WO2009121697A1 - Current-carrying component comprising a carrier, conductor tracks and conductor laminae - Google Patents

Current-carrying component comprising a carrier, conductor tracks and conductor laminae Download PDF

Info

Publication number
WO2009121697A1
WO2009121697A1 PCT/EP2009/052838 EP2009052838W WO2009121697A1 WO 2009121697 A1 WO2009121697 A1 WO 2009121697A1 EP 2009052838 W EP2009052838 W EP 2009052838W WO 2009121697 A1 WO2009121697 A1 WO 2009121697A1
Authority
WO
WIPO (PCT)
Prior art keywords
current
circuit boards
printed circuit
carrying component
conductor
Prior art date
Application number
PCT/EP2009/052838
Other languages
German (de)
French (fr)
Inventor
Harald Gamperl
Boris Thaller
Stefan Holzinger
Franz Knoll
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2009121697A1 publication Critical patent/WO2009121697A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to a current-carrying component which has a non-conducting carrier and one or more conductor tracks provided on this carrier.
  • An alternative is to make a printed circuit board thicker.
  • This has the disadvantage that more copper is used over the entire surface, which is usually not necessary.
  • the etching process for the production of the conductor tracks takes longer and consumes more raw materials.
  • the etching edges do not extend optimally vertically.
  • the printed circuit boards are becoming increasingly undercut with increasing copper height. As a consequence, components with a fine pitch spacing (soldering pads) can not be fitted. These are in particular CPUs and many other ICs, such as CAN drivers.
  • the object of the invention is to provide a suitable for guiding high currents, cost-effective current-carrying component with small dimensions.
  • the advantages of the invention are, in particular, that currents of high current intensities can be transmitted via the interconnects provided on the carrier without the interconnects needing to be unnecessarily wide or high.
  • This advantageously has the consequence that the dimensions of the carrier as well as the dimensions of a device housing in which the carrier is arranged can be kept small.
  • the invention also allows to integrate components with a small pin spacing on the same substrate as the line part.
  • printed circuit boards of identical shape and size are used as printed circuit boards, then these printed circuit boards can be inexpensively manufactured in large numbers and then be fixed on the printed conductors of the respective printed circuit board independently of the respective layout of the printed circuit board.
  • the attachment of the printed circuit boards on the strip conductors in the context of equipping the printed circuit board with SMD components can be carried out by means of a placement machine. Consequently, it does not require separate steps to attach the circuit board on the tracks.
  • Circuit boards are also chosen layout-dependent. This allows an optimal adaptation of the circuit board to the particular application.
  • a preferred embodiment of the invention is to provide a parallel or offset parallel arrangement of the printed circuit board to reduce the electrical resistance of a conductor track.
  • FIG. 1 shows sketches of a current-carrying component according to a first exemplary embodiment of the invention
  • FIG. 2 shows sketches of a current-carrying component according to a second exemplary embodiment of the invention
  • FIG. 3 shows sketches of a current-carrying component according to a third exemplary embodiment of the invention
  • FIG. 4 shows an electrical equivalent circuit diagram of a current-carrying component according to the invention
  • Figure 5 is a diagram for illustrating the advantages of
  • Figure 6 is a sketch of a current-carrying component according to a fourth embodiment of the invention.
  • FIG. 7 shows an electrical equivalent circuit diagram and a side view of a further current-carrying component according to FIG.
  • FIG. 1 shows sketches of a current-carrying component according to a first exemplary embodiment of the invention.
  • the current-carrying component 1 shown in FIG. 1 has a non-conducting carrier 2.
  • a conductor 3 is provided, which has a kink.
  • this conductor 3 are spaced from each other three printed circuit boards 4 are attached.
  • the size and shape of these three circuit boards is identical. They each have a rectangular cross-sectional shape.
  • the carrier 2 consists of a substrate, the conductor 3 and the circuit board 4 each predominantly of copper or other electrically conductive material.
  • a substrate for the carrier 2 for example, hard paper, FR4, ceramics, etc., can be used.
  • FIG. 2 shows sketches of a current-carrying component according to a second exemplary embodiment of the invention.
  • the current-carrying component shown in FIG. 2 has a non-conducting carrier 2.
  • a conductor 3 is provided, which has a kink.
  • a printed circuit board 4 is fixed, the size and shape of which is adapted to the shape of the conductor 3.
  • the printed circuit board 4 as well as the conductor track 3 has a kink.
  • the carrier 2 consists of a substrate, the conductor 3 and the printed circuit board 4 are each predominantly made of copper or another electrically conductive material.
  • FIG. 3 shows sketches of a current-carrying component according to a third exemplary embodiment of the invention.
  • the current-carrying component shown in FIG. 3 has a non-conducting carrier 2.
  • a conductor 3 is provided, which has a kink.
  • On this conductor 3 are spaced from each other a total of five printed circuit boards 4 attached.
  • the shape of these circuit boards is identical.
  • the circuit boards are each formed rectangular. The size of these ser circuit board is different in the present embodiment.
  • the three printed circuit boards arranged at the bottom in FIG. 3 have a greater length and a greater width than the two printed circuit boards arranged at the top in FIG.
  • the carrier 2 consists of a substrate, the conductor 3 and the circuit board 4 each predominantly of copper or other electrically conductive material.
  • the circuit board 4 are offset in parallel. They can also be arranged parallel to one another.
  • additional electrically conductive surfaces which are implemented in the form of printed circuit boards 4, are respectively applied to the conductor track 3 of a carrier 2.
  • These printed circuit boards 4 like conventional SMD components, can be placed onto the respective position on the printed conductor 3 using an automatic placement machine, optionally connected thereto, for example glued, and then soldered to it, for example.
  • the printed circuit board 4 are electrically contacted with the respective conductor track. They contribute to the power supply and thereby relieve the respective track. This allows a transmission of currents of high currents, without that the conductor must be designed widened accordingly.
