USD834025S1 - SSD storage device - Google Patents

SSD storage device Download PDF

Info

Publication number
USD834025S1
USD834025S1 US29/614,249 US201729614249F USD834025S US D834025 S1 USD834025 S1 US D834025S1 US 201729614249 F US201729614249 F US 201729614249F US D834025 S USD834025 S US D834025S
Authority
US
United States
Prior art keywords
storage device
ssd storage
view
ssd
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/614,249
Inventor
G. M Lim
Eun-Jin Yun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YUN, EUN-JIN, LIM, G. M
Application granted granted Critical
Publication of USD834025S1 publication Critical patent/USD834025S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of an SSD storage device showing our new design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a left side elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a top plan view thereof.
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another perspective view thereof, showing the handle member in a raised position.
Broken lines and unshaded portions contained within broken lines depict either features of the SSD storage device that form no part of the present design claim or exemplary elements that might be used in conjunction with the SSD storage device that are shown for illustrative purposes only and that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an SSD storage device, as shown and described.
US29/614,249 2017-02-17 2017-08-17 SSD storage device Active USD834025S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20170007657 2017-02-17
KR30-2017-0007657 2017-02-17

Publications (1)

Publication Number Publication Date
USD834025S1 true USD834025S1 (en) 2018-11-20

Family

ID=61684823

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/614,249 Active USD834025S1 (en) 2017-02-17 2017-08-17 SSD storage device

Country Status (3)

Country Link
US (1) USD834025S1 (en)
JP (1) JP1600323S (en)
TW (1) TWD189070S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD848432S1 (en) * 2017-02-17 2019-05-14 Samsung Electronics Co., Ltd. SSD storage device
USD862475S1 (en) * 2017-02-17 2019-10-08 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD888675S1 (en) * 2018-08-29 2020-06-30 Samsung Electronics Co., Ltd. Case for a circuit board
USD888676S1 (en) * 2018-08-29 2020-06-30 Samsung Electronics Co., Ltd. Case for a circuit board
USD967823S1 (en) * 2019-05-06 2022-10-25 Dell Products L.P. Information handling system storage device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD189068S (en) 2017-02-17 2018-03-11 三星電子股份有限公司 Ssd storage device
TWD189071S (en) 2017-02-17 2018-03-11 三星電子股份有限公司 Ssd storage device
TWD189066S (en) 2017-02-17 2018-03-11 三星電子股份有限公司 Ssd storage device

Citations (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4872505A (en) * 1988-08-16 1989-10-10 Ncr Corporation Heat sink for an electronic device
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US5285353A (en) * 1992-12-28 1994-02-08 Delco Electronics Corporation Support bar for circuit boards
US5347428A (en) * 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
USD368911S (en) * 1994-12-14 1996-04-16 Apple Computer, Inc. Radio card for a computer device
US5754409A (en) * 1996-11-06 1998-05-19 Dynamem, Inc. Foldable electronic assembly module
US5995370A (en) * 1997-09-01 1999-11-30 Sharp Kabushiki Kaisha Heat-sinking arrangement for circuit elements
US6002589A (en) * 1997-07-21 1999-12-14 Rambus Inc. Integrated circuit package for coupling to a printed circuit board
US6008994A (en) * 1998-08-04 1999-12-28 Itt Manufacturing Enterprises, Inc. PC card grounding clip
US6021048A (en) * 1998-02-17 2000-02-01 Smith; Gary W. High speed memory module
US6025992A (en) * 1999-02-11 2000-02-15 International Business Machines Corp. Integrated heat exchanger for memory module
US6088829A (en) * 1995-10-26 2000-07-11 Hitachi, Ltd. Synchronous data transfer system
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
US6381140B1 (en) * 1999-08-30 2002-04-30 Witek Enterprise Co., Ltd. Memory module
US6400931B1 (en) * 1998-02-10 2002-06-04 Nokia Mobile Phones Limited Card-like wireless communication device
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6590282B1 (en) * 2002-04-12 2003-07-08 Industrial Technology Research Institute Stacked semiconductor package formed on a substrate and method for fabrication
US6614664B2 (en) * 2000-10-24 2003-09-02 Samsung Electronics Co., Ltd. Memory module having series-connected printed circuit boards
US6628538B2 (en) * 2000-03-10 2003-09-30 Hitachi, Ltd. Memory module including module data wirings available as a memory access data bus
US6757751B1 (en) * 2000-08-11 2004-06-29 Harrison Gene High-speed, multiple-bank, stacked, and PCB-mounted memory module
US6762942B1 (en) * 2002-09-05 2004-07-13 Gary W. Smith Break away, high speed, folded, jumperless electronic assembly
US20040196682A1 (en) * 2002-09-26 2004-10-07 Elpida Memory, Inc. Semiconductor unit having two device terminals for every one input/output signal
US20050082663A1 (en) * 2003-10-20 2005-04-21 Renesas Technology Corp. Semiconductor device and semiconductor module
US20050088828A1 (en) * 2003-10-27 2005-04-28 Benq Corporation Electronic apparatus with module-locking device
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US20060049500A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US20060050488A1 (en) * 2004-09-03 2006-03-09 Staktel Group, L.P. High capacity thin module system and method
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US20060050592A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Compact module system and method
US20060049502A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Module thermal management system and method
US20060050498A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Die module system and method
US20060050489A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Optimized mounting area circuit module system and method
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US20060129888A1 (en) * 2004-09-03 2006-06-15 Staktek Group L.P. Circuit module turbulence enhacement systems and methods
US20060171247A1 (en) * 2005-02-03 2006-08-03 Wolfgang Hoppe Semiconductor memory module with bus architecture
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US20070011574A1 (en) * 2005-06-14 2007-01-11 Christian Weiss Memory device
US20070033490A1 (en) * 2005-07-19 2007-02-08 Karl-Heinz Moosrainer Semiconductor memory module with error correction
US20070139897A1 (en) * 2005-12-19 2007-06-21 Siva Raghuram Circuit board arrangement including heat dissipater
US20070176286A1 (en) * 2006-02-02 2007-08-02 Staktek Group L.P. Composite core circuit module system and method
US7265989B2 (en) * 2003-04-08 2007-09-04 Softbank Bb Corp. PC card
US7269025B2 (en) * 2004-12-30 2007-09-11 Intel Corporation Ballout for buffer
