the bending area 20b includes the encapsulation layer 211 and the adjustment layer 212, and the encapsulation adjustment layer 21 in the first non-bending area 20a and the second non-bending area 20c includes the encapsulation layer 211.

The adjustment layer 212 is located in the bending area 20b on the side of the packaging layer 211 away from the first metal layer 22. The adjustment layer 212 has two opposite ends, which extend toward the first non-bending area 20a and the second non-bending area 20c respectively to ensure that the adjustment layer 212 covers the bending area 20b.

It can be understood that the material modulus and thickness of the adjustment layer 212 covering the bending zone 20b cooperate with the material modulus and thickness of the packaging layer 211 located in the bending zone 20b to work together to achieve the adjustment of the neutral layer L in the bending zone 20b.

In one embodiment, as shown in Fig. 19, a display area 20d is provided in the first non-bending area 20a. When a signal is transmitted from the first metal layer 22 in the bending area 20b to the first non-bending area 20a, the display area 20d receives the signal and emits light outward under the action of the signal to realize the display function of the display area 20d, thereby realizing the display function of the display screen 100 of the present application.

The display area 20d includes a functional layer 24, which is located on the side of the encapsulation adjustment layer 21 away from the first metal layer 22. The functional layer 24 can be a composite layer structure with multiple layer structures to achieve specific functions of the display area 20d. Exemplarily, the specific functions may include filtering, increasing light intensity, adjusting light type, touch function, and protection function.

It can be understood that the material of the adjustment layer 212 is the same as at least part of the material in the functional layer 24, so that during the production process of the display screen 100 of the present application, the adjustment layer 212 and the functional layer 24 can be produced simultaneously, thereby reducing the production cost of the display screen 100 of the present application and improving processing efficiency.

The material modulus of the encapsulation adjustment layer 21 is between 0.25 GPa and 118 GPa, and the material of the encapsulation adjustment layer 21 may be an organic material or a metal.

In one embodiment, the material of the functional layer 24 includes an organic material, the material of the adjustment layer 212 is correspondingly an organic material, and the thickness of the adjustment layer 212 is between 15 μm and 25 μm, and the modulus of the material in the adjustment layer 212 is between 0.25 GPa and 12 GPa.

Please refer to FIG. 20 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG20 , the functional layer 24 includes a filter layer 241, a touch layer 242, a thin film encapsulation layer 244, and a microlens array 243 stacked in sequence. It is understandable that in other embodiments, the functional layer 24 may include any one, two, or three of the filter layer 241, the touch layer 242, the thin film encapsulation layer 244, and the microlens array 243. Among them, the filter layer 241 is used to reduce the reflected light of the external environment, the touch layer 242 is used to realize the touch control of the user, the thin film encapsulation layer 244 is used to prevent the pollution of the external environment, and the microlens array 243 is used to improve the display effect of the display screen.

In this embodiment, when the functional layer 24 adopts the filter layer 241, the touch layer 242, the thin film encapsulation layer 244 and the microlens array 243, the materials of the corresponding functional layer 24 are mostly organic materials, and the modulus of some materials in the corresponding functional layer 24 is relatively high. It can be understood that when some materials in the above-mentioned functional layer 24 with a higher modulus are used to simultaneously manufacture the adjustment layer 212, the material of the adjustment layer 212 in the corresponding bending area 20b also has a higher modulus, and the thickness of the corresponding adjustment layer 212 is reduced.

In one embodiment, the adjustment layer 212 may be a composite layer structure and include a plurality of sub-adjustment layers 212a. Please refer to FIG. 20 , the sub-adjustment layer 212a is made of the same material as at least one of the functional layers 24. Thus, each sub-adjustment layer 212a can be made synchronously with a structure in the functional layer, without the need to make the structure of the adjustment layer 212 in the bending area 20b alone, thereby simplifying the manufacturing process of the display panel 20. It is understandable that when each sub-adjustment layer 212a is made synchronously with the corresponding material in the functional layer 24, the stacking order of each sub-adjustment layer 212a in the adjustment layer 212 is the same as the manufacturing order of the corresponding material in the functional layer 24.

