TWI782914B - Releasing film - Google Patents

Abstract

A releasing film, comprising: a support that comprises a substrate and an adhesive layer positioned on the substrate; and an electromagnetic wave-shielding sheet positioned on the adhesive layer of the support, the releasing film having a peel force between the adhesive layer and the electromagnetic wave-shielding sheet from 0.10 N/50 mm to 2.00 N/50 mm.

Description

Release film

The present invention relates to a release film.

In recent years, along with progress in the miniaturization of electronic equipment, further improvement in high-density mounting technology on the surface of semiconductor elements has been demanded. Therefore, in recent years, a so-called package-on-package type semiconductor device in which a plurality of semiconductor elements is stacked in multiple stages has been adopted. In such a package-on-package type semiconductor device, semiconductor elements are arranged in a stacked state, so problems (electromagnetic wave obstruction) caused by external noise may arise. This kind of noise problem becomes more and more obvious with the development of digitization, high speed and high frequency of electronic equipment. Therefore, in order to suppress the influence of noise, there has been proposed a technique in which an electromagnetic wave shielding sheet for shielding electromagnetic waves is formed on a sealing material that seals a semiconductor element (for example, refer to Patent Document 1).

As a method of forming an electromagnetic wave shielding sheet, for example, a method of manufacturing a semiconductor device described in Patent Document 2 is known. In this manufacturing method, in the step of sealing the semiconductor element with the sealing material by transfer molding using the upper mold and the lower mold, the material for forming the electromagnetic wave shielding sheet is applied to the release mold placed on the upper mold Release film (carrier film), this material is transferred onto the sealing material and cured to form an electromagnetic wave shielding sheet. [Prior Art Documents] [Patent Documents]

[Patent Document 1] Japanese Patent No. 4133637 [Patent Document 2] Japanese Patent Laid-Open No. 2007-287937

However, in the method described in Patent Document 2, every time the semiconductor device is sealed with a sealing material, it is necessary to apply the material for forming the electromagnetic wave shielding sheet on the carrier film every time, so production From an efficiency point of view, there is room for improvement.

This invention is made to solve the said subject, and it aims at providing the release film which can aim at the improvement of the production efficiency of the semiconductor device which has an electromagnetic wave shielding sheet.

Means for solving the above-mentioned problems include the following embodiments. <1> A release film comprising: a support body including a base material and an adhesive layer arranged on the base material; and an electromagnetic wave shielding sheet arranged on the adhesive layer of the support body, and the The peeling force between the adhesive layer and the electromagnetic wave shielding sheet is 0.10 N/50 mm to 2.00 N/50 mm. <2> The release film according to <1>, wherein the electromagnetic wave shielding sheet has a thickness of 0.01 μm to 50 μm. <3> The release film according to <1> or <2>, wherein the adhesive layer has a thickness of 1 μm to 20 μm.

<4> The release film according to any one of <1> to <3>, wherein the adhesive layer contains at least one selected from the group consisting of silicone adhesives and acrylic adhesives.

<5> The release film according to any one of <1> to <4>, which is used in the manufacture of a semiconductor device, the manufacture of the semiconductor device including transferring the electromagnetic wave shielding sheet to a semiconductor element for sealing. Steps for sealant.

According to the present invention, it is possible to provide a release film capable of improving the production efficiency of a semiconductor device having an electromagnetic wave shielding sheet.

Hereinafter, the form for carrying out this invention is demonstrated in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps (steps) and the like) are not essential unless otherwise specified. Numerical values and their ranges are also the same and do not limit the present invention.

The term "step" in this specification includes a step that is independent from other steps, and even when it cannot be clearly distinguished from other steps, as long as the purpose of the step is achieved. The numerical range represented by "-" in this specification includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the numerical ranges described step by step in this specification, the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of the numerical range described in other stages. In addition, in the numerical range described in this specification, the upper limit or the lower limit of the said numerical range can be replaced with the value shown in an Example. In this specification, the content or content of each component in the composition refers to the plurality of substances present in the composition when there are multiple substances corresponding to each component in the composition, unless otherwise specified. The total content rate or content. In this specification, the particle size of each component in the composition refers to a mixture of the plurality of particles present in the composition, unless otherwise specified, when there are multiple types of particles corresponding to each component in the composition. value. The term "layer" or "film" in this specification, when looking at the area where the layer or film exists, includes not only the case where it is formed in the entire area, but also the case where it is formed in only a part of the area. Condition. The term "lamination" in this specification means that layers are accumulated, and two or more layers may be combined, and two or more layers may be attached and detached. In this specification, "(meth)acryl" means at least one of acryl and methacryl, "(meth)acryl" means at least one of acryl and methacryl, and "(meth)acryl" means at least one of acryl and methacryl. "Base) acrylate" means at least one of acrylate and methacrylate.

The release film of this embodiment includes: a support body including a substrate and an adhesive layer arranged on the substrate; and an electromagnetic wave shielding sheet arranged on the adhesive layer of the support body, and the adhesive layer The peeling force with the electromagnetic wave shielding sheet is 0.10 N/50 mm to 2.00 N/50 mm.

Since the release film according to the present embodiment has the above structure, even if the electromagnetic wave shielding sheet is previously arranged on the support before the sealing step, the electromagnetic wave shielding sheet can be peeled off favorably from the support. Therefore, it is not necessary to arrange the electromagnetic wave shielding sheet on the release film every sealing step, or to form an electromagnetic wave shielding layer in another step after sealing, which is advantageous from the viewpoint of production efficiency. Therefore, the release film of this embodiment can be preferably used in a method of manufacturing a semiconductor device having an electromagnetic wave shielding sheet (more specifically, a process including transferring the electromagnetic wave shielding sheet to a sealing material for sealing a semiconductor element. Step semiconductor device manufacturing method).

In this specification, the "peeling force between the adhesive layer and the electromagnetic wave shielding sheet" is a value (N/50 mm) measured under the conditions of a peeling angle of 180° and a peeling speed of 0.3 m/min in an environment of 170°C. The peel force can be measured using, for example, a Tensilon universal testing machine (manufactured by A&D Co., Ltd.).

When the peeling force between the adhesive layer and the electromagnetic wave shielding sheet is 0.10 N/50 mm or more, it tends to suppress the peeling of the electromagnetic wave shielding sheet at high temperature. There exists a tendency for the transferability of the self-adhesive layer of an electromagnetic wave shielding sheet to be fully acquired as the peeling force between an adhesive layer and an electromagnetic wave shielding sheet is 2.00 N/50 mm or less. The peeling force between the adhesive layer and the electromagnetic wave shielding sheet is preferably not less than 0.20 N/50 mm and is preferably not more than 1.60 N/50 mm.