US20070212902A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212920A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212919A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212906A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070223198A1 (en) * 2006-03-25 2007-09-27 Foxconn Technology Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7299313B2 (en) * 2004-10-29 2007-11-20 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US20070294889A1 (en) * 2001-12-06 2007-12-27 Reinhold Schmitt Electronic circuit module and method for its assembly
US20080094811A1 (en) * 2006-10-23 2008-04-24 International Business Machines Corporation High density high reliability memory module with a fault tolerant address and command bus
US20080116571A1 (en) * 2006-11-22 2008-05-22 International Business Machines Corporation, Inc. Structures to enhance cooling of computer memory modules
US20080123303A1 (en) * 2006-11-29 2008-05-29 Elpida Memory, Inc. Memory module
US20080123300A1 (en) * 2006-11-29 2008-05-29 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
US20080137278A1 (en) * 2006-12-11 2008-06-12 Kreton Corporation Memory chip and insert card having the same thereon
USD575787S1 (en) * 2008-01-03 2008-08-26 Quanta Computer Inc. Wireless network card
US7516281B2 (en) * 2004-05-25 2009-04-07 Micron Technology, Inc. On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US20090129026A1 (en) * 2007-11-19 2009-05-21 Samsung Electronics Co., Ltd. Heat sink for semiconductor device and semiconductor module assembly including the heat sink
US7590899B2 (en) * 2006-09-15 2009-09-15 International Business Machines Corporation Processor memory array having memory macros for relocatable store protect keys
US20090268390A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Printed circuit assembly with determination of storage configuration based on installed paddle board
US7619893B1 (en) * 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US7636274B2 (en) * 2004-03-05 2009-12-22 Netlist, Inc. Memory module with a circuit providing load isolation and memory domain translation
US20100073860A1 (en) * 2008-09-24 2010-03-25 Takakatsu Moriai Ssd apparatus
US7688592B2 (en) * 2004-02-23 2010-03-30 Infineon Technologies Ag Cooling system for devices having power semiconductors and method for cooling the device
US7811097B1 (en) * 2005-08-29 2010-10-12 Netlist, Inc. Circuit with flexible portion
US7839712B2 (en) * 2007-08-03 2010-11-23 Qimonda Ag Semiconductor memory arrangement
US7861029B2 (en) * 2007-04-23 2010-12-28 Qimonda Ag Memory module having buffer and memory ranks addressable by respective selection signal
USD637193S1 (en) * 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD637192S1 (en) * 2010-10-18 2011-05-03 Apple Inc. Electronic device
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US8347057B2 (en) * 2009-08-27 2013-01-01 Elpida Memory, Inc. Memory module
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
US8422263B2 (en) * 2009-06-05 2013-04-16 Elpida Memory, Inc. Load reduced memory module and memory system including the same
US8510629B2 (en) * 2009-10-21 2013-08-13 Elpida Memory, Inc. Memory module on which regular chips and error correction chips are mounted
US20130219235A1 (en) * 2012-02-17 2013-08-22 Kabushiki Kaisha Toshiba Memory system and test method thereof
US8705240B1 (en) * 2007-12-18 2014-04-22 Google Inc. Embossed heat spreader
US8796830B1 (en) * 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
USD716310S1 (en) * 2012-06-09 2014-10-28 Apple, Inc. Electronic device
US8885422B2 (en) * 2009-06-12 2014-11-11 Hewlett-Packard Development Company, L.P. Hierarchical on-chip memory
JP1520122S (en) 2014-05-15 2015-03-23
JP1528484S (en) 2015-01-14 2015-07-13
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
US20160172016A1 (en) * 2014-12-12 2016-06-16 Kabushiki Kaisha Toshiba Semiconductor device and electronic device
US20160334992A1 (en) * 2015-05-12 2016-11-17 Kabushiki Kaisha Toshiba Semiconductor device that changes a target memory unit based on temperature
US20170010639A1 (en) * 2015-07-09 2017-01-12 Kabushiki Kaisha Toshiba Semiconductor device package having an oscillator and an apparatus having the same
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD794035S1 (en) * 2016-06-20 2017-08-08 V-Color Technology Inc. Solid state drive
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory

Patent Citations (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4872505A (en) * 1988-08-16 1989-10-10 Ncr Corporation Heat sink for an electronic device
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US5347428A (en) * 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
US5285353A (en) * 1992-12-28 1994-02-08 Delco Electronics Corporation Support bar for circuit boards
USD368911S (en) * 1994-12-14 1996-04-16 Apple Computer, Inc. Radio card for a computer device
US6088829A (en) * 1995-10-26 2000-07-11 Hitachi, Ltd. Synchronous data transfer system
US5754409A (en) * 1996-11-06 1998-05-19 Dynamem, Inc. Foldable electronic assembly module
US6002589A (en) * 1997-07-21 1999-12-14 Rambus Inc. Integrated circuit package for coupling to a printed circuit board
US5995370A (en) * 1997-09-01 1999-11-30 Sharp Kabushiki Kaisha Heat-sinking arrangement for circuit elements
US6400931B1 (en) * 1998-02-10 2002-06-04 Nokia Mobile Phones Limited Card-like wireless communication device
US6021048A (en) * 1998-02-17 2000-02-01 Smith; Gary W. High speed memory module
US6008994A (en) * 1998-08-04 1999-12-28 Itt Manufacturing Enterprises, Inc. PC card grounding clip
US6025992A (en) * 1999-02-11 2000-02-15 International Business Machines Corp. Integrated heat exchanger for memory module
US6381140B1 (en) * 1999-08-30 2002-04-30 Witek Enterprise Co., Ltd. Memory module
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
US6628538B2 (en) * 2000-03-10 2003-09-30 Hitachi, Ltd. Memory module including module data wirings available as a memory access data bus
US6757751B1 (en) * 2000-08-11 2004-06-29 Harrison Gene High-speed, multiple-bank, stacked, and PCB-mounted memory module
US6614664B2 (en) * 2000-10-24 2003-09-02 Samsung Electronics Co., Ltd. Memory module having series-connected printed circuit boards
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US20070294889A1 (en) * 2001-12-06 2007-12-27 Reinhold Schmitt Electronic circuit module and method for its assembly
US6590282B1 (en) * 2002-04-12 2003-07-08 Industrial Technology Research Institute Stacked semiconductor package formed on a substrate and method for fabrication
US6762942B1 (en) * 2002-09-05 2004-07-13 Gary W. Smith Break away, high speed, folded, jumperless electronic assembly
US20040196682A1 (en) * 2002-09-26 2004-10-07 Elpida Memory, Inc. Semiconductor unit having two device terminals for every one input/output signal
US7265989B2 (en) * 2003-04-08 2007-09-04 Softbank Bb Corp. PC card
US20050082663A1 (en) * 2003-10-20 2005-04-21 Renesas Technology Corp. Semiconductor device and semiconductor module
US20050088828A1 (en) * 2003-10-27 2005-04-28 Benq Corporation Electronic apparatus with module-locking device
US7688592B2 (en) * 2004-02-23 2010-03-30 Infineon Technologies Ag Cooling system for devices having power semiconductors and method for cooling the device
US7636274B2 (en) * 2004-03-05 2009-12-22 Netlist, Inc. Memory module with a circuit providing load isolation and memory domain translation
US7516281B2 (en) * 2004-05-25 2009-04-07 Micron Technology, Inc. On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US20060050498A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Die module system and method
US20060050489A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Optimized mounting area circuit module system and method
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US20060129888A1 (en) * 2004-09-03 2006-06-15 Staktek Group L.P. Circuit module turbulence enhacement systems and methods
US20060049502A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Module thermal management system and method
US20060050592A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Compact module system and method
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US20060050488A1 (en) * 2004-09-03 2006-03-09 Staktel Group, L.P. High capacity thin module system and method
US20060049500A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US7299313B2 (en) * 2004-10-29 2007-11-20 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US7269025B2 (en) * 2004-12-30 2007-09-11 Intel Corporation Ballout for buffer
US20060171247A1 (en) * 2005-02-03 2006-08-03 Wolfgang Hoppe Semiconductor memory module with bus architecture
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US20070011574A1 (en) * 2005-06-14 2007-01-11 Christian Weiss Memory device
US20070033490A1 (en) * 2005-07-19 2007-02-08 Karl-Heinz Moosrainer Semiconductor memory module with error correction
US7811097B1 (en) * 2005-08-29 2010-10-12 Netlist, Inc. Circuit with flexible portion
US20070139897A1 (en) * 2005-12-19 2007-06-21 Siva Raghuram Circuit board arrangement including heat dissipater
US20070176286A1 (en) * 2006-02-02 2007-08-02 Staktek Group L.P. Composite core circuit module system and method
US7619893B1 (en) * 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US20070212906A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212902A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212920A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212919A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070223198A1 (en) * 2006-03-25 2007-09-27 Foxconn Technology Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US8796830B1 (en) * 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US7590899B2 (en) * 2006-09-15 2009-09-15 International Business Machines Corporation Processor memory array having memory macros for relocatable store protect keys
US20080094811A1 (en) * 2006-10-23 2008-04-24 International Business Machines Corporation High density high reliability memory module with a fault tolerant address and command bus
US20080116571A1 (en) * 2006-11-22 2008-05-22 International Business Machines Corporation, Inc. Structures to enhance cooling of computer memory modules
US20080123300A1 (en) * 2006-11-29 2008-05-29 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
US20080123303A1 (en) * 2006-11-29 2008-05-29 Elpida Memory, Inc. Memory module
US20080137278A1 (en) * 2006-12-11 2008-06-12 Kreton Corporation Memory chip and insert card having the same thereon
US7861029B2 (en) * 2007-04-23 2010-12-28 Qimonda Ag Memory module having buffer and memory ranks addressable by respective selection signal
US7839712B2 (en) * 2007-08-03 2010-11-23 Qimonda Ag Semiconductor memory arrangement
US20090129026A1 (en) * 2007-11-19 2009-05-21 Samsung Electronics Co., Ltd. Heat sink for semiconductor device and semiconductor module assembly including the heat sink
US8705240B1 (en) * 2007-12-18 2014-04-22 Google Inc. Embossed heat spreader
USD575787S1 (en) * 2008-01-03 2008-08-26 Quanta Computer Inc. Wireless network card
US20090268390A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Printed circuit assembly with determination of storage configuration based on installed paddle board
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US20100073860A1 (en) * 2008-09-24 2010-03-25 Takakatsu Moriai Ssd apparatus
US8422263B2 (en) * 2009-06-05 2013-04-16 Elpida Memory, Inc. Load reduced memory module and memory system including the same
US8885422B2 (en) * 2009-06-12 2014-11-11 Hewlett-Packard Development Company, L.P. Hierarchical on-chip memory
US8347057B2 (en) * 2009-08-27 2013-01-01 Elpida Memory, Inc. Memory module
US8510629B2 (en) * 2009-10-21 2013-08-13 Elpida Memory, Inc. Memory module on which regular chips and error correction chips are mounted
USD655296S1 (en) * 2010-10-18 2012-03-06 Apple Inc. Electronic device
USD637192S1 (en) * 2010-10-18 2011-05-03 Apple Inc. Electronic device
USD686215S1 (en) * 2010-11-19 2013-07-16 Apple Inc. Electronic device
USD652041S1 (en) * 2010-11-19 2012-01-10 Apple Inc. Electronic device
USD637193S1 (en) * 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
US20130219235A1 (en) * 2012-02-17 2013-08-22 Kabushiki Kaisha Toshiba Memory system and test method thereof
USD716310S1 (en) * 2012-06-09 2014-10-28 Apple, Inc. Electronic device
JP1520122S (en) 2014-05-15 2015-03-23
US20160172016A1 (en) * 2014-12-12 2016-06-16 Kabushiki Kaisha Toshiba Semiconductor device and electronic device
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
JP1528484S (en) 2015-01-14 2015-07-13
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
US20160334992A1 (en) * 2015-05-12 2016-11-17 Kabushiki Kaisha Toshiba Semiconductor device that changes a target memory unit based on temperature
US20170010639A1 (en) * 2015-07-09 2017-01-12 Kabushiki Kaisha Toshiba Semiconductor device package having an oscillator and an apparatus having the same
USD794035S1 (en) * 2016-06-20 2017-08-08 V-Color Technology Inc. Solid state drive
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Non-Patent Prior Art list", total 2 pages.
Communication dated Nov. 3, 2017, issued by the Taiwan Patent Office in counterpart Taiwan application No. 106304669.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD848432S1 (en) * 2017-02-17 2019-05-14 Samsung Electronics Co., Ltd. SSD storage device
USD862475S1 (en) * 2017-02-17 2019-10-08 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD888675S1 (en) * 2018-08-29 2020-06-30 Samsung Electronics Co., Ltd. Case for a circuit board
USD888676S1 (en) * 2018-08-29 2020-06-30 Samsung Electronics Co., Ltd. Case for a circuit board
USD967823S1 (en) * 2019-05-06 2022-10-25 Dell Products L.P. Information handling system storage device

Also Published As

Publication number Publication date
JP1600323S (en) 2018-03-26
TWD189070S (en) 2018-03-11

Similar Documents

Publication Publication Date Title
USD826944S1 (en) SSD storage device
USD847811S1 (en) SSD storage device
USD834025S1 (en) SSD storage device
USD848419S1 (en) SSD storage device
USD819023S1 (en) SSD storage device
USD819022S1 (en) SSD storage device
USD829719S1 (en) SSD storage device
USD826945S1 (en) SSD storage device
USD831657S1 (en) External SSD storage device
USD857014S1 (en) Storage device
USD819633S1 (en) External SSD storage device
USD861592S1 (en) Battery
USD846494S1 (en) Storage battery
USD795009S1 (en) Lid with loop
USD828358S1 (en) SSD storage device
USD827998S1 (en) Insole
USD837794S1 (en) Device case with handle
USD828357S1 (en) SSD storage device
USD795698S1 (en) Container for storage
USD974366S1 (en) Data storage device for use with an electronic device
USD833893S1 (en) Thermostat device
USD819024S1 (en) External SSD storage device
USD815508S1 (en) Handle
USD840408S1 (en) Electronic device holder
USD849000S1 (en) Portable storage device