WO2016121587A1 - 三次元造型サポート材用活性エネルギー線硬化性樹脂組成物 - Google Patents
三次元造型サポート材用活性エネルギー線硬化性樹脂組成物 Download PDFInfo
- Publication number
- WO2016121587A1 WO2016121587A1 PCT/JP2016/051515 JP2016051515W WO2016121587A1 WO 2016121587 A1 WO2016121587 A1 WO 2016121587A1 JP 2016051515 W JP2016051515 W JP 2016051515W WO 2016121587 A1 WO2016121587 A1 WO 2016121587A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- active energy
- energy ray
- curable resin
- resin composition
- meth
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 194
- 239000011342 resin composition Substances 0.000 title claims abstract description 100
- 239000000178 monomer Substances 0.000 claims abstract description 95
- 150000001875 compounds Chemical class 0.000 claims abstract description 46
- 239000003999 initiator Substances 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 46
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- 125000002091 cationic group Chemical group 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 125000002947 alkylene group Chemical group 0.000 claims description 10
- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 claims description 10
- 125000000129 anionic group Chemical group 0.000 claims description 9
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims description 7
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 150000001450 anions Chemical class 0.000 claims description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- 150000002894 organic compounds Chemical class 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 239000000654 additive Substances 0.000 abstract description 10
- 230000000996 additive effect Effects 0.000 abstract description 6
- 238000011109 contamination Methods 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract 1
- 229940048053 acrylate Drugs 0.000 description 89
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 88
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 61
- -1 halogen ions Chemical class 0.000 description 60
- 238000004140 cleaning Methods 0.000 description 48
- 239000007788 liquid Substances 0.000 description 40
- 230000000052 comparative effect Effects 0.000 description 33
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 29
- 238000000034 method Methods 0.000 description 26
- 238000001723 curing Methods 0.000 description 20
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 18
- 239000004926 polymethyl methacrylate Substances 0.000 description 18
- 239000000047 product Substances 0.000 description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 14
- 229920001515 polyalkylene glycol Polymers 0.000 description 14
- 239000002202 Polyethylene glycol Substances 0.000 description 13
- 229920001223 polyethylene glycol Polymers 0.000 description 13
- 230000008961 swelling Effects 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- 229920001451 polypropylene glycol Polymers 0.000 description 12
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 11
- JSYQTJCNKUAUMM-UHFFFAOYSA-N ethyl carbamate;prop-2-enamide Chemical compound NC(=O)C=C.CCOC(N)=O JSYQTJCNKUAUMM-UHFFFAOYSA-N 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical group C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 9
- 238000000926 separation method Methods 0.000 description 9
- 238000004090 dissolution Methods 0.000 description 8
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 229920005862 polyol Polymers 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 7
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 7
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 6
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 150000003926 acrylamides Chemical class 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 239000005056 polyisocyanate Substances 0.000 description 6
- 229920001228 polyisocyanate Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- 229960003237 betaine Drugs 0.000 description 5
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 235000011187 glycerol Nutrition 0.000 description 5
- 238000005342 ion exchange Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 229910001507 metal halide Inorganic materials 0.000 description 5
- 150000005309 metal halides Chemical class 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000005058 Isophorone diisocyanate Substances 0.000 description 4
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 4
- 230000000740 bleeding effect Effects 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- 238000007730 finishing process Methods 0.000 description 4
- 150000002334 glycols Chemical class 0.000 description 4
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 4
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 3
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 3
- 208000034189 Sclerosis Diseases 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 3
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 3
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 3
- 150000004056 anthraquinones Chemical class 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 239000008117 stearic acid Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 2
- SZNYYWIUQFZLLT-UHFFFAOYSA-N 2-methyl-1-(2-methylpropoxy)propane Chemical compound CC(C)COCC(C)C SZNYYWIUQFZLLT-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- 229910020366 ClO 4 Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229920002556 Polyethylene Glycol 300 Polymers 0.000 description 2
- WTKZEGDFNFYCGP-UHFFFAOYSA-O Pyrazolium Chemical compound C1=CN[NH+]=C1 WTKZEGDFNFYCGP-UHFFFAOYSA-O 0.000 description 2
- RWRDLPDLKQPQOW-UHFFFAOYSA-O Pyrrolidinium ion Chemical compound C1CC[NH2+]C1 RWRDLPDLKQPQOW-UHFFFAOYSA-O 0.000 description 2
- 206010040880 Skin irritation Diseases 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QYTDEUPAUMOIOP-UHFFFAOYSA-N TEMPO Chemical group CC1(C)CCCC(C)(C)N1[O] QYTDEUPAUMOIOP-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 2
- 229960001231 choline Drugs 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000003827 glycol group Chemical group 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- ZCQWOFVYLHDMMC-UHFFFAOYSA-O hydron;1,3-oxazole Chemical compound C1=COC=[NH+]1 ZCQWOFVYLHDMMC-UHFFFAOYSA-O 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 229940085991 phosphate ion Drugs 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 230000036556 skin irritation Effects 0.000 description 2
- 231100000475 skin irritation Toxicity 0.000 description 2
- 229940047670 sodium acrylate Drugs 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 2
- 230000002522 swelling effect Effects 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- ZOKCNEIWFQCSCM-UHFFFAOYSA-N (2-methyl-4-phenylpent-4-en-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)CC(=C)C1=CC=CC=C1 ZOKCNEIWFQCSCM-UHFFFAOYSA-N 0.000 description 1
- PSBDWGZCVUAZQS-UHFFFAOYSA-N (dimethylsulfonio)acetate Chemical compound C[S+](C)CC([O-])=O PSBDWGZCVUAZQS-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- WVWYODXLKONLEM-UHFFFAOYSA-N 1,2-diisocyanatobutane Chemical compound O=C=NC(CC)CN=C=O WVWYODXLKONLEM-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- ABZIUADBEUVQIX-UHFFFAOYSA-N 1,3-diisocyanatobenzene 1,4-diisocyanatobenzene Chemical compound C1(=CC(=CC=C1)N=C=O)N=C=O.C1(=CC=C(C=C1)N=C=O)N=C=O ABZIUADBEUVQIX-UHFFFAOYSA-N 0.000 description 1
- UFXYYTWJETZVHG-UHFFFAOYSA-N 1,3-diisocyanatobutane Chemical compound O=C=NC(C)CCN=C=O UFXYYTWJETZVHG-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- XUIXZBXRQFZHIT-UHFFFAOYSA-N 1-[1-(1-hydroxypropan-2-yloxy)propan-2-yloxy]-3-methoxypropan-2-ol Chemical compound COCC(O)COC(C)COC(C)CO XUIXZBXRQFZHIT-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- LHNAURKRXGPVDW-UHFFFAOYSA-N 2,3-diisocyanatobutane Chemical compound O=C=NC(C)C(C)N=C=O LHNAURKRXGPVDW-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- CFDVVYHDNLJDOP-UHFFFAOYSA-N 2-(dimethylamino)-3-methyl-2-(4-methylphenyl)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound CN(C(C(=O)C1=CC=C(C=C1)N1CCOCC1)(C(C)C)C1=CC=C(C=C1)C)C CFDVVYHDNLJDOP-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- PTXMNGZGHGYOIJ-UHFFFAOYSA-N 2-[4-hydroxy-3,3-bis(hydroxymethyl)butan-2-yl]oxyethyl prop-2-enoate Chemical compound OCC(CO)(CO)C(C)OCCOC(=O)C=C PTXMNGZGHGYOIJ-UHFFFAOYSA-N 0.000 description 1
- LCLMOJQKUBRPIM-UHFFFAOYSA-N 2-aminoethanol;prop-2-enoic acid Chemical compound NCCO.OC(=O)C=C LCLMOJQKUBRPIM-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- CKKQLOUBFINSIB-UHFFFAOYSA-N 2-hydroxy-1,2,2-triphenylethanone Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(O)C(=O)C1=CC=CC=C1 CKKQLOUBFINSIB-UHFFFAOYSA-N 0.000 description 1
- HQOWQDGYEVBGMI-UHFFFAOYSA-N 2-hydroxy-1,2,3-triphenylpropane-1,3-dione Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)(O)C(=O)C1=CC=CC=C1 HQOWQDGYEVBGMI-UHFFFAOYSA-N 0.000 description 1
- RZCDMINQJLGWEP-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpent-4-en-1-one Chemical compound C=1C=CC=CC=1C(CC=C)(O)C(=O)C1=CC=CC=C1 RZCDMINQJLGWEP-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- MWCBGWLCXSUTHK-UHFFFAOYSA-N 2-methylbutane-1,4-diol Chemical compound OCC(C)CCO MWCBGWLCXSUTHK-UHFFFAOYSA-N 0.000 description 1
- JLWNXAQLFIHRMZ-UHFFFAOYSA-N 2-methylidenepentanamide;trimethylazanium;chloride Chemical compound [Cl-].C[NH+](C)C.CCCC(=C)C(N)=O JLWNXAQLFIHRMZ-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- SCSRCSIMUYNQQS-UHFFFAOYSA-N 4-methylbenzenesulfonate 2-methylidenepentanamide trimethylazanium Chemical compound C[NH+](C)C.CCCC(=C)C(N)=O.Cc1ccc(cc1)S([O-])(=O)=O SCSRCSIMUYNQQS-UHFFFAOYSA-N 0.000 description 1
- UZHIMIBNVCRJIK-UHFFFAOYSA-N 4-methylbenzenesulfonate trimethyl-[3-(prop-2-enoylamino)propyl]azanium Chemical compound Cc1ccc(cc1)S([O-])(=O)=O.C[N+](C)(C)CCCNC(=O)C=C UZHIMIBNVCRJIK-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004322 Butylated hydroxytoluene Substances 0.000 description 1
- HZRPIZSSEMKEEW-UHFFFAOYSA-N C1CO1.O=C1NC(=O)NC(=O)N1 Chemical compound C1CO1.O=C1NC(=O)NC(=O)N1 HZRPIZSSEMKEEW-UHFFFAOYSA-N 0.000 description 1
- WSXQZPSVENNEEU-UHFFFAOYSA-N C[N+](CCO)(C1)C(C([O-])=O)=NC1OC(C=C)=O Chemical compound C[N+](CCO)(C1)C(C([O-])=O)=NC1OC(C=C)=O WSXQZPSVENNEEU-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004381 Choline salt Substances 0.000 description 1
- DKMROQRQHGEIOW-UHFFFAOYSA-N Diethyl succinate Chemical compound CCOC(=O)CCC(=O)OCC DKMROQRQHGEIOW-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical class C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical class C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical class C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000001449 anionic compounds Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- CIWBQSYVNNPZIQ-XYWKZLDCSA-N betamethasone dipropionate Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@H](C)[C@@](C(=O)COC(=O)CC)(OC(=O)CC)[C@@]1(C)C[C@@H]2O CIWBQSYVNNPZIQ-XYWKZLDCSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229940095259 butylated hydroxytoluene Drugs 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001767 cationic compounds Chemical class 0.000 description 1
- FZFAMSAMCHXGEF-UHFFFAOYSA-N chloro formate Chemical compound ClOC=O FZFAMSAMCHXGEF-UHFFFAOYSA-N 0.000 description 1
- 235000019417 choline salt Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 229940074639 diprolene Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- BNKAXGCRDYRABM-UHFFFAOYSA-N ethenyl dihydrogen phosphate Chemical compound OP(O)(=O)OC=C BNKAXGCRDYRABM-UHFFFAOYSA-N 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- YEGNRPYFJGAPIM-UHFFFAOYSA-N ethyl prop-2-enoate methanesulfonate trimethylazanium Chemical compound C[NH+](C)C.CS([O-])(=O)=O.CCOC(=O)C=C YEGNRPYFJGAPIM-UHFFFAOYSA-N 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- CKFGINPQOCXMAZ-UHFFFAOYSA-N formaldehyde hydrate Natural products OCO CKFGINPQOCXMAZ-UHFFFAOYSA-N 0.000 description 1
- MGJURKDLIJVDEO-UHFFFAOYSA-N formaldehyde;hydrate Chemical compound O.O=C MGJURKDLIJVDEO-UHFFFAOYSA-N 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000003505 heat denaturation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 125000001145 hydrido group Chemical group *[H] 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910001412 inorganic anion Inorganic materials 0.000 description 1
- 229910001411 inorganic cation Inorganic materials 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical group CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- LFETXMWECUPHJA-UHFFFAOYSA-N methanamine;hydrate Chemical compound O.NC LFETXMWECUPHJA-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- FLKPEMZONWLCSK-UHFFFAOYSA-N phthalic acid di-n-ethyl ester Natural products CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- IXRIKXJQFYIWSW-UHFFFAOYSA-N propan-1-one Chemical compound CC[C+]=O IXRIKXJQFYIWSW-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229940117986 sulfobetaine Drugs 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/40—Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/56—Acrylamide; Methacrylamide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/58—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing oxygen in addition to the carbonamido oxygen, e.g. N-methylolacrylamide, N-(meth)acryloylmorpholine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/60—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide containing nitrogen in addition to the carbonamido nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
- B29K2071/02—Polyalkylene oxides, e.g. PEO, i.e. polyethylene oxide, or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0002—Condition, form or state of moulded material or of the material to be shaped monomers or prepolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0059—Degradable
- B29K2995/0062—Degradable water-soluble
Definitions
- the present invention relates to an active energy ray-curable resin composition used for forming a support material for shape support in additive manufacturing, a support material formed from the composition, an optical three-dimensional modeling method using the support agent,
- the present invention relates to an ink-jet optical three-dimensional modeling method and a three-dimensional model obtained by these manufacturing methods.
- Additive manufacturing technology is based on three-dimensional shape data, and fuses and cures thermoplastic resin, photo-curable resin, powder resin, powder metal, etc. using melt extrusion, inkjet, laser light, electron beam, etc. By this, it is the technique of accumulating in thin film form and obtaining the target three-dimensional molded item. Shaped objects can be obtained directly from shape data, and complex shapes such as hollow and mesh shapes can be integrally molded, so the field of use such as medical lots, aircraft industry, industrial robots can be expanded, including the creation of small lot or custom test models. ing.
- An additive manufacturing device generally called a 3D printer is used to obtain a three-dimensional model.
- a 3D printer is used to obtain a three-dimensional model.
- photo-curing resin such as acrylic
- hot melt lamination method using thermoplastic resin such as acrylonitrile / butadiene / styrene resin
- other 3D methods such as powder modeling method and optical modeling method Printers are known.
- the additive manufacturing technique can form a three-dimensional object having a complicated shape, but when manufacturing a hollow structure, a support for shape support is required to prevent the three-dimensional object from being deformed by its own weight.
- a powder modeling method in which powder raw materials are bound or fused, unbound and unfused powder acts as a support, and after molding, a three-dimensional shaped object can be obtained by scraping off.
- the inkjet method in which the photo-curable resin is cured stepwise and the hot melt lamination method in which the thermoplastic resin is melt-extruded and laminated
- a three-dimensional model made of a model material and a support made of a support material are used. Since it is necessary to form them almost simultaneously, it is necessary to provide a process for removing the support material from the three-dimensional structure after molding.
- the support material after molding is not an easy task. Since the support material is fused, adhered or adhered to the target three-dimensional object, it is usually peeled off manually with a spatula or brush, or blown off with a water jet. However, since there is a risk of damage to the three-dimensional structure, careful work is required, which is a heavy burden.
- thermoplastic resin heat-melting wax, materials that can be dissolved in water and organic solvents, water-swelling gels, etc. are used as support materials, and power such as heating, dissolution, chemical reaction, and hydraulic cleaning is used depending on the nature of the support material. Separation methods using cleaning, electromagnetic wave irradiation, thermal expansion difference, and the like have been proposed (Patent Documents 1 and 2).
- Patent Documents 3 and 4 a resin that can be easily peeled off from the model material is used (Patent Documents 3 and 4), a wax is used as a support material to perform melting and removal by heat (Patent Document 5), alkali, water, organic Means for dissolving and dispersing in a solvent (Patent Documents 6 to 11), and means for removing a support material by stirring or energizing using an electrolyte solution such as tetramethylammonium hydroxide as a cleaning liquid have been proposed. Yes.
- the molding accuracy of the interface due to the compatibility and mixing that occurs near the contact surface before the support material and the model material are cured decreases, and the surface of the contact portion after the support material is removed
- the finish accuracy of the three-dimensional model was lowered, such as roughening.
- the support material can be efficiently removed at a low temperature and in a short time only by immersing the rough shaped object supported by the support material in a cleaning solution, and a finishing process is not required. It is an object of the present invention to provide a support material that can be obtained and an active energy ray-curable resin composition used for forming the support material. Further, the present invention uses the active energy ray-curable resin composition and a support material obtained by curing the active energy ray-curable resin composition, and is a three-dimensional stereolithography method capable of obtaining a three-dimensional object with high efficiency and high accuracy. And providing a molded product thereof.
- the present inventors have used a cured product of an active energy ray-curable resin composition containing an ionic monomer as a support material.
- the present inventors have found that the above problems can be solved and the goal can be achieved, and the present invention has been achieved.
- the present invention provides (1) an active energy ray-curable resin composition for a three-dimensional molding support material containing 1.0% by mass or more of an ionic monomer (A), (2) Ionic monomer (A) 1.0-30.0 mass%, nonionic water-soluble monomer (B) 2.0-60.0 mass%, non-polymerizable compound (C) 25 Active energy ray-curable resin composition according to (1) above, comprising 0.0 to 80.0% by mass and a photopolymerization initiator (D) of 0.1 to 5.0% by mass; (3) The active energy ray-curable resin composition according to (1) or (2), wherein the ionic monomer (A) is 1.0 to 30.0% by mass, the nonionic water-soluble monomer Contains 10.0 to 60.0 mass% of the monomer (B), 25.0 to 60.0 mass% of the non-polymerizable compound (C) and 0.1 to 5.0 mass% of the photopolymerization initiator (D).
- An active energy ray-curable resin composition for a support material wherein the cured product obtained by irradiation with active energy rays is water-soluble or water-dispersible
- the active energy ray-curable resin composition according to (1) or (2) wherein the ionic monomer (A) is 1.0 to 30.0% by mass, the nonionic water-soluble monomer
- the monomer (B) is 2.0 to 50.0% by mass
- the non-polymerizable compound (C) is 40.0 to 80.0% by mass
- the photopolymerization initiator (D) is 0.1 to 5.0% by mass
- An active energy ray for a support material containing 0.5 to 5.0% by mass of a functional unsaturated monomer (E), and a cured product obtained by irradiation with an active energy ray is water-swellable Curable resin composition
- Active energy ray-curable resin composition (7) The active energy ray-curable composition according to any one of (1) to (6), wherein the ionic monomer (A) is a compound represented by the following general formula (1): Resin composition, (Wherein R 1 represents a hydrogen atom or a methyl group, R 2 and R 3 each independently represents an alkyl group having 1 to 3 carbon atoms, which may be the same or different, and R 4 represents a carbon number 1 to 3 alkyl group, alkenyl group, or benzyl group, Y represents an oxygen atom or NH, Z represents an alkylene group having 1 to 3 carbon atoms, and X ⁇ represents an anion.) (8) The active energy ray-curable resin composition according to any one of (1) to (7), wherein the nonionic water-soluble monomer (B) is N-substituted (meth) acrylamide, (9) Any of (1) to (8) above, wherein the nonionic water-soluble monomer (B) is N- (2-hydroxy
- the active energy ray-curable resin composition containing an ionic monomer is cured by active energy ray irradiation at the same time as or immediately after being molded by addition production to form a support material, A rough shaped object integrated with the support material and the model material supported by the support material is obtained.
- a cleaning solution such as water
- the support material dissolves or disperses in the cleaning liquid, or swells with the cleaning liquid and peels off from the model material, thereby easily removing the support material from the three-dimensional structure. I can do it.
- the polarity of the active energy ray-curable resin composition is increased, the phase separation from the curable resin composition for model materials is high, surface contamination is not caused, and high molding accuracy is achieved.
- a three-dimensional molded article can be provided.
- the present invention is described in detail below.
- the ionic monomer (A) used in the present invention is at least one selected from the group consisting of ammonium salt, imidazolium salt, choline salt, sulfonium salt, pyrazolium salt, oxazolium salt, pyridinium salt, pyrrolidinium salt, phosphonium and the like.
- At least one anionic property selected from the group consisting of a cationic monomer (a1) having a cationic group and an ethylenically unsaturated bond in one molecule, a carboxylate, a sulfonate, and a phosphate
- It is a betaine type monomer (a3) having a saturated bonding group in one molecule.
- cationic monomer (a1) used in the present invention include cations such as ammonium having an ethylenically unsaturated bond, imidazolium, choline, sulfonium, pyrazolium, oxazolium, pyridinium, pyrrolidinium, phosphonium and the like. Is mentioned.
- Counter anions include Cl ⁇ , Br ⁇ , I ⁇ etc. halogen ions or OH ⁇ , CH 3 COO ⁇ , NO 3 ⁇ , ClO 4 ⁇ , PF 6 ⁇ , BF 4 ⁇ , HSO 4 ⁇ , CH 3 SO 3.
- Examples of the ethylenically unsaturated bond contained in the cationic monomer (a1) used in the present invention include a vinyl group, an allyl group, an acrylate group, a methacrylate group, an acrylamide group, and a methacrylamide group.
- the cationic monomer (a1) is represented by the following general formula (1) (wherein R 1 is a hydrogen atom) Or a methyl group, R 2 and R 3 are each independently an alkyl group having 1 to 3 carbon atoms, which may be the same or different, and R 4 is an alkyl group having 1 to 3 carbon atoms, or a benzyl group Y represents an oxygen atom or NH, Z represents an alkylene group having 1 to 3 carbon atoms, X ⁇ represents a halogen ion such as Cl ⁇ , Br ⁇ or I ⁇ or OH ⁇ , CH 3 COO ⁇ , NO 3.
- R 1 is a hydrogen atom
- R 2 and R 3 are each independently an alkyl group having 1 to 3 carbon atoms, which may be the same or different
- R 4 is an alkyl group having 1 to 3 carbon atoms
- Y represents an oxygen atom or NH
- Z represents an alkylene group having 1 to 3 carbon atoms
- anionic monomer (a2) used in the present invention include an anion such as (meth) acrylate ion, (meth) acrylate ethylcarboxylate ion, (meth) ethyl succinate ion, (Meth) acrylic acid ethyl phthalate ion, (meth) acrylic acid ethyl hexahydrophthalic acid ion, maleic acid ion, tetrahydrophthalic acid ion, itaconic acid ion, (meth) acrylic acid ethyl sulfonic acid ion, 2-acrylamide-2- Examples include methyl propane sulfonate ion, vinyl carboxylate ion, vinyl sulfonate ion, (meth) acrylic acid ethyl phosphate ion, and vinyl phosphate ion.
- anion such as (meth) acrylate ion, (meth) acrylate ethylcarboxy
- the counter cation is at least selected from inorganic cations such as Li + , Na + , K + , Ca 2+ and Mg 2+ , and organic cations such as ammonium, imidazolium, choline, sulfonium, oxazolium, pyrazolium, pyridinium, pyrrolidinium and phosphonium.
- inorganic cations such as Li + , Na + , K + , Ca 2+ and Mg 2+
- organic cations such as ammonium, imidazolium, choline, sulfonium, oxazolium, pyrazolium, pyridinium, pyrrolidinium and phosphonium.
- organic cations such as ammonium, imidazolium, choline, sulfonium, oxazolium, pyrazolium, pyridinium, pyrrolidinium and phosphonium.
- ion
- betaine monomer (a3) used in the present invention include (meth) acryloyloxyalkyl-N, N-dialkylammonium- ⁇ -N-alkylcarboxybetaine, (meth) acrylamideoxyalkyl-N, Carboxybetaine type monomers such as N-dialkylammonium- ⁇ -N-alkylcarboxybetaine, (meth) acryloyloxyalkyl-N, N-dialkylammonium- ⁇ -N-alkylsulfobetaine, (meth) acrylamideoxyalkyl-N, Sulfobetaine type monomers such as N-dialkylammonium- ⁇ -N-alkylsulfobetaine, (meth) acryloyloxyalkyl-N, N-dialkylammonium- ⁇ -N-alkylphosphobetaine, (meth) acrylamideoxyalkyl Phosphobetaine type monomers such as —N, N-dialkylam
- the cationic monomer (a1), the anionic monomer (a2) and the betaine monomer (a3) which are these ionic monomers may be used alone or Two or more types may be used in combination. From the viewpoint of balancing the compatibility and copolymerization with other components in the support material such as the nonionic water-soluble monomer (B), and the incompatibility with the resin composition forming the model material, Cationic monomer (a1) and anionic monomer (a2) are more preferred, and cationic monomer (a1) is more preferred.
- the content of the ionic monomer (A) in the present invention is 1.0% by mass or more based on the entire active energy ray-curable resin composition. If it is 1.0% by mass or more, the cured support material is preferable because it has good solubility and dispersibility in the cleaning liquid, swelling property with respect to the cleaning liquid, and separation with respect to the model material.
- the content of the ionic monomer (A) is more preferably 1.0 to 30.0% by mass. If it is 30.0% by mass or less, the resulting support material can suppress bleed-out of the non-polymerizable compound (C), and has a sufficient dissolution rate and dispersion rate in the step of removing the support material by dissolution or dispersion.
- the step of removing the support material by swelling and peeling is preferable because the dissolution rate in the cleaning liquid can be suppressed and a sufficient swelling rate can be maintained. Further, it is more preferably 5.0 to 20.0% by mass.
- the nonionic water-soluble monomer (B) used in the present invention includes a water-soluble hydroxyalkyl (meth) acrylate, a water-soluble polyalkylene glycol (meth) acrylate, and a water-soluble alkoxy polyalkylene glycol (meth) acrylate.
- water solubility shall mean that the solubility (25 degreeC) with respect to water is 5 (g / 100g) or more.
- Examples of the water-soluble hydroxyalkyl (meth) acrylate used in the present invention include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth). Examples thereof include acrylate, 4-hydroxybutyl (meth) acrylate, 5-hydroxypentyl (meth) acrylate, and 6-hydroxyhexyl (meth) acrylate.
- water-soluble polyalkylene glycol (meth) acrylate used in the present invention examples include diethylene glycol (meth) acrylate, triethylene glycol (meth) acrylate, polyethylene glycol (meth) acrylate, dipropylene glycol (meth) acrylate, and tripropylene glycol. (Meth) acrylate, polypropylene glycol (meth) acrylate, polyethylene glycol polypropylene glycol (meth) acrylate and the like.
- Examples of the water-soluble alkoxy polyalkylene glycol (meth) acrylate used in the present invention include methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, and methoxydipropylene glycol (meth).
- Examples include acrylate, methoxytripropylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, and methoxypolyethylene glycol polypropylene glycol (meth) acrylate.
- Examples of the water-soluble N-substituted (meth) acrylamide used in the present invention include, for example, N-alkyl (meth) acrylamide introduced with an alkyl group having 1 to 3 carbon atoms, N, N-dialkyl (meth) acrylamide, N-hydroxyalkyl (meth) acrylamide, N, N-di (hydroxyalkyl) (meth) acrylamide, and N-hydroxyalkyl-N- (4- Hydroxyphenyl) (meth) acrylamide, N-alkyl-N-hydroxyalkyl (meth) acrylamide introduced with a hydroxyalkyl group having 1 to 6 carbon atoms and an alkyl group having 1 to 6 carbon atoms, 1 to carbon atoms N-alkoxyalkyl introduced with an alkoxyalkyl group comprising 6 alkoxy groups and an alkylene group having 1 to 6 carbon atoms (Meth) acrylamide, N, N-di (alkoxyalkyl) (me
- the content of the nonionic water-soluble monomer (B) of the present invention is preferably 2.0 to 60.0% by mass with respect to the entire active energy ray-curable resin composition.
- the content is 2.0% by mass or more, bleeding out of the non-polymerizable compound (C) can be suppressed from the cured support material, and the cured support material is soluble or dispersible in the cleaning liquid, or the cleaning liquid. It is preferable because it has good swellability with respect to the surface and separation with respect to the model material.
- the composition exhibits sufficient curability with respect to the active energy ray, and the non-polymerizable compound (C ) Is more preferable because it does not bleed out.
- the content of 60.0% by mass or less is preferable because the support material to be obtained has a low rate of cure shrinkage and heat generation at the time of curing, and foaming is difficult to occur, and a three-dimensional model can be manufactured with high accuracy.
- a polyfunctional unsaturated monomer (E) when included, it is more preferable to contain 50.0 mass% or less of (B) from a viewpoint which is easy to control the heat_generation
- the non-polymerizable compound (C) used in the present invention is compatible with the ionic monomer (A) and the non-ionic water-soluble monomer (B), but does not react with them and is not polymerized. If it is a thing of nature, it will not specifically limit.
- These non-polymerizable compounds can be used singly or in combination of two or more.
- the non-polymerizable compound (C) is water. And / or a non-polymerizable water-soluble organic compound.
- water solubility shall mean that the solubility (25 degreeC) with respect to water is 5 (g / 100g) or more.
- non-polymerizable water-soluble organic compound used in the present invention examples include water-soluble alkylene glycols, dialkylene glycols, trialkylene glycols composed of an alkylene group having 2 to 4 carbon atoms, an alkyl group having 1 to 4 carbon atoms, and the like.
- the content of the non-polymerizable compound (C) used in the present invention is 25.0 to 80.0% by mass with respect to the entire active energy ray-curable resin composition.
- the content is 25.0% by mass or more, the viscosity of the active energy ray-curable resin composition is low, the operability is good, and the curing shrinkage rate of the support material obtained by curing is low, and the three-dimensional modeling This is preferable because the product can be manufactured with high accuracy.
- it is 80% by mass or less bleeding out of the non-polymerizable compound (C) is suppressed, and the cured product obtained by polymerization with active energy rays can sufficiently satisfy the tensile strength, hardness, elasticity, etc.
- the content of the non-polymerizable compound (C) is more preferably 25.0 to 60.0% by mass, and 35.0 to 50.0% by mass. % Is more preferable.
- the swelling ratio can be maintained large, so that it is more preferably 40.0 to 80.0% by mass, and 50.0 to 70.0% by mass. Further preferred.
- Examples of the photopolymerization initiator (D) used in the present invention include ordinary ones such as acetophenone, benzoin, benzophenone, ⁇ -aminoketone, xanthone, anthraquinone, acylphosphine oxide, and polymer photoinitiator. May be selected as appropriate.
- acetophenones include diethoxyacetophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4- Isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2-hydroxyethoxy) -phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenylketone, 2-methyl- Examples of 1- (4-methylthiophenyl) -2-morpholinopropane-1, benzoins include benzoin, ⁇ -methylbenzoin, ⁇ -phenylbenzoin, ⁇ -allylbenzoin, ⁇ -benzoylbenzoin, benzoin methyl ether, benzoin ethyl ether , Benzoin isopropyl ether, As zoin isobutyl ether, benzyldimethyl ketal and benzophenones,
- the content of the photopolymerization initiator (D) used in the present invention is preferably 0.1 to 5.0% by mass with respect to the entire active energy ray-curable resin composition.
- the content is 0.1% by mass or more, the active energy ray-curable resin composition is sufficiently polymerized by irradiation with active energy rays, the amount of residual monomer in the obtained support material is small, and the tensile strength of the cured product , Hardness, elasticity, etc. are good, and bleed out of the non-polymerizable compound (C) can be suppressed, which is preferable.
- it is 5% by mass or less, the pot life of the active energy ray-curable resin composition is long, and troubles such as gelation during storage do not occur, and 0.5 to 3% by mass is more preferable.
- polyfunctional unsaturated monomer (E) used in the present invention a bifunctional monomer or a trifunctional or higher functional monomer can be used.
- bifunctional monomer alkylene glycol di (meth) can be used.
- the functional or higher monomer include pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol tetra ( Acrylate), dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tri (meth) acryloyloxyethoxytrimethylolpropane, glycerin polyglycidyl ether poly (meth) acrylate, is
- alkylene glycol di (meth) acrylates examples include ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and 3-methyl-1,5-pentanediol di (meth).
- examples include tricyclodecane di (meth) acrylate.
- Polyalkylene glycol di (meth) acrylates include diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, diprolene glycol di (meth) acrylate, triprolene glycol di ( (Meth) acrylate, polyprolene glycol di (meth) acrylate, di (neopentyl glycol) di (meth) acrylate, tri (neopentyl glycol) di (meth) acrylate, poly (neopentyl glycol) di (meth) acrylate, di (3-Methyl-1,5-pentanediol) di (meth) acrylate, tri (3-methyl-1,5-pentanediol) di (meth) acrylate, poly (3-methyl-1,5-pentanediol) (Meth) acrylate, polyethylene glycol polypropylene glycol di (meth)
- Polyester di (meth) acrylates are those in which a polyester polyol having hydroxyl groups at both ends or side chains containing a polyester skeleton in the molecule and (meth) acrylic acid are ester-bonded.
- the polyvalent carboxylic acid component of the polyester polyol include terephthalic acid, isophthalic acid, succinic acid, adipic acid, azelaic acid, sebacic acid, and dodecanedioic acid.
- the diol component include ethylene glycol and 1,2-propylene glycol.
- Polycarbonate di (meth) acrylates are those in which a polycarbonate polyol having hydroxyl groups at both ends or side chains containing a carbonate skeleton in the molecule and (meth) acrylic acid are ester-bonded.
- Examples of the carbonyl component of the polycarbonate polyol include phosgene, chloroformate, dialkyl carbonate, diaryl carbonate and alkylene carbonate.
- diol component examples include ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,4- Butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 1,9-nonanediol, neopentyl glycol, 2-ethyl -2-butyl-1,3-propanediol and the like.
- Polyurethane di (meth) acrylates include alcohol compounds having one or more hydroxyl groups in the molecule, polyisocyanate compounds having two or more isocyanate groups in one molecule, (meth) acrylate compounds having hydroxyl groups,
- the synthesis method is not particularly limited and can be synthesized by a known urethanization reaction technique.
- polyurethane (meth) acrylamides examples include alcohol compounds having one or more hydroxyl groups in the molecule, polyisocyanate compounds having two or more isocyanate groups in one molecule, and (meth) acrylamide compounds having hydroxyl groups. It is a compound obtained by an addition reaction, and the synthesis method is not particularly limited and can be synthesized by a known urethanization reaction technique.
- Alcohol compounds having one or more hydroxyl groups in the molecule are ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,2- having one or more hydroxyl groups at the end or side chain of the main chain skeleton.
- non-polymerizable compound (C) is preferably a compound containing an alkylene glycol structure
- ethylene glycol, polyethylene glycol, polypropylene glycol, polypropylene glycol or the like having an alkylene glycol structure is used, non-polymerizable compounds of urethane (meth) acrylamides are used. This is preferable because the compatibility with the polymerizable compound is increased.
- polyisocyanate compound having two or more isocyanate groups in one molecule examples include trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, 1,2-propylene diisocyanate, 1,2-butylene diisocyanate, Aliphatic isocyanates such as 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 1,3-phenylene diisocyanate 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate Aromatic isocyanates such as 2,4-diphenylmethane diisocyanate and xylylene diisocyanate, cyclopentylene
- Examples of the (meth) acrylate compound having a hydroxyl group used in the present invention include, for example, hydroxyalkyl (meth) acrylate, 4-hydroxyphenyl (meth) acrylate having a hydroxyalkyl group having 1 to 6 carbon atoms, Examples include dialkylene glycol (meth) acrylate, trialkylene glycol (meth) acrylate, polyalkylene glycol (meth) acrylate, glycerin mono (meth) acrylate, glycerin di (meth) acrylate and the like having 1 to 6 alkylene glycol groups introduced therein. It is done.
- Examples of the (meth) acrylamide compound having a hydroxyl group used in the present invention include N-hydroxyalkyl (meth) acrylamide, N, N-di (hydrido) into which a hydroxyalkyl group having 1 to 6 carbon atoms has been introduced.
- Xylalkyl) (meth) acrylamide, N-hydroxyalkyl-N- (4-hydroxyphenyl) (meth) acrylamide, N-introducing a hydroxyalkyl group having 1 to 6 carbon atoms and an alkyl group having 1 to 6 carbon atoms Alkyl-N-hydroxyalkyl (meth) acrylamide, N-alkyl-N- (4-hydroxyphenyl) (meth) acrylamide, 4-hydroxyphenyl (meth) acrylamide, N, N-di (4-hydroxyphenyl) (Meth) acrylamide, etc., especially N- (2-hydroxyethyl) acrylic Amides has a high curability, skin irritation (PII 0) is easy to handle and high safety is lower, more preferably.
- the amount of the polyfunctional unsaturated monomer (E) used is preferably 0.5 to 5.0% by mass with respect to the entire active energy ray-curable resin composition.
- the cured product obtained by polymerizing the active energy ray-curable resin composition by irradiation with active energy rays has good tensile strength, hardness, elasticity, etc., and is a non-polymerizable compound. This is preferable because the bleeding out of (C) can be suppressed.
- the active energy ray-curable resin composition of the present invention is cured by irradiation with active energy rays.
- the active energy rays of the present invention are those having energy quanta in electromagnetic waves or charged particle beams, that is, visible light, electrons. It refers to light energy rays such as rays, ultraviolet rays, infrared rays, X-rays, ⁇ rays, ⁇ rays and ⁇ rays.
- Examples of the active energy ray source include a high-pressure mercury lamp, a halogen lamp, a xenon lamp, a metal halide lamp, an LED lamp, an electron beam accelerator, and a radioactive element.
- ultraviolet rays are preferable from the viewpoint of storage stability of the active energy ray-curable resin composition, curing speed and low harmfulness.
- a necessary amount of active energy ray irradiation is not particularly limited. Varies depending on the type and amount of the ionic monomer (A), nonionic water-soluble monomer (B), and photopolymerization initiator (D) used in the active energy ray-curable resin composition. / Cm 2 or more and 1000 mJ / cm 2 or less is preferable. When the integrated light quantity is 50 mJ / cm 2 or more, sufficient curing proceeds, the cured product has good tensile strength, hardness, elasticity, and the like, and the bleeding out of the non-polymerizable compound (C) is suppressed, which is preferable. . Further, it is preferable that the integrated light amount is 1000 mJ / cm 2 or less because the irradiation time of the active energy ray is short and leads to improvement in productivity in additive manufacturing.
- the active energy ray-curable resin composition of the present invention is ethylenic in addition to the ionic monomer (A), nonionic water-soluble monomer (B), and polyfunctional unsaturated monomer (E). Unsaturated compounds (F) can further be used.
- the ethylenically unsaturated compound (F) is a monofunctional (meth) acrylate or vinyl compound, and may be used alone or in combination of two or more.
- the amount of the ethylenically unsaturated compound (F) added is not particularly limited as long as it does not adversely affect the characteristics exhibited by the active energy ray-curable resin composition according to the present invention, and the active energy ray-curable resin composition is not limited. The range of 10 mass% or less is preferable with respect to the whole.
- the monofunctional (meth) acrylate is, for example, an alkyl (meth) acrylate having a linear, branched or cyclic alkyl group having 1 to 22 carbon atoms, a phenoxy group and an alkylene glycol group having 1 to 4 carbon atoms.
- Examples of the vinyl compound include vinyl acetate, methyl vinyl ether, ethyl vinyl ether, styrene, p-alkyl styrene introduced with an alkyl group having 1 to 18 carbon atoms, and N-vinyl caprolactam.
- the active energy ray-curable resin composition of the present invention can use various additives as necessary.
- Additives include thermal polymerization inhibitors, antioxidants, antioxidants, UV sensitizers, preservatives, phosphate esters and other flame retardants, surfactants, wetting and dispersing materials, antistatic agents, and coloring agents. , Plasticizers, surface lubricants, leveling agents, softeners, pigments, organic fillers, inorganic fillers and the like.
- the addition amount of these various resins and additives is not particularly limited as long as it does not adversely affect the characteristics exhibited by the active energy ray-curable resin composition according to the present invention, and is not limited to the entire active energy ray-curable resin composition. The range of 5% by mass or less is preferable.
- thermal polymerization inhibitors examples include hydroquinone, p-methoxyphenol, 2,6-di-tert-butyl-p-cresol, 2,2,6,6-tetramethylpiperidine-1-oxyl, 4-hydroxy- Examples include 2,2,6,6-tetramethylpiperidine-1-oxyl, phenothiazine, pyrogallol, ⁇ -naphthol and the like.
- antiaging agent examples include hindered phenol-based compounds such as butylated hydroxytoluene and butylhydroxyanisole, benzotriazole-based compounds, and hindered amine-based compounds.
- Surfactants include, for example, nonylphenol polyethylene oxide adducts, lauric acid polyethylene oxide adducts, alkylene oxide addition nonionic surfactants such as stearic acid polyethylene oxide adducts, sorbitan palmitic acid monoester, sorbitan stearic acid monoester , Polyhydric alcohol type nonionic surfactant such as sorbitan stearic acid triester, acetylene glycol compound type nonionic surfactant, acetylene type polyalkylene glycol compound type nonionic surfactant, perfluoroalkyl polyethylene oxide adduct, Fluorine-containing surfactants such as perfluoroalkyl carboxylates and perfluoroalkylbetaines, polyether-modified silicone oils, (meth) acrylate-modified silica Modified silicone oils such N'oiru, amphoteric polymeric surfactant (BYK chemie Japan Ltd., such as BYK
- the active energy ray-curable resin composition As a method of using the active energy ray-curable resin composition of the present invention, the active energy ray-curable resin composition is formed into a predetermined shape pattern, or immediately after the formation, the active energy ray is irradiated and cured. It is. Moreover, it is preferable to use for the photomolding method discharged by an inkjet system and hardened
- the viscosity of the active energy ray-curable resin composition is lowered, and a high-viscosity resin can be discharged. However, heat denaturation and polymerization are likely to occur. Since discharge at a temperature lower than 80 ° C. is preferable from the viewpoint of thermal stability of the active energy ray-curable resin composition, the viscosity of the active energy ray-curable resin composition is more preferably 80 mPa ⁇ s or less.
- the active energy ray-curable resin composition of the present invention can be used by ejecting fine droplets of the active energy ray-curable resin composition from an ink discharge nozzle so as to draw a predetermined shape pattern by an ink jet method.
- a method of forming a cured thin film by irradiating energy rays is preferable.
- the cross-sectional shape sliced in the direction of stacking the cured thin film of the model material corresponding to the three-dimensional model to be modeled Data and data sliced in the direction in which the cured thin film of the support material for supporting the model material at the time of modeling is created.
- the support material is supported from below by placing the support material around the model material in the lower position. So that support material is provided.
- a thin film of the resin by discharging a photocurable ink for the model material or an active energy ray-curable resin composition as a raw material of the support material from an inkjet nozzle in a desired pattern according to the cross-sectional shape data of the model material and the support material
- the resin thin film layer is cured by radiating curing light from a light source.
- a photocurable ink for a model material and / or an active energy ray curable resin composition for a support material is supplied from an inkjet nozzle on the cured resin thin film layer according to the following cross-sectional shape.
- a cured resin layer corresponding to each cross-sectional shape is laminated to form a target three-dimensional structure and a support.
- the support is usually formed between the flat stage and the three-dimensional structure.
- an active energy ray-curable resin composition for forming a support material is supplied from an inkjet nozzle, and when forming a three-dimensional structure, a photocurable ink for a model material is supplied from an inkjet nozzle.
- the photocurable ink for the model material and the active energy ray-curable resin composition for forming the support material may be discharged from the same inkjet nozzle or may be discharged from separate inkjet nozzles.
- the support material of the present invention can be obtained by curing an active energy ray-curable resin composition by irradiation with active energy rays, and it can be used as a support material for shape support in three-dimensional modeling, thereby supporting a three-dimensional modeled object.
- a rough shaped object supported by the material can be obtained.
- the obtained rough model is immersed in a cleaning solution, and the three-dimensional model can be easily obtained by removing the support material by dissolving, dispersing or swelling the support material in the cleaning solution.
- an internal stress arises from the difference in swelling rate with a three-dimensional molded item (model material), and a support material can peel and remove from a three-dimensional molded item, without applying external force.
- the support material that has been swelled and peeled becomes a swollen gel that has absorbed the cleaning liquid and is separated into two phases from the cleaning liquid, the surface of the three-dimensional structure is not contaminated by the resin dissolved in the cleaning liquid, and the cleaning liquid is volatilized as a finishing process.
- the process can be simplified.
- the swollen support material is phase-separated from the cleaning liquid, it can be easily separated and recovered from the cleaning liquid by filtration, and the effect of reducing the environmental load can be expected.
- the support material of the present invention For cleaning the support material of the present invention, normal water is used, and tap water, pure water, ion exchange water, or the like is used as the water.
- an alkaline aqueous solution if the support material obtained by curing the active energy ray-curable resin composition of the present invention is dissolved, dispersed or swollen, and the three-dimensional model can not be dissolved or swollen, an alkaline aqueous solution, an electrolyte solution, or an organic solvent can be used. It is also possible to use it.
- the alkaline aqueous solution include aqueous solutions of hydroxides of alkali metals and alkaline earth metals such as aqueous solutions of sodium hydroxide, potassium hydroxide, and calcium hydroxide.
- Examples of the electrolyte solution include potassium carbonate, sodium carbonate, ammonia, tetra
- An aqueous solution of an electrolyte such as methylammonium hydroxide may be mentioned.
- Examples of the organic solvent include alcohols, ketones, alkylene glycols, polyalkylene glycols, glycol ethers, glycol esters and the like. These water, alkaline aqueous solution, electrolyte solution, and organic solvent can be used individually by 1 type or in combination of 2 or more types. Water is particularly preferable as the cleaning liquid from the viewpoint of not dissolving the three-dimensional structure, the support material being easily dissolved, dispersed or swollen in the cleaning liquid, and safety.
- the cleaning time for the support material is preferably 24 hours or less, and more preferably 10 hours or less. If the cleaning time is 24 hours or less from the point of production efficiency, it is preferable because the cleaning cycle can be repeated every day, and the efficiency is preferable, and if it is 10 hours or less, the molded article manufactured in the daytime is washed at night, The next day is more preferable because cleaning can be completed and production can be performed more efficiently. A shorter washing time is preferable because production efficiency increases, and is preferably 5 hours or shorter, more preferably 1 hour or shorter.
- the cleaning temperature of the support material can be any temperature from 0 ° C to 100 ° C.
- the resin that forms the three-dimensional structure may be deformed by heat when it is cleaned at a high temperature. Since the higher the temperature, the faster the dissolution, dispersion, or swelling, cleaning at 10 ° C. or higher and 40 ° C. or lower is more preferable.
- the shape of the support material is arbitrary as long as it is provided so as to support the shape of the three-dimensional modeled object, but the support material of the present invention is obtained as a support that can be removed by dissolution, dispersion, or swelling by being immersed in washing water. It is possible to provide a large number of supports in contact with an arbitrary outer surface of the rough shaped object. Providing a large number of supports in this way not only prevents deformation due to its own weight, but also has the effect of shielding light from the end of the modeling, and prevents deterioration of the rough modeled object due to excessive active energy ray irradiation. You can also
- the weight average molecular weight of the obtained urethane acrylamide (E-1) was measured using high performance liquid chromatography (LC-10A manufactured by Shimadzu Corporation), and the column was Shodex GPC KF-806L (exclusion limit molecular weight: 2 ⁇ 10 7 , separation range: 100 to 2 ⁇ 10 7 , theoretical plate number: 10,000 plates / pack, filler material: styrene-divinylbenzene copolymer, filler particle size: 10 ⁇ m), and tetrahydrofuran was used as the eluent. ) And calculated by standard polystyrene molecular weight conversion.
- Example 1 N, N, N-trimethylammoniumpropylacrylamide p-toluenesulfonate (a1-1) 1.0 part by mass, N-acroylmorpholine (B-1) 44.0 parts by mass, number average molecular weight 600 polyethylene glycol (PEG 600, manufactured by Toho Chemical Co., Ltd.) (C-1) 50.0 parts by mass, IRGACURE 184 (1-hydroxycyclohexyl phenyl ketone (manufactured by BASF Japan)) (D-1) 5.0 parts by mass
- a uniform and transparent active energy ray-curable resin composition of Example 1 was obtained.
- Comparative Examples 1 to 4 The active energy ray-curable resin compositions corresponding to Comparative Examples 1 to 4 were obtained by performing the same operations as in Example 1 with the compositions shown in Table 1.
- Comparative Example 2 compares Example 5 described in Patent Document 11 (WO2014-051046)
- Comparative Example 3 compares Example 9 described in Patent Document 8 (Japanese Patent Laid-Open No. 2010-155889).
- Example 4 was based on Example 2-1 described in Patent Document 9 (Japanese Patent Laid-Open No. 2012-111226).
- Example 10 Active energy ray-curable resin composition for water-swellable support material
- Example 10 Sodium acrylate (a2-1) 2.0 parts by mass, N- (2-hydroxyethyl) acrylamide (B-2) 17.4 parts by mass, ion-exchanged water (C-3) 10.0 parts by mass, diethylene glycol mono 70.0 parts by mass of ethyl ether (C-4), IRGACURE 184 (1-hydroxycyclohexyl phenyl ketone (manufactured by BASF Japan Ltd.)) (D-1) 0.1 part by mass, diethylene glycol diacrylate (E-5) 0. 5 parts by mass of each was charged into a container and stirred at 25 ° C. for 1 hour to obtain a uniform and transparent active energy ray-curable resin composition of Example 10.
- Comparative Example 5 The active energy ray-curable resin composition corresponding to Comparative Example 5 was obtained by performing the same operation as in Example 10 with the composition shown in Table 2.
- Comparative Example 5 referred to Example 2-2 described in Patent Document 9 (Japanese Patent Laid-Open No. 2012-111226).
- ionic monomer (a1: cationic monomer, a2: anionic monomer)
- a1-1 N, N, N-trimethylammonium propylacrylamide p-toluenesulfonate a1-2: N, N, N-trimethylammonium propylacrylamide hydrochloride a1-3: N, N, N-trimethylammonium ethyl acrylate Methanesulfonic acid salt a2-1: Sodium acrylate a2-2: Acrylic acid 2-aminoethanol salt
- B Nonionic water-soluble monomer
- B-1 N-Acroylmorpholine
- B-2 N- (2- Hydroxyethyl) acrylamide
- B-3 4-hydroxybutyl acrylate
- B-4 2-hydroxyethyl methacrylate
- B-5 N, N-diethylacrylamide
- C non-polymerized compound
- C-1 polyethylene glycol having a number average molecular weight of 600
- Viscosity measurement Cone plate type viscometer (device name: RE550 type viscometer manufactured by Toki Sangyo Co., Ltd.) was used and obtained in each example and comparative example at 25 ° C. according to JIS K5600-2-3. The viscosity of the active energy ray-curable resin composition was measured.
- Curability A 75 ⁇ m-thick heavy release PET film (polyester film E7001 manufactured by Toyobo Co., Ltd.) (with the treated surface on the front) is adhered to a horizontally placed glass plate, and each example and comparative example is used with a bar coater.
- the obtained active energy ray-curable resin composition was applied to a thickness of 50 ⁇ m and irradiated with ultraviolet rays in the air (apparatus: manufactured by iGraphics, inverter type conveyor device ECS-4011GX, metal halide lamp: manufactured by iGraphics M04) -L41, UV illuminance 300 mW / cm 2, accumulated light quantity 200 mJ / cm 2 in one pass) and measured the integrated amount of light necessary for curing the active energy ray curable resin composition.
- the curing described here is a state in which the surface of the coating film is not sticky.
- a 75 ⁇ m-thick heavy release PET film (polyester film E7001 manufactured by Toyobo Co., Ltd.) is adhered to a horizontally placed glass plate, and a spacer having a thickness of 1 mm and an inside of 50 mm ⁇ 20 mm is installed. After filling the active energy ray-curable resin composition obtained in each Example and Comparative Example inside, a 50 ⁇ m-thick lightly peeled PET film (Toyobo Co., Ltd., polyester film E7002) is stacked thereon.
- Irradiated with ultraviolet rays (device: Eye Graphics, inverter type conveyor device ECS-4011GX, metal halide lamp: Eye Graphics M04-L41, UV illumination 300 mW / cm 2 , integrated light amount 200 mJ / cm 2 in one pass)
- the active energy ray-curable resin composition was cured.
- the integrated light quantity which irradiates an ultraviolet-ray was made into the integrated light quantity obtained by the said sclerosis
- the cured product prepared by removing the peeled PET film on both sides was used as a test piece, and left in a constant temperature and humidity chamber set at 25 ° C. and 50% RH for 168 hours. Evaluation was performed.
- Support material removability water-soluble, water-dispersible support material
- a curable resin composition before photocuring in which a 1 mm thick spacer with a 50 mm ⁇ 40 mm inside is installed on a 1 mm thick polymethylmethacrylate plate (PMMA plate) installed horizontally, and a model material is formed inside the spacer
- PMMA plate polymethylmethacrylate plate
- “LH100white” manufactured by Mimaki Engineering Co., Ltd. and the active energy ray-curable resin compositions obtained in Examples 1 to 9 and Comparative Examples 1 to 4 were filled so as to be in contact with each other, and then irradiated with ultraviolet rays.
- Swellability water swellable support material
- the swelling rate of the support material can be obtained from the following calculation formula.
- the rectangular support material of 50 mm ⁇ 20 mm ⁇ 1 mm obtained from each of Examples 10 to 16 and Comparative Examples 3 and 5 was immersed in a cleaning solution at 25 ° C. for 24 hours.
- the swelling ratio is calculated from the length of the long side of the support material.
- Swell ratio (%) (length of cured product after immersion ⁇ length of cured product before immersion) / length of cured product before immersion ⁇ 100
- ion-exchange water was used as the cleaning liquid.
- the integrated light quantity which irradiates an ultraviolet-ray was made into the integrated light quantity obtained by the said sclerosis
- Partial removal of support material (a state in which a large amount of support material remains on the PMMA surface)
- Support material is not removed
- model material / support material 3 g of active energy ray-curable resin composition obtained in each example and comparative example is placed in a 10 ml graduated cylinder, and “LH100white” is not mixed with 3 g of support material from above. So quietly put. Cover the entire graduated cylinder with aluminum foil so that light does not enter and let stand for 24 hours, then observe the interface state between LH100white and the active energy ray-curable resin composition for the support material, and support the model material and support using the following evaluation method. The separability of the material was evaluated.
- A Good separation (interface can be clearly confirmed)
- ⁇ Separation is sufficiently recognized (the vicinity of the interface is not cloudy and the interface can be confirmed)
- ⁇ Separation is observed but insufficient (the vicinity of the interface is cloudy and the interface is hardly confirmed)
- X Not separable (overall cloudy and mixed)
- Modeling accuracy of the model material / support material boundary The cured material is created in the same way as the support material removability, but it is stabbed vertically in the “LH100white” just before irradiation with the UV irradiation device, and the tip reaches the PMMA surface. After that, the portion where the model material is thinly extended to the support material side is created by horizontally moving to the active energy ray-curable resin composition side obtained in the respective Examples and Comparative Examples as they are.
- the cured product obtained by immediately irradiating with ultraviolet rays in this state was immersed in ion-exchanged water. After removing the support material, it was taken out, and the state of the boundary between the model material and the support material was evaluated by the following evaluation method.
- ⁇ Good modeling accuracy at the boundary (the thinly stretched model material is almost cured and remains)
- ⁇ Modeling accuracy at the boundary is slightly good (the thinly stretched model material remains up to about half the length)
- ⁇ Slightly poor modeling accuracy at the boundary (only the root portion of the cross-sectional area of approximately 1 mm of the thinly stretched model material is cured and remains)
- X Poor modeling accuracy (the portion of the model material stretched thinly disappears and the stretched portion cannot be specified)
- the active energy ray-curable resin compositions of Examples 1 to 9 have a viscosity of 100 mPa ⁇ s or less at 25 ° C., and are excellent in operability. Further, it was curable with an integrated light quantity of 1000 mJ / cm 2 or less even in the air, and showed excellent curability. Moreover, the bleed-out of the nonpolymerizable compound from the support material obtained by curing was hardly observed, and the resin was suitable as a support material. Furthermore, all of the examples showed good dissolution and dispersibility in ion-exchanged water, and the support material could be completely removed at a low temperature in a short time.
- the separation from the model material was good, and high molding accuracy was shown.
- the dissolved and dispersed support material includes ionic properties and has a surface activity, the PMAA plate after removal of the support material and the surface of the model material are also excellent in cleanability.
- Comparative Examples 1 to 3 containing no ionic monomer it takes time to disperse water, and the support material remains on the surface of the PMAA plate or model material after removal, and these residues are solid. It was attached and could not be completely removed by washing with water.
- the support material of the comparative example was poorly separable from the model material, the composition “compared with LH100white” of Comparative Example 1 and Comparative Example 2 before curing occurred at the contact portion, and the molding accuracy was low.
- the integrated light amount required for curing is 2000 mJ / cm 2 or more, the curability is low, and the support material is hardly removed even when immersed in ion-exchanged water, and a process of scraping with a spatula is necessary. Met.
- the curability was good, but the viscosity of the liquid resin was as high as 200 mPa ⁇ s or more at 25 ° C., and a decrease in operability was observed.
- Comparative Example 4 75% by mass or more of polypropylene glycol corresponding to the non-polymerizable compound was used, so that the bleedout was severe and the separation from the model material and the molding accuracy were low.
- the support material of Comparative Example 4 was dispersed in ion-exchanged water in 1 hour, but part of the dispersed support material was seen as yellow oily deposits on the surface of the PMMA plate and the model material, and was completely washed out with water. It was necessary to wipe off with an organic solvent such as alcohol.
- the obtained active energy ray-curable resin compositions of Examples 10 to 16 have a viscosity of 100 mPa ⁇ s or less at 25 ° C., and are excellent in operability. Further, since N-substituted (meth) acrylamide was blended, it was curable with an integrated light quantity of 1000 mJ / cm 2 or less even in the air, and showed excellent curability. Moreover, the bleed-out of the non-reactive diluent from the support material obtained by curing was not confirmed, and the resin was suitable as a support material. Furthermore, in all of the examples, ion-exchanged water showed good cleanability.
- Comparative Example 3 of the present invention corresponding to Example 9 described in Patent Document 8 (Japanese Patent Application Laid-Open No. 2010-155889), the viscosity of the liquid resin was low and the operability was good, but it was necessary for curing. The integrated light quantity was 2000 mJ / cm 2 or more, and the curability was low. In Comparative Example 3 containing no ionic monomer, the swelling of the support material was hardly observed even when immersed in ion exchange water, and the removal of the support material required a process such as scraping with a spatula or the like. there were. In Comparative Example 5 of the present invention corresponding to Example 2-2 described in Patent Document 9 (Japanese Patent Laid-Open No.
- the active energy ray-curable resin composition of the present invention can be suitably used for forming a support material for addition production. Moreover, since the active energy ray-curable resin composition has a low viscosity and excellent operability, it can also be used for addition production by inkjet. Furthermore, when the rough shaped article in a state where the three-dimensional shaped article is supported by the support material of the present invention is immersed in the cleaning liquid, the support material dissolves, disperses or swells in the cleaning liquid and can be easily removed.
- the support material of the present invention exhibits excellent removability and has an advantage that the manufacturing process of the three-dimensional structure can be shortened.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
(1)イオン性単量体(A)1.0質量%以上を含む三次元造型サポート材用活性エネルギー線硬化性樹脂組成物、
(2)イオン性単量体(A)1.0~30.0質量%、非イオン性水溶性単量体(B)2.0~60.0質量%、非重合性化合物(C)25.0~80.0質量%と光重合開始剤(D)0.1~5.0質量%を含有することを特徴とする前記(1)に記載の活性エネルギー線硬化性樹脂組成物、
(3)前記(1)又は(2)に記載の活性エネルギー線硬化性樹脂組成物であって、イオン性単量体(A)1.0~30.0質量%、非イオン性水溶性単量体(B)10.0~60.0質量%、非重合性化合物(C)25.0~60.0質量%と光重合開始剤(D)0.1~5.0質量%を含有し、活性エネルギー線照射によって得られた硬化物が水溶性もしくは水分散性であることを特徴とするサポート材用活性エネルギー線硬化性樹脂組成物、
(4)前記(1)又は(2)に記載の活性エネルギー線硬化性樹脂組成物であって、イオン性単量体(A)1.0~30.0質量%、非イオン性水溶性単量体(B)2.0~50.0質量%、非重合性化合物(C)40.0~80.0質量%、光重合開始剤(D)0.1~5.0質量%と多官能性不飽和単量体(E)0.5~5.0質量%を含有し、活性エネルギー線照射によって得られた硬化物が水膨潤性であることを特徴とするサポート材用活性エネルギー線硬化性樹脂組成物、
(5)多官能性不飽和単量体(E)がポリウレタン(メタ)アクリルアミドであることを特徴とする前記(4)に記載の活性エネルギー線硬化性樹脂組成物、
(6)イオン性単量体(A)は、カチオン性単量体(a1)及び/又はアニオン性単量体(a2)である前記(1)~(5)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物、
(7)イオン性単量体(A)が下記一般式(1)で示される化合物であることを特徴とする前記(1)~(6)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物、
(8)非イオン性水溶性単量体(B)は、N-置換(メタ)アクリルアミドである前記(1)~(7)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物、
(9)非イオン性水溶性単量体(B)は、N-(2-ヒドロキシエチル)アクリルアミド及び/又はN-アクロイルモルホリンであることを特徴とする前記(1)~(8)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物、
(10)非重合性化合物(C)は、水及び/又は非重合性水溶性有機化合物である前記(1)~(9)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物、
(11)非重合性化合物(C)は、アルキレングリコール構造を含有する化合物である前記(1)~(10)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物、
(12)前記(1)~(11)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物を含有する三次元造形用インクジェットインク組成物、
(13)前記(1)~(11)のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物を活性エネルギー線照射により硬化して得られることを特徴とするサポート材
を提供するものである。
本発明に用いられるイオン性単量体(A)は、アンモニウム塩、イミダゾリウム塩、コリン塩、スルホニウム塩、ピラゾリウム塩、オキサゾリウム塩、ピリジニウム塩、ピロリジニウム塩、ホスホニウム等からなる群から選ばれる少なくとも1種のカチオン性基とエチレン性不飽和結合を1分子内に有するカチオン性単量体(a1)、カルボン酸塩、スルホン酸塩及びリン酸塩等からなる群から選ばれる少なくとも1種のアニオン性基とエチレン性不飽和結合を1分子内に有するアニオン性単量体(a2)もしくは、上記の少なくとも1種のカチオン性基と上記の少なくとも1種のアニオン性基を有し、更にエチレン性不飽和結合基を1分子内に有するベタイン型単量体(a3)である。これらのイオン性単量体は1種類単独で使用してもよいし、また2種類以上併用してもよい。
攪拌機、温度計、還流冷却器を備えた300mLセパラフラスコに水酸基価374mgKOH/g、数平均分子量300の末端水酸基を有するポリエチレングリコール44.07g、重合禁止剤としてメチルハイドロキノン0.20gを添加し、そこにポリイソシアネートとしてトリレンジイソシアネート38.31gを添加し、窒素雰囲気中で攪拌しながら、60℃で3時間反応させた。更に、この反応物にN-(2-ヒドロキシエチル)アクリルアミド17.40g、および触媒としてジブチルスズジラウレート0.02gを添加し、60℃で3時間反応して、IR測定で2230cm-1のイソシアネート基の吸収ピークが消失したことを確認した。その後、反応容器を冷却し、重量平均分子量4,800のウレタンアクリルアミド(E-1:PEG300/TDI系ウレタンアクリルアミド)を得た。なお得られたウレタンアクリルアミド(E-1)の重量平均分子量は、高速液体クロマトグラフィー(株式会社島津製作所製のLC-10Aを用いて、カラムはShodex GPC KF-806L(排除限界分子量:2×107、分離範囲:100~2×107、理論段数:10,000段/本、充填剤材質:スチレン-ジビニルベンゼン共重合体、充填剤粒径:10μm)、溶離液としてテトラヒドロフランを使用した。)により測定し、標準ポリスチレン分子量換算により算出した。
攪拌機、温度計、還流冷却器を備えた300mLセパラフラスコに水酸基価187mgKOH/g、数平均分子量600の末端水酸基を有するポリエチレングリコール65.41g、重合禁止剤としてメチルハイドロキノン0.20gを添加し、そこにポリイソシアネートとしてイソホロンジイソシアネート29.03g、および触媒としてジブチルスズジラウレート0.02gを添加し、窒素雰囲気中で攪拌しながら、60℃で3時間反応させた。更に、この反応物にN-(2-ヒドロキシエチル)アクリルアミド5.32g、および触媒としてジブチルスズジラウレート0.02gを添加し、60℃で3時間反応して、IR測定で2230cm-1のイソシアネート基の吸収ピークが消失したことを確認した。その後、反応容器を冷却し、重量平均分子量12,600のウレタンアクリルアミド(E-6:PEG600/IPDI系ウレタンアクリルアミド)を得た。
実施例1
N,N,N-トリメチルアンモニウムプロピルアクリルアミド p-トルエンスルホン酸塩(a1-1)1.0質量部、N-アクロイルモルホリン(B-1)44.0質量部、数平均分子量600のポリエチレングリコール(PEG600、東邦化学工業株式会社社製)(C-1)50.0質量部、IRGACURE184(1-ヒドロキシシクロヘキシルフェニルケトン(BASFジャパン株式会社製))(D-1)5.0質量部をそれぞれ容器に仕込み、25℃で1時間攪拌することにより、均一透明な実施例1の活性エネルギー線硬化性樹脂組成物を得た。
表1に示す組成で、実施例1と同様の操作を行うことにより、実施例2~9に相当する活性エネルギー線硬化性樹脂組成物を得た。
表1に示す組成で、実施例1と同様の操作を行うことにより、比較例1~4に相当する活性エネルギー線硬化性樹脂組成物を得た。ここにおいて、比較例2は特許文献11(WO2014-051046号公報)に記載の実施例5を、比較例3は特許文献8(特開2010-155889号公報)に記載の実施例9を、比較例4は特許文献9(特開2012-111226号公報)に記載の実施例2-1を参考にした。
実施例10
アクリル酸ナトリウム(a2-1)2.0質量部、N-(2-ヒドロキシエチル)アクリルアミド(B-2)17.4質量部、イオン交換水(C-3)10.0質量部、ジエチレングリコールモノエチルエーテル(C-4)70.0質量部、IRGACURE184(1-ヒドロキシシクロヘキシルフェニルケトン(BASFジャパン株式会社製))(D-1)0.1質量部、ジエチレングリコールジアクリレート(E-5)0.5質量部をそれぞれ容器に仕込み、25℃で1時間攪拌することにより、均一透明な実施例10の活性エネルギー線硬化性樹脂組成物を得た。
表2に示す組成で、実施例10と同様の操作を行うことにより、実施例11~16に相当する活性エネルギー線硬化性樹脂組成物を得た。
表2に示す組成で、実施例10と同様の操作を行うことにより、比較例5に相当する活性エネルギー線硬化性樹脂組成物を得た。ここにおいて、比較例5は特許文献9(特開2012-111226号公報)に記載の実施例2-2を参考にした。
A:イオン性単量体(a1:カチオン性単量体、a2:アニオン性単量体)
a1-1:N,N,N-トリメチルアンモニウムプロピルアクリルアミド p-トルエンスルホン酸塩
a1-2:N,N,N-トリメチルアンモニウムプロピルアクリルアミド 塩酸塩
a1-3:N,N,N-トリメチルアンモニウムエチルアクリレート メタンスルホン酸塩
a2-1:アクリル酸ナトリウム
a2-2:アクリル酸2-アミノエタノール塩
B:非イオン性水溶性単量体
B-1:N-アクロイルモルホリン
B-2:N-(2-ヒドロキシエチル)アクリルアミド
B-3:4-ヒドロキシブチルアクリレート
B-4:2-ヒドロキシエチルメタクリレート
B-5:N,N-ジエチルアクリルアミド
C:非重合化合物
C-1:数平均分子量600のポリエチレングリコール(PEG600、東邦化学工業株式会社社製)
C-2:数平均分子量200のポリエチレングリコール(PEG200、東邦化学工業株式会社社製)
C-3:イオン交換水
C-4:ジエチレングリコールモノエチルエーテル
C-5:ジエチレングリコール
C-6:数平均分子量400の1,2-ポリプロピレングリコール(ユニオールD400、日油株式会社社製)
C-7:1,2-ポリプロピレングリコール
C-8:数平均分子量1000の1,2-ポリプロピレングリコール(ユニオールD1000、日油株式会社社製)
D:光重合開始剤
D-1:1-ヒドロキシシクロヘキシルフェニルケトン(IRGACURE184、BASFジャパン株式会社製)
D-2:2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド(IRGACURE-TPO、BASFジャパン株式会社製)
E: 多官能性不飽和単量体
E-1:PEG300/TDI系ウレタンアクリルアミド
E-2:ポリエチレングリコール(分子量200)ジアクリレート
E-3:エトキシレートグリセリントリアクリレート
E-4:ポリエチレングリコール(分子量1000)ジアクリレート
E-5:ジエチレングリコールジアクリレート
E-6:PEG600/IPDI系ウレタンアクリルアミド
F:A、B、E以外のエチレン性不飽和化合物
F-1:n-ブチルアクリレート
G:その他の添加物
G-1:サーフィノール440(エアープロダクツジャパン社製)
G-2:エマノーン1112(ラウリン酸ポリエチレンオキサイド(12E.O.)付加物、花王株式会社製)
G-3:BYK307(ポリエーテル変性ポリジメチルシロキサン、ビックケミージャパン株式会社製]
G-4:ネオペレックスG-15(ドデシルベンゼンスルホン酸ナトリウム、花王株式会社製)
G-5:2,4-ジフェニル-4-メチル-ペンテン
コーンプレート型粘度計(装置名:RE550型粘度計 東機産業株式会社製)を使用し、JIS K5600-2-3に準じて、25℃にて、各実施例と比較例で得られた活性エネルギー線硬化性樹脂組成物の粘度を測定した。
水平に設置したガラス板上に厚さ75μmの重剥離PETフィルム(東洋紡株式会社製、ポリエステルフィルムE7001)(処理面を表に)を密着させ、バーコーターにて各実施例と比較例で得られた活性エネルギー線硬化性樹脂組成物を50μmの厚みに塗布し、空気下にて紫外線を照射(装置:アイグラフィックス製、インバーター式コンベア装置ECS-4011GX、メタルハライドランプ:アイグラフィックス製M04-L41、紫外線照度300mW/cm2、1パスでの積算光量200mJ/cm2)し、活性エネルギー線硬化性樹脂組成物の硬化に必要な積算光量を測定した。またここで記載する硬化とは塗膜の表面がベタ付かなくなる状態とする。
水平に設置したガラス板上に厚さ75μmの重剥離PETフィルム(東洋紡株式会社製、ポリエステルフィルムE7001)を密着させ、厚さ1mm、内部が50mm×20mmのスペーサーを設置し、スペーサーの内側に各実施例と比較例で得られた活性エネルギー線硬化性樹脂組成物を充填した後、更にその上に厚さ50μmの軽剥離PETフィルム(東洋紡株式会社製、ポリエステルフィルムE7002)を重ね、紫外線を照射(装置:アイグラフィックス製、インバーター式コンベア装置ECS-4011GX、メタルハライドランプ:アイグラフィックス製M04-L41、紫外線照度300mW/cm2、1パスでの積算光量200mJ/cm2)し、活性エネルギー線硬化性樹脂組成物を硬化させた。また紫外線を照射する積算光量は上記硬化性評価で得られた積算光量とした。その後、両側の剥離PETフィルムを取り除いて作成した硬化物を試験片として用い、25℃、50%RHに設定した恒温恒湿槽中に168時間静置し、静置前後の試験片表面を目視により評価を行った。
◎:静置前、静置後共にブリードアウトが認められない
○:静置前にブリードアウトが見られないが、静置後にブリードアウトが僅かに認められる
△:静置前にブリードアウトが僅かに認められ、静置後にブリードアウトが若干認められる
×:静置前にブリードアウトが若干認められ、静置後にブリードアウトが激しく認められる
水平に設置した厚さ1mmのポリメチルメタクリレート板(PMMA板)に厚さ1mm、内部が50mm×40mmのスペーサーを設置し、スペーサーの内側にモデル材を形成する光硬化前の硬化性樹脂組成物としてミマキエンジニアリング社製「LH100white」と、実施例1~9と比較例1~4で得られた活性エネルギー線硬化性樹脂組成物を各1gずつ相互に接触するように充填した後、紫外線を照射(装置:アイグラフィックス製、インバーター式コンベア装置ECS-4011GX、メタルハライドランプ:アイグラフィックス製M04-L41、紫外線照度300mW/cm2、1パスでの積算光量200mJ/cm2)し、モデル材およびサポート材を得た。また紫外線を照射する積算光量は上記硬化性評価で得られた積算光量とした。その後、室温(25℃)において、得られたPMMA板上のモデル材およびサポート材を洗浄液としてイオン交換水に浸漬し、サポート材が水に溶解もしくは分散し、モデル材およびPMMA板上からサポート材が除去されるまでの時間と除去後のモデル材およびPMMA板の状態を確認し、下記の評価方法により評価した。
◎:サポート材がすべて除去(モデル材との接触部およびPMMA板表面にザラツキ、べた付き等も無い状態)
○:サポート材はほぼ除去(モデル材との接触部およびPMMA板表面にザラツキ、べた付き等がわずかにあるが、水流で洗浄可能な状態)
△:サポート材は大部分除去(モデル材との接触部およびPMMA表面にザラツキ、べた付き等の残留があり、水流では洗浄不可な状態)
△×:サポート材は一部除去(モデル材との接触部およびPMMA表面にサポート材の残留が多量にある状態)
×:サポート材は除去されていない状態
上記サポート材の除去性において、サポート材が水に溶解もしくは分散した後の洗浄液の状態を確認し、下記の評価方法により評価した。
◎:サポート材が洗浄液に均一に溶解し、透明な状態
○:サポート材が洗浄液に均一分散し、白濁した状態
△:サポート材が洗浄液に不均一に分散し、分散物の沈殿が見られる状態
×:サポート材の一部が沈殿した状態
サポート材の膨潤率は下記の計算式から求められる。耐ブリードアウト性と同様にして各実施例10~16と比較例3、5から得た50mm×20mm×1mmの長方形のサポート材を用いて、25℃の洗浄液に24時間浸漬し、浸漬前後のサポート材の長辺の長さから膨潤率を算出する。
膨潤率(%)=(浸漬後の硬化物の長さ-浸漬前の硬化物の長さ)/浸漬前の硬化物の長さ×100
なお、洗浄液としてはイオン交換水を使用した。
水平に設置した厚さ1mmのPMMA板に厚さ1mm、内部が50mm×20mmのスペーサーを設置し、スペーサーの内側に各実施例10~16と比較例3、5で得られた活性エネルギー線硬化性樹脂組成物を充填した後、紫外線を照射(装置:アイグラフィックス製、インバーター式コンベア装置ECS-4011GX、メタルハライドランプ:アイグラフィックス製M04-L41、紫外線照度300mW/cm2、1パスでの積算光量200mJ/cm2)し、サポート材を得た。また紫外線を照射する積算光量は上記硬化性評価で得られた積算光量とした。その後、得られたPMMA板上のサポート材を洗浄液に浸漬し、PMMA板上からサポート材が自然に剥離するまでの時間と剥離状態を確認し、下記の評価方法により評価した。なお、洗浄液としてはイオン交換水を使用した。
◎:サポート材がすべて除去(PMMA板表面にザラツキ、べた付き等も無い状態)
○:サポート材はほぼ除去(PMMA板表面にザラツキ、べた付き等がわずかにあるが、水流で洗浄可能な状態)
△:サポート材は大部分除去(PMMA表面にザラツキ、べた付き等の残留があり、水流では洗浄不可な状態)
△×:サポート材は一部除去(PMMA表面にサポート材の残留が多量にある状態)
×:サポート材は除去されていない状態
10mlのメスシリンダーに、各実施例と比較例で得られた活性エネルギー線硬化性樹脂組成物を3g入れ、その上から、「LH100white」を3gサポート材に混ざらないように静かに入れた。光が入らないようにメスシリンダー全体をアルミ箔で覆い24時間静置後、LH100whiteとサポート材用活性エネルギー線硬化性樹脂組成物の界面状態を観察して、下記の評価方法によりモデル材とサポート材の分離性を評価した。
◎:分離性良好(界面がはっきり確認できる)
○:分離性が十分認められる(界面付近が白濁せず、界面が確認できる)
△:分離性が認められるが不十分(界面付近が白濁し、界面が殆ど確認できず)
×:分離性がない(全体的に白濁し、混合状態がある)
上記サポート材の除去性と同様に硬化物を作成するが、紫外線照射装置で照射する直前に「LH100white」中に垂直に突き刺し先端をPMMA面まで到達させた後、そのままの各実施例と比較例で得られた活性エネルギー線硬化性樹脂組成物側に水平移動してモデル材がサポート材側に細く伸びる部分を作成する。この状態ですぐに紫外線照射して得られた硬化物をイオン交換水に浸漬した。サポート材除去後に取り出し、下記の評価方法によりモデル材とサポート材の境界部の状態を評価した。
◎:境界部の造形精度良好(細く伸ばしたモデル材がほぼそのまま硬化して残留)
○:境界部の造形精度やや良好(細く伸ばしたモデル材が半分の長さ程度まで残留)
△:境界部の造形精度やや不良(細く伸ばしたモデル材の断面積約1mmの根元部分のみが硬化して残留)
×:造形精度不良(細く伸ばしたモデル材の部分がなくなり、伸張箇所が特定できない。)
Claims (13)
- イオン性単量体(A)1.0質量%以上を含む三次元造型サポート材用活性エネルギー線硬化性樹脂組成物。
- イオン性単量体(A)1.0~30.0質量%、非イオン性水溶性単量体(B)2.0~60.0質量%、非重合性化合物(C)25.0~80.0質量%と光重合開始剤(D)0.1~5.0質量%を含有することを特徴とする請求項1に記載の活性エネルギー線硬化性樹脂組成物。
- 請求項1又は2に記載の活性エネルギー線硬化性樹脂組成物であって、イオン性単量体(A)1.0~30.0質量%、非イオン性水溶性単量体(B)10.0~60.0質量%、非重合性化合物(C)25.0~60.0質量%と光重合開始剤(D)0.1~5.0質量%を含有し、活性エネルギー線照射によって得られた硬化物が水溶性もしくは水分散性であることを特徴とするサポート材用活性エネルギー線硬化性樹脂組成物。
- 請求項1又は2に記載の活性エネルギー線硬化性樹脂組成物であって、イオン性単量体(A)1.0~30.0質量%、非イオン性水溶性単量体(B)2.0~50.0質量%、非重合性化合物(C)40.0~80.0質量%、光重合開始剤(D)0.1~5.0質量%と多官能性不飽和単量体(E)0.5~5.0質量%を含有し、活性エネルギー線照射によって得られた硬化物が水膨潤性であることを特徴とするサポート材用活性エネルギー線硬化性樹脂組成物。
- 多官能性不飽和単量体(E)がポリウレタン(メタ)アクリルアミドであることを特徴とする請求項4に記載の活性エネルギー線硬化性樹脂組成物。
- イオン性単量体(A)は、カチオン性単量体(a1)及び/又はアニオン性単量体(a2)である請求項1~5のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物。
- 非イオン性水溶性単量体(B)は、N-置換(メタ)アクリルアミドである請求項1~7のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物。
- 非イオン性水溶性単量体(B)は、N-(2-ヒドロキシエチル)アクリルアミド及び/又はN-アクロイルモルホリンであることを特徴とする請求項1~8のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物。
- 非重合性化合物(C)は、水及び/又は非重合性水溶性有機化合物である請求項1~9のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物。
- 非重合性化合物(C)は、アルキレングリコール構造を含有する化合物である前記請求項1~10のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物。
- 請求項1~11のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物を含有する三次元造形用インクジェットインク組成物。
- 請求項1~11のいずれか一項に記載の活性エネルギー線硬化性樹脂組成物を活性エネルギー線照射により硬化して得られることを特徴とするサポート材。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016535751A JP6033510B1 (ja) | 2015-01-26 | 2016-01-20 | 三次元造型サポート材用活性エネルギー線硬化性樹脂組成物 |
KR1020177020733A KR102248466B1 (ko) | 2015-01-26 | 2016-01-20 | 3차원 조형 서포트재용 활성 에너지선 경화성 수지 조성물, 3차원 조형용 잉크젯 잉크 조성물 및 서포트재 |
US15/533,537 US10711149B2 (en) | 2015-01-26 | 2016-01-20 | Active energy ray-curable resin composition for three-dimensional model supporting material |
EP16743191.5A EP3251818B1 (en) | 2015-01-26 | 2016-01-20 | Active energy ray-curable resin composition for three-dimensional model supporting material |
CN201680004633.7A CN107107461B (zh) | 2015-01-26 | 2016-01-20 | 三维造型支撑件用活性能量射线固化性树脂组合物 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015012524 | 2015-01-26 | ||
JP2015-012524 | 2015-01-26 | ||
JP2015031031 | 2015-02-19 | ||
JP2015-031031 | 2015-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016121587A1 true WO2016121587A1 (ja) | 2016-08-04 |
Family
ID=56543204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/051515 WO2016121587A1 (ja) | 2015-01-26 | 2016-01-20 | 三次元造型サポート材用活性エネルギー線硬化性樹脂組成物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10711149B2 (ja) |
EP (1) | EP3251818B1 (ja) |
JP (1) | JP6033510B1 (ja) |
KR (1) | KR102248466B1 (ja) |
CN (1) | CN107107461B (ja) |
WO (1) | WO2016121587A1 (ja) |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017031249A (ja) * | 2015-07-29 | 2017-02-09 | 日立マクセル株式会社 | モデル材用樹脂組成物、サポート材用樹脂組成物、光造形品、および、光造形品の製造方法 |
WO2018043582A1 (ja) * | 2016-09-01 | 2018-03-08 | 株式会社日本触媒 | インクジェット3dプリンター用光硬化性サポート材組成物、インクジェット3dプリンター用インク、インクジェット3dプリンター用カートリッジ、サポート材の製造方法ならびに光造形物の製造方法 |
JP2018509501A (ja) * | 2015-03-11 | 2018-04-05 | ストラタシス リミテッド | サポート材配合物およびそれを使用した付加製造法 |
JP2018058974A (ja) * | 2016-10-04 | 2018-04-12 | 共栄社化学株式会社 | 活性線硬化性樹脂組成物 |
WO2018101343A1 (ja) * | 2016-11-29 | 2018-06-07 | マクセルホールディングス株式会社 | サポート材用組成物および光造形用インクセット |
WO2018143303A1 (ja) * | 2017-01-31 | 2018-08-09 | マクセルホールディングス株式会社 | 光造形用インクセット、光造形品、及び、光造形品の製造方法 |
WO2018143305A1 (ja) * | 2017-01-31 | 2018-08-09 | マクセルホールディングス株式会社 | 光造形用インクセット、光造形品、及び、光造形品の製造方法 |
JP2018141091A (ja) * | 2017-02-28 | 2018-09-13 | 凸版印刷株式会社 | 電離放射線重合性組成物、電離放射線硬化フィルム及びこの電離放射線硬化フィルムの製造方法 |
JP2018154092A (ja) * | 2017-03-21 | 2018-10-04 | 株式会社リコー | 立体造形物の製造方法、及び立体造形物のデータの作成方法 |
JP2018172698A (ja) * | 2018-07-31 | 2018-11-08 | マクセルホールディングス株式会社 | サポート材組成物 |
JP2019081297A (ja) * | 2017-10-30 | 2019-05-30 | セイコーエプソン株式会社 | 三次元造形物の製造方法 |
JP2019081296A (ja) * | 2017-10-30 | 2019-05-30 | セイコーエプソン株式会社 | 三次元造形物の製造方法 |
JP2019199448A (ja) * | 2018-05-17 | 2019-11-21 | クラレノリタケデンタル株式会社 | 光硬化性樹脂組成物 |
WO2019230136A1 (ja) * | 2018-05-28 | 2019-12-05 | マクセルホールディングス株式会社 | 光造形用インクセット |
WO2019230132A1 (ja) * | 2018-05-29 | 2019-12-05 | マクセルホールディングス株式会社 | 光造形用組成物セット |
WO2019230125A1 (ja) * | 2018-05-29 | 2019-12-05 | マクセルホールディングス株式会社 | サポート材組成物 |
WO2019230135A1 (ja) * | 2018-05-28 | 2019-12-05 | マクセルホールディングス株式会社 | 光造形用インクセット、及び、光造形品の製造方法 |
KR20190140016A (ko) * | 2017-04-25 | 2019-12-18 | 바스프 에스이 | 3d 프린팅 시스템에서 사용되는 조성물 및 이의 적용 |
WO2020017615A1 (ja) | 2018-07-18 | 2020-01-23 | Kjケミカルズ株式会社 | 三次元造形サポート材用活性エネルギー線硬化性樹脂組成物とインク |
JP2020055140A (ja) * | 2018-09-28 | 2020-04-09 | 株式会社日本触媒 | インクジェット光造形用の光硬化性樹脂組成物セット、それを用いた光造形品ならびにその製造方法 |
JP2020062859A (ja) * | 2018-10-19 | 2020-04-23 | 凸版印刷株式会社 | レンズ形成フィルム |
JP2020132794A (ja) * | 2019-02-22 | 2020-08-31 | 株式会社日本触媒 | Uv硬化性組成物 |
US20200291204A1 (en) * | 2019-03-15 | 2020-09-17 | University Of South Alabama | Build materials for photochemical additive manufacturing applications |
JP2021030625A (ja) * | 2019-08-27 | 2021-03-01 | 株式会社日本触媒 | インクジェット3dプリンター用サポート材の製造方法、サポート材、及び光造形物の製造方法 |
JP2021508621A (ja) * | 2017-12-29 | 2021-03-11 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | 3dフォトポリマー噴射用のサポート基礎構造体を生成するための組成物 |
JP2021509371A (ja) * | 2017-12-31 | 2021-03-25 | ストラタシス リミテッド | 低温での三次元物体の付加製造に使用可能な支持体材料配合物 |
JP2021084944A (ja) * | 2019-11-26 | 2021-06-03 | デンカ株式会社 | 組成物 |
US11111401B2 (en) | 2015-09-15 | 2021-09-07 | Maxell Holdings, Ltd. | Light curing molding ink set, and method for manufacturing light cured article |
JP2021530380A (ja) * | 2018-07-18 | 2021-11-11 | アルケマ フランス | 重合性イオン種をベースとする硬化性組成物を用いて調製された物品 |
WO2022075440A1 (ja) * | 2020-10-08 | 2022-04-14 | キヤノン株式会社 | インクジェット記録方法、インクジェット記録装置、多孔質体の製造方法、及び多孔質体の製造装置 |
US11639400B2 (en) | 2018-08-30 | 2023-05-02 | Ricoh Company, Ltd. | Active energy ray curable liquid, method of manufacturing fabrication object, resin fabrication object, and gel fabrication object |
US11795335B2 (en) | 2015-09-15 | 2023-10-24 | Maxell, Ltd. | Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article |
US11981824B2 (en) | 2018-03-02 | 2024-05-14 | Nippon Shokubai Co., Ltd. | Photocurable composition for support materials for inkjet 3D printers, ink, cartridge, method for producing support material, and method for producing optically shaped article |
JP7504926B2 (ja) | 2019-06-19 | 2024-06-24 | ナノ ディメンション テクノロジーズ,リミテッド | 予備硬化サポートインク組成物 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6083040B2 (ja) * | 2015-02-06 | 2017-02-22 | Kjケミカルズ株式会社 | 立体造形物の製造方法及びそれらを利用した立体造形物 |
ES2718061T3 (es) | 2015-06-17 | 2019-06-27 | Clariant Int Ltd | Polímeros solubles en agua o hinchables en agua como agentes de reducción de la pérdida de agua en pastas crudas de cemento |
CN110267996B (zh) | 2016-12-12 | 2022-07-22 | 科莱恩国际有限公司 | 包含某种水平的生物基碳的聚合物 |
JP7050784B2 (ja) | 2016-12-12 | 2022-04-08 | クラリアント・インターナシヨナル・リミテツド | 化粧料組成物、皮膚科学的組成物または医薬組成物におけるバイオベースのポリマーの使用 |
WO2018108665A1 (en) | 2016-12-15 | 2018-06-21 | Clariant International Ltd | Water-soluble and/or water-swellable hybrid polymer |
EP3554646A1 (en) | 2016-12-15 | 2019-10-23 | Clariant International Ltd | Water-soluble and/or water-swellable hybrid polymer |
WO2018108663A1 (en) | 2016-12-15 | 2018-06-21 | Clariant International Ltd | Water-soluble and/or water-swellable hybrid polymer |
WO2018108664A1 (en) | 2016-12-15 | 2018-06-21 | Clariant International Ltd | Water-soluble and/or water-swellable hybrid polymer |
CN107586375B (zh) * | 2017-10-30 | 2020-04-28 | 广东工业大学 | 一种水溶性支撑材料 |
IL275769B2 (en) * | 2017-12-31 | 2024-07-01 | Stratasys Ltd | Formulations for use as a model material in an additive manufacturing process at low temperatures |
US11826876B2 (en) * | 2018-05-07 | 2023-11-28 | Applied Materials, Inc. | Hydrophilic and zeta potential tunable chemical mechanical polishing pads |
EP3587511B1 (en) * | 2018-06-25 | 2024-04-10 | Canon Production Printing Holding B.V. | Improvement of uv ink adhesion |
WO2020001835A1 (en) * | 2018-06-26 | 2020-01-02 | Arkema France | Curable compositions based on multistage polymers |
US11396608B2 (en) * | 2018-06-26 | 2022-07-26 | Postprocess Technologies, Inc. | Compositions for removing support material from a 3D-printed object and methods of making thereof |
JPWO2020066736A1 (ja) * | 2018-09-25 | 2021-09-24 | Dic株式会社 | 硬化性樹脂組成物、硬化物及び立体造形物 |
EP3864058A4 (en) | 2018-10-08 | 2022-07-20 | Henkel AG & Co. KGaA | PHOTOCURABLE COMPOSITION |
JP7101598B2 (ja) * | 2018-11-26 | 2022-07-15 | 花王株式会社 | 三次元物体前駆体処理剤組成物 |
US20240117081A1 (en) * | 2019-11-14 | 2024-04-11 | Adeka Corporation | Polymerizable composition, vehicle, cured material, and method of manufacturing cured material |
JP2021105143A (ja) * | 2019-12-27 | 2021-07-26 | サカタインクス株式会社 | 水性インクジェット印刷用インク組成物 |
JP7506516B2 (ja) * | 2020-04-24 | 2024-06-26 | サカタインクス株式会社 | 光硬化型水性インクジェット印刷用インク組成物 |
CN118515824A (zh) * | 2024-06-21 | 2024-08-20 | 深圳永昌和科技有限公司 | 一种环保阻燃型光敏树脂材料及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004074331A1 (ja) * | 2003-02-21 | 2004-09-02 | Hymo Corporation | 低分子化水溶性高分子、その製造方法及び使用方法 |
JP2012111226A (ja) * | 2010-11-01 | 2012-06-14 | Keyence Corp | インクジェット光造形法における、光造形品形成用モデル材、光造形品の光造形時の形状支持用サポート材および光造形品の製造方法 |
JP2014113695A (ja) * | 2012-12-06 | 2014-06-26 | Sony Corp | 造形物の製造方法、及び造形物 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5503785A (en) | 1994-06-02 | 1996-04-02 | Stratasys, Inc. | Process of support removal for fused deposition modeling |
JPH0889779A (ja) * | 1994-09-20 | 1996-04-09 | Nitto Chem Ind Co Ltd | カチオン系分散剤およびその製造方法 |
US6228923B1 (en) * | 1997-04-02 | 2001-05-08 | Stratasys, Inc. | Water soluble rapid prototyping support and mold material |
JP2000154497A (ja) * | 1998-11-13 | 2000-06-06 | Nicca Chemical Co Ltd | インクジェット記録用紙用耐水性向上剤及びインクジェット記録用紙 |
US7754807B2 (en) | 1999-04-20 | 2010-07-13 | Stratasys, Inc. | Soluble material and process for three-dimensional modeling |
US7300619B2 (en) * | 2000-03-13 | 2007-11-27 | Objet Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
US6569373B2 (en) | 2000-03-13 | 2003-05-27 | Object Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
JP2004255839A (ja) | 2003-02-28 | 2004-09-16 | Hitachi Printing Solutions Ltd | インクジェット方式の三次元造形装置及びその造形法 |
US20050014005A1 (en) | 2003-07-18 | 2005-01-20 | Laura Kramer | Ink-jettable reactive polymer systems for free-form fabrication of solid three-dimensional objects |
JP2009102527A (ja) * | 2007-10-24 | 2009-05-14 | Fujifilm Corp | 三次元造形用材料及びこれを使用する三次元造形物の製造方法 |
JP2010155889A (ja) | 2008-12-26 | 2010-07-15 | Jsr Corp | 光硬化性液状樹脂組成物およびインクジェット光造形法による支持体の製造方法 |
JP5669373B2 (ja) * | 2009-06-05 | 2015-02-12 | Kjケミカルズ株式会社 | 4級カチオン性帯電防止剤及びそれを含有した帯電防止組成物と成形品 |
JP2011005658A (ja) | 2009-06-23 | 2011-01-13 | Altech Co Ltd | 三次元造型方法 |
JP2011020412A (ja) | 2009-07-17 | 2011-02-03 | Altech Co Ltd | 三次元造型方法 |
JP5717124B2 (ja) * | 2010-08-30 | 2015-05-13 | Kjケミカルズ株式会社 | 活性エネルギー線硬化性樹脂組成物及びコート剤 |
ES2625878T3 (es) * | 2010-10-29 | 2017-07-20 | Bellandtechnology Ag | Copolímero soluble en agua o desintegrable en agua |
JP5685052B2 (ja) | 2010-11-01 | 2015-03-18 | 株式会社キーエンス | 三次元造形装置及び三次元造形方法 |
KR101263327B1 (ko) * | 2011-05-06 | 2013-05-16 | 광주과학기술원 | 레이저 유도 이온 가속용 박막 부재 제조방법 및 이를 이용한 박막 표적 및 그 제조방법 |
JP5994424B2 (ja) * | 2012-06-25 | 2016-09-21 | Dic株式会社 | 紫外線硬化型粘着剤用樹脂組成物及び粘着剤 |
JP6194891B2 (ja) | 2012-09-27 | 2017-09-13 | Jnc株式会社 | 光造形用重合性組成物 |
JP5980088B2 (ja) | 2012-10-23 | 2016-08-31 | 花王株式会社 | 3dプリンタ造形物用現像液組成物、3dプリンタ造形物の現像方法、及び3dプリンタ造形物の製造方法 |
JP6186946B2 (ja) * | 2013-06-28 | 2017-08-30 | 東洋インキScホールディングス株式会社 | 光学的立体造形用樹脂組成物、及び立体造形物 |
JP6083040B2 (ja) * | 2015-02-06 | 2017-02-22 | Kjケミカルズ株式会社 | 立体造形物の製造方法及びそれらを利用した立体造形物 |
-
2016
- 2016-01-20 EP EP16743191.5A patent/EP3251818B1/en active Active
- 2016-01-20 US US15/533,537 patent/US10711149B2/en active Active
- 2016-01-20 WO PCT/JP2016/051515 patent/WO2016121587A1/ja active Application Filing
- 2016-01-20 CN CN201680004633.7A patent/CN107107461B/zh active Active
- 2016-01-20 JP JP2016535751A patent/JP6033510B1/ja active Active
- 2016-01-20 KR KR1020177020733A patent/KR102248466B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004074331A1 (ja) * | 2003-02-21 | 2004-09-02 | Hymo Corporation | 低分子化水溶性高分子、その製造方法及び使用方法 |
JP2012111226A (ja) * | 2010-11-01 | 2012-06-14 | Keyence Corp | インクジェット光造形法における、光造形品形成用モデル材、光造形品の光造形時の形状支持用サポート材および光造形品の製造方法 |
JP2014113695A (ja) * | 2012-12-06 | 2014-06-26 | Sony Corp | 造形物の製造方法、及び造形物 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3251818A4 * |
Cited By (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018509501A (ja) * | 2015-03-11 | 2018-04-05 | ストラタシス リミテッド | サポート材配合物およびそれを使用した付加製造法 |
US11458723B2 (en) | 2015-03-11 | 2022-10-04 | Stratasys Ltd. | Support material formulation and additive manufacturing processes employing same |
JP2017031249A (ja) * | 2015-07-29 | 2017-02-09 | 日立マクセル株式会社 | モデル材用樹脂組成物、サポート材用樹脂組成物、光造形品、および、光造形品の製造方法 |
US11485067B2 (en) | 2015-07-29 | 2022-11-01 | Maxell, Ltd. | Resin composition for modeling material, resin composition for supporting material, photofabrication product, and process for producing photofabrication product |
US11111401B2 (en) | 2015-09-15 | 2021-09-07 | Maxell Holdings, Ltd. | Light curing molding ink set, and method for manufacturing light cured article |
US11795335B2 (en) | 2015-09-15 | 2023-10-24 | Maxell, Ltd. | Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article |
EP3508335A4 (en) * | 2016-09-01 | 2020-04-29 | Nippon Shokubai Co., Ltd. | LIGHT-CURABLE CARRIER MATERIAL COMPOSITION FOR 3D INK-JET PRINTER, INK FOR 3D-INK-JET PRINTER, CARTRIDGE FOR 3D INK-JET PRINTER, METHOD FOR PRODUCING A CARRIER MATERIAL AND METHOD FOR PRODUCING A PRODUCTION |
JP2020128094A (ja) * | 2016-09-01 | 2020-08-27 | 株式会社日本触媒 | インクジェット3dプリンター用光硬化性サポート材組成物、インクジェット3dプリンター用インク、インクジェット3dプリンター用カートリッジ、サポート材の製造方法ならびに光造形物の製造方法 |
JPWO2018043582A1 (ja) * | 2016-09-01 | 2019-06-24 | 株式会社日本触媒 | インクジェット3dプリンター用光硬化性サポート材組成物、インクジェット3dプリンター用インク、インクジェット3dプリンター用カートリッジ、サポート材の製造方法ならびに光造形物の製造方法 |
US12122860B2 (en) | 2016-09-01 | 2024-10-22 | Nippon Shokubai Co., Ltd. | Photocurable support material composition for inkjet 3D printers, ink for inkjet 3D printers, cartridge for inkjet 3D printers, method for producing support material and method for producing optically shaped article |
WO2018043582A1 (ja) * | 2016-09-01 | 2018-03-08 | 株式会社日本触媒 | インクジェット3dプリンター用光硬化性サポート材組成物、インクジェット3dプリンター用インク、インクジェット3dプリンター用カートリッジ、サポート材の製造方法ならびに光造形物の製造方法 |
CN109641395A (zh) * | 2016-09-01 | 2019-04-16 | 株式会社日本触媒 | 喷墨3d打印机用光固化性支撑材料组合物、喷墨3d打印机用油墨、喷墨3d打印机用墨盒、支撑材料的制造方法以及光造型物的制造方法 |
JP2018058974A (ja) * | 2016-10-04 | 2018-04-12 | 共栄社化学株式会社 | 活性線硬化性樹脂組成物 |
US10557032B2 (en) | 2016-11-29 | 2020-02-11 | Maxell Holdings, Ltd. | Composition for support material and ink set for stereolithography |
WO2018101343A1 (ja) * | 2016-11-29 | 2018-06-07 | マクセルホールディングス株式会社 | サポート材用組成物および光造形用インクセット |
CN109715370A (zh) * | 2016-11-29 | 2019-05-03 | 麦克赛尔控股株式会社 | 支撑材用组合物和光造形用油墨组 |
JP2018087291A (ja) * | 2016-11-29 | 2018-06-07 | マクセルホールディングス株式会社 | サポート材組成物 |
JPWO2018143303A1 (ja) * | 2017-01-31 | 2019-03-28 | マクセルホールディングス株式会社 | 光造形用インクセット、光造形品、及び、光造形品の製造方法 |
WO2018143303A1 (ja) * | 2017-01-31 | 2018-08-09 | マクセルホールディングス株式会社 | 光造形用インクセット、光造形品、及び、光造形品の製造方法 |
WO2018143305A1 (ja) * | 2017-01-31 | 2018-08-09 | マクセルホールディングス株式会社 | 光造形用インクセット、光造形品、及び、光造形品の製造方法 |
JP2018141091A (ja) * | 2017-02-28 | 2018-09-13 | 凸版印刷株式会社 | 電離放射線重合性組成物、電離放射線硬化フィルム及びこの電離放射線硬化フィルムの製造方法 |
JP2018154092A (ja) * | 2017-03-21 | 2018-10-04 | 株式会社リコー | 立体造形物の製造方法、及び立体造形物のデータの作成方法 |
KR20190140016A (ko) * | 2017-04-25 | 2019-12-18 | 바스프 에스이 | 3d 프린팅 시스템에서 사용되는 조성물 및 이의 적용 |
JP2020517498A (ja) * | 2017-04-25 | 2020-06-18 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 3d印刷システムで使用される組成物、その適用 |
JP7110233B2 (ja) | 2017-04-25 | 2022-08-01 | ビーエーエスエフ ソシエタス・ヨーロピア | 3d印刷システムで使用される組成物、その適用 |
KR102591163B1 (ko) * | 2017-04-25 | 2023-10-20 | 바스프 에스이 | 3d 프린팅 시스템에서 사용되는 조성물 및 이의 적용 |
JP2019081297A (ja) * | 2017-10-30 | 2019-05-30 | セイコーエプソン株式会社 | 三次元造形物の製造方法 |
JP2019081296A (ja) * | 2017-10-30 | 2019-05-30 | セイコーエプソン株式会社 | 三次元造形物の製造方法 |
JP6993611B2 (ja) | 2017-10-30 | 2022-01-13 | セイコーエプソン株式会社 | 三次元造形物の製造方法 |
JP2021508621A (ja) * | 2017-12-29 | 2021-03-11 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | 3dフォトポリマー噴射用のサポート基礎構造体を生成するための組成物 |
JP7277468B2 (ja) | 2017-12-29 | 2023-05-19 | ビーエーエスエフ ソシエタス・ヨーロピア | 3dフォトポリマー噴射用のサポート基礎構造体を生成するための組成物 |
JP7319280B2 (ja) | 2017-12-31 | 2023-08-01 | ストラタシス リミテッド | 低温での三次元物体の付加製造に使用可能な支持体材料配合物 |
JP2021509371A (ja) * | 2017-12-31 | 2021-03-25 | ストラタシス リミテッド | 低温での三次元物体の付加製造に使用可能な支持体材料配合物 |
US11981824B2 (en) | 2018-03-02 | 2024-05-14 | Nippon Shokubai Co., Ltd. | Photocurable composition for support materials for inkjet 3D printers, ink, cartridge, method for producing support material, and method for producing optically shaped article |
JP7105102B2 (ja) | 2018-05-17 | 2022-07-22 | クラレノリタケデンタル株式会社 | 光硬化性樹脂組成物 |
JP2019199448A (ja) * | 2018-05-17 | 2019-11-21 | クラレノリタケデンタル株式会社 | 光硬化性樹脂組成物 |
WO2019230135A1 (ja) * | 2018-05-28 | 2019-12-05 | マクセルホールディングス株式会社 | 光造形用インクセット、及び、光造形品の製造方法 |
WO2019230136A1 (ja) * | 2018-05-28 | 2019-12-05 | マクセルホールディングス株式会社 | 光造形用インクセット |
WO2019230125A1 (ja) * | 2018-05-29 | 2019-12-05 | マクセルホールディングス株式会社 | サポート材組成物 |
JPWO2019230125A1 (ja) * | 2018-05-29 | 2021-06-10 | マクセルホールディングス株式会社 | サポート材組成物 |
WO2019230132A1 (ja) * | 2018-05-29 | 2019-12-05 | マクセルホールディングス株式会社 | 光造形用組成物セット |
JP7133619B2 (ja) | 2018-05-29 | 2022-09-08 | マクセル株式会社 | サポート材組成物 |
JP2021530380A (ja) * | 2018-07-18 | 2021-11-11 | アルケマ フランス | 重合性イオン種をベースとする硬化性組成物を用いて調製された物品 |
JP7350836B2 (ja) | 2018-07-18 | 2023-09-26 | アルケマ フランス | 重合性イオン種をベースとする硬化性組成物を用いて調製された物品 |
KR20210033937A (ko) | 2018-07-18 | 2021-03-29 | 케이제이 케미칼즈 가부시키가이샤 | 3 차원 조형 서포트재용 활성 에너지선 경화성 수지 조성물과 잉크 |
US11826963B2 (en) | 2018-07-18 | 2023-11-28 | Kj Chemicals Corporation | Active energy ray-curable resin composition and ink for three-dimensional molding support materials |
WO2020017615A1 (ja) | 2018-07-18 | 2020-01-23 | Kjケミカルズ株式会社 | 三次元造形サポート材用活性エネルギー線硬化性樹脂組成物とインク |
US11638950B2 (en) | 2018-07-18 | 2023-05-02 | Arkema France | Articles prepared using curable compositions based on polymerizable ionic species |
JP2018172698A (ja) * | 2018-07-31 | 2018-11-08 | マクセルホールディングス株式会社 | サポート材組成物 |
US11639400B2 (en) | 2018-08-30 | 2023-05-02 | Ricoh Company, Ltd. | Active energy ray curable liquid, method of manufacturing fabrication object, resin fabrication object, and gel fabrication object |
JP7079707B2 (ja) | 2018-09-28 | 2022-06-02 | 株式会社日本触媒 | インクジェット光造形用の光硬化性樹脂組成物セット、それを用いた光造形品ならびにその製造方法 |
JP2020055140A (ja) * | 2018-09-28 | 2020-04-09 | 株式会社日本触媒 | インクジェット光造形用の光硬化性樹脂組成物セット、それを用いた光造形品ならびにその製造方法 |
JP7238333B2 (ja) | 2018-10-19 | 2023-03-14 | 凸版印刷株式会社 | レンズ形成フィルム |
JP2020062859A (ja) * | 2018-10-19 | 2020-04-23 | 凸版印刷株式会社 | レンズ形成フィルム |
JP2020132794A (ja) * | 2019-02-22 | 2020-08-31 | 株式会社日本触媒 | Uv硬化性組成物 |
JP7323300B2 (ja) | 2019-02-22 | 2023-08-08 | 株式会社日本触媒 | Uv硬化性組成物 |
US20200291204A1 (en) * | 2019-03-15 | 2020-09-17 | University Of South Alabama | Build materials for photochemical additive manufacturing applications |
US12077653B2 (en) * | 2019-03-15 | 2024-09-03 | University Of South Alabama | Build materials for photochemical additive manufacturing applications |
JP7504926B2 (ja) | 2019-06-19 | 2024-06-24 | ナノ ディメンション テクノロジーズ,リミテッド | 予備硬化サポートインク組成物 |
JP2021030625A (ja) * | 2019-08-27 | 2021-03-01 | 株式会社日本触媒 | インクジェット3dプリンター用サポート材の製造方法、サポート材、及び光造形物の製造方法 |
JP7323383B2 (ja) | 2019-08-27 | 2023-08-08 | 株式会社日本触媒 | インクジェット3dプリンター用サポート材の製造方法、サポート材、及び光造形物の製造方法 |
JP2021084944A (ja) * | 2019-11-26 | 2021-06-03 | デンカ株式会社 | 組成物 |
JP7359663B2 (ja) | 2019-11-26 | 2023-10-11 | デンカ株式会社 | 組成物 |
WO2022075440A1 (ja) * | 2020-10-08 | 2022-04-14 | キヤノン株式会社 | インクジェット記録方法、インクジェット記録装置、多孔質体の製造方法、及び多孔質体の製造装置 |
Also Published As
Publication number | Publication date |
---|---|
US20180291219A1 (en) | 2018-10-11 |
CN107107461A (zh) | 2017-08-29 |
CN107107461B (zh) | 2022-03-29 |
JPWO2016121587A1 (ja) | 2017-04-27 |
KR20170108962A (ko) | 2017-09-27 |
KR102248466B1 (ko) | 2021-05-04 |
US10711149B2 (en) | 2020-07-14 |
EP3251818A4 (en) | 2018-01-24 |
EP3251818B1 (en) | 2019-12-11 |
EP3251818A1 (en) | 2017-12-06 |
JP6033510B1 (ja) | 2016-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6033510B1 (ja) | 三次元造型サポート材用活性エネルギー線硬化性樹脂組成物 | |
JP6083040B2 (ja) | 立体造形物の製造方法及びそれらを利用した立体造形物 | |
CN105820552B (zh) | 三维造型用支持材料、三维造型用组合物组、三维造型装置及制备三维成型体的方法 | |
JP2017078123A (ja) | サポート材用活性エネルギー線硬化性樹脂組成物 | |
JP7144880B2 (ja) | 活性エネルギー線硬化性樹脂組成物、インク及びインクセット | |
US11491709B2 (en) | Photo-curable resin composition for three-dimensional molding, method for three-dimensional molding using the same, and three-dimensional molded product | |
JP2016113518A (ja) | (メタ)アクリルアミド系ウレタンオリゴマーを有する活性エネルギー線硬化性樹脂組成物 | |
JP6930176B2 (ja) | 立体造形用組成物のセット、立体造形物の製造方法、及び立体造形装置 | |
JP2022099528A (ja) | 活性エネルギー線硬化性樹脂組成物 | |
JP2020108963A (ja) | 三次元造形物の製造方法 | |
JP6962098B2 (ja) | 三次元造形用サポート材、三次元造形用材料セット及び三次元造形装置 | |
JP2020012052A (ja) | 三次元造形サポート材用活性エネルギー線硬化性樹脂組成物 | |
KR102728876B1 (ko) | 3 차원 조형 서포트재용 활성 에너지선 경화성 수지 조성물과 잉크 | |
JP6993611B2 (ja) | 三次元造形物の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2016535751 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16743191 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15533537 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20177020733 Country of ref document: KR Kind code of ref document: A |
|
REEP | Request for entry into the european phase |
Ref document number: 2016743191 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |