WO2023082750A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2023082750A1
WO2023082750A1 PCT/CN2022/113558 CN2022113558W WO2023082750A1 WO 2023082750 A1 WO2023082750 A1 WO 2023082750A1 CN 2022113558 W CN2022113558 W CN 2022113558W WO 2023082750 A1 WO2023082750 A1 WO 2023082750A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
shielding
heat conduction
heat
plate
Prior art date
Application number
PCT/CN2022/113558
Other languages
English (en)
French (fr)
Other versions
WO2023082750A9 (zh
Inventor
张洪
董绍洪
乔艳党
李奋英
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US18/043,840 priority Critical patent/US20240284636A1/en
Priority to EP22856865.5A priority patent/EP4203638A4/en
Publication of WO2023082750A1 publication Critical patent/WO2023082750A1/zh
Publication of WO2023082750A9 publication Critical patent/WO2023082750A9/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet

Definitions

  • the embodiment of the present application relates to the technical field of terminals, and in particular to an electronic device.
  • An embodiment of the present application provides an electronic device, which can improve the heat dissipation effect and realize rapid heat dissipation of the electronic device.
  • the first aspect of the present application provides an electronic device.
  • Electronic equipment includes at least a main board, electronic components and shielding components.
  • the electronic device is arranged on the main board.
  • the shielding assembly includes a shielding case, a capillary structure and a heat conducting plate.
  • Electronic devices are located within and connected to the shield.
  • the main board and the shielding cover are connected to form a shielding space to shield electronic devices.
  • the thermally conductive plate is located on the side of the shield facing away from the electronics.
  • the heat conducting plate is connected to the shield and forms a sealed chamber.
  • the capillary structure is arranged in the sealed chamber.
  • the sealed chamber is filled with working fluid.
  • the sealed chamber includes an evaporation zone and a condensation zone.
  • the evaporation zone is located above the electronics.
  • the capillary structure is used to make the working fluid flow back from the condensation area to the evaporation area.
  • a capillary structure is provided between the shield cover and the heat conduction plate of the shield assembly.
  • the working fluid can circulate and exchange heat between the evaporation zone and the condensation zone, so that the heat at the electronic device can be conducted to the area of the shielding assembly away from the electronic device.
  • the shielding assembly of the embodiment of the present application can increase the heat dissipation area and heat dissipation rate, thereby improving heat dissipation efficiency, realizing rapid cooling of electronic devices, and improving heat dissipation effect.
  • the capillary structure and the shielding cover are integrally formed.
  • the method of directly forming the capillary structure on the shield can eliminate the need to connect the capillary structure and the shield through sintering and other assembly processes, which is beneficial to reduce the process of assembling and connecting the shield and the additional capillary structure.
  • the shielding case and the capillary structure are connected by assembly, when the capillary structure is subjected to external force, there is a possibility that the capillary structure and the shielding case will be separated or dislocated, while the capillary structure is directly formed on the shielding case of the present application. The possibility of occurrence of the above-mentioned problems can be reduced.
  • the surface of the shielding cover facing the sealed chamber has capillary grooves.
  • the capillary grooves form a capillary structure.
  • an etching process is used to form a capillary structure on the surface of the shield facing the sealed chamber.
  • a first recess is provided on a surface of the shield facing the heat conducting plate.
  • the sealed chamber includes a first recess.
  • the capillary structure is arranged in the first recess.
  • At least part of the heat conducting plate is located in the first recess. At least part of the heat conduction plate is located in the first recess, which is beneficial to reduce the total thickness of the shield cover and the heat conduction plate, making the structure of the shield assembly more compact, and reducing the space occupancy rate of the shield assembly.
  • at least part of the heat conduction plate is accommodated in the first recess, and the shielding cover can form protection for the portion of the heat conduction plate accommodated in the first recess, so that this part of the heat conduction plate is not easily broken or deformed by the impact of an external structural member .
  • At least one of the surface of the shielding cover facing the sealed chamber and the surface of the heat conduction plate facing the sealed chamber is provided with a protective layer.
  • the protective layer can be used to isolate the working fluid and the heat conducting plate in the sealed chamber, so that the working fluid is not easy to contact with the heat conducting plate to cause chemical reaction, and reduce the possibility of the heat conducting plate being oxidized or corroded by the working fluid.
  • the material of the shield is any one of steel, titanium metal, and titanium alloy.
  • the material of the heat conducting plate is any one of steel, titanium metal and titanium alloy.
  • the material of the protective layer is copper or copper alloy.
  • the shielding cover includes side panels and a top panel.
  • the side panels are connected to the main board.
  • the top plate is connected to the heat conducting plate and forms a sealed chamber.
  • the sealed chamber is a vacuum chamber.
  • the working fluid in the evaporation area of the sealed chamber can undergo liquid-phase vaporization in a vacuum environment to form steam.
  • the working medium will have a large amount of latent heat when the phase transition occurs, and the volume will expand rapidly in the vacuum environment after forming steam, which is beneficial to improve the heat dissipation effect.
  • the heat conducting plate and the shielding cover are sealed by welding.
  • the heat conduction plate and the shield are welded and sealed, so that the connection strength between the heat conduction plate and the shield is high, and the connection stability is high, so that the separation between the heat conduction plate and the shield is not easy to occur, which can effectively improve the sealing reliability between the heat conduction plate and the shield sex.
  • the shielding assembly further includes a shielding frame.
  • the shield frame is connected to the main board.
  • the shielding case is connected with the shielding frame.
  • the shielding cover includes side panels and a top panel.
  • the shield frame includes sides and a top.
  • the top has escape holes for avoiding electronics.
  • the side panels are detachably connected to the side parts.
  • the top plate covers the escape hole. Electronic devices can be detected or maintained through the avoidance hole.
  • the shielding cover and the shielding frame are detachably connected, which is beneficial to improving the convenience of detecting or maintaining the electronic device.
  • the electronic device further includes a housing.
  • the heat conducting plate is connected with the casing.
  • the electronic device also includes a first heat conduction element and a second heat conduction element.
  • a first heat conducting member is arranged between the electronic device and the shielding cover. The heat at the electronic device can be conducted to the area of the shielding assembly away from the electronic device, then to the housing through the shielding assembly, and finally to the outside of the electronic device from the housing.
  • the first heat conducting member can fill the gap between the electronic device and the shielding case, which is beneficial to reduce the thermal resistance between the electronic device and the shielding case, and improve the heat transfer efficiency between the electronic device and the shielding case.
  • a second heat conduction element is arranged between the heat conduction plate and the housing. The second heat conducting member can fill the gap between the shielding case and the housing, which is beneficial to reducing the thermal resistance between the shielding case and the housing and improving the heat transfer efficiency between the shielding case and the housing.
  • both the first heat conduction member and the second heat conduction member have elasticity.
  • the electronic device and the shield can jointly apply compressive stress to the first heat conduction member to deform the first heat conduction member, so that the first heat conduction member can be better bonded to the electronic device and the shield cover, reducing the contact between the first heat conduction member and the shield.
  • the heat conduction plate and the housing can jointly exert compressive stress on the second heat conduction member to deform the second heat conduction member, so that the second heat conduction member can be better bonded to the heat conduction plate and the housing, reducing the contact between the second heat conduction member and the housing.
  • the first heat conducting member is heat conducting glue.
  • the second heat conducting member is heat conducting glue or graphene sheet.
  • the shielding assembly further includes a support column.
  • a support column is located within the sealed chamber. One end of the support column is connected with the shielding cover, and the other end is connected with the heat conducting plate.
  • the support columns can provide support for the heat conduction plate, reducing the possibility of the heat conduction plate collapsing and deforming towards the shield due to no support underneath, so that the surface of the heat conduction plate facing away from the shield can be in a flat state.
  • the support column and the heat conduction plate are integrally formed.
  • the support column is directly processed on the heat conduction plate, so that the connection strength between the heat conduction plate and the support column can be ensured to be high, and the possibility of the support column being disconnected from the heat conduction plate due to external force or being bent and losing its supporting effect can be reduced.
  • the heat conducting plate has a second recess.
  • the support column is located in the second recess.
  • the sealed chamber includes a second recess.
  • the second aspect of the present application provides an electronic device manufacturing method, including:
  • the shielding assembly includes a shielding cover, a capillary structure and a heat conduction plate.
  • the heat conduction plate is connected to the shielding cover to form a sealed chamber.
  • the capillary structure is arranged in the sealed chamber, and the sealed chamber is filled with working fluid.
  • the sealed chamber includes an evaporation area. And the condensation area, the capillary structure is used to make the working fluid flow back from the condensation area to the evaporation area;
  • the shielding case is connected with the main board to form a shielding space for containing electronic devices to shield the electronic devices.
  • the electronic device is connected to the shielding case.
  • the heat conduction plate is located on the side of the shielding case facing away from the electronic device.
  • a capillary structure is provided between the shield case and the heat conduction plate of the shield assembly.
  • the working fluid filled in the sealed chamber can circulate and exchange heat between the evaporation area and the condensation area, so that the heat at the electronic device can be conducted to the area of the shielding assembly away from the electronic device.
  • the shielding component can increase the heat dissipation area and the heat dissipation rate, thereby improving the heat dissipation efficiency, realizing rapid cooling of electronic devices, and improving the heat dissipation effect.
  • the step of providing the shielding assembly processing and forming a capillary structure in a region of the shielding cover facing away from the electronic device.
  • the capillary structure and the shielding cover are integrally formed.
  • the method of directly forming the capillary structure on the shield can eliminate the need to connect the capillary structure and the shield through sintering and other assembly processes, which is beneficial to reduce the process of assembling and connecting the shield and the additional capillary structure.
  • capillary grooves are formed in the region of the shielding cover facing away from the electronic device, and the capillary grooves form a capillary structure.
  • an etching process is used to form capillary grooves on the surface of the shielding case facing the sealed chamber.
  • a first recess is formed on the surface of the shield facing the heat conducting plate, the sealed chamber includes the first recess, and the capillary structure is disposed in the first recess.
  • At least part of the heat conducting plate is located in the first recess. At least part of the heat conduction plate is located in the first recess, which is beneficial to reduce the total thickness of the shield cover and the heat conduction plate, making the structure of the shield assembly more compact, and reducing the space occupancy rate of the shield assembly.
  • at least part of the heat conduction plate is accommodated in the first recess, and the shielding cover can form protection for the portion of the heat conduction plate accommodated in the first recess, so that this part of the heat conduction plate is not easily broken or deformed by the impact of an external structural member .
  • a protective layer is provided on at least one of the surface of the shielding cover facing the sealed chamber and the surface of the heat conduction plate facing the sealed chamber.
  • the protective layer can be used to isolate the working fluid and the heat conducting plate in the sealed chamber, so that the working fluid is not easy to contact with the heat conducting plate to cause chemical reaction, and reduce the possibility of the heat conducting plate being oxidized or corroded by the working fluid.
  • the material of the shield is any one of steel, titanium metal, and titanium alloy.
  • the material of the heat conducting plate is any one of steel, titanium metal and titanium alloy.
  • the material of the protective layer is copper or copper alloy.
  • the shielding case in the step of providing the shielding assembly: the shielding case includes side plates and a top plate, the side plates of the shielding case are connected to the main board, and the top plate of the shielding case is connected to the heat conducting plate to form a sealed chamber.
  • the sealed chamber is evacuated.
  • the sealed chamber is a vacuum chamber.
  • the working fluid in the evaporation area of the sealed chamber can undergo liquid-phase vaporization in a vacuum environment to form steam.
  • the working medium will have a large amount of latent heat when the phase transition occurs, and the volume will expand rapidly in the vacuum environment after forming steam, which is beneficial to improve the heat dissipation effect.
  • the heat conducting plate and the shielding case are welded and sealed to form a sealed chamber.
  • the heat conduction plate and the shield are welded and sealed, so that the connection strength between the heat conduction plate and the shield is high, and the connection stability is high, so that the separation between the heat conduction plate and the shield is not easy to occur, which can effectively improve the sealing reliability between the heat conduction plate and the shield sex.
  • the shielding assembly further includes a shielding frame, the shielding frame is connected to the main board, and the shielding case is connected to the shielding frame.
  • the shielding cover includes side panels and a top panel.
  • the shield frame includes sides and a top.
  • the top of the shielding frame has escape holes for avoiding electronic devices.
  • the side panels of the shielding case are detachably connected with the side parts of the shielding frame.
  • the top plate of the shield cover covers the avoidance hole. Electronic devices can be detected or maintained through the avoidance hole.
  • the shielding cover and the shielding frame are detachably connected, which is beneficial to improving the convenience of detecting or maintaining the electronic device.
  • a housing, a first heat conduction element and a second heat conduction element are provided, the first heat conduction element is arranged on the electronic device or the shielding case, and after the shielding case is connected to the main board, the first heat conduction Between the shield cover and the shielding cover, the second heat conduction element is arranged on the heat conduction plate or the shell, and the heat conduction plate and the shell are connected through the second heat conduction element.
  • a first heat conducting member is arranged between the electronic device and the shielding cover. The heat at the electronic device can be conducted to the area of the shielding assembly away from the electronic device, then to the housing through the shielding assembly, and finally to the outside of the electronic device from the housing.
  • the first heat conducting member can fill the gap between the electronic device and the shielding case, which is beneficial to reduce the thermal resistance between the electronic device and the shielding case, and improve the heat transfer efficiency between the electronic device and the shielding case.
  • a second heat conduction element is arranged between the heat conduction plate and the housing. The second heat conducting member can fill the gap between the shielding case and the housing, which is beneficial to reducing the thermal resistance between the shielding case and the housing and improving the heat transfer efficiency between the shielding case and the housing.
  • both the first heat conduction member and the second heat conduction member have elasticity.
  • the electronic device and the shield can jointly apply compressive stress to the first heat conduction member to deform the first heat conduction member, so that the first heat conduction member can be better bonded to the electronic device and the shield cover, reducing the contact between the first heat conduction member and the shield.
  • the heat conduction plate and the housing can jointly exert compressive stress on the second heat conduction member to deform the second heat conduction member, so that the second heat conduction member can be better bonded to the heat conduction plate and the housing, reducing the contact between the second heat conduction member and the housing.
  • the first heat conducting member is heat conducting glue.
  • the second heat conducting member is heat conducting glue or graphene sheet.
  • the shielding assembly further includes a support column.
  • a support column is located within the sealed chamber. One end of the support column is connected with the shielding cover, and the other end is connected with the heat conducting plate.
  • the support columns can provide support for the heat conduction plate, reducing the possibility of the heat conduction plate collapsing and deforming towards the shield due to no support underneath, so that the surface of the heat conduction plate facing away from the shield can be in a flat state.
  • the support column and the heat conduction plate are integrally formed.