Please refer to FIG. 21 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG. 21 . The functional layer 24 of the display area 20d includes a filter layer 241. The filter layer 241 includes a light shielding layer 2411, a color filter unit 2412, and a filter protection layer 2413. The light shielding layer 2411 is arranged on the side of the encapsulation layer 211 away from the first metal layer 22 to block the light incident on the surface of the light shielding layer 2411. A plurality of color filter units 2412 are provided and are embedded in the light shielding layer 2411 at intervals to filter light of a color different from that of the color filter unit 2412. The filter protection layer 2413 is located on the side of the light shielding layer 2411 away from the encapsulation layer 211 to protect the light shielding layer 2411 and the color filter unit 2412.

In this embodiment, the adjustment layer 212 corresponds to the light shielding layer 2411, the color filter unit 2412, and the filter protection layer 2413 of the filter layer 241, and the first sub-adjustment layer 2121, the second sub-adjustment layer 2122, and the third sub-adjustment layer 2123 are respectively and synchronously manufactured. It can be understood that the first sub-adjustment layer 2121 and the light shielding layer 2411 are made of the same material, the second sub-adjustment layer 2122 and the color filter unit 2412 are made of the same material, and the third sub-adjustment layer 2123 and the filter protection layer 2413 are made of the same material, so as to utilize the material with a higher modulus in the functional layer 24 to achieve the position adjustment of the neutral layer L in the bending area 20b.

As shown in FIG. 21 , since the light shielding layer 2411 can shield the light irradiating the surface of the light shielding layer 2411, and the material of the first sub-adjusting layer 2121 is the same as that of the light shielding layer 2411, the first sub-adjusting layer 2121 can face the first non-bending area 20a and be used to form the boundary of the display area 20d, thereby relying on the light shielding effect of the material of the light shielding layer 2411 to prevent the light emitted by the display area 20d from passing through the boundary of the display area 20d and emitting outward, thereby affecting the display effect of the display screen 100 of the present application.

On the other hand, the light shielding layer 2411 of the display screen 100 of the present application is manufactured by processes such as coating, exposure and development, and in the manufacturing process of the display screen 100 of the present application, the manufacturing accuracy of the light shielding layer 2411 is relatively high, so that the manufacturing accuracy of the boundary of the display area 20d is also improved simultaneously. It can be understood that in other embodiments, the light shielding layer 2411 can also be manufactured by other process methods with relatively high manufacturing accuracy.

In the prior art, a structure similar to the shielding layer 13 shown in FIG. 15 may be used as the boundary of the display area 20d. The shielding layer 13 is usually prepared by mimeographing or the like, and its manufacturing precision is relatively low. In this embodiment, the first sub-adjusting layer 2121 is used to form the boundary of the display area 20d, which can improve the boundary size precision of the display area 20d.

In the prior art, in order to ensure the thickness of the micro coating 40', the micro coating 40' needs to be extended more into the first non-bending area 20a', so that the boundary of the adhesive layer 50' is relatively far away from the bending area 20b'. Exemplarily, the distance between the boundary of the adhesive layer 50' and the micro coating 40' is 0.18mm. At this time, if a structure similar to the shielding layer 13 shown in Figure 15 is used as the boundary of the display area 20d, the manufacturing tolerance of the shielding layer 13 (using the mimeograph method, the tolerance is 0.03mm) and the assembly tolerance (the assembly of the upper stack 10' needs to reserve a width of 0.1mm to ensure the shielding effect) are accumulated, which may cause the structure of the shielding layer 13 to deviate by 0.31mm (0.18mm+0.03mm+0.1mm) toward the display area 20d.