  • the placement of the conductor track or the conductor tracks of a carrier with the circuit board can be made in an advantageous manner in the same operation, in which also the placement of the carrier takes place with SMD components. Additional further steps are not necessary.
  • the printed circuit board 4 are pressed as well as the SMD components in applied solder paste and soldered as well as the SMD components on the carrier or the conductor track.
  • FIG. 4 shows a simplified electrical equivalent circuit diagram of a current-carrying component according to the invention.
  • the lower resistance line symbolizes the ohms Resistors R (3) in the longitudinal direction of a conductor 3 and the upper resistance line, the ohmic resistors R (4) of the longitudinally spaced apart conductor plates 4. It can be seen that in each case a resistor R (4) of a printed circuit board 4 parallel to each associated resistor R (3) of the conductor track is arranged. As a result, the current fed into the conductor track is divided between the two resistance lines, so that the conductor track 3 is relieved of its current conduction through the printed circuit board 4.
  • Figure 5 is a diagram for illustrating the advantages of the invention.
  • the width b of a conductor track and along the ordinate of the current i fed into the conductor track are recorded. From the diagram it can be seen that in the case of a width bl of
  • Conductor without applied printed circuit board is the maximum possible current il and with applied printed circuit boards, the maximum possible current is i2, where i2 is much greater than il. Furthermore, it is apparent from the diagram that the conductor without a printed circuit board a
  • the straight line K2 is valid, which has a greater slope than the straight line Kl. It is evident borrowed that with a much smaller width bl the same current i2 can be performed.
  • An application of printed circuit boards on a conductor allows it after all, to transmit a much larger current over said strip conductor as without applying the printed circuit board. For the transmission of larger currents, consequently, no broadening of a conductor track is required.
  • FIG. 6 shows a sketch of a current-carrying component according to a fourth exemplary embodiment of the invention.
  • a current-carrying component 1 is provided which comprises a carrier 2, a conductor 3 provided on the carrier and a conductor 3 fixed to the carrier 3.
  • FIG. 7 shows a detailed electrical equivalent circuit diagram and a side view of a further current-carrying component according to the invention.
  • conductor 3 is applied to a carrier 2. With this conductor 3 spaced-apart printed circuit board 4 are soldered. Each of these circuit boards has two solder joints 5 made of solder with the conductor 3.
  • the conductor 3 is made of copper.
  • the height of the conductor 3 is 70 microns.
  • the printed circuit board 4 are also made of copper. Their height is 500 microns each.
  • the associated equivalent circuit diagram is shown in the upper illustration of FIG. 7, the associated equivalent circuit diagram is shown.
  • the lower line symbolizes ohmic resistances, which characterize the 70 ⁇ m high conductor track.
  • Each second of these ohmic resistances is connected in parallel with a series connection of three further ohmic resistors, wherein the two ohmic resistors drawn in the vertical direction characterize the ohmic resistances of the solder joints 5 and wherein the upper ohmic resistance drawn in the horizontal direction characterizes the ohmic resistance of the respective printed circuit board 4.
  • the invention relates to a current-carrying component which has a carrier, one or more conductor tracks provided on the carrier and printed circuit boards attached to the conductor tracks. These circuit boards are preferably placed on the conductor tracks by means of a placement machine and secured thereto. This can be done in the same step, in which by means of the same placement machine and other SMD components are mounted on the carrier.
  • the printed circuit boards are preferably manufactured in standardized sizes which on the one hand have an optimized aspect ratio for soldering (size tolerances, temperature coefficients, distortion, etc.) and, on the other hand, for the automatic placement machine (gripping safety, positionability, placement speed, etc.). Deploying multiple sizes can support a large number of different layouts. Furthermore, the manufacturing costs of printed circuit boards are reduced by the high number of identical parts.
  • Another production alternative would be the stamping of endless material. This would allow platelets of different lengths with the same width or different width but with the same length. The advantage would be that you can adjust the size of the plates more closely to the requirements of a currently available layout.
  • the printed circuit boards serve to relieve the printed conductors in relation to the current conduction.
  • the invention allows a transmission of high currents through the tracks without the need for broadening the tracks. This makes it possible to dimension the housing of an electrical or electronic device, within which the carrier is positioned, small.
  • a further reduction of the electrical resistance of a printed conductor is possible by a parallel arrangement of the additional printed circuit boards.
  • the circuit boards may be realized as platelets of rectangular cross section, platelets of square cross section, platelets of round cross section, in the form of a stamped grid, in the form of domes or in the form of bridges. They can also be integrated part of the carrier.
  • the circuit boards are made of a highly electrically conductive material, preferably copper.
  • the printed circuit boards which are connected in an electrically conductive manner to the printed conductors, are glued, soldered, laser-soldered, welded or laser-welded, for example, to the printed conductors. They can also be inserted in the carrier.
  • the height of the printed circuit boards 4 is 500 ⁇ m in each case. This is only an example. Alternatively, the height of the printed circuit board 4, for example, 200 microns, 300 microns, 400 microns or 1000 microns.
  • the copper layer provided on a printed circuit board can also have different layer thicknesses.
  • Another alternative is to make vias through a trace and the carrier so that traces and leads disposed on the other side of the carrier can be contacted.
  • traces and leads disposed on the other side of the carrier can be contacted.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The invention relates to a current-carrying component having a non-current-conducting carrier and one or more conductor tracks provided on said carrier. Conductor laminae are fixed on at least one of said conductor tracks, said conductor laminae being electrically contact-connected to the respective conductor track. This relieves the loading on the conductor tracks when carrying current. The invention permits placement of components with a small pitch distance, for example CPUs, and permits high currents to be carried on one and the same printed circuit board.

