WO2022061724A1

WO2022061724A1 - Feed structure, antenna, and communication device

Info

Publication number: WO2022061724A1
Application number: PCT/CN2020/117784
Authority: WO
Inventors: 陈亮; 曹菊鹏; 谢国庆; 邸允会; 余彦民
Original assignee: 华为技术有限公司
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2022-03-31
Also published as: CN115943527A

Abstract

Disclosed are a feed structure, an antenna, and a communication device. The feed structure comprises: a dielectric plate, the dielectric plate comprising a first surface and a second surface opposite each other; a first electrically-conductive film, the first electrically-conductive film being provided on the first surface of the dielectric plate; a feed unit, the feed unit being provided on the first surface of the dielectric plate, and the feed unit being used for feeding electricity to the first electrically-conductive film; and a first protective layer, the first protective layer being provided between the feed unit and the first electrically-conductive film, the first protective layer employing an insulating material, and the first protective layer being used for separating the feed unit from the electrically-conductive film, thus allowing the feed unit to be coupled and connected to the first electrically-conductive film. As such, the feed unit and the first electrically-conductive film can be separated by the first protective film, thus allowing the feed unit to be coupled and feed electricity to the first electrically-conductive film, and further stabilizing performance.

Description

Feeding structures, antennas and communication equipment

technical field

The embodiments of the present application relate to the field of communication technologies, and in particular, to a feeding structure, an antenna, and a communication device.

Background technique

At present, thin-film antennas are widely used in automotive electronics, wireless communications, Internet of Things and other fields. The feeding structure of the thin film antenna includes: a dielectric plate, a conductive film (conductive film, CF) disposed on the dielectric plate, and a feeding unit, and the feeding unit is used for feeding the conductive film.

In the prior art, the feeding unit of the thin-film antenna is usually connected to other parts by welding. However, the conductive film of the thin-film antenna is easily deformed and melted by heat during high-temperature welding, which adversely affects the performance of the antenna.

SUMMARY OF THE INVENTION

The embodiments of the present application provide a feeding structure, an antenna and a communication device, which solve the problem that the thin-film antenna is susceptible to thermal deformation during assembly.

To achieve the above object, the application adopts the following technical solutions:

In one aspect of the embodiments of the present application, a feeding structure is provided, including: a dielectric plate, the dielectric plate includes a first surface and a second surface opposite to each other; a first conductive film, the first conductive film is disposed on the dielectric plate a first surface; a feeding unit, the feeding unit is arranged on the first surface of the dielectric plate, the feeding unit is used to feed the first conductive film; a first protective layer, the first protective layer is arranged on the first surface Between the feeding unit and the first conductive film, the first protective layer is used to separate the feeding unit and the first conductive film, so that the feeding unit is coupled and connected to the first conductive film. Therefore, the feeding unit can be separated from the first conductive film by the first protective layer, so that the feeding unit can transmit the radio frequency signal to the first conductive film circuit by means of coupling feeding, avoiding the need for welding In the direct feeding mode of connection, the first conductive film is deformed and melted by heat, which improves the stability of the feeding structure. In addition, by providing the first protective layer, the surface is smoother, and the oxidation of the first conductive film can also be avoided.

In an optional implementation manner, the feeding structure further includes: a grounding unit and a second conductive film, the second conductive film is coupled and connected to the grounding unit, and the second conductive film is coupled and connected to the first conductive film. Therefore, the connection instability caused by the direct connection between the second conductive film and the first ground unit is avoided, and the stability of the electrical connection is improved.

In an optional implementation manner, the second conductive film is disposed on the second surface of the dielectric plate, and a surface of the second conductive film away from the dielectric plate is covered with a second protective layer. Thus, the second protective layer can protect the second conductive film and prevent the first conductive film from being oxidized or scratched.

In an optional implementation manner, the second conductive film is disposed between the first surface of the dielectric plate and the first conductive film, and a second protection film is provided between the second conductive film and the first conductive film Floor. Thus, the second protective layer can separate the second conductive film and the first conductive film, so that the second conductive film and the first conductive film are coupled and connected. In addition, the second protective layer is also used to protect the second conductive film to prevent the first conductive film from being oxidized or scratched.

In an optional implementation manner, a gap is provided on the second conductive film and the second protective layer, and the first conductive film and the first protective layer are provided in the gap. Therefore, the first conductive film and the first protective layer are disposed in the gap between the second conductive film and the second protective layer, which saves space and facilitates miniaturization of the product. At the same time, the surface of the feeding structure is made flatter.

In an optional implementation manner, the first protective layer or the second protective layer adopts: polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP/COC, At least one of polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.

In an optional implementation manner, the feeding unit further includes a cable and a mounting member, the cable includes a ground conductor, and the mounting member includes: a clamping portion disposed close to the second surface of the dielectric board; the clamping portion The second conductive film is coupled and connected to the clamping portion. Thereby, the first conductive film can be coupled to ground through the second conductive film, the clamping portion and the ground conductor in sequence.

In an optional implementation manner, the feeding unit includes a feeding sheet, the cable further includes a feeding wire, the feeding wire is electrically connected to the feeding sheet, and the feeding sheet is disposed on the first protective layer away from the power feeding sheet. The surface of the first conductive film; the feeding unit for coupling and feeding the first conductive film includes: the feeding line is used for feeding the feeding sheet, and the feeding sheet is used for coupling to the first conductive film feed. Thereby, the feeding line can couple the feeding to the first conductive film through the feeding sheet.

In an optional implementation manner, the feeding structure further includes: a connecting piece; wherein, the feeding piece, the dielectric plate, and the mounting piece are provided with connecting holes adapted to the connecting piece, and the connecting piece is in turn The connecting member is detachably connected to the feeding sheet, the dielectric plate and the mounting member through the connecting hole of the feeding sheet, the medium plate and the mounting member. Thereby, the first conductive film and the first protective layer between the feeding sheet and the dielectric board are tightly fixed by the feeding sheet and the dielectric board, and the second conductive film and the second protective layer between the mount and the dielectric board are The mount and the media plate are tightly secured. At the same time, the detachable connection method is adopted, which reduces the difficulty of installation.

In an optional implementation, the feed plate includes a third surface close to the first protective layer, and a fourth surface opposite to the third surface; conductors are provided on both the third surface and the fourth surface , the feed line is electrically connected to the conductor on the fourth surface, and the conductor on the third surface is electrically connected to the conductor on the fourth surface through metallized through holes; A conductive film coupling and feeding includes: the feeding sheet is used for coupling and feeding the first conductive film through a conductor arranged on the third surface. Thus, the feed line can feed the conductors on the fourth surface of the feed strip, the feed strip can transmit signals through the metallized through holes to the conductors on the third surface, and through the conductors on the third surface to the first surface The conductive film is coupled to the feeding, so the feeding line only needs to be connected to the conductor on the fourth surface of the feeding sheet, which reduces the installation difficulty of the feeding line.

In an optional implementation manner, the feed line and the ground conductor are arranged coaxially, and an insulating material is provided between the ground conductor and the feed line. Accordingly, the feed line and the ground conductor are coaxially arranged, and space can be saved.

In an optional implementation manner, the first conductive film or the second conductive film includes at least one of metal grids, metal nanowires, carbon nanotubes, graphene, and metal oxides.

In a second aspect of the embodiments of the present application, an antenna is provided, the antenna includes: a radiating element and the above-mentioned feeding structure, where the feeding structure is electrically connected to the radiating element. Therefore, the antenna adopts the above-mentioned feeding structure, and has the same technical effect as the feeding structure provided in the foregoing embodiment, which will not be repeated here.

In a third aspect of the embodiments of the present application, a communication device is provided, including a radio frequency module and the above-mentioned antenna unit, wherein the radio frequency module and the antenna unit are electrically connected. Therefore, the communication device adopts the above-mentioned antenna unit, and has the same technical effect as the feeding structure provided in the foregoing embodiment, which will not be repeated here.

Description of drawings

FIG. 1 is a schematic structural diagram of a communication device provided by an embodiment of the present application;

FIG. 2 is a schematic structural diagram of an antenna provided by an embodiment of the present application;

3 is a schematic diagram of a disassembled structure of a feed structure provided by an embodiment of the present application;

Fig. 3a is the structural schematic diagram of the feeding structure in Fig. 3;

Figure 3b is a schematic structural diagram of the mounting member in Figure 3;

Fig. 4 is the top view of the feeding structure in Fig. 3;

5 is a schematic diagram of a disassembled structure of another feeding structure provided by an embodiment of the present application;

Fig. 5a is the structural schematic diagram of the feeding structure in Fig. 5;

Figure 5b is a schematic structural diagram of the mounting member in Figure 5;

FIG. 6 is a top view of the feeding structure in FIG. 5 .

detailed description

In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

Hereinafter, the terms "first", "second", etc. are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", etc., may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more.

In addition, in this application, orientation terms such as "upper" and "lower" are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used for relative In the description and clarification of the drawings, it may change correspondingly according to the change of the orientation in which the components are placed in the drawings.

The term "and/or" in this application is only an association relationship to describe associated objects, which means that there can be three kinds of relationships, for example, A and/or B, which can mean that A exists alone, A and B exist at the same time, independently There are three cases of B. In addition, the character "/" in this document generally indicates that the related objects are an "or" relationship.

In this application, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" may be a fixed connection, a detachable connection, or an integrated body; it may be directly connected, or Can be indirectly connected through an intermediary. Furthermore, the term "coupled connection" may be a connection that enables signal transmission.

Hereinafter, terms that may appear in the embodiments of the present application are explained.

Electrical connection: It can be understood as the physical contact and electrical conduction between the conductors of the components, and it can also be understood as the entities that can transmit electrical signals between different components in the circuit structure through printed circuit board (PCB) copper foil or wires. The form in which the line is connected.

Coupling: refers to the phenomenon that there is no physical contact between the input and output of two or more circuit elements or electrical networks, but influence each other, and transmit energy from one side to the other through interaction.

An embodiment of the present application provides a communication device. As shown in FIG. 1 , the communication device 0001 includes, for example, an antenna 02 .

The communication device 0001 provided in this embodiment of the present application can be applied to electronic devices with wireless communication functions, such as cellular base station devices, wireless local area network (WLAN) devices, automotive electronic devices, and Internet of Things (IOT) devices.

