USD826944S1 - SSD storage device - Google Patents
SSD storage device Download PDFInfo
- Publication number
- USD826944S1 USD826944S1 US29/614,246 US201729614246F USD826944S US D826944 S1 USD826944 S1 US D826944S1 US 201729614246 F US201729614246 F US 201729614246F US D826944 S USD826944 S US D826944S
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- US
- United States
- Prior art keywords
- storage device
- ssd storage
- view
- ssd
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Description
Broken lines and unshaded portions contained within broken lines depict either features of the SSD storage device that form no part of the present design claim or exemplary elements that might be used in conjunction with the SSD storage device that are shown for illustrative purposes only and that form no part of the claimed design.
Claims (1)
- The ornamental design for an SSD storage device, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR30-2017-0007655 | 2017-02-17 | ||
KR20170007655 | 2017-02-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD826944S1 true USD826944S1 (en) | 2018-08-28 |
Family
ID=62706156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/614,246 Active USD826944S1 (en) | 2017-02-17 | 2017-08-17 | SSD storage device |
Country Status (3)
Country | Link |
---|---|
US (1) | USD826944S1 (en) |
JP (1) | JP1608281S (en) |
TW (1) | TWD189071S (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD848432S1 (en) * | 2017-02-17 | 2019-05-14 | Samsung Electronics Co., Ltd. | SSD storage device |
USD862475S1 (en) * | 2017-02-17 | 2019-10-08 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869470S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD967823S1 (en) * | 2019-05-06 | 2022-10-25 | Dell Products L.P. | Information handling system storage device |
USD986249S1 (en) * | 2021-08-30 | 2023-05-16 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986898S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986899S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986901S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986900S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD988318S1 (en) * | 2020-09-10 | 2023-06-06 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD996424S1 (en) * | 2020-06-09 | 2023-08-22 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD1005296S1 (en) * | 2021-11-30 | 2023-11-21 | G.Skill International Enterprise Co., Ltd. | Computer memory module |
USD1005295S1 (en) * | 2021-11-30 | 2023-11-21 | G.Skill International Enterprise Co., Ltd. | Computer memory module |
Citations (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872505A (en) * | 1988-08-16 | 1989-10-10 | Ncr Corporation | Heat sink for an electronic device |
US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
US5347428A (en) * | 1992-12-03 | 1994-09-13 | Irvine Sensors Corporation | Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip |
US5754409A (en) * | 1996-11-06 | 1998-05-19 | Dynamem, Inc. | Foldable electronic assembly module |
US5995370A (en) * | 1997-09-01 | 1999-11-30 | Sharp Kabushiki Kaisha | Heat-sinking arrangement for circuit elements |
US6002589A (en) * | 1997-07-21 | 1999-12-14 | Rambus Inc. | Integrated circuit package for coupling to a printed circuit board |
US6021048A (en) * | 1998-02-17 | 2000-02-01 | Smith; Gary W. | High speed memory module |
US6025992A (en) * | 1999-02-11 | 2000-02-15 | International Business Machines Corp. | Integrated heat exchanger for memory module |
US6088829A (en) * | 1995-10-26 | 2000-07-11 | Hitachi, Ltd. | Synchronous data transfer system |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US6381140B1 (en) * | 1999-08-30 | 2002-04-30 | Witek Enterprise Co., Ltd. | Memory module |
US6535387B2 (en) * | 2001-06-28 | 2003-03-18 | Intel Corporation | Heat transfer apparatus |
US6590282B1 (en) * | 2002-04-12 | 2003-07-08 | Industrial Technology Research Institute | Stacked semiconductor package formed on a substrate and method for fabrication |