Description

Beschreibung / DescriptionDescription / Description
Stromführungsbauteil mit einem Träger, Leiterbahnen und Lei- terplättchenCurrent-carrying component with a carrier, printed conductors and printed circuit boards
Die Erfindung betrifft ein Stromführungsbauteil, welches einen nicht stromleitenden Träger sowie eine oder mehrere auf diesem Träger vorgesehene Leiterbahnen aufweist.The invention relates to a current-carrying component which has a non-conducting carrier and one or more conductor tracks provided on this carrier.
Es sind bereits Stromführungsbauteile in Form von bestückten Leiterplatten bekannt. Diese weisen einen nichtleitenden Träger auf, auf welchem Leiterbahnen vorgesehen sind. Diese sind mit den Anschlüssen elektrischer Bauteile elektrisch kontaktiert, um die Bauteile in gewünschter Weise miteinander zu verschalten.There are already known power supply components in the form of populated printed circuit boards. These have a non-conductive support on which conductor tracks are provided. These are electrically contacted with the terminals of electrical components in order to interconnect the components in the desired manner.
Bei vielen Anwendungen besteht die Notwendigkeit, über die genannten Leiterbahnen hohe Stromstärken zu übertragen. Um dies zu ermöglichen ist es notwendig, die Leiterbahnen breit auszubilden. Dies hat zur Folge, dass auch der Träger, auf welchem die Leiterbahnen vorgesehen sind, große Abmessungen aufweist. Dies wiederum bedeutet, dass auch das Gehäuse eines elektrischen Gerätes, in welchem das Stromführungsbauteil angeordnet ist, vergleichsweise große Abmessungen aufweisen muss.In many applications, there is a need to transmit high currents through the said tracks. In order to make this possible it is necessary to make the strip conductors wide. This has the consequence that also the carrier on which the conductor tracks are provided, has large dimensions. This in turn means that the housing of an electrical device, in which the current-carrying component is arranged, must also have comparatively large dimensions.
Eine Alternative besteht darin, eine Leiterplatte dicker beschichten zu lassen. Dies hat den Nachteil, dass über die gesamte Fläche vermehrt Kupfer eingesetzt wird, was meist nicht notwendig ist. Außerdem dauert der Ätzprozess zur Herstellung der Leiterbahnen länger und verbraucht mehr Rohstoffe. Ferner verlaufen die Ätzflanken nicht optimal senkrecht. Die Leiterplatten werden mit zunehmender Kupferhöhe immer stärker unterätzt. In weiterer Folge können Bauteile mit feinem Pitch- abstand (Lötpads) nicht bestückt werden. Dabei handelt es sich insbesondere um CPUs und viele andere ICs, beispielsweise CAN-Treiber. Die Aufgabe der Erfindung besteht darin, ein zur Führung hoher Stromstärken geeignetes, kostengünstiges Stromführungsbauteil mit kleinen Abmessungen anzugeben.An alternative is to make a printed circuit board thicker. This has the disadvantage that more copper is used over the entire surface, which is usually not necessary. In addition, the etching process for the production of the conductor tracks takes longer and consumes more raw materials. Furthermore, the etching edges do not extend optimally vertically. The printed circuit boards are becoming increasingly undercut with increasing copper height. As a consequence, components with a fine pitch spacing (soldering pads) can not be fitted. These are in particular CPUs and many other ICs, such as CAN drivers. The object of the invention is to provide a suitable for guiding high currents, cost-effective current-carrying component with small dimensions.
Diese Aufgabe wird durch ein Stromführungsbauteil mit den im Anspruch 1 angegebenen Merkmalen gelöst. Vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung sind in den abhängigen Ansprüchen angegeben.This object is achieved by a current-carrying component having the features specified in claim 1. Advantageous embodiments and further developments of the invention are specified in the dependent claims.
Die Vorteile der Erfindung bestehen insbesondere darin, dass über die auf dem Träger vorgesehenen Leiterbahnen Ströme hoher Stromstärken übertragen werden können, ohne dass die Leiterbahnen unnötig breit oder hoch ausgelegt werden müssen. Dies hat in vorteilhafter Weise zur Folge, dass auch die Ab- messungen des Trägers sowie die Abmessungen eines Gerätegehäuses, in welchem der Träger angeordnet ist, klein gehalten werden können. Ferner erlaubt es die Erfindung auch, Bauteile mit geringem Pinabstand auf demselben Substrat wie den Leitungsteil zu integrieren.The advantages of the invention are, in particular, that currents of high current intensities can be transmitted via the interconnects provided on the carrier without the interconnects needing to be unnecessarily wide or high. This advantageously has the consequence that the dimensions of the carrier as well as the dimensions of a device housing in which the carrier is arranged can be kept small. Furthermore, the invention also allows to integrate components with a small pin spacing on the same substrate as the line part.
Werden als Leiterplättchen ausschließlich Leiterplättchen übereinstimmender Form und Größe verwendet, dann können diese Leiterplättchen kostengünstig in großer Stückzahl hergestellt und dann unabhängig vom jeweils vorliegenden Layout der Lei- terplatte auf den Leiterbahnen der jeweiligen Leiterplatte befestigt werden.If only printed circuit boards of identical shape and size are used as printed circuit boards, then these printed circuit boards can be inexpensively manufactured in large numbers and then be fixed on the printed conductors of the respective printed circuit board independently of the respective layout of the printed circuit board.
In vorteilhafter Weise kann die Befestigung der Leiterplättchen auf den Leiterbahnen im Rahmen der Bestückung der Lei- terplatte mit SMD-Bauteilen mittels eines Bestückungsautomaten vorgenommen werden. Folglich bedarf es zur Befestigung der Leiterplättchen auf den Leiterbahnen keiner gesonderten Arbeitsschritte .In an advantageous manner, the attachment of the printed circuit boards on the strip conductors in the context of equipping the printed circuit board with SMD components can be carried out by means of a placement machine. Consequently, it does not require separate steps to attach the circuit board on the tracks.
Gemäß einer alternativen Ausführungsform kann die Form derAccording to an alternative embodiment, the shape of the
Leiterplättchen auch layoutabhängig gewählt werden. Dies ermöglicht eine optimale Anpassung der Leiterplättchen an den jeweils vorliegenden Anwendungsfall. Eine bevorzugte Ausgestaltung der Erfindung besteht darin, zu einer Reduzierung des elektrischen Widerstandes einer Leiterbahn eine parallele oder versetzt parallele Anordnung der Leiterplättchen vorzusehen.Circuit boards are also chosen layout-dependent. This allows an optimal adaptation of the circuit board to the particular application. A preferred embodiment of the invention is to provide a parallel or offset parallel arrangement of the printed circuit board to reduce the electrical resistance of a conductor track.
Weitere vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung ergeben sich aus deren nachfolgender Erläuterung anhand der Figuren. Es zeigtFurther advantageous embodiments and modifications of the invention will become apparent from the following explanation with reference to FIGS. It shows
Figur 1 Skizzen eines Stromführungsbauteils gemäß einem ersten Ausführungsbeispiel für die Erfindung,FIG. 1 shows sketches of a current-carrying component according to a first exemplary embodiment of the invention,