  • the support column is directly processed on the heat conduction plate, so that the connection strength between the heat conduction plate and the support column can be ensured to be high, and the possibility of the support column being disconnected from the heat conduction plate due to external force or being bent and losing its supporting effect can be reduced.
  • a second recess is formed on the surface of the heat conducting plate facing the shield, and the support column is located in the second recess.
  • the sealed chamber includes a second recess.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG. 2 is a schematic diagram of an exploded structure of an electronic device provided in the related art
  • FIG. 3 is a schematic diagram of a partial cross-sectional structure of an electronic device provided in the related art
  • FIG. 4 is a partial cross-sectional structural schematic diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 5 is a partial cross-sectional structural schematic diagram of an electronic device provided by another embodiment of the present application.
  • FIG. 6 is a partial cross-sectional structural schematic diagram of an electronic device provided by another embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a shielding assembly provided by an embodiment of the present application.
  • Fig. 8 is a schematic cross-sectional structure diagram along the A-A direction in Fig. 7;
  • FIG. 9 is a schematic structural diagram of a shielding assembly provided by another embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a shielding assembly provided by another embodiment of the present application.
  • Fig. 11 is a schematic structural diagram of a shielding assembly provided by another embodiment of the present application.
  • Fig. 12 is a schematic structural diagram of a shielding assembly provided by another embodiment of the present application.
  • FIG. 13 is a schematic diagram of an exploded structure of a shielding assembly provided by an embodiment of the present application.
  • FIG. 14 is a partial cross-sectional structural schematic diagram of an electronic device provided in yet another embodiment of the present application.
  • Fig. 15 is a schematic structural diagram of a shielding assembly provided by another embodiment of the present application.
  • FIG. 16 is a schematic structural diagram of a shielding assembly provided in yet another embodiment of the present application.
  • FIG. 17 is a schematic flowchart of a method for manufacturing an electronic device provided by an embodiment of the present application.
  • 70 Shielding assembly; 701. Sealed chamber; 701a, evaporation zone; 701b, condensation zone; 701c, transition zone;
  • shielding cover 711, side plate; 711a, protrusion; 712, top plate; 713, first recess;
  • the first heat conduction element 90.
  • the second heat conduction element 99.
  • the heat conduction interface material 100.
  • the shielding space 200.
  • the welding print
  • the electronic device in the embodiment of the present application may be called user equipment (user equipment, UE) or terminal (terminal), for example, the electronic device may be a tablet computer (portable android device, PAD), a personal digital assistant (personal digital assistant, PDA), handheld devices with wireless communication functions, computing devices, vehicle-mounted devices, wearable devices, virtual reality (virtual reality, VR) terminal equipment, augmented reality (augmented reality, AR) terminal equipment, industrial control (industrial control) Wireless terminals in self driving, wireless terminals in remote medical, wireless terminals in smart grid, wireless terminals in transportation safety, smart Mobile terminals or fixed terminals such as wireless terminals in a smart city and wireless terminals in a smart home.
  • the form of the terminal device is not specifically limited in the embodiment of the present application.
  • FIG. 1 schematically shows the structure of an electronic device 10 according to an embodiment.
  • the electronic device 10 is a handheld device with a wireless communication function as an example for description.
  • the handheld device with wireless communication function may be, for example, a mobile phone.
  • FIG. 2 schematically shows a partial exploded structure of the electronic device 10 .
  • FIG. 3 schematically shows a partial cross-sectional structure of the electronic device 10 .
  • the electronic device 10 of the embodiment of the present application includes a display assembly 20 , a housing 30 , a main board 40 , an electronic device 50 and a shielding box 60 .
  • the display unit 20 has a display area for displaying image information.
  • the display component 20 is mounted on the casing 30, and the display area of the display component 20 is exposed to present image information to the user.
  • the main board 40 is connected to the casing 30 and located inside the display assembly 20 , so that the main board 40 is not easily observed by the user outside the electronic device 10 .
  • the electronic device 50 is disposed on the motherboard 40 .
  • the main board 40 may be a printed circuit board (Printed Circuit Board, PCB).
  • the electronic device 50 is welded to the main board 40 through a welding process.
  • the electronic device 50 includes but is not limited to a central processing unit (CPU, Central Processing Unit), an intelligent algorithm chip or a power management chip (PMIC, Power Management IC).
  • the electronic device 50 may be a main heat generating chip in the electronic device 10 . Since the internal space of the electronic device 10 is relatively small, the electronic device 50 is highly integrated on the main board 40 to fully reduce the volume of the main board 40 and reduce the space occupancy rate of the main board 40 .
  • the heat generated by the electronic device 50 is also likely to accumulate in a certain space, causing the temperature of the electronic device 50 to rise and affecting the working performance of the electronic device 50 .
  • the electronic device 50 of the electronic device 10 will generate a large amount of heat due to continuous operation for a long time and form a heat source. The user can obviously feel the temperature rise of the electronic device 10 from the outside of the electronic device 10 .
  • the shielding box 60 is disposed outside the electronic device 50 , and the shielding box 60 is disposed on the electronic device 50 .
  • the shielding box 60 is connected with the main board 40 to form a shielding space 100 .
  • the shielding box 60 is welded to the main board 40 through a welding process.
  • the electronic device 50 is located in the shielded space 100 .
  • the shielding box 60 can be used to shield the electronic device 50 to reduce the interference of the electronic device 50 by the electromagnetic signals of other components or the electromagnetic signals of the environment where the electronic device 10 is located.
  • a thermally conductive interface material 99 is provided between the electronic device 50 and the shielding box 60 .
  • a thermally conductive interface material 99 is also provided between the shield case 60 and the housing 30 .
  • the shielding box 60 is a single-layer stainless steel plate. The heat generated by the electronic device 50 needs to be dissipated through the thermal interface material 99 , the shielding box 60 , the thermal interface material 99 and the casing 30 .
  • the heat generated by the electronic device 50 needs to pass through two layers of thermally conductive interface material 99 and a layer of shielding box 60 to dissipate heat from the electronic device 50 to the housing 30, so that the electronic device The heat at 50 cannot be dissipated quickly, resulting in deviation of the heat dissipation effect.
  • the area of the thermally conductive interface material 99 between the electronic device 50 and the shielding box 60 is small, and the heat is mainly dissipated through the thermally conductive interface material 99 and the area corresponding to the thermally conductive interface material 99 on the shielding box 60, while the heat is dissipated to the shielding box 60.
  • the conduction of the heat-conducting interface material 99 between the housing 30 and the area away from the electronic device 50 is slow, resulting in a relatively small overall heat dissipation area, which also leads to deviations in heat dissipation effect.
  • the shielding assembly can quickly guide the heat conducted from the electronic device 50 to the shielding cover to the area of the shielding cover away from the electronic device 50, thereby helping to improve the heat dissipation efficiency, improve the heat dissipation effect, and ensure the heat dissipation of the electronic device. 50 operating temperature is at a normal level.
  • the heat dissipation area of the shielding component is increased, the heat dissipation efficiency between the shielding component and the housing 30 is improved, which is conducive to rapid heat dissipation and improves the heat dissipation effect.
  • FIG. 4 schematically shows a partial cross-sectional structure of an electronic device 10 according to an embodiment.
  • the electronic device 10 of the embodiment of the present application includes a main board 40 , an electronic device 50 and a shielding assembly 70 .
  • the electronic device 50 is disposed on the motherboard 40 .
  • the shielding assembly 70 is connected to the main board 40 to form a shielding space 100 .
  • the electronic device 50 is located in the shielded space 100 .
  • the shielding assembly 70 includes a shielding case 71 , a capillary structure 72 and a heat conducting plate 73 .
  • the electronic device 50 is located in the shielding case 71 and connected to the shielding case 71 so as to be able to exchange heat with the shielding case 71 .
  • the main board 40 and the shielding case 71 are connected to form a shielding space 100 for shielding the electronic device 50 .
  • the heat conducting plate 73 is located on a side of the shielding cover 71 facing away from the electronic device 50 .
  • the heat conducting plate 73 is connected with the shielding case 71 and forms a sealed chamber 701 .
  • the capillary structure 72 is disposed in the sealed chamber 701 .
  • the sealed chamber 701 is filled with working fluid (not shown in the figure).
  • the sealed chamber 701 includes an evaporation zone 701a and a condensation zone 701b.
  • the evaporation region 701 a is located above the electronic device 50 .
  • the condensation area 701b is away from the electronic device 50 .
  • the capillary structure 72 is used to generate capillary force to make the working fluid flow back from the condensation zone 701b to the evaporation zone 701a.
  • Working fluid refers to the medium that can be used for heat exchange.
  • the working fluid can be water.
  • the electronic device 50 becomes a heat source after generating heat during operation.
  • the heat of the electronic device 50 can be conducted to the evaporation area 701 a through the shielding cover 71 .
  • the working fluid in the evaporation zone 701a absorbs heat from the heat source and evaporates to form steam.
  • the steam diffuses and flows to the condensation zone 701b and condenses in the condensation zone 701b to release heat.
  • the capillary structure 72 draws the condensed working fluid from the condensation zone 701b to the evaporation zone 701a to absorb heat again through capillary action, so that the working medium reciprocates heat exchange, continuously absorbs heat from the evaporation zone 701a, and releases heat in the condensation zone 701b, forming A circulating heat exchange system with gas-liquid two-phase coexistence.
  • the sealed chamber 701 further includes a transition region 701c.
  • Transition zone 701c is located between evaporation zone 701a and condensation zone 701b.
  • the vapor formed by the vaporization of the working fluid in the evaporation zone 701a can diffuse to the transition zone 701c.
  • the steam passes through the transition zone 701c, it releases heat and the temperature decreases, but no condensation occurs.
  • the steam diffuses to the condensation zone 701b and condenses in the condensation zone 701b to release heat.
  • the electronic device 50 and other components can be arranged in the shielding case 71 .
  • the area of the electronic device 50 corresponding to the shield 71 is smaller than the area of the shield 71 corresponding to the housing 30 .
  • the evaporation region 701 a of the sealed chamber 701 may cover the corresponding electronic device 50 .
  • the orthographic projection of the electronic device 50 on the main board 40 is located within the orthographic projection of the evaporation region 701 a of the sealed chamber 701 on the main board 40 .
  • a capillary structure 72 is provided between the shield cover 71 and the heat conduction plate 73 of the shield assembly 70 .
  • the working fluid can circulate between the evaporation zone 701a and the condensation zone 701b for heat exchange, so that the heat at the electronic device 50 can be conducted to the area of the shielding assembly 70 away from the electronic device 50 .
  • the shielding assembly 70 of the embodiment of the present application can increase the heat dissipation area and the heat dissipation rate, thereby improving the heat dissipation efficiency, realizing rapid cooling of the electronic device 50, and improving the heat dissipation effect.
  • the capillary structure 72 and the shielding cover 71 may be separate structures.
  • a first concave portion 713 is disposed on a surface of the shielding cover 71 facing the heat conducting plate 73 .
  • the capillary structure 72 is disposed in the first recess 713 .
  • the capillary structure 72 may be, but not limited to, a porous medium based on copper, such as copper mesh, sintered copper powder or copper foam.
  • the capillary structure 72 can be connected to the shielding case 71 by sintering.
  • the first concave portion 713 may be formed on the shielding case 71 by a stamping process. Specifically, compressive stress is applied to a predetermined area of the shield 71 , so that the predetermined area sinks into the shield 71 to form the first recess 713 .
  • FIG. 6 schematically shows a partial cross-sectional structure of an electronic device 10 according to yet another embodiment.
  • the capillary structure 72 and the shielding cover 71 can be integrally formed.
  • the integral formation of the capillary structure 72 and the shielding case 71 means that the capillary structure 72 is directly processed and manufactured on the shielding case 71 , so that the capillary structure 72 and the shielding case 71 are an integral and inseparable structure.
  • directly forming the capillary structure 72 on the shielding case 71 it is no longer necessary to connect the capillary structure 72 and the shielding case 71 through sintering and other assembly processes, which is beneficial to reduce the assembly and connection between the shielding case 71 and the additional capillary structure 72. process.
  • the shielding cover 71 and the capillary structure 72 are connected by assembly, when the capillary structure 72 is subjected to an external force, there is a possibility that the capillary structure 72 and the shielding cover 71 will be separated or dislocated, while the shielding cover 71 of the present application Forming the capillary structure 72 directly on the surface can reduce the possibility of the above problems.
  • the surface of the shielding cover 71 facing the sealed chamber 701 has capillary grooves 721 .
  • the capillary grooves 721 form the capillary structure 72 .
  • the capillary groove 721 extends in a direction from the evaporation zone 701a to the condensation zone 701b.
  • the capillary groove 721 may be a continuously extending groove structure, so that the working fluid can flow smoothly in the capillary groove 721 .
  • the working fluid in the capillary groove 721 of the evaporation zone 701a evaporates to form steam after absorbing the heat from the outside, and the steam escapes from the capillary groove 721 and flows to the condensation zone 701b.
  • the steam condenses and releases heat in the condensation zone 701b and then liquefies.
  • the capillary groove 721 in the condensation area 701b will absorb the working fluid, and transport the working fluid to the evaporation area 701a through capillary force.
  • the shield 71 is provided with a plurality of capillary grooves 721, so that more working fluid can be sucked into the evaporation region 701a per unit time for heat exchange, which is beneficial to improve heat exchange efficiency.
  • a plurality of capillary grooves 721 may be arranged at intervals from each other.
  • the capillary groove 721 may be a micro groove with a width below 0.1 mm.
  • the width of the capillary groove 721 may range from 0.02 mm to 0.1 mm.
  • the thickness of the shielding cover 71 may be 0.1 mm, and the depth of the capillary groove 721 may range from 0.03 mm to 0.07 mm.
  • the capillary groove 721 can be directly formed on the surface of the shielding cover 71 by using a laser etching process or a chemical etching process.
  • the surface of the shielding cover 71 facing the heat conducting plate 73 has a first recess 713 .
  • Capillary grooves 721 are provided on the bottom wall of the first concave portion 713 .
  • the surface of the heat conducting plate 73 facing the shielding case 71 is a flat surface.
  • the heat conducting plate 73 is a plate body with uniform thickness.
  • the heat conduction plate 73 covers the first concave portion 713 .
  • the sealed chamber 701 includes a first recess 713 and a capillary groove 721 .
  • the thickness of the shielding case 71 may be 0.1 mm.
  • the thickness of the heat conducting plate 73 may be 0.1 mm.
  • the depth range of the first concave portion 713 may be 0.03 mm to 0.07 mm.
  • the depth of the capillary groove 721 does not exceed the thickness of the shield 71 , for example, the depth of the capillary groove 721 may range from 0.03mm to 0.07mm.