Hereinafter, although the release film of this embodiment is demonstrated referring drawings, this invention is not limited to this. In addition, the size of the components in each figure is a conceptual size, and the relative relationship of the size between components is not limited to this.

FIG. 1 is a schematic cross-sectional view showing an example of the structure of a release film according to this embodiment. The release film 10 includes: a support body 20 including a base material 50 and an adhesive layer 40 disposed on the base material 50 ; and an electromagnetic wave shielding sheet 30 disposed on the adhesive layer 40 of the support body 20 . Regarding the support body 20, the adhesive layer may be disposed on the entire surface of the substrate 50, or may be disposed on only a part thereof, and its shape is not particularly limited.

In the release film 10 , as long as the position where the electromagnetic wave shielding sheet 30 is disposed is on the adhesive layer 40 , there is no particular limitation. For example, as shown in the schematic plan view of FIG. 2 , the electromagnetic wave shielding sheet 30 may be disposed on only a part of the support body 20 , or the electromagnetic wave shielding sheet 30 may be disposed on the entire surface of the support body 20 . The shape of the electromagnetic wave shielding sheet 30 is not particularly limited, and may be a desired shape such as a quadrangle or a circle. The electromagnetic wave shielding sheet 30 may be arranged at intervals in a plurality of regions, and the interval between regions in this case is not particularly limited.

The method of disposing the electromagnetic wave shielding sheet 30 on the adhesive layer 40 is not particularly limited. For example, a sputtering method, a vapor deposition method, an ion plating method, a lamination method, etc. are mentioned. From the viewpoint of adhesiveness to the adhesive layer 40 , vapor deposition, ion plating, or lamination are preferable. The material of the electromagnetic wave shielding sheet 30 is not particularly limited. For example, a metal is mentioned. From the viewpoint of price and workability, it is preferable to contain at least one metal element selected from the group consisting of copper and aluminum.

The thickness of the substrate 50 is preferably from 20 μm to 200 μm, more preferably from 25 μm to 100 μm, and still more preferably from 25 μm to 50 μm. When the thickness of the base material 50 is 20 μm or more, sufficient strength is obtained, and the occurrence of problems such as warpage of the lead frame tends to be suppressed, and when the thickness is 200 μm or less, the suitability for semiconductor manufacturing equipment tends to be excellent.

The thickness of the adhesive layer 40 is preferably 1 μm˜20 μm, more preferably 2 μm˜12 μm. If the thickness of the adhesive layer 40 is 1 μm or more, there is a tendency that the transfer of the electromagnetic wave shielding sheet 30 from the adhesive layer 40 to the adherend can be performed well, and if it is 20 μm or less, the electromagnetic wave shielding sheet 30 may be difficult to seal in the sealing step. Tendency to peel from the adhesive layer 40 .

The thickness of the electromagnetic shielding sheet 30 is preferably from 0.01 μm to 50 μm, more preferably from 0.05 μm to 12 μm. When the thickness of the electromagnetic wave shielding sheet 30 is 0.01 μm or more, sufficient electromagnetic wave shielding property tends to be obtained, and when it is 50 μm or less, the processability tends to be excellent.

In this specification, the thickness of the base material 50, the adhesive layer 40, and the electromagnetic wave shielding sheet 30 is made into the number average of the values measured at 5 points. The method of measuring the thickness is not particularly limited, and a known method can be used.

The release film 10 may have members other than the base material 50, the adhesive layer 40, and the electromagnetic wave shielding sheet 30 as needed. For example, you may have the protective film for protecting the surface of the release film 10.

<adhesive layer>

The adhesive layer will not be specifically limited as long as the peeling force with an electromagnetic wave shielding sheet falls within the said range. For example, a layer containing an adhesive such as a silicone adhesive, an acrylic adhesive, a rubber adhesive, or a urethane adhesive is exemplified. The adhesive contained in the adhesive layer may be single type, or may be 2 or more types. In the present invention, the adhesive contained in the adhesive layer may partially or completely react, or may not react. In addition, it may be in a state cured by heat or the like, or may be in a non-cured state.

(1) Silicone-based adhesives Silicone-based adhesives in this specification refer to silicone polymers as the base polymer (the main component of the polymer component, that is, a component that accounts for 50% by mass or more of the entire polymer component ) adhesive. Silicone-based adhesives are advantageous in that the peeling force can be relatively reduced, the electromagnetic wave shielding sheet can be easily peeled off from the adhesive layer, and the adhesive residue on the electromagnetic wave shielding sheet (residue of the adhesive) can be suppressed. Examples of the silicone adhesive include an addition reaction type silicone adhesive, a peroxide-curable silicone adhesive, a condensation type silicone adhesive, and the like. From the viewpoint of not using a peroxide in the curing reaction and generating no decomposition product, an addition reaction type silicone-based adhesive is preferable.

(Addition Reaction Type Silicone Adhesive) The so-called addition reaction type silicone adhesive is a silicone adhesive containing an addition reaction type silicone resin and a silicone resin (resin). Type silicone resin contains at least two alkenyl groups in one molecule (such as vinyl, allyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, etc.) The first polydimethylsiloxane having a hydrocarbon group, particularly preferably a vinyl group), and the second polydimethylsiloxane having at least two hydrosilyl groups in one molecule.

The alkenyl group content in the first polydimethylsiloxane (the ratio of the number of alkenyl groups to the number of siloxane bonds) is preferably 0.01% to 10%, more preferably 0.1% to 5%. %. The alkenyl group is preferably present at least at both terminals of the molecular chain, more preferably present at both terminals and side chains. The degree of polymerization (the number of siloxane bonds) of the first polydimethylsiloxane is preferably from 200 to 5,000, more preferably from 500 to 3,000. The weight average molecular weight of the first polydimethylsiloxane is preferably from 20,000 to 1,300,000, more preferably from 300,000 to 1,200,000.

The molecular weight (weight average molecular weight and number average molecular weight) of a polymer in this specification is a polystyrene conversion value measured by the gel permeation chromatography (Gel Permeation Chromatography, GPC) method.

The content of the hydrosilyl groups in the second polydimethylsiloxane is preferably from 2 to 300 per molecule, more preferably from 4 to 200. The degree of polymerization (the number of siloxane bonds) of the second polydimethylsiloxane is preferably from 50 to 2,000, more preferably from 100 to 1,500.

In the addition reaction type silicone resin, the ratio of the first polydimethylsiloxane to the second polydimethylsiloxane is preferably, for example, relative to 100 parts by mass of the first polydimethylsiloxane The blending ratio of the second polydimethylsiloxane is 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass.

