KR101695344B1 - Radiant heat device for led lamp - Google Patents

Radiant heat device for led lamp Download PDF

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Publication number
KR101695344B1
KR101695344B1 KR1020160004303A KR20160004303A KR101695344B1 KR 101695344 B1 KR101695344 B1 KR 101695344B1 KR 1020160004303 A KR1020160004303 A KR 1020160004303A KR 20160004303 A KR20160004303 A KR 20160004303A KR 101695344 B1 KR101695344 B1 KR 101695344B1
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KR
South Korea
Prior art keywords
heat
led module
leds
led
support
Prior art date
Application number
KR1020160004303A
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Korean (ko)
Inventor
김경미
박준희
Original Assignee
(주)디에스 에이
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Publication date
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Priority to KR1020160004303A priority Critical patent/KR101695344B1/en
Application granted granted Critical
Publication of KR101695344B1 publication Critical patent/KR101695344B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

In order to efficiently dissipate heat generated from LEDs when a streetlight, a tunnel, or various kinds of illumination using LEDs is used, the heat sink is fusion-bonded to the support portion on which the LED base is mounted using ultrasonic welding or a shoulder paste, The number of the heat sinks can be selectively adjusted according to the amount of heat generated by the LEDs, and the cross-sectional area of the heat sinks fused to the support portions can be widened to facilitate fusion between the support portions and the heat sinks, The present invention relates to an LED lamp heat dissipating device having a significantly improved heat radiation efficiency, comprising: an LED module having a plurality of LEDs and having an LED base formed with a plurality of fixing holes penetrating in a vertical direction; A support for fixing the LED module to the upper portion of the LED module and closely contacting the LED module to emit heat generated from the plurality of LEDs; A plurality of heat sinks mounted on the support; And a heat dissipation fixture for pressing and supporting the support part and the LED module to transfer heat generated from the plurality of LEDs to the support part; Wherein the heat dissipating fastener is inserted into and fixed to the LED module; And a pressing member which is fitted to the lower portion of the locking bolt and fixed to the pressing groove to elastically press the locking bolt.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an LED lamp,

The present invention relates to an LED lamp heat dissipating device, and more particularly, to an LED lamp heat dissipating device that is capable of efficiently dissipating heat generated from an LED when a streetlight, a tunnel, The supporting member and the heat sink can be integrally formed by using the heat sink, and the number of the heat sink can be selectively controlled according to the amount of heat generated by the LED, and the cross-sectional area of the heat sink fused to the support member is widened to facilitate fusion of the supporting member and the heat sink. And at the same time, the resistance to heat transmitted from the LED base is reduced, thereby greatly improving the heat radiation efficiency.

In general, tunnels, streetlights, and various lighting fixtures are installed for the purpose of keeping the brightness of the tunnel at a certain level for the safety of the vehicles that run into the tunnels, or for the passengers and pedestrians of the roads or India. Therefore, it is an illumination light aiming at facilitating traffic in the tunnel, improving the anxiety of the driver or pedestrian of the vehicle and preventing the accident.

Such tunnels and street lamps are generally installed at predetermined intervals in roadsides or tunnels, and usually use mercury lamps, metal halide lamps, sodium lamps, and fluorescent lamps.

However, in the case of such a mercury lamp and a fluorescent lamp, the durability life is short, so that the cost of the replacement cycle is large, and the metal halide or sodium lamp consumes a large amount of electric power, resulting in a large maintenance cost.

In order to solve these problems, recently, an LED lamp has been introduced. LED has been developed by using a characteristic of emitting light when a voltage is applied to a compound semiconductor, and is smaller than a conventional light source, has a long life, It has excellent efficiency of converting into energy and has been widely used in various places.

In recent years, as the development of semiconductor technology has resulted in the commercialization of high-brightness white LEDs, a variety of lighting devices using the same are emerging. Particularly, by integrating a large number of LED elements in a high-density manner arranged in series or in parallel and increasing the luminous intensity per unit area, the conventional lamps have been replaced in the case of tunnels and the like.

On the other hand, in the case of a single-type LED lamp, since the heat generated in the same area increases as the integrated density of the LED increases, the LED element is damaged due to a large amount of heat generated in the LED element.