  • the edge of the heat conducting plate 73 is welded to the shielding cover 71 to form a solder mark 200 .
  • the overlapping area of the heat conduction plate 73 and the shielding cover 71 is welded to form a solder mark 200, and the solder mark 200 is covered by the heat conduction plate 73, so that the solder mark 200 cannot be observed from the outside.
  • At least part of the heat conducting plate 73 is located in the first recess 713, which is beneficial to reduce the total thickness of the shielding cover 71 and the heat conducting plate 73, making the structure of the shielding assembly 70 more compact and reducing the space occupied by the shielding assembly 70. Rate.
  • at least part of the heat conduction plate 73 is accommodated in the first recess 713, and the shield cover 71 can form a shield for the portion of the heat conduction plate 73 accommodated in the first recess 713, so that this portion of the heat conduction plate 73 is not easily affected by external structural components. breakage or deformation due to impact.
  • the solder print 200 can be located in the first recess 713, so that the shield cover 71 can also protect the solder print 200 formed by the heat conduction plate 73 and the shield cover 71, The possibility of cracking of the solder print 200 due to impact is reduced.
  • the shape of the outer contour of the heat conducting plate 73 matches the shape of the first recess 713 .
  • the heat conducting plate 73 is entirely accommodated in the first concave portion 713 .
  • the outer surface of the heat conducting plate 73 facing away from the sealed chamber 701 is flush with the surface of the shielding case 71 .
  • the first recess 713 may be formed on the shielding cover 71 by using an etching process.
  • a predetermined area of the shielding cover 71 is thinned by an etching process, so that the thickness of the predetermined area is reduced to form a first concave portion 713 .
  • the sum of the depth of the capillary groove 721 and the depth of the first recess 713 does not exceed the thickness of the shielding case 71 .
  • the surface of the shielding case 71 is a flat surface.
  • Capillary grooves 721 are directly provided on the surface of the shield case 71 .
  • the heat conduction plate 73 includes a second recess 731 .
  • the heat conducting plate 73 is connected to the shielding case 71 .
  • the capillary groove 721 communicates with the second recess 731 .
  • the sealed chamber 701 includes a second recess 731 and a capillary groove 721 .
  • the working fluid in the evaporation zone 701a absorbs heat from the heat source and evaporates to form steam.
  • the capillary groove 721 draws the condensed working fluid from the condensation area 701b to the evaporation area 701a through capillary action to absorb heat again.
  • the vapor formed by the vaporization of the working fluid leaves the capillary groove 721 and diffuses into the part of the second concave portion 731 located in the evaporation region 701a.
  • the thickness of the shielding cover 71 may be 0.1 mm.
  • the depth of the capillary groove 721 may range from 0.03 mm to 0.07 mm.
  • the thickness of the heat conducting plate 73 may be 0.1 mm, and the depth of the second recess 731 may range from 0.05 mm to 0.07 mm.
  • the surface of the shielding case 71 has a first recess 713 .
  • Capillary grooves 721 are provided on the bottom wall of the first concave portion 713 .
  • the heat conduction plate 73 includes a second recess 731 .
  • the heat conducting plate 73 is connected to the shielding case 71 .
  • the first recess 713 , the capillary groove 721 and the second recess 731 are in communication.
  • the sealed chamber 701 includes a first recess 713 , a capillary groove 721 and a second recess 731 .
  • the second concave portion 731 can be formed on the heat conducting plate 73 by a stamping process. Specifically, compressive stress is applied to a predetermined area of the heat conduction plate 73 so that the predetermined area protrudes outside the heat conduction plate 73 and forms the second concave portion 731 .
  • the second concave portion 731 may be formed on the heat conducting plate 73 by using an etching process. A predetermined area of the heat conducting plate 73 is thinned by an etching process, so that the thickness of the predetermined area is reduced to form a second concave portion 731 .
  • the surface of the shielding case 71 facing the sealed chamber 701 is roughened to form the capillary structure 72 .
  • a structure with irregular microporous channels will be formed.
  • a laser etching process or a chemical etching process may be used to roughen the surface of the shielding cover 71 .
  • the shielding cover 71 is made of metal material, which is beneficial to improve heat dissipation efficiency.
  • a protective layer 74 is provided on the surface of the shielding case 71 facing the sealed chamber 701 .
  • the protective layer 74 can be used to isolate the working fluid in the sealed chamber 701 from the shield 71 , so that the working fluid is not easy to contact with the shield 71 to cause a chemical reaction, and reduce the possibility of the shield 71 being oxidized or corroded by the working fluid.
  • the material of the shield 71 may be any one of steel, titanium metal, and titanium alloy.
  • shield 71 may be stainless steel.
  • the yield strength and hardness of the shielding cover 71 are relatively high, so that the shielding cover 71 has a strong resistance to deformation, so that it can cope with bending, twisting or impact without being easily deformed, reducing the extrusion of the sealing chamber due to the deformation of the shielding cover 71 701 or extruding the capillary structure 72 may lead to the possibility of failure of the heat dissipation function.
  • the material of the protective layer 74 can be copper or copper alloy. When the working fluid is water, the protective layer 74 does not chemically react with water, so the protective layer 74 is not easily oxidized or corroded by the working fluid.
  • the capillary groove 721 may be formed on the shielding case 71 by an etching process first, and then the protective layer 74 is formed on the surface of the shielding case 71 facing the sealed chamber 701 by an electroplating process or an electroless deposition process.
  • the heat conducting plate 73 is made of metal material, which is beneficial to improve heat dissipation efficiency.
  • a protective layer 74 is provided on the surface of the heat conducting plate 73 facing the sealed chamber 701 .
  • the protective layer 74 can be used to isolate the working fluid in the sealed chamber 701 from the heat conducting plate 73, so that the working fluid is not easy to contact with the heat conducting plate 73 to cause chemical reaction, and reduce the possibility of the heat conducting plate 73 being oxidized or corroded by the working fluid.
  • the material of the heat conducting plate 73 may be any one of steel, titanium metal, and titanium alloy.
  • the thermally conductive plate 73 may be stainless steel.
  • the heat conduction plate 73 itself has high yield strength and hardness, which makes the heat conduction plate 73 have strong deformation resistance, so that it can cope with bending, twisting or impact without being easily deformed, reducing the extrusion of the sealed chamber due to the deformation of the heat conduction plate 73 701 or extruding the capillary structure 72 may lead to the possibility of failure of the heat dissipation function.
  • the material of the protective layer 74 can be copper or copper alloy. When the working fluid is water, the protective layer 74 does not chemically react with water, so the protective layer 74 is not easily oxidized or corroded by the working fluid.
  • the surface of the heat conduction plate 73 facing the sealed chamber 701 and the surface of the heat conduction plate 73 facing the sealed chamber 701 are provided with a protective layer 74 .
  • the sealed chamber 701 is a vacuum chamber.
  • the working fluid in the evaporation region 701a of the sealed chamber 701 can undergo liquid-phase vaporization in a vacuum environment to form steam.
  • the working medium will have a large amount of latent heat when the phase transition occurs, and the volume will expand rapidly in the vacuum environment after forming steam, which is beneficial to improve the heat dissipation effect.
  • the heat conducting plate 73 and the shielding cover 71 may be connected under a vacuum environment, so as to ensure that the sealed chamber 701 is in a vacuum environment.
  • the heat conducting plate 73 and the shielding case 71 can be connected in a non-vacuum environment, and then the sealed chamber 701 is evacuated to form a vacuum environment.
  • the heat conduction plate 73 is welded and sealed with the shield cover 71, so that the connection strength between the heat conduction plate 73 and the shield cover 71 is high, and the connection stability is high, so that separation between the heat conduction plate 73 and the shield cover 71 is difficult to occur, and the heat conduction plate 73 and the heat conduction plate 73 can be effectively improved. Sealing reliability between the shields 71.
  • the way that the heat conduction plate 73 is directly welded to the shield 71 does not need to use additional connecting parts (such as fasteners or adhesives) to connect the heat conduction plate 73 and the shield 71, which is conducive to simplifying the heat conduction plate 73.
  • the heat exchange structure formed with the shielding cover 71 reduces the overall volume of the heat exchange structure, thereby helping to reduce the thickness of the heat exchange structure.
  • the edge area of the heat conducting plate 73 can be welded with the shielding case 71 to form a ring-shaped welding mark 200 .
  • the sealed chamber 701 is located within the area defined by the annular weld 200 .
  • the material of the shielding cover 71 is the same as that of the heat conducting plate 73 .
  • the materials of the shielding cover 71 and the heat conducting plate 73 are both stainless steel or titanium.
  • the heat conducting plate 73 and the shielding cover 71 can be connected by brazing or laser welding.
  • solder paste is pre-disposed between the edge of the heat conducting plate 73 and the shielding case 71 .
  • the solder paste is heated using a brazing process.
  • the solder print 200 is formed after the melted solder paste solidifies.
  • a cavity is formed between the heat conducting plate 73 and the shielding case 71 .
  • a pipeline is set to communicate with the chamber, and the working medium is injected into the chamber through the pipeline, and then the chamber is evacuated through the pipeline. After vacuuming is completed, the pipeline is sealed, and a sealed chamber 701 with working fluid is formed between the heat conducting plate 73 and the shielding cover 71 . Finally, a tightness test is performed on the sealed chamber 701 .
  • the shielding case 71 includes a side plate 711 and a top plate 712 .
  • the side plate 711 and the top plate 712 of the shielding case 71 are intersected, and there is a predetermined angle between them.
  • the angle between the side plate 711 and the top plate 712 may be 90°.
  • the side plate 711 of the shielding case 71 is connected to the main board 40 .
  • the side plate 711 of the shielding case 71 is connected to the main board 40 by welding.
  • the top plate 712 of the shielding case 71 is connected with the heat conducting plate 73 and forms a sealed chamber 701 .
  • the electronic device 50 is connected to the top plate 712 of the shielding case 71 and can exchange heat with the top plate 712 of the shielding case 71 .
  • the blank for manufacturing the shield 71 is a flat plate.
  • the capillary structure 72 is first directly processed in the area of the blank for forming the top plate 712 of the shielding case 71 .
  • the blank is stamped by a stamping process, so that the blank undergoes predetermined deformation to form the shielding case 71 having side plates 711 and a top plate 712 .
  • the shield 71 formed by stamping needs to be reshaped to release the internal stress accumulated in the shield 71 after stamping, and reduce the deformation of the shield 71 caused by the excessive internal stress of the shield 71 itself. , distortion, thus leading to the possibility of failure of the capillary structure 72 due to extrusion deformation.
  • the included angle between the top plates 712 is at a predetermined angle.
  • the blank for manufacturing the shielding case 71 is a flat plate. Firstly, the blank is stamped by a stamping process, and the shielding case 71 having side plates 711 and a top plate 712 is punched out. Then the shielding case 71 is reshaped to fully release the internal stress of the shielding case 71 . Under the normal temperature environment, use shaping equipment to push the side plate 711 on the outside of the side plate 711 to shape the side plate 711, so that the side plate 711 can fully release the internal stress, so as to ensure that the side plate 711 is free of internal stress. The included angle between the top plates 712 is at a predetermined angle.
  • the capillary structure 72 is directly processed on the top plate 712 of the reshaped shield 71, thereby also reducing the deformation and distortion of the shield 71 caused by the excessive internal stress of the shield 71 itself, thereby causing the capillary structure 72 to be squeezed. Possibility of failure due to compression deformation.
  • the blank can be any one of steel, titanium metal, and titanium alloy, so that the yield strength and rigidity of the blank itself are relatively large, so that the shielding cover 71 formed after the stamping process has a small internal stress and is not easy to deform and twist .
  • the shielding assembly 70 further includes a shielding frame 75 .
  • the shield frame 75 is connected to the main board 40 .
  • the shielding case 71 is connected to the shielding frame 75 .
  • the shielding case 71 is connected to the main board 40 through the shielding frame 75 .
  • Both the shielding case 71 and the shielding frame 75 are made of metal.
  • both the shielding case 71 and the shielding frame 75 are steel, such as stainless steel.
  • the shielding cover 71 is detachably connected to the shielding frame 75 , which is beneficial to improve the convenience of detecting or maintaining the electronic device 50 .
  • the shield cover 71 is removed from the shield frame 75 .
  • the shielding case 71 is reinstalled on the shielding frame 75 .
  • the shielding case 71 may be connected to the shielding frame 75 by clamping, bonding or fastening.
  • the shielding frame 75 can be welded with the main board 40 .
  • the shield 71 includes side panels 711 and a top panel 712 .
  • the shielding frame 75 includes sides 751 and a top 752 .
  • the side 751 and the top 752 of the shielding frame 75 intersect.
  • the top 752 of the shielding frame 75 has an escape hole 753 for avoiding the electronic device 50 .
  • the electronic device 50 can be inspected or maintained through the avoidance hole 753 .
  • the shape of the escape hole 753 can match the overall shape of the electronic device 50 , or the avoidance hole 753 has a regular shape and an area larger than the orthographic area of the electronic device 50 . Exemplarily, as shown in FIG. 14 and FIG.
  • the side plate 711 of the shielding case 71 is snap-connected with the side portion 751 of the shielding frame 75 .
  • the side plate 711 of the shielding case 71 has a protrusion 711a
  • the side portion 751 of the shielding frame 75 has a locking hole or a locking recess for engaging with the protrusion 711a of the side plate 711 .
  • the top plate 712 of the shielding case 71 covers the escape hole 753 opened on the top 752 of the shielding frame 75 .
  • the area of the shielding cover 71 corresponding to the escape hole 753 is connected to the electronic device 50 .
  • the electronic device 10 further includes a first heat conduction element 80 and a second heat conduction element 90 .
  • the first heat conducting element 80 is located in the shielding case 71 .
  • a first heat conducting member 80 is disposed between the electronic device 50 and the shielding cover 71 .
  • the first heat conducting member 80 can fill the gap between the electronic device 50 and the shielding case 71 , which is beneficial to reduce the thermal resistance between the electronic device 50 and the shielding case 71 and improve the heat transfer efficiency between the electronic device 50 and the shielding case 71 .
  • the surface of the first heat conducting member 80 facing the electronic device 50 is in contact with the surface of the electronic device 50 facing the shielding cover 71 .
  • the surface of the first heat conducting member 80 facing the shielding case 71 is in contact with the surface of the shielding case 71 facing the electronic device 50 .
  • the first heat conducting member 80 may cover the entire surface of the electronic device 50 facing the shielding cover 71 .
  • the first heat conduction element 80 is arranged corresponding to the evaporation area 701a of the sealed chamber 701, so that the heat conducted by the first heat conduction element 80 to the shield 71 will quickly heat the working fluid in the evaporation area 701a and vaporize the working fluid.
