US20110220338A1 - Led heat sink and method of manufacturing same - Google Patents

Led heat sink and method of manufacturing same Download PDF

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Publication number
US20110220338A1
US20110220338A1 US12/721,940 US72194010A US2011220338A1 US 20110220338 A1 US20110220338 A1 US 20110220338A1 US 72194010 A US72194010 A US 72194010A US 2011220338 A1 US2011220338 A1 US 2011220338A1
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United States
Prior art keywords
heat sink
led
zone
holding zone
led lamp
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/721,940
Inventor
Kun-Jung Chang
Ching-Yuan Juan
Kuo-Chun Lin
Ching-Huang Juan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LI-HONG TECHNOLOGICAL Co Ltd
Original Assignee
LI-HONG TECHNOLOGICAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LI-HONG TECHNOLOGICAL Co Ltd filed Critical LI-HONG TECHNOLOGICAL Co Ltd
Priority to US12/721,940 priority Critical patent/US20110220338A1/en
Assigned to LI-HONG TECHNOLOGICAL CO., LTD. reassignment LI-HONG TECHNOLOGICAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, KUN-JUNG, JUAN, CHING-HUANG, JUAN, Ching-Yuan, LIN, KUO-CHUN
Publication of US20110220338A1 publication Critical patent/US20110220338A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to a LED heat sink and a method of manufacturing same and particularly to a LED heat sink that provides anchoring and forced heat transfer function and a method of manufacturing same.
  • a conventional LED lamp includes a heat sink attached to the bottom of a LED chip. When the LED lamp is in use for illumination it generates heat which can be transferred through the heat sink to lower the temperature of the LED lamp.
  • the conventional LED lamp and the heat sink are coupled by contact. In practice poor contact or contact failure could happen. Moreover, the LED with a greater luminosity also generates a greater amount of heat, especially on lighting fixtures containing composite LED lamps such as traffic lights on crossroads that share a common projection or notation surface. Poor heat transfer could result in malfunction of the LED lamp. Not only maintenance cost is higher, the number of LED lamps to illuminate the projection and notation surface also reduces and results in dark zones or dark spots, light projection or notation effect is impacted.
  • the conventional LED lamp has to be mounted onto a printed circuit board.
  • the printed circuit board has holes formed thereon the hold the heat sink. In the event that the printed circuit board or heat sink has dimensional errors, installation and use are hindered. If the heat sink is too small poor contact or contact failure takes place. The size of the heat sink may be increased to avoid the poor contact or contact failure, but such an approach has to exert an extra force during mounting the heat sink onto the printed circuit board.
  • the printed circuit board could be warped or broken.
  • the primary object of the present invention is to overcome the problems of the conventional LED lamp of poor contact or contact failure that results in ineffective heat transfer of the heat generated by the LED lamp.
  • the present invention provides a heat sink with a latch hook to form a compact coupling between the LED lamp and the heat sink.
  • the heat sink according to the present invention takes into account of operational characteristics of LED lamp such as small size, greater heat generation and higher heat concentration by providing a heat sink prototype which has a holding zone with a cooling medium such as heat dispersing paste dispensed thereon; next mounting a LED lamp onto the holding zone; the holding zone being bordered by an anchor portion of a greater height and a compact stamping zone extended upwards from the anchor zone; then the compact stamping zone is stamped forcefully through a mold in a diagonal direction towards the holding zone such that the anchor zone is squeezed and deformed and a portion of the compact stamping zone is squeezed to form a latch hook above the holding zone to form compact coupling between the LED lamp and the heat sink.
  • a secured coupling can be formed without the need of providing a printed circuit board to mount the LED lamp.
  • the LED heat sink of the present invention can firmly hold the LED lamp and provide forced heat dissipation.
  • the LED heat sink of the present invention forms a firm coupling between the LED lamp and the heat sink and provides improved heat transfer effect.
  • the LED heat sink of the present invention allows the LED lamp to be directly mounted thereon without an extra printed circuit board.
  • the present invention can be made through a simpler fabrication process with a higher production yield and at a greater production efficiency.
  • FIG. 1 is a perspective view of the LED heat sink according to the present invention.
  • FIG. 2 is a schematic view of the LED heat sink and a LED lamp in a coupling condition.
  • FIG. 3A is a schematic view of the LED heat sink with a LED lamp mounted thereon.
  • FIG. 3B is a cross section taken on line 3 B- 3 B in FIG. 3A .
  • FIG. 4A is a schematic view of a fabrication process according to the present invention.
