M350969 八、新型說明： 【新型所屬的技術領域】 本創作疋有關於一種雷子提里/ α .. a . ea 电 装置(electronic device)， 且特別疋有關於一種具有彈神道 、 彈‘電件（elastic conductive component)的電子裝置。 【先前技術】 隨者科技的進步，雷早梦甚1 t 兒于敕置已與人類的日常生活產生 狁不可分的關係。一般來翊，發 r. .+k J版木况電子裝置内部幾乎都會具有 电路板(Circuit board)，Η ,τ ’ 且軍子骏置内部的多個電子元件 (μι _ 麵丫， HI 導電㈣喊於電路板上，並經由電路板的 内郤線路來彼此電性連接。 圖U會示出習知—種電子裂置的結構示意圖。請參考 圖1 ’電子裝置100包括一上殼體（case) 11〇、一下殼體 120、一電路板13〇以及多個螺絲14〇。上殼體uo與電路 板13〇刀別具有多個穿孔（through hole ) 112與多個穿孔 13!j而下殼體120則具有多個螺孔122。這些螺絲14〇分 別穿過這些穿孔112與這些穿孔132而鎖固於這些螺孔 122中’以將電路板130鎖固於上殼體11〇與下殼體12〇 之間。 值得注意的是，製造公差（tolerance)可能會使上殼 體U〇的多個凸出部（pr〇truding portion) 114具有不同的 南度’或是使下殼體120的多個凸柱結構（boss structure) 5 M350969 124具有不同的高度。如此一來，被鎖固於上殼體no與 下殼體120之間的電路板130可能會產生彎曲變形（如圖 1中所示）。此時，部份配置於電路板13〇上的球格陣列 (未繪示）可能會被剝離（lift 〇ff)，進而使組裝於電路 板130上的電子元件（未繪示）與電路板13〇之間產生斷 路（broken circuit)。 另外，製造公差亦可能會使這些穿孔112、這些螺孔M350969 VIII. New description: [New technical field] This creation is related to a kind of electronic device, and especially for a kind of bullet, bullet Electronic device of the elastic conductive component. [Prior Art] With the advancement of science and technology, Lei early dreams have been inextricably linked to the daily life of human beings. Generally speaking, the r. .+k J version of the wood electronic device almost always has a circuit board (Circuit board), Η, τ ' and the military electronic components inside the internal electronic components (μι _ 丫 丫, HI conductive (4) shouting on the circuit board and electrically connecting to each other via the inner circuit of the circuit board. Fig. U will show a schematic structural view of a conventional electronic crack. Please refer to Fig. 1 'The electronic device 100 includes an upper casing 11 〇, the lower casing 120, a circuit board 13 〇 and a plurality of screws 14 〇. The upper casing uo and the circuit board 13 have a plurality of through holes 112 and a plurality of perforations 13! The lower housing 120 has a plurality of screw holes 122. These screws 14 are respectively inserted through the through holes 112 and the through holes 132 to be locked in the screw holes 122 to lock the circuit board 130 to the upper housing 11〇. Between the lower casing 12 and the lower casing 12. It is worth noting that the manufacturing tolerance may cause the plurality of pr〇truding portions 114 of the upper casing U to have different south degrees or to make The plurality of boss structures 5 M350969 124 of the housing 120 have different heights. As a result, the circuit board 130 locked between the upper casing no and the lower casing 120 may be subjected to bending deformation (as shown in FIG. 1). At this time, a part of the ball disposed on the circuit board 13〇 The grid array (not shown) may be lifted (lift 〇 ff), thereby causing a broken circuit between the electronic components (not shown) assembled on the circuit board 130 and the circuit board 13 。. Tolerances may also cause these perforations 112, these tapped holes
122與這些穿孔132的位置無法互相職。如此一來，被 鎖固於上殼體110與下殼體12〇之間的電路板13〇亦可能 ，產生彎㈣形’進而使電子元件與電路板請之間產生 斷路。 除此之外，在習知技藝中，電路板no直接被鎖固於 m與下殼體m之間。因此，上殼體⑽或下殼 承受的外力較容易傳遞至電路板13〇。也因此， =电子裝置觸，衝擊測試或振動測試時 ，電子元件與 易產生斷路，進而使電子裝置100的 【新型内容】 較高導電件的電子裝置，其具有 -彈電子襄置，包括-殼體、-電路板、 外呈右：鎖固構件(1〇Cki—)。 风體具有至少—凸柱結構1路板承餘膝結構，並具 6 M350969 有至少-穿孔。鎖固構件具有—嵌合部（infixing p她⑻、 一限位部（poSition_limitingportion)以及一位於嵌合部與 限位部之間的連接部（connecting p〇rti〇n)。嵌合部嵌設 於（embedded in)凸柱結構’而彈性導電件套接於(口扮:） ，接部外’並與連接部套接於（flt int(〇穿孔巾。電路板 雙限於凸柱結構與限位部之間。 私 在本創作的一實施例中，上述的電路板具有相對的一 第一表面以及一第二表面。彈性導電件由穿孔中朝向第一 表面延伸，以使第一表面透過彈性導電件抵住（ban against)限位部，而第二表面抵住凸柱結構。 ^在本創作的一實施例中，上述的電路板具有相對的一 第一表面以及一第二表面。第一表面抵住限位部，而彈性 導電件由穿孔中朝向第二表面延伸，以使第二表面 性導電件抵住凸柱結構。 ^在本創作的一實施例中，上述的電路板具有相對的一 第一表面以及一第二表面。彈性導電件由穿孔中朝向 表面與第二表面延伸，以使第—表面與第二表面透過碰 導電件分別抵住限位部與凸柱結構。 在本創作的-實施例中’上述的凸柱結構與限位 外徑大於穿孔的内徑。 在本創作的一實施例中，上述的凸柱結構具有—螺孔 (threaded hole)，而嵌合部為一適於與螺孔螺合 (screw)。 ’、 在本創作的一實施例中，上述的凸柱結構具有—卡孔 M350969 (locking aperture)，而嵌人却达. 勾（hook)。 甘入&邛為一適於與卡孔卡合的卡 在本創作的-實施例中，上述 導電橡膠（conductive mbber)。 W件的材質為 在本創作中，笔路板透過彈性導電 士 力以娜導電件可用以吸收由殼體傳遞:電 測試良^因此，電子裝置會具有較高的生產良率與 γίΐ本創麵上述舰和優點能更明_懂，下文特 舉夕個以例’並配合所附圖式，作詳細說明如下。 【實施方式】 ，2Α為本創作—實施例的一種電子裝置的結構示意 圖。月參考圖2Α，電子裝置2〇〇a包括一殼體2l〇a、一電 ，板220彈性導電件23〇a以及至少-鎖固構件2伽。 成體210a具有至少一凸柱結構212。電路板22〇承載於凸 柱，，並具有至少一穿孔222。鎖固構件240a具有 一，合部242a、一限位部244以及一位於嵌合部242與限 位部2=4之間的連接部246。嵌合部242a嵌設於凸柱結構 212。彈性導電件23〇&套接於連接部246外，並與連接部 246套接於穿孔222中。另外，電路板220受限於凸柱結 構212與限位部244之間。 更詳細而言’電路板220具有一第一表面224以及一 相對於第—表面224的第二表面226，而彈性導電件230a 8 M350969 的材，例如疋$電橡膠，且其用以套接於穿孔孤中時會 朝向第-表面224延伸。再者，凸柱結構212可具有一螺 孔214,而鎖固構件雇例如是一等高獅（或稱為轴肩 螺絲L，且其嵌合部242a、限位部244與連接部246分別 為等尚螺絲的螺柱、頭部（head)與肩部（shGulder)。其 . 中，嵌合部242a可用以螺合於螺孔214中，而連接部246 則可用以與彈性導電件230a —併套接於穿孔222中。另 # 外，凸柱結構212與限位部244的外徑可大於穿孔222的 内徑。 於此實施例中，使用者可藉由以下步驟將電路板22〇 組裝於殼體210a上。首先，使用者可先將彈性導電件23〇a 套接於電路板220的穿孔222中。接著，將電路板220承 載於凸柱結構212上’並使穿孔222對準凸柱結構212的 螺孔214。然後，使鎖固構件240a的嵌合部242a穿過穿 孔222而螺合於螺孔214中，直到鎖固構件240a的連接部 246抵住凸柱結構212為止。此時，彈性導電件23〇a會緊 ‘ 配於電路板220與鎖固構件240a的連接部246之間，而電 . 路板220的第一表面224會透過彈性導電件230a抵住限位 部244，且電路板220的第二表面226則會直接抵住凸柱 結構212。如此一來，電路板220即會被保持於凸柱結構 212與限位部244之間。 值得注意的是’於此實施例中，彈性導電件230a可藉 由產生彈性變形來吸收鎖固構件240a與殼體210a傳遞至 電路板220上的外力。因此，當殼體21〇a的多個凸柱結構 9 M350969 的冋度因製造公差而略有不同時，位於電路板2卻的 第表面224與鎖固構件240a的限位部244之間的彈性導 電件23〇a可藉由產生彈性變形來降低電路板no在垂直方 向上的變形量。或者，當殼體210a的多個螺孔214的位置 與，路板220的多個穿孔222的位置因製造公差而略有偏 . 差日守’位於電路板220與鎖固構件240a的連接部246之間 的彈f生‘包件23Ga亦可藉由產生彈性變形來降低電路板 參 220在水平方向上的變形量。也因此，電子裝置2〇〇a會具 有較高的生產良率。 〃 另外，當使用者對電子裝置200a進行衝擊測試或振動 測試時，彈性導電件230a亦可藉由產生彈性變形來吸收由 殼體210a傳遞至電路板22〇上的外力。因此，電子裝置 200a亦會具有較高的測試良率。 圖2B為本創作另一實施例的一種電子裝置的結構示 意圖。請參考® 2B，電子裝置2〇%的結構與圖2A中所 示的電子裝置2GGa的結構相似。二者不同之處在於電子裝 ‘置200a的彈性導電件23〇a朝向電路板22〇的第一表面似 . 延伸’而電子裝置20〇b的雜導電件230b則是朝向電路 板220的第二表面226延伸。此時，電路板22〇的第一表 面224會直接抵住限位部244，而電路板22〇的第二表面 226則會透過彈性導電件23〇b抵住凸柱結構212。 相同的’彈性導電件2獅可藉由產生彈性變形來吸收 鎖固構件240a與殼體21〇a傳遞至電路板22〇上的外力。 因此，電子裝置200b不僅會具有較高的生產良率，亦會具122 and the positions of these perforations 132 cannot be used interchangeably. As a result, the circuit board 13 that is locked between the upper casing 110 and the lower casing 12 is also likely to be bent (four) to cause an open circuit between the electronic component and the circuit board. In addition to this, in the prior art, the circuit board no is directly locked between m and the lower casing m. Therefore, the external force received by the upper casing (10) or the lower casing is more easily transmitted to the circuit board 13A. Therefore, when the electronic device touches, impacts, or vibrates, the electronic component is prone to open circuit, thereby making the electronic device 100 a new type of electronic device having a higher conductive member, which has an elastic electronic device, including - The housing, the circuit board, and the right are right: the locking member (1〇Cki—). The wind body has at least a stud structure 1 road plate bearing knee structure, and 6 M350969 has at least - perforation. The locking member has a fitting portion (infixing p (8), a limiting portion (poSition_limitingportion), and a connecting portion (connecting p〇rti〇n) between the fitting portion and the limiting portion. The fitting portion is embedded The (embedded in) stud structure 'and the elastic conductive member is sleeved on the (mouth:), the outer portion of the joint and the socket is attached to the joint (flt int). The circuit board is limited to the structure and limit of the stud. In an embodiment of the present invention, the circuit board has a first surface and a second surface. The elastic conductive member extends from the through hole toward the first surface to allow the first surface to pass through. The resilient conductive member abuts the limiting portion and the second surface abuts the stud structure. In an embodiment of the present invention, the circuit board has a first surface and a second surface. The first surface abuts the limiting portion, and the elastic conductive member extends from the through hole toward the second surface such that the second surface conductive member abuts the stud structure. In an embodiment of the present invention, the circuit board is Having a first surface and a first Two surfaces: the elastic conductive member extends from the perforated surface toward the surface and the second surface such that the first surface and the second surface pass through the resistive member against the limiting portion and the stud structure, respectively. In the present embodiment - The above-mentioned stud structure and the limit outer diameter are larger than the inner diameter of the perforation. In an embodiment of the present invention, the above-mentioned stud structure has a threaded hole, and the fitting portion is adapted to be a screw hole. Screw. In an embodiment of the present invention, the above-mentioned stud structure has a locking aperture M350969 (locking aperture), but the intrusion is a hook. The hook is a hook. The card suitable for engaging with the card hole is in the embodiment of the present invention, the above-mentioned conductive rubber. The material of the W piece is in the present creation, the pen piece is transparently conductive and can be used for the conductive member. Absorption is transmitted by the shell: electrical test is good ^ Therefore, the electronic device will have a higher production yield and γίΐ The above-mentioned ship and advantages of this wound can be more clear _ understand, the following special case by example The formula is described in detail below. [Embodiment] A schematic diagram of a structure of an electronic device according to an embodiment. Referring to FIG. 2A, the electronic device 2A includes a housing 2a, an electric, a plate 220 elastic conductive member 23A, and at least a locking member 2 The body 210a has at least one stud structure 212. The circuit board 22 is carried on the stud and has at least one through hole 222. The locking member 240a has a joint portion 242a, a limiting portion 244 and a fitting portion. The connecting portion 246 between the portion 242 and the limiting portion 2 = 4. The fitting portion 242a is embedded in the stud structure 212. The elastic conductive member 23〇& is sleeved outside the connecting portion 246, and is sleeved in the through hole 222 with the connecting portion 246. Additionally, the circuit board 220 is constrained between the stud structure 212 and the limit portion 244. In more detail, the circuit board 220 has a first surface 224 and a second surface 226 opposite to the first surface 224, and the elastic conductive members 230a 8 M350969 are made of, for example, 电$ electric rubber, and are used for