US6614664B2 (en) * | 2000-10-24 | 2003-09-02 | Samsung Electronics Co., Ltd. | Memory module having series-connected printed circuit boards |
US6628538B2 (en) * | 2000-03-10 | 2003-09-30 | Hitachi, Ltd. | Memory module including module data wirings available as a memory access data bus |
US6757751B1 (en) * | 2000-08-11 | 2004-06-29 | Harrison Gene | High-speed, multiple-bank, stacked, and PCB-mounted memory module |
US6762942B1 (en) * | 2002-09-05 | 2004-07-13 | Gary W. Smith | Break away, high speed, folded, jumperless electronic assembly |
US20040196682A1 (en) * | 2002-09-26 | 2004-10-07 | Elpida Memory, Inc. | Semiconductor unit having two device terminals for every one input/output signal |
US20050082663A1 (en) * | 2003-10-20 | 2005-04-21 | Renesas Technology Corp. | Semiconductor device and semiconductor module |
US6956284B2 (en) * | 2001-10-26 | 2005-10-18 | Staktek Group L.P. | Integrated circuit stacking system and method |
US20060050489A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Optimized mounting area circuit module system and method |
US20060049513A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Thin module system and method with thermal management |
US20060050488A1 (en) * | 2004-09-03 | 2006-03-09 | Staktel Group, L.P. | High capacity thin module system and method |
US20060050592A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Compact module system and method |
US20060050492A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group, L.P. | Thin module system and method |
US20060049500A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Thin module system and method |
US20060049502A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group, L.P. | Module thermal management system and method |
US20060050498A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Die module system and method |
US20060129888A1 (en) * | 2004-09-03 | 2006-06-15 | Staktek Group L.P. | Circuit module turbulence enhacement systems and methods |
US20060171247A1 (en) * | 2005-02-03 | 2006-08-03 | Wolfgang Hoppe | Semiconductor memory module with bus architecture |
US20060261449A1 (en) * | 2005-05-18 | 2006-11-23 | Staktek Group L.P. | Memory module system and method |
US20070011574A1 (en) * | 2005-06-14 | 2007-01-11 | Christian Weiss | Memory device |
US20070033490A1 (en) * | 2005-07-19 | 2007-02-08 | Karl-Heinz Moosrainer | Semiconductor memory module with error correction |
US20070139897A1 (en) * | 2005-12-19 | 2007-06-21 | Siva Raghuram | Circuit board arrangement including heat dissipater |
US20070176286A1 (en) * | 2006-02-02 | 2007-08-02 | Staktek Group L.P. | Composite core circuit module system and method |
US7269025B2 (en) * | 2004-12-30 | 2007-09-11 | Intel Corporation | Ballout for buffer |
US20070212902A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070212920A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070212906A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070212919A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070223198A1 (en) * | 2006-03-25 | 2007-09-27 | Foxconn Technology Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US7299313B2 (en) * | 2004-10-29 | 2007-11-20 | International Business Machines Corporation | System, method and storage medium for a memory subsystem command interface |
US20070294889A1 (en) * | 2001-12-06 | 2007-12-27 | Reinhold Schmitt | Electronic circuit module and method for its assembly |
US20080094811A1 (en) * | 2006-10-23 | 2008-04-24 | International Business Machines Corporation | High density high reliability memory module with a fault tolerant address and command bus |
US20080116571A1 (en) * | 2006-11-22 | 2008-05-22 | International Business Machines Corporation, Inc. | Structures to enhance cooling of computer memory modules |
US20080123303A1 (en) * | 2006-11-29 | 2008-05-29 | Elpida Memory, Inc. | Memory module |