In this embodiment, the first sub-adjustment layer 2121 is used to form the boundary of the display area 20d. The first sub-adjustment layer 2121 can be made by deposition or evaporation with the light shielding layer 2411. The precision of deposition or evaporation is relatively high. With the thickness of the adjustment layer 212 reduced, the boundary position of the adhesive layer 40 can extend in the direction away from the display area 20d, so that the frame of the display screen 100 of the present application is relatively narrowed. That is, the first sub-adjustment layer 2121 is used as the boundary of the display area 20d, eliminating the influence of the distance between the shielding layer 13 and the micro-coating 40', the manufacturing tolerance and assembly tolerance of the shielding layer 13, and the frame width of the display screen 100 of the present application can be reduced by about 0.31mm.

In one embodiment, the material modulus of the filter layer 241 is between 1.5 GPa and 12 GPa.

In one embodiment, the second sub-adjustment layer 2122 may also be a multi-layer structure, wherein each layer structure corresponds to the material of a color filter unit in the color filter unit 2412. Exemplarily, the color filter unit 2412 includes a red filter unit, a green filter unit, and a blue filter unit. The second sub-adjustment layer 2122 is formed by one, two, or three of a red filter material, a green filter material, and a blue filter material. Among them, when the second sub-adjustment layer 2122 is a multi-layer structure formed by two or three filter materials, the stacking order of each layer of filter material is also the same as the manufacturing order of the filter material in the display area 20d. It can be understood that in other embodiments, the color filter unit 2412 may also include filter units of other colors. Correspondingly, the second sub-adjustment layer 2122 may also include a layer structure formed by filter materials of other colors.

In one embodiment, the light shielding layer 2411 is made of acrylic acid; the color filter unit 2412 is made of acrylic acid; and the filter protection layer 2413 is made of acrylic acid or siloxane.

In one embodiment, the material modulus of the light shielding layer 2411 is 12 GPa; the material modulus of the color filter unit 2412 is between 1.5 GPa and 3.54 GPa; and the material modulus of the filter protection layer 2413 is 4.6 GPa.

Please refer to FIG. 22 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG22 , the functional layer 24 includes a touch layer 242, and the touch layer 242 includes a stacked touch buffer layer 2421, a touch insulating layer 2422, and a touch protection layer 2423. The touch buffer layer 2421 is closer to the encapsulation layer 211 than the touch insulating layer 2422 and the touch protection layer 2423.

In this embodiment, the adjustment layer 212 corresponds to the touch buffer layer 2421, the touch insulating layer 2422, and the touch protection layer 2423 of the touch layer 242, and the fourth sub-adjustment layer 2124, the fifth sub-adjustment layer 2125, and the sixth sub-adjustment layer 2126 are respectively and synchronously manufactured. It can be understood that the fourth sub-adjustment layer 2124 and the touch buffer layer 2421 are made of the same material, the fifth sub-adjustment layer 2125 and the touch insulating layer 2422 are made of the same material, and the sixth sub-adjustment layer 2126 is made of the same material. The adjustment layer 2126 and the touch protection layer 2423 are made of the same material, so as to utilize the material with a higher modulus in the functional layer 24 to achieve position adjustment of the neutral layer L in the bending area 20 b.

In one embodiment, the material modulus of the touch layer 242 is greater than or equal to 4.6 GPa.

In one embodiment, the touch buffer layer 2421 , the touch insulating layer 2422 , and the touch protection layer 2423 are all made of acrylic acid or siloxane.

In one embodiment, the material modulus of the touch buffer layer 2421 , the touch insulation layer 2422 , and the touch protection layer 2423 are all 4.6 GPa.

Please refer to FIG. 23 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG23 , the functional layer 24 includes a microlens array 243, and the microlens array 243 includes a first lens layer 2431 and a second lens layer 2432 having different refractive indices. In this embodiment, the refractive index of the first lens layer 2431 is less than that of the second lens layer 2432, and the first lens layer 2431 is closer to the encapsulation layer 211 than the second lens layer 2432. It can be understood that in another embodiment, the refractive index of the second lens layer 2432 is less than that of the first lens layer 2431, and the second lens layer 2432 is closer to the encapsulation layer 211 than the first lens layer 2431.

