WO2010100997A1 - Electronic component and electronic device - Google Patents

Electronic component and electronic device Download PDF

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Publication number
WO2010100997A1
WO2010100997A1 PCT/JP2010/051677 JP2010051677W WO2010100997A1 WO 2010100997 A1 WO2010100997 A1 WO 2010100997A1 JP 2010051677 W JP2010051677 W JP 2010051677W WO 2010100997 A1 WO2010100997 A1 WO 2010100997A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
external electrode
conductors
metal case
coil
Prior art date
Application number
PCT/JP2010/051677
Other languages
French (fr)
Japanese (ja)
Inventor
隆浩 森
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2011502698A priority Critical patent/JP5516572B2/en
Priority to CN201080010628.XA priority patent/CN102342021B/en
Publication of WO2010100997A1 publication Critical patent/WO2010100997A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1708—Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Definitions

  • the present invention relates to an electronic component and an electronic device, and more particularly to an electronic component and an electronic device including a coil and a capacitor.
  • FIG. 7A is a cross-sectional structure diagram of the LC resonant component 110 described in Patent Document 1.
  • FIG. 7B is a diagram in which the LC resonant component 110 is mounted on the circuit board 120.
  • the LC resonant component 110 includes a multilayer body 112, external electrodes 114a and 114b, internal conductors 116a to 116e, and via hole conductors B1 to B5.
  • the stacked body 112 is configured by stacking a plurality of rectangular insulating layers.
  • the external electrodes 114a and 114b are provided on the side surface of the stacked body 112 and face each other.
  • the external electrodes 114a and 114b are connected to the ground.
  • the inner conductors 116a to 116c are provided in parallel to each other and connect the outer electrodes 114a and 114b.
  • the inner conductors 116d and 116e are provided below the inner conductors 116a to 116c in the stacking direction, and constitute a capacitor by facing each other.
  • the internal conductor 116d is connected to two external electrodes (not shown) through which signals are input and output.
  • the inner conductor 116e is connected to the outer electrodes 114a and 114b.
  • the via-hole conductors B1, B2, B4, and B5 extend in the stacking direction, connect the internal conductors 116a to 116c, and function as coils.
  • the via-hole conductor B3 extends in the stacking direction, connects the internal conductors 116a to 116d, and functions as a coil.
  • a resonant circuit is formed in which a coil and a capacitor are connected in parallel between two external electrodes (not shown) for inputting and outputting signals.
  • the LC resonant component 110 is used by being mounted on a circuit board 120 as shown in FIG. At this time, the LC resonant component 110 is covered with the metal case 122. Thereby, it is suppressed that the noise from the outside penetrates into the LC resonance component 110 and other mounting components.
  • the LC resonant component 110 may be disposed in the vicinity of the metal case 122.
  • the external electrode 114 b of the LC resonant component 110 faces the metal case 122.
  • the external electrode 114b and the metal case 122 are magnetically coupled and capacitively coupled.
  • the external electrode 114b is connected to the via-hole conductors B1 to B5 via internal conductors 116a to 116c. A signal flows through the via-hole conductors B1 to B5.
  • the noise absorbed by the metal case 122 enters the signals flowing through the via-hole conductors B1 to B5 via the external electrode 114b and the internal conductors 116a to 116c. Resulting in.
  • the internal conductor 116a to which the via-hole conductors B1 to B5 through which signals flow is connected is provided in the vicinity of the upper surface of the multilayer body 112. Therefore, the inner conductor 116a and the metal case 122 are magnetically coupled and capacitively coupled. As a result, the noise absorbed by the metal case 122 enters the signals flowing through the via-hole conductors B1 to B5 via the internal conductor 116a.
  • an object of the present invention is to provide an electronic component and an electronic device that can suppress noise from entering through a metal case provided on a substrate.
  • the electronic component according to the first aspect of the present invention includes a laminate in which a plurality of insulator layers are laminated, a plurality of internal conductors constituting coils and capacitors built in the laminate, A first ground external electrode provided on a side surface of the multilayer body; and a second ground external electrode provided on a side surface of the multilayer body and facing the first ground external electrode; The internal conductor constituting the coil is connected to the first ground external electrode and is not connected to the second ground external electrode. To do.
  • an electronic device includes a substrate, the electronic component according to the first embodiment mounted on the substrate, and the second ground external electrode, And a metal case covering the electronic component.
  • an electronic component includes a laminated body in which a plurality of insulator layers are laminated, and a plurality of internal conductors constituting a coil and a capacitor built in the laminated body.
  • the inner conductor constituting the coil is provided on the upper side in the stacking direction than the inner conductor constituting the capacitor, and the inner conductor provided on the uppermost side in the stacking direction.
  • the dielectric layer provided on the upper side in the stacking direction is lower in relative dielectric constant than the insulator layer provided on the lower side in the stacking direction than the inner conductor provided on the uppermost side in the stacking direction. It is characterized by having a rate.
  • An electronic device includes a substrate, an electronic component according to the third embodiment mounted on the substrate, and a metal case covering the electronic component. It is characterized by this.
  • noise can be prevented from entering through the metal case provided on the substrate.
  • FIG. 1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 1st Embodiment.
  • FIG. 3 is a perspective view of an electronic device in which the electronic component of FIG. 2 is mounted on a circuit board.
  • FIG. 3 is an equivalent circuit diagram of the electronic component of FIG. 2.
  • FIG. 6 is a perspective view of an electronic device in which the electronic component of FIG. 5 is mounted on a circuit board.
  • FIG. 7A is a cross-sectional structure diagram of the LC resonant component described in Patent Document 1.
  • FIG. FIG. 7B is a diagram in which the LC resonant component is mounted on a substrate.
  • FIG. 1 is an external perspective view of electronic components 10a and 10b according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the multilayer body 12a of the electronic component 10a.
  • FIG. 3 is a perspective view of an electronic device 50 a in which the electronic component 10 a is mounted on the circuit board 30.
  • FIG. 4 is an equivalent circuit diagram of the electronic component 10a.
  • the stacking direction of the electronic component 10a is defined as the z-axis direction
  • the direction along the long side of the electronic component 10a is defined as the x-axis direction
  • the direction along the short side of the electronic component 10a is defined as the y-axis direction.
  • the origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10a.
  • the electronic component 10a includes a laminated body 12a, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 18 (18a to 18h), and via-hole conductors b (b1, b2). I have.
  • the laminated body 12a is formed by laminating a plurality of rectangular dielectric layers 16 (16a to 16g) in this order, and has a rectangular parallelepiped shape.
  • the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12a, and is used as a signal input terminal.
  • the external electrode 14b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12a, and is used as a signal output terminal.
  • the external electrode 14c is provided on the side surface on the negative side in the y-axis direction of the multilayer body 12a and is used as a ground terminal.
  • the external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12a and is used as a ground terminal.
  • the external electrode 14d is opposed to the external electrode 14c.
  • the recognition mark 15 is provided on the upper surface on the positive side in the z-axis direction of the laminated body 12a, and is used for identifying the direction of the electronic component 10a during mounting.
  • the dielectric layer 16 is a rectangular insulating layer made of, for example, a Ba—Al—Si based dielectric ceramic.
  • the inner conductor 18 is made of a conductive material mainly composed of Cu, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12a. More specifically, each of the inner conductors 18a and 18b extends from the negative side in the y-axis direction toward the positive direction in the y-axis direction on the main surface of the dielectric layer 16b. Part of the coils L1 and L2 is configured. However, the inner conductors 18a and 18b are not drawn out to the side on the positive direction side in the y-axis direction. Therefore, the internal conductors 18a and 18b are connected to the external electrode 14c but are not connected to the external electrode 14d.
  • the inner conductors 18c and 18d are provided on the main surface of the dielectric layer 16c so as to overlap with the inner conductors 18a and 18b and the dielectric layer 16b when viewed in plan from the z-axis direction.
  • the internal conductor 18c is connected to the external electrode 14a by being drawn out to the side on the negative side in the x-axis direction in the dielectric layer 16c.
  • the internal conductor 18d is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16c.
  • the via-hole conductor b1 penetrates the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18a and the internal conductor 18c.
  • the via-hole conductor b2 penetrates the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18b and the internal conductor 18d.
  • Via-hole conductors b1 and b2 constitute part of coils L1 and L2, respectively.
  • the inner conductor 18a and the via hole conductor b1 constitute the coil L1 in FIG.
  • the internal conductor 18b and the via-hole conductor b2 constitute the coil L2 in FIG.
  • the via-hole conductor b is made of, for example, a conductive material whose main component is copper.
  • the inner conductor 18e is provided on the dielectric layer 16d so as to face the inner conductors 18c and 18d with the dielectric layer 16c interposed therebetween when viewed in plan from the z-axis direction.
  • the inner conductors 18c and 18e constitute the capacitor C1 in FIG.
  • the internal conductors 18d and 18e also constitute the capacitor C1 in FIG.
  • the inner conductor 18 e is provided at the center of the dielectric layer 16 d and is not connected to any of the outer electrodes 14.
  • the inner conductors 18f and 18g are provided on the main surface of the dielectric layer 16e so as to overlap with the inner conductor 18e and the dielectric layer 16d when viewed in plan from the z-axis direction.
  • the internal conductors 18e and 18f constitute the capacitor C1 of FIG.
  • the inner conductors 18e and 18g also constitute the capacitor C1 in FIG.
  • the internal conductor 18f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 16e.
  • the internal conductor 18g is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16e.
  • the inner conductor 18h is provided on the dielectric layer 16f so as to face the inner conductors 18f and 18g with the dielectric layer 16e interposed therebetween when viewed in plan from the z-axis direction.
  • the inner conductors 18f and 18h constitute the capacitor C2 in FIG. 4
  • the inner conductors 18g and 18h constitute the capacitor C3 in FIG.
  • the inner conductor 18h is connected to the outer electrodes 14c and 14d by being drawn out to the side on the positive side and the side on the negative direction in the dielectric layer 16f. Has been.
  • the internal conductors 18a and 18b and the via-hole conductors b1 and b2 constituting the coils L1 and L2 are the internal conductors constituting the capacitors C1 to C3. It is provided on the positive direction side in the z-axis direction from 18c to 18h.
  • the electronic component 10a is mounted on the circuit board 30 as shown in FIG.