US20080123300A1 (en) * | 2006-11-29 | 2008-05-29 | International Business Machines Corporation | Folded-sheet-metal heatsinks for closely packaged heat-producing devices |
US20080137278A1 (en) * | 2006-12-11 | 2008-06-12 | Kreton Corporation | Memory chip and insert card having the same thereon |
US7516281B2 (en) * | 2004-05-25 | 2009-04-07 | Micron Technology, Inc. | On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes |
US20090129026A1 (en) * | 2007-11-19 | 2009-05-21 | Samsung Electronics Co., Ltd. | Heat sink for semiconductor device and semiconductor module assembly including the heat sink |
US7590899B2 (en) * | 2006-09-15 | 2009-09-15 | International Business Machines Corporation | Processor memory array having memory macros for relocatable store protect keys |
US20090268390A1 (en) * | 2008-04-23 | 2009-10-29 | International Business Machines Corporation | Printed circuit assembly with determination of storage configuration based on installed paddle board |
US7619893B1 (en) * | 2006-02-17 | 2009-11-17 | Netlist, Inc. | Heat spreader for electronic modules |
US7636274B2 (en) * | 2004-03-05 | 2009-12-22 | Netlist, Inc. | Memory module with a circuit providing load isolation and memory domain translation |
US20100073860A1 (en) * | 2008-09-24 | 2010-03-25 | Takakatsu Moriai | Ssd apparatus |
US7688592B2 (en) * | 2004-02-23 | 2010-03-30 | Infineon Technologies Ag | Cooling system for devices having power semiconductors and method for cooling the device |
US7811097B1 (en) * | 2005-08-29 | 2010-10-12 | Netlist, Inc. | Circuit with flexible portion |
US7839712B2 (en) * | 2007-08-03 | 2010-11-23 | Qimonda Ag | Semiconductor memory arrangement |
US7861029B2 (en) * | 2007-04-23 | 2010-12-28 | Qimonda Ag | Memory module having buffer and memory ranks addressable by respective selection signal |
USD637193S1 (en) | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
USD637192S1 (en) | 2010-10-18 | 2011-05-03 | Apple Inc. | Electronic device |
US8018723B1 (en) * | 2008-04-30 | 2011-09-13 | Netlist, Inc. | Heat dissipation for electronic modules |
US8347057B2 (en) * | 2009-08-27 | 2013-01-01 | Elpida Memory, Inc. | Memory module |
USD673922S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
US8422263B2 (en) * | 2009-06-05 | 2013-04-16 | Elpida Memory, Inc. | Load reduced memory module and memory system including the same |
US8510629B2 (en) * | 2009-10-21 | 2013-08-13 | Elpida Memory, Inc. | Memory module on which regular chips and error correction chips are mounted |
US20130219235A1 (en) * | 2012-02-17 | 2013-08-22 | Kabushiki Kaisha Toshiba | Memory system and test method thereof |
US8705240B1 (en) * | 2007-12-18 | 2014-04-22 | Google Inc. | Embossed heat spreader |
US8796830B1 (en) * | 2006-09-01 | 2014-08-05 | Google Inc. | Stackable low-profile lead frame package |
USD716310S1 (en) * | 2012-06-09 | 2014-10-28 | Apple, Inc. | Electronic device |
US8885422B2 (en) * | 2009-06-12 | 2014-11-11 | Hewlett-Packard Development Company, L.P. | Hierarchical on-chip memory |
USD753073S1 (en) | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
US20160172016A1 (en) * | 2014-12-12 | 2016-06-16 | Kabushiki Kaisha Toshiba | Semiconductor device and electronic device |
US20160334992A1 (en) * | 2015-05-12 | 2016-11-17 | Kabushiki Kaisha Toshiba | Semiconductor device that changes a target memory unit based on temperature |
US20170010639A1 (en) * | 2015-07-09 | 2017-01-12 | Kabushiki Kaisha Toshiba | Semiconductor device package having an oscillator and an apparatus having the same |
USD787456S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD787457S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD794035S1 (en) * | 2016-06-20 | 2017-08-08 | V-Color Technology Inc. | Solid state drive |
USD793973S1 (en) * | 2015-01-14 | 2017-08-08 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD798251S1 (en) * | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
JP1600323S (en) | 2017-02-17 | 2018-03-26 |
-
2017