In this embodiment, the adjustment layer 212 corresponds to the first lens layer 2431 and the second lens layer 2432 of the microlens array 243, and the seventh sub-adjustment layer 2127 and the eighth sub-adjustment layer 2128 are respectively and synchronously manufactured. It can be understood that the seventh sub-adjustment layer 2127 and the first lens layer 2431 are made of the same material, and the eighth sub-adjustment layer 2128 and the second lens layer 2432 are made of the same material, so as to utilize the material with a higher modulus in the functional layer 24 to achieve the position adjustment of the neutral layer L in the bending area 20b.

In one embodiment, the material modulus of the microlens array 243 is between 0.25 GPa and 5.4 GPa.

In one embodiment, the first lens layer 2431 and the second lens layer 2432 are both made of acrylic acid or silicone.

In one embodiment, the material modulus of the first lens layer 2431 is 0.25 GPa; and the material modulus of the second lens layer 2432 is 5.4 GPa.

Please refer to FIG. 24 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG24 , the functional layer 24 includes a thin film encapsulation layer 244, and the thin film encapsulation layer 244 includes an inkjet printing layer 2441. In this embodiment, the adjustment layer 212 corresponds to the inkjet printing layer 2441 of the thin film encapsulation layer 244, and the ninth sub-adjustment layer 2129 is simultaneously manufactured. It can be understood that the ninth sub-adjustment layer 2129 and the inkjet printing layer 2441 are made of the same material, so as to utilize the material with a higher modulus in the functional layer 24 to achieve the position adjustment of the neutral layer L in the bending area 20b.

In one embodiment, the material modulus of the thin film encapsulation layer 244 is greater than or equal to 3.4 GPa.

In one embodiment, the inkjet printing layer 2441 is prepared using one of acrylic acid, novolac epoxy resin, and silicone.

In one embodiment, the material modulus of the inkjet printed layer 2441 is 3.4 GPa.

Please refer to FIG. 25 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG. 25 , the encapsulation layer 211 includes a stacked first pixel definition layer 2111 and a first flat layer 2112. The first flat layer 2112 is coated on the relatively rough surface of the first metal layer 22, thereby providing a relatively flat surface. The first pixel definition layer 2111 is located on the surface of the first flat layer 2112 away from the first metal layer 22. The first pixel definition layer 2111 located in the display area 20d is used to realize the positioning of the light-emitting unit (not shown in the figure).

It can be understood that the first pixel definition layer 2111 located in the bending zone 20b has a higher material modulus and a certain thickness. The material modulus and thickness of the first pixel definition layer 2111 are used to cooperate with the thickness and modulus of the substrate 25, the first metal layer 22, and the first flat layer 2112, so as to adjust the neutral layer L of the bending zone 20b to the first metal layer 22, or the neutral layer L is close to the first metal layer 22.

As mentioned above, the material of the encapsulation adjustment layer 21 can also be metal. Please refer to FIG. 26 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG26 , the encapsulation layer 211 includes a second flat layer 2113, and the functional layer 24 includes a second metal layer 245. In the display area 20d, the second flat layer 2113 is located between the first metal layer 22 and the second metal layer 245 to achieve insulation between the first metal layer 22 and the second metal layer 245.

At the same time, in the display area 20d, the second metal layer 245 can be patterned to form structures such as electrodes or pads of the display panel 20. The second metal layer 245 can cooperate with the first metal layer 22 to transmit electrical signals in the display area 20d to form a voltage difference, thereby driving the devices in the display area 20d to emit light and display.