  • a metal case 32 is provided so as to cover the main surface of the circuit board 30.
  • the metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10a and the like.
  • the side surface portion 32a is attached perpendicular to the circuit board 30 and faces the external electrode 14d.
  • the upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30.
  • the electronic component 10 a is covered with the metal case 32.
  • the metal case 32 does not face the external electrode 14c.
  • the internal conductors 18a and 18b constituting the coils L1 and L2 are not connected to the external electrode 14d facing the metal case 32. Therefore, the noise absorbed by the metal case 32 does not enter the laminated body 12a from the internal electrodes 18a and 18b from the external electrode 14b. Therefore, in the electronic component 10a and the electronic device 50a, it is possible to prevent noise from entering the electronic component 10a through the metal case 32.
  • the inner conductors 18a and 18b constituting the coils L1 and L2 are provided above the inner conductors 18c to 18h constituting the capacitors C1 to C3 in the z-axis direction. Furthermore, in the electronic component 10a, the inner conductors 18a and 18b are provided on the uppermost side in the z-axis direction. Therefore, the inner conductors 18a and 18b are easily affected by noise from the metal case 32 because the distance between the inner conductors 18a and 18b is shorter than the inner conductors 18c to 18h. Therefore, by not connecting the internal conductors 18a and 18b to the external electrode 14d, it is possible to effectively suppress noise from entering the internal conductors 18a and 18b from the metal case 32.
  • the internal conductors 18a and 18b are provided only between the via-hole conductors b1 and b2 and the external electrode 14c, respectively. Therefore, the internal conductors 18a and 18b are not provided on the external electrode 14d side than the via-hole conductors b1 and b2. Therefore, the size of the area where the inner conductors 18a, 18b and the metal case 32 face each other is reduced. As a result, magnetic coupling and capacitive coupling between the inner conductors 18a and 18b and the metal case 32 are reduced. Therefore, it is possible to prevent noise from entering the inner conductors 18a and 18b from the metal case 32.
  • a plurality (two) of the internal conductors 18a and 18b constituting the coils L1 and L2 are provided on the same dielectric layer 16b. Furthermore, a plurality (two) of via-hole conductors b1 and b2 are provided so as to be connected to the internal conductors 18a and 18b, respectively. Thereby, the coil L1 and the coil L2 come close to each other. As a result, the magnetic coupling between the coil L1 and the coil L2 can be strengthened.
  • FIG. 5 is an exploded perspective view of the multilayer body 12b of the electronic component 10b.
  • FIG. 6 is a perspective view of an electronic device 50 b in which the electronic component 10 b is mounted on the circuit board 30.
  • the stacking direction of the electronic component 10b is defined as the z-axis direction
  • the direction along the long side of the electronic component 10b is defined as the x-axis direction
  • the direction along the short side of the electronic component 10b is defined as the y-axis direction.
  • the origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10b. 1 and 4 are used for an external perspective view and an equivalent circuit diagram of the electronic component 10b.
  • the electronic component 10b includes a laminated body 12b, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 68 (68a to 68h), and via-hole conductors b (b11, b12). I have.
  • the multilayer body 12b is formed by laminating a plurality of rectangular dielectric layers 65 (65a) and 66 (66b to 66g) in this order, and forms a rectangular parallelepiped shape.
  • the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12b, and is used as a signal input terminal.
  • the external electrode 14 b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12 b and is used as a signal output terminal.
  • the external electrode 14c is provided on the side surface on the negative direction side in the y-axis direction of the multilayer body 12b and is used as a ground terminal.
  • the external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12b and is used as a ground terminal.
  • the external electrode 14c is opposed to the external electrode 14d.
  • the recognition mark 15 is provided on the upper surface of the laminated body 12b on the positive side in the z-axis direction, and is used for identifying the direction of the electronic component 10b during mounting.
  • the dielectric layers 65 and 66 are rectangular insulating layers made of, for example, a Ba—Al—Si based dielectric ceramic.
  • the inner conductor 68 is made of a conductive material containing Cu as a main component, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12b. More specifically, the inner conductors 68a and 68b extend from the negative side in the y-axis direction to the positive side in the y-axis direction on the main surface of the dielectric layer 66b, and the coil L1. , L2 is configured. Thereby, the inner conductors 68a and 68b are connected to the outer electrodes 14c and 14d.
  • the inner conductors 68c and 68d are provided on the main surface of the dielectric layer 66c so as to overlap with the inner conductors 68a and 68b and the dielectric layer 66b when viewed in plan from the z-axis direction.
  • the internal conductor 68c is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66c.
  • the internal conductor 68d is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66c.
  • the via-hole conductor b11 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68a and the internal conductor 68c.
  • the via-hole conductor b12 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68b and the internal conductor 68d.
  • the via-hole conductors b11 and b12 constitute part of the coils L1 and L2, respectively.
  • the internal conductor 68a and the via hole conductor b11 constitute the coil L1 in FIG.
  • the inner conductor 68b and the via-hole conductor b12 constitute the coil L2 in FIG.
  • the via-hole conductor b is made of, for example, a conductive material whose main component is copper.
  • the inner conductor 68e is provided on the dielectric layer 66d so as to face the inner conductors 68c and 68d with the dielectric layer 66c interposed therebetween when viewed in plan from the z-axis direction.
  • the internal conductors 68c and 68e constitute the capacitor C1 of FIG.
  • the internal conductors 68d and 68e also constitute the capacitor C1 in FIG.
  • the inner conductor 68 e is provided in the center of the dielectric layer 66 d and is not connected to any of the outer electrodes 14.
  • the inner conductors 68f and 68g are provided on the main surface of the dielectric layer 66e so as to overlap with the inner conductor 68e and the dielectric layer 66d when viewed in plan from the z-axis direction.
  • the inner conductors 68e and 68f constitute the capacitor C1 in FIG.
  • the internal conductors 68e and 68g also constitute the capacitor C1 in FIG.
  • the internal conductor 68f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66e.
  • the internal conductor 68g is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66e.
  • the inner conductor 68h is provided on the dielectric layer 66f so as to face the inner conductors 68f and 68g with the dielectric layer 66e interposed therebetween when viewed in plan from the z-axis direction.
  • the inner conductors 68f and 68h constitute the capacitor C2 of FIG. 4
  • the inner conductors 68g and 68h constitute the capacitor C3 of FIG.
  • the inner conductor 68h is connected to the outer electrodes 14c and 14d by being drawn out to the positive side and the negative side in the dielectric layer 66f. Has been.
  • the internal conductors 68a and 68b and the via-hole conductors b11 and b12 constituting the coils L1 and L2 constitute the capacitors C1 to C3. It is provided on the positive side in the z-axis direction from the internal conductors 68c to 68h.
  • the dielectric layer 65a is provided on the positive side in the z-axis direction relative to the inner conductors 68a and 68b provided on the most positive direction side in the z-axis direction, and is located on the positive side in the z-axis direction.
  • the dielectric constant is lower than that of the dielectric layer 66 provided on the negative side in the axial direction.
  • the electronic component 10b is mounted on the circuit board 30 as shown in FIG.
  • a metal case 32 is provided so as to cover the main surface of the circuit board 30.
  • the metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10b and the like.
  • the side surface portion 32a is attached perpendicularly to the circuit board 30 and faces the external electrode 14d.
  • the upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30. Thereby, the electronic component 10 b is covered with the metal case 32.
  • the metal case 32 does not face the external electrode 14c.
  • the dielectric layer 65a provided on the positive side in the z-axis direction relative to the internal conductors 68a and 68b provided on the most positive direction side in the z-axis direction includes the internal conductor 68a, It has a relative dielectric constant lower than that of the dielectric layer 66 provided on the negative side in the z-axis direction from 68b.
  • stray capacitance generated between the inner conductors 68a and 68b and the upper surface portion 32b of the metal case 32 is reduced.
  • the electronic component 10b it is possible to prevent noise from entering the electronic component 10b via the metal case 32.
  • the inner conductors 68a and 68b constitute coils L1 and L2. Therefore, a signal flows through the internal conductors 68a and 68b. Therefore, by reducing the stray capacitance between the inner conductors 68a and 68b and the metal case 32, it is possible to more effectively suppress noise from entering the signal in the electronic component 10b.
  • the manufacturing method of the electronic component 10a is demonstrated, referring FIG.1 and FIG.2.
  • the manufacturing method of the electronic component 10b is basically the same as the manufacturing method of the electronic component 10a, and thus the description thereof is omitted.
  • a ceramic green sheet to be the dielectric layer 16 is prepared. Specifically, each material obtained by weighing barium oxide (BaO), aluminum oxide (Al 2 O 3 ), and silicon oxide (SiO 2 ) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a dielectric ceramic powder.
  • barium oxide (BaO), aluminum oxide (Al 2 O 3 ), and silicon oxide (SiO 2 ) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a dielectric ceramic powder.
  • This binder ceramic powder is mixed with a binder, a plasticizer, a wetting material, and a dispersing agent, mixed with a ball mill, and then defoamed under reduced pressure.
  • the obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the dielectric layer 16.
  • via hole conductors b1 and b2 are formed in each of the ceramic green sheets to be the dielectric layer 16b. Specifically, a via hole is formed by irradiating a ceramic green sheet to be the dielectric layer 16b with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.
  • a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.
  • a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the ceramic green sheets to be the dielectric layers 16b to 16f by a method such as a screen printing method or a photolithography method.
  • the inner conductors 18a to 18h are formed.
  • the step of forming the internal conductors 18a to 18h and the step of filling the via hole with the conductive paste may be performed in the same step.
  • each ceramic green sheet is laminated. Specifically, a ceramic green sheet to be the dielectric layer 16g is disposed. The carrier film of the ceramic green sheet to be the dielectric layer 16g is peeled off, and the ceramic green sheet to be the dielectric layer 16f is disposed on the ceramic green sheet to be the dielectric layer 16g. Thereafter, the ceramic green sheet to be the dielectric layer 16f is pressure-bonded to the ceramic green sheet to be the dielectric layer 16g.
  • the discharge method of the carrier film is discharge by suction and grabbing discharge by a chuck. Thereafter, the ceramic green sheets to be the dielectric layers 16e, 16d, 16c, 16b, and 16a are similarly laminated and pressure-bonded in this order. Thereby, a mother laminated body is formed. The mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.
  • the mother laminated body is cut into a laminated body 12a having a predetermined size with a cutting blade. Thereby, the unsintered laminated body 12a is obtained.
  • This unfired laminate 12a is subjected to binder removal processing and firing.
  • the fired laminated body 12a is obtained through the above steps.
  • the laminated body 12a is barrel-processed and chamfered. Thereafter, a copper electrode to be the external electrodes 14a to 14d is formed on the surface of the laminated body 12a by applying and baking an electrode paste whose main component is copper by a method such as dipping.
  • the external electrodes 14a to 14d are formed by performing Ni plating / Sn plating on the surface of the copper electrode. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.
  • the electronic component and the electronic device according to the present invention are not limited to the electronic components 10a and 10b and the electronic devices 50a and 50b shown in the above-described embodiment, and can be changed within the scope of the gist thereof.
  • a resin may be used as the dielectric layer.
  • the present invention is useful for electronic parts and electronic devices, and is particularly excellent in that noise can be prevented from entering through a metal case provided on a substrate.
  • Capacitors L1, L2 Coils b1, b2, b11, b12 Via hole conductors 10a, 10b Electronic parts 12a, 12b Laminated bodies 14a-14d External electrodes 16a-16g, 65a, 66b-66g Dielectric layers 18a-18h, 68a- 68h Inner conductor 30 Circuit board 32 Metal case 32a Side surface portion 32b Upper surface portion 50a, 50b Electronic device

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Abstract

An electronic component and an electronic device wherein intrusion of noise through a metal case provided on a substrate can be minimized. A stack (12a) is formed from a plurality of dielectric layers (16). Internal conductors (18) form coils (L1, L2) and capacitors (C1 to C3) built inside the stack (12a). Two outer electrodes are provided on the opposing side surfaces of the stack (12) and are used as ground terminals. The internal conductors (18a, 18b) forming the coils (L1, L2) are connected to one of the outer electrodes, and not connected to the other of the outer electrodes.

Description

電子部品及び電子装置Electronic component and electronic device
　本発明は、電子部品及び電子装置に関し、より特定的には、コイル及びコンデンサを含む電子部品及び電子装置に関する。 The present invention relates to an electronic component and an electronic device, and more particularly to an electronic component and an electronic device including a coil and a capacitor.
　従来の電子部品として、例えば、特許文献１に記載のＬＣ共振部品が知られている。図７（ａ）は、特許文献１に記載のＬＣ共振部品１１０の断面構造図である。図７（ｂ）は、ＬＣ共振部品１１０が回路基板１２０上に実装された図である。 As a conventional electronic component, for example, an LC resonant component described in Patent Document 1 is known. FIG. 7A is a cross-sectional structure diagram of the LC resonant component 110 described in Patent Document 1. FIG. FIG. 7B is a diagram in which the LC resonant component 110 is mounted on the circuit board 120.
　ＬＣ共振部品１１０は、図７（ａ）に示すように、積層体１１２、外部電極１１４ａ，１１４ｂ、内部導体１１６ａ～１１６ｅ及びビアホール導体Ｂ１～Ｂ５により構成されている。積層体１１２は、長方形状の絶縁体層が複数層積層されることにより構成されている。外部電極１１４ａ，１１４ｂは、積層体１１２の側面に設けられ、互いに対向している。該外部電極１１４ａ，１１４ｂは、グランドに接続されている。 As shown in FIG. 7A, the LC resonant component 110 includes a multilayer body 112, external electrodes 114a and 114b, internal conductors 116a to 116e, and via hole conductors B1 to B5. The stacked body 112 is configured by stacking a plurality of rectangular insulating layers. The external electrodes 114a and 114b are provided on the side surface of the stacked body 112 and face each other. The external electrodes 114a and 114b are connected to the ground.
　内部導体１１６ａ～１１６ｃは、互いに平行に設けられていると共に、外部電極１１４ａ，１１４ｂを接続している。内部導体１１６ｄ，１１６ｅは、内部導体１１６ａ～１１６ｃよりも積層方向の下側に設けられており、互いに対向することによりコンデンサを構成している。内部導体１１６ｄは、信号が入出力する２つの外部電極（不図示）に接続されている。また、内部導体１１６ｅは、外部電極１１４ａ，１１４ｂに接続されている。 The inner conductors 116a to 116c are provided in parallel to each other and connect the outer electrodes 114a and 114b. The inner conductors 116d and 116e are provided below the inner conductors 116a to 116c in the stacking direction, and constitute a capacitor by facing each other. The internal conductor 116d is connected to two external electrodes (not shown) through which signals are input and output. The inner conductor 116e is connected to the outer electrodes 114a and 114b.
　ビアホール導体Ｂ１，Ｂ２，Ｂ４，Ｂ５は、積層方向に延在しており、内部導体１１６ａ～１１６ｃを接続していると共に、コイルとして機能している。また、ビアホール導体Ｂ３は、積層方向に延在しており、内部導体１１６ａ～１１６ｄを接続していると共に、コイルとして機能している。以上のようなＬＣ共振部品１１０によれば、信号が入出力する２つの外部電極（不図示）間にコイルとコンデンサとが並列に接続された共振回路が形成されている。 The via-hole conductors B1, B2, B4, and B5 extend in the stacking direction, connect the internal conductors 116a to 116c, and function as coils. The via-hole conductor B3 extends in the stacking direction, connects the internal conductors 116a to 116d, and functions as a coil. According to the LC resonant component 110 as described above, a resonant circuit is formed in which a coil and a capacitor are connected in parallel between two external electrodes (not shown) for inputting and outputting signals.
　前記ＬＣ共振部品１１０は、図７（ｂ）に示すように、回路基板１２０上に実装されて用いられる。この際、ＬＣ共振部品１１０は、金属ケース１２２によって覆われる。これにより、ＬＣ共振部品１１０やその他の実装部品に、外部からのノイズが侵入することが抑制されている。 The LC resonant component 110 is used by being mounted on a circuit board 120 as shown in FIG. At this time, the LC resonant component 110 is covered with the metal case 122. Thereby, it is suppressed that the noise from the outside penetrates into the LC resonance component 110 and other mounting components.
　しかしながら、ＬＣ共振部品１１０では、依然として、ノイズが侵入するおそれがある。より詳細には、図７（ｂ）に示すように、ＬＣ共振部品１１０は、金属ケース１２２近傍に配置される場合がある。この場合には、ＬＣ共振部品１１０の外部電極１１４ｂは、金属ケース１２２に対向してしまう。その結果、外部電極１１４ｂと金属ケース１２２とは、磁気結合及び容量結合してしまう。外部電極１１４ｂは、図７（ａ）に示すように、ビアホール導体Ｂ１～Ｂ５に対して、内部導体１１６ａ～１１６ｃを介して接続されている。そして、ビアホール導体Ｂ１～Ｂ５には、信号が流れている。よって、外部電極１１４ｂと金属ケース１２２とが磁気結合及び容量結合すると、金属ケース１２２が吸収したノイズが、外部電極１１４ｂ及び内部導体１１６ａ～１１６ｃを介して、ビアホール導体Ｂ１～Ｂ５を流れる信号に侵入してしまう。 However, in the LC resonant component 110, noise may still enter. More specifically, as shown in FIG. 7B, the LC resonant component 110 may be disposed in the vicinity of the metal case 122. In this case, the external electrode 114 b of the LC resonant component 110 faces the metal case 122. As a result, the external electrode 114b and the metal case 122 are magnetically coupled and capacitively coupled. As shown in FIG. 7A, the external electrode 114b is connected to the via-hole conductors B1 to B5 via internal conductors 116a to 116c. A signal flows through the via-hole conductors B1 to B5. Therefore, when the external electrode 114b and the metal case 122 are magnetically coupled and capacitively coupled, the noise absorbed by the metal case 122 enters the signals flowing through the via-hole conductors B1 to B5 via the external electrode 114b and the internal conductors 116a to 116c. Resulting in.
　また、ＬＣ共振部品１１０では、信号が流れるビアホール導体Ｂ１～Ｂ５が接続されている内部導体１１６ａは、積層体１１２の上面近傍に設けられている。そのため、内部導体１１６ａと金属ケース１２２とは、磁気結合及び容量結合してしまう。その結果、金属ケース１２２が吸収したノイズが、内部導体１１６ａを介して、ビアホール導体Ｂ１～Ｂ５を流れる信号に侵入してしまう。 In the LC resonant component 110, the internal conductor 116a to which the via-hole conductors B1 to B5 through which signals flow is connected is provided in the vicinity of the upper surface of the multilayer body 112. Therefore, the inner conductor 116a and the metal case 122 are magnetically coupled and capacitively coupled. As a result, the noise absorbed by the metal case 122 enters the signals flowing through the via-hole conductors B1 to B5 via the internal conductor 116a.
特開平９－１８６０４９号公報Japanese Patent Laid-Open No. 9-186049
　そこで、本発明の目的は、基板に設けられている金属ケースを介してノイズが侵入することを抑制できる電子部品及び電子装置を提供することである。 Therefore, an object of the present invention is to provide an electronic component and an electronic device that can suppress noise from entering through a metal case provided on a substrate.
　本発明の第１の形態に係る電子部品は、複数の絶縁体層が積層されてなる積層体と、前記積層体に内蔵されているコイル及びコンデンサを構成している複数の内部導体と、前記積層体の側面に設けられている第１のグランド用外部電極と、前記積層体の側面に設けられ、かつ、前記第１のグランド用外部電極と対向している第２のグランド用外部電極と、を備え、前記コイルを構成している前記内部導体は、前記第１のグランド用外部電極に接続されており、かつ、前記第２のグランド用外部電極に接続されていないこと、を特徴とする。 The electronic component according to the first aspect of the present invention includes a laminate in which a plurality of insulator layers are laminated, a plurality of internal conductors constituting coils and capacitors built in the laminate, A first ground external electrode provided on a side surface of the multilayer body; and a second ground external electrode provided on a side surface of the multilayer body and facing the first ground external electrode; The internal conductor constituting the coil is connected to the first ground external electrode and is not connected to the second ground external electrode. To do.