If the content of the alkenyl group contained in the first polydimethylsiloxane, the content of the hydrosilyl group contained in the second polydimethylsiloxane, and the second polydimethylsiloxane relative to When the compounding ratio of the first polydimethylsiloxane is within the above-mentioned ranges, the addition reaction between the first polydimethylsiloxane and the second polydimethylsiloxane tends to progress favorably. . Moreover, it is preferable that the 1st polydimethylsiloxane does not have a hydrosilyl group, and it is preferable that a 2nd polydimethylsiloxane does not have an alkenyl group.

The silicone resin has the function of imparting adhesiveness to the silicone-based adhesive. The silicone resin used in this specification refers to silicone having a three-dimensional network structure. Examples of the silicone resin include MQ, which includes an M unit as a monofunctional siloxane unit [(CH ₃ ) ₃ SiO _1/2 ] and a Q unit as a tetrafunctional siloxane unit [SiO _4/2 ]. resin. The molar ratio of the M unit to the Q unit (M unit/Q unit) in the MQ resin is preferably 0.6-1.7.

In the addition reaction type silicone adhesive, the blending ratio of the silicone resin is preferably 1 to 30 parts by mass, more preferably 3 to 20 parts by mass, relative to 100 parts by mass of the addition reaction type silicone resin. parts by mass, more preferably 5 to 15 parts by mass. When the blending ratio of the silicone resin is in the above range, the peelability of the addition reaction type silicone adhesive can be adjusted to a desired range. That is, the electromagnetic wave shielding sheet tends to be more easily peeled from the adhesive layer obtained by using the addition reaction type silicone-based adhesive, and the residue of the electromagnetic wave shielding sheet tends to be less likely to be generated.

The addition reaction type silicone-based adhesive preferably contains a catalyst. By containing the catalyst, the curing reaction of the addition reaction type silicone resin can be performed more efficiently. The catalyst is not particularly limited as long as it can cause the addition reaction of the first polydimethylsiloxane and the second polydimethylsiloxane, but a compound containing a platinum group metal is preferable among them. Examples of compounds containing platinum group metals include: fine-particulate platinum, fine-particulate platinum adsorbed on a carbon powder carrier, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complexes of chloroplatinic acid, palladium, rhodium Wait.

When the addition reaction type silicone adhesive contains a catalyst, the compounding amount of the catalyst relative to 100 parts by mass of the addition reaction type silicone resin (when the catalyst is a compound containing a platinum group metal , the amount corresponding to the platinum group metal) is preferably 0.0001 to 0.1 parts by mass, more preferably 0.001 to 0.01 parts by mass.

(Peroxide Curable Silicone Adhesive and Condensation Silicone Adhesive) Peroxide curable silicone adhesive is generally made by curing (crosslinking) organopolysiloxane with peroxide and Produces adhesives for silicone-based polymers. In addition, condensation-type silicone-based adhesives generally form silicone-based polymers by dehydration or dealcoholization reactions between polyorganosiloxanes having hydrolyzable silanyl groups such as silanol groups or alkoxysilyl groups at the ends. of adhesives.

In the case of a peroxide-curing silicone adhesive, use a silicone rubber having at least a methyl group, and in the case of a condensation-type silicone adhesive, use a silicone rubber having a silanol group or a hydrolyzable alkoxy group at the end. Silane-based silicone rubber. In addition, the weight average molecular weight of the organopolysiloxane in the silicone rubber is usually 150,000 or more, preferably 280,000 to 1 million, more preferably 500,000 to 900,000.

Silicone-based adhesives may contain various additives such as reaction inhibitors and adhesion enhancers in addition to polymer components.

The method of forming the adhesive layer on the substrate using the silicone adhesive is not particularly limited. For example, an adhesive layer can be formed by applying a silicone-based adhesive to the base material, drying and hardening as necessary. The application can be performed using, for example, a coating machine such as a bar coater, a die coater, a gravure coater, a roll coater, or a knife coater.

When the silicone-based adhesive contains a diluent, the diluent is not particularly limited. For example, hydrocarbon compounds, such as toluene, hexane, and heptane, acetone, ethyl acetate, methyl ethyl ketone, methyl isobutyl ketone, etc. are mentioned. The diluent contained in the silicone-based adhesive may be a single type or two or more types.

When the silicone-based adhesive is an addition-reaction type silicone adhesive, it is preferable to apply the addition-reaction type silicone adhesive to the substrate and then heat and harden it. In this case, the heating temperature is preferably from 80°C to 180°C, and the heating time is preferably from about 10 seconds to 90 seconds.

(2) Acrylic adhesive The acrylic adhesive used in this specification refers to an adhesive in which an acrylic polymer is used as a base polymer. The term "acrylic polymer" refers to a monomer having at least one (meth)acryl group in one molecule (hereinafter, sometimes referred to as "acrylic monomer") as the main constituent monomer. Components (components accounting for 50% by mass or more of the total monomers constituting the acrylic polymer). Acrylic adhesives are advantageous in terms of transparency, weather resistance, heat resistance, solvent resistance, and the like.

When designing the acrylic polymer contained in the acrylic adhesive, it is important to consider the glass transition point (adhesion to the adherend, applicable temperature, etc.), the introduction of the cross-linking point (durability, heat resistance etc.), copolymerization of acrylic monomers (molecular structure of acrylic polymers, uniformity of cross-linking points, etc.), etc. to adjust the type, molecular weight, etc. of the monomers. In order to introduce crosslinking points into the molecule, an acrylic polymer is synthesized using a monomer (acrylic acid, hydroxyethyl acrylate, etc.) containing a functional group capable of reacting with a crosslinking agent used in combination.

Examples of the acrylic polymer include polymers in which an alkyl (meth)acrylate is used as a main constituent monomer component. As the alkyl (meth)acrylate, for example, a compound represented by the following formula (1) can be preferably used. CH ₂ =C(R ¹ )COOR ² (1)

Here, R ¹ in the formula (1) represents a hydrogen atom or a methyl group, and R ² represents an alkyl group having 1 to 20 carbon atoms (which may be either a chain alkyl group or an alicyclic alkyl group).

From the viewpoint of obtaining an adhesive with excellent adhesive performance, R2 is preferably a chained alkyl group with ² to 14 carbon atoms (C2 to 14) (it can be either a straight chained alkyl group or a branched alkyl group) ). Examples of C2-14 chain alkyl groups include ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second-butyl, third-butyl, n-pentyl, isopentyl, Neopentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, 2-ethylhexyl, n-nonyl, isononyl, n-decyl, isodecyl, n-undecyl, n-dodecyl Alkyl, n-tridecyl, n-tetradecyl, etc. Examples of the alicyclic alkyl group in the case where R ² is an alicyclic alkyl group include cyclohexyl, isobornyl and the like.