The communication device, for example, also includes a radio frequency module (Radio Frequency module, AF module) 03. The radio frequency module 03 is electrically connected to the antenna 02 , and the radio frequency module 03 is used for sending and receiving electromagnetic signals to the antenna 02 through the feeding point 01 . The antenna 02 radiates electromagnetic waves according to the received electromagnetic signals or sends electromagnetic signals to the radio frequency module 03 according to the received electromagnetic waves, so as to realize the sending and receiving of wireless signals. Wherein, the radio frequency module (03 is a transceiver (transmitter and/or receiver, T/R) and other circuits that can transmit and/or receive radio frequency signals.

Please refer to FIG. 2 , which is a schematic structural diagram of an antenna provided by an embodiment of the present application. As shown in FIG. 2 , the antenna 02 includes: a feeding structure 001 and a radiating element 002.

The feeding structure 001 and the radiation unit 002 are electrically connected, and the feeding structure 001 is used to feed the radiation unit 002, so that the radiation unit 002 radiates or receives electromagnetic waves.

FIG. 3 is a schematic diagram of a disassembled structure of a feeding structure provided by an embodiment of the present application, and FIG. 3 a is a schematic structural diagram of the feeding structure in FIG. 3 . FIG. 3b is a schematic structural diagram of the mounting member in FIG. 3 . FIG. 4 is a top view of the feeding structure in FIG. 3 . As shown in FIG. 3 , FIG. 3 a , FIG. 3 b , and FIG. 4 , the power feeding structure 001 includes: a dielectric plate 10 , a first conductive film 20 and a power feeding unit 40 .

Wherein, the dielectric plate 10 includes, for example, an opposite first surface a1 and a second surface a2. It should be noted that, in FIG. 3 , the first surface a1 is, for example, the upper surface of the dielectric board 10 , and the second surface a2 is, for example, the lower surface of the dielectric board 10 , wherein the first and the second are relative concepts, which can be Variations occur according to changes in the orientation of the components in the drawings.

The first conductive film 20 is disposed on, for example, the first surface a1 of the dielectric plate 10 . Specifically, the first conductive film 20 may be a feeding strip line disposed on the first surface a1. Combining the structure of the antenna shown in FIG. 2 and the feeding structure shown in FIG. On the first surface a1 and connected to the first conductive film 20 , the first conductive film 20 can be used to feed the radiation element 002 .

The embodiments of the present application do not limit the material of the dielectric plate 10. In some embodiments of the present application, the dielectric plate 10 may be polymer, glass, or filled with gas.

The power feeding unit 40 is used for feeding power to the first conductive film 20 .

The embodiment of the present application does not limit the material structure of the first conductive film 20. The material structure of the first conductive film 20 includes: at least one of metal grids, metal nanowires, carbon nanotubes, graphene, and metal oxides A sort of. Wherein, when the material structure of the first conductive film 20 is a metal mesh, it may be a copper mesh, a silver mesh, or a nickel alloy mesh, etc., which have better electrical conductivity than other material structures.

In some embodiments, a conductive adhesive or a conductive double-sided tape is used at the contact point between the feeding unit 40 and the first conductive film 20 to connect and conduct the feeding unit 40 and the first conductive film 20, but the contact point is The connection at the point is unstable, and the degradation of passive intermodulation (PIM) characteristics is prone to occur.

Among them, PIM refers to the characteristics of passive components such as connectors, feeders, filters, etc., which work under the condition of high-power signals with multiple carrier frequencies due to the nonlinearity of the components themselves. Passive intermodulation is caused by many factors, including: poor mechanical contact.

In other embodiments, the first conductive film 20 is crimped on the feeding unit 40 , and the conductive surface of the first conductive film 20 is electrically connected to the feeding unit 40 . The contact feeding method in which the conductive surfaces are directly crimped is adopted, which avoids the melting of the first conductive film 20 caused by the welding connection method, and reduces the assembly difficulty of the thin film antenna.

However, the surface flatness of the directly crimped feeding structure 001 is difficult to control, and the anti-oxidation effect is not good, so it is not suitable for mass production and long-term use.

To this end, the embodiment of the present application further improves the feeding structure 001 .

3, the feeding structure 001 further includes: a first protective layer 201, the first protective layer 201 is located between the feeding unit 40 and the first conductive film 20, the first protective layer 201 is made of insulating material, for example. The first protective layer 201 is used to separate the feeding unit 40 from the first conductive film 20 , so that the feeding unit 40 and the first conductive film 20 are coupled and connected.

It should be noted that the vertical projection of the feeding unit 40 on the dielectric plate 10 intersects the first conductive film 20 , and the feeding unit 40 can couple and feed the first conductive film 20 during operation.

The embodiment of the present application does not limit the material of the first protective layer 201 , and the first protective layer 201 is, for example, an insulating material. The material of the first protective layer 201 can be polyethylene terephthalate film PET, polyimide film PI, cyclic olefin polymer film COP/COC, polycarbonate film PC, polyethylene film PE, polychlorinated At least one of vinyl film PVC and polyethylene naphthalate film PEN.

The first conductive film 20 can be connected to the dielectric board 10 by, for example, crimping, and the first protective layer 201 can be connected to the first conductive film, for example, by crimping. The first protective layer 201 can also be used to protect the first conductive film 20 to prevent the first conductive film 20 from being oxidized or scratched.

It should be noted that the crimping refers to a connection produced by mechanically pressing the first conductive film 20 or the first protective layer 201 with a manual or automatic special crimping tool.

Therefore, the feeding unit 40 can be separated from the first conductive film 20 by the first protective layer 201 , so that the feeding unit 40 can transmit the radio frequency signal to the first conductive film 20 by coupling feeding. On the circuit, the performance is more stable, the first conductive film 20 is prevented from being deformed and melted by heat due to the welding connection method, the assembly difficulty of the feeding structure 001 is reduced, and the stability of the feeding structure 001 is improved. In addition, by providing the first protective layer 201, the surface is more flat, and the oxidation of the first conductive film 20 can also be avoided.

In addition, the feeding structure 001 further includes: a ground unit and a second conductive film 30 , the second conductive film 30 is coupled and connected to the ground unit, and the second conductive film 30 is connected to the first conductive film 20 Coupling connection. The embodiments of the present application do not limit the structure of the grounding unit. In some embodiments of the present application, as shown in FIG. 3 , the grounding unit includes: a mounting member 50 and a grounding conductor 4022 .

Wherein, the second conductive film 30 is a grounding plate disposed on the surface of the dielectric plate 10 for realizing a grounding function. During operation, the second conductive film 30 is coupled and connected to the mounting member 50 of the grounding unit, and grounding can be achieved through the grounding unit.

In some embodiments of the present application, the second conductive film 30 and the first conductive film 20 use the same structure.

This embodiment of the present application does not limit the position of the second conductive film 30 . In some embodiments of the present application, as shown in FIG. 3 , the second conductive film 30 is disposed on the second surface a2 of the dielectric board 10 , and the surface of the second conductive film 30 away from the dielectric board 10 is covered with The second protective layer 301 .

The second protective layer 301 can be made of insulating material, and the second protective layer 301 is used to protect the second conductive film 30 to prevent the second conductive film 30 from being oxidized or scratched.

The embodiment of the present application does not limit the material of the second protective layer 301 , the second protective layer 301 can be made of the same material as the first protective layer 201 , and the material of the second protective layer 301 can be made of the following materials At least one: polyethylene terephthalate film PET, polyimide film PI, cycloolefin polymer film COP/COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, poly ethylene naphthalate film PEN.

The second protective layer 301 can be connected to the second conductive film 30 by, for example, crimping.

In other embodiments of the present application, as shown in FIG. 5 , the second conductive film 30 is disposed between the first surface a1 of the dielectric plate 10 and the first conductive film 20 , and the second conductive film 30 and the A second protective layer 301 is provided between the first conductive films 20 .

In this embodiment, the second protective layer 301 is used to separate the second conductive film 30 from the first conductive film 20 , so that the second conductive film 30 and the first conductive film 20 are coupled and connected. In addition, the second protective layer 301 is also used to protect the second conductive film 30 to prevent the second conductive film 30 from being oxidized or scratched.

In other embodiments of the present application, referring next to FIG. 5 , the second conductive film 30 is disposed between the first surface a1 of the dielectric plate 10 and the first conductive film 20 , the second conductive film 30 and the first conductive film 30 A second protective layer 301 is disposed between a conductive film 20, a gap 3011 is formed on the second conductive film 30 and the second protective layer 301, and the first conductive film 20 and the first protective layer 201 are disposed in the gap 3011.

Therefore, the first conductive film 20 and the first protective layer 201 are arranged in the gap 3011 , which saves space and improves the flatness of the surface of the feeding structure 001 .

In this embodiment, both the first conductive film 20 and the second conductive film 30 are disposed on the first surface a1 of the dielectric plate 10 , the second conductive film 30 is provided with a gap 3011 , and the first conductive film 20 is disposed in the gap 3011 , and the first conductive film 20 may not completely fill the gap 3011 , and the first conductive film 20 is coupled to the second conductive film 30 .

In the feeding structure provided by the embodiment of the present application, the grounding unit is coupled and connected to the second conductive film 30 to avoid thermal deformation and melting of the second conductive film 30 caused by the welding connection method, thereby reducing the assembly difficulty of the feeding structure 001 and improving the The stability of the feeding structure 001 is improved. In addition, by providing the second protective layer 301, the surface is more flat, and the oxidation of the second conductive film 30 can also be avoided.

When the grounding unit includes the mounting member 50, in some embodiments, the mounting member 50 includes: a clamping part disposed close to the second surface a2 of the dielectric board 10, for example, the first clamping part 51 and The second clamping portion 52 .

The embodiment of the present application does not limit the specific structure of the mounting member 50. In some embodiments of the present application, as shown in FIG. 3b, the mounting member 50 includes a base 504, and the first clamping portion 51 and The second clamping portion 52 .

The first clamping portion 51 and the second clamping portion 52 are arranged in sequence along the Y axis, and a groove 505 is provided between the first clamping portion 51 and the second clamping portion 52. The second conductive film 30, The second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are provided with protrusions adapted to the groove 505 , when the second conductive film 30 , the second protective layer 301 , the feeding Sheet 401, and after the dielectric board 10 is assembled with the mounting member 50, the second conductive film 30, the second protective layer 301, the feeding sheet 401, and the protrusions of the dielectric board 10 are located in the clamping portion. In the groove 505 , the second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are prevented from moving relative to the mounting member 50 along the Y-axis direction.

The longitudinal section (XZ plane) of the first clamping part 51 and the second clamping part 52 is an L-shaped structure, and the "_" part 502 of the L-shaped structure is parallel to the X-axis for supporting the medium board 10. The "1" part 503 of the L-shaped structure is parallel to the Z axis, and the "_" part 502 of the L-shaped structure and the "1" part 503 of the L-shaped structure are both protrusions arranged on the base 504. Wherein, the height of the "1" part 503 of the L-shaped structure in the Z-axis direction is greater than the height of the "_" part 502 of the L-shaped structure in the Z-axis direction.

The second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the dielectric board 10 are provided with concave parts adapted to the “1” portion 503 . When the dielectric board 10 is connected to the mounting member 50 After assembly, the "1" portion 503 of the L-shaped structure is located in the second conductive film 30, the second protective layer 301, the feeding sheet 401, and the concave portion of the dielectric board 10, to further prevent the dielectric board 10 from facing the dielectric board 10. The mount 50 moves in the Y-axis direction.

Wherein, the "_" part 502 of the first clamping part 51 and the second clamping part 52 is provided with a connecting hole 501 matching with the connecting piece 60 in FIG. 3a.

The “1” portion 503 of the first clamping portion 51 is provided with a groove 506 , and the groove 506 is used for fixing the cable 40 .

In other embodiments of the present application, as shown in Fig. 5 and Fig. 5a, the projection of the mounting member 50 on the YZ plane is an "I"-shaped structure. Further, as shown in Fig. 5b, the mounting member 50 includes a base 504, and The first clamping portion 51 and the second clamping portion 52 provided on the base 504 .

Compared with the above-mentioned mounting member 50 in FIG. 3 b , the mounting member 50 in FIG. 5 b has a first top plate 507 and a second top plate 508 added.

Wherein, the first top plate 507 is provided on the top of the first clamping portion 51 , and the second top plate 508 is provided on the top of the second clamping portion 52 .

The first clamping portion 51 and the second clamping portion 52 are arranged in sequence along the Y axis, and a groove 505 is provided between the first clamping portion 51 and the second clamping portion 52. The second conductive film 30, The second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are provided with protrusions adapted to the groove 505 , when the second conductive film 30 , the second protective layer 301 , the feeding The second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the protrusions of the dielectric board 10 are located in the clamping portion In the formed groove 505 , the second conductive film 30 , the second protective layer 301 , the feeding sheet 401 , and the dielectric plate 10 are prevented from moving relative to the mounting member 50 along the Y-axis direction.

The longitudinal section (XZ plane) of the first clamping part 51 and the second clamping part 52 is an L-shaped structure, and the "_" part of the L-shaped structure is parallel to the X axis for supporting the medium board 10. The L-shaped structure is The "1" part of the structure is parallel to the Z axis, and the "_" part of the L-shaped structure and the "1" part of the L-shaped structure are both protrusions disposed on the base 504. Wherein, the height of the "1" part of the L-shaped structure in the Z-axis direction is greater than the height of the "_" part of the L-shaped structure in the Z-axis direction.

The first top plate 507 is disposed on the top of the “1” part of the first clamping part 51 and is parallel to the “_” part of the first clamping part 51 . The second top plate 508 is disposed at the top of the “1” part of the second clamping part 52 and is parallel to the “_” part of the second clamping part 52 .

The first top plate 507 and the second top plate 508 are provided with connection holes 5011 , and the first clamping portion 51 and the second clamping portion 52 are provided with connection holes 501 .

In addition, the first top plate 507 is further provided with a groove 506 , and the groove 506 is used for fixing the cable 40 .

The ground conductor 4022 is electrically connected to the clamping portion, the clamping portion is coupled and connected to the second conductive film 30 , and the second conductive film 30 is coupled and connected to the first conductive film 20 and the radiation unit 002 . The radiation unit 002 may be coupled to ground through the second conductive film 30 , the mount 50 and the ground conductor 4022 .

This embodiment of the present application does not limit the structure of the feeding unit 40 . In some embodiments of the present application, the power feeding unit 40 includes: a power feeding sheet 401 and a power feeding line 4021 .

Wherein, the feeding line 4021 is electrically connected to the feeding sheet 401, the feeding sheet 401 is disposed on the side of the first protective layer 201 away from the first conductive film 20, and the feeding wire 4021 is used for feeding the feeding sheet 401. 401 is used for feeding, and the feeding sheet 401 is used to couple and feed the first conductive film 20 .

The present application does not limit the structure of the feed line 4021 and the ground conductor 4022, and the feed line 4021 and the ground conductor 4022 may be in the form of coaxial wire, metal sheet, strip wire, flat wire, and the like.