　また、本発明の第２の形態に係る電子装置は、基板と、前記基板に実装されている第１の形態に係る電子部品と、前記第２のグランド用外部電極と対向した状態で、前記電子部品を覆っている金属ケースと、を備えていること、を特徴とする。 Further, an electronic device according to a second aspect of the present invention includes a substrate, the electronic component according to the first embodiment mounted on the substrate, and the second ground external electrode, And a metal case covering the electronic component.
　また、本発明の第３の形態に係る電子部品は、複数の絶縁体層が積層されてなる積層体と、前記積層体に内蔵されているコイル及びコンデンサを構成している複数の内部導体と、を備え、前記コイルを構成している前記内部導体は、前記コンデンサを構成している前記内部導体よりも積層方向の上側に設けられ、積層方向の最も上側に設けられている前記内部導体よりも積層方向の上側に設けられている前記絶縁体層は、積層方向の最も上側に設けられている該内部導体よりも積層方向の下側に設けられている前記絶縁体層よりも低い比誘電率を有していること、を特徴とする。 Further, an electronic component according to a third aspect of the present invention includes a laminated body in which a plurality of insulator layers are laminated, and a plurality of internal conductors constituting a coil and a capacitor built in the laminated body. The inner conductor constituting the coil is provided on the upper side in the stacking direction than the inner conductor constituting the capacitor, and the inner conductor provided on the uppermost side in the stacking direction. The dielectric layer provided on the upper side in the stacking direction is lower in relative dielectric constant than the insulator layer provided on the lower side in the stacking direction than the inner conductor provided on the uppermost side in the stacking direction. It is characterized by having a rate.
　また、本発明の第４の形態に係る電子装置は、基板と、前記基板に実装されている第３の形態に係る電子部品と、前記電子部品を覆っている金属ケースと、を備えていること、を特徴とする。 An electronic device according to a fourth aspect of the present invention includes a substrate, an electronic component according to the third embodiment mounted on the substrate, and a metal case covering the electronic component. It is characterized by this.
　本発明によれば、基板に設けられている金属ケースを介してノイズが侵入することを抑制できる。 According to the present invention, noise can be prevented from entering through the metal case provided on the substrate.
本発明の実施形態に係る電子部品の外観斜視図である。1 is an external perspective view of an electronic component according to an embodiment of the present invention. 第１の実施形態に係る電子部品の積層体の分解斜視図である。It is a disassembled perspective view of the laminated body of the electronic component which concerns on 1st Embodiment. 図２の電子部品が回路基板上に実装された電子装置の透視図である。FIG. 3 is a perspective view of an electronic device in which the electronic component of FIG. 2 is mounted on a circuit board. 図２の電子部品の等価回路図である。FIG. 3 is an equivalent circuit diagram of the electronic component of FIG. 2. 第２の実施形態に係る電子部品の積層体の分解斜視図である。It is a disassembled perspective view of the laminated body of the electronic component which concerns on 2nd Embodiment. 図５の電子部品が回路基板上に実装された電子装置の透視図である。FIG. 6 is a perspective view of an electronic device in which the electronic component of FIG. 5 is mounted on a circuit board. 図７（ａ）は、特許文献１に記載のＬＣ共振部品の断面構造図である。図７（ｂ）は、該ＬＣ共振部品が基板上に実装された図である。FIG. 7A is a cross-sectional structure diagram of the LC resonant component described in Patent Document 1. FIG. FIG. 7B is a diagram in which the LC resonant component is mounted on a substrate.
　以下に本発明の実施形態に係る電子部品及び電子装置について説明する。 Hereinafter, an electronic component and an electronic device according to an embodiment of the present invention will be described.
（第１の実施形態）
（電子部品の構成）
　以下に、本発明の第１の実施形態に係る電子部品の構成について図面を参照しながら説明する。図１は、本発明の実施形態に係る電子部品１０ａ，１０ｂの外観斜視図である。図２は、電子部品１０ａの積層体１２ａの分解斜視図である。図３は、電子部品１０ａが回路基板３０上に実装された電子装置５０ａの透視図である。図４は、電子部品１０ａの等価回路図である。以下、電子部品１０ａの積層方向をｚ軸方向と定義し、電子部品１０ａの長辺に沿った方向をｘ軸方向と定義し、電子部品１０ａの短辺に沿った方向をｙ軸方向と定義する。なお、ｘ軸方向、ｙ軸方向及びｚ軸方向の原点は、電子部品１０ａの中心とする。 (First embodiment)
(Configuration of electronic parts)
Hereinafter, the configuration of the electronic component according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of electronic components 10a and 10b according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multilayer body 12a of the electronic component 10a. FIG. 3 is a perspective view of an electronic device 50 a in which the electronic component 10 a is mounted on the circuit board 30. FIG. 4 is an equivalent circuit diagram of the electronic component 10a. Hereinafter, the stacking direction of the electronic component 10a is defined as the z-axis direction, the direction along the long side of the electronic component 10a is defined as the x-axis direction, and the direction along the short side of the electronic component 10a is defined as the y-axis direction. To do. The origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10a.
　電子部品１０ａは、図１及び図２に示すように、積層体１２ａ、外部電極１４（１４ａ～１４ｄ）、認識マーク１５、内部導体１８（１８ａ～１８ｈ）及びビアホール導体ｂ（ｂ１，ｂ２）を備えている。 As shown in FIGS. 1 and 2, the electronic component 10a includes a laminated body 12a, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 18 (18a to 18h), and via-hole conductors b (b1, b2). I have.
　積層体１２ａは、図２に示すように、長方形状の複数の誘電体層１６（１６ａ～１６ｇ）がこの順に並ぶように積層されることにより構成され、直方体状をなしている。外部電極１４ａは、図１に示すように、積層体１２ａのｘ軸方向の負方向側の側面に設けられており、信号の入力端子として用いられる。外部電極１４ｂは、図１に示すように、積層体１２ａのｘ軸方向の正方向側の側面に設けられており、信号の出力端子として用いられる。外部電極１４ｃは、積層体１２ａのｙ軸方向の負方向側の側面に設けられており、グランド端子として用いられる。外部電極１４ｄは、積層体１２ａのｙ軸方向の正方向側の側面に設けられており、グランド端子として用いられる。外部電極１４ｄは、外部電極１４ｃと対向している。 As shown in FIG. 2, the laminated body 12a is formed by laminating a plurality of rectangular dielectric layers 16 (16a to 16g) in this order, and has a rectangular parallelepiped shape. As shown in FIG. 1, the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12a, and is used as a signal input terminal. As shown in FIG. 1, the external electrode 14b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12a, and is used as a signal output terminal. The external electrode 14c is provided on the side surface on the negative side in the y-axis direction of the multilayer body 12a and is used as a ground terminal. The external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12a and is used as a ground terminal. The external electrode 14d is opposed to the external electrode 14c.
　認識マーク１５は、積層体１２ａのｚ軸方向の正方向側の上面に設けられており、実装時において電子部品１０ａの方向を識別するために用いられる。 The recognition mark 15 is provided on the upper surface on the positive side in the z-axis direction of the laminated body 12a, and is used for identifying the direction of the electronic component 10a during mounting.
　誘電体層１６は、例えば、Ｂａ－Ａｌ－Ｓｉ系の誘電体セラミックからなる長方形状の絶縁層である。内部導体１８は、Ｃｕを主成分とする導電性材料により構成され、積層体１２ａに内蔵されているコイルＬ１，Ｌ２及びコンデンサＣ１～Ｃ３を構成している。より詳細には、内部導体１８ａ，１８ｂはそれぞれ、誘電体層１６ｂの主面上において、ｙ軸方向の負方向側の辺からｙ軸方向の正方向側に向かって延在しているおり、コイルＬ１，Ｌ２の一部を構成している。ただし、内部導体１８ａ，１８ｂは、ｙ軸方向の正方向側の辺まで引き出されていない。したがって、内部導体１８ａ，１８ｂは、外部電極１４ｃには接続されているのに対して、外部電極１４ｄには接続されていない。 The dielectric layer 16 is a rectangular insulating layer made of, for example, a Ba—Al—Si based dielectric ceramic. The inner conductor 18 is made of a conductive material mainly composed of Cu, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12a. More specifically, each of the inner conductors 18a and 18b extends from the negative side in the y-axis direction toward the positive direction in the y-axis direction on the main surface of the dielectric layer 16b. Part of the coils L1 and L2 is configured. However, the inner conductors 18a and 18b are not drawn out to the side on the positive direction side in the y-axis direction. Therefore, the internal conductors 18a and 18b are connected to the external electrode 14c but are not connected to the external electrode 14d.
　内部導体１８ｃ，１８ｄはそれぞれ、ｚ軸方向から平面視したときに、内部導体１８ａ，１８ｂと誘電体層１６ｂを挟んで重なるように誘電体層１６ｃの主面上に設けられている。また、内部導体１８ｃは、誘電体層１６ｃにおいて、ｘ軸方向の負方向側の辺に引き出されていることにより、外部電極１４ａと接続されている。同様に、内部導体１８ｄは、誘電体層１６ｃにおいて、ｘ軸方向の正方向側の辺に引き出されていることにより、外部電極１４ｂと接続されている。 The inner conductors 18c and 18d are provided on the main surface of the dielectric layer 16c so as to overlap with the inner conductors 18a and 18b and the dielectric layer 16b when viewed in plan from the z-axis direction. The internal conductor 18c is connected to the external electrode 14a by being drawn out to the side on the negative side in the x-axis direction in the dielectric layer 16c. Similarly, the internal conductor 18d is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16c.
　ビアホール導体ｂ１は、誘電体層１６ｂをｚ軸方向に貫通しており、内部導体１８ａと内部導体１８ｃとを接続している。ビアホール導体ｂ２は、誘電体層１６ｂをｚ軸方向に貫通しており、内部導体１８ｂと内部導体１８ｄとを接続している。ビアホール導体ｂ１，ｂ２はそれぞれ、コイルＬ１，Ｌ２の一部を構成している。そして、内部導体１８ａとビアホール導体ｂ１とは、図４のコイルＬ１を構成している。内部導体１８ｂとビアホール導体ｂ２とは、図４のコイルＬ２を構成している。ビアホール導体ｂは、例えば、銅を主成分とする導電性材料により構成されている。 The via-hole conductor b1 penetrates the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18a and the internal conductor 18c. The via-hole conductor b2 penetrates the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18b and the internal conductor 18d. Via-hole conductors b1 and b2 constitute part of coils L1 and L2, respectively. The inner conductor 18a and the via hole conductor b1 constitute the coil L1 in FIG. The internal conductor 18b and the via-hole conductor b2 constitute the coil L2 in FIG. The via-hole conductor b is made of, for example, a conductive material whose main component is copper.
　内部導体１８ｅは、ｚ軸方向から平面視したときに、内部導体１８ｃ，１８ｄと誘電体層１６ｃを挟んで対向するように、誘電体層１６ｄ上に設けられている。これにより、内部導体１８ｃ，１８ｅは、図４のコンデンサＣ１を構成している。また、内部導体１８ｄ，１８ｅも、図４のコンデンサＣ１を構成している。なお、内部導体１８ｅは、図２に示すように、誘電体層１６ｄの中央部に設けられており、外部電極１４のいずれとも接続されていない。 The inner conductor 18e is provided on the dielectric layer 16d so as to face the inner conductors 18c and 18d with the dielectric layer 16c interposed therebetween when viewed in plan from the z-axis direction. Thus, the inner conductors 18c and 18e constitute the capacitor C1 in FIG. The internal conductors 18d and 18e also constitute the capacitor C1 in FIG. As shown in FIG. 2, the inner conductor 18 e is provided at the center of the dielectric layer 16 d and is not connected to any of the outer electrodes 14.
　内部導体１８ｆ，１８ｇはそれぞれ、ｚ軸方向から平面視したときに、内部導体１８ｅと誘電体層１６ｄを挟んで重なるように誘電体層１６ｅの主面上に設けられている。これにより、内部導体１８ｅ，１８ｆは、図４のコンデンサＣ１を構成している。また、内部導体１８ｅ，１８ｇも、図４のコンデンサＣ１を構成している。また、内部導体１８ｆは、誘電体層１６ｅにおいて、ｘ軸方向の負方向側の辺に引き出されていることにより、外部電極１４ａと接続されている。同様に、内部導体１８ｇは、誘電体層１６ｅにおいて、ｘ軸方向の正方向側の辺に引き出されていることにより、外部電極１４ｂと接続されている。 The inner conductors 18f and 18g are provided on the main surface of the dielectric layer 16e so as to overlap with the inner conductor 18e and the dielectric layer 16d when viewed in plan from the z-axis direction. Thereby, the internal conductors 18e and 18f constitute the capacitor C1 of FIG. Further, the inner conductors 18e and 18g also constitute the capacitor C1 in FIG. The internal conductor 18f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 16e. Similarly, the internal conductor 18g is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16e.
　内部導体１８ｈは、ｚ軸方向から平面視したときに、内部導体１８ｆ，１８ｇと誘電体層１６ｅを挟んで対向するように、誘電体層１６ｆ上に設けられている。これにより、内部導体１８ｆ，１８ｈは、図４のコンデンサＣ２を構成し、内部導体１８ｇ，１８ｈは、図４のコンデンサＣ３を構成している。なお、内部導体１８ｈは、図２に示すように、誘電体層１６ｆにおいて、ｙ軸方向の正方向側の辺及び負方向側の辺に引き出されていることにより、外部電極１４ｃ，１４ｄと接続されている。 The inner conductor 18h is provided on the dielectric layer 16f so as to face the inner conductors 18f and 18g with the dielectric layer 16e interposed therebetween when viewed in plan from the z-axis direction. Thereby, the inner conductors 18f and 18h constitute the capacitor C2 in FIG. 4, and the inner conductors 18g and 18h constitute the capacitor C3 in FIG. As shown in FIG. 2, the inner conductor 18h is connected to the outer electrodes 14c and 14d by being drawn out to the side on the positive side and the side on the negative direction in the dielectric layer 16f. Has been.
　以上のような誘電体層１６ａ～１６ｇが積層されることにより、コイルＬ１，Ｌ２を構成している内部導体１８ａ，１８ｂ及びビアホール導体ｂ１，ｂ２は、コンデンサＣ１～Ｃ３を構成している内部導体１８ｃ～１８ｈよりもｚ軸方向の正方向側に設けられている。 By laminating the dielectric layers 16a to 16g as described above, the internal conductors 18a and 18b and the via-hole conductors b1 and b2 constituting the coils L1 and L2 are the internal conductors constituting the capacitors C1 to C3. It is provided on the positive direction side in the z-axis direction from 18c to 18h.
　ところで、電子部品１０ａは、図３に示すように、回路基板３０上に実装される。そして、回路基板３０の主面を覆うように、金属ケース３２が設けられている。金属ケース３２は、側面部３２ａ及び上面部３２ｂを有し、外部からのノイズが電子部品１０ａ等に侵入することを抑制する役割を果たしている。側面部３２ａは、回路基板３０に対して垂直に取り付けられており、外部電極１４ｄと対向している。また、上面部３２ｂは、側面部３２ａに接続されており、回路基板３０の主面と所定の距離を空けて、該回路基板３０の主面を覆っている。これにより、電子部品１０ａは、金属ケース３２により覆われている。ただし、金属ケース３２は、外部電極１４ｃとは対向していない。 Incidentally, the electronic component 10a is mounted on the circuit board 30 as shown in FIG. A metal case 32 is provided so as to cover the main surface of the circuit board 30. The metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10a and the like. The side surface portion 32a is attached perpendicular to the circuit board 30 and faces the external electrode 14d. The upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30. Thereby, the electronic component 10 a is covered with the metal case 32. However, the metal case 32 does not face the external electrode 14c.
（効果）
　以上のように構成された電子部品１０ａ及び電子装置５０ａによれば、以下に説明するように、金属ケース３２を介して電子部品１０ａにノイズが侵入することを抑制できる。より詳細には、図７に示すＬＣ共振部品１１０では、外部電極１１４ｂと金属ケース１２２とが対向し、かつ、外部電極１１４ｂと内部導体１１６ａ～１１６ｃとが接続されていた。そのため、金属ケース１２２が吸収したノイズが、外部電極１１４ｂ及び内部導体１１６ａ～１１６ｃを介して、コイルを構成しているビアホール導体Ｂ１～Ｂ５に侵入していた。 (effect)
According to the electronic component 10a and the electronic device 50a configured as described above, it is possible to suppress noise from entering the electronic component 10a through the metal case 32 as described below. More specifically, in the LC resonant component 110 shown in FIG. 7, the external electrode 114b and the metal case 122 face each other, and the external electrode 114b and the internal conductors 116a to 116c are connected. Therefore, the noise absorbed by the metal case 122 has entered the via-hole conductors B1 to B5 constituting the coil through the external electrode 114b and the internal conductors 116a to 116c.
　そこで、電子部品１０ａでは、コイルＬ１，Ｌ２を構成している内部導体１８ａ，１８ｂは、金属ケース３２と対向している外部電極１４ｄに対して接続されていない。したがって、金属ケース３２が吸収したノイズは、外部電極１４ｂから内部導体１８ａ，１８ｂから積層体１２ａの内部へ侵入することはない。よって、電子部品１０ａ及び電子装置５０ａでは、金属ケース３２を介して電子部品１０ａにノイズが侵入することを抑制できる。 Therefore, in the electronic component 10a, the internal conductors 18a and 18b constituting the coils L1 and L2 are not connected to the external electrode 14d facing the metal case 32. Therefore, the noise absorbed by the metal case 32 does not enter the laminated body 12a from the internal electrodes 18a and 18b from the external electrode 14b. Therefore, in the electronic component 10a and the electronic device 50a, it is possible to prevent noise from entering the electronic component 10a through the metal case 32.
　特に、電子部品１０ａでは、コイルＬ１，Ｌ２を構成している内部導体１８ａ，１８ｂは、コンデンサＣ１～Ｃ３を構成している内部導体１８ｃ～１８ｈよりもｚ軸方向の上側に設けられている。更に、電子部品１０ａでは、内部導体１８ａ，１８ｂは、ｚ軸方向において最も上側に設けられている。よって、内部導体１８ａ，１８ｂは、内部導体１８ｃ～１８ｈに比べて、金属ケース３２との間の距離が短いため、金属ケース３２からのノイズの影響を受けやすい。そこで、内部導体１８ａ，１８ｂを外部電極１４ｄに対して接続しないことにより、金属ケース３２から内部導体１８ａ，１８ｂにノイズが侵入することを効果的に抑制できる。 In particular, in the electronic component 10a, the inner conductors 18a and 18b constituting the coils L1 and L2 are provided above the inner conductors 18c to 18h constituting the capacitors C1 to C3 in the z-axis direction. Furthermore, in the electronic component 10a, the inner conductors 18a and 18b are provided on the uppermost side in the z-axis direction. Therefore, the inner conductors 18a and 18b are easily affected by noise from the metal case 32 because the distance between the inner conductors 18a and 18b is shorter than the inner conductors 18c to 18h. Therefore, by not connecting the internal conductors 18a and 18b to the external electrode 14d, it is possible to effectively suppress noise from entering the internal conductors 18a and 18b from the metal case 32.
　また、電子部品１０ａでは、図２及び図３に示すように、内部導体１８ａ，１８ｂはそれぞれ、ビアホール導体ｂ１，ｂ２と外部電極１４ｃとの間にのみ設けられている。したがって、内部導体１８ａ，１８ｂは、ビアホール導体ｂ１，ｂ２よりも外部電極１４ｄ側には設けられていない。そのため、内部導体１８ａ，１８ｂと金属ケース３２とが対向する面積の大きさが低減される。その結果、内部導体１８ａ，１８ｂと金属ケース３２との間の磁気結合及び容量結合が低減される。よって、金属ケース３２から内部導体１８ａ，１８ｂにノイズが侵入することが抑制される。 In the electronic component 10a, as shown in FIGS. 2 and 3, the internal conductors 18a and 18b are provided only between the via-hole conductors b1 and b2 and the external electrode 14c, respectively. Therefore, the internal conductors 18a and 18b are not provided on the external electrode 14d side than the via-hole conductors b1 and b2. Therefore, the size of the area where the inner conductors 18a, 18b and the metal case 32 face each other is reduced. As a result, magnetic coupling and capacitive coupling between the inner conductors 18a and 18b and the metal case 32 are reduced. Therefore, it is possible to prevent noise from entering the inner conductors 18a and 18b from the metal case 32.
　また、電子部品１０ａでは、コイルＬ１，Ｌ２を構成している内部導体１８ａ，１８ｂは、同じ誘電体層１６ｂ上に複数（２つ）設けられている。更に、ビアホール導体ｂ１，ｂ２は、内部導体１８ａ，１８ｂのそれぞれに接続されるように複数（２つ）設けられている。これにより、コイルＬ１とコイルＬ２とは互いに近接するようになる。その結果、コイルＬ１とコイルＬ２との間の磁気結合を強くすることができる。 In the electronic component 10a, a plurality (two) of the internal conductors 18a and 18b constituting the coils L1 and L2 are provided on the same dielectric layer 16b. Furthermore, a plurality (two) of via-hole conductors b1 and b2 are provided so as to be connected to the internal conductors 18a and 18b, respectively. Thereby, the coil L1 and the coil L2 come close to each other. As a result, the magnetic coupling between the coil L1 and the coil L2 can be strengthened.
（第２の実施形態）
（電子部品の構成）
　以下に、本発明の第２の実施形態に係る電子部品の構成について図面を参照しながら説明する。図５は、電子部品１０ｂの積層体１２ｂの分解斜視図である。図６は、電子部品１０ｂが回路基板３０上に実装された電子装置５０ｂの透視図である。以下、電子部品１０ｂの積層方向をｚ軸方向と定義し、電子部品１０ｂの長辺に沿った方向をｘ軸方向と定義し、電子部品１０ｂの短辺に沿った方向をｙ軸方向と定義する。なお、ｘ軸方向、ｙ軸方向及びｚ軸方向の原点は、電子部品１０ｂの中心とする。電子部品１０ｂの外観斜視図及び等価回路図は、図１及び図４を援用する。 (Second Embodiment)
(Configuration of electronic parts)
The configuration of the electronic component according to the second embodiment of the present invention will be described below with reference to the drawings. FIG. 5 is an exploded perspective view of the multilayer body 12b of the electronic component 10b. FIG. 6 is a perspective view of an electronic device 50 b in which the electronic component 10 b is mounted on the circuit board 30. Hereinafter, the stacking direction of the electronic component 10b is defined as the z-axis direction, the direction along the long side of the electronic component 10b is defined as the x-axis direction, and the direction along the short side of the electronic component 10b is defined as the y-axis direction. To do. The origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10b. 1 and 4 are used for an external perspective view and an equivalent circuit diagram of the electronic component 10b.
　電子部品１０ｂは、図１及び図５に示すように、積層体１２ｂ、外部電極１４（１４ａ～１４ｄ）、認識マーク１５、内部導体６８（６８ａ～６８ｈ）及びビアホール導体ｂ（ｂ１１，ｂ１２）を備えている。 As shown in FIGS. 1 and 5, the electronic component 10b includes a laminated body 12b, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 68 (68a to 68h), and via-hole conductors b (b11, b12). I have.
　積層体１２ｂは、図５に示すように、長方形状の複数の誘電体層６５（６５ａ），６６（６６ｂ～６６ｇ）がこの順に並ぶように積層されることにより構成され、直方体状をなしている。外部電極１４ａは、図１に示すように、積層体１２ｂのｘ軸方向の負方向側の側面に設けられており、信号の入力端子として用いられる。外部電極１４ｂは、図１に示すように、積層体１２ｂのｘ軸方向の正方向側の側面に設けられており、信号の出力端子として用いられる。外部電極１４ｃは、積層体１２ｂのｙ軸方向の負方向側の側面に設けられており、グランド端子として用いられる。外部電極１４ｄは、積層体１２ｂのｙ軸方向の正方向側の側面に設けられており、グランド端子として用いられる。外部電極１４ｃは、外部電極１４ｄと対向している。 As shown in FIG. 5, the multilayer body 12b is formed by laminating a plurality of rectangular dielectric layers 65 (65a) and 66 (66b to 66g) in this order, and forms a rectangular parallelepiped shape. Yes. As shown in FIG. 1, the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12b, and is used as a signal input terminal. As shown in FIG. 1, the external electrode 14 b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12 b and is used as a signal output terminal. The external electrode 14c is provided on the side surface on the negative direction side in the y-axis direction of the multilayer body 12b and is used as a ground terminal. The external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12b and is used as a ground terminal. The external electrode 14c is opposed to the external electrode 14d.
　認識マーク１５は、積層体１２ｂのｚ軸方向の正方向側の上面に設けられており、実装時において電子部品１０ｂの方向を識別するために用いられる。 The recognition mark 15 is provided on the upper surface of the laminated body 12b on the positive side in the z-axis direction, and is used for identifying the direction of the electronic component 10b during mounting.
　誘電体層６５，６６は、例えば、Ｂａ－Ａｌ－Ｓｉ系の誘電体セラミックからなる長方形状の絶縁層である。内部導体６８は、Ｃｕを主成分とする導電性材料により構成され、積層体１２ｂに内蔵されているコイルＬ１，Ｌ２及びコンデンサＣ１～Ｃ３を構成している。より詳細には、内部導体６８ａ，６８ｂは、誘電体層６６ｂの主面上において、ｙ軸方向の負方向側の辺からｙ軸方向の正方向側の辺まで延在しており、コイルＬ１，Ｌ２の一部を構成している。これにより、内部導体６８ａ，６８ｂは、外部電極１４ｃ，１４ｄに接続されている。 The dielectric layers 65 and 66 are rectangular insulating layers made of, for example, a Ba—Al—Si based dielectric ceramic. The inner conductor 68 is made of a conductive material containing Cu as a main component, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12b. More specifically, the inner conductors 68a and 68b extend from the negative side in the y-axis direction to the positive side in the y-axis direction on the main surface of the dielectric layer 66b, and the coil L1. , L2 is configured. Thereby, the inner conductors 68a and 68b are connected to the outer electrodes 14c and 14d.
　内部導体６８ｃ，６８ｄはそれぞれ、ｚ軸方向から平面視したときに、内部導体６８ａ，６８ｂと誘電体層６６ｂを挟んで重なるように誘電体層６６ｃの主面上に設けられている。また、内部導体６８ｃは、誘電体層６６ｃにおいて、ｘ軸方向の負方向側の辺に引き出されていることにより、外部電極１４ａと接続されている。同様に、内部導体６８ｄは、誘電体層６６ｃにおいて、ｘ軸方向の正方向側の辺に引き出されていることにより、外部電極１４ｂと接続されている。 The inner conductors 68c and 68d are provided on the main surface of the dielectric layer 66c so as to overlap with the inner conductors 68a and 68b and the dielectric layer 66b when viewed in plan from the z-axis direction. The internal conductor 68c is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66c. Similarly, the internal conductor 68d is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66c.
　ビアホール導体ｂ１１は、誘電体層６６ｂをｚ軸方向に貫通しており、内部導体６８ａと内部導体６８ｃとを接続している。ビアホール導体ｂ１２は、誘電体層６６ｂをｚ軸方向に貫通しており、内部導体６８ｂと内部導体６８ｄとを接続している。ビアホール導体ｂ１１，ｂ１２はそれぞれ、コイルＬ１，Ｌ２の一部を構成している。そして、内部導体６８ａとビアホール導体ｂ１１とは、図４のコイルＬ１を構成している。内部導体６８ｂとビアホール導体ｂ１２とは、図４のコイルＬ２を構成している。ビアホール導体ｂは、例えば、銅を主成分とする導電性材料により構成されている。 The via-hole conductor b11 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68a and the internal conductor 68c. The via-hole conductor b12 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68b and the internal conductor 68d. The via-hole conductors b11 and b12 constitute part of the coils L1 and L2, respectively. The internal conductor 68a and the via hole conductor b11 constitute the coil L1 in FIG. The inner conductor 68b and the via-hole conductor b12 constitute the coil L2 in FIG. The via-hole conductor b is made of, for example, a conductive material whose main component is copper.
　内部導体６８ｅは、ｚ軸方向から平面視したときに、内部導体６８ｃ，６８ｄと誘電体層６６ｃを挟んで対向するように、誘電体層６６ｄ上に設けられている。これにより、内部導体６８ｃ，６８ｅは、図４のコンデンサＣ１を構成している。また、内部導体６８ｄ，６８ｅも、図４のコンデンサＣ１を構成している。なお、内部導体６８ｅは、図５に示すように、誘電体層６６ｄの中央部に設けられており、外部電極１４のいずれとも接続されていない。 The inner conductor 68e is provided on the dielectric layer 66d so as to face the inner conductors 68c and 68d with the dielectric layer 66c interposed therebetween when viewed in plan from the z-axis direction. As a result, the internal conductors 68c and 68e constitute the capacitor C1 of FIG. The internal conductors 68d and 68e also constitute the capacitor C1 in FIG. As shown in FIG. 5, the inner conductor 68 e is provided in the center of the dielectric layer 66 d and is not connected to any of the outer electrodes 14.
　内部導体６８ｆ，６８ｇはそれぞれ、ｚ軸方向から平面視したときに、内部導体６８ｅと誘電体層６６ｄを挟んで重なるように誘電体層６６ｅの主面上に設けられている。これにより、内部導体６８ｅ，６８ｆは、図４のコンデンサＣ１を構成している。また、内部導体６８ｅ，６８ｇも、図４のコンデンサＣ１を構成している。また、内部導体６８ｆは、誘電体層６６ｅにおいて、ｘ軸方向の負方向側の辺に引き出されていることにより、外部電極１４ａと接続されている。同様に、内部導体６８ｇは、誘電体層６６ｅにおいて、ｘ軸方向の正方向側の辺に引き出されていることにより、外部電極１４ｂと接続されている。 The inner conductors 68f and 68g are provided on the main surface of the dielectric layer 66e so as to overlap with the inner conductor 68e and the dielectric layer 66d when viewed in plan from the z-axis direction. Thus, the inner conductors 68e and 68f constitute the capacitor C1 in FIG. The internal conductors 68e and 68g also constitute the capacitor C1 in FIG. The internal conductor 68f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66e. Similarly, the internal conductor 68g is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66e.