In order to heat the LED lighting, soft materials such as aluminum and copper are used as the heat-dissipating unit. In order to assemble these parts, the heat-dissipating unit is subjected to a hole process, and the heat sink, Since the material of the heat dissipating unit is soft due to the nature of the heat dissipating unit, there is a problem that the heat dissipating unit is reduced due to abrasion during assembly of the bolt, and the parts can not be used.

In addition, a heat sink, a heat sink, or the like is installed to prevent damage to the LED device and improve the heat generating performance. However, since the connection portion between the heat sink and the LED device is widened or spaced apart, There has been a problem of shortening the error and the service life.

To solve such a problem, Korean Patent Laid-Open No. 10-2011-0125761.

As shown in FIG. 1, the prior art includes a heat pipe 70 installed in the LED module 10; A support member 80 having a through hole 83 formed at the center thereof to be fitted into the heat pipe 70 and including an annular groove 81 and a support piece 82 around the through hole 83; The lower surface of the heat pipe 70 is fixed to the annular groove 81 and the support piece 82 so that the engagement piece 91 and the seat surface 92 And a plurality of heat dissipating plates 90 having a plurality of through holes 93 so as to circulate the air to the inside of the LED module 10. The fixing part 71 of the heat pipe 70 is formed on the upper part of the LED module 10 The heat pipe 70 is inserted into the through hole 83 of the receiving member 80 and fixed to the annular groove 81 of the receiving member 80, A part of the seating surface 92 of the heat sink 90 is seated on the supporting piece 82 of the receiving member 80 and the inner surface of the heat sink 90 is inserted into the heat sink 90, The heat transfer of the LEDs is maximized by brazing and fixing the contact surfaces of the pipe 70 to the outer peripheral surface of the fitting portion 72, It is possible to control the heat dissipation area according to the amount of heat dissipation of the eddy, and it is possible to manufacture the heat dissipation plate by injection molding, thereby reducing the cost of the product, improving the workability, and being easily installed in other products.

However, in the prior art, since the plurality of heat sinks are fastened to the fixing member and the fixing portion by bolts, when the heat sink is coupled to the fixing portion, the heat sink may be detached due to the occurrence of the warpage, There is still a problem in that it is still insufficient to effectively radiate heat.

1. Korean Patent Application No. 10-2011-0125761 entitled "Heat sink structure for LED" (Published date: November 22, 2011)

SUMMARY OF THE INVENTION It is an object of the present invention to provide an LED lamp heat dissipating device for improving the heat dissipation performance by minimizing an interval between the heat dissipation plate and the LED module in case of heat dissipation of the LED lamp.

Another object of the present invention is to provide an LED lamp heat dissipating device for assembling a combination of a heat dissipating unit and an LED module using a one-touch locking method, and using chip solder and a waterproof material to improve heat dissipation and waterproofness excellently.

Another object of the present invention is to provide an LED lamp heat-dissipating device capable of selectively controlling the number of heat sinks according to the amount of heat generated by the LEDs, by integrally forming a supporting portion and a plurality of heat sinks.

An LED lamp heat dissipating device according to the present invention includes: an LED module having a plurality of LEDs and having an LED base formed with a plurality of fixing holes penetrating in a vertical direction; A support for fixing the LED module to the upper portion of the LED module and closely contacting the LED module to emit heat generated from the plurality of LEDs; A plurality of heat sinks mounted on the support; And a heat dissipation fixture for pressing and supporting the support part and the LED module to transfer heat generated from the plurality of LEDs to the support part; Wherein the heat dissipating fastener is inserted into and fixed to the LED module; And a pressing member fixed to the pressing grooves respectively formed in the plurality of fixing members so as to be elastically pressed by being fitted to the lower portion of the locking bolt; Wherein the heat dissipation plate includes a body having a plurality of through holes penetrated therein so as to circulate air at a predetermined interval inward; A heat radiating rib formed at one end of the lower end of the body and fused to the support by ultrasonic welding or shoulder paste; And a pair of fixing parts formed at both upper ends of the body for connecting and fixing the body to each other; The pair of fastening portions are formed by fastening holes formed at both upper ends of the body so as to bend and penetrate in one direction, and fastening protrusions corresponding to the fastening holes and formed to be bent in a " ; And the heat dissipating ribs of the heat dissipating plates are fusion-bonded to the space formed between the locking bolts by ultrasonic welding or shoulder paste.

As described above, the LED lamp heat dissipating device according to the present invention improves the heat radiation performance of the LED lamp and prevents the gap between the LED module and the heat sink from being worn due to the tab wear, The waterproof property is improved to improve the durability and durability of the product, and the life can be prolonged.

In addition, by combining the heat sink and the LED module quickly with one touch, it is possible to improve the work process, thereby reducing the cost and improving the productivity.

In addition, there is an advantage in that the heat radiation area can be sufficiently secured by selectively adjusting the number of the heat radiation plates according to the heat generation amount of the heat radiation unit LED.

1 is an exploded perspective view of a heat sink structure for a conventional LED.
FIG. 2 is a perspective view and a detail view and an enlarged view of the LED lamp heat dissipating device according to the present invention. FIG.
3 is an exploded perspective view of an LED lamp heat dissipation device according to the present invention and another enlarged view.
4 is a detailed view of an LED module according to the present invention.
5A to 5C are cross-sectional views illustrating a state where the heat-radiating fastener is fixed by the heat-dissipating fastener of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an LED lamp radiating apparatus according to the present invention will be described in detail with reference to the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and they may vary depending on the intentions or customs of the client, the operator, the user, and the like. Therefore, the definition should be based on the contents throughout this specification.

Like numbers refer to like elements throughout the drawings.

FIG. 2 is a perspective view of the LED lamp heat dissipating device according to the present invention, and FIG. 3 is an exploded perspective view and another detail and enlarged view of the LED lamp heat dissipating device according to the present invention, And FIGS. 5A to 5C are sectional views showing a state where the heat dissipation fixture is fixed by the present invention. FIG.

2 to 5C, the LED lamp heat dissipating device according to the present invention includes an LED module 100, a support part 200 mounted on the LED module 100 in close contact with the support part 200, And a plurality of heat sinks 300 mounted on the heat sink 300.

Here, the LED module 100 may include a plurality of LEDs 110 and a heat dissipation fixture 120.

The LED module 100 may include a conventional metal PCB (PCB) substrate.

In the LED module 100, a support part 200 for dissipating heat is fixed to the lower part.

The LED module 100 and the support part 200 are connected and fixed by a heat dissipation fixture 120.

The LED module 100 is provided with a plurality of LEDs 110.

The heat dissipation fixture 120 presses the elastic force of the LED module 100 and the support part 200 so as not to lift them, and tightly adheres to the gap.

The LED module 100 and the support part 200 can be brought into close contact with each other by using elasticity and melt adhesion. That is, it is possible to press-contact with an elastic spring or to melt the solder chip or the like and to closely contact with each other.

The supporting part 200 is connected to the LED module 100 by a heat dissipating fixture 120 as a plate member and a plurality of heat sinks 300 are fused on the supporting part 200 by ultrasonic welding or shoulder paste .

The heat dissipation plate 300 includes a plurality of bodies 310 through which a plurality of through holes 311 penetrate to circulate air at a predetermined interval to the inside thereof and a plurality of through holes 311 formed by bending one side of the lower end of the body 310, A heat radiating rib 320 which is fused to the support portion 200 by fusion or shoulder paste and a pair of fixing portions 320 formed at both upper ends of the body 310 to connect and fix the body 310 to each other, (330). The pair of fixing parts 330 are bent in one direction from upper ends of both sides of the body 310 and have a locking hole 331 formed at one side thereof and a locking piece 331 protruding corresponding to the locking hole 331 332 are formed. In addition, the body 310 has a thin plate shape, and embossed or wavy patterns are repeatedly formed from the inside to the outside to maximize the heat radiation area.

The support part 200 is formed by injection molding and can be formed of an alloy using aluminum or magnesium.

3 and 4, the LED lamp radiating apparatus according to the present invention will be described in detail.

The LED module 100 includes a plurality of LEDs 110 mounted on a top surface of the LED base 130 and a plurality of LEDs 110 mounted on the LED base 130, A plurality of fixing holes 140 are formed to penetrate in the direction of FIG.