From the viewpoint of obtaining an acrylic polymer with better adhesive performance, 50% by mass or more (for example, 50% by mass to 99.9% by mass) of the total amount of monomers used in the synthesis of the acrylic polymer, more preferably 70% by mass or more (for example, 70% by mass to 99.9% by mass), more preferably 85% by mass or more (for example, 85% by mass to 99.9% by mass), preferably R ² in the formula (1) is C2 to 14 chain alkyl (meth)acrylate, more preferably R2 is a chain alkyl acrylate of C4～10, and more preferably selected from n-butyl acrylate and ² -ethylhexyl acrylate at least one.

The acrylic polymer preferably has a hydroxyl group as a crosslinking point. As an acrylic polymer which has a hydroxyl group, what contains a hydroxyl group containing acrylic monomer in a polymerization component can be used preferably.

Specific examples of hydroxyl-containing acrylic monomers include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, (meth)acrylate Base) 2-hydroxybutyl acrylate, 4-hydroxybutyl (meth)acrylate, 2-hydroxyhexyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyl (meth)acrylate Octyl ester, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, (4-hydroxymethylcyclohexyl)methacrylate, polypropylene glycol mono(meth)acrylate, N -Hydroxyethyl (meth)acrylamide, N-hydroxypropyl (meth)acrylamide, etc. The hydroxyl group-containing acrylic monomer may be used alone or in combination of two or more.

Among hydroxyl group-containing acrylic monomers, hydroxyl group-containing (meth)acrylates are preferred. The (meth)acrylate containing hydroxyl group is preferably 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, (meth)acrylic acid 2-Hydroxybutyl, 4-Hydroxybutyl (meth)acrylate, etc.

Regarding the acrylic polymer having a hydroxyl group, the proportion of the acrylic monomer containing a hydroxyl group in the total amount of monomers used for its synthesis may be, for example, in the range of 0.01% by mass to 20% by mass, preferably 0.05% by mass to 15% by mass. %, more preferably in the range of 0.1% by mass to 10% by mass.

The acrylic polymer may contain, as a polymerization component, an acrylic monomer having a functional group other than a hydroxyl group and a monomer other than the acrylic monomer (hereinafter also referred to as another monomer). Other monomers may be used, for example, for the purpose of adjusting Tg, adhesive properties, etc. of the acrylic polymer. For example, monomers that can improve the cohesion and heat resistance of adhesives include: sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, cyano group-containing monomers, vinyl esters, aromatic vinyl compounds Wait. In addition, examples of monomers that introduce functional groups that can serve as crosslinking points into acrylic polymers or contribute to the improvement of adhesive force include carboxyl group-containing monomers, acid anhydride group-containing monomers, acyl-containing Amine-based monomers, amine-containing monomers, imide-containing monomers, epoxy-containing monomers, (meth)acrylmorpholine, vinyl ethers, etc. The other monomers may be used alone or in combination of two or more.

Examples of sulfonic acid group-containing monomers include: styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid acid, sulfopropyl (meth)acrylate, (meth)acryloxynaphthalenesulfonic acid, sodium vinylsulfonate, etc.

As a monomer containing a phosphoric acid group, 2-hydroxyethyl acryloyl phosphate etc. are mentioned.

As a cyano group-containing monomer, acrylonitrile, methacrylonitrile, etc. are mentioned.

Examples of vinyl esters include vinyl acetate, vinyl propionate, vinyl laurate, and the like.

Examples of the aromatic vinyl compound include styrene, substituted styrenes (chlorostyrene, chloromethylstyrene, α-methylstyrene, etc.), and the like.

Examples of carboxyl group-containing monomers include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, Methacrylate, etc.

Examples of the acid anhydride group-containing monomer include maleic anhydride, itaconic anhydride, acid anhydrides of the above-mentioned carboxyl group-containing monomer, and the like. Examples of amide group-containing monomers include: acrylamide, methacrylamide, diethylacrylamide, N-vinylpyrrolidone, N,N-dimethylacrylamide, N, N-Dimethylmethacrylamide, N,N-diethylacrylamide, N,N-diethylmethacrylamide, N,N'-methylenebisacrylamide, N, N-dimethylaminopropyl acrylamide, N,N-dimethylaminopropyl methacrylamide, diacetone acrylamide, etc. Examples of amino group-containing monomers include aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethyl (meth)acrylate Aminopropyl Etc. Examples of the imide group-containing monomer include cyclohexylmaleimide, isopropylmaleimide, N-cyclohexylmaleimide, itaconimide, and the like. Glycidyl (meth)acrylate, methylglycidyl (meth)acrylate, allyl glycidyl ether, etc. are mentioned as an epoxy group containing monomer. Examples of vinyl ethers include methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, and the like.

When the acrylic polymer contains other monomers as polymerization components, the content of other monomers is preferably 40% by mass or less of the total amount of monomers used in the synthesis of the acrylic polymer. , more preferably 30% by mass or less. Moreover, it is preferable that the sum total of other monomers is 0.001 mass % or more in the monomer total amount used for the synthesis|combination of an acryl-type polymer.

As an acrylic polymer, what used only an acrylic monomer as a polymerization component may be sufficient. Examples of acrylic polymers containing only acrylic monomers as polymerization components include acrylic polymers containing only alkyl (meth)acrylates having 6 to 14 carbon atoms as polymerization components, An acrylic polymer or the like in which an alkyl (meth)acrylate having a number of 6 to 14 and a hydroxyl group-containing (meth)acrylate are polymerized components.

The standard polystyrene-equivalent weight average molecular weight (Mw) of the acrylic polymer obtained by gel permeation chromatography (GPC) may be, for example, 20×10 ⁴ or more, preferably 30×10 ⁴ or more. Also, for example, it may be 90´10 ⁴ or less, preferably 80´10 ⁴ or less. There exists a tendency for the adhesive agent which shows favorable adhesive performance to be obtained as the weight average molecular weight of an acryl-type polymer exists in the said range.

The acrylic polymer may be a random copolymer, a block copolymer, or a graft copolymer. From the viewpoint of productivity and the like, a random copolymer is usually preferred.

The glass transition temperature (Tg) of the acrylic polymer is preferably -15°C or lower, more preferably -25°C or lower, further preferably -40°C or lower. In addition, the glass transition temperature (Tg) is preferably -70°C or higher. When the glass transition temperature (Tg) of an acryl-type polymer exists in the said range, it exists in the tendency for the adhesive agent which shows favorable adhesive performance to be formed.