  • FIG. 4B is a cross section taken on line 4 B- 4 B in FIG. 4A .
  • FIG. 5 is a perspective view of an embodiment of the present invention in a vertical and linear arrangement.
  • FIG. 6 is a perspective view of another embodiment of the present invention in a horizontal and linear arrangement.
  • FIG. 7 is a perspective view of yet another embodiment of the present invention in a stacked arrangement.
  • FIG. 8 is a perspective view of the present invention coupling with a heat transfer duct.
  • FIG. 9 is a sectional view of the present invention coupled with a heat transfer duct.
  • FIG. 10 is perspective view of still another embodiment of the present invention.
  • the present invention aims to provide a LED heat sink 1 formed by mounting a LED lamp 2 onto a heat sink prototype 10 (as shown in FIG. 2 ) through a fabrication process.
  • the heat sink 1 includes a holding zone 11 and one or more anchor portions 12 formed in blocks or struts bordering the holding zone 11 and higher than the holding zone 11 .
  • Each anchor portion 12 has a latch hook 121 at one side adjacent to the holding zone 11 .
  • the latch hook 121 is directed towards the holding zone 11 in a downward manner to form latching and downward pressing.
  • the present invention aims to provide the LED heat sink 1 with the holding zone 11 to hold the LED lamp 2 .
  • the holding zone 11 is bordered by the anchor portions 12 to prevent the LED lamp 2 from sliding.
  • Each anchor portion 12 has a latch hook 121 at one side adjacent to the holding zone 11 to latch and press the LED lamp 2 downwards so that the LED lamp 2 and the heat sink 1 are coupled tightly in one body, thereby heat generated by the LED lamp 2 during lighting can be transferred through the heat sink 1 to reduce the temperature of the LED lamp 2 to increase the life span thereof.
  • the present invention also provides a manufacturing method to fabricate the LED heat sink 1 that comprises procedures as follows:
  • Step 1 Provide a heat sink prototype 10 which has a holding zone 11 on a upper side bordered by one or more jutting anchor portions 12 each has an upper end formed a compact stamping zone 120 ;
  • Step 2 Provide at least one LED lamp 2 , and dispense a heat transfer medium 3 such as heat dispersing paste on the holding zone 11 , and mount the LED lamp 2 onto the holding zone 11 at a desired location;
  • a heat transfer medium 3 such as heat dispersing paste
  • Step 3 Provide a mold 4 corresponding to the compact stamping zone 120 of the anchor portion 12 ;
  • Step 4 Stamp forcefully the compact stamping zone 120 on the upper side with the mold 4 in a diagonal direction towards the holding zone 11 to form a cavity 122 on the compact stamping zone 120 and squeeze the material of the anchor portion 12 beneath the compact stamping zone 120 towards the periphery of the LED lamp 2 to form a latch hook 121 pressing downwards, thereby the LED lamp 2 and the heat sink 1 are tightly coupled together in one body in a close contact manner to achieve forced heat transfer effect.
  • the present invention also provides a number of embodiments in arrangement between a plurality of LED lamps 2 and the holding zone 11 .
  • FIG. 5 illustrates an embodiment in which the LED lamps 2 are mounted onto the holding zone 11 in a vertical and linear manner.
  • FIG. 6 illustrates another embodiment in which the LED lamps 2 are mounted onto the holding zone 11 in a horizontal and linear manner.
  • FIG. 7 shows yet another embodiment in which the LED lamps 2 are mounted onto the holding zone 11 in a stacked manner.
  • the heat sink 1 b is an elongate body equipped with an opening sealing function.
  • the heat sink 1 b is taken from a heat sink prototype 10 b with one or more holding zone 11 b formed at the top end.
  • the holding zone 11 b is bordered by one or more anchor portions 12 b each has an upper side formed a compact stamping zone 120 b .
  • the heat sink prototype 10 b has a bundle portion 13 b in a middle section formed in varying shapes or sizes. In this embodiment the bundle portion 13 b is a plurality of indented rings.
  • the heat sink prototype 10 b also has a heat transfer strut 14 b at the bottom end.
