USD802545S1 - Lower chamber for a plasma processing apparatus - Google Patents

Lower chamber for a plasma processing apparatus Download PDF

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Publication number
USD802545S1
USD802545S1 US29/544,071 US201529544071F USD802545S US D802545 S1 USD802545 S1 US D802545S1 US 201529544071 F US201529544071 F US 201529544071F US D802545 S USD802545 S US D802545S
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United States
Prior art keywords
processing apparatus
plasma processing
lower chamber
view
taken along
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Active
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US29/544,071
Inventor
Susumu Tauchi
Takashi Uemura
Kohei Sato
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAUCHI, SUSUMU, UEMURA, TAKASHI, SATO, KOHEI
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Publication of USD802545S1 publication Critical patent/USD802545S1/en
Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME AND ADDRESS Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
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FIG. 1 is a front, top and right side perspective view of a lower chamber for a plasma processing apparatus according to the design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6;
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 6; and,
FIG. 10 is a partially enlarged view taken along line 10-10 of FIG. 8.

Claims (1)

    CLAIM
  1. The ornamental design for a lower chamber for a plasma processing apparatus, as shown and described.
US29/544,071 2015-06-12 2015-10-30 Lower chamber for a plasma processing apparatus Active USD802545S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-013038 2015-06-12
JPD2015-13038F JP1546801S (en) 2015-06-12 2015-06-12

Publications (1)

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USD802545S1 true USD802545S1 (en) 2017-11-14

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US29/544,071 Active USD802545S1 (en) 2015-06-12 2015-10-30 Lower chamber for a plasma processing apparatus

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US (1) USD802545S1 (en)
JP (1) JP1546801S (en)
TW (1) TWD175855S (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD1005245S1 (en) * 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1008986S1 (en) * 2021-04-26 2023-12-26 Hitachi High-Tech Corporation Ion shield plate for plasma processing apparatus
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1051867S1 (en) * 2023-01-17 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

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US4319432A (en) * 1980-05-13 1982-03-16 Spitfire Tool And Machine Co. Polishing fixture
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6264540B1 (en) * 2000-03-30 2001-07-24 Speedfam-Ipec Corporation Method and apparatus for disposable bladder carrier assembly
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
US20050191947A1 (en) * 2003-11-13 2005-09-01 Chen Hung C. Retaining ring with shaped surface
US20070224864A1 (en) * 2005-05-24 2007-09-27 John Burns CMP retaining ring
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD722966S1 (en) * 2013-08-23 2015-02-24 Bridgeport Fittings, Inc. Split, non-metallic electrical insulating bushing
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD775710S1 (en) * 2015-05-19 2017-01-03 Il Han Kim End bushing for fishing reel spool

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4319432A (en) * 1980-05-13 1982-03-16 Spitfire Tool And Machine Co. Polishing fixture
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6264540B1 (en) * 2000-03-30 2001-07-24 Speedfam-Ipec Corporation Method and apparatus for disposable bladder carrier assembly
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
US20050191947A1 (en) * 2003-11-13 2005-09-01 Chen Hung C. Retaining ring with shaped surface
US20070224864A1 (en) * 2005-05-24 2007-09-27 John Burns CMP retaining ring
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD722966S1 (en) * 2013-08-23 2015-02-24 Bridgeport Fittings, Inc. Split, non-metallic electrical insulating bushing
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
USD775710S1 (en) * 2015-05-19 2017-01-03 Il Han Kim End bushing for fishing reel spool
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD1005245S1 (en) * 2021-04-19 2023-11-21 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1008986S1 (en) * 2021-04-26 2023-12-26 Hitachi High-Tech Corporation Ion shield plate for plasma processing apparatus
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1051867S1 (en) * 2023-01-17 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber

Also Published As

Publication number Publication date
TWD175855S (en) 2016-05-21
JP1546801S (en) 2016-03-28

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