socketing. It extends toward the first surface 224 when the perforations are in the middle. Furthermore, the stud structure 212 can have a screw hole 214, and the locking member employs, for example, a contour lion (or a shoulder screw L), and the fitting portion 242a, the limiting portion 244 and the connecting portion 246 respectively It is a stud, a head and a shGulder of the screw. Among them, the fitting portion 242a can be screwed into the screw hole 214, and the connecting portion 246 can be used with the elastic conductive member 230a. The outer diameter of the stud structure 212 and the limiting portion 244 may be larger than the inner diameter of the through hole 222. In this embodiment, the user can use the following steps to turn the circuit board 22 The 〇 is assembled on the housing 210a. First, the user can first sleeve the elastic conductive member 23〇a into the through hole 222 of the circuit board 220. Then, the circuit board 220 is carried on the stud structure 212 and the through hole 222 is provided. The screw hole 214 of the stud structure 212 is aligned. Then, the fitting portion 242a of the locking member 240a is screwed into the screw hole 214 through the through hole 222 until the connecting portion 246 of the locking member 240a abuts the stud structure. 212. At this time, the elastic conductive member 23〇a is tightly disposed on the connecting portion 246 of the circuit board 220 and the locking member 240a. The first surface 224 of the circuit board 220 is pressed against the limiting portion 244 through the elastic conductive member 230a, and the second surface 226 of the circuit board 220 directly abuts the stud structure 212. Thus, the circuit board 220 will be held between the stud structure 212 and the limiting portion 244. It is noted that in this embodiment, the elastic conductive member 230a can absorb the locking member 240a and the housing 210a by elastic deformation. The external force on the circuit board 220. Therefore, when the twist of the plurality of stud structures 9 M350969 of the housing 21〇a is slightly different due to manufacturing tolerances, the first surface 224 of the circuit board 2 and the locking member 240a The elastic conductive member 23〇a between the limiting portions 244 can reduce the amount of deformation of the circuit board no in the vertical direction by elastic deformation. Or, when the positions of the plurality of screw holes 214 of the housing 210a are The position of the plurality of perforations 222 of the plate 220 is slightly offset due to manufacturing tolerances. The difference between the board member 220 and the connecting portion 246 of the locking member 240a can also be elastic. Deformation to reduce the amount of deformation of the board parameter 220 in the horizontal direction. Therefore, the electronic device 2〇〇a has a high production yield. 〃 In addition, when the user performs an impact test or a vibration test on the electronic device 200a, the elastic conductive member 230a can also be absorbed by the shell by elastic deformation. The body 210a is transmitted to the external force on the circuit board 22. Therefore, the electronic device 200a also has a high test yield. Fig. 2B is a schematic structural view of an electronic device according to another embodiment of the present invention. Referring to ® 2B, the structure of the electronic device 2〇% is similar to that of the electronic device 2GGa shown in Fig. 2A. The