- 2017-08-16 TW TW106304684F patent/TWD189071S/en unknown
- 2017-08-17 US US29/614,246 patent/USD826944S1/en active Active
- 2017-08-17 JP JPD2017-17645F patent/JP1608281S/ja active Active
Patent Citations (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872505A (en) * | 1988-08-16 | 1989-10-10 | Ncr Corporation | Heat sink for an electronic device |
US5224023A (en) * | 1992-02-10 | 1993-06-29 | Smith Gary W | Foldable electronic assembly module |
US5347428A (en) * | 1992-12-03 | 1994-09-13 | Irvine Sensors Corporation | Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip |
US6088829A (en) * | 1995-10-26 | 2000-07-11 | Hitachi, Ltd. | Synchronous data transfer system |
US5754409A (en) * | 1996-11-06 | 1998-05-19 | Dynamem, Inc. | Foldable electronic assembly module |
US6002589A (en) * | 1997-07-21 | 1999-12-14 | Rambus Inc. | Integrated circuit package for coupling to a printed circuit board |
US5995370A (en) * | 1997-09-01 | 1999-11-30 | Sharp Kabushiki Kaisha | Heat-sinking arrangement for circuit elements |
US6021048A (en) * | 1998-02-17 | 2000-02-01 | Smith; Gary W. | High speed memory module |
US6025992A (en) * | 1999-02-11 | 2000-02-15 | International Business Machines Corp. | Integrated heat exchanger for memory module |
US6381140B1 (en) * | 1999-08-30 | 2002-04-30 | Witek Enterprise Co., Ltd. | Memory module |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US6628538B2 (en) * | 2000-03-10 | 2003-09-30 | Hitachi, Ltd. | Memory module including module data wirings available as a memory access data bus |
US6757751B1 (en) * | 2000-08-11 | 2004-06-29 | Harrison Gene | High-speed, multiple-bank, stacked, and PCB-mounted memory module |
US6614664B2 (en) * | 2000-10-24 | 2003-09-02 | Samsung Electronics Co., Ltd. | Memory module having series-connected printed circuit boards |
US6535387B2 (en) * | 2001-06-28 | 2003-03-18 | Intel Corporation | Heat transfer apparatus |
US6956284B2 (en) * | 2001-10-26 | 2005-10-18 | Staktek Group L.P. | Integrated circuit stacking system and method |
US20070294889A1 (en) * | 2001-12-06 | 2007-12-27 | Reinhold Schmitt | Electronic circuit module and method for its assembly |
US6590282B1 (en) * | 2002-04-12 | 2003-07-08 | Industrial Technology Research Institute | Stacked semiconductor package formed on a substrate and method for fabrication |
US6762942B1 (en) * | 2002-09-05 | 2004-07-13 | Gary W. Smith | Break away, high speed, folded, jumperless electronic assembly |
US20040196682A1 (en) * | 2002-09-26 | 2004-10-07 | Elpida Memory, Inc. | Semiconductor unit having two device terminals for every one input/output signal |
US20050082663A1 (en) * | 2003-10-20 | 2005-04-21 | Renesas Technology Corp. | Semiconductor device and semiconductor module |
US7688592B2 (en) * | 2004-02-23 | 2010-03-30 | Infineon Technologies Ag | Cooling system for devices having power semiconductors and method for cooling the device |
US7636274B2 (en) * | 2004-03-05 | 2009-12-22 | Netlist, Inc. | Memory module with a circuit providing load isolation and memory domain translation |
US7516281B2 (en) * | 2004-05-25 | 2009-04-07 | Micron Technology, Inc. | On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes |
US20060049500A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Thin module system and method |
US20060050492A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group, L.P. | Thin module system and method |
US20060049502A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group, L.P. | Module thermal management system and method |
US20060050498A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Die module system and method |
US20060129888A1 (en) * | 2004-09-03 | 2006-06-15 | Staktek Group L.P. | Circuit module turbulence enhacement systems and methods |
US20060050592A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Compact module system and method |
US20060050488A1 (en) * | 2004-09-03 | 2006-03-09 | Staktel Group, L.P. | High capacity thin module system and method |
US20060049513A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Thin module system and method with thermal management |
US20060050489A1 (en) * | 2004-09-03 | 2006-03-09 | Staktek Group L.P. | Optimized mounting area circuit module system and method |
US7299313B2 (en) * | 2004-10-29 | 2007-11-20 | International Business Machines Corporation | System, method and storage medium for a memory subsystem command interface |
US7269025B2 (en) * | 2004-12-30 | 2007-09-11 | Intel Corporation | Ballout for buffer |
US20060171247A1 (en) * | 2005-02-03 | 2006-08-03 | Wolfgang Hoppe | Semiconductor memory module with bus architecture |
US20060261449A1 (en) * | 2005-05-18 | 2006-11-23 | Staktek Group L.P. | Memory module system and method |
US20070011574A1 (en) * | 2005-06-14 | 2007-01-11 | Christian Weiss | Memory device |
US20070033490A1 (en) * | 2005-07-19 | 2007-02-08 | Karl-Heinz Moosrainer | Semiconductor memory module with error correction |
US7811097B1 (en) * | 2005-08-29 | 2010-10-12 | Netlist, Inc. | Circuit with flexible portion |
US20070139897A1 (en) * | 2005-12-19 | 2007-06-21 | Siva Raghuram | Circuit board arrangement including heat dissipater |
US20070176286A1 (en) * | 2006-02-02 | 2007-08-02 | Staktek Group L.P. | Composite core circuit module system and method |
US7619893B1 (en) * | 2006-02-17 | 2009-11-17 | Netlist, Inc. | Heat spreader for electronic modules |
US20070212920A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070212919A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070212906A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070212902A1 (en) * | 2006-03-08 | 2007-09-13 | Clayton James E | Thin multichip flex-module |
US20070223198A1 (en) * | 2006-03-25 | 2007-09-27 | Foxconn Technology Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
US8796830B1 (en) * | 2006-09-01 | 2014-08-05 | Google Inc. | Stackable low-profile lead frame package |
US7590899B2 (en) * | 2006-09-15 | 2009-09-15 | International Business Machines Corporation | Processor memory array having memory macros for relocatable store protect keys |
US20080094811A1 (en) * | 2006-10-23 | 2008-04-24 | International Business Machines Corporation | High density high reliability memory module with a fault tolerant address and command bus |
US20080116571A1 (en) * | 2006-11-22 | 2008-05-22 | International Business Machines Corporation, Inc. | Structures to enhance cooling of computer memory modules |
US20080123300A1 (en) * | 2006-11-29 | 2008-05-29 | International Business Machines Corporation | Folded-sheet-metal heatsinks for closely packaged heat-producing devices |
US20080123303A1 (en) * | 2006-11-29 | 2008-05-29 | Elpida Memory, Inc. | Memory module |
US20080137278A1 (en) * | 2006-12-11 | 2008-06-12 | Kreton Corporation | Memory chip and insert card having the same thereon |
US7861029B2 (en) * | 2007-04-23 | 2010-12-28 | Qimonda Ag | Memory module having buffer and memory ranks addressable by respective selection signal |
US7839712B2 (en) * | 2007-08-03 | 2010-11-23 | Qimonda Ag | Semiconductor memory arrangement |
US20090129026A1 (en) * | 2007-11-19 | 2009-05-21 | Samsung Electronics Co., Ltd. | Heat sink for semiconductor device and semiconductor module assembly including the heat sink |
US8705240B1 (en) * | 2007-12-18 | 2014-04-22 | Google Inc. | Embossed heat spreader |
US20090268390A1 (en) * | 2008-04-23 | 2009-10-29 | International Business Machines Corporation | Printed circuit assembly with determination of storage configuration based on installed paddle board |
US8018723B1 (en) * | 2008-04-30 | 2011-09-13 | Netlist, Inc. | Heat dissipation for electronic modules |
US20100073860A1 (en) * | 2008-09-24 | 2010-03-25 | Takakatsu Moriai | Ssd apparatus |
US8422263B2 (en) * | 2009-06-05 | 2013-04-16 | Elpida Memory, Inc. | Load reduced memory module and memory system including the same |
US8885422B2 (en) * | 2009-06-12 | 2014-11-11 | Hewlett-Packard Development Company, L.P. | Hierarchical on-chip memory |
US8347057B2 (en) * | 2009-08-27 | 2013-01-01 | Elpida Memory, Inc. | Memory module |
US8510629B2 (en) * | 2009-10-21 | 2013-08-13 | Elpida Memory, Inc. | Memory module on which regular chips and error correction chips are mounted |
USD637192S1 (en) | 2010-10-18 | 2011-05-03 | Apple Inc. | Electronic device |
USD655296S1 (en) * | 2010-10-18 | 2012-03-06 | Apple Inc. | Electronic device |
USD686215S1 (en) * | 2010-11-19 | 2013-07-16 | Apple Inc. | Electronic device |
USD652041S1 (en) * | 2010-11-19 | 2012-01-10 | Apple Inc. | Electronic device |
USD637193S1 (en) | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
USD673922S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
US20130219235A1 (en) * | 2012-02-17 | 2013-08-22 | Kabushiki Kaisha Toshiba | Memory system and test method thereof |
USD716310S1 (en) * | 2012-06-09 | 2014-10-28 | Apple, Inc. | Electronic device |
US20160172016A1 (en) * | 2014-12-12 | 2016-06-16 | Kabushiki Kaisha Toshiba | Semiconductor device and electronic device |
USD753073S1 (en) | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
USD787456S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD787457S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD793973S1 (en) * | 2015-01-14 | 2017-08-08 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
US20160334992A1 (en) * | 2015-05-12 | 2016-11-17 | Kabushiki Kaisha Toshiba | Semiconductor device that changes a target memory unit based on temperature |
US20170010639A1 (en) * | 2015-07-09 | 2017-01-12 | Kabushiki Kaisha Toshiba | Semiconductor device package having an oscillator and an apparatus having the same |
USD794035S1 (en) * | 2016-06-20 | 2017-08-08 | V-Color Technology Inc. | Solid state drive |
USD798251S1 (en) * | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
JP1600323S (en) | 2017-02-17 | 2018-03-26 |
Non-Patent Citations (3)
Title |
---|
Communication dated May 8, 2018, from the Japanese Patent Office in counterpart application No. 2017-017645. |
Communication dated Nov. 3, 2017, issued by the Taiwanese Patent Office in counterpart Taiwanese Application No. 106304684. |
Non-Patent Prior Art List, 2 pgs total. |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD862475S1 (en) * | 2017-02-17 | 2019-10-08 | Samsung Electronics Co., Ltd. | SSD storage device |
USD848432S1 (en) * | 2017-02-17 | 2019-05-14 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869470S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD967823S1 (en) * | 2019-05-06 | 2022-10-25 | Dell Products L.P. | Information handling system storage device |
USD996424S1 (en) * | 2020-06-09 | 2023-08-22 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
US11979996B2 (en) | 2020-06-09 | 2024-05-07 | Samsung Electronics Co., Ltd. | Memory device and electronic device including the same |
USD998612S1 (en) * | 2020-06-09 | 2023-09-12 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD997939S1 (en) * | 2020-06-09 | 2023-09-05 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD997161S1 (en) * | 2020-09-10 | 2023-08-29 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD988318S1 (en) * | 2020-09-10 | 2023-06-06 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986900S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986901S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986899S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986898S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD986249S1 (en) * | 2021-08-30 | 2023-05-16 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
USD1005296S1 (en) * | 2021-11-30 | 2023-11-21 | G.Skill International Enterprise Co., Ltd. | Computer memory module |
USD1005295S1 (en) * | 2021-11-30 | 2023-11-21 | G.Skill International Enterprise Co., Ltd. | Computer memory module |
Also Published As
Publication number | Publication date |
---|---|
JP1608281S (en) | 2018-07-02 |
TWD189071S (en) | 2018-03-11 |
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