The Tg of the acrylic polymer used in this specification refers to the Tg of the homopolymer (homopolymer) based on each monomer constituting the acrylic polymer, and the mass fraction of the monomer (copolymerization ratio on a mass basis) based on The value obtained from the formula of Fox. Therefore, the Tg of the acrylic polymer can be adjusted by appropriately changing the monomer composition (that is, the type of monomer used in the synthesis of the acrylic polymer, the ratio of the amount used, and the like). Here, as the Tg of the homopolymer, that described in a known material ("Polymer Handbook" (3rd edition, John Wiley & Sons, Inc, 1989)) is used. value. As the Tg of the homopolymer, specifically, the following values are used.

Homopolymer of 2-ethylhexyl acrylate: -70°C Homopolymer of n-butyl acrylate: -55°C Homopolymer of ethyl acrylate: -22°C Homopolymer of methyl acrylate: 8°C Methyl Homopolymer of methyl acrylate: 105°C Homopolymer of cyclohexyl methacrylate: 66°C Homopolymer of vinyl acetate: 32°C Homopolymer of styrene: 100°C Homopolymer of acrylic acid: 106°C Homopolymer of methacrylic acid: 130°C

Tg of a homopolymer not described in "Polymer Handbook" is a value measured by the following method. 100 parts by mass of monomers, 0.2 parts by mass of azobisisobutyronitrile, and 200 parts by mass of ethyl acetate as a polymerization solvent were charged into a reactor equipped with a thermometer, a stirrer, a nitrogen gas introduction pipe, and a reflux cooling pipe, and nitrogen gas was circulated. Stir at room temperature (25°C) for 1 hour. After removing oxygen in the polymerization system in this way, the temperature was raised to 63° C., and the reaction was carried out for 10 hours. Then, it cooled to room temperature (25 degreeC), and the homopolymer solution whose solid content concentration was 33 mass % was obtained. Next, this homopolymer solution was cast-coated on a release liner (release liner), and dried to prepare a test sample (sheet-shaped homopolymer) having a thickness of about 2 mm. The test sample was punched into a disc shape with a diameter of 7.9 mm, and clamped by a parallel plate, and a viscoelasticity testing machine (ARES, Rheometrics) was used to impart a shear strain at a frequency of 1 Hz, and the temperature range - Viscoelasticity was measured in a shear mode at a heating rate of 70°C to 150°C and 5°C/min, and the peak top temperature of tan δ was defined as the Tg of the homopolymer.

The method for synthesizing the acrylic polymer is not particularly limited, and generally used methods such as solution polymerization, emulsion polymerization, block polymerization, and suspension polymerization can be applied. From the viewpoint of easiness of preparation of a solvent-based adhesive composition containing an acrylic polymer, a solution polymerization method is preferable. The organic solvent (polymerization vehicle) used in the solution polymerization method is not particularly limited, and examples thereof include toluene, ethyl acetate, hexane, and cyclohexane. The organic solvent used may be single type, or may be two or more types.

The term "solvent-type adhesive composition" in this specification refers to a composition in the form of an adhesive component contained in an organic solvent. The organic solvent is not particularly limited. For example, toluene, xylene, ethyl acetate, hexane, cyclohexane, methylcyclohexane, isopropyl alcohol, etc. are mentioned. An organic solvent may be used alone or in combination of two or more. The solvent-based adhesive composition preferably has a non-volatile component (Non-Volatile, NV) of 30% to 60% by mass, more preferably 30% to 50% by mass. The viscosity of the solvent-based adhesive composition is preferably from 3 Pa･s to 25 Pa･s, more preferably from 5 Pa･s to 15 Pa･s. In addition, the said viscosity means the value measured using the rotational viscometer in 23 degreeC environment.

Acrylic adhesives can be engineered in such a way that acrylic polymers are cross-linked. As a specific method of crosslinking an acrylic polymer, a method may be mentioned in which a monomer having a functional group (hydroxyl group, carboxyl group, etc.) It is introduced into an acrylic polymer, and a compound (crosslinking agent) capable of reacting with the functional group to form a crosslinked structure is added to the acrylic polymer to react.

The crosslinking agent is not particularly limited, and may be selected from general compounds used for crosslinking acrylic polymers. For example, epoxy-based cross-linking agents, isocyanate-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, metal Salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, amine-based cross-linking agents, etc., wherein epoxy-based cross-linking agents and Isocyanate-based crosslinking agent. The crosslinking agent used may be one kind alone, or two or more kinds thereof.

Examples of epoxy-based crosslinking agents include: N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidyl aniline, 1,3-bis(N,N-diglycidyl Glycerylaminomethyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol Diglycidyl ether, Polypropylene glycol diglycidyl ether, Sorbitol polyglycidyl ether, Glycerol polyglycidyl ether, Pentaerythritol polyglycidyl ether, Polyglycerol polyglycidyl ether, Sorbitan polyglycidyl ether , trimethylolpropane polyglycidyl ether, diglycidyl adipate, diglycidyl o-phthalate, triglycidyl-tris(2-hydroxyethyl) isocyanurate, m- Hydroquinone diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resins having two or more epoxy groups in the molecule, and the like.

Examples of isocyanate-based crosslinking agents include lower aliphatic polyisocyanate compounds such as 1,2-ethylidene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; Aliphatic polyisocyanate compounds such as pentyl diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate; 2,4-toluene diisocyanate, 2,6-toluene diisocyanate , 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate and other aromatic polyisocyanate compounds.

The usage-amount of a crosslinking agent can be set as about 0.01 mass part - 15 mass parts, for example with respect to 100 mass parts of acrylic polymers, Preferably it is 0.1 mass part - 10 mass parts (for example, 0.2 mass part - 2 mass parts share). In the case where the crosslinking agent is contained in the above usage amount, there is a tendency that an adhesive exhibiting good adhesive performance can be obtained.

The acrylic adhesive may contain various additives as necessary. Examples of additives include surface lubricants, leveling agents, antioxidants, preservatives, light stabilizers, ultraviolet absorbers, polymerization inhibitors, silane coupling agents, and the like.

The acrylic adhesive may also contain an adhesiveness imparting resin as needed. The type of tackifying resin is not particularly limited, and examples thereof include rosin-based tackifying resins, terpene-based tackifying resins, hydrocarbon-based tackifying resins, epoxy-based tackifying resins, and polyamide-based tackifying resins. Imparting resins, elastic-based adhesiveness-imparting resins, phenolic adhesiveness-imparting resins, ketone-based adhesiveness-imparting resins, etc. The tackiness-imparting resin contained in the acrylic adhesive may be one kind alone, or two or more kinds thereof.