difference between the two is that the elastic conductive member 23〇a of the electronic device 200a faces the first surface of the circuit board 22〇. The extended conductive member 230b of the electronic device 20〇b is the first facing the circuit board 220. The two surfaces 226 extend. At this time, the first surface 224 of the circuit board 22 直接 directly abuts the limiting portion 244, and the second surface 226 of the circuit board 22 透过 passes through the elastic conductive member 23 〇 b against the stud structure 212. The same 'elastic conductive member 2' can absorb the external force transmitted from the locking member 240a and the housing 21A to the circuit board 22 by elastic deformation. Therefore, the electronic device 200b not only has a high production yield, but also has
M350969 有較高的測試良率。 圖2C為本創作又一實施例的—種電子裝置的 思圖。請參考® 2C，電子裝置義的結構與圖2A中所 示的电子裝置200a的結構相似。三者不同之處在於電子 置200a的彈性導電件篇僅朝向電路板22〇的第—表= 224延伸，而電子裳置綠的彈性導電件·則是 電路板220的第—表面224與第二表面m延伸。此時: 電路板220的第—表面224會透過彈性導電件23Qe抵住阳 位部244，而電路板22〇的第二表面226則會透過彈性^ 電件230c抵住凸柱結構212。. 相同的’彈性導電件23〇c可藉由產生彈性變形來吸吹 鎖固構件240a與殼體2l〇a傳遞至電路板220上的外力。 因此，電子I置200c不僅會具有較高的生產良率，亦會氣 有較高的測試良率。 ^ 值得注意的是’圖2A中所示的電子裝置2〇〇a的電略 板220僅透過彈性導電件230a抵住限位部244，而圖之这 中所不的電子表置200b的電路板220則僅透過彈性導電件 230a抵住凸柱結構212。然而，相較於上述兩個實施例， 此實施例中的電子裝置200c的電路板220透過彈性導電件 230c抵住限位部244與凸柱結構212。因此，使彈性導電 件230c在垂直方向上可具有較大的變形量。也因此，電子 裝置200c的殼體210a在凸柱結構212的高度上可容許有 較大的製造公差。 圖2D為本創作再一實施例的一種電子裝置的結構示 11 M350969 意圖。請參考圖2D，電子褒置2_的結構與圖沈 不的電子裝置2GGc的結構相似。二者不同之處在於 置騰的殼體雇的凸柱結構212具有螺孔214，且ς 子裝置施的鎖固構件顺的嵌合部施為螺柱^ 而’電子裝置200d的殼體21〇b的凸柱結構212則二 卡孔2i6，且電子裝置2_ _ _件2働的嵌合部 則為一適於與卡孔216卡合的卡勾。 ^的，彈性導電件施可藉由產生彈性變形來 鎖固構件240b與殼體210b傳遞至電路板22〇上的 =此’電子裝置2GGd不僅會具有較高的生產良率，亦合呈 有較高的測試良率。 s /、 綜上所述，在本創作中，電路板透過彈性導電件連接 與鎖固構件，以使彈性導電件可用以吸收由殼 生產路板上的外力。因此’電子裝置會具有較高的 生產良率與測試良率。 雖然本創作已以多個實施例揭露如上 限定本創作，任何所屬技術領域中具有通常知識 ，離本創作的精神和範_，當可作些許的更動與潤飾， 3本創作的髓範圍#視_的申請專概圍所界定者 圖式簡單說明】 圖1繪示出習知一種電子裝置的結構示意圖。 圖2Α為本創作—實施例的一種電子裝置的結構示意 12 M350969 圖。 圖2B為本創作另一實施例的一種電子裝置的結構示 意圖。 圖2C為本創作又一實施例的一種電子裝置的結構示 意圖。 圖2D為本創作再一實施例的一種電子裝置的結構示 意圖。 【主要元件符號說明】 100 :電子裝置 110 :上殼體 112、132 :穿孔 114 :凸出部 120 :下殼體 122 :螺孔 124 :凸柱結構 130 :電路板 140 :螺絲 200a、200b、200c、200d :電子裝置 210a、210b :殼體 212 :凸柱結構 214 :螺孔 216 :卡孔 220 :電路板 13 M350969 222 :穿孔 224 :第一表面 226 :第二表面 230a、230b、230c :彈性導電件 240a、240b :鎖固構件 242a、242b :嵌合部 244 :限位部 246 :連接部 14M350969 has a high test yield. 2C is a schematic diagram of an electronic device according to still another embodiment of the present invention. Referring to the ® 2C, the electronic device structure is similar to that of the electronic device 200a shown in FIG. 2A. The difference between the three is that the elastic conductive member of the electronic device 200a extends only toward the first table 224 of the circuit board 22, and the elastic conductive member with the green color is the first surface 224 of the circuit board 220. The two surfaces m extend. At this time, the first surface 224 of the circuit board 220 is biased against the male portion 244 through the elastic conductive member 23Qe, and the second surface 226 of the circuit board 22 is biased against the stud structure 212 through the elastic member 230c. The same 'elastic conductive member 23'c can absorb the external force transmitted from the lock member 240a and the housing 201a to the circuit board 220 by elastic deformation. Therefore, the electronic I set 200c not only has a high production yield, but also has a high test yield. ^ It is worth noting that the electronic board 220 of the electronic device 2A shown in FIG. 