  • the holding zone 11 b is daubed with a heat transfer medium 3 such as heat dispersing paste; next, mount the LED lamp 2 onto the holding zone 11 b at a desired location; then stamp the upper side of the compact stamping zone 120 b with a mold (not shown in the drawings) in a diagonal direction towards the holding zone 11 b to form a cavity 122 b on the upper side of the compact stamping zone 120 b and squeeze the material of the anchor portion 12 b below towards the periphery of the LED lamp 2 so that a latch hook 121 b is formed on the heat sink prototype 10 b to latch the LED lamp 2 to become the heat sink 1 b ; then couple the heat transfer duct 5 with the heat sink 1 b through the bottom of the heat sink 1 b with the LED lamp 2 fastened thereon, through the heat transfer strut 14 b until reaching the bundle portion 13 b in the middle of the heat sink 1 b ; through a corresponding duct sealing mold (not shown in the drawings) the opening 51 of the heat transfer duct

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A LED heat sink and a method of manufacturing same are disclosed. The LED heat sink includes a holding zone bordered by one or more anchor portion of a higher elevation. The anchor zone has an upper side formed a compact stamping zone. The compact stamping zone is stamped forcefully through a mold in a diagonal direction towards the holding zone such that the material of the anchor zone is squeezed above the holding zone to form a latch hook to latch and press a LED lamp onto the holding zone so that the LED lamp is tightly in contact with the heat sink. Thus a forced transfer effect can be achieved to rapidly reduce the temperature of the LED lamp.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a LED heat sink and a method of manufacturing same and particularly to a LED heat sink that provides anchoring and forced heat transfer function and a method of manufacturing same.
    • BACKGROUND OF THE INVENTION
  • A conventional LED lamp includes a heat sink attached to the bottom of a LED chip. When the LED lamp is in use for illumination it generates heat which can be transferred through the heat sink to lower the temperature of the LED lamp.
  • The conventional LED lamp and the heat sink are coupled by contact. In practice poor contact or contact failure could happen. Moreover, the LED with a greater luminosity also generates a greater amount of heat, especially on lighting fixtures containing composite LED lamps such as traffic lights on crossroads that share a common projection or notation surface. Poor heat transfer could result in malfunction of the LED lamp. Not only maintenance cost is higher, the number of LED lamps to illuminate the projection and notation surface also reduces and results in dark zones or dark spots, light projection or notation effect is impacted.
  • The conventional LED lamp has to be mounted onto a printed circuit board. The printed circuit board has holes formed thereon the hold the heat sink. In the event that the printed circuit board or heat sink has dimensional errors, installation and use are hindered. If the heat sink is too small poor contact or contact failure takes place. The size of the heat sink may be increased to avoid the poor contact or contact failure, but such an approach has to exert an extra force during mounting the heat sink onto the printed circuit board. The printed circuit board could be warped or broken.
    • SUMMARY OF THE INVENTION
  • The primary object of the present invention is to overcome the problems of the conventional LED lamp of poor contact or contact failure that results in ineffective heat transfer of the heat generated by the LED lamp. The present invention provides a heat sink with a latch hook to form a compact coupling between the LED lamp and the heat sink.
  • To achieve the foregoing object the heat sink according to the present invention takes into account of operational characteristics of LED lamp such as small size, greater heat generation and higher heat concentration by providing a heat sink prototype which has a holding zone with a cooling medium such as heat dispersing paste dispensed thereon; next mounting a LED lamp onto the holding zone; the holding zone being bordered by an anchor portion of a greater height and a compact stamping zone extended upwards from the anchor zone; then the compact stamping zone is stamped forcefully through a mold in a diagonal direction towards the holding zone such that the anchor zone is squeezed and deformed and a portion of the compact stamping zone is squeezed to form a latch hook above the holding zone to form compact coupling between the LED lamp and the heat sink. Thus a secured coupling can be formed without the need of providing a printed circuit board to mount the LED lamp.
  • The construction thus formed by the present invention provides many benefits as follows:
  • 1. The LED heat sink of the present invention can firmly hold the LED lamp and provide forced heat dissipation.
  • 2. The LED heat sink of the present invention forms a firm coupling between the LED lamp and the heat sink and provides improved heat transfer effect.
  • 3. The LED heat sink of the present invention allows the LED lamp to be directly mounted thereon without an extra printed circuit board.
  • 4. The present invention can be made through a simpler fabrication process with a higher production yield and at a greater production efficiency.
  • The foregoing, as well as additional objects, features and advantages of the present invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of the LED heat sink according to the present invention.
  • FIG. 2 is a schematic view of the LED heat sink and a LED lamp in a coupling condition.
  • FIG. 3A is a schematic view of the LED heat sink with a LED lamp mounted thereon.
  • FIG. 3B is a cross section taken on line 3B-3B in FIG. 3A.
  • FIG. 4A is a schematic view of a fabrication process according to the present invention.
  • FIG. 4B is a cross section taken on line 4B-4B in FIG. 4A.