　内部導体６８ｈは、ｚ軸方向から平面視したときに、内部導体６８ｆ，６８ｇと誘電体層６６ｅを挟んで対向するように、誘電体層６６ｆ上に設けられている。これにより、内部導体６８ｆ，６８ｈは、図４のコンデンサＣ２を構成し、内部導体６８ｇ，６８ｈは、図４のコンデンサＣ３を構成している。なお、内部導体６８ｈは、図５に示すように、誘電体層６６ｆにおいて、ｙ軸方向の正方向側の辺及び負方向側の辺に引き出されていることにより、外部電極１４ｃ，１４ｄと接続されている。 The inner conductor 68h is provided on the dielectric layer 66f so as to face the inner conductors 68f and 68g with the dielectric layer 66e interposed therebetween when viewed in plan from the z-axis direction. Thereby, the inner conductors 68f and 68h constitute the capacitor C2 of FIG. 4, and the inner conductors 68g and 68h constitute the capacitor C3 of FIG. As shown in FIG. 5, the inner conductor 68h is connected to the outer electrodes 14c and 14d by being drawn out to the positive side and the negative side in the dielectric layer 66f. Has been.
　以上のような誘電体層６５ａ，６６ｂ～６６ｇが積層されることにより、コイルＬ１，Ｌ２を構成している内部導体６８ａ，６８ｂ及びビアホール導体ｂ１１，ｂ１２は、コンデンサＣ１～Ｃ３を構成している内部導体６８ｃ～６８ｈよりもｚ軸方向の正方向側に設けられている。 By laminating the dielectric layers 65a, 66b to 66g as described above, the internal conductors 68a and 68b and the via-hole conductors b11 and b12 constituting the coils L1 and L2 constitute the capacitors C1 to C3. It is provided on the positive side in the z-axis direction from the internal conductors 68c to 68h.
　更に、誘電体層６５ａは、ｚ軸方向の最も正方向側に設けられている内部導体６８ａ，６８ｂよりもｚ軸方向の正方向側に設けられ、かつ、該内部導体６８ａ，６８ｂよりもｚ軸方向の負方向側に設けられている誘電体層６６よりも低い比誘電率を有している。 Furthermore, the dielectric layer 65a is provided on the positive side in the z-axis direction relative to the inner conductors 68a and 68b provided on the most positive direction side in the z-axis direction, and is located on the positive side in the z-axis direction. The dielectric constant is lower than that of the dielectric layer 66 provided on the negative side in the axial direction.
　ところで、電子部品１０ｂは、図６に示すように、回路基板３０上に実装される。そして、回路基板３０の主面を覆うように、金属ケース３２が設けられている。金属ケース３２は、側面部３２ａ及び上面部３２ｂを有し、外部からのノイズが電子部品１０ｂ等に侵入することを抑制する役割を果たしている。側面部３２ａは、回路基板３０に対して垂直に取り付けられており、外部電極１４ｄと対向している。また、上面部３２ｂは、側面部３２ａに接続されており、回路基板３０の主面と所定の距離を空けて、該回路基板３０の主面を覆っている。これにより、電子部品１０ｂは、金属ケース３２により覆われている。ただし、金属ケース３２は、外部電極１４ｃとは対向していない。 Incidentally, the electronic component 10b is mounted on the circuit board 30 as shown in FIG. A metal case 32 is provided so as to cover the main surface of the circuit board 30. The metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10b and the like. The side surface portion 32a is attached perpendicularly to the circuit board 30 and faces the external electrode 14d. Further, the upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30. Thereby, the electronic component 10 b is covered with the metal case 32. However, the metal case 32 does not face the external electrode 14c.
（効果）
　以上のように構成された電子部品１０ｂ及び電子装置５０ｂによれば、以下に説明するように、金属ケース３２を介して電子部品１０ｂにノイズが侵入することを抑制できる。より詳細には、図７に示すＬＣ共振部品１１０では、内部導体１１６ａは、金属ケース１２２と対向し、該金属ケース１２２との間で容量結合する。そのため、金属ケース１２２が吸収したノイズが、内部導体１１６ａを介してＬＣ共振部品１１０内に侵入するおそれがある。 (effect)
According to the electronic component 10b and the electronic device 50b configured as described above, it is possible to suppress noise from entering the electronic component 10b through the metal case 32 as described below. More specifically, in the LC resonant component 110 shown in FIG. 7, the inner conductor 116 a faces the metal case 122 and is capacitively coupled to the metal case 122. Therefore, the noise absorbed by the metal case 122 may enter the LC resonant component 110 through the internal conductor 116a.
　そこで、電子部品１０ｂでは、ｚ軸方向の最も正方向側に設けられている内部導体６８ａ，６８ｂよりもｚ軸方向の正方向側に設けられている誘電体層６５ａは、該内部導体６８ａ，６８ｂよりもｚ軸方向の負方向側に設けられている誘電体層６６よりも低い比誘電率を有している。これにより、内部導体６８ａ，６８ｂと金属ケース３２の上面部３２ｂとの間に発生する浮遊容量が低減される。その結果、電子部品１０ｂによれば、金属ケース３２を介して電子部品１０ｂにノイズが侵入することを抑制できる。 Therefore, in the electronic component 10b, the dielectric layer 65a provided on the positive side in the z-axis direction relative to the internal conductors 68a and 68b provided on the most positive direction side in the z-axis direction includes the internal conductor 68a, It has a relative dielectric constant lower than that of the dielectric layer 66 provided on the negative side in the z-axis direction from 68b. Thereby, stray capacitance generated between the inner conductors 68a and 68b and the upper surface portion 32b of the metal case 32 is reduced. As a result, according to the electronic component 10b, it is possible to prevent noise from entering the electronic component 10b via the metal case 32.
　特に、電子部品１０ｂでは、内部導体６８ａ，６８ｂは、コイルＬ１，Ｌ２を構成している。そのため、内部導体６８ａ，６８ｂには信号が流れる。したがって、内部導体６８ａ，６８ｂと金属ケース３２との間の浮遊容量を低減することにより、電子部品１０ｂにおいて、信号にノイズが侵入することがより効果的に抑制される。 In particular, in the electronic component 10b, the inner conductors 68a and 68b constitute coils L1 and L2. Therefore, a signal flows through the internal conductors 68a and 68b. Therefore, by reducing the stray capacitance between the inner conductors 68a and 68b and the metal case 32, it is possible to more effectively suppress noise from entering the signal in the electronic component 10b.
（電子部品の製造方法）
　以下に、電子部品１０ａの製造方法について図１及び図２を参照しながら説明する。なお、電子部品１０ｂの製造方法は、電子部品１０ａの製造方法と基本的に同じであるので、説明を省略する。 (Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10a is demonstrated, referring FIG.1 and FIG.2. Note that the manufacturing method of the electronic component 10b is basically the same as the manufacturing method of the electronic component 10a, and thus the description thereof is omitted.
　まず、誘電体層１６となるべきセラミックグリーンシートを準備する。具体的には、酸化バリウム（ＢａＯ）、酸化アルミニウム（Ａｌ2Ｏ3）及び酸化ケイ素（ＳｉＯ2）を所定の比率で秤量したそれぞれの材料を原材料としてボールミルに投入し、湿式調合を行う。得られた混合物を乾燥してから粉砕し、得られた粉末を仮焼する。得られた仮焼粉末をボールミルにて湿式粉砕した後、乾燥してから解砕して、誘電体セラミック粉末を得る。 First, a ceramic green sheet to be the dielectric layer 16 is prepared. Specifically, each material obtained by weighing barium oxide (BaO), aluminum oxide (Al 2 O 3 ), and silicon oxide (SiO 2 ) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a dielectric ceramic powder.
　この誘電体セラミック粉末に対して結合剤と可塑剤、湿潤材、分散剤を加えてボールミルで混合を行い、その後、減圧により脱泡を行う。得られたセラミックスラリーをドクターブレード法により、キャリアシート上にシート状に形成して乾燥させ、誘電体層１６となるべきセラミックグリーンシートを作製する。 This binder ceramic powder is mixed with a binder, a plasticizer, a wetting material, and a dispersing agent, mixed with a ball mill, and then defoamed under reduced pressure. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the dielectric layer 16.
　次に、誘電体層１６ｂとなるべきセラミックグリーンシートのそれぞれに、ビアホール導体ｂ１，ｂ２を形成する。具体的には、誘電体層１６ｂとなるべきセラミックグリーンシートにレーザビームを照射してビアホールを形成する。次に、このビアホールに対して、Ａｇ，Ｐｄ，Ｃｕ，Ａｕやこれらの合金などの導電性ペーストを印刷塗布などの方法により充填する。 Next, via hole conductors b1 and b2 are formed in each of the ceramic green sheets to be the dielectric layer 16b. Specifically, a via hole is formed by irradiating a ceramic green sheet to be the dielectric layer 16b with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.
　次に、誘電体層１６ｂ～１６ｆとなるべきセラミックグリーンシート上に、Ａｇ，Ｐｄ，Ｃｕ，Ａｕやこれらの合金などを主成分とする導電性ペーストをスクリーン印刷法やフォトリソグラフィ法などの方法で塗布することにより、内部導体１８ａ～１８ｈを形成する。なお、内部導体１８ａ～１８ｈを形成する工程とビアホールに対して導電性ペーストを充填する工程とは、同じ工程において行われてもよい。 Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the ceramic green sheets to be the dielectric layers 16b to 16f by a method such as a screen printing method or a photolithography method. By applying, the inner conductors 18a to 18h are formed. The step of forming the internal conductors 18a to 18h and the step of filling the via hole with the conductive paste may be performed in the same step.