Examples of rosin-based tackifying resins include unmodified rosins (raw rosins) such as gum rosin, wood rosin, and tall oil rosin; unmodified rosins modified by hydrogenation, disproportionation, polymerization, etc. Modified rosin (hydrogenated rosin, disproportionated rosin, polymerized rosin, rosin modified by other chemical methods, etc.); other various rosin derivatives, etc. Examples of rosin derivatives include those obtained by esterifying unmodified rosin or modified rosin with alcohols (rosin ester); those obtained by modifying unmodified rosin or modified rosin with unsaturated fatty acids (unsaturated fatty acid modified rosin); modified rosin ester by unsaturated fatty acid (unsaturated fatty acid modified rosin ester); unmodified rosin, modified rosin, unsaturated fatty acid modified rosin or unmodified rosin Carboxyl groups in modified rosin esters modified by saturated fatty acids are reduced (abietin alcohol); unmodified rosin, modified rosin and metal salts of the rosin derivatives (especially rosin esters); by using acid catalysts Rosin phenol resins obtained by adding phenol to unmodified rosin, modified rosin, and the rosin derivatives and thermally polymerizing them.

Examples of terpene-based adhesiveness-imparting resins include terpene-based resins such as α-pinene polymers, β-pinene polymers, and dipentene polymers; modification of these terpene-based resins (phenol-modified , aromatic modification, hydrogenation modification, hydrocarbon modification, etc.) modified terpene-based resins, etc. Examples of the modified terpene-based resin include terpene-phenol-based resins, styrene-modified terpene-based resins, aromatic-modified terpene-based resins, hydrogenated terpene-based resins, and the like.

Examples of hydrocarbon-based tackifying resins include aliphatic hydrocarbon resins, aromatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, aliphatic and aromatic petroleum resins (styrene-olefin copolymers, etc.), Aliphatic and cycloaliphatic petroleum resins, hydrogenated hydrocarbon resins, coumarone-based resins, coumarone-indene-based resins, etc. Examples of the aliphatic hydrocarbon resin include polymers of one or more aliphatic hydrocarbons selected from olefins and dienes having about 4 to 5 carbon atoms. Examples of olefins include 1-butene, isobutene, 1-pentene and the like. As dienes, butadiene, 1,3-pentadiene, isoprene, etc. are mentioned.

Examples of aromatic hydrocarbon resins include vinyl group-containing aromatic hydrocarbons (styrene, vinyltoluene, α-methylstyrene, indene, methylindene, etc.) with about 8 to 10 carbon atoms. aggregates etc.

Examples of aliphatic cyclic hydrocarbon resins include alicyclic hydrocarbon resins obtained by cyclodimerizing so-called "C4 petroleum fractions" or "C5 petroleum fractions" and polymerizing them; cyclic dienes Compounds (cyclopentadiene, dicyclopentadiene, ethylidene norbornane, dipentene, etc.) Alicyclic hydrocarbon resins obtained by hydrogenating rings, etc.

The tackiness-imparting resin preferably has a softening point (softening temperature) of 80° C. or higher (preferably 100° C. or higher). There is a tendency that an adhesive with higher performance (for example, high adhesiveness) can be obtained by using such an adhesiveness-imparting resin. The upper limit of the softening point of the tackiness-imparting resin is not particularly limited, and may be, for example, 200° C. or lower (preferably 180° C. or lower). In addition, the softening point of the tackiness-imparting resin referred to here is defined as the softening point test method specified by any one of Japanese Industrial Standards (Japanese Industrial Standards, JIS) K 5902: 2006 and JIS K 2207: 2006 ( The value determined by the ring and ball method.

The usage-amount of tackiness imparting resin is not specifically limited, It can set suitably according to the tackiness performance (adhesive force etc.) aimed at. For example, it is preferable to use 10 to 100 parts by mass (preferably 15 to 80 parts by mass, more preferably 20 to 60 parts by mass) based on solid content relative to 100 parts by mass of the acrylic polymer. parts) using the tack-imparting resin.

(3) Rubber-based adhesive The rubber-based adhesive used in this specification refers to an adhesive in which a rubber-based polymer is used as a base polymer. The rubber-based polymer is not particularly limited, and may be a natural rubber-based polymer (including a modified natural rubber-based polymer) or a synthetic rubber-based polymer. Examples of synthetic rubber-based polymers include ABA-type or AB-type block copolymers (A represents a thermoplastic block, B represents a rubber block. Styrene-isoprene-styrene copolymer (Styrene-Isoprene- Styrene, SIS), styrene-butadiene-styrene copolymer (Styrene-Butadiene-Styrene, SBS) etc.). The rubber-based polymer may be a combination of a natural rubber-based polymer and a synthetic rubber-based polymer.

When the rubber-based adhesive contains a synthetic rubber-based polymer, examples of the synthetic rubber-based polymer include polybutadiene, polyisoprene, butyl rubber, polyisobutylene, styrene butadiene rubber ( Styrene Butadiene Rubber, SBR), Styrene-Butadiene-Styrene Block Copolymer (SBS), Styrene-Ethylene-Butylene-Styrene Block Copolymer (Styrene-Ethylene-Butylene-Styrene, SEBS), Styrene-isoprene-styrene block copolymer (SIS), etc.

When the rubber-based adhesive contains a modified natural rubber-based polymer, the modified natural rubber-based polymer is preferably 50% by mass or more (for example, 60% by mass or more) of structural moieties derived from natural rubber. Examples of the modified natural rubber-based polymer include graft-modified natural rubber-based polymers obtained by grafting other monomers onto the natural rubber-based polymer, and the like. Examples of the monomer grafted onto the natural rubber-based polymer include acrylic monomers (monomers having an acryl group or a methacryl group), styrene, and the like. The monomer to be grafted to the natural rubber-based polymer may be one kind alone, or two or more kinds thereof.

Examples of acrylic monomers grafted onto natural rubber-based polymers include alkyl acrylates (for example, methyl acrylate, ethyl acrylate, isopropyl acrylate, tertiary butyl acrylate, etc. 1 to 16 alkyl acrylate), alkyl methacrylate (for example, methyl methacrylate (MMA), ethyl methacrylate, isopropyl methacrylate, third methacrylate C1-C16 alkyl methacrylates such as butyl esters), acrylic acid, methacrylic acid, and the like. The modified natural rubber-based polymer is preferably one in which 50% by mass or more of monomers grafted to the natural rubber-based polymer are acrylic monomers (acrylic acid-modified natural rubber-based polymer).