After the second metal layer 245 extends from the first non-bending area 20a to the bending area 20b, it can be constructed as a part of the adjustment layer 212. Since the material modulus of the second metal layer 245 is relatively high, in this embodiment, the material modulus of the adjustment layer 212 can be further improved by simultaneously making the adjustment layer 212 with the material of the second metal layer 245, thereby reducing the thickness of the adjustment layer 212 required for the display screen 100 of the present application.

In one embodiment, the material modulus of the second planar layer 2113 is between 10 GPa and 15 GPa; and/or the material modulus of the second metal layer 245 is between 72 GPa and 118 GPa.

In one embodiment, as shown in FIG26 , the second metal layer 245 in the bending region 20b is provided with at least one pressure relief groove 2451. The pressure relief groove 2451 is distributed on a side of the second metal layer 245 close to the substrate 25, and the length direction of the pressure relief groove 2451 is parallel to the bending axis of the bending region 20b.

In this embodiment, since the second metal layer 245 is made of metal material, when the neutral layer L of the bending area 20b is located near the second metal layer 245, When the second metal layer 245 is on one side of the back film 23, the second metal layer 245 will be subjected to a large bending stress, and the bending stress causes the opposite sides of the second metal layer 245 to be stretched. It can be understood that when the bending stress is too large, it may cause the second metal layer 245 to break. Therefore, the second metal layer 245 in the bending area 20b is provided with a pressure relief groove, which can reduce the bending stress of the second metal layer 245 in the bending area 20b, thereby avoiding the second metal layer 245 from breaking due to excessive bending stress.

For ease of description, FIG26 appropriately increases the depth of the decompression groove 2451, and expands the width and spacing of the decompression groove 2451. For the actual display screen 100 structure, the depth of the decompression groove 2451 may be relatively small, and the width and spacing of the decompression groove 2451 are also relatively small. The decompression groove 2451 is formed on the surface of the second metal layer 245 close to the substrate 25 as a micro-texture structure to reduce the bending stress of the second metal layer 245 in the bending area 20b.

In one embodiment, as shown in FIG26 , the adjustment layer 212 further includes a stacked second pixel definition layer 212b and a third flat layer 212c. The third flat layer 212c is located on a side of the second metal layer 245 away from the second flat layer 2113 and covers the second metal layer 245. The second pixel definition layer 212b is located on a side of the third flat layer 212c away from the second metal layer 245.

Since the second metal layer 245 has a relatively rough surface, the third flat layer 212c is coated on the surface of the second metal layer 245 away from the second flat layer 2113 to provide a relatively flat surface.

It can be understood that the second pixel definition layer 212b is located in the bending zone 20b and has a certain material modulus and thickness, so as to cooperate with the thickness and modulus of the substrate 25, the first metal layer 22, the second flat layer 2113, the second metal layer 245, and the third flat layer 212c, so as to adjust the neutral layer L of the bending zone 20b to the first metal layer 22, or the neutral layer L is close to the first metal layer 22.

Please refer to FIG. 27 for another structural schematic diagram of a display screen 100 provided in an embodiment of the present application.

As shown in FIG27 , the encapsulation adjustment layer 21 includes a first encapsulation area 21a, an adjustment area 21b, and a second encapsulation area 21c connected in sequence. The first encapsulation area 21a is located in the first non-bending area 20a to encapsulate the first non-bending area 20a and protect the first metal layer 22 located in the first non-bending area 20a. The second encapsulation area 21c is located in the second non-bending area 20c to encapsulate the second non-bending area 20c and protect the first metal layer 22 located in the second non-bending area 20c.

In this embodiment, the encapsulation adjustment layer 21 in the bending area 20b is constructed as an adjustment area 21b. The adjustment area 21b is independently made in the bending area 20b, connected between the first encapsulation area 21a and the second encapsulation area 21c, and used to adjust the position of the neutral layer L in the bending area 20b.