2A only passes through the elastic conductive member 230a against the limiting portion 244, and the circuit of the electronic meter 200b shown in the figure is not shown. The plate 220 is only pressed against the stud structure 212 through the elastic conductive member 230a. However, compared to the above two embodiments, the circuit board 220 of the electronic device 200c in this embodiment is pressed against the limiting portion 244 and the stud structure 212 through the elastic conductive member 230c. Therefore, the elastic conductive member 230c can have a large amount of deformation in the vertical direction. As such, the housing 210a of the electronic device 200c can tolerate greater manufacturing tolerances at the height of the stud structure 212. 2D is a schematic view showing the structure of an electronic device according to still another embodiment of the present invention. Referring to FIG. 2D, the structure of the electronic device 2_ is similar to that of the electronic device 2GGc. The difference between the two is that the boss structure 212 of the housing that is placed in the housing has a screw hole 214, and the fitting portion of the locking member applied by the latch device is applied as a stud and the housing 21 of the electronic device 200d The stud structure 212 of the 〇b is a second card hole 2i6, and the fitting portion of the electronic device 2___ 2 働 is a hook suitable for engaging with the card hole 216. ^, the elastic conductive member can be elastically deformed to transfer the member 240b and the housing 210b to the circuit board 22 = = this 'electronic device 2GGd not only has a higher production yield, but also Higher test yield. s /, In summary, in the present invention, the circuit board is connected to the locking member through the elastic conductive member so that the elastic conductive member can be used to absorb the external force generated by the casing. Therefore, electronic devices will have higher production yields and test yields. Although the present invention has been disclosed in various embodiments as defined above, the present invention has the usual knowledge, and the spirit and scope of the present invention, when a little change and refinement can be made, the scope of the 3 creations is #视_ BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view of a conventional electronic device. FIG. 2 is a schematic diagram showing the structure of an electronic device according to an embodiment of the present invention. FIG. Fig. 2B is a schematic view showing the configuration of an electronic device according to another embodiment of the present invention. Fig. 2C is a schematic structural view of an electronic device according to still another embodiment of the present invention. Fig. 2D is a schematic view showing the construction of an electronic apparatus according to still another embodiment of the present invention. [Description of main component symbols] 100: electronic device 110: upper case 112, 132: perforation 114: projection 120: lower case 122: screw hole 124: stud structure 130: circuit board 140: screws 200a, 200b, 200c, 200d: electronic device 210a, 210b: housing 212: stud structure 214: screw hole 216: card hole 220: circuit board 13 M350969 222: perforation 224: first surface 226: second surface 230a, 230b, 230c: Elastic conductive members 240a, 240b: locking members 242a, 242b: fitting portion 244: limiting portion 246: connecting portion 14