  • FIG. 5 is a perspective view of an embodiment of the present invention in a vertical and linear arrangement.
  • FIG. 6 is a perspective view of another embodiment of the present invention in a horizontal and linear arrangement.
  • FIG. 7 is a perspective view of yet another embodiment of the present invention in a stacked arrangement.
  • FIG. 8 is a perspective view of the present invention coupling with a heat transfer duct.
  • FIG. 9 is a sectional view of the present invention coupled with a heat transfer duct.
  • FIG. 10 is perspective view of still another embodiment of the present invention
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please referring to FIGS. 1 and 2, the present invention aims to provide a LED heat sink 1 formed by mounting a LED lamp 2 onto a heat sink prototype 10 (as shown in FIG. 2) through a fabrication process. The heat sink 1 includes a holding zone 11 and one or more anchor portions 12 formed in blocks or struts bordering the holding zone 11 and higher than the holding zone 11. Each anchor portion 12 has a latch hook 121 at one side adjacent to the holding zone 11. The latch hook 121 is directed towards the holding zone 11 in a downward manner to form latching and downward pressing.
  • Referring to FIGS. 2 through 4B, the present invention aims to provide the LED heat sink 1 with the holding zone 11 to hold the LED lamp 2. The holding zone 11 is bordered by the anchor portions 12 to prevent the LED lamp 2 from sliding. Each anchor portion 12 has a latch hook 121 at one side adjacent to the holding zone 11 to latch and press the LED lamp 2 downwards so that the LED lamp 2 and the heat sink 1 are coupled tightly in one body, thereby heat generated by the LED lamp 2 during lighting can be transferred through the heat sink 1 to reduce the temperature of the LED lamp 2 to increase the life span thereof.
  • The present invention also provides a manufacturing method to fabricate the LED heat sink 1 that comprises procedures as follows:
  • 1. Step 1: Provide a heat sink prototype 10 which has a holding zone 11 on a upper side bordered by one or more jutting anchor portions 12 each has an upper end formed a compact stamping zone 120;
  • 2. Step 2: Provide at least one LED lamp 2, and dispense a heat transfer medium 3 such as heat dispersing paste on the holding zone 11, and mount the LED lamp 2 onto the holding zone 11 at a desired location;
  • 3. Step 3: Provide a mold 4 corresponding to the compact stamping zone 120 of the anchor portion 12;
  • 4. Step 4: Stamp forcefully the compact stamping zone 120 on the upper side with the mold 4 in a diagonal direction towards the holding zone 11 to form a cavity 122 on the compact stamping zone 120 and squeeze the material of the anchor portion 12 beneath the compact stamping zone 120 towards the periphery of the LED lamp 2 to form a latch hook 121 pressing downwards, thereby the LED lamp 2 and the heat sink 1 are tightly coupled together in one body in a close contact manner to achieve forced heat transfer effect.
  • The present invention also provides a number of embodiments in arrangement between a plurality of LED lamps 2 and the holding zone 11. FIG. 5 illustrates an embodiment in which the LED lamps 2 are mounted onto the holding zone 11 in a vertical and linear manner. FIG. 6 illustrates another embodiment in which the LED lamps 2 are mounted onto the holding zone 11 in a horizontal and linear manner. FIG. 7 shows yet another embodiment in which the LED lamps 2 are mounted onto the holding zone 11 in a stacked manner.
  • Refer to FIGS. 8, 9 and 10 for still another embodiment of the present invention to couple with a heat transfer duct 5. In this embodiment the heat sink 1 b is an elongate body equipped with an opening sealing function. The heat sink 1 b is taken from a heat sink prototype 10 b with one or more holding zone 11 b formed at the top end. The holding zone 11 b is bordered by one or more anchor portions 12 b each has an upper side formed a compact stamping zone 120 b. The heat sink prototype 10 b has a bundle portion 13 b in a middle section formed in varying shapes or sizes. In this embodiment the bundle portion 13 b is a plurality of indented rings. The heat sink prototype 10 b also has a heat transfer strut 14 b at the bottom end.