In the case where the base polymer of the rubber-based adhesive is a natural rubber-based polymer, for example, the natural rubber-based polymer is preferably MS (1+4) 100°C (use an L-shaped rotor, preheat for 1 minute, and measure the viscosity The Mooney viscosity is about 10 to 60 under the measurement conditions of 4 minutes and a test temperature of 100°C. In another aspect, an acrylic-modified natural rubber-based polymer (NR-MMA graft copolymer) obtained by grafting methyl methacrylate (MMA) to a natural rubber-based polymer is preferred. The said graft copolymer can be manufactured by a normal method, and can also acquire it as a commercial item. The graft ratio of MMA in the NR-MMA graft copolymer (expressed by the mass of MMA bonded to natural rubber/the mass of natural rubber used for grafting ´100 (%) is usually the same as that used for NR -The mass ratio of the natural rubber and MMA produced by the MMA graft copolymer is equal to the calculated value) For example, it can be set to 1% to 120%, preferably 5% to 100%, more preferably 10% to 90%, More preferably, it is 30% to 80%. The grafting rate is preferably from 50% to 90%, more preferably from 60% to 80%. When the grafting rate is 1% or more, the adhesive force can be suppressed from becoming too high, and when the grafting rate is 120% or less, the adhesive force to adherends such as SUS plates can be prevented from becoming too low. A part of MMA used in the production of the NR-MMA graft copolymer (for example, 5% by mass or less, typically 3% by mass or less of the monomers grafted to natural rubber) may be substituted with other monomers.

The rubber-based adhesive may contain other polymers (hereinafter also referred to as subpolymers) in addition to the base polymer. Examples of subpolymers include acrylic polymers, polyacrylic polymers that can be used as base polymers of known acrylic adhesives, polyester adhesives, polyurethane adhesives, silicone adhesives, etc. Ester polymers, polyurethane polymers, silicone polymers, etc. Or it may be other than the base polymer in the said rubber-type polymer. The subpolymer contained in the rubber-based adhesive may be a single type or two or more types. Examples of the combination of the base polymer and the subpolymer include a combination of a natural rubber polymer as the base polymer and an NR-MMA graft copolymer as the subpolymer, and a NR-MMA graft copolymer as the base polymer. A combination of a copolymer and a natural rubber-based polymer as a subpolymer, etc.

When the rubber-based adhesive contains a base polymer and a subpolymer, it can be used in an amount of 100 parts by mass or less relative to 100 parts by mass of the base polymer (in the case of two or more subpolymers, the total) using subpolymers. Usually, it is appropriate to make the usage-amount of the subpolymer 70 mass parts or less with respect to 100 mass parts of base polymers, Preferably it is 50 mass parts or less. The rubber-based adhesive may not substantially contain a subpolymer (that is, substantially 100% by mass of the polymer component is the base polymer). In addition, a rubber-based adhesive that does not substantially contain polymer components other than rubber-based polymers (for example, a rubber-based adhesive that does not substantially contain polymer components other than natural rubber and modified natural rubber) may be used.

The rubber-based adhesive may contain an adhesiveness imparting agent in addition to the polymer component. In particular, when a natural rubber-based polymer with low adhesiveness itself is included as a polymer component, by including an adhesiveness-imparting agent, it is possible to exhibit high adhesiveness to various adherends. When the rubber-based adhesive contains the tackiness-imparting agent, examples of the tackiness-imparting agent include those exemplified as the tackiness-imparting resin that may be contained in the acrylic adhesive.

In the case where the rubber-based adhesive includes a polymer component and an adhesiveness-imparting agent, for example, the amount of the adhesiveness-imparting agent (in the case of two or more types of adhesiveness-imparting agents) can be adjusted relative to 100 parts by mass of the polymer component. , and the total thereof) shall be 20 to 150 parts by mass (preferably 30 to 100 parts by mass). When the usage-amount of an adhesiveness imparting agent is 20 mass parts or more, the adhesive force with respect to adherends, such as a lead frame, exists in the tendency for sufficient acquisition. On the other hand, when the usage-amount of the tackiness imparting agent is 150 mass parts or less, the adhesive force (particularly the adhesive force in a low-temperature environment) with respect to the adherend, such as a lead frame, tends to be fully acquired.

The method of applying the rubber-based adhesive to the substrate is not particularly limited. For example, an adhesive composition obtained by dissolving or dispersing the components to be a rubber-based adhesive in an appropriate medium is applied to the base material and dried to form an adhesive layer directly on the base material, preferably. known methods such as a method of transferring an adhesive layer formed on a peelable surface to a substrate. The adhesive composition can be prepared, for example, by conventionally mixing a polymer component, typically an adhesive agent, other components used as necessary, and the medium.

The rubber-based adhesive may also contain a vulcanization accelerator as necessary. As the vulcanization accelerator, dithiocarbamic acids (sodium dimethyldithiocarbamate, sodium diethyldithiocarbamate, zinc dimethyldithiocarbamate, zinc diethyldithiocarbamate, etc.), thiazole Classes (2-mercaptobenzothiazole, dibenzothiazolyl disulfide, etc.), guanidines (diphenylguanidine, di-o-tolylguanidine, etc.), sulfenamides (benzothiazolyl-2- Diethylsulfenamide, N-cyclohexyl-2-benzothiazolylsulfenamide, etc.), thiurams (tetramethylthiuram monosulfide, tetramethylthiuram disulfide, etc.) , xanthic acids (sodium isopropyl xanthate, zinc isopropyl xanthate, etc.), aldehydes and ammonia (acetaldehyde ammonia, hexamethylenetetramine, etc.), aldehydes and amines (n-butyl aldehyde aniline, butyl aldehyde monobutylamine, etc.), thioureas (diethylthiourea, trimethylthiourea, etc.), etc. The vulcanization accelerator contained in the rubber-based adhesive may be a single type or two or more types. For example, dithiocarbamic acids and thiurams may be used in combination. For example, the vulcanization accelerator may be used in an amount of 0.1 to 10 parts by mass (preferably 0.5 to 5 parts by mass) relative to 100 parts by mass of the polymer component.

The rubber-based adhesive may also contain a crosslinking agent as necessary. Examples of the crosslinking agent include isocyanate compounds, sulfur, sulfur-containing compounds, phenol resins, organometallic compounds, and the like. The crosslinking agent is preferably an isocyanate compound, more preferably a difunctional or higher isocyanate compound. Examples of isocyanate compounds having more than two functions include: lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone diisocyanate Cycloaliphatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate and other aromatic diisocyanates; trimethylolpropane/toluene diisocyanate Trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate) L"), trimethylolpropane/hexamethylene diisocyanate trimer adduct (Nippon Polyurethane Industrial Co., Ltd., trade name "Coronate (Coronate) HL"), isocyanurate body of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate (Coronate) HL") Coronate) HX") and other isocyanate adducts, etc. The crosslinking agent contained in the rubber-based adhesive may be a single type or two or more types. It is preferable to set the usage-amount (in the case of an isocyanate compound) of a crosslinking agent to 0.3-10 mass parts (for example, 0.5-5 mass parts) with respect to 100 mass parts of polymer components.

