WO2000004595A3 - Land-side mounting of components to an integrated circuit package - Google Patents

Land-side mounting of components to an integrated circuit package Download PDF

Info

Publication number
WO2000004595A3
WO2000004595A3 PCT/US1999/016067 US9916067W WO0004595A3 WO 2000004595 A3 WO2000004595 A3 WO 2000004595A3 US 9916067 W US9916067 W US 9916067W WO 0004595 A3 WO0004595 A3 WO 0004595A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
components
land
circuit package
coupled
Prior art date
Application number
PCT/US1999/016067
Other languages
French (fr)
Other versions
WO2000004595A2 (en
Inventor
Edward A Burton
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of WO2000004595A2 publication Critical patent/WO2000004595A2/en
Publication of WO2000004595A3 publication Critical patent/WO2000004595A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A method and apparatus is presented to allow one or more electrical components to be coupled to the land-side of an integrated circuit package coupled to a circuit board. In a first embodiment, a void is provided in the circuit board, and a peripheral area of the integrated circuit package is coupled to a peripheral area around the void. This provides space for the insertion of components in the land-side of the integrated circuit package. In a second embodiment, a spacer is provided coupled to the peripheral area of the integrated circuit package to allow the insertion of components into the land-side of the package and above the circuit board. With these embodiments of the present invention, components, such as decoupling capacitors can be coupled closer to the die (e.g. a processor die) of the package thus reducing parasitic inductance.
PCT/US1999/016067 1998-07-20 1999-07-16 Land-side mounting of components to an integrated circuit package WO2000004595A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11941098A 1998-07-20 1998-07-20
US09/119,410 1998-07-20

Publications (2)

Publication Number Publication Date
WO2000004595A2 WO2000004595A2 (en) 2000-01-27
WO2000004595A3 true WO2000004595A3 (en) 2000-06-29

Family

ID=22384265

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/016067 WO2000004595A2 (en) 1998-07-20 1999-07-16 Land-side mounting of components to an integrated circuit package

Country Status (2)

Country Link
TW (1) TW426924B (en)
WO (1) WO2000004595A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7823279B2 (en) * 2002-04-01 2010-11-02 Intel Corporation Method for using an in package power supply to supply power to an integrated circuit and to a component
US6713871B2 (en) * 2002-05-21 2004-03-30 Intel Corporation Surface mount solder method and apparatus for decoupling capacitance and process of making
EP2627160A1 (en) * 2012-02-08 2013-08-14 Harman Becker Automotive Systems GmbH Circuit board system
US9949381B2 (en) 2013-07-15 2018-04-17 Stmicroelectronics (Grenoble 2) Sas Electronic device with at least one impedance-compensating inductor and related methods
US12002795B2 (en) 2022-04-13 2024-06-04 Google Llc Pluggable CPU modules with vertical power

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754366A (en) * 1985-01-22 1988-06-28 Rogers Corporation Decoupling capacitor for leadless surface mounted chip carrier
EP0645811A2 (en) * 1993-09-24 1995-03-29 Kabushiki Kaisha Toshiba Semiconductor device having semiconductor chip with backside electrode
EP0729180A2 (en) * 1995-02-24 1996-08-28 AT&T Corp. Packaging multi-chip modules without wirebond interconnection
US5646828A (en) * 1995-02-24 1997-07-08 Lucent Technologies Inc. Thin packaging of multi-chip modules with enhanced thermal/power management
EP0822595A2 (en) * 1996-07-31 1998-02-04 Taiyo Yuden Co., Ltd. Hybrid module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754366A (en) * 1985-01-22 1988-06-28 Rogers Corporation Decoupling capacitor for leadless surface mounted chip carrier
EP0645811A2 (en) * 1993-09-24 1995-03-29 Kabushiki Kaisha Toshiba Semiconductor device having semiconductor chip with backside electrode
EP0729180A2 (en) * 1995-02-24 1996-08-28 AT&T Corp. Packaging multi-chip modules without wirebond interconnection
US5646828A (en) * 1995-02-24 1997-07-08 Lucent Technologies Inc. Thin packaging of multi-chip modules with enhanced thermal/power management
EP0822595A2 (en) * 1996-07-31 1998-02-04 Taiyo Yuden Co., Ltd. Hybrid module

Also Published As

Publication number Publication date
WO2000004595A2 (en) 2000-01-27
TW426924B (en) 2001-03-21

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