In some embodiments of the present application, the feed line 4021 and the ground conductor 4022 are coaxially arranged, wherein the ground conductor 4022 is arranged outside the feed line 4021, and insulation is provided between the ground conductor 4022 and the feed line 4021 Material.

This embodiment of the present application does not limit the specific structure of the feeding sheet 401 . In some embodiments of the present application, as shown in FIG. 3 , the feeding sheet 401 adopts a printed circuit board (PCB), and the feeding sheet 401 includes a third surface a3 close to the first protective layer 201 , and a fourth surface a4 opposite to the third surface a3 of the feeding sheet 401 .

For example, conductors 4012 are provided on the third surface a3 and the fourth surface a4 of the feeding sheet 401. The feeding wire 4021 is electrically connected to the conductor 4012 on the fourth surface a4 of the feeding sheet 401, and the feeding sheet 401 The conductors 4012 on the third surface a3 are electrically connected to the conductors 4012 on the fourth surface a4 of the feed plate 401 through metallized vias.

Wherein, the feeding line 4021 is used for feeding the feeding sheet 401, and the feeding sheet 401 is used for coupling and feeding the first conductive film 20 through the conductor 4012 arranged on the third surface a3 of the feeding sheet 401 .

The embodiment of the present application does not limit the shape of the conductor 4012, and the shape of the surface of the conductor may be various shapes such as circle, square, and ring.

The feed line 4021 is connected to the feed plate 401 by welding, and the ground conductor 4022 is connected to the mounting member 50 by welding.

In some embodiments of the present application, the feeding structure 001 further includes: a connecting member 60 .

Wherein, the feeding piece 401 is provided with a first connection hole 4011 adapted to the connection piece 60 , the dielectric plate 10 is provided with a second connection hole 101 adapted to the connection piece 60 , the mounting piece 50 is provided with a second connection hole 101 There is a third connecting hole 501 adapted to the connecting piece 60. The connecting piece 60 is passed through the first connecting hole 4011, the second connecting hole 101 and the third connecting hole 501 in sequence. The electrical sheet 401 , the dielectric board 10 and the mounting member 50 are detachably connected.

The connecting member 60 can be a screw, which is used to fasten the feeding piece 401 , the dielectric board 10 and the mounting member 50 . The screws can be metal, plastic, or other forms of press fit.

In this embodiment, the mounting member 50 and the feeding sheet 401 are fixed on the dielectric board 10 through the connecting member 60 , the first conductive film 20 and the first protective layer 201 are clamped by the feeding sheet 401 and the dielectric board 10 , the second The conductive film 30 and the second protective layer 301 are sandwiched by the mounting member 50 and the dielectric board 10 .

The feed structure 001 provided by the present application will be specifically described below with reference to Example 1 and Example 2.

Example one:

As shown in FIG. 3 , FIG. 3 a , FIG. 3 b and FIG. 4 , the feeding structure 001 includes: a feeding sheet 401 , a first protective layer 201 , a first conductive film 20 , a dielectric plate 10 , a first protective layer 201 , a first conductive film 20 , a Two conductive films 30 and a second protective layer 301 .

In an implementation manner, the first conductive film 20 is crimped on the first surface a1 of the dielectric board 10 , and the first protective layer 201 is crimped on the first conductive film 20 .

The first conductive film 20 is disposed at the middle position of the first surface a1, the length of the first conductive film 20 in the X direction is the same as the length of the dielectric plate 10, and the width of the first conductive film 20 in the Y direction is smaller than the width of the dielectric plate.

In an implementation manner, the second conductive film 30 is disposed on the second surface a2 of the dielectric plate 10 , and the second protective layer 301 is crimped on the second conductive film 30 .

The second conductive film 30 completely covers the second surface a2, the length of the second conductive film 30 in the X direction is equal to the length of the dielectric plate 10, and the width of the second conductive film 30 in the Y direction is equal to the width of the dielectric plate.

The first protective layer 201 is located between the feeding unit 40 and the first conductive film 20 , and the first protective layer 201 is made of insulating material, for example. The first protective layer 201 is used to separate the feeding unit 40 from the first conductive film 20 , so that the feeding unit 40 and the first conductive film 20 are coupled and connected.

The second protective layer 301 can be made of insulating material, and the second protective layer 301 is used to protect the second conductive film 30 to prevent the first conductive film 20 from being oxidized or scratched.

In an implementation manner, the feeding structure 001 further includes: a connecting member 60 and a mounting member 50 disposed close to the second surface a2 of the dielectric board 10 . As shown in FIG. 3 , there are two connecting members 60 .

The feeding piece 401 is provided with a first connection hole 4011 adapted to the connector 60 , the dielectric board 10 is provided with a second connection hole 101 adapted to the connector 60 , and the mounting member 50 is provided with a connector 60 . The third connecting hole 501 is adapted to 60 . During assembly, the connector 60 passes through the first connecting hole 4011 , the second connecting hole 101 and the third connecting hole 501 in sequence, so that the first conductive film 20 and the first protective layer 201 between the mounting component 50 and the dielectric board 10 are formed. The feeding piece 401 and the dielectric board 10 are tightly fixed, so that the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric board 10 are tightly fixed by the mounting member 50 and the dielectric board 10 .