The rubber-based adhesive may also contain a vulcanization accelerator as necessary. Zinc stearate etc. are mentioned as a vulcanization acceleration auxiliary agent. By using a vulcanization accelerator, the vulcanization accelerator can be activated to increase vulcanization efficiency. When the vulcanization accelerator is included, for example, the amount used may be 0.1 to 10 parts by mass (preferably 0.5 to 5 parts by mass) relative to 100 parts by mass of the polymer component.

The rubber-based adhesive may contain additives as necessary. Examples of additives include softeners, flame retardants, antistatic agents, light stabilizers (radical scavengers, ultraviolet absorbers, etc.), antioxidants, and the like.

(4) Urethane-Based Adhesive The urethane-based adhesive used in this specification refers to an adhesive in which a urethane polymer is used as a base polymer. Examples of the urethane polymer include polymers obtained by reacting polyols with polyisocyanate compounds, preferably terminal isocyanate group-containing urethanes obtained by reacting polyols with excess polyisocyanate compounds. Ester prepolymer (hereinafter referred to as "terminated NCO prepolymer"). The terminal NCO prepolymer can be synthesized by reacting various polyols with excess polyisocyanate compound such that the equivalent ratio of OH to NCO (number of OH/number of NCO) is 1/1.2 to 3.5. The reaction can be carried out with appropriate reaction catalysts (organic tin catalysts such as dibutyltin dilaurate, bismuth catalysts such as bismuth octoate, tertiary catalysts such as 1,4-diaza[2.2.2]bicyclooctane, etc. amine-based catalyst, etc.), for example, at 20° C. to 90° C. (preferably 60° C. to 90° C.) and 1 hour to 7 hours.

From the viewpoint of the storage stability of the prepolymer and the flexibility of the cured product, the content of the terminal isocyanate group (NCO) in the terminal NCO prepolymer is preferably 0.2 mass % to 15.0 mass %, more preferably 0.5 mass % % to 3.5% by mass. The number average molecular weight of the terminal NCO prepolymer is usually 3,000 to 50,000, preferably 4,000 to 30,000 from the viewpoint of handling.

Examples of polyols include propylene oxide or propylene oxide and alkylene oxides such as ethylene oxide, ethylene glycol, propylene glycol, glycerin, trimethylolpropane, pentaerythritol, sorbitol, sucrose, etc. Polyether polyols formed by addition polymerization of polyhydric alcohols; ethylene glycol, propylene glycol and their oligomeric glycols; butylene glycol, hexylene glycol, and polytetramethylene ether Diols; polycaprolactone polyols; polyester polyols such as polyethylene glycol adipate; polybutadiene polyols; high-level fatty acid esters with hydroxyl groups such as castor oil; Polymer polyols obtained by grafting ether polyols or polyester polyols, etc. The polyhydric alcohol used for the synthesis|combination of a urethane polymer may be single 1 type, and may be 2 or more types.

Polyols can also be polymers. When the polyol is a polymer, its number average molecular weight is preferably from 500 to 20,000, more preferably from 1,000 to 20,000, from the viewpoint of reactivity and workability. From the viewpoint of suppressing foaming, workability, curability and stability of physical properties, especially from the viewpoint of obtaining an excellent balance of these properties when combined with a specific curing catalyst described later, the polyol is preferably Polyoxyalkylene polyols as adducts of propylene oxide, or polyoxyalkylene polyols as adducts of propylene oxide and ethylene oxide. From a practical point of view, polyoxyalkylene polyol (that is, polypropylene glycol) which is an adduct of propylene oxide is more preferable, and polypropylene glycol is still more preferable.

The polyol may also be rosin diol. By using rosin diol, the adhesive force of the adhesive becomes more excellent. Rosin diol is a diol having two rosin skeletons and a hydroxyl group in the molecule. Examples of the rosin diol include rosin esters obtained by reacting rosin with polyhydric alcohols, reaction products of rosin and bisphenol A diglycidyl ether, and the like. These rosin diols can be produced by a previously known method. Among rosin diols, those having a polyoxyalkylene skeleton are preferred from the viewpoint of compatibility with NCO-terminated prepolymers. Examples of commercially available rosin diols having a polyoxyalkylene skeleton include Pinecrystal D-6011, KE-615-3, and D-6250 (all of which are Arakawa Chemical Co., Ltd. )Wait.

Rosin diol is preferably used in combination with other polyols. The other polyol is preferably polypropylene glycol. When using rosin diol and other polyols in combination, the amount of rosin diol used is preferably 50% by mass or less of the total amount of polyols, more preferably 2% by mass to 30% by mass, from the viewpoint of properties after hardening. % by mass, more preferably 3% by mass to 15% by mass.

The polyols can also be polyfunctional polyols. For example, by using a tetrafunctional or higher (preferably tetrafunctional to octafunctional) polyfunctional polyol, the adhesive becomes more excellent in the adhesive force (peel strength) after curing of the adhesive.

Examples of polyfunctional polyols include tetraols (pentaerythritol, diglycerol, etc.), pentaols (triglycerol, galactose, etc.), hexaols (dipentaerythritol, sorbitol, etc.), heptaols, octals (tripentaerythritol, etc.) , sucrose, etc.), those obtained by adding ethylene oxide, propylene oxide, etc. to these polyfunctional polyols, etc. From the viewpoint of versatility and effect, an alkoxide adduct of pentaerythritol is preferable. These polyfunctional polyols can be produced by a conventionally known method, and can also be obtained as a commercial item. Examples of commercially available polyfunctional polyols include EL-410NE (Asahi Glass Co., Ltd.), POLYPL 4525 (Perstorp Specialty Chemicals AB), and the like.

Multifunctional polyols can also be polymers. When the polyfunctional polyol is a polymer, the number average molecular weight thereof is usually 100 to 2,000, and preferably 300 to 700 from the viewpoint of properties and reactivity.

The polyfunctional polyol is preferably used in combination with other polyols. The other polyol is preferably polypropylene glycol, more preferably a combination of polypropylene glycol and rosin glycol. In the case of using a polyfunctional polyol in combination with other polyols, from the viewpoint of the flexibility of the cured product (adhesive), the amount of the polyfunctional polyol used is preferably such that the number of hydroxyl groups of the polyfunctional polyol becomes multiple The amount is 60% or less of the number of hydroxyl groups in the entire alcohol, more preferably 5% to 20%.

The polyisocyanate compound is not particularly limited, and may be any one belonging to aromatic, aliphatic, or alicyclic. Specