WO2018220005A1

WO2018220005A1 - Optical circuit board having plug connector

Info

Publication number: WO2018220005A1
Application number: PCT/EP2018/064173
Authority: WO
Inventors: Blanca Esthela RUIZ BRUNNER; Andrés FERRER MOREU; Christian Balazs GSELL
Original assignee: Reichle & De-Massari Ag
Priority date: 2017-06-01
Filing date: 2018-05-30
Publication date: 2018-12-06
Also published as: DE102017112131A1

Abstract

The invention relates to an optical circuit board (10a-c) having at least one substrate (12a-c) having at least one optical fiber (14a-c), which is arranged on and/or in the substrate (12a-c), and having at least one receptacle element (16a-c) connected to the substrate, which receptacle element has a receptacle region (18a-c) for at least one connector pin (20a-c) and which is provided in order to determine, at least in part, a position of the connector pin (20a-c) relative to the optical fiber (14a-c). According to the invention, the receptacle region (18a-c) has at least one primary receptacle region (22a-c), which is provided in order to receive the connector pin (20a-c), and at least one secondary receptacle region (24a-c), which has a transverse extension (26a-c), which is greater than a transverse extension (28a-c) of the primary receptacle region (22a-c).

Description

Optical circuit board with connector

State of the art

The invention relates to an optical circuit board according to the preamble of claim 1 and a method for producing an optical circuit board according to the preamble of claim 11.

German Offenlegungsschrift DE 10 2012 1 12 683 A1 already discloses an optical printed circuit board which has a substrate and a plurality of optical waveguides arranged on the substrate. An integrally formed with the substrate receiving element has a receiving area for a connector pin. The receiving region has a constriction, in the region of which a transverse extent of the receiving region is smaller in relation to an environment. The plug pin has a groove corresponding to the constriction.

The object of the invention is, in particular, to provide a generic printed circuit board with improved properties in terms of efficiency. The object is achieved by the features of claims 1 and 1 1, while advantageous embodiments and modifications of the invention can be taken from the dependent claims.

The invention is based on an optical printed circuit board with at least one substrate, with at least one light guide, which is arranged on and / or in the substrate, and with at least one receiving element connected to the substrate, which has a receiving region for at least one plug pin and which is intended, a location, in particular a position and / or an orientation of the connector pin relative to the light guide, in particular by means of the receiving area at least partially and preferably completely set.

It is proposed that the receiving region has at least one main receiving region, which is provided for receiving the plug pin, and at least one secondary receiving region which has a transverse extent that is greater than a transverse extent of the main receiving region.

In this context, an "optical printed circuit board" should be understood in particular to mean a printed circuit board which has at least one optical waveguide which is intended to transmit light signals.Furthermore, the optical printed circuit board may comprise elements and / or units which are attached to a substrate of the optical printed circuit board These may be, for example, optoelectronic components and / or optical components, in particular linear and / or non-linear optical components, electronic components and / or electrical conductors and / or units and / or elements for Connection and / or a coupling of the optical circuit board, in particular with optical systems and / or devices In this context, a "substrate" is to be understood in particular a carrier element which is provided to a base layer for an optical circuit board form. Preferably, the substrate is designed plate-like. The substrate may in particular be made of a hard paper and / or of a polymer plastic and / or of a polymer plastic film and / or of a fiber-reinforced plastic and / or of a combination of different materials. In particular, the substrate may be single-layered or multi-layered. In particular, the substrate could have at least two, advantageously at least four, particularly advantageously at least eight, and preferably a plurality of layers which, for example, could be laminated together. In this context, a "light guide" is to be understood as meaning, in particular, an optical transmission conductor which is intended in particular for transporting light signals.For example, the light guide could in particular be a transparent core, preferably a glass or plastic fiber, and in particular a core Alternatively, the optical waveguide could in particular be free of at least one cladding and be provided, in particular, for transporting light signals, for example via at least one fluid medium, such as, for example, air In particular, the cladding of the optical waveguide may be at least partially applied by a base layer applied to the substrate and / or at least partially by a layer of the substrate itself be educated. In particular, the light guide extends to an edge of the substrate and preferably meets at an angle of 70 ° to 1 10 °, in particular from 80 ° to 100 °, preferably from 85 ° to 95 ° and particularly advantageously from 90 ° to the edge. The optical waveguide can be designed in particular as a single-mode optical waveguide and / or as a multimode optical waveguide. For example, the light guide could be at least partially integrated into the substrate and / or integrally connected to the substrate, advantageously formed integrally with the substrate. Alternatively, the optical waveguide could in particular be arranged on the substrate, for example in a coating arranged on the substrate.

By "in one piece" is meant, in particular, at least materially bonded, for example, by a welding process, an adhesion process, an injection process and / or another process that appears expedient to a person skilled in the art, and / or advantageously shaped in one piece, such as by a Manufacture from a casting and / or by a production in a one- or multi-component injection molding process and advantageously from a single blank. Advantageously, the optical printed circuit board on a plurality of optical fibers, which are arranged at least in an edge region of the substrate, in particular at least substantially parallel to each other. In this context, an "edge region" of the at least one substrate should be understood to mean, in particular, a maximum of 20 mm, advantageously not more than 10 mm and particularly advantageously not more than 5 mm in the direction of a center, starting from an edge of the at least one substrate The term "at least essentially parallel" should be understood to mean, in particular, an orientation of a direction relative to a reference direction, in particular in a plane, wherein the direction relative to the reference direction is a deviation, in particular less than 5 °, advantageously less than 2 ° and particularly advantageously less than 1 °.

By way of example, the optical printed circuit board could have at least one coating which could be designed, in particular, as a protective layer and / or as an insulating layer. The coating could in particular be interrupted in the edge area and / or have at least one recess, in order in particular to expose the light guide. The optical waveguide could, for example, be arranged and / or run at least partially in the recess and / or the interruption of the coating. Alternatively or additionally, the optical waveguide could be embedded in particular in the substrate and, for example, arranged at least for the most part between at least two layers of the substrate.

The receiving region is designed in particular as a recess and, in particular, is provided for receiving at least part of the plug pin. For example, the receiving area could be indirectly connected to the substrate. In particular, the receiving area could at least to a large extent be formed and / or defined by a coating, which could in particular be connected to the substrate, in particular directly. Advantageously, the receiving area could be connected directly to the substrate. In particular, the reception area could be at least partially and at least a large part formed by the substrate and / or be defined. By "at least to a large extent" should be understood in particular to a proportion of at least 70%, in particular at least 80%, advantageously at least 90% and preferably at least 95%.

In particular, the receiving element has a longitudinal extension direction, which is aligned in particular in the edge region at least substantially parallel to a direction of longitudinal extension of the optical waveguide. A "longitudinal extension direction" of an object should be understood to mean, in particular, a direction which is aligned parallel to a longest side of a smallest imaginary geometrical cuboid which just completely encloses the object.

The optical circuit board has in particular the connector pin. A "main receiving area" is to be understood in particular as a receiving area which is provided for receiving the plug pin and which has a longitudinal extension direction which is aligned in at least one mounted state at least substantially parallel to a longitudinal extension direction of the plug pin In particular, a wall bounding the main receiving area is aligned at least substantially parallel to the plug pin in at least one assembled state, The wall bounding the main receiving area could in particular be real and formed, for example, by the substrate or in addition, the wall bounding the main receiving area could in particular be virtual, and in particular as an imaginary extension of a real Wa bordering the main receiving area be his.

A "secondary receiving area" is to be understood in particular as a receiving area which adjoins the main receiving area and in particular is interrupted at least partially by the main receiving area could be. In an assembled state of the connector pin, the latter is arranged, in particular, in regions of the receiving region which are different from secondary receiving regions. For example, the secondary receiving area could have at least one first secondary area and at least one second secondary area, which could be spaced apart from one another by the main receiving area and in particular could be arranged on opposite sides of the main receiving area.

A "transverse extension" is to be understood in particular to be an extension which is aligned in at least one mounted state of the connector pin perpendicular to a longitudinal extension direction of the connector pin and / or to a direction of longitudinal extension of the receiving element and which is oriented in particular parallel to a main extension plane of the substrate "Extent" of an object should be understood in particular a maximum distance between two points of a vertical projection of the object on a plane. A "main extension plane" of an object is to be understood in particular as meaning a plane which is parallel to a largest side surface of a smallest imaginary geometric cuboid which just completely encloses the object, and in particular runs through the center of the cuboid specially designed and / or equipped to be understood. The fact that an object is intended for a specific function should in particular mean that the object fulfills and / or executes this specific function in at least one application and / or operating state. In particular, a high efficiency can be achieved by the embodiment according to the invention. In particular, the plug pin can be aligned optimally relative to the light guide. Due to the larger transverse extent of the secondary receiving area compared to the main receiving area, in particular at least one substance located in the main receiving area, such as For example, at least one fastening means, when inserting the connector pins in the main receiving area from the main receiving area in the secondary recording area dodge, which in particular a particularly optimal and / or interference-free signal transmission can be achieved. It is also proposed that the optical printed circuit board has at least one fastening means which is provided for fastening the connector pin in the receiving region and, in at least one assembled state, is arranged at least partially within the secondary receiving region. A "fastener" is to be understood in particular an element which secured in at least one mounted state, the connector pin in the receiving area and in particular a connection between the connector pin and at least one wall bounding the receiving area, which could be formed in particular by the substrate. By the use of the fastening means being arranged "at least partially" within the secondary receiving region in at least one assembled state, it should be understood in particular that the fastening means in the assembled state have a mass fraction and / or volume fraction of at least 5%, in particular at least 10%, advantageously at least 15%, and preferably at least 20% within the secondary receiving area is arranged. In this way, an excess portion of the fastening means, which escapes from the main receiving area into the secondary receiving area, in particular when the male pin is inserted into the main receiving area, can be specifically led off, whereby, in particular, a leakage of the portion of the fastening means from unwanted areas of the main receiving area, such as from a Front edge of the main receiving area, can be avoided.

For example, the fastening means could be provided at least for a non-positive and / or at least a positive fastening of the connector pins in the receiving area. Preferably, the fastening means is at least for a cohesive fastening of the connector pin in the receiving area provided. As a result, the plug pin can in particular be fastened particularly stably and / or permanently in the receiving area.

Furthermore, it is proposed that the fastening means is designed as a hardened raw mass, in which the connector pin could be introduced in particular. For example, the raw mass could be a solder mass, which could be heated in particular, such as by means of a laser, and which was introduced in particular in a preparation of the optical circuit board in the form of a preferably viscous raw mass in the receiving area. Alternatively or additionally, the raw mass could in particular be a weld mass and the plug pin could be fastened in particular by means of laser welding. In particular, the raw material could be a cured adhesive, which could have been introduced into the receiving region, in particular in the case of a production of the optical printed circuit board in the form of a preferably viscous raw material. As a result, in particular an inexpensive and / or stable design can be achieved.

It is also proposed that the secondary receiving region is arranged with respect to a longitudinal direction of extension of the receiving element in an end region of the receiving region. An "end area" of the receiving area is to be understood in particular to be an area which extends from one end of the receiving area in a longitudinal direction of the object over a proportion of not more than 25%, in particular not more than 20%, advantageously not more than 15% and preferably no more than In this way, in particular, a particularly high efficiency can be achieved, In particular, a violation of the fastening means in a direction perpendicular to a main plane of extension of the substrate oriented direction can be avoided become. For example, the receiving area could, in particular, have exclusively the sub-reception area. Preferably, the receiving region has at least one further secondary receiving region, which is spaced apart from the secondary receiving region with respect to a longitudinal direction of extension of the receiving element. In particular, the secondary receiving region and the additional secondary receiving region have a spacing of at least 1 mm, in particular of at least 2 mm and advantageously of at least 3 mm and / or a distance of at least 5%, in particular of at least 10% and advantageously of at least with respect to the longitudinal direction of the receiving element - At least 15% of a longitudinal extension of the receiving element. By way of example, the receiving area could have at least two additional secondary receiving areas. In particular, the secondary receiving regions could be distributed at least substantially uniformly over a longitudinal extension of the receiving region and in particular form a fishbone structure together with the main receiving region, in particular to harden a raw mass of a fastening means and / or a fastening force of the fastening means to the substrate improve. As a result, advantages achieved in particular by at least one secondary receiving area can be increased. Furthermore, it is proposed that the additional secondary receiving region is arranged with respect to the longitudinal direction of extension of the receiving element in a front region of the receiving region. A "front area" of the receiving area is intended in particular to be understood as an area which extends from one end of the receiving area in a longitudinal direction of the object over a proportion of not more than 25%, in particular not more than 20%, advantageously not more than 15% and preferably no more than 10% of a longitudinal extent of the receiving region and which is arranged in particular on one of an edge of the substrate facing the end of the receiving area achieved advantages are distributed over the entire longitudinal extension direction of the receiving area.

Furthermore, it is proposed that the fastening means in the assembled state be arranged at least partially within the additional secondary receiving region, whereby in particular a particularly high efficiency can be achieved.

In addition, it is proposed that the secondary receiving region and in particular additionally the additional secondary receiving region are arranged on at least one side next to the main receiving region with respect to a longitudinal extension direction of the receiving element. As a result, in particular spatial conditions, such as, for example, a spatial restriction on one side next to the main receiving area, can be optimally utilized.

For example, the additional receiving area and, in particular, the additional additional receiving area could be arranged exclusively on one side next to the main receiving area. Preferably, the secondary receiving region and in particular additionally the additional secondary receiving region are arranged with respect to a longitudinal direction of extension of the receiving element on at least two sides next to the main receiving region. As a result, in particular, a configuration which is symmetrical with respect to the longitudinal extension direction of the receiving element and / or a symmetrical escape of the fastening means from the main fastening region relative to the longitudinal direction of extension of the receiving element can be made possible.

A particularly high level of efficiency can be achieved in particular by a method for producing an optical circuit board according to the invention having at least one substrate, with at least one light guide, which is arranged on and / or in the substrate, and with at least one receiving element connected to the substrate a receiving area for at least one plug pin and which is intended to at least partially define a position of the plug pin relative to the light guide, wherein the receiving Area has at least one main receiving area and at least one side receiving portion having a transverse extent which is greater than a transverse extent of the main receiving area, wherein the plug pin is arranged in the main receiving area. In addition, it is proposed that a preferably viscous raw mass of a fastening means is arranged in the main receiving area before the plug pin is arranged in the main receiving area. The viscous raw mass of the fastening means is in particular a mass of an adhesive before curing. Alternatively or additionally, the viscous raw mass of the fastening means could in particular be a mass of a solder and / or a welding agent before curing. A "viscous" mass is to be understood in particular as meaning a mass which has a viscosity of at least 2 mPas, in particular of at least 5 mPas, advantageously of at least 10 mPas, particularly advantageously of at least 50 mPas and preferably of at least 100 mPas and particularly preferably of at least 500 mPas and / or which has a viscosity of not more than 10 ⁷ mPas, in particular not more than 10 ⁶ mPas, preferably not more than 10 ⁵ mPas and preferably not more than 10 ⁷ mPas and manner are performed.

Furthermore, it is proposed that the plug pin is pressed into the raw mass, wherein this dodges into the secondary receiving area. As a result, in particular leakage of the raw mass of the fastening means from undesired points of the main receiving area, such as for example from a front edge of the main receiving area, can be avoided.

The optical circuit board should not be limited to the application and embodiment described above. In particular, the optical circuit board may be one of a type for performing a function described herein have a different number of individual elements, components and units mentioned herein.

drawings

Further advantages emerge from the following description of the drawing. In the drawings, three embodiments of the invention are shown. The drawings, the description and the claims contain numerous features in combination. The person skilled in the art will expediently also consider the features individually and combine them into meaningful further combinations.

1 shows a substrate and a plug unit of an optical printed circuit board in a mounted state in a schematic representation, FIG. 2 shows the substrate and a first plug element and a second plug element of the plug unit in the assembled state in a schematic sectional illustration,

3 shows the substrate, the second plug element and two plug pins of the optical printed circuit board in the assembled state in a schematic representation,

4 shows a substrate, a first plug element and a second plug element of a plug unit of an alternative optical circuit board in a mounted state in a schematic

Sectional view

5 shows the substrate, a plurality of light lighters and a further optical unit of the optical circuit board in a schematic illustration,

6 shows a substrate and a first plug element and a second plug element of a plug unit of an alternative optical printed circuit board in an assembled state in a schematic sectional view, 7 shows the substrate in a partially treated state in a schematic representation,

8 shows the substrate and a receiving element of the optical printed circuit board in a further partially treated state in a schematic plan view,

9 shows a section of the substrate and the receiving element in a schematic plan view,

10 shows an alternative substrate in a partially treated state in a schematic representation,

1 1, the substrate and the receiving element and a connector pin of the optical circuit board in a further partially treated state in a schematic plan view,

12 shows the substrate and the receiving element, which is shown greatly simplified, in a further partially treated state in a schematic representation and

Fig. 13 shows a substrate and a receiving element of an alternative optical circuit board in a partially treated state in a schematic plan view.

DESCRIPTION OF THE EXEMPLARY EMBODIMENTS FIG. 1 shows an optical circuit board 10a with a substrate 12a. The substrate 12a has a base plate 64a (see Fig. 2). The base plate 64a largely forms the substrate 12a. The substrate 12a has a coating 66a. The coating 66a of the substrate 12a is disposed on the base plate 64a in an assembled state. In the mounted state, the coating 66 a of the substrate 12 a is arranged on a main surface of the base plate 64.

The optical circuit board 10a has an edge member 40a. The edge member 40a is connected in the mounted state to the substrate 12a in an edge region 42a of the substrate 12a. In the assembled state, the edge member 40a is integrally connected to the substrate 12a. In the present embodiment, the edge element 40b is identical to the substrate 12b. The edge member 40b forms the edge portion 42b of the substrate 12b.

In a region facing the edge region 42a, the coating 66a of the substrate 12a has at least one recess 68a (compare FIGS. 2 and 3). In the present exemplary embodiment, the coating 66a of the substrate 12a has two recesses 68a in an area facing the edge region 42a. Of the recesses 68a, only one will be described below. In the assembled state, a plug unit 44a abuts the substrate 12a in a region of the recess 68a.

The optical circuit board 10a has the plug unit 44a (see Figures 1 to 3). The plug unit 44a is disposed on the substrate 12a in the mounted state. In the present embodiment, the plug unit 44a is formed in two parts. The plug unit 44a has a first plug element 48a and a second plug element 50a. In the assembled state, the first male member 48a and the second male member 50a are connected to each other.

The first connector element 48a forms part of a connector outer housing, in particular a majority of a connector outer housing. In the mounted state, the first connector element 48a partially surrounds the substrate 12a, in particular the base plate 64a of the substrate 12a. The first connector element 48a partially engages around the second connector element 50a in the mounted state.

The second male member 50a is disposed on the main surface of the base plate 64a in the mounted state. In the mounted state, the second plug element 50a bears against the recess 68a of the coating 66a of the substrate 12a. The first male member 48a, in the mounted state, clamps the second male member 50a to the substrate 12a.

In the assembled state, the second male member 50a is fixed to the substrate 12a. For example, the second plug element 50a could be connected to the sub strat 12a be secured by a screw connection. In the present embodiment, the second male member 50a is fixed to the substrate 12a by an adhesive bond.

The first plug element 48a has at least one projection 70a (see Fig. 2). In the present embodiment, the first connector element 48a has a plurality of projections 70a. Of multiply existing objects, only one is provided with a reference numeral in the figures. Of the projections 70a, only one will be described below. In an alternative embodiment, the first plug element 48a could, for example, be free of protrusions 70a.

The projection 70a partially engages the substrate 12a, in particular the base plate 64a of the substrate 12a. The protrusion 70a partially pierces the substrate 12a, in particular the base plate 64a of the substrate 12a. The protrusion 70a presses a first reference surface 52a of the first male member 48a toward an edge surface 56a of the edge member 40a.

The edge member 40a has the edge surface 56a. The edge surface 56a includes a reference 46a to an orientation of the plug unit 44a. The edge member 40a provides a reference point 46a for alignment of the plug unit 44a. The first plug member 48a has the first reference surface 52a. The first reference surface 52a could, for example, be aligned flush with the edge surface 56a of the edge element 40a in the mounted state. In the mounted state, for example, the first reference surface 52a may abut the edge surface 56a of the edge member 40a. The second male member 50a has a second reference surface 54a. In the present embodiment, the second reference surface 54a in the mounted state is aligned flush with the edge surface 56a of the edge element 40a. In the assembled state, the second reference surface 54a is disposed in an extension of the edge surface 56a of the edge member 40a.

The second male member 50a has a reference member 76a (see Figures 2 and 3). The reference member 76a forms the second reference surface 54a. The reference element 76a completes, with the aid of the second reference surface 54a, a front surface of the edge element 40a which represents a contact surface to a contact and balance of a ferrule of a further optical unit (not shown).

In the present embodiment, the first connector element 48a is formed to a large extent of a metal. Alternatively, the first plug element 48a could be formed to a large extent of a polymer. Also conceivable are other materials that appear appropriate to a person skilled in the art. The first connector element 48a has a part of an adapter for an optical waveguide connector, in particular an MT connector. For a transmission of electromagnetic radiation, in particular of light, the optical printed circuit board 10a has a plurality of optical waveguides 14a (see FIG. 4). Of the optical fibers 14a, only one will be described below.

The light guide 14a is disposed on the substrate 12a in the mounted state. Alternatively, the light guide 14a could be arranged in the mounted state in the substrate 12a. The optical waveguide 14a is provided for transmitting electromagnetic radiation, in particular in the form of light, to a further optical unit 72a of the optical printed circuit board 10a.

The optical circuit board 10a has the further optical unit 72a. The further optical unit 72a has a lens 74a. The lens 74a is different from a lens intended for a collimated beam. Alternatively, the further optical unit 72a could comprise at least one waveguide and / or at least one cable made of waveguides. In the transmission of electromagnetic radiation to the further optical unit 72a, a transmission path passes through the edge element 40a.

In a method of mounting the optical circuit board 10a, the connector unit 44a is disposed on the substrate 12a. The second plug element 50a is arranged in the recess 68a of the coating 66a of the substrate 12a. The first plug member 48a is disposed on the substrate 12a. The first connector element 48a is pushed over the substrate 12a. The plug unit 44a is aligned with the edge member 40a.

The second plug element 50a has a raised portion 78a (see Figures 1 to 3). In the mounted state, the elevation 78a of the second plug element 50a is arranged on a side of the second plug element 50a facing away from the reference point 46a of the edge element 40a.

The second plug element 50a has a further second reference surface 80a. The elevation 78a of the second connector element 50a forms the further second reference surface 80a. The further second reference surface 80a is arranged on a side of the elevation 78a facing the reference point 46a of the edge element 40a. The further second reference surface 80a, in the mounted state, defines another reference point 108a for alignment of the first plug element 48a relative to the substrate 12a. The reference point 46a of the edge element 40a defines a stop plane for the elevation 78a of the second connector element 50a, in particular for the further second reference surface 80a of the elevation 78a of the second connector element 50a. In the assembled state, the further second reference surface 80a is a function of the reference point 46a of the edge member 40a. The further second reference surface 80a is spaced in the assembled state by a distance 82a to an edge of the light guide 14a. The edge of the light guide 14a is disposed in the edge portion 42a of the substrate 12a. 4 and 5, a modification of the embodiment of FIGS. 1 to 3 is shown. In the present embodiment, an edge element 40a 'in a mounted state is materially connected to a substrate 12a'. In the mounted state, the edge element 40a 'is connected to the substrate 12a' by an adhesive bond.

The edge member 40a 'is formed separately from the substrate 12a'. In the mounted state, the edge element 40a 'in an edge region 42a' of the substrate 12a 'is connected to the substrate 12a'. The edge member 40a 'is formed as a substantially rigid member. The edge element 40a 'is specially designed for an optical circuit board 10a'.

The edge element 40a 'has a main body 58a'. The main body 58a 'has a refractive index which essentially corresponds to a refractive index of the optical waveguide 14a'.

The edge element 40a 'has a coating 60a'. The coating 60a 'of the edge element 40a' is arranged on a front edge of the main body 58a '. The coating 60a of the edge member 40a 'is formed as an antireflection coating. In the mounted state, the coating 60a 'of the edge element 40a' is arranged on a side of the main body 58a 'facing away from the substrate 12a'. Alternatively, the edge member 40a 'could be free of a coating 60a'.

On a side of the main body 58a facing the substrate 12a ', the edge element 40a' is connected to the substrate 12a 'by the adhesive bond. The optical circuit board 10a 'has an adhesive 62a' (see Figures 4 and 5). The adhesive 62a 'in the assembled state connects the edge member 40a' to the substrate 12a '. The adhesive 62a 'has a refractive index which substantially corresponds to a refractive index of the optical fiber 14a'.

In an alternative embodiment, the edge element 40a 'could modify radiation. In Fig. 6 to 13 two further embodiments of the invention are shown. The following descriptions are essentially limited to the differences between the exemplary embodiments, wherein reference can be made to the description of the exemplary embodiment of FIGS. 1 to 5 with regard to components, features and functions that remain the same. To distinguish the embodiments, the letter a in the reference numerals of the embodiment in FIGS. 1 to 5 by the letters b and c in the reference numerals of the embodiments of FIGS. 6 to 13 replaced. With regard to identically named components, in particular with regard to components having the same reference numerals, it is also possible in principle to refer to the drawings and / or the description of the exemplary embodiment of FIGS. 1 to 5.

Fig. 6 shows an alternative optical circuit board 10b. The optical circuit board 10a has a substrate 12b and an edge member 40b. The edge member 40b is connected to the substrate 12b in an assembled state in an edge portion 42b of the substrate 12b.

The edge member 40b is integrally connected to the substrate 12b in an assembled state. In the present embodiment, the edge element 40b is identical to the substrate 12b. The edge member 40b forms the edge portion 42b of the substrate 12b. In a region facing the edge region 42b, a coating 66b of the substrate 12b has two recesses 68b in the present exemplary embodiment (see FIG. Of the recesses 68b, only one will be described below.

The substrate 12b has at least one fastening recess 84b. In the present exemplary embodiment, the substrate 12b, in particular per recess 68b of the coating 66b of the substrate 12b, has two fastening recesses 84b. The fastening recesses 84b are provided for fastening a second plug element 50b of a plug unit 44b. A position of the fastening recesses 84b is in particular variable and in particular depends on a configuration of the second connector element 50b and / or the plug unit 44b. When viewed in a plan view, the mounting recesses 84b have a substantially circular shape. Alternatively or additionally, the attachment recesses 84b could each have at least one slot. In particular, the fastening recesses could be provided for a variable attachment of the second plug element 50b of the plug unit 44b and in particular allow and / or permit and / or permit a displacement of the second plug element 50b of the plug unit 44b. As a result, the fastening recesses 84b could in particular allow a flush arrangement in a region of the edge element 40b facing away from a center.

The fastening recesses 84 are spaced apart in a depth direction 86b. The depth direction 86b is oriented substantially perpendicular to an edge of the substrate 12b. The depth direction 86b points from the edge portion 42b toward a center of the substrate 12b.

The substrate 12b has at least one reference mark 88b. In the present exemplary embodiment, the substrate 12b, in particular per recess 68b of the coating 66b of the substrate 12b, has an in particular single reference mark 88b. The reference mark 88b has a longitudinal extension direction, which is aligned substantially parallel to light guides 14b.

For example, the reference mark 88b and, in particular, the light guides 14b could be arranged on and / or in the substrate 12b by means of a high-precision machine. The reference mark 88b and in particular additionally the light guides 14b could in particular be produced in the same process step, in particular in the same lithography process step. In particular, high precision, in particular in a range of micrometers or submicrometers, could thereby be achieved. The reference mark 88b is provided for determining and / or defining a position of a receiving element 16b (see Fig. 8). The optical circuit board 10b has the receiving element 1 6b. The receiving element 16b is connected to the substrate 12b. The receiving element 16b has a receiving area 18b for a plug pin 20b (see FIG. 11). The receiving area 18b has a longitudinal extension direction 32b, which is aligned substantially parallel to the depth direction 86b. The longitudinal extension direction 32b of the receiving region 18b is aligned substantially parallel to the optical fibers 14b. In the assembled state, the receiving element 16b partially defines a position of the connector pin 20b relative to the optical fiber 14b.

The optical circuit board 10b has the connector pin 20b. Per recess 68b of the coating 66b of the substrate 12b, the optical circuit board 10b has exactly one connector pin 20b. In an assembled state, the plug pin 20b is partially disposed in a main receiving area 22b of the receiving area 18b.

The receiving area 18b has the main receiving area 22b. The main receiving portion 22b is provided for receiving the connector pin 20b. The main receiving portion 22b has a longitudinal extension direction which is aligned substantially parallel to the longitudinal extension direction 32b of the receiving portion 18b.

The receiving area 18b has a secondary receiving area 24b. The side receiving area 24b has a transverse extent 26b that is greater than a transverse extent 28b of the main receiving area 22b (see Fig. 9). The optical circuit board 10b has a fixing means 30b (see Fig. 11). The fixing means 30b is provided for fixing the connector pin 20b in the receiving portion 18b. In the assembled state, the fastening means 30b is partially disposed within the sub-receiving area 24b. The fastening means 30b is provided for a cohesive fastening of the connector pin 20b in the receiving region 18b. In the assembled state, the fastening means 30b is formed as a hardened raw material. The raw material is formed in the present embodiment as a cured adhesive. Alternatively, the raw material could be formed as a hardened solder and / or as a cured welding compound.

The sub-receiving area 24b is arranged in an end area 34b of the receiving area 18b with respect to the longitudinal extension direction 32b of the receiving element 16b. The receiving area has a further secondary receiving area 36b. With regard to the longitudinal extension direction 32b of the receiving element 16b, the additional secondary receiving region 36b is spaced apart from the secondary receiving region 24b.

The additional secondary receiving region 36b is arranged with respect to the longitudinal extension direction 32b of the receiving element 16b in a front region 38b of the receiving region 18b. In the assembled state, the attachment means 30b is partially disposed within the further sub-receiving area 36b.

The sub-receiving portion 24b is disposed on a side adjacent to the main receiving portion 22b with respect to the longitudinal extension direction 32b of the receiving member 16b. In the present embodiment, the sub-receiving portion 24b is disposed on two sides adjacent to the main receiving portion 22b with respect to the longitudinal extension direction 32b of the receiving member 16b.

The additional auxiliary receiving region 36b is arranged on one side next to the main receiving region 22b with respect to the longitudinal extension direction 32b of the receiving element 16b. In the present exemplary embodiment, the additional auxiliary receiving region 36b is arranged on two sides next to the main receiving region 22b with respect to the longitudinal extension direction 32b of the receiving element 16b. The substrate 12b has at least one further reference mark 90b (compare FIGS. 8 and 11). In the present exemplary embodiment, the substrate 12b, in particular per recess 68b of the coating 66b of the substrate 12b, has an in particular single further reference mark 90b. The further reference mark 90b is provided for an alignment of the plug unit 44b, in particular of the second plug element 50b of the plug unit 44b, during assembly.

For example, the further reference mark 90b could be arranged on and / or in the substrate 12b by means of a high-precision machine. The substrate 12b has at least one processing mark 92b (compare FIGS. 8 and 11). In the present exemplary embodiment, the substrate 12b, in particular per recess 68b of the coating 66b of the substrate 12b, has four processing marks 92b. Alternatively, the substrate 12b could have a different number of processing marks 92b. The machining marks 92b are formed as a reference for a polishing process. A total number of processing marks 92b removed from the substrate 12b in the polishing process are a reference for a tolerance for the mounting recess 84b.

In FIG. 8, a polishing edge 94b of the substrate 12b is shown in dashed lines following the polishing process. A total number of processing marks 92b intersecting the polishing edge 94b is formed as an angle reference in a check.

In the present exemplary embodiment, the substrate 12b has a substantially rectilinear edge surface 56b (see FIG. The substantially rectilinear edge surface 56b defines a plane in which, in particular, substantially all points of the edge surface 56b are arranged. Alternatively, the substrate 12b could have at least one indentation 96b in the edge region 42b (compare FIGS. 10 and 11). The substrate 12b could, in particular per recess 68b of the coating 66b of the substrate 12b, have a recess 96b. For example, the indentation 96b could be provided for engagement of a part of the plug unit 44b.

The recess 68b of the coating 66b of the substrate 12b is provided for exposing a part of the light guides 14b. The recess 68b of the coating 66b of the substrate 12b is provided for visualizing the reference mark 88b and / or the further reference mark 90b and / or the machining marks 92b.

For example, the reference mark 88b and / or the further reference mark 90b and / or the processing mark 92b could be arranged on the same layer of the substrate 12b. Alternatively or additionally, the reference mark 88b and / or the further reference mark 90b and / or the processing mark 92b could, for example, be arranged on at least two and advantageously on at least three different layers of the substrate 12b. The reference mark 88b and / or the further reference mark 90b and / or the processing mark 92b could, for example, be arranged on at least one copper layer and / or on at least one optical waveguide layer of the substrate 12b.

In the present exemplary embodiment, the receiving area 18b, in particular the main receiving area 22b, when viewed in a cross-sectional plane, which is aligned in particular perpendicular to a main extension plane of the substrate 12b, a substantially V-shaped configuration (see Fig .. 12). For example, the receiving element 16b and, in particular, the receiving area 18b could be produced by means of a high-precision machine. The receiving element 16b and in particular additionally the receiving area 18b could be produced, for example, over at least substantially an entire longitudinal extent by means of a high-precision machine. alternatives For example, at least one region of the receiving element 16b and in particular additionally of the receiving region 18b could be produced by means of a high-precision machine, such as in particular at least a portion of the main receiving region 22b. In a method of manufacturing the optical circuit board 10b, a thick raw mass of the fixing means 30b is placed in the main receiving area 22b before the male pin 20b is placed in the main receiving area 22b. The plug pin 20b is pressed into the raw mass of the fixing means 30b, which deviates into the sub-receiving area 24b and the further sub-receiving area 36b. In the method of manufacturing the optical circuit board 10b, the connector pin 20b is placed in the main receiving area 22b.

Fig. 13 shows a substrate 12c and a receiving element 16c of an alternative optical circuit board 10c. The receiving element 16c has a receiving region 18c with a main receiving area 22c and a secondary receiving area 24c. The sub-receiving area 24c is arranged with respect to the longitudinal extension direction 32c of the receiving element 16c in an end area 34c of the receiving area 18c.

In the present exemplary embodiment, the receiving area 18c has two additional secondary receiving areas 36c. With respect to the longitudinal extension direction 32c of the receiving element 1 6c, the additional auxiliary receiving areas 36c are spaced from the secondary receiving area 24c. The secondary receiving region 24c and the additional secondary receiving regions 36c are distributed substantially uniformly over a longitudinal extension of the receiving element 16c with respect to the longitudinal extension direction 32c of the receiving element 16c.

In the present exemplary embodiment, the receiving region 18c, in particular the main receiving region 22c, when viewed in a cross-sectional plane, which is aligned in particular perpendicular to a main extension plane of the substrate 12c, a substantially U-shaped configuration. In an end of the receiving area 18c facing away from an edge surface 56c of the edge element 40c, the receiving area 18a, when viewed in a plan view, has a substantially semicircular shape with a radius 98 of substantially 0.5 mm. When viewed in a plan view, the main receiving area 22c has a width 100c of substantially 1 mm, in particular at a tolerance of substantially 0.05 mm.

When viewed in a plan view, a distance 102c of a central axis of the main receiving area 22c to an axis of symmetry is substantially 2.3 mm, in particular at a tolerance of substantially 0.05 mm. A distance 104c of an extension of a reference mark 88c facing away from the axis of symmetry to the axis of symmetry is substantially 3.8 mm when viewed in a plan view.

An extension 106c from a start of the substantially semicircular shape of the receiving region 18c to an end of the reference mark 88c facing away from the edge surface 56c of the edge element 40c is substantially 2 mm when viewed in a plan view, in particular at a tolerance of substantially 0.01 mm.

reference numeral

10 optical circuit board

12 substrate

14 light guides

16 receiving element

18 recording area

20 connector pin

22 main reception area

24 additional reception area

26 transverse extension

28 transverse extension

30 fasteners

32 longitudinal direction

34 end area

36 Additional secondary recording area

38 front area

40 edge element

42 edge area

44 plug unit

46 reference point

48 First plug element

50 Second plug element

52 First reference surface

54 Second reference surface

56 edge surface

58 basic body

60 coating

62 adhesives

64 base plate

66 coating recess

head Start

Another optical unit lens

reference element

increase

Another second reference surface distance

Mounting recess depth direction

reference mark

Further reference marking Machining mark Polishing edge

indentation

radius

width

distance

extension

Another reference point

Claims

claims

Optical printed circuit board having at least one substrate (12a-c), with at least one light guide (14a-c), which is arranged on and / or in the substrate (12a-c), and with at least one with the substrate (12a-c) connected receiving element (16a-c), which has a receiving area (18a-c) for at least one plug pin (20a-c) and which is intended, a position of the plug pins (20a-c) relative to the light guide (14a-c) at least partially fixed, characterized in that the receiving area (18a-c) at least one main receiving portion (22a-c), which is provided for receiving the connector pin (20a-c), and at least one secondary receiving portion (24a-c), which a transverse extent (26a-c) greater than a transverse extent (28a-c) of the main receiving area (22a-c).

Optical printed circuit board according to claim 1, characterized by at least one fastening means (30a-c) which is provided for fastening the plug pin (20a-c) in the receiving region (18a-c) and in at least one mounted state at least partially within the secondary receiving region (24a-c) is arranged.

Optical circuit board according to claim 2, characterized in that the fastening means (30a-c) is provided at least for a cohesive fastening of the connector pin (20a-c) in the receiving area (18a-c).

4. An optical circuit board according to claim 2 or 3, characterized in that the fastening means (30a-c) is formed as a hardened raw mass.

5. An optical circuit board according to one of the preceding claims,

characterized in that the auxiliary receiving portion (24a-c) is disposed in an end portion (34a-c) of the receiving portion (18a-c) with respect to a longitudinal extension direction (32a-c) of the receiving member (1 6a-c).

6. An optical circuit board according to one of the preceding claims,

characterized in that the receiving region (18a-c) has at least one further secondary receiving region (36a-c), which with respect to a longitudinal direction (32a-c) of the receiving element

(1 6a-c) is spaced from the sub-receiving area (24a-c).

7. An optical circuit board according to claim 6, characterized in that the further auxiliary receiving portion (36a-c) with respect to the longitudinal direction (32a-c) of the receiving element (1 6a-c) in a front region (38a-c) of the receiving area (18a-c ) is arranged.

8. An optical circuit board according to claims 2 and 6, characterized in that the fastening means (30a-c) in the assembled state at least partially within the further Nebenaufnahmebe- area (36a-c) is arranged.

9. Optical circuit board according to one of the preceding claims, characterized in that the secondary receiving portion (24a-c) with respect to a longitudinal direction (32a-c) of the receiving element (1 6a-c) on at least one side adjacent to the main receiving portion (22a-c) is.

10. An optical circuit board according to claim 9, characterized in that the secondary receiving portion (24a-b) with respect to a longitudinal direction (32a-b) of the receiving element (16a-b) on at least two sides adjacent to the main receiving portion (22a-b) is arranged.

1 1. Method for producing an optical circuit board, in particular according to one of the preceding claims, comprising at least one substrate (12a-c), with at least one light guide (14a-c) arranged on and / or in the substrate (12a-c) , and at least one receiving element (16a-c) connected to the substrate (12a-c), which has a receiving area (18a-c) for at least one plug pin (20a-c) and which is intended to be a position of the plug pin (20a-c) at least partially fixed relative to the light guide (14a-c), characterized in that the receiving region (18a-c) at least one main receiving portion (22a-c) and at least one secondary receiving portion (24a-c), which has a Transverse extension (26a-c) which is greater than a transverse extent (28a-c) of the main receiving area (22a-c), wherein the plug pin (20a-c) in the main receiving area (22a-c) is arranged.

12. The method of claim 1 1, characterized in that a raw mass of a fastening means (30a-c) in the main receiving area (22a-c) is arranged before the plug pin (20a-c) in the main receiving area (22a-c) is arranged.

13. The method according to claim 12, characterized in that the plug pin (20a-c) is pressed into the raw mass, which evades in the Ne benaufnahmebereich (24a-c).