In an implementation manner, the connecting member 60 is a bolt, the first connecting hole 4011 , the second connecting hole 101 and the third connecting hole 501 are bolt holes adapted to the bolt, and the connecting member 60 is connected to the first connecting hole 4011 , The second connection hole 101 and the third connection hole 501 are detachably connected through threads.

Next, referring to FIG. 3 , the feeding structure 001 further includes: a cable 40 , and the cable 40 includes: a coaxially arranged feeding line 4021 and a ground conductor 4022 , wherein the feeding line 4021 is electrically connected to the feeding sheet 401 , the feeding line 4021 is used for feeding the feeding sheet 401 , and the feeding sheet 401 is used for coupling and feeding the first conductive film 20 . The ground conductor 4022 is electrically connected to the mounting member 50 , and the second conductive film 30 is coupled and connected to the clamping portion of the mounting member 50 .

The feeding sheet 401 includes a third surface a3 close to the first protective layer 201 , and a fourth surface a4 opposite to the third surface a3 of the feeding sheet 401 .

During operation, the feeding line 4021 can transmit radio frequency signals to the feeding sheet 401. Since the first protective layer 201 is provided between the feeding sheet 401 and the first conductive film 20, and the first protective layer 201 is insulated, the feeding sheet 401 is insulated. 401 transmits the radio frequency signal to the circuit of the first conductive film 20 by means of coupling and feeding. In addition, the mounting member 50 is grounded through the ground conductor 4022, the second conductive film 30 is coupled to the mounting member 50, and the first conductive film 20 is coupled to the second conductive film 30, so that the first conductive film 20 can be coupled to ground.

As a result, the feeding structure 001 can be detachably connected to each part of the structure through the connector, so as to realize the coupled feeding method and the coupled grounding method. Compared with the connection methods such as conductive glue, the connection performance is more stable, and the use of welding is avoided at the same time. The connection method caused the first conductive film 20 to be deformed and melted by heat. The assembly difficulty of the feeding structure 001 is reduced, the stability of the feeding structure 001 is improved, and in addition. By setting the surface of the first protective layer 201 to be more flat, the oxidation of the first conductive film 20 can also be avoided.

Example two:

As shown in FIG. 5 , FIG. 5 a , FIG. 5 b , and FIG. 6 , the feeding structure 001 includes: a feeding sheet 401 , a second protective layer 301 , a second conductive film 30 and a dielectric plate 10 that are stacked along the Z-axis direction. Wherein, a gap 3011 is provided between the second protective layer 301 and the second conductive film 30, the first conductive film 20 and the first protective layer 201 are located in the gap 3011, and the first conductive film 20 does not completely fill the gap 3011, The first conductive film 20 is coupled to the second conductive film 30 .

In an implementation manner, the second conductive film 30 is disposed on the first surface a1 of the dielectric board 10 , and the second protective layer 301 is crimped on the second conductive film 30 .

The length of the second conductive film 30 in the X direction is equal to the length of the dielectric plate 10 , and the width of the second conductive film 30 in the Y direction is equal to the width of the dielectric plate.

A gap 3011 is provided in the middle position of the second protective layer 301 and the second conductive film 30 in the Y direction. On the first surface a1 , the first protective layer 201 is crimped on the first conductive film 20 . The width of the first conductive film 20 and the first protective layer 201 in the Y direction is smaller than the width of the gap 3011 .

The first protective layer 201 is located between the feeding unit 40 and the first conductive film 20, and the first protective layer 201 is made of insulating material, for example. The first protective layer 201 is used to separate the feeding unit 40 from the first conductive film 20 , so that the feeding unit 40 and the first conductive film 20 are coupled and connected.

The second protective layer 301 is used to separate the second conductive film 30 from the first conductive film 20 , so that the second conductive film 30 and the first conductive film 20 are coupled and connected. In addition, the second protective layer 301 is also used to protect the second conductive film 30 to prevent the first conductive film 20 from being oxidized or scratched.

In an implementation manner, the feeding structure 001 further includes: a connecting member 60 and a mounting member 50 disposed close to the second surface a2 of the dielectric board 10 . As shown in FIG. 5 , there are two connecting members 60 .

The feeding piece 401 is provided with a first connection hole 4011 adapted to the connector 60 , the dielectric plate 10 is provided with a second connection hole 101 adapted to the connector 60 , and the mounting member 50 is provided with a connector 60 . 60 is the third connecting hole 501 that fits. During assembly, the connector 60 passes through the first connection hole 4011 , the second connection hole 101 and the third connection hole 501 in sequence, so that the first conductive film 20 and the first protective layer between the feeding sheet 401 and the dielectric board 10 are 201 is tightly fixed by the feeding piece 401 and the dielectric board 10 , so that the second conductive film 30 and the second protective layer 301 between the mounting member 50 and the dielectric board 10 are tightly fixed by the mounting member 50 and the dielectric board 10 .