  • the first heat conducting member 80 has elasticity.
  • the first heat conducting member 80 can be easily compressed and deformed when subjected to an external force.
  • the electronic device 50 and the shielding cover 71 can jointly apply compressive stress to the first heat-conducting member 80 so that the first heat-conducting member 80 is deformed, so that the first heat-conducting member 80 can be better bonded to the electronic device 50 and the shielding cover 71 , to reduce the possibility that the heat transfer efficiency will be affected by the increased thermal resistance caused by the gap between the first heat conduction member 80 and the electronic device 50 or the first heat conduction member 80 and the shield 71 .
  • the first heat conducting member 80 may be heat conducting glue.
  • glue with good thermal conductivity can be coated on the electronic device 50 in advance, and then the shielding cover 71 is covered on the electronic device 50 and bonded with the glue. After the glue is solidified, the first heat conducting element 80 can be formed.
  • the electronic device 10 also includes a housing 30 .
  • the heat conduction plate 73 is connected to the housing 30 so as to exchange heat with the housing 30 .
  • the heat is transferred to the casing 30 through the heat conducting plate 73 and dissipated to the outside of the electronic device 10 through the casing 30 .
  • the casing 30 of the electronic device 10 may include a middle frame.
  • the heat conducting plate 73 is connected with the middle frame.
  • the housing 30 of the electronic device 10 may also include a battery cover.
  • the heat conducting plate 73 is connected with the battery cover.
  • a second heat conducting member 90 is disposed between the heat conducting plate 73 and the housing 30 .
  • the second heat conducting member 90 can fill the gap between the shield 71 and the shell 30 , which is beneficial to reduce the thermal resistance between the shield 71 and the shell 30 and improve the heat transfer efficiency between the shield 71 and the shell 30 .
  • the area of the second heat conducting element 90 is larger than the area of the first heat conducting element 80 .
  • the second heat conduction member 90 covers the area corresponding to the sealed chamber 701 on the heat conduction plate 73 , so that the heat in different areas on the heat conduction plate 73 can be conducted to the second heat conduction member 90 , and then transferred to the housing 30 through the second heat conduction member 90 .
  • the heat generated at the electronic device 50 is conducted to a region on the shielding cover 71 corresponding to the evaporation region 701 a of the sealed chamber 701 through the first heat conducting member 80 .
  • the working fluid in the evaporation zone 701a absorbs heat, evaporates, and flows to the condensation zone 701b away from the evaporation zone 701a.
  • the working fluid can quickly conduct heat to the area of the shielding cover 71 and the heat conducting plate 73 away from the evaporation area 701a, so as to reduce the possibility of heat accumulation in the evaporation area 701a.
  • the heat from the heat conduction plate 73 is conducted to the second heat conduction member 90 , and then transferred to the housing 30 through the second heat conduction member 90 .
  • the heat at the first heat conduction member 80 can quickly spread to the shielding assembly 70 and the second heat conduction member 90, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.
  • the second heat conducting member 90 has elasticity.
  • the second heat conducting member 90 can be easily compressed and deformed when subjected to an external force.
  • the heat conduction plate 73 and the housing 30 can jointly apply compressive stress to the second heat conduction member 90 to deform the second heat conduction member 90 , so that the second heat conduction member 90 can be better bonded to the heat conduction plate 73 and the housing 30 , to reduce the possibility that the heat transfer efficiency will be affected by the increased thermal resistance due to the gap between the second heat conduction member 90 and the shield 71 or between the second heat conduction member 90 and the housing 30 .
  • the second heat conducting member 90 may be heat conducting glue.
  • the second heat conducting element 90 can be formed after the glue solidifies.
  • the second heat conducting member 90 may be a graphene sheet.
  • the processed graphene sheet is pasted on the heat conducting plate 73 and the housing 30 .
  • Graphene sheets have the properties of low thermal resistance, light weight and high thermal conductivity, and high heat dissipation efficiency.
  • the thickness of the heat conduction plate 73 itself is small, which can ensure that the heat conduction plate 73 has good heat conduction performance.
  • the possibility of damage to the capillary structure 72 may be caused by pressing the capillary structure 72 . Referring to FIGS.
  • the shielding assembly 70 further includes a support post 76 .
  • the support column 76 is located in the sealed chamber 701 .
  • One end of the support column 76 is connected to the shield cover 71, and the other end is connected to the heat conduction plate 73, so that the support column 76 can provide support for the heat conduction plate 73, reducing the collapse and deformation of the heat conduction plate 73 towards the shield cover 71 due to no support below. possibility, so that the surface of the heat conducting plate 73 facing away from the shielding cover 71 can be in a flat state.
  • the capillary structure 72 in the sealed chamber 701 avoids the support column 76 to be disposed.
  • the shielding case 71 , the support column 76 and the heat conducting plate 73 are connected by assembly. One end of the support column 76 is bonded to the shield 71 , and then the heat conduction plate 73 is fastened on the shield 71 and the other end of the support column 76 is bonded to the heat conduction plate 73 .
  • the support column 76 and the heat conducting plate 73 are integrally formed.
  • the support column 76 is directly processed on the heat conduction plate 73, so that the connection strength between the heat conduction plate 73 and the support column 76 can be ensured to be high, and the possibility of the support column 76 being disconnected from the heat conduction plate 73 due to external force or being bent and losing its supporting effect can be reduced. possibility.
  • the heat conducting plate 73 and the support column 76 may be formed by mold casting.
  • the blank may be etched by an etching process, and the area on the blank facing the sealed chamber 701 is thinned to simultaneously form the heat conducting plate 73 and the supporting pillar 76 .
  • the thinned area forms the second recess 731 of the heat conducting plate 73 .
  • FIG. 17 schematically shows a flow chart of the manufacturing method of the electronic device 10 .
  • the embodiment of the present application provides a method for manufacturing an electronic device 10, including:
  • Step S100 providing the main board 40
  • Step S200 provide the electronic device 50, and connect the electronic device 50 to the main board 40;
  • Step S300 provide a shielding assembly 70, the shielding assembly 70 includes a shielding cover 71, a capillary structure 72 and a heat conduction plate 73, the heat conduction plate 73 is connected to the shielding cover 71 to form a sealed chamber 701, and the capillary structure 72 is arranged in the sealed chamber 701, Fill the working fluid in the sealed chamber 701, the sealed chamber 701 includes an evaporation zone 701a and a condensation zone 701b, and the capillary structure 72 is used to make the working fluid flow back from the condensation zone 701b to the evaporation zone 701a;
  • the shielding cover 71 is connected with the main board 40 to form a shielding space for accommodating the electronic device 50 to shield the electronic device 50.
  • the electronic device 50 is connected to the shielding cover 71.
  • the heat conducting plate 73 is located on the side of the shielding cover 71 facing away from the electronic device 50.
  • the evaporation area 701 a is located above the electronic device 50 .
  • a capillary structure 72 is provided between the shield case 71 and the heat conduction plate 73 of the shield assembly 70 .
  • the working fluid filled in the sealed chamber 701 can circulate and exchange heat between the evaporation area 701 a and the condensation area 701 b, so that the heat at the electronic device 50 can be conducted to the area of the shielding assembly 70 away from the electronic device 50 .
  • the shielding assembly 70 can increase the heat dissipation area and the heat dissipation rate, thereby improving the heat dissipation efficiency, realizing rapid cooling of the electronic device 50, and improving the heat dissipation effect.
  • the capillary structure 72 is formed by processing the region of the shielding cover 71 facing away from the electronic device 50 .
  • the capillary structure 72 and the shielding cover 71 are integrally formed.
  • the shielding cover 71 and the capillary structure 72 are connected by assembly, when the capillary structure 72 is subjected to an external force, there is a possibility that the capillary structure 72 and the shielding cover 71 will be separated or dislocated, while the shielding cover 71 of the present application Forming the capillary structure 72 directly on the surface can reduce the possibility of the above problems.
  • capillary grooves 721 are formed in the region of the shielding cover 71 facing away from the electronic device 50 , and the capillary grooves 721 form the capillary structures 72 .
  • an etching process is used to form capillary grooves 721 on the surface of the shielding cover 71 facing the sealed chamber 701 .
  • a first concave portion 713 is formed on the surface of the shielding cover 71 facing the heat conducting plate 73, the sealed chamber 701 includes the first concave portion 713, and the capillary structure 72 is disposed on Inside the first concave portion 713 .
  • At least a portion of the thermally conductive plate 73 is located within the first recess 713 . At least part of the heat conduction plate 73 is located in the first recess 713 , thereby reducing the total thickness of the shield 71 and the heat conduction plate 73 , making the shield assembly 70 more compact and reducing the space occupation rate of the shield assembly 70 .
  • at least part of the heat conduction plate 73 is accommodated in the first recess 713, and the shield cover 71 can form a shield for the portion of the heat conduction plate 73 accommodated in the first recess 713, so that this portion of the heat conduction plate 73 is not easily affected by external structural components. breakage or deformation due to impact.
  • a protective layer 74 is provided on at least one of the surface of the shielding cover 71 facing the sealed chamber 701 and the surface of the heat conducting plate 73 facing the sealed chamber 701 .
  • the protective layer 74 can be used to isolate the working fluid in the sealed chamber 701 from the heat conducting plate 73, so that the working fluid is not easy to contact with the heat conducting plate 73 to cause chemical reaction, and reduce the possibility of the heat conducting plate 73 being oxidized or corroded by the working fluid.
  • the material of the shielding cover 71 is any one of steel, titanium metal, and titanium alloy
  • the material of the heat conducting plate 73 is any one of steel, titanium metal, and titanium alloy
  • the material of the protective layer 74 is copper. or copper alloys.
  • the shielding case 71 includes a side plate 711 and a top plate 712, the side plate 711 of the shielding case 71 is connected to the main board 40, the top plate 712 of the shielding case 71 is connected to the heat conducting plate 73 are connected and form a sealed chamber 701.
  • the sealed chamber 701 is evacuated.
  • the sealed chamber 701 is a vacuum chamber.
  • the working fluid in the evaporation region 701a of the sealed chamber 701 can undergo liquid-phase vaporization in a vacuum environment to form steam.
  • the working medium will have a large amount of latent heat when the phase transition occurs, and the volume will expand rapidly in the vacuum environment after forming steam, which is beneficial to improve the heat dissipation effect.
  • the heat conducting plate 73 is welded and sealed with the shielding case 71 to form a sealed chamber 701 .
  • the heat conduction plate 73 is welded and sealed with the shield cover 71, so that the connection strength between the heat conduction plate 73 and the shield cover 71 is high, and the connection stability is high, so that separation between the heat conduction plate 73 and the shield cover 71 is difficult to occur, and the heat conduction plate 73 and the heat conduction plate 73 can be effectively improved. Sealing reliability between the shields 71.
  • the shielding assembly 70 further includes a shielding frame 75 , the shielding frame 75 is connected to the main board 40 , and the shielding cover 71 is connected to the shielding frame 75 .
  • the shield 71 includes side panels 711 and a top panel 712 .
  • the shielding frame 75 includes sides 751 and a top 752 .
  • the top 752 of the shielding frame 75 has an escape hole 753 for avoiding the electronic device 50 .
  • the side plate 711 of the shielding case 71 is detachably connected to the side portion 751 of the shielding frame 75 .
  • the top plate 712 of the shielding case 71 covers the escape hole 753 .
  • the electronic device 50 can be inspected or maintained through the avoidance hole 753 .
  • the shielding cover 71 is detachably connected to the shielding frame 75 , which is beneficial to improve the convenience of detecting or maintaining the electronic device 50 .
  • a housing 30 a first heat conduction element 80 and a second heat conduction element 90 are provided.
  • the first heat conducting member 80 is arranged on the electronic device 50 or the shielding case 71 , and after the shielding case 71 is connected with the motherboard 40 , the first heat conducting member 80 is located between the electronic device 50 and the shielding case 71 .
  • the second heat conduction member 90 is disposed on the heat conduction plate 73 or the housing 30 , and the heat conduction plate 73 and the housing 30 are connected through the second heat conduction member 90 .
  • a first heat conducting member 80 is disposed between the electronic device 50 and the shielding cover 71 .
  • the heat at the electronic device 50 can be conducted to the area of the shielding assembly 70 away from the electronic device 50 , then transferred to the housing 30 through the shielding assembly 70 , and finally transferred to the outside of the electronic device 10 through the housing 30 .
  • the first heat conducting member 80 can fill the gap between the electronic device 50 and the shielding case 71 , which is beneficial to reduce the thermal resistance between the electronic device 50 and the shielding case 71 and improve the heat transfer efficiency between the electronic device 50 and the shielding case 71 .
  • a second heat conducting member 90 is disposed between the heat conducting plate 73 and the housing 30 . The second heat conducting member 90 can fill the gap between the shield 71 and the housing 30 , which is beneficial to reduce the thermal resistance between the shield 71 and the housing 30 and improve the heat transfer efficiency between the shield 71 and the housing 30 .
  • both the first heat conducting member 80 and the second heat conducting member 90 are elastic.
  • the electronic device 50 and the shielding cover 71 can jointly apply compressive stress to the first heat-conducting member 80 so that the first heat-conducting member 80 is deformed, so that the first heat-conducting member 80 can be better bonded to the electronic device 50 and the shielding cover 71 , to reduce the possibility that the heat transfer efficiency will be affected by the increased thermal resistance caused by the gap between the first heat conduction member 80 and the electronic device 50 or the first heat conduction member 80 and the shield 71 .
  • the heat conduction plate 73 and the housing 30 can jointly apply compressive stress to the second heat conduction member 90 to deform the second heat conduction member 90 , so that the second heat conduction member 90 can be better bonded to the heat conduction plate 73 and the housing 30 , to reduce the possibility that the heat transfer efficiency will be affected by the increased thermal resistance due to the gap between the second heat conduction member 90 and the shield 71 or between the second heat conduction member 90 and the housing 30 .
  • the first heat conduction member 80 is thermally conductive glue
  • the second heat conduction member 90 is heat conduction glue or a graphene sheet.
  • the shielding assembly 70 further includes a support column 76 .
  • the support column 76 is located in the sealed chamber 701 .
  • One end of the support column 76 is connected to the shield 71 , and the other end is connected to the heat conducting plate 73 .
  • the support column 76 can provide support for the heat conduction plate 73, reducing the possibility of the heat conduction plate 73 collapsing and deforming towards the shield 71 due to no support underneath, so that the surface of the heat conduction plate 73 facing away from the shield 71 can be in a flat state.
  • the support column 76 and the heat conducting plate 73 are integrally formed.
  • the support column 76 is directly processed on the heat conduction plate 73, so that the connection strength between the heat conduction plate 73 and the support column 76 can be ensured to be high, and the possibility of the support column 76 being disconnected from the heat conduction plate 73 due to external force or being bent and losing its supporting effect can be reduced. possibility.
  • a second concave portion 731 is formed on the surface of the heat conducting plate 73 facing the shielding case 71 , and the support column 76 is located in the second concave portion 731 .
  • the sealed chamber 701 includes a second recess 731 .
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements.
  • plural herein means two or more.
  • the term “and/or” in this article is just an association relationship describing associated objects, which means that there can be three relationships, for example, A and/or B can mean: A exists alone, A and B exist simultaneously, and there exists alone B these three situations.
  • the character "/" in this paper generally indicates that the contextual objects are an “or” relationship; in the formula, the character "/" indicates that the contextual objects are a "division" relationship.
  • sequence numbers of the above-mentioned processes do not mean the order of execution, and the order of execution of the processes should be determined by their functions and internal logic, and should not be used in the implementation of this application.
  • the implementation of the examples constitutes no limitation.

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Abstract

本申请实施例提供一种电子设备。电子设备至少包括主板、电子器件和屏蔽组件。电子器件设置于主板。屏蔽组件包括屏蔽罩、毛细结构和导热板。电子器件位于屏蔽罩内并且与屏蔽罩相连。主板和屏蔽罩相连形成屏蔽空间，以屏蔽电子器件。导热板位于屏蔽罩背向电子器件的一侧。导热板与屏蔽罩相连并形成密封腔室。毛细结构设置于密封腔室内。密封腔室内填充有工质。密封腔室包括蒸发区和冷凝区。蒸发区位于电子器件的上方。毛细结构用于使工质从冷凝区流回蒸发区。本申请实施例的电子设备，能够提升散热效果，实现电子器件快速散热。

Description

电子设备
本申请要求于2021年11月10日提交中国国家知识产权局、申请号为202111328232.6、申请名称为“电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端技术领域，特别涉及一种电子设备。
背景技术
随着智能手机或平板电脑(portable equipment，PAD)等电子设备的爆发式增长，电子设备的功能越来越多。电子设备的壳体内集成有不同的电子器件，例如中央处理器(CPU，Central Processing Unit)、智能算法芯片或电源管理芯片(PMIC，Power Management IC)等。这些电子器件在工作状态下会产生大量的热量。这些热量集聚在电子设备内部时，会影响电子器件的性能。因此，需要通过散热结构将热量及时散出。目前，电子器件的外围设置有屏蔽罩，从而降低外界信号对电子器件的干扰。电子器件通过屏蔽罩和壳体进行散热。然而，该散热结构设计存在散热效果偏差的问题。
发明内容
本申请实施例提供一种电子设备，能够提升散热效果，实现电子器件快速散热。
本申请第一方面提供一种电子设备。电子设备至少包括主板、电子器件和屏蔽组件。电子器件设置于主板。屏蔽组件包括屏蔽罩、毛细结构和导热板。电子器件位于屏蔽罩内并且与屏蔽罩相连。主板和屏蔽罩相连形成屏蔽空间，以屏蔽电子器件。导热板位于屏蔽罩背向电子器件的一侧。导热板与屏蔽罩相连并形成密封腔室。毛细结构设置于密封腔室内。密封腔室内填充有工质。密封腔室包括蒸发区和冷凝区。蒸发区位于电子器件的上方。毛细结构用于使工质从冷凝区流回蒸发区。
本申请实施例的电子设备中，屏蔽组件的屏蔽罩和导热板之间设置毛细结构。在密封腔室内填充工质后，工质可以在蒸发区和冷凝区之间循环往复进行换热，以使电子器件处的热量可以传导至屏蔽组件远离电子器件的区域。本申请实施例的屏蔽组件可以增大散热面积和散热速率，从而有利于提高散热效率，实现对电子器件的快速冷却，提升散热效果。
在一种可能的实施方式中，毛细结构与屏蔽罩为一体成型结构。在屏蔽罩上直接形成毛细结构的方式，可以不再需要通过烧结等组装工序将毛细结构和屏蔽罩进行连接，有利于减少屏蔽罩和额外设置的毛细结构进行装配连接的工序。另外，如果屏蔽罩和毛细结构是通过组装的方式实现连接，则毛细结构受到外力作用时，存在毛细结构与屏蔽罩发生分离或者错位的可能性，而本申请的屏蔽罩上直接形成毛细结构，可以降低发生上述问题的可能性。
在一种可能的实施方式中，屏蔽罩面向密封腔室的表面具有毛细凹槽。毛细凹槽形成毛细结构。
在一种可能的实施方式中，采用蚀刻工艺在屏蔽罩面向密封腔室的表面形成毛细结构。
在一种可能的实施方式中，屏蔽罩面向导热板的表面设置第一凹部。密封腔室包括第一凹部。毛细结构设置于第一凹部内。
在一种可能的实施方式中，导热板的至少部分位于第一凹部内。导热板的至少部分位于第一凹部内，从而有利于减小屏蔽罩和导热板的总厚度，使得屏蔽组件结构更加紧凑，降低屏蔽组件的空间占用率。另外，导热板的至少部分容纳于第一凹部内，屏蔽罩可以对导热板上容纳于第一凹部内的部分形成防护，使得导热板上的该部分不易受到外部结构件碰撞而发生断裂或变形。
在一种可能的实施方式中，屏蔽罩面向密封腔室的表面和导热板面向密封腔室的表面中的至少一者上设置有防护层。防护层可以用于隔离密封腔室内的工质和导热板，以使工质不易与导热板接触而发生化学反应，降低导热板被工质氧化或腐蚀的可能性。
在一种可能的实施方式中，屏蔽罩的材料为钢、钛金属、钛合金中的任意一种。导热板的材料为钢、钛金属、钛合金中的任意一种。防护层的材料为铜或铜合金。
在一种可能的实施方式中，屏蔽罩包括侧板和顶板。侧板与主板相连。顶板与导热板相连并形成密封腔室。
在一种可能的实施方式中，密封腔室为真空腔室。密封腔室的蒸发区的工质可以在真空环境下发生液相汽化现象，形成蒸汽。工质在发生相变现象时会具有大量的潜热，而形成蒸汽后在真空环境中体积会迅速膨胀，有利于提高散热效果。
在一种可能的实施方式中，导热板和屏蔽罩焊接密封。导热板与屏蔽罩焊接密封，使得导热板和屏蔽罩之间连接强度高、连接稳定性高，从而导热板和屏蔽罩之间不易发生分离，可以有效提高导热板和屏蔽罩之间的密封可靠性。
在一种可能的实施方式中，屏蔽组件还包括屏蔽框架。屏蔽框架与主板相连。屏蔽罩与屏蔽框架相连。
在一种可能的实施方式中，屏蔽罩包括侧板和顶板。屏蔽框架包括侧部和顶部。顶部具有用于避让电子器件的避让孔。侧板与侧部可拆卸连接。顶板覆盖避让孔。可以通过该避让孔对电子器件进行检测或维修。屏蔽罩与屏蔽框架可拆卸连接，有利于提高对电子器件进行检测或维修的便利性。
在一种可能的实施方式中，电子设备还包括壳体。导热板与壳体相连。电子设备还包括第一导热件和第二导热件。电子器件和屏蔽罩之间设置第一导热件。电子器件处的热量可以传导至屏蔽组件远离电子器件的区域，再通过屏蔽组件传导至壳体，最终由壳体传导至电子设备外部。第一导热件可以填充电子器件和屏蔽罩之间的间隙，有利于降低电子器件和屏蔽罩之间的热阻，提高电子器件与屏蔽罩之间的传热效率。导热板和壳体之间设置第二导热件。第二导热件可以填充屏蔽罩和壳体之间的间隙，有利于降低屏蔽罩和壳体之间的热阻，提高屏蔽罩与壳体之间的传热效率。
在一种可能的实施方式中，第一导热件和第二导热件均具有弹性。电子器件和屏蔽罩可以共同对第一导热件施加压应力，以使第一导热件发生变形，从而第一导热件可以更好地与电子器件和屏蔽罩实现贴合，降低第一导热件与电子器件或者第一导热件与屏蔽罩之间因存在间隙而导致热阻增大，影响传热效率的可能性。导热板和壳体 可以共同对第二导热件施加压应力，以使第二导热件发生变形，从而第二导热件可以更好地与导热板和壳体实现贴合，降低第二导热件与屏蔽罩或者第二导热件与壳体之间因存在间隙而导致热阻增大，影响传热效率的可能性。
在一种可能的实施方式中，第一导热件为导热胶。第二导热件为导热胶或石墨烯片。
在一种可能的实施方式中，屏蔽组件还包括支撑柱。支撑柱位于密封腔室内。支撑柱的一端部与屏蔽罩相连，另一端部与导热板相连。支撑柱可以为导热板提供支撑力，降低导热板因下方没有支撑而朝向屏蔽罩发生塌陷变形的可能性，使得导热板背向屏蔽罩的表面可以处于平整状态。
在一种可能的实施方式中，支撑柱和导热板为一体成型结构。在导热板上直接加工形成支撑柱，从而可以保证导热板和支撑柱的连接强度较高，降低支撑柱受到外力作用而与导热板脱离连接状态或者发生弯曲失去支撑作用的可能性。
在一种可能的实施方式中，导热板具有第二凹部。支撑柱位于第二凹部内。密封腔室包括第二凹部。
本申请第二方面提供一种电子设备制造方法，包括：
提供主板；
提供电子器件，将电子器件与主板相连；
提供屏蔽组件，屏蔽组件包括屏蔽罩、毛细结构和导热板，导热板与屏蔽罩相连并形成密封腔室，毛细结构设置于密封腔室内，在密封腔室内填充工质，密封腔室包括蒸发区和冷凝区，毛细结构用于使工质从冷凝区流回蒸发区；
将屏蔽罩与主板相连形成容纳电子器件的屏蔽空间，以屏蔽电子器件，电子器件与屏蔽罩相连，导热板位于屏蔽罩背向电子器件的一侧，蒸发区位于电子器件的上方。
本申请实施例的电子设备制造方法制造的电子设备中，屏蔽组件的屏蔽罩和导热板之间设置毛细结构。密封腔室内填充的工质可以在蒸发区和冷凝区之间循环往复进行换热，以使电子器件处的热量可以传导至屏蔽组件远离电子器件的区域。本申请实施例中，屏蔽组件可以增大散热面积和散热速率，从而有利于提高散热效率，实现对电子器件的快速冷却，提升散热效果。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：在屏蔽罩背向电子器件的区域加工形成毛细结构。毛细结构与屏蔽罩为一体成型结构。在屏蔽罩上直接形成毛细结构的方式，可以不再需要通过烧结等组装工序将毛细结构和屏蔽罩进行连接，有利于减少屏蔽罩和额外设置的毛细结构进行装配连接的工序。另外，如果屏蔽罩和毛细结构是通过组装的方式实现连接，则毛细结构受到外力作用时，存在毛细结构与屏蔽罩发生分离或者错位的可能性，而本申请的屏蔽罩上直接形成毛细结构，可以降低发生上述问题的可能性。
在一种可能的实施方式中，在屏蔽罩背向电子器件的区域加工形成毛细凹槽，而毛细凹槽形成毛细结构。
在一种可能的实施方式中，采用蚀刻工艺在屏蔽罩面向密封腔室的表面形成毛细凹槽。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：在屏蔽罩面向导热板的表 面加工形成第一凹部，密封腔室包括第一凹部，而毛细结构设置于第一凹部内。
在一种可能的实施方式中，导热板的至少部分位于第一凹部内。导热板的至少部分位于第一凹部内，从而有利于减小屏蔽罩和导热板的总厚度，使得屏蔽组件结构更加紧凑，降低屏蔽组件的空间占用率。另外，导热板的至少部分容纳于第一凹部内，屏蔽罩可以对导热板上容纳于第一凹部内的部分形成防护，使得导热板上的该部分不易受到外部结构件碰撞而发生断裂或变形。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：在屏蔽罩面向密封腔室的表面和导热板面向密封腔室的表面中的至少一者上设置防护层。防护层可以用于隔离密封腔室内的工质和导热板，以使工质不易与导热板接触而发生化学反应，降低导热板被工质氧化或腐蚀的可能性。
在一种可能的实施方式中，屏蔽罩的材料为钢、钛金属、钛合金中的任意一种。导热板的材料为钢、钛金属、钛合金中的任意一种。防护层的材料为铜或铜合金。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：屏蔽罩包括侧板和顶板，将屏蔽罩的侧板与主板相连，屏蔽罩的顶板与导热板相连并形成密封腔室。
在一种可能的实施方式中，将密封腔室抽真空。密封腔室为真空腔室。密封腔室的蒸发区的工质可以在真空环境下发生液相汽化现象，形成蒸汽。工质在发生相变现象时会具有大量的潜热，而形成蒸汽后在真空环境中体积会迅速膨胀，有利于提高散热效果。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：导热板与屏蔽罩焊接密封，以形成密封腔室。导热板与屏蔽罩焊接密封，使得导热板和屏蔽罩之间连接强度高、连接稳定性高，从而导热板和屏蔽罩之间不易发生分离，可以有效提高导热板和屏蔽罩之间的密封可靠性。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：屏蔽组件还包括屏蔽框架，将屏蔽框架与主板相连，将屏蔽罩与屏蔽框架相连。
在一种可能的实施方式中，屏蔽罩包括侧板和顶板。屏蔽框架包括侧部和顶部。屏蔽框架的顶部具有用于避让电子器件的避让孔。屏蔽罩的侧板与屏蔽框架的侧部可拆卸连接。屏蔽罩的顶板覆盖避让孔。可以通过该避让孔对电子器件进行检测或维修。屏蔽罩与屏蔽框架可拆卸连接，有利于提高对电子器件进行检测或维修的便利性。
在一种可能的实施方式中，提供壳体、第一导热件和第二导热件，将第一导热件设置于电子器件或屏蔽罩，屏蔽罩与主板相连后，第一导热件位于电子器件和屏蔽罩之间，将第二导热件设置于导热板或壳体，导热板和壳体通过第二导热件相连。电子器件和屏蔽罩之间设置第一导热件。电子器件处的热量可以传导至屏蔽组件远离电子器件的区域，再通过屏蔽组件传导至壳体，最终由壳体传导至电子设备外部。第一导热件可以填充电子器件和屏蔽罩之间的间隙，有利于降低电子器件和屏蔽罩之间的热阻，提高电子器件与屏蔽罩之间的传热效率。导热板和壳体之间设置第二导热件。第二导热件可以填充屏蔽罩和壳体之间的间隙，有利于降低屏蔽罩和壳体之间的热阻，提高屏蔽罩与壳体之间的传热效率。
在一种可能的实施方式中，第一导热件和第二导热件均具有弹性。电子器件和屏蔽罩可以共同对第一导热件施加压应力，以使第一导热件发生变形，从而第一导热件 可以更好地与电子器件和屏蔽罩实现贴合，降低第一导热件与电子器件或者第一导热件与屏蔽罩之间因存在间隙而导致热阻增大，影响传热效率的可能性。导热板和壳体可以共同对第二导热件施加压应力，以使第二导热件发生变形，从而第二导热件可以更好地与导热板和壳体实现贴合，降低第二导热件与屏蔽罩或者第二导热件与壳体之间因存在间隙而导致热阻增大，影响传热效率的可能性。
在一种可能的实施方式中，第一导热件为导热胶。第二导热件为导热胶或石墨烯片。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：屏蔽组件还包括支撑柱。支撑柱位于密封腔室内。支撑柱的一端部与屏蔽罩相连，另一端部与导热板相连。支撑柱可以为导热板提供支撑力，降低导热板因下方没有支撑而朝向屏蔽罩发生塌陷变形的可能性，使得导热板背向屏蔽罩的表面可以处于平整状态。
在一种可能的实施方式中，支撑柱和导热板为一体成型结构。在导热板上直接加工形成支撑柱，从而可以保证导热板和支撑柱的连接强度较高，降低支撑柱受到外力作用而与导热板脱离连接状态或者发生弯曲失去支撑作用的可能性。
在一种可能的实施方式中，在提供屏蔽组件的步骤中：在导热板面向屏蔽罩的表面加工形成第二凹部，而支撑柱位于第二凹部内。密封腔室包括第二凹部。
附图说明
图1为本申请实施例提供的电子设备的结构示意图；
图2为相关技术中提供的电子设备的分解结构示意图；
图3为相关技术中提供的电子设备的局部剖视结构示意图；
图4为本申请一实施例提供的电子设备的局部剖视结构示意图；
图5为本申请又一实施例提供的电子设备的局部剖视结构示意图；
图6为本申请另一实施例提供的电子设备的局部剖视结构示意图；
图7为本申请一实施例提供的屏蔽组件的结构示意图；
图8为图7中沿A-A方向的剖视结构示意图；
图9为本申请另一实施例提供的屏蔽组件的结构示意图；
图10为本申请另一实施例提供的屏蔽组件的结构示意图；
图11为本申请另一实施例提供的屏蔽组件的结构示意图；
图12为本申请另一实施例提供的屏蔽组件的结构示意图；
图13为本申请一实施例提供的屏蔽组件的分解结构示意图；
图14为本申请再一实施例提供的电子设备的局部剖视结构示意图；
图15为本申请另一实施例提供的屏蔽组件的结构示意图；
图16为本申请再一实施例提供的屏蔽组件的结构示意图；
图17为本申请一实施例提供的电子设备制造方法的流程示意图。
标记说明：
10、电子设备；20、显示组件；30、壳体；40、主板；50、电子器件；60、屏蔽盒；
70、屏蔽组件；701、密封腔室；701a、蒸发区；701b、冷凝区；701c、过渡区；
71、屏蔽罩；711、侧板；711a、凸起；712、顶板；713、第一凹部；
72、毛细结构；721、毛细凹槽；
73、导热板；731、第二凹部；
74、防护层；
75、屏蔽框架；751、侧部；752、顶部；753、避让孔；
76、支撑柱；
80、第一导热件；90、第二导热件；99、导热界面材料；100、屏蔽空间；200、焊印。
具体实施方式
本申请实施例中的电子设备可以称为用户设备(user equipment，UE)或终端(terminal)等，例如，电子设备可以为平板电脑(portable android device，PAD)、个人数字处理(personal digital assistant，PDA)、具有无线通信功能的手持设备、计算设备、车载设备、可穿戴设备、虚拟现实(virtual reality，VR)终端设备、增强现实(augmented reality，AR)终端设备、工业控制(industrial control)中的无线终端、无人驾驶(self driving)中的无线终端、远程医疗(remote medical)中的无线终端、智能电网(smart grid)中的无线终端、运输安全(transportation safety)中的无线终端、智慧城市(smart city)中的无线终端、智慧家庭(smart home)中的无线终端等移动终端或固定终端。本申请实施例中对终端设备的形态不做具体限定。
本申请实施例中，图1示意性地显示了一实施例的电子设备10的结构。参见图1所示，以电子设备10为具有无线通信功能的手持设备为例进行说明。无线通信功能的手持设备例如可以是手机。
图2示意性地显示了的电子设备10的局部分解结构。图3示意性地显示了电子设备10的局部剖视结构。参见图2和图3所示，本申请实施例的电子设备10包括显示组件20、壳体30、主板40、电子器件50和屏蔽盒60。
显示组件20具有用于显示图像信息的显示区域。显示组件20安装于壳体30，并且显示组件20的显示区域外露以便于向用户呈现图像信息。主板40与壳体30相连，并且位于显示组件20的内侧，从而用户在电子设备10的外部不易观察到主板40。
电子器件50设置于主板40。主板40可以是印制电路板(Printed Circuit Board，PCB)。电子器件50通过焊接工艺焊接于主板40。电子器件50包括但不限于中央处理器(CPU，Central Processing Unit)、智能算法芯片或电源管理芯片(PMIC，Power Management IC)。电子器件50可以为电子设备10内的主发热芯片。由于电子设备10的内部空间较为狭小，因此电子器件50高度集成在主板40上，以充分减小主板40的体积，降低主板40的空间占用率。电子器件50高度集成后，电子器件50所产生的热量也容易在一定空间内发生集聚，导致电子器件50温度升高，影响电子器件50的工作性能。例如，用户使用电子设备10进行长时间游戏、播放视频或通话的场景下，电子设备10的电子器件50由于长时间连续工作会产生大量的热量而形成热源。用户可以从电子设备10的外部明显感受到电子设备10温度升高。因此，需要将热量及时从电子设备10内部散失到电子设备10外部，才可以使得电子器件50位置的环境温度 处于正常工作温度范围内，保证电子器件50工作稳定。
屏蔽盒60设置于电子器件50的外部，并且屏蔽盒60罩设在电子器件50上。屏蔽盒60与主板40相连形成屏蔽空间100。例如，屏蔽盒60通过焊接工艺焊接于主板40。电子器件50位于屏蔽空间100内。屏蔽盒60可以用于屏蔽电子器件50，降低其他元器件的电磁信号或电子设备10所处环境的电磁信号干扰电子器件50。
相关技术中，在电子器件50和屏蔽盒60之间设置导热界面材料99。在屏蔽盒60和壳体30之间也设置导热界面材料99。屏蔽盒60为单层的不锈钢材质的板件。电子器件50产生的热量需要经过导热界面材料99、屏蔽盒60、导热界面材料99和壳体30进行散失。由于固体之间相互接触时，热阻较大，因此电子器件50产生的热量从电子器件50到壳体30需要经过两层导热界面材料99和一层屏蔽盒60进行散热的方式，使得电子器件50处的热量不能快速散失，从而导致散热效果偏差。另外，电子器件50与屏蔽盒60之间的导热界面材料99面积较小，热量主要通过导热界面材料99和屏蔽盒60上与导热界面材料99相对应的区域进行散失，而热量向屏蔽盒60和壳体30之间的导热界面材料99上远离电子器件50的区域传导缓慢，导致散热面积整体偏小，从而也会导致散热效果偏差。
本申请实施例提供的电子设备10，屏蔽组件可以将电子器件50传导至屏蔽罩上的热量快速引导至屏蔽罩远离电子器件50的区域，从而有利于提高散热效率，提升散热效果，保证电子器件50工作温度处于正常水平。另外，由于屏蔽组件的散热面积增大，因此屏蔽组件和壳体30之间的散热效率提高，有利于快速散热，提升散热效果。
下面对本申请实施例提供的电子设备10的实现方式进行阐述。
图4示意性地显示了一实施例的电子设备10的局部剖视结构。参见图4所示，本申请实施例的电子设备10包括主板40、电子器件50和屏蔽组件70。电子器件50设置于主板40。屏蔽组件70与主板40相连以形成屏蔽空间100。电子器件50位于该屏蔽空间100内。屏蔽组件70包括屏蔽罩71、毛细结构72和导热板73。电子器件50位于屏蔽罩71内并且与屏蔽罩71相连，以能够与屏蔽罩71之间进行热交换。主板40和屏蔽罩71相连形成屏蔽空间100，以屏蔽电子器件50。导热板73位于屏蔽罩71背向电子器件50的一侧。导热板73与屏蔽罩71相连并形成密封腔室701。毛细结构72设置于密封腔室701内。密封腔室701内填充有工质(图中未示出)。密封腔室701包括蒸发区701a和冷凝区701b。蒸发区701a位于电子器件50的上方。冷凝区701b远离电子器件50。毛细结构72用于产生毛细力以使工质从冷凝区701b流回蒸发区701a。
工质指的是可以用于换热的介质。例如，工质可以是水。电子器件50工作发热后成为热源。电子器件50的热量可以通过屏蔽罩71传导至蒸发区701a。位于蒸发区701a的工质从热源处吸收热量汽化形成蒸汽。蒸汽向冷凝区701b扩散流动并在冷凝区701b冷凝放出热量。毛细结构72通过毛细作用将冷凝后的工质从冷凝区701b吸取到蒸发区701a重新吸收热量，从而使得工质往复循环换热，不断从蒸发区701a吸收热量，在冷凝区701b释放热量，形成一个气液两相并存的循环换热系统。
参见图4和图5所示，密封腔室701还包括过渡区701c。过渡区701c位于蒸发区701a和冷凝区701b之间。位于蒸发区701a的工质汽化形成的蒸汽可以扩散到过渡 区701c。蒸汽经过过渡区701c时会释放热量，温度降低，但未能发生冷凝。蒸汽经过过渡区701c后，扩散到冷凝区701b并且在冷凝区701b冷凝放出热量。
屏蔽罩71内可以设置电子器件50和其他元器件。电子器件50与屏蔽罩71相对应的区域面积小于屏蔽罩71与壳体30相对应的区域面积。密封腔室701的蒸发区701a可以覆盖对应的电子器件50。电子器件50在主板40上的正投影位于密封腔室701的蒸发区701a在主板40上的正投影内。
本申请实施例的电子设备10中，屏蔽组件70的屏蔽罩71和导热板73之间设置毛细结构72。在密封腔室701内填充工质后，工质可以在蒸发区701a和冷凝区701b之间循环往复进行换热，以使电子器件50处的热量可以传导至屏蔽组件70远离电子器件50的区域。本申请实施例的屏蔽组件70可以增大散热面积和散热速率，从而有利于提高散热效率，实现对电子器件50的快速冷却，提升散热效果。
参见图4和图5所示，毛细结构72和屏蔽罩71可以为分体结构。屏蔽罩71面向导热板73的表面设置第一凹部713。毛细结构72设置于第一凹部713内。毛细结构72可以但不限于是以铜为基材的多孔介质，例如，铜网、铜粉烧结或泡沫铜。毛细结构72可以采用烧结方式连接于屏蔽罩71。
示例性地，可以采用冲压工艺在屏蔽罩71上形成第一凹部713。具体地，对屏蔽罩71的预定区域施加压应力，以使该预定区域向屏蔽罩71内部下沉，并形成第一凹部713。
图6示意性地显示了又一实施例的电子设备10的局部剖视结构。参见图6所示，毛细结构72与屏蔽罩71可以为一体成型结构。毛细结构72与屏蔽罩71一体成型指的是直接在屏蔽罩71上加工制造形成毛细结构72，从而毛细结构72和屏蔽罩71是一整体不可分离的结构。在屏蔽罩71上直接形成毛细结构72的方式，可以不再需要通过烧结等组装工序将毛细结构72和屏蔽罩71进行连接，有利于减少屏蔽罩71和额外设置的毛细结构72进行装配连接的工序。另外，如果屏蔽罩71和毛细结构72是通过组装的方式实现连接，则毛细结构72受到外力作用时，存在毛细结构72与屏蔽罩71发生分离或者错位的可能性，而本申请的屏蔽罩71上直接形成毛细结构72，可以降低发生上述问题的可能性。
在一些可实现的方式中，参见图7和图8所示，屏蔽罩71面向密封腔室701的表面具有毛细凹槽721。毛细凹槽721形成毛细结构72。毛细凹槽721在蒸发区701a至冷凝区701b的方向上延伸。毛细凹槽721可以是连续延伸的槽结构，从而工质可以在毛细凹槽721内顺利流动。蒸发区701a的毛细凹槽721内的工质在吸收来自外部的热量后汽化形成蒸汽，而蒸汽会从毛细凹槽721中脱离并向冷凝区701b流动。蒸汽在冷凝区701b冷凝放热后液化。冷凝区701b的毛细凹槽721会吸取工质，并通过毛细力将工质向蒸发区701a输送。
在一些示例中，屏蔽罩71上设置有多个毛细凹槽721，从而可以在单位时间将更多的工质吸取到蒸发区701a进行换热，有利于提高换热效率。多个毛细凹槽721可以相互间隔设置。毛细凹槽721可以为宽度在0.1毫米以下的微型凹槽。例如，毛细凹槽721的宽度范围可以是0.02毫米至0.1毫米。屏蔽罩71的厚度可以为0.1毫米，而毛细凹槽721的深度范围可以是0.03毫米至0.07毫米。示例性地，可以采用激光蚀刻 工艺或者化学蚀刻工艺在屏蔽罩71的表面上直接形成毛细凹槽721。
示例性地，参见图8所示，屏蔽罩71面向导热板73的表面具有第一凹部713。在第一凹部713的底壁上设置毛细凹槽721。导热板73面向屏蔽罩71的表面为平整表面。导热板73为厚度均匀的板体。导热板73覆盖第一凹部713。密封腔室701包括第一凹部713和毛细凹槽721。屏蔽罩71的厚度可以为0.1毫米。导热板73的厚度可以为0.1毫米。采用冲压工艺加工形成第一凹部713的方式中，第一凹部713的深度范围可以是0.03毫米至0.07毫米。毛细凹槽721的深度不超过屏蔽罩71的厚度，例如，毛细凹槽721的深度范围可以是0.03毫米至0.07毫米。
示例性地，参见图8所示，导热板73的边缘和屏蔽罩71焊接形成焊印200。或者，导热板73和屏蔽罩71的搭接区域焊接形成焊印200，并且焊印200被导热板73覆盖，从而在外部观察不到焊印200。
参见图9所示，导热板73的至少部分位于第一凹部713内，从而有利于减小屏蔽罩71和导热板73的总厚度，使得屏蔽组件70结构更加紧凑，降低屏蔽组件70的空间占用率。另外，导热板73的至少部分容纳于第一凹部713内，屏蔽罩71可以对导热板73上容纳于第一凹部713内的部分形成防护，使得导热板73上的该部分不易受到外部结构件碰撞而发生断裂或变形。在导热板73和屏蔽罩71通过焊接实现连接的实施例中，焊印200可以位于第一凹部713内，使得屏蔽罩71也可以对导热板73和屏蔽罩71形成的焊印200形成防护，降低焊印200受到撞击而发生开裂的可能性。示例性地，导热板73的外部轮廓形状与第一凹部713的形状相匹配。导热板73整体容纳于第一凹部713内。导热板73背向密封腔室701的外表面与屏蔽罩71的表面相齐平。
示例性地，可以采用蚀刻工艺在屏蔽罩71上加工形成第一凹部713。通过蚀刻工艺对屏蔽罩71的预定区域进行减薄处理，以使该预定区域厚度减小，形成第一凹部713。毛细凹槽721的深度和第一凹部713的深度的总和不超过屏蔽罩71的厚度。
示例性地，参见图9和图10所示，屏蔽罩71的表面为平整表面。在屏蔽罩71的表面上直接设置毛细凹槽721。导热板73包括第二凹部731。导热板73和屏蔽罩71相连。毛细凹槽721与第二凹部731相连通。密封腔室701包括第二凹部731和毛细凹槽721。位于蒸发区701a的工质从热源处吸收热量汽化形成蒸汽。蒸汽扩散到第二凹部731位于冷凝区701b的部分后，发生冷凝，而冷凝后的工质会被吸入毛细凹槽721。毛细凹槽721通过毛细作用将冷凝后的工质从冷凝区701b吸取到蒸发区701a重新吸收热量。工质汽化形成的蒸汽离开毛细凹槽721而扩散进入到第二凹部731位于蒸发区701a的部分。
示例性地，屏蔽罩71的厚度可以为0.1毫米。毛细凹槽721的深度范围可以是0.03毫米至0.07毫米。导热板73的厚度可以为0.1毫米，而第二凹部731的深度范围可以是0.05毫米至0.07毫米。
示例性地，参见图11所示，屏蔽罩71的表面具有第一凹部713。在第一凹部713的底壁上设置毛细凹槽721。导热板73包括第二凹部731。导热板73和屏蔽罩71相连。第一凹部713、毛细凹槽721以及第二凹部731相连通。密封腔室701包括第一凹部713、毛细凹槽721和第二凹部731。
示例性地，可以采用冲压工艺在导热板73上形成第二凹部731。具体地，对导热板73的预定区域施加压应力，以使该预定区域向导热板73外侧凸起，并形成第二凹部731。或者，可以采用蚀刻工艺在导热板73上加工形成第二凹部731。通过蚀刻工艺对导热板73的预定区域进行减薄处理，以使该预定区域厚度减小，形成第二凹部731。
在另一些示例中，屏蔽罩71面向密封腔室701的表面粗糙化处理以形成毛细结构72。屏蔽罩71面向密封腔室701的表面粗糙化处理后会形成具有不规则微孔通道的结构。示例性地，可以采用激光蚀刻工艺或者化学蚀刻工艺对屏蔽罩71的表面进行粗糙化处理。
在一些可实现的方式中，参见图12所示，屏蔽罩71选用金属材料，有利于提高散热效率。屏蔽罩71面向密封腔室701的表面上设置有防护层74。防护层74可以用于隔离密封腔室701内的工质和屏蔽罩71，以使工质不易与屏蔽罩71接触而发生化学反应，降低屏蔽罩71被工质氧化或腐蚀的可能性。示例性地，屏蔽罩71的材料可以为钢、钛金属、钛合金中的任意一种。例如，屏蔽罩71可以是不锈钢。屏蔽罩71自身屈服强度和硬度较高，使得屏蔽罩71的抗变形能力强，从而可以应对弯折、扭曲或撞击等情况而不易发生变形，降低因屏蔽罩71发生变形而挤压密封腔室701或挤压毛细结构72导致散热功能失效的可能性。防护层74的材料可以为铜或铜合金。工质为水时，防护层74不与水发生化学反应，从而防护层74不易被工质氧化或腐蚀。
示例性地，在屏蔽罩71上可以先通过蚀刻工艺加工形成毛细凹槽721，然后通过电镀工艺或化学沉积工艺在屏蔽罩71面向密封腔室701的表面上形成防护层74。
导热板73选用金属材料，有利于提高散热效率。导热板73面向密封腔室701的表面上设置有防护层74。防护层74可以用于隔离密封腔室701内的工质和导热板73，以使工质不易与导热板73接触而发生化学反应，降低导热板73被工质氧化或腐蚀的可能性。示例性地，导热板73的材料可以为钢、钛金属、钛合金中的任意一种。例如，导热板73可以是不锈钢。导热板73自身屈服强度和硬度较高，使得导热板73的抗变形能力强，从而可以应对弯折、扭曲或撞击等情况而不易发生变形，降低因导热板73发生变形而挤压密封腔室701或挤压毛细结构72导致散热功能失效的可能性。防护层74的材料可以为铜或铜合金。工质为水时，防护层74不与水发生化学反应，从而防护层74不易被工质氧化或腐蚀。
可以理解的是，为了降低屏蔽罩71和导热板73均与工质接触而发生氧化或腐蚀的可能性，导热板73面向密封腔室701的表面和导热板73面向密封腔室701的表面上均设置有防护层74。
密封腔室701为真空腔室。密封腔室701的蒸发区701a的工质可以在真空环境下发生液相汽化现象，形成蒸汽。工质在发生相变现象时会具有大量的潜热，而形成蒸汽后在真空环境中体积会迅速膨胀，有利于提高散热效果。示例性地，导热板73和屏蔽罩71可以在真空环境下进行连接，从而保证密封腔室701为真空环境。或者，导热板73和屏蔽罩71可以在非真空环境下进行连接，然后再对密封腔室701抽真空以形成真空环境。
导热板73与屏蔽罩71焊接密封，使得导热板73和屏蔽罩71之间连接强度高、 连接稳定性高，从而导热板73和屏蔽罩71之间不易发生分离，可以有效提高导热板73和屏蔽罩71之间的密封可靠性。同时，导热板73与屏蔽罩71直接焊接连接的方式，不再需要使用额外的连接件(例如紧固件或粘接件)将导热板73和屏蔽罩71连接起来，有利于简化导热板73和屏蔽罩71形成的换热结构，减小换热结构整体的体积，从而有利于减小换热结构的厚度。导热板73的边缘区域可以与屏蔽罩71焊接以形成环形焊印200。密封腔室701位于环形焊印200所限定的区域内。示例性地，屏蔽罩71的材料和导热板73的材料相同。例如，屏蔽罩71的材料和导热板73的材料均为不锈钢或钛金属。导热板73和屏蔽罩71可以通过钎焊或激光焊接工艺实现连接。
在一些示例中，在导热板73的边缘和屏蔽罩71之间预设置焊膏。采用钎焊工艺对焊膏进行加热。熔化后的焊膏固化后形成焊印200。导热板73和屏蔽罩71之间形成腔室。设置一个管道与腔室相连通，并通过管道向腔室内注入工质，然后通过管道对腔室进行抽真空。完成抽真空后，对管道进行密封处理，导热板73和屏蔽罩71之间形成具有工质的密封腔室701。最后，对密封腔室701进行密封性检测。
在一些可实现的方式中，参见图12所示，屏蔽罩71包括侧板711和顶板712。屏蔽罩71的侧板711和顶板712相交设置，两者之间具有预定夹角。例如，侧板711和顶板712夹角可以为90°。侧板711和顶板712之间也可以具有圆弧过渡段，减小侧板711和顶板712之间出现应力集中。屏蔽罩71的侧板711与主板40相连。示例性地，屏蔽罩71的侧板711与主板40之间通过焊接方式相连。屏蔽罩71的顶板712与导热板73相连并形成密封腔室701。电子器件50与屏蔽罩71的顶板712相连，并能够与屏蔽罩71的顶板712进行热交换。
在一些示例中，加工制造屏蔽罩71的坯料为平整板材。在坯料上用于形成屏蔽罩71的顶板712的区域先直接加工形成毛细结构72。然后，采用冲压工艺冲压坯料，以使坯料发生预定变形，形成具有侧板711和顶板712的屏蔽罩71。由于坯料的厚度较小，因此冲压形成的屏蔽罩71需要经过整形处理，以释放冲压后积累在屏蔽罩71内的内应力，降低因屏蔽罩71自身内应力过大而导致屏蔽罩71发生变形、扭曲，从而导致毛细结构72受到挤压变形发生失效的可能性。在常温环境下，使用整形设备在侧板711的外侧推动侧板711而对侧板711进行整形，以使侧板711充分释放内应力，从而保证侧板711在无内应力的情况下，与顶板712之间的夹角处于预定角度。
在另一些示例中，加工制造屏蔽罩71的坯料为平整板材。先采用冲压工艺冲压坯料，冲压出具有侧板711和顶板712的屏蔽罩71。然后对屏蔽罩71进行整形处理，充分释放屏蔽罩71的内应力。在常温环境下，使用整形设备在侧板711的外侧推动侧板711而对侧板711进行整形，以使侧板711充分释放内应力，从而保证侧板711在无内应力的情况下，与顶板712之间的夹角处于预定角度。最后，在完成整形的屏蔽罩71的顶板712上直接加工形成毛细结构72，从而也可以降低因屏蔽罩71自身内应力过大而导致屏蔽罩71发生变形、扭曲，从而导致毛细结构72受到挤压变形发生失效的可能性。
示例性地，坯料可以为钢、钛金属、钛合金中的任意一种，从而坯料自身屈服强度和刚度较大，使得经过冲压工艺后形成的屏蔽罩71自身内应力小，不易发生变形、扭曲。
在一些可实现的方式中，参见图13和图14所示，屏蔽组件70还包括屏蔽框架75。屏蔽框架75与主板40相连。屏蔽罩71与屏蔽框架75相连。屏蔽罩71通过屏蔽框架75与主板40相连。屏蔽罩71和屏蔽框架75均为金属材料。示例性地，屏蔽罩71和屏蔽框架75均为钢，例如不锈钢。屏蔽罩71与屏蔽框架75可拆卸连接，有利于提高对电子器件50进行检测或维修的便利性。在需要对屏蔽组件70内的电子器件50进行检测或维修时，将屏蔽罩71从屏蔽框架75上移除。完成检测或维修工作后，将屏蔽罩71重新安装于屏蔽框架75上。示例性地，屏蔽罩71可以通过卡接、粘接或紧固件连接的方式与屏蔽框架75相连。屏蔽框架75可以与主板40焊接。
在一些示例中，屏蔽罩71包括侧板711和顶板712。屏蔽框架75包括侧部751和顶部752。屏蔽框架75的侧部751和顶部752相交设置。屏蔽框架75的顶部752具有用于避让电子器件50的避让孔753。可以通过该避让孔753对电子器件50进行检测或维修。避让孔753的形状可以与电子器件50的整体形状相匹配，或者，避让孔753为规则形状并且面积大于电子器件50的正投影面积。示例性地，参见图14和图15所示，屏蔽罩71的侧板711与屏蔽框架75的侧部751卡接连接。屏蔽罩71的侧板711上具有凸起711a，而屏蔽框架75的侧部751具有用于与侧板711的凸起711a相卡接的卡接孔或卡接凹部。屏蔽罩71的顶板712覆盖屏蔽框架75的顶部752上开设的避让孔753。屏蔽罩71与避让孔753对应的区域与电子器件50相连。
在一些可实现的方式中，参见图14所示，电子设备10还包括第一导热件80和第二导热件90。第一导热件80位于屏蔽罩71内。电子器件50和屏蔽罩71之间设置第一导热件80。第一导热件80可以填充电子器件50和屏蔽罩71之间的间隙，有利于降低电子器件50和屏蔽罩71之间的热阻，提高电子器件50与屏蔽罩71之间的传热效率。第一导热件80面向电子器件50的表面与电子器件50面向屏蔽罩71的表面接触。第一导热件80面向屏蔽罩71的表面与屏蔽罩71面向电子器件50的表面接触。第一导热件80可以覆盖电子器件50面向屏蔽罩71的整个表面。第一导热件80与密封腔室701的蒸发区701a对应设置，从而第一导热件80传导至屏蔽罩71的热量会快速地加热蒸发区701a的工质并使得工质汽化蒸发。
第一导热件80具有弹性。第一导热件80受到外力作用时可以容易地压缩变形。电子器件50和屏蔽罩71可以共同对第一导热件80施加压应力，以使第一导热件80发生变形，从而第一导热件80可以更好地与电子器件50和屏蔽罩71实现贴合，降低第一导热件80与电子器件50或者第一导热件80与屏蔽罩71之间因存在间隙而导致热阻增大，影响传热效率的可能性。示例性地，第一导热件80可以是导热胶。例如，可以预先在电子器件50上涂覆导热性能良好的胶水，再将屏蔽罩71罩在电子器件50上并与胶水粘接。胶水凝固后可以形成第一导热件80。
电子设备10还包括壳体30。导热板73与壳体30相连，以能够与壳体30之间进行热交换。热量通过导热板73传递到壳体30上，并通过壳体30散失到电子设备10的外部。电子设备10的壳体30可以包括中框。导热板73与中框相连。电子设备10的壳体30也可以包括电池盖。导热板73与电池盖相连。
导热板73和壳体30之间设置第二导热件90。第二导热件90可以填充屏蔽罩71 和壳体30之间的间隙，有利于降低屏蔽罩71和壳体30之间的热阻，提高屏蔽罩71与壳体30之间的传热效率。第二导热件90的面积大于第一导热件80的面积。第二导热件90覆盖导热板73上对应密封腔室701的区域，从而导热板73上的不同区域的热量都能够传导至第二导热件90，并通过第二导热件90传导至壳体30。电子器件50处产生的热量通过第一导热件80传导至屏蔽罩71上与密封腔室701的蒸发区701a对应的区域。蒸发区701a的工质吸收热量后汽化蒸发并向远离蒸发区701a的冷凝区701b流动。工质可以快速地将热量传导至屏蔽罩71和导热板73远离蒸发区701a的区域，以降低热量在蒸发区701a集聚的可能性。导热板73的热量传导至第二导热件90，再经过第二导热件90传导至壳体30。第一导热件80处的热量可以快速扩散到屏蔽组件70和第二导热件90，使得散热面积增大，提高了散热效率。
第二导热件90具有弹性。第二导热件90受到外力作用时可以容易地压缩变形。导热板73和壳体30可以共同对第二导热件90施加压应力，以使第二导热件90发生变形，从而第二导热件90可以更好地与导热板73和壳体30实现贴合，降低第二导热件90与屏蔽罩71或者第二导热件90与壳体30之间因存在间隙而导致热阻增大，影响传热效率的可能性。示例性地，第二导热件90可以是导热胶。例如，可以预先在导热板73上涂覆导热性能良好的胶水，再将壳体30与胶水粘接。胶水凝固后可以形成第二导热件90。示例性地，第二导热件90可以是石墨烯片。将加工成形的石墨烯片贴合在导热板73和壳体30上。石墨烯片具有低热阻、重量轻和高导热系数的性能，散热效率高。
导热板73自身的厚度较小，可以保证导热板73具有良好的热传导性能。但是，厚度较小的导热板73受到外力作用时，易于发生变形。如果导热板73发生塌陷变形，导热板73塌陷部分会压缩密封腔室701，导致密封腔室701缩小而影响工质正常循环的流动性，降低换热效率，并且也存在导热板73塌陷部分挤压毛细结构72而导致毛细结构72损坏失效的可能性。参见图15和图16所示，屏蔽组件70还包括支撑柱76。支撑柱76位于密封腔室701内。支撑柱76的一端部与屏蔽罩71相连，另一端部与导热板73相连，从而支撑柱76可以为导热板73提供支撑力，降低导热板73因下方没有支撑而朝向屏蔽罩71发生塌陷变形的可能性，使得导热板73背向屏蔽罩71的表面可以处于平整状态。密封腔室701内的毛细结构72避让支撑柱76设置。
在一些示例中，屏蔽罩71、支撑柱76和导热板73通过组装方式连接。将支撑柱76的一端粘接于屏蔽罩71上，然后将导热板73扣合在屏蔽罩71上并且使得支撑柱76的另一端粘接于导热板73上。
在一些示例中，支撑柱76和导热板73为一体成型结构。在导热板73上直接加工形成支撑柱76，从而可以保证导热板73和支撑柱76的连接强度较高，降低支撑柱76受到外力作用而与导热板73脱离连接状态或者发生弯曲失去支撑作用的可能性。示例性地，可以采用模型铸造的方式形成导热板73和支撑柱76。或者，可以采用蚀刻工艺对坯料进行蚀刻处理，将坯料上用于面向密封腔室701的区域减薄以同时形成导热板73和支撑柱76。减薄区域形成导热板73的第二凹部731。在导热板73和屏蔽罩71相连后，支撑柱76远离导热板73的一端部连接于屏蔽罩71，而导热板73的第二凹部731形成密封腔室701的一部分。
图17示意性地显示了电子设备10制造方法的流程图。参见图17所示，本申请实施例提供一种电子设备10制造方法，包括：
步骤S100：提供主板40；
步骤S200：提供电子器件50，将电子器件50与主板40相连；
步骤S300：提供屏蔽组件70，屏蔽组件70包括屏蔽罩71、毛细结构72和导热板73，导热板73与屏蔽罩71相连并形成密封腔室701，毛细结构72设置于密封腔室701内，在密封腔室701内填充工质，密封腔室701包括蒸发区701a和冷凝区701b，毛细结构72用于使工质从冷凝区701b流回蒸发区701a；
将屏蔽罩71与主板40相连形成容纳电子器件50的屏蔽空间，以屏蔽电子器件50，电子器件50与屏蔽罩71相连，导热板73位于屏蔽罩71背向电子器件50的一侧，蒸发区701a位于电子器件50的上方。
本申请实施例的电子设备10制造方法制造的电子设备10中，屏蔽组件70的屏蔽罩71和导热板73之间设置毛细结构72。密封腔室701内填充的工质可以在蒸发区701a和冷凝区701b之间循环往复进行换热，以使电子器件50处的热量可以传导至屏蔽组件70远离电子器件50的区域。本申请实施例中，屏蔽组件70可以增大散热面积和散热速率，从而有利于提高散热效率，实现对电子器件50的快速冷却，提升散热效果。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：在屏蔽罩71背向电子器件50的区域加工形成毛细结构72。毛细结构72与屏蔽罩71为一体成型结构。在屏蔽罩71上直接形成毛细结构72的方式，可以不再需要通过烧结等组装工序将毛细结构72和屏蔽罩71进行连接，有利于减少屏蔽罩71和额外设置的毛细结构72进行装配连接的工序。另外，如果屏蔽罩71和毛细结构72是通过组装的方式实现连接，则毛细结构72受到外力作用时，存在毛细结构72与屏蔽罩71发生分离或者错位的可能性，而本申请的屏蔽罩71上直接形成毛细结构72，可以降低发生上述问题的可能性。
在一些示例中，在屏蔽罩71背向电子器件50的区域加工形成毛细凹槽721，而毛细凹槽721形成毛细结构72。
在一些示例中，采用蚀刻工艺在屏蔽罩71面向密封腔室701的表面形成毛细凹槽721。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：在屏蔽罩71面向导热板73的表面加工形成第一凹部713，密封腔室701包括第一凹部713，而毛细结构72设置于第一凹部713内。
在一些示例中，导热板73的至少部分位于第一凹部713内。导热板73的至少部分位于第一凹部713内，从而有利于减小屏蔽罩71和导热板73的总厚度，使得屏蔽组件70结构更加紧凑，降低屏蔽组件70的空间占用率。另外，导热板73的至少部分容纳于第一凹部713内，屏蔽罩71可以对导热板73上容纳于第一凹部713内的部分形成防护，使得导热板73上的该部分不易受到外部结构件碰撞而发生断裂或变形。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：在屏蔽罩71面向密封腔室701的表面和导热板73面向密封腔室701的表面中的至少一者上设置防护层74。防护层74可以用于隔离密封腔室701内的工质和导热板73，以使工质不易与导热板73接触而发生化学反应，降低导热板73被工质氧化或腐蚀的可能性。
在一些示例中，屏蔽罩71的材料为钢、钛金属、钛合金中的任意一种，导热板73的材料为钢、钛金属、钛合金中的任意一种，防护层74的材料为铜或铜合金。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：屏蔽罩71包括侧板711和顶板712，将屏蔽罩71的侧板711与主板40相连，屏蔽罩71的顶板712与导热板73相连并形成密封腔室701。
在一些可实现的方式中，将密封腔室701抽真空。密封腔室701为真空腔室。密封腔室701的蒸发区701a的工质可以在真空环境下发生液相汽化现象，形成蒸汽。工质在发生相变现象时会具有大量的潜热，而形成蒸汽后在真空环境中体积会迅速膨胀，有利于提高散热效果。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：导热板73与屏蔽罩71焊接密封，以形成密封腔室701。导热板73与屏蔽罩71焊接密封，使得导热板73和屏蔽罩71之间连接强度高、连接稳定性高，从而导热板73和屏蔽罩71之间不易发生分离，可以有效提高导热板73和屏蔽罩71之间的密封可靠性。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：屏蔽组件70还包括屏蔽框架75，将屏蔽框架75与主板40相连，将屏蔽罩71与屏蔽框架75相连。
在一些示例中，屏蔽罩71包括侧板711和顶板712。屏蔽框架75包括侧部751和顶部752。屏蔽框架75的顶部752具有用于避让电子器件50的避让孔753。屏蔽罩71的侧板711与屏蔽框架75的侧部751可拆卸连接。屏蔽罩71的顶板712覆盖避让孔753。可以通过该避让孔753对电子器件50进行检测或维修。屏蔽罩71与屏蔽框架75可拆卸连接，有利于提高对电子器件50进行检测或维修的便利性。
在一些可实现的方式中，提供壳体30、第一导热件80和第二导热件90。将第一导热件80设置于电子器件50或屏蔽罩71，屏蔽罩71与主板40相连后，第一导热件80位于电子器件50和屏蔽罩71之间。将第二导热件90设置于导热板73或壳体30，导热板73和壳体30通过第二导热件90相连。电子器件50和屏蔽罩71之间设置第一导热件80。电子器件50处的热量可以传导至屏蔽组件70远离电子器件50的区域，再通过屏蔽组件70传导至壳体30，最终由壳体30传导至电子设备10外部。第一导热件80可以填充电子器件50和屏蔽罩71之间的间隙，有利于降低电子器件50和屏蔽罩71之间的热阻，提高电子器件50与屏蔽罩71之间的传热效率。导热板73和壳体30之间设置第二导热件90。第二导热件90可以填充屏蔽罩71和壳体30之间的间隙，有利于降低屏蔽罩71和壳体30之间的热阻，提高屏蔽罩71与壳体30之间的传热效率。
在一些示例中，第一导热件80和第二导热件90均具有弹性。电子器件50和屏蔽罩71可以共同对第一导热件80施加压应力，以使第一导热件80发生变形，从而第一导热件80可以更好地与电子器件50和屏蔽罩71实现贴合，降低第一导热件80与电子器件50或者第一导热件80与屏蔽罩71之间因存在间隙而导致热阻增大，影响传热效率的可能性。导热板73和壳体30可以共同对第二导热件90施加压应力，以使第二导热件90发生变形，从而第二导热件90可以更好地与导热板73和壳体30实现贴合，降低第二导热件90与屏蔽罩71或者第二导热件90与壳体30之间因存在间隙而导致热阻增大，影响传热效率的可能性。
在一些示例中，第一导热件80为导热胶，第二导热件90为导热胶或石墨烯片。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：屏蔽组件70还包括支撑柱76。支撑柱76位于密封腔室701内。支撑柱76的一端部与屏蔽罩71相连，另一端部与导热板73相连。支撑柱76可以为导热板73提供支撑力，降低导热板73因下方没有支撑而朝向屏蔽罩71发生塌陷变形的可能性，使得导热板73背向屏蔽罩71的表面可以处于平整状态。
在一些示例中，支撑柱76和导热板73为一体成型结构。在导热板73上直接加工形成支撑柱76，从而可以保证导热板73和支撑柱76的连接强度较高，降低支撑柱76受到外力作用而与导热板73脱离连接状态或者发生弯曲失去支撑作用的可能性。
在一些可实现的方式中，在提供屏蔽组件70的步骤中：在导热板73面向屏蔽罩71的表面加工形成第二凹部731，而支撑柱76位于第二凹部731内。密封腔室701包括第二凹部731。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
在本申请实施例或者暗示所指的装置或者元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。在本申请实施例的描述中，“多个”的含义是两个或两个以上，除非是另有精确具体地规定。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请实施例的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
本文中的术语“多个”是指两个或两个以上。本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系；在公式中，字符“/”，表示前后关联对象是一种“相除”的关系。
可以理解的是，在本申请的实施例中涉及的各种数字编号仅为描述方便进行的区分，并不用来限制本申请的实施例的范围。
可以理解的是，在本申请的实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请的实施例的实施过程构成任何限定。

Claims (18)

  1. 一种电子设备，其特征在于，至少包括：
    主板；
    电子器件，设置于所述主板；
    屏蔽组件，包括屏蔽罩、毛细结构和导热板，所述电子器件位于所述屏蔽罩内并且与所述屏蔽罩相连，所述主板和所述屏蔽罩相连形成屏蔽空间，以屏蔽所述电子器件，所述导热板位于所述屏蔽罩背向所述电子器件的一侧，所述导热板与所述屏蔽罩相连并形成密封腔室，所述毛细结构设置于所述密封腔室内，所述密封腔室内填充有工质，所述密封腔室包括蒸发区和冷凝区，所述蒸发区位于所述电子器件的上方，所述毛细结构用于使所述工质从所述冷凝区流回所述蒸发区。
  2. 根据权利要求1所述的电子设备，其特征在于，所述毛细结构与所述屏蔽罩为一体成型结构。
  3. 根据权利要求2所述的电子设备，其特征在于，所述屏蔽罩面向所述密封腔室的表面具有毛细凹槽，所述毛细凹槽形成所述毛细结构。
  4. 根据权利要求3所述的电子设备，其特征在于，采用蚀刻工艺在所述屏蔽罩面向所述密封腔室的表面形成所述毛细结构。
  5. 根据权利要求1至4任一项所述的电子设备，其特征在于，所述屏蔽罩面向所述导热板的表面设置第一凹部，所述密封腔室包括所述第一凹部，所述毛细结构设置于所述第一凹部内。
  6. 根据权利要求5所述的电子设备，其特征在于，所述导热板的至少部分位于所述第一凹部内。
  7. 根据权利要求1至6任一项所述的电子设备，其特征在于，所述屏蔽罩面向所述密封腔室的表面和所述导热板面向所述密封腔室的表面中的至少一者上设置有防护层。
  8. 根据权利要求7所述的电子设备，其特征在于，所述屏蔽罩的材料为钢、钛金属、钛合金中的任意一种，所述导热板的材料为钢、钛金属、钛合金中的任意一种，所述防护层的材料为铜或铜合金。
  9. 根据权利要求1至8任一项所述的电子设备，其特征在于，所述屏蔽罩包括侧板和顶板，所述侧板与所述主板相连，所述顶板与所述导热板相连并形成所述密封腔室。
  10. 根据权利要求1至9任一项所述的电子设备，其特征在于，所述密封腔室为真空腔室，或者，所述导热板和所述屏蔽罩焊接密封。
  11. 根据权利要求1至10任一项所述的电子设备，其特征在于，所述屏蔽组件还包括屏蔽框架，所述屏蔽框架与所述主板相连，所述屏蔽罩与所述屏蔽框架相连。
  12. 根据权利要求11所述的电子设备，其特征在于，所述屏蔽罩包括侧板和顶板，所述屏蔽框架包括侧部和顶部，所述顶部具有用于避让所述电子器件的避让孔，所述侧板与所述侧部可拆卸连接，所述顶板覆盖所述避让孔。
  13. 根据权利要求1至12任一项所述的电子设备，其特征在于，所述电子设备还包括壳体，所述导热板与所述壳体相连，所述电子设备还包括第一导热件和第二导热件，所述电子器件和所述屏蔽罩之间设置所述第一导热件，所述导热板和所述壳体之间设置所述第二导热件。
  14. 根据权利要求13所述的电子设备，其特征在于，所述第一导热件和所述第二导热件均具有弹性。
  15. 根据权利要求13所述的电子设备，其特征在于，所述第一导热件为导热胶，所述第二导热件为导热胶或石墨烯片。
  16. 根据权利要求1至15任一项所述的电子设备，其特征在于，所述屏蔽组件还包括支撑柱，所述支撑柱位于所述密封腔室内，所述支撑柱的一端部与所述屏蔽罩相连，另一端部与所述导热板相连。
  17. 根据权利要求16所述的电子设备，其特征在于，所述支撑柱和所述导热板为一体成型结构。
  18. 根据权利要求16或17所述的电子设备，其特征在于，所述导热板具有第二凹部，所述支撑柱位于所述第二凹部内，所述密封腔室包括所述第二凹部。
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