  • In this embodiment the holding zone 11 b is daubed with a heat transfer medium 3 such as heat dispersing paste; next, mount the LED lamp 2 onto the holding zone 11 b at a desired location; then stamp the upper side of the compact stamping zone 120 b with a mold (not shown in the drawings) in a diagonal direction towards the holding zone 11 b to form a cavity 122 b on the upper side of the compact stamping zone 120 b and squeeze the material of the anchor portion 12 b below towards the periphery of the LED lamp 2 so that a latch hook 121 b is formed on the heat sink prototype 10 b to latch the LED lamp 2 to become the heat sink 1 b; then couple the heat transfer duct 5 with the heat sink 1 b through the bottom of the heat sink 1 b with the LED lamp 2 fastened thereon, through the heat transfer strut 14 b until reaching the bundle portion 13 b in the middle of the heat sink 1 b; through a corresponding duct sealing mold (not shown in the drawings) the opening 51 of the heat transfer duct 5 and the bundle portion 13 b can be sealed tightly to finish the heat sink 1 b coupled with the heat transfer duct 5.

Claims (11)

1. A LED heat sink, comprising:
one or more holding zone on a upper side of the heat sink; and
one or more anchor portion which borders the holding zone at a higher elevation and includes a latch hook at one side adjacent to the holding zone.
2. The LED heat sink of claim 1, wherein the latch hook faces the holding zone and forms downward latching and pressing.
3. The LED heat sink of claim 1, wherein the anchor portion is a jutting block.
4. The LED heat sink of claim 1, wherein the anchor portion is a jutting strut.
5. A LED heat sink formed in an elongate body insertable into a heat transfer duct, comprising:
one or more holding zone located on an upper side of the heat sink;
a bundle portion located in a middle section of the heat sink; and
a heat transfer strut located at a bottom end of the heat sink.
6. The LED heat sink of claim 5, wherein the holding zone borders one or more anchor portion which is higher than the holding zone.
7. The LED heat sink of claim 6, wherein the anchor portion includes a latch hook at one side adjacent to the holding portion.
8. The LED heat sink of claim 5, wherein the bundle portion has a plurality of indent rings.
9. The LED heat sink of claim 5, wherein the bundle portion and the heat transfer strut are inserted into the heat transfer duct.
10. The LED heat sink of claim 9, wherein the heat transfer duct includes an opening which couples the bundle portion from an outer side and is sealed through a mold to form tight coupling and sealing between the heat transfer duct and the bundle portion.
11. A method for manufacturing a LED heat sink comprising the steps of:
providing a heat sink prototype which has a holding zone on a upper side bordered by one or more jutting anchor portion which has an upper end formed a compact stamping zone;
providing at least one LED lamp and dispensing a heat transfer medium on the holding zone, and mounting the LED lamp onto the holding zone at a desired location;
providing a mold corresponding to the compact stamping zone of the anchor portion; and
stamping the compact stamping zone on an upper side thereof with the mold in a diagonal direction towards the holding zone to squeeze the material of the anchor portion beneath the compact stamping zone to the periphery of the LED lamp to form a latch hook to produce a tight coupling between the LED lamp and the heat sink to generate forced heat transfer effect.
US12/721,940 2010-03-11 2010-03-11 Led heat sink and method of manufacturing same Abandoned US20110220338A1 (en)

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CN103499079A (en) * 2013-10-10 2014-01-08 昆山纯柏精密五金有限公司 Method for machining radiator of LED module
CN103968275A (en) * 2013-02-01 2014-08-06 深圳市虹林辉科技有限公司 LED (light emitting diode) lam and wiring method
US10638647B1 (en) * 2017-12-30 2020-04-28 Xeleum Lighting Attaching printed circuit board to heat exchanger

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US7936119B2 (en) * 2008-10-16 2011-05-03 Yung Pun Cheng Wide-angle LED lighting lamp with high heat-dissipation efficiency and uniform illumination
US7972036B1 (en) * 2008-04-30 2011-07-05 Genlyte Thomas Group Llc Modular bollard luminaire louver
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US20020043359A1 (en) * 2000-10-12 2002-04-18 Mizutani Electric Ind. Co., Ltd. Heat sink for electronic parts and manufacture thereof
US6758262B2 (en) * 2000-10-25 2004-07-06 The Furukawa Electric Co., Ltd. Heat sink, method for manufacturing same, and pressing jig
US6947283B2 (en) * 2002-10-01 2005-09-20 Intel Corporation Heat sink and retaining clip assembly
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Publication number Priority date Publication date Assignee Title
CN103968275A (en) * 2013-02-01 2014-08-06 深圳市虹林辉科技有限公司 LED (light emitting diode) lam and wiring method
CN103499079A (en) * 2013-10-10 2014-01-08 昆山纯柏精密五金有限公司 Method for machining radiator of LED module
US10638647B1 (en) * 2017-12-30 2020-04-28 Xeleum Lighting Attaching printed circuit board to heat exchanger

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