In one embodiment, the adjustment area 21b can be made by inkjet printing, and the material of the inkjet printing is acrylic acid, phenolic epoxy resin, or siloxane. In another embodiment, the adjustment area 21b can also be made by vapor deposition, and the material of the vapor deposition is silicon oxide or silicon nitride.

In one embodiment, the thickness of the adjustment zone 21b is between 15 μm and 25 μm, and the material modulus of the adjustment zone 21b is between 0.25 GPa and 12 GPa. It can be understood that, on the basis of ensuring the overall thickness of the bending zone 20b, the present application can be used to adjust the position of the neutral layer L of the bending zone 20b in combination with the thickness and modulus of the adjustment zone 21b.

Based on the beneficial effect of reducing the fracture risk of the first metal layer 22 in the bending area 20b of the display screen 100 of the present application, the electronic device 200 of the present application also has the beneficial effect of improving the structural rigidity of the first metal layer 22 in the bending area 20b and reducing the volume of the display screen 100 due to the use of the display screen 100 provided by the present application. In this way, the signal transmission reliability of the electronic device 200 is ensured, the frame is narrowed, and the user experience is improved.

The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

A display screen, characterized in that it comprises an upper stack, a display panel and a lower stack, the display panel comprises a first non-bending area, a bending area and a second non-bending area connected in sequence, the first non-bending area and the second non-bending area are respectively attached to opposite sides of the lower stack, and the upper stack is located on the side of the first non-bending area away from the lower stack;

The display panel includes a substrate, a first metal layer and a packaging adjustment layer stacked in sequence, the material modulus of the packaging adjustment layer is between 0.25GPa-118GPa, and in the bending area, the packaging adjustment layer is used to adjust the neutral layer position of the display panel so that the neutral layer is located within the first metal layer, or the neutral layer is close to the first metal layer.
The display screen according to claim 1 is characterized in that the encapsulation adjustment layer in the bending area includes an encapsulation layer and an adjustment layer, the encapsulation layer is located between the first metal layer and the adjustment layer, the encapsulation layer is used to cover and protect the first metal layer, and the encapsulation layer and the adjustment layer work together to adjust the position of the neutral layer.
The display screen according to claim 2, characterized in that a display area is provided in the first non-bending area, the display area comprises a functional layer, and the functional layer is located on a side of the packaging adjustment layer away from the first metal layer;

The functional layer is a composite layer structure, the material of the adjustment layer is the same as at least part of the material of the functional layer, and the adjustment layer and the functional layer are manufactured synchronously.
The display screen according to claim 3, characterized in that the adjustment layer comprises a plurality of stacked sub-adjustment layers, and the material in the sub-adjustment layers is the same as at least one material in the functional layer.
The display screen according to claim 3 or 4 is characterized in that the material of the functional layer includes organic material, the material of the adjustment layer is all organic material, the thickness of the adjustment layer is between 15 μm and 25 μm, and the modulus of the material in the adjustment layer is between 0.25 GPa and 12 GPa.
The display screen according to any one of claims 3 to 5, characterized in that the functional layer comprises at least one of a filter layer, a touch layer, a thin film encapsulation layer and a microlens array.
The display screen according to claim 6, characterized in that the functional layer includes the filter layer, and the filter layer includes a light shielding layer, a color filter unit, and a filter protection layer;

The adjustment layer includes at least one of a first sub-adjustment layer made of the same material as the light shielding layer, a second sub-adjustment layer made of the same material as the color filter unit, and a third sub-adjustment layer made of the same material as the filter protection layer.
The display screen according to claim 7, characterized in that the first sub-adjustment layer extends from the bending area portion into the first non-bending area, and the first sub-adjustment layer in the first non-bending area forms a boundary of the display area.
The display screen according to any one of claims 6 to 8, characterized in that the functional layer includes the touch layer, and the touch layer includes a stacked touch buffer layer, a touch insulation layer and a touch protection layer;