It is preferable that the above-mentioned heat dissipation fixture 120 is fitted and fixed to the fixing hole 140.

Preferably, the fixing hole 140 is formed by a pressing groove 150 and a coupling hole 160.

A support portion 200 is closely fixed to an upper portion of the LED base 130.

Heat generated from the LED 110 by the LED base 130 and the support 200 is discharged through the heat sink 300 through the support 200.

At this time, the LED base 130 and the support part 200 are fixed by the heat dissipation fixture 120.

The support part 200 is formed with a plurality of fixing holes 210 penetrating in the vertical direction and the fixing holes 210 are formed so as to face on the same center line as the fixing holes 140.

The heat dissipation fixture 120 may include a locking bolt 121 and a pressing member 123.

The locking bolt 121 is formed of a cylindrical body 121-1 and a head 121-2 is formed at the upper end of the body 121-1. A locking portion 121-3 having an incision is formed at the center.

The locking part 121-3 is formed to be able to elastically move left and right about the incision part, and a wedge-shaped locking step 121-4 is formed at the lower end.

The pressing member 123 is fitted to the locking bolt 121 and is inserted into the pressing groove 150. The pressing bolt 121 is pressed by the locking bolt 121 to act elastically.

That is, it is preferable that the pressing force is applied by the locking bolt 121 and the elastic force acts downward, so that the LED base 130 and the supporting part 200 are closely contacted.

It is preferable that the pressing member 123 uses a flat spring.

Hereinafter, an LED lamp heat-dissipating device according to the present invention will be described with reference to FIGS. 5A to 5C.

The LED base 130 of the LED module 100 is mounted on the lower surface of the support part 200.

It is preferable that the fixing hole 140 of the LED base 130 and the fixing hole 210 of the supporting portion 200 are aligned with each other.

After the fixing hole 140 and the fixing hole 210 are aligned, the locking bolt 121 is engaged.

The fixing hole 140 includes a pressing groove 150 and a coupling hole 160. The pressing member 123 is inserted into the pressing groove 150 and is urged by an external force . That is, the pressing member 123 is engaged with the pressing groove 150 by the head 121-2 of the locking bolt 121, and is simultaneously pressed and fixed.

Therefore, the locking protrusion 121-4 of the locking part 121-3 formed at the lower end of the locking bolt 121 is caught by the lower surface of the fixing hole 210 of the supporting part 200, .

The heat dissipating rib 320 of the heat sink 300 is fused to the space formed between the locking bolts 121 by ultrasonic welding or shoulder paste. The heat dissipating ribs 320 of the heat dissipating plate 300 are inserted into the regions of the support portions 200 between the head portions 121-2 of the locking bolts 121 inserted through the fixing holes 210 of the support portion 200 ).

Now, an assembly of the LED lamp heat-dissipating device according to the present invention will be described.

First, the support portion 200 is fixed on the LED module 100.

The heat sink 300 is then fused to the support 200. At this time, a pair of the upper and lower latching pieces 332 of the heat sink 300 are bent in a " 332 are fitted into the latching holes 331 so that a plurality of heat sinks 300 welded on the support portion 200 are connected to each other.

Hereinafter, the operation of the LED lamp heat-dissipating device according to the present invention will be described.

The heat generated from the plurality of LEDs 110 of the LED module 100 is emitted to the atmosphere through the plurality of heat sinks 300 welded to the support portion 200 mounted on the upper portion of the LED module 100 do.

By increasing the number of the heat sinks 300 to be fused onto the supporting portions 200 when a large amount of heat is generated from the plurality of LEDs 110, And can be discharged to the atmosphere through the heat exchanger 300.

As described above, the LED lamp heat dissipating device according to the present invention improves the heat dissipation performance of the LED lamp and prevents the defect of opening the gap due to the tab wear of the bolt hole of the LED module and the heat sink, The waterproof property can be improved to improve the durability and durability of the product, and the service life can be prolonged. In addition, by combining the heat sink and the LED module quickly with one touch, the work process can be improved to reduce the cost and improve the productivity. In addition, by combining the heat sink and the LED module quickly with one touch, it is possible to improve the work process to reduce the cost and improve the productivity, and the heat radiation area can be sufficiently secured by selectively controlling the number of heat sinks according to the heat generation amount of the heat sink unit LED .

While the present invention has been particularly shown and described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Various changes, modifications or adjustments to the example will be possible. Therefore, the scope of protection of the present invention should be construed as including all changes, modifications, and adjustments that fall within the spirit of the technical idea of the present invention.

100: LED module 110: LED
120: Heat dissipating fastener 121: Locking bolt
121-1: Body 121-2: Head
121-3: Locking portion 121-4:
123: pressing member 130: LED base
140: Fixing hole 150: Pressurized groove
160: Coupling hole 200: Support
210: Fixing hole 300: Heat sink
310: body 311: through hole
320: heat dissipating rib 330:
331: Retaining hole 332:

Claims (4)

An LED module having a plurality of LEDs and an LED base having a plurality of fixing holes penetrating in a vertical direction;
A support for fixing the LED module to the upper portion of the LED module and closely contacting the LED module to emit heat generated from the plurality of LEDs;
A plurality of heat sinks mounted on the support; And
And a heat dissipation fixture for pressing and supporting the support part and the LED module to transfer heat generated from the plurality of LEDs to the support part;
The heat-
A locking bolt which is fitted and fixed to the LED module; And
And a pressing member fixed to the pressing grooves respectively formed in the plurality of fixing holes so as to be elastically pressed by being fitted to the lower portion of the locking bolt;
The heat-
A body through which a plurality of through holes are passed so as to circulate air at a predetermined interval inside;
A heat radiating rib formed at one end of the lower end of the body and fused to the support by ultrasonic welding or shoulder paste; And
And a pair of fixing parts formed at both upper ends of the body for connecting and fixing the body to each other;
The pair of fastening portions are formed by fastening holes formed at both upper ends of the body so as to be bent and penetrated in one direction, and fastening protrusions corresponding to the fastening holes and bent to have a "┐";
Wherein the heat dissipating ribs of the heat dissipating plate are fused by ultrasonic welding or a shoulder paste in a space formed between the locking bolts.
The method according to claim 1,
The locking bolt includes a cylindrical body;
A disc-shaped head formed on an upper portion of the body;
Wherein a locking part is formed at a lower end of the body and a locking protrusion is provided at the locking part.
The method according to claim 1,
Wherein the supporting portion is formed with a plurality of fixing holes penetrating in the vertical direction, and the fixing holes are formed so as to face the same center line as the fixing holes.
delete
KR1020160004303A 2016-01-13 2016-01-13 Radiant heat device for led lamp KR101695344B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190049196A (en) 2017-11-01 2019-05-09 주식회사 진웅테크놀러지 LED module having waterproof vent hole for streetlight
KR20200041069A (en) * 2018-10-11 2020-04-21 허창기 Led floodlight with radiate heat means

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020000380A (en) * 2000-06-24 2002-01-05 이형도 Heatsink fixing device
JP2007281504A (en) * 2007-06-04 2007-10-25 Fujikura Ltd Heat sink and fin module
KR20110125761A (en) 2010-05-14 2011-11-22 (주)아이큐디지탈 Cooling plate structure for led
KR101086160B1 (en) * 2011-06-08 2011-11-25 김인석 Waterproofing and radiant heat unit of led lamp
KR101230872B1 (en) * 2011-11-08 2013-02-07 주식회사 레더스 Heat sink for led lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020000380A (en) * 2000-06-24 2002-01-05 이형도 Heatsink fixing device
JP2007281504A (en) * 2007-06-04 2007-10-25 Fujikura Ltd Heat sink and fin module
KR20110125761A (en) 2010-05-14 2011-11-22 (주)아이큐디지탈 Cooling plate structure for led
KR101086160B1 (en) * 2011-06-08 2011-11-25 김인석 Waterproofing and radiant heat unit of led lamp
KR101230872B1 (en) * 2011-11-08 2013-02-07 주식회사 레더스 Heat sink for led lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190049196A (en) 2017-11-01 2019-05-09 주식회사 진웅테크놀러지 LED module having waterproof vent hole for streetlight
KR20200041069A (en) * 2018-10-11 2020-04-21 허창기 Led floodlight with radiate heat means
KR102140707B1 (en) 2018-10-11 2020-08-03 허창기 Led floodlight with radiate heat means

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