Figur 2 Skizzen eines Stromführungsbauteils gemäß einem zwei- ten Ausführungsbeispiel für die Erfindung,2 shows sketches of a current-carrying component according to a second exemplary embodiment of the invention, FIG.
Figur 3 Skizzen eines Stromführungsbauteils gemäß einem dritten Ausführungsbeispiel für die Erfindung,FIG. 3 shows sketches of a current-carrying component according to a third exemplary embodiment of the invention,
Figur 4 ein elektrisches Ersatzschaltbild eines Stromführungsbauteils gemäß der Erfindung,FIG. 4 shows an electrical equivalent circuit diagram of a current-carrying component according to the invention,
Figur 5 ein Diagramm zur Veranschaulichung der Vorteile derFigure 5 is a diagram for illustrating the advantages of
Erfindung,Invention,
Figur 6 eine Skizze eines Stromführungsbauteils gemäß einem vierten Ausführungsbeispiel für die Erfindung undFigure 6 is a sketch of a current-carrying component according to a fourth embodiment of the invention and
Figur 7 ein elektrisches Ersatzschaltbild und eine Seitenan- sieht eines weiteren Stromführungsbauteils gemäß derFIG. 7 shows an electrical equivalent circuit diagram and a side view of a further current-carrying component according to FIG
Erfindung.Invention.
Die Figur 1 zeigt Skizzen eines Stromführungsbauteils gemäß einem ersten Ausführungsbeispiel für die Erfindung. Dabei ist auf der linken Seite von Figur 1 eine Aufrissdarstellung und auf der rechten Seite von Figur 1 eine Querschnittsdarstellung gezeigt. Das in der Figur 1 gezeigte Stromführungsbauteil 1 weist einen nicht stromleitenden Träger 2 auf. Auf diesem Träger 2 ist eine Leiterbahn 3 vorgesehen, die einen Knick aufweist. Auf dieser Leiterbahn 3 sind voneinander beabstandet drei Leiterplättchen 4 befestigt. Die Größe und Form dieser drei Leiterplättchen ist identisch. Sie weisen jeweils eine rechteckige Querschnittsform auf. Der Träger 2 besteht aus einem Substrat, die Leiterbahn 3 und die Leiterplättchen 4 jeweils zum überwiegenden Teil aus Kupfer oder einem sonstigen elektrisch leitfähigen Material. Als Substrat für den Träger 2 kann beispielsweise Hartpapier, FR4, Kera- mik, usw., verwendet werden.FIG. 1 shows sketches of a current-carrying component according to a first exemplary embodiment of the invention. Here, on the left side of Figure 1 is an elevational view and on the right side of Figure 1 is a cross-sectional view. The current-carrying component 1 shown in FIG. 1 has a non-conducting carrier 2. On this carrier 2, a conductor 3 is provided, which has a kink. On this conductor 3 are spaced from each other three printed circuit boards 4 are attached. The size and shape of these three circuit boards is identical. They each have a rectangular cross-sectional shape. The carrier 2 consists of a substrate, the conductor 3 and the circuit board 4 each predominantly of copper or other electrically conductive material. As a substrate for the carrier 2, for example, hard paper, FR4, ceramics, etc., can be used.
Die Figur 2 zeigt Skizzen eines Stromführungsbauteils gemäß einem zweiten Ausführungsbeispiel für die Erfindung. Dabei ist auf der linken Seite von Figur 2 eine Aufrissdarstellung und auf der rechten Seite von Figur 2 eine Querschnittsdarstellung gezeigt. Das in der Figur 2 gezeigte Stromführungsbauteil weist einen nicht stromleitenden Träger 2 auf. Auf diesem Träger 2 ist eine Leiterbahn 3 vorgesehen, die einen Knick aufweist. Auf dieser Leiterbahn 3 ist ein Leiterplätt- chen 4 befestigt, dessen Größe und Form an die Form der Leiterbahn 3 angepasst ist. Beim gezeigten Ausführungsbeispiel weist das Leiterplättchen 4 ebenso wie die Leiterbahn 3 einen Knick auf. Der Träger 2 besteht aus einem Substrat, die Leiterbahn 3 und das Leiterplättchen 4 jeweils zum überwiegenden Teil aus Kupfer oder einem sonstigen elektrisch leitfähigen Material .FIG. 2 shows sketches of a current-carrying component according to a second exemplary embodiment of the invention. In this case, on the left side of Figure 2 is an elevational view and on the right side of Figure 2 is shown a cross-sectional view. The current-carrying component shown in FIG. 2 has a non-conducting carrier 2. On this support 2, a conductor 3 is provided, which has a kink. On this conductor 3, a printed circuit board 4 is fixed, the size and shape of which is adapted to the shape of the conductor 3. In the embodiment shown, the printed circuit board 4 as well as the conductor track 3 has a kink. The carrier 2 consists of a substrate, the conductor 3 and the printed circuit board 4 are each predominantly made of copper or another electrically conductive material.
Die Figur 3 zeigt Skizzen eines Stromführungsbauteils gemäß einem dritten Ausführungsbeispiel für die Erfindung. Dabei ist auf der linken Seite von Figur 3 eine Aufrissdarstellung und auf der rechten Seite von Figur 3 eine Querschnittsdarstellung gezeigt. Das in der Figur 3 gezeigte Stromführungsbauteil weist einen nicht stromleitenden Träger 2 auf. Auf diesem Träger 2 ist eine Leiterbahn 3 vorgesehen, die einen Knick aufweist. Auf dieser Leiterbahn 3 sind voneinander beabstandet insgesamt fünf Leiterplättchen 4 befestigt. Die Form dieser Leiterplättchen ist identisch. Die Leiterplättchen sind jeweils rechteckförmig ausgebildet. Die Größe die- ser Leiterplättchen ist beim vorliegenden Ausführungsbeispiel unterschiedlich. Die drei in der Figur 3 unten angeordneten Leiterplättchen haben eine größere Länge und eine größere Breite als die beiden in der Figur 3 oben angeordneten Lei- terplättchen . Der Träger 2 besteht aus einem Substrat, die Leiterbahn 3 und die Leiterplättchen 4 jeweils zum überwiegenden Teil aus Kupfer oder einem sonstigen elektrisch leitfähigen Material. Die Leiterplättchen 4 sind versetzt parallel angeordnet. Sie können auch parallel zueinander angeord- net sein.FIG. 3 shows sketches of a current-carrying component according to a third exemplary embodiment of the invention. Here, on the left side of Figure 3 is an elevational view and on the right side of Figure 3 is shown a cross-sectional view. The current-carrying component shown in FIG. 3 has a non-conducting carrier 2. On this support 2, a conductor 3 is provided, which has a kink. On this conductor 3 are spaced from each other a total of five printed circuit boards 4 attached. The shape of these circuit boards is identical. The circuit boards are each formed rectangular. The size of these ser circuit board is different in the present embodiment. The three printed circuit boards arranged at the bottom in FIG. 3 have a greater length and a greater width than the two printed circuit boards arranged at the top in FIG. The carrier 2 consists of a substrate, the conductor 3 and the circuit board 4 each predominantly of copper or other electrically conductive material. The circuit board 4 are offset in parallel. They can also be arranged parallel to one another.