The adjustment layer includes at least one of a fourth sub-adjustment layer made of the same material as the touch buffer layer, a fifth sub-adjustment layer made of the same material as the touch insulation layer, and a sixth sub-adjustment layer made of the same material as the touch protection layer.
The display screen according to any one of claims 6 to 9, characterized in that the functional layer includes the microlens array, and the microlens array includes a first lens layer and a second lens layer with different refractive indices;

The adjustment layer includes a seventh adjustment sub-layer made of the same material as that of the first lens layer, and/or includes an eighth adjustment sub-layer made of the same material as that of the second lens layer.
The display screen according to any one of claims 6 to 10, characterized in that the functional layer includes a thin film encapsulation layer, the thin film encapsulation layer includes an inkjet printing layer, and the adjustment layer includes a ninth sub-adjustment layer made of the same material as the inkjet printing layer.
The display screen according to any one of claims 2 to 11 is characterized in that the packaging adjustment layer in the first non-bending area and the second non-bending area includes the packaging layer, and the packaging layer includes a stacked first pixel definition layer and a first flat layer, and the first flat layer is located between the first pixel definition layer and the first metal layer.
The display screen according to any one of claims 2 to 4 is characterized in that the packaging adjustment layer in the first non-bending area and the second non-bending area includes the packaging layer, and the packaging layer includes a second flat layer, the functional layer includes a second metal layer, and the second metal layer extends from the first non-bending area to the bending area and is constructed as a part of the adjustment layer.
The display screen according to claim 13, characterized in that the material modulus of the second flat layer is between 10 GPa and 15 GPa; and/or

The material modulus of the second metal layer ranges from 72 GPa to 118 GPa.
The display screen according to claim 13 or 14 is characterized in that the second metal layer in the bending zone is provided with at least one decompression groove, the length direction of the decompression groove is parallel to the bending axis of the bending zone, and the decompression groove is used to reduce the bending stress of the second metal layer.
The display screen according to any one of claims 13 to 15 is characterized in that the adjustment layer also includes a stacked second pixel definition layer and a third flat layer, the third flat layer covers the second metal layer, the third flat layer is located on the side of the second metal layer away from the second flat layer, and the third flat layer is also located between the second pixel definition layer and the second metal layer.
The display screen according to claim 1 is characterized in that the encapsulation adjustment layer in the bending area includes an adjustment area, the thickness of the adjustment area is between 15 μm and 25 μm, and the material modulus of the adjustment area is between 0.25 GPa and 12 GPa.
The display screen according to any one of claims 1-17 is characterized in that the display panel in the first non-bending area includes a first back film, and the display panel in the second non-bending area includes a second back film, and the first back film and the second back film are respectively adhered to opposite sides of the lower stack.
The display screen according to any one of claims 1 to 18 is characterized in that the upper stack comprises a supporting layer and a cover plate stacked in sequence, the supporting layer is located between the cover plate and the display panel, and the projections of the display panel and the lower stack on the upper stack are accommodated in the supporting layer.
The display screen according to claim 19 is characterized in that an adhesive layer is provided between the upper stack and the display panel, the adhesive layer is accommodated in the first non-bending area, and the thickness of the adhesive layer is greater than or equal to the thickness of the adjustment layer.
The display screen according to claim 20 is characterized in that the upper stack includes a shielding layer, the shielding layer is located between the supporting layer and the cover plate, the shielding layer is located on the side of the bending area close to the display panel, the shielding layer also partially extends into the first non-bending area, and the projection of the shielding layer on the adhesive layer partially overlaps with the adhesive layer.
The display screen according to any one of claims 1-21 is characterized in that the lower stack includes a stacked backing plate and a support plate, the support plate is located between the backing plate and the upper stack, and the projection of the backing plate in the second non-bending area is contained in the second non-bending area.
An electronic device, characterized in that it comprises a housing and a display screen according to any one of claims 1 to 22, wherein the display screen is embedded in the housing, and the display screen is used to realize a display function of the electronic device.