　次に、各セラミックグリーンシートを積層する。具体的には、誘電体層１６ｇとなるべきセラミックグリーンシートを配置する。誘電体層１６ｇとなるべきセラミックグリーンシートのキャリアフィルムを剥がして、誘電体層１６ｇとなるべきセラミックグリーンシート上に誘電体層１６ｆとなるべきセラミックグリーンシートを配置する。この後、誘電体層１６ｆとなるべきセラミックグリーンシートを誘電体層１６ｇとなるべきセラミックグリーンシートに対して圧着する。キャリアフィルムの排出方法は、吸引による排出及びチャックによるつかみ排出である。この後、誘電体層１６ｅ，１６ｄ，１６ｃ，１６ｂ，１６ａとなるべきセラミックグリーンシートについても同様にこの順番に積層及び圧着する。これにより、マザー積層体が形成される。このマザー積層体には、静水圧プレスなどにより本圧着が施される。 Next, each ceramic green sheet is laminated. Specifically, a ceramic green sheet to be the dielectric layer 16g is disposed. The carrier film of the ceramic green sheet to be the dielectric layer 16g is peeled off, and the ceramic green sheet to be the dielectric layer 16f is disposed on the ceramic green sheet to be the dielectric layer 16g. Thereafter, the ceramic green sheet to be the dielectric layer 16f is pressure-bonded to the ceramic green sheet to be the dielectric layer 16g. The discharge method of the carrier film is discharge by suction and grabbing discharge by a chuck. Thereafter, the ceramic green sheets to be the dielectric layers 16e, 16d, 16c, 16b, and 16a are similarly laminated and pressure-bonded in this order. Thereby, a mother laminated body is formed. The mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.
　次に、マザー積層体をカット刃により所定寸法の積層体１２ａにカットする。これにより未焼成の積層体１２ａが得られる。この未焼成の積層体１２ａには、脱バインダー処理及び焼成がなされる。 Next, the mother laminated body is cut into a laminated body 12a having a predetermined size with a cutting blade. Thereby, the unsintered laminated body 12a is obtained. This unfired laminate 12a is subjected to binder removal processing and firing.
　以上の工程により、焼成された積層体１２ａが得られる。積層体１２ａには、バレル加工が施されて、面取りが行われる。その後、積層体１２ａの表面には、例えば、浸漬法等の方法により主成分が銅である電極ペーストが塗布及び焼き付けされることにより、外部電極１４ａ～１４ｄとなるべき銅電極が形成される。 The fired laminated body 12a is obtained through the above steps. The laminated body 12a is barrel-processed and chamfered. Thereafter, a copper electrode to be the external electrodes 14a to 14d is formed on the surface of the laminated body 12a by applying and baking an electrode paste whose main component is copper by a method such as dipping.
　最後に、銅電極の表面に、Ｎｉめっき／Ｓｎめっきを施すことにより、外部電極１４ａ～１４ｄを形成する。以上の工程を経て、図１に示すような電子部品１０ａが完成する。 Finally, the external electrodes 14a to 14d are formed by performing Ni plating / Sn plating on the surface of the copper electrode. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.
（その他の実施形態）
　なお、本発明に係る電子部品及び電子装置は、前記実施形態に示した電子部品１０ａ，１０ｂ及び電子装置５０ａ，５０ｂに限らず、その要旨の範囲内において変更可能である。 (Other embodiments)
The electronic component and the electronic device according to the present invention are not limited to the electronic components 10a and 10b and the electronic devices 50a and 50b shown in the above-described embodiment, and can be changed within the scope of the gist thereof.
　なお、電子部品１０ａの内部導体１８ａ，１８ｂと電子部品１０ｂの磁性体層６５ａとを組み合わせてもよい。これらを組み合わせることにより、より効果的に、電子部品１０ａ，１０ｂ内にノイズが侵入することを抑制できる。また、誘電体層として樹脂を使用してもよい。 In addition, you may combine the inner conductors 18a and 18b of the electronic component 10a, and the magnetic body layer 65a of the electronic component 10b. By combining these, it is possible to more effectively suppress noise from entering the electronic components 10a and 10b. A resin may be used as the dielectric layer.
　本発明は、電子部品及び電子装置に有用であり、特に、基板に設けられている金属ケースを介してノイズが侵入することを抑制できる点において優れている。 The present invention is useful for electronic parts and electronic devices, and is particularly excellent in that noise can be prevented from entering through a metal case provided on a substrate.
　Ｃ１～Ｃ３　コンデンサ
　Ｌ１，Ｌ２　コイル
　ｂ１，ｂ２，ｂ１１，ｂ１２　ビアホール導体
　１０ａ，１０ｂ　電子部品
　１２ａ，１２ｂ　積層体
　１４ａ～１４ｄ　外部電極
　１６ａ～１６ｇ，６５ａ，６６ｂ～６６ｇ　誘電体層
　１８ａ～１８ｈ，６８ａ～６８ｈ　内部導体
　３０　回路基板
　３２　金属ケース
　３２ａ　側面部
　３２ｂ　上面部
　５０ａ，５０ｂ　電子装置 C1 to C3 Capacitors L1, L2 Coils b1, b2, b11, b12 Via hole conductors 10a, 10b Electronic parts 12a, 12b Laminated bodies 14a-14d External electrodes 16a-16g, 65a, 66b-66g Dielectric layers 18a-18h, 68a- 68h Inner conductor 30 Circuit board 32 Metal case 32a Side surface portion 32b Upper surface portion 50a, 50b Electronic device

Claims (9)

  1. 　複数の絶縁体層が積層されてなる積層体と、
    　前記積層体に内蔵されているコイル及びコンデンサを構成している複数の内部導体と、
    　前記積層体の側面に設けられている第１のグランド用外部電極と、
    　前記積層体の側面に設けられ、かつ、前記第１のグランド用外部電極と対向している第２のグランド用外部電極と、
    　を備え、
    　前記コイルを構成している前記内部導体は、前記第１のグランド用外部電極に接続されており、かつ、前記第２のグランド用外部電極に接続されていないこと、
    　を特徴とする電子部品。     A laminate formed by laminating a plurality of insulator layers;
    A plurality of internal conductors constituting a coil and a capacitor built in the laminate; and
    A first ground external electrode provided on a side surface of the laminate;
    A second ground external electrode provided on a side surface of the multilayer body and facing the first ground external electrode;
    With
    The internal conductor constituting the coil is connected to the first ground external electrode and not connected to the second ground external electrode;
    Electronic parts characterized by
  2. 　回路基板上に実装されると共に、金属ケースにより覆われる電子部品であって、
    　前記第１のグランド用外部電極は、実装時に、前記金属ケースと対向せず、
    　前記第２のグランド用外部電極は、実装時に、前記金属ケースと対向すること、
    　を特徴とする請求項１に記載の電子部品。     An electronic component mounted on a circuit board and covered with a metal case,
    The first ground external electrode does not face the metal case when mounted,
    The second ground external electrode is opposed to the metal case at the time of mounting;
    The electronic component according to claim 1.
  3. 　前記コイルを構成している前記内部導体は、前記コンデンサを構成している前記内部導体よりも積層方向の上側に設けられていること、
    　を特徴とする請求項１又は請求項２のいずれかに記載の電子部品。     The inner conductor constituting the coil is provided above the inner conductor constituting the capacitor in the stacking direction;
    The electronic component according to claim 1, wherein:
  4. 　前記コイルの一部を構成しているビアホール導体を、
    　更に備え、
    　前記コイルを構成している前記内部導体の一方端は、前記第１のグランド用外部電極に接続され、
    　前記内部導体の他方端は、前記ビアホール導体に接続されていること、
    　を特徴とする請求項３に記載の電子部品。     A via-hole conductor constituting a part of the coil,
    In addition,
    One end of the internal conductor constituting the coil is connected to the first ground external electrode,
    The other end of the inner conductor is connected to the via-hole conductor;
    The electronic component according to claim 3.
  5. 　前記コイルを構成している前記内部導体は、同じ前記絶縁体層上に複数設けられており、
    　前記ビアホール導体は、同じ前記絶縁体層上に設けられている前記複数の内部導体のそれぞれに接続されるように複数設けられていること、
    　を特徴とする請求項４に記載の電子部品。     A plurality of the inner conductors constituting the coil are provided on the same insulator layer,
    A plurality of the via-hole conductors are provided so as to be connected to each of the plurality of inner conductors provided on the same insulator layer;
    The electronic component according to claim 4.
  6. 　積層方向の最も上側に設けられている前記内部導体よりも積層方向の上側に設けられている前記絶縁体層は、積層方向の最も上側に設けられている該内部導体よりも積層方向の下側に設けられている前記絶縁体層よりも低い比誘電率を有していること、
    　を特徴とする請求項１ないし請求項５のいずれかに記載の電子部品。     The insulator layer provided above the inner conductor provided in the uppermost layer in the stacking direction is lower than the inner conductor provided in the uppermost layer in the stacking direction. Having a dielectric constant lower than that of the insulator layer provided in
    The electronic component according to claim 1, wherein:
  7. 　基板と、
    　前記基板に実装されている請求項１ないし請求項６のいずれかに記載の電子部品と、
    　前記第２のグランド用外部電極と対向した状態で、前記電子部品を覆っている金属ケースと、
    　を備えていること、
    　を特徴とする電子装置。     A substrate,
    The electronic component according to any one of claims 1 to 6, which is mounted on the substrate,
    A metal case covering the electronic component in a state facing the second ground external electrode;
    Having
    An electronic device characterized by the above.
  8. 　複数の絶縁体層が積層されてなる積層体と、
    　前記積層体に内蔵されているコイル及びコンデンサを構成している複数の内部導体と、
    　を備え、
    　前記コイルを構成している前記内部導体は、前記コンデンサを構成している前記内部導体よりも積層方向の上側に設けられ、
    　積層方向の最も上側に設けられている前記内部導体よりも積層方向の上側に設けられている前記絶縁体層は、積層方向の最も上側に設けられている該内部導体よりも積層方向の下側に設けられている前記絶縁体層よりも低い比誘電率を有していること、
    　を特徴とする電子部品。     A laminate formed by laminating a plurality of insulator layers;
    A plurality of internal conductors constituting a coil and a capacitor built in the laminate; and
    With
    The inner conductor constituting the coil is provided above the inner conductor constituting the capacitor in the stacking direction,
    The insulator layer provided above the inner conductor provided in the uppermost layer in the stacking direction is lower than the inner conductor provided in the uppermost layer in the stacking direction. Having a dielectric constant lower than that of the insulator layer provided in
    Electronic parts characterized by
  9. 　基板と、
    　前記基板に実装されている請求項８に記載の電子部品と、
    　前記電子部品を覆っている金属ケースと、
    　を備えていること、
    　を特徴とする電子装置。     A substrate,
    The electronic component according to claim 8 mounted on the substrate;
    A metal case covering the electronic component;
    Having
    An electronic device characterized by the above.
PCT/JP2010/051677 2009-03-02 2010-02-05 Electronic component and electronic device WO2010100997A1 (en)

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