Wie aus den Figuren 1 - 3 ersichtlich ist, werden auf die Leiterbahn 3 eines Trägers 2 jeweils zusätzliche elektrisch leitende Flächen aufgebracht, die in Form von Leiterplättchen 4 realisiert sind. Diese Leiterplättchen 4 können ebenso wie herkömmliche SMD-Bauteile unter Verwendung eines Bestückungsautomaten auf die jeweilige Position auf der Leiterbahn 3 aufgesetzt, optional mit dieser verbunden, beispielsweise verklebt, und danach mit dieser beispielsweise verlötet wer- den. Dadurch sind die Leiterplättchen 4 mit der jeweiligen Leiterbahn elektrisch kontaktiert. Sie tragen zur Stromführung bei und entlasten dadurch die jeweilige Leiterbahn. Dies erlaubt eine Übertragung von Strömen hoher Stromstärken, ohne dass die Leiterbahn entsprechend verbreitert ausgebildet sein muss.As can be seen from FIGS. 1 to 3, additional electrically conductive surfaces, which are implemented in the form of printed circuit boards 4, are respectively applied to the conductor track 3 of a carrier 2. These printed circuit boards 4, like conventional SMD components, can be placed onto the respective position on the printed conductor 3 using an automatic placement machine, optionally connected thereto, for example glued, and then soldered to it, for example. As a result, the printed circuit board 4 are electrically contacted with the respective conductor track. They contribute to the power supply and thereby relieve the respective track. This allows a transmission of currents of high currents, without that the conductor must be designed widened accordingly.
Die Bestückung der Leiterbahn bzw. der Leiterbahnen eines Trägers mit den Leiterplättchen kann in vorteilhafter Weise in demselben Arbeitsgang vorgenommen werden, in welchem auch die Bestückung des Trägers mit SMD-Bauteilen erfolgt. Zusätzliche weitere Arbeitsschritte sind nicht notwendig. Die Leiterplättchen 4 werden ebenso wie die SMD-Bauteile in aufgebrachte Lotpaste gedrückt und ebenso wie die SMD-Bauteile auf dem Träger bzw. der Leiterbahn verlötet.The placement of the conductor track or the conductor tracks of a carrier with the circuit board can be made in an advantageous manner in the same operation, in which also the placement of the carrier takes place with SMD components. Additional further steps are not necessary. The printed circuit board 4 are pressed as well as the SMD components in applied solder paste and soldered as well as the SMD components on the carrier or the conductor track.
Die Figur 4 zeigt ein vereinfachtes elektrisches Ersatzschaltbild eines Stromführungsbauteils gemäß der Erfindung. Dabei symbolisiert die untere Widerstandszeile die Ohmschen Widerstände R (3) in Längsrichtung einer Leiterbahn 3 und die obere Widerstandszeile die Ohmschen Widerstände R (4) der in Längsrichtung voneinander beabstandeten Leiterplättchen 4. Es ist ersichtlich, dass jeweils ein Widerstand R(4) eines Lei- terplättchens 4 parallel zu einem jeweils zugehörigen Widerstand R (3) der Leiterbahn angeordnet ist. Dadurch wird der in die Leiterbahn eingespeiste Strom auf die beiden Widerstandszeilen aufgeteilt, so dass die Leiterbahn 3 bezüglich ihrer Stromführung durch die Leiterplättchen 4 entlastet wird.FIG. 4 shows a simplified electrical equivalent circuit diagram of a current-carrying component according to the invention. The lower resistance line symbolizes the ohms Resistors R (3) in the longitudinal direction of a conductor 3 and the upper resistance line, the ohmic resistors R (4) of the longitudinally spaced apart conductor plates 4. It can be seen that in each case a resistor R (4) of a printed circuit board 4 parallel to each associated resistor R (3) of the conductor track is arranged. As a result, the current fed into the conductor track is divided between the two resistance lines, so that the conductor track 3 is relieved of its current conduction through the printed circuit board 4.
Die Figur 5 zeigt ein Diagramm zur Veranschaulichung der Vorteile der Erfindung. In diesem Diagramm ist längs der Abszisse die Breite b einer Leiterbahn und längs der Ordinate der in die Leiterbahn eingespeiste Strom i aufgezeichnet. Aus dem Diagramm ist ersichtlich, dass im Falle einer Breite bl derFigure 5 is a diagram for illustrating the advantages of the invention. In this diagram, along the abscissa, the width b of a conductor track and along the ordinate of the current i fed into the conductor track are recorded. From the diagram it can be seen that in the case of a width bl of
Leiterbahn ohne aufgebrachte Leiterplättchen der maximal mögliche Strom il beträgt und mit aufgebrachten Leiterplättchen der maximal mögliche Strom i2 beträgt, wobei i2 wesentlich größer als il ist. Des Weiteren geht aus dem Diagramm hervor, dass die Leiterbahn ohne aufgebrachte Leiterplättchen eineConductor without applied printed circuit board is the maximum possible current il and with applied printed circuit boards, the maximum possible current is i2, where i2 is much greater than il. Furthermore, it is apparent from the diagram that the conductor without a printed circuit board a
Breite von b2 aufweisen muss, um den Strom i2 führen zu können. Durch die Verringerung des Widerstands durch das Aufbringen der Leiterplättchen wird die Gerade K2 gültig, die eine größere Steigung hat als die Gerade Kl. Es ist ersicht- lieh, dass mit einer wesentlich kleineren Breite bl derselbe Strom i2 geführt werden kann. Ein Aufbringen von Leiterplättchen auf eine Leiterbahn erlaubt es nach alledem, über die genannte Leiterbahn einen wesentlich größeren Strom zu übertragen als ohne Aufbringen der Leiterplättchen. Zur Übertra- gung größerer Ströme bedarf es folglich keiner Verbreiterung einer Leiterbahn.Width of b2 in order to carry current i2. By reducing the resistance by applying the printed circuit board, the straight line K2 is valid, which has a greater slope than the straight line Kl. It is evident borrowed that with a much smaller width bl the same current i2 can be performed. An application of printed circuit boards on a conductor allows it after all, to transmit a much larger current over said strip conductor as without applying the printed circuit board. For the transmission of larger currents, consequently, no broadening of a conductor track is required.
Die Figur 6 zeigt eine Skizze eines Stromführungsbauteils gemäß einem vierten Ausführungsbeispiel für die Erfindung. Bei diesem Ausführungsbeispiel ist ein Stromführungsbauteil 1 vorgesehen, welches einen Träger 2, eine auf dem Träger vorgesehene Leiterbahn 3 und ein auf der Leiterbahn 3 befestig- tes Leiterplättchen 4 aufweist, wobei dieses Leiterplättchen gitterförmig ausgebildet ist.FIG. 6 shows a sketch of a current-carrying component according to a fourth exemplary embodiment of the invention. In this embodiment, a current-carrying component 1 is provided which comprises a carrier 2, a conductor 3 provided on the carrier and a conductor 3 fixed to the carrier 3. Tes printed circuit board 4, wherein this conductor plate is formed lattice-shaped.
Die Figur 7 zeigt ein detailliertes elektrisches Ersatz- Schaltbild und eine Seitenansicht eines weiteren Stromführungsbauteils gemäß der Erfindung.FIG. 7 shows a detailed electrical equivalent circuit diagram and a side view of a further current-carrying component according to the invention.
Bei diesem weiteren Stromführungsbauteil ist - wie aus der unteren Darstellung von Figur 7 ersichtlich ist - auf einen Träger 2 eine Leiterbahn 3 aufgebracht. Mit dieser Leiterbahn 3 sind voneinander beabstandete Leiterplättchen 4 verlötet. Jedes dieser Leiterplättchen weist zwei aus Lötzinn bestehende Lötverbindungen 5 mit der Leiterbahn 3 auf. Die Leiterbahn 3 besteht aus Kupfer. Die Höhe der Leiterbahn 3 beträgt 70 μm. Die Leiterplättchen 4 bestehen ebenfalls aus Kupfer. Ihre Höhe beträgt jeweils 500 μm.In this further current-carrying component-as can be seen from the lower illustration of FIG. 7-a conductor 3 is applied to a carrier 2. With this conductor 3 spaced-apart printed circuit board 4 are soldered. Each of these circuit boards has two solder joints 5 made of solder with the conductor 3. The conductor 3 is made of copper. The height of the conductor 3 is 70 microns. The printed circuit board 4 are also made of copper. Their height is 500 microns each.
In der oberen Darstellung von Figur 7 ist das zugehörige Ersatzschaltbild gezeigt. Darin symbolisiert die untere Zeile Ohmsche Widerstände, die die 70 μm hohe Leiterbahn charakterisieren. Jedem zweiten dieser Ohmschen Widerstände ist eine Reihenschaltung von drei weiteren Ohmschen Widerständen parallelgeschaltet, wobei die beiden in Vertikalrichtung gezeichneten Ohmschen Widerstände die Ohmschen Widerstände der Lötverbindungen 5 charakterisieren und wobei der obere, in Horizontalrichtung gezeichnete Ohmsche Widerstand den Ohmschen Widerstand des jeweiligen Leiterplättchens 4 charakterisiert .In the upper illustration of FIG. 7, the associated equivalent circuit diagram is shown. In it, the lower line symbolizes ohmic resistances, which characterize the 70 μm high conductor track. Each second of these ohmic resistances is connected in parallel with a series connection of three further ohmic resistors, wherein the two ohmic resistors drawn in the vertical direction characterize the ohmic resistances of the solder joints 5 and wherein the upper ohmic resistance drawn in the horizontal direction characterizes the ohmic resistance of the respective printed circuit board 4.
Die Erfindung betrifft nach alledem ein Stromführungsbauteil, welches einen Träger, eine oder mehrere auf dem Träger vorgesehene Leiterbahnen und auf den Leiterbahnen befestigte Leiterplättchen aufweist. Diese Leiterplättchen werden vorzugsweise mittels eines Bestückungsautomaten auf die Leiterbahnen aufgesetzt und auf diesen befestigt. Dies kann im Rahmen desselben Arbeitsschrittes erfolgen, in welchem mittels desselben Bestückungsautomaten auch weitere SMD-Bauteile auf dem Träger befestigt werden. Die Leiterplättchen werden vorzugsweise in standardisierten Größen gefertigt, die einerseits ein für das Löten (Größentoleranzen, Temperaturkoeffizienten, Verwindung, etc) und ande- rerseits für den Bestückungsautomaten (GreifSicherheit, Posi- tionierbarkeit, Bestückgeschwindigkeit, etc) optimiertes Seitenverhältnis haben. Durch die Bereitstellung mehrerer Größen kann eine große Anzahl von unterschiedlichen Layouts unterstützt werden. Des weiteren sinken die Herstellungskosten der Leiterplättchen durch die hohe Stückzahl gleicher Teile.After all, the invention relates to a current-carrying component which has a carrier, one or more conductor tracks provided on the carrier and printed circuit boards attached to the conductor tracks. These circuit boards are preferably placed on the conductor tracks by means of a placement machine and secured thereto. This can be done in the same step, in which by means of the same placement machine and other SMD components are mounted on the carrier. The printed circuit boards are preferably manufactured in standardized sizes which on the one hand have an optimized aspect ratio for soldering (size tolerances, temperature coefficients, distortion, etc.) and, on the other hand, for the automatic placement machine (gripping safety, positionability, placement speed, etc.). Deploying multiple sizes can support a large number of different layouts. Furthermore, the manufacturing costs of printed circuit boards are reduced by the high number of identical parts.
Eine weitere Fertigungsalternative wäre das Abstanzen von Endlosmaterial. Damit wären Plättchen unterschiedlicher Länge bei gleicher Breite oder unterschiedlicher Breite bei glei- eher Länge möglich. Der Vorteil wäre, dass man die Größe der Plättchen genauer an die Anforderungen eines aktuell vorliegenden Layouts anpassen kann.Another production alternative would be the stamping of endless material. This would allow platelets of different lengths with the same width or different width but with the same length. The advantage would be that you can adjust the size of the plates more closely to the requirements of a currently available layout.
Die Leiterplättchen dienen einer Entlastung der Leiterbahnen in Bezug auf die Stromführung. Insbesondere erlaubt die Erfindung eine Übertragung hoher Stromstärken über die Leiterbahnen, ohne dass es einer Verbreiterung der Leiterbahnen bedarf. Dies ermöglicht es, auch das Gehäuse eines elektrischen oder elektronischen Gerätes, innerhalb dessen der Träger po- sitioniert ist, klein zu dimensionieren.The printed circuit boards serve to relieve the printed conductors in relation to the current conduction. In particular, the invention allows a transmission of high currents through the tracks without the need for broadening the tracks. This makes it possible to dimension the housing of an electrical or electronic device, within which the carrier is positioned, small.
Eine weitere Reduzierung des elektrischen Widerstandes einer Leiterbahn ist durch eine Parallelanordnung der zusätzlichen Leiterplättchen möglich.A further reduction of the electrical resistance of a printed conductor is possible by a parallel arrangement of the additional printed circuit boards.
Die Leiterplättchen können als Plättchen mit rechteckigem Querschnitt, als Plättchen mit quadratischem Querschnitt, als Plättchen mit rundem Querschnitt, in Form eines Stanzgitters, in Form von Domen oder in Form von Brücken realisiert sein. Sie können auch integrierter Bestandteil des Trägers sein.The circuit boards may be realized as platelets of rectangular cross section, platelets of square cross section, platelets of round cross section, in the form of a stamped grid, in the form of domes or in the form of bridges. They can also be integrated part of the carrier.
Die Leiterplättchen bestehen aus einem elektrisch gut leitenden Material, vorzugsweise aus Kupfer. Die mit den Leiterbahnen elektrisch leitend verbundenen Lei- terplättchen sind beispielsweise mit den Leiterbahnen verklebt, verlötet, laserverlötet, verschweißt oder laserver- schweißt. Sie können auch in den Träger eingelegt sein.The circuit boards are made of a highly electrically conductive material, preferably copper. The printed circuit boards, which are connected in an electrically conductive manner to the printed conductors, are glued, soldered, laser-soldered, welded or laser-welded, for example, to the printed conductors. They can also be inserted in the carrier.
Im Zusammenhang mit der Figur 7 wurde angegeben, dass die Höhe der Leiterplättchen 4 jeweils 500 μm beträgt. Dies ist nur beispielhaft zu sehen. Alternativ dazu kann die Höhe der Lei- terplättchen 4 beispielsweise auch 200 μm, 300 μm, 400 μm oder 1000 μm betragen. Auch die auf einer Leiterplatte vorgesehene Kupferschicht kann unterschiedliche Schichtstärken aufweisen .In connection with FIG. 7, it was stated that the height of the printed circuit boards 4 is 500 μm in each case. This is only an example. Alternatively, the height of the printed circuit board 4, for example, 200 microns, 300 microns, 400 microns or 1000 microns. The copper layer provided on a printed circuit board can also have different layer thicknesses.
Eine weitere Alternative besteht darin, durch eine Leiterbahn und den Träger hindurch Durchkontaktierungen vorzunehmen, so dass auf der anderen Seite des Trägers angeordnete Leiterbahnen und Leiterplättchen kontaktiert werden können. Dadurch ist eine Parallelschaltung von Leiterbahnen und Leiterplätt- chen möglich, durch welche die Stromtragfähigkeit weiter erhöht wird. Another alternative is to make vias through a trace and the carrier so that traces and leads disposed on the other side of the carrier can be contacted. As a result, a parallel connection of printed conductors and printed circuit boards is possible, by means of which the current carrying capacity is further increased.

Claims

Patentansprüche / Patent Claims Claims / Patent Claims
1. Stromführungsbauteil, welches einen nicht stromleitenden Träger und eine oder mehrere auf diesem Träger vorgesehene Leiterbahnen aufweist, d a d u r c h g e k e n n z e i c h n e t , dass auf mindestens einer dieser Leiterbahnen Leiterplättchen (4) befestigt sind und die Leiterplättchen mit der jeweiligen Leiterbahn (3) elektrisch kontaktiert sind.1. Current-carrying component, which has a non-current-carrying carrier and one or more provided on this carrier tracks, that at least one of these tracks printed circuit boards (4) are fixed and the circuit boards are electrically contacted with the respective conductor track (3).
2. Stromführungsbauteil nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass eine, mehrere oder alle Leiterplättchen (4) eine rechteckige Querschnittsform aufweisen.2. Current-carrying component according to claim 1, characterized in that one, several or all printed circuit boards (4) have a rectangular cross-sectional shape.
3. Stromführungsbauteil nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass eines, mehrere oder alle Leiterplättchen eine runde oder ovale Querschnittsform aufweisen.3. Current-carrying component according to claim 1, characterized in that one, several or all circuit boards have a round or oval cross-sectional shape.
4. Stromführungsbauteil nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass eines, mehrere oder alle Leiterplättchen gitterförmig ausgebildet sind.4. Current-carrying component according to claim 1, characterized in that one, several or all circuit boards are formed in a lattice-shaped manner.
5. Stromführungsbauteil nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass eines, mehrere oder alle Leiterplättchen in Form von Domen ausgebildet sind.5. Current-carrying component according to claim 1, characterized in that one, several or all circuit boards are formed in the form of domes.
6. Stromführungsbauteil nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass eines, mehrere oder alle Leiterplättchen brückenförmig ausgebildet sind. 6. current-carrying component according to claim 1, characterized in that one, several or all circuit boards are formed bridge-shaped.
7. Stromführungsbauteil nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , dass eines, mehrere oder alle Leiterplättchen integrierter Bestandteil des Trägers (2) sind.7. Current-carrying component according to claim 1, characterized in that one, several or all printed circuit boards are an integral part of the carrier (2).
8. Stromführungsbauteil nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass die Leiterplättchen (4) jeweils aus einem elektrisch leitfähigen Material bestehen, welches einen hohen Anteil an Kupfer, Gold, Silber oder eine leitfähige Legierung aufweist.8. Current-carrying component according to one of the preceding claims, in which the printed circuit boards (4) each consist of an electrically conductive material which has a high proportion of copper, gold, silver or a conductive alloy.
9. Stromführungsbauteil nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass alle Leiterplättchen (4) dieselbe Form aufweisen.9. Current-carrying component according to one of the preceding claims, characterized in that all printed circuit boards (4) have the same shape.
10. Stromführungsbauteil nach einem der Ansprüche 1 bis 8, d a d u r c h g e k e n n z e i c h n e t , dass die Leiterplättchen (4) mindestens zwei unterschiedliche Formen aufweisen.10. Current-carrying component according to one of claims 1 to 8, d a d e r c h e c e n e c e in that the printed circuit boards (4) have at least two different shapes.
11. Stromführungsbauteil nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass alle Leiterplättchen dieselben Abmessungen aufweisen.11. Current-carrying component according to one of the preceding claims, characterized in that all printed circuit boards have the same dimensions.
12. Stromführungsbauteil nach einem der Ansprüche 1 bis 10, d a d u r c h g e k e n n z e i c h n e t , dass die Leiterplättchen mindestens zwei unterschiedliche Abmessungen aufweisen.12. Current-carrying component according to one of claims 1 to 10, d a d e r c h e c e n e c e s in that the printed circuit boards have at least two different dimensions.
13. Stromführungsbauteil nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass die Leiterplättchen mit der jeweiligen Leiterbahn verklebt, verlötet oder verschweißt sind und/oder in den Träger eingelegt sind. 13. Current-carrying component according to one of the preceding claims, characterized in that the printed circuit boards are glued, soldered or welded to the respective conductor track and / or inserted into the carrier.
PCT/EP2009/052838 2008-04-01 2009-03-11 Current-carrying component comprising a carrier, conductor tracks and conductor laminae WO2009121697A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008016661.8 2008-04-01
DE102008016661 2008-04-01

Publications (1)

Publication Number Publication Date
WO2009121697A1 true WO2009121697A1 (en) 2009-10-08

Family

ID=40639753

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/052838 WO2009121697A1 (en) 2008-04-01 2009-03-11 Current-carrying component comprising a carrier, conductor tracks and conductor laminae

Country Status (1)

Country Link
WO (1) WO2009121697A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012113762A1 (en) * 2011-02-22 2012-08-30 Continental Automotive Gmbh High current-carrying printed circuit board and method for producing said printed circuit board
EP2699065A1 (en) * 2012-06-18 2014-02-19 Sanyo Electric Co., Ltd Circuit substrate
DE102013220162A1 (en) * 2013-10-07 2015-04-23 Robert Bosch Gmbh Wiring member
WO2015082267A1 (en) 2013-12-02 2015-06-11 Delphi France Sas Method for producing a power printed circuit and power printed circuit obtained by this method
DE102011102484B4 (en) * 2011-05-24 2020-03-05 Jumatech Gmbh Printed circuit board with molded part and process for its production

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154958A1 (en) * 1971-11-05 1973-05-10 Nordmende SAFETY LOSS POINT IN HIGH VOLTAGE CONDUCTORS IN PRINTED CIRCUITS
US4694123A (en) * 1982-01-13 1987-09-15 Elxsi Backplane power connector system
EP0375428A1 (en) * 1988-12-22 1990-06-27 Texas Instruments Incorporated System for enhancing current carrying capacity of printed wiring board
DE4425803A1 (en) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Printed circuit board
US6401332B1 (en) * 1997-02-17 2002-06-11 Magnetek S.P.A. Processing printed circuits and printed circuits thus obtained
US6683669B1 (en) * 1999-08-06 2004-01-27 Sharp Kabushiki Kaisha Apparatus and method for fabricating substrate of a liquid crystal display device and interconnects therein
US20070045816A1 (en) * 2004-01-06 2007-03-01 International Business Machines Corporation Electronic package with improved current carrying capability and method of forming the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154958A1 (en) * 1971-11-05 1973-05-10 Nordmende SAFETY LOSS POINT IN HIGH VOLTAGE CONDUCTORS IN PRINTED CIRCUITS
US4694123A (en) * 1982-01-13 1987-09-15 Elxsi Backplane power connector system
EP0375428A1 (en) * 1988-12-22 1990-06-27 Texas Instruments Incorporated System for enhancing current carrying capacity of printed wiring board
DE4425803A1 (en) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Printed circuit board
US6401332B1 (en) * 1997-02-17 2002-06-11 Magnetek S.P.A. Processing printed circuits and printed circuits thus obtained
US6683669B1 (en) * 1999-08-06 2004-01-27 Sharp Kabushiki Kaisha Apparatus and method for fabricating substrate of a liquid crystal display device and interconnects therein
US20070045816A1 (en) * 2004-01-06 2007-03-01 International Business Machines Corporation Electronic package with improved current carrying capability and method of forming the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012113762A1 (en) * 2011-02-22 2012-08-30 Continental Automotive Gmbh High current-carrying printed circuit board and method for producing said printed circuit board
CN103477724A (en) * 2011-02-22 2013-12-25 大陆汽车有限公司 High current-carrying printed circuit board and method for producing said printed circuit board
US9456491B2 (en) 2011-02-22 2016-09-27 Continental Automotive Gmbh High current-carrying printed circuit board and method for producing said printed circuit board
DE102011102484B4 (en) * 2011-05-24 2020-03-05 Jumatech Gmbh Printed circuit board with molded part and process for its production
US10736214B2 (en) 2011-05-24 2020-08-04 Jumatech Gmbh Printed circuit board having a molded part and method for the production thereof
EP2699065A1 (en) * 2012-06-18 2014-02-19 Sanyo Electric Co., Ltd Circuit substrate
EP2699065A4 (en) * 2012-06-18 2014-08-13 Sanyo Electric Co Circuit substrate
DE102013220162A1 (en) * 2013-10-07 2015-04-23 Robert Bosch Gmbh Wiring member
WO2015082267A1 (en) 2013-12-02 2015-06-11 Delphi France Sas Method for producing a power printed circuit and power printed circuit obtained by this method

Similar Documents

Publication Publication Date Title
DE60131677T2 (en) I-CHANNEL SURFACE MOUNT CONNECTOR
DE69017424T2 (en) BRACKET FOR A HIGH-SPEED CCD SENSOR WITH IMPROVED SIGNAL NOISE LEVEL OPERATION AND THERMAL CONTACT.
EP3095307B1 (en) Printed circuit board, circuit, and method for the production of a circuit
DE102011088322A1 (en) A connection system for electrically connecting electrical devices and method for connecting an electrically conductive first terminal and an electrically conductive second terminal
WO2009121697A1 (en) Current-carrying component comprising a carrier, conductor tracks and conductor laminae
DE60007203T2 (en) Contacting structure for circuits of a connection block
DE19516547A1 (en) Printed circuit board with an electrically conductive layer and method for producing a printed circuit board
DE60128537T2 (en) ASSEMBLY TO CONNECT AT LEAST TWO PRINTED CIRCUITS
DE20117650U1 (en) Surface mount electrical resistance
DE102010027149A1 (en) Bendable metal core board
EP0026839B1 (en) Flexible printed circuit
DE10001180B4 (en) A double-sided pattern connection component, printed circuit board, and method of connecting connection patterns formed on both sides of a printed circuit board
WO2012171565A1 (en) Electrical contact device for connecting circuit boards
DE60201537T2 (en) ELECTRICAL CONNECTION ARRANGEMENT FOR ELECTRONIC COMPONENTS
DE102007005824A1 (en) Connecting element for a double-sided circuit board
EP2149281B1 (en) Illumination device and projection device with such an illumination device
DE102004049575A1 (en) Electrical terminal for connecting conductor cable to PCB, has terminal unit provided for pressing in conductor cable for electrical link of conductor cable, where terminal unit is designed as spike
DE102016101757A1 (en) CIRCUIT MODULE WITH SURFACE MOUNTABLE SURFACE BLOCKS FOR CONNECTING A PCB
DE202004021564U1 (en) Connecting element for printed circuit boards
DE112015005933T5 (en) Electronic control device
EP0144413A1 (en) Printed board for the surface soldering of integrated miniature circuits and manufacturing method of such printed boards
WO2019068826A1 (en) Printed circuit board and method for processing a printed circuit board
AT502552B1 (en) ASSEMBLY METHOD, COUPLING DEVICE AND COUPLING ELEMENT FOR A HIGH-PERFORMANCE CONTACT, AND BATTERY CHARGER WITH A CLUTCH DEVICE
EP3503694B1 (en) Method for producing a heat-conducting connection between a power component and a metallic layer of a circuit carrier
DE102007041904A1 (en) Combined solder joint for attachment of electrical component with printed circuit board, has push through connection surface running through printed circuit board and connected with printed circuit board by reflow surface soldered joint

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09727852

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09727852

Country of ref document: EP

Kind code of ref document: A1