Next, referring to FIG. 5 , the feeding structure 001 further includes: a cable 40 , and the cable 40 includes: a coaxially arranged feeding line 4021 and a ground conductor 4022 , wherein the feeding line 4021 is electrically connected to the feeding sheet 401 , the feeding line 4021 is used for feeding the feeding sheet 401 , and the feeding sheet 401 is used for coupling and feeding the first conductive film 20 . The ground conductor 4022 is electrically connected to the mounting member 50 , and the second conductive film 30 is coupled to the clamping portion of the mounting member 50 .

During operation, the feeding line 4021 can transmit radio frequency signals to the feeding sheet 401. Since the first protective layer 201 is provided between the feeding sheet 401 and the first conductive film 20, and the first protective layer 201 is insulated, the feeding sheet 401 is insulated. 401 transmits the radio frequency signal to the circuit of the first conductive film 20 by means of coupling and feeding. In addition, the mounting member 50 is grounded through the ground conductor 4022 , the second conductive film 30 is coupled to the mounting member 50 , and the first conductive film 20 is coupled to the second conductive film 30 , so that the first conductive film 20 can pass through the second conductive film 30 , the mount 50 and the ground conductor 4022 are coupled to ground.

In the feeding structure 001 of this example, the first conductive film 20 and the first protective layer 201 are disposed in the gap 3011 between the second conductive film 30 and the second protective layer 301 , which saves space and is beneficial to product quality. miniaturization. At the same time, the surface of the feeding structure 001 is made more flat.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application shall be covered within the protection scope of the present application. . Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A feeding structure, characterized in that it includes:

a dielectric plate including opposing first and second surfaces;

a first conductive film, the first conductive film is disposed on the first surface;

a power feeding unit, the power feeding unit is disposed on the first surface, and the power feeding unit is used for feeding power to the first conductive film;

a first protective layer, the first protective layer is provided between the feeding unit and the first conductive film, the first protective layer is used to separate the feeding unit and the first conductive film ;

Wherein, the feeding unit is coupled and connected to the first conductive film.
The feeding structure according to claim 1, further comprising: a ground unit and a second conductive film, the second conductive film is coupled and connected to the ground unit, and the second conductive film is connected to the ground unit. The first conductive film is coupled and connected.
The feeding structure according to claim 2, wherein the second conductive film is disposed on the second surface of the dielectric plate, and the surface of the second conductive film away from the dielectric plate is covered with a second conductive film. The protective layer.
The feeding structure according to claim 2, wherein the second conductive film is disposed between the first surface and the first conductive film, the second conductive film and the first conductive film A second protective layer is provided between the films.
The feeding structure according to claim 4, wherein a gap is provided between the second conductive film and the second protective layer, and the first conductive film and the first protective layer are provided in the gap middle.
The feeding structure according to any one of claims 3-5, wherein the first protective layer or the second protective layer is made of: polyethylene terephthalate film PET, polyimide At least one of amine film PI, cyclic olefin polymer film COC, polycarbonate film PC, polyethylene film PE, polyvinyl chloride film PVC, and polyethylene naphthalate film PEN.
The power feeding structure according to any one of claims 2-6, wherein the grounding unit comprises a grounding conductor and a mounting piece, the mounting piece comprising: a clamping portion disposed close to the second surface;

The ground conductor is electrically connected to the clamping portion, and the clamping portion is coupled and connected to the second conductive film.
The power feeding structure according to claim 7, wherein the power feeding unit comprises a power feeding line, the power feeding line and the grounding conductor are coaxially arranged, and a power feeding line is arranged between the grounding conductor and the power feeding line There is insulating material.
The power feeding structure according to claim 8, wherein the power feeding unit further comprises a power feeding sheet, the power feeding sheet is electrically connected to the power feeding line, and the power feeding sheet is provided on the first The protective layer is away from the surface of the first conductive film;

The feeding unit for coupling and feeding the first conductive film includes: the feeding line is used for feeding power to the feeding sheet, and the feeding sheet is used for coupling and feeding the first conductive film Electricity.
The power feeding structure according to claim 9, wherein the power feeding structure further comprises: a connecting member;

Wherein, the feeding sheet, the dielectric plate, and the mounting piece are provided with connecting holes adapted to the connecting piece, and the connecting piece is sequentially pierced through the feeding sheet, the dielectric board and the connecting piece. In the connecting hole of the mounting piece, the connecting piece is detachably connected to the feeding sheet, the medium plate and the mounting piece.
The feeding structure according to claim 9 or 10, wherein the feeding sheet comprises a third surface close to the first protective layer, and a fourth surface opposite to the third surface;

Conductors are provided on both the third surface and the fourth surface, the feed line is electrically connected with the conductors on the fourth surface, and the conductors on the third surface pass through metallized through holes and the conductors on the fourth surface. the conductors on the fourth surface are electrically connected;

Wherein, the feeding sheet for coupling and feeding the first conductive film includes: the feeding sheet is used for coupling and feeding the first conductive film through a conductor disposed on the third surface.
The feeding structure according to any one of claims 2-11, wherein the first conductive film or the second conductive film is made of metal mesh, metal nanowire, carbon nanotube, graphene, at least one of metal oxides.
An antenna, characterized in that, the antenna comprises: a radiating element and the feeding structure according to any one of claims 1-12.
A communication device, comprising a radio frequency module and the antenna according to claim 13, wherein the radio frequency module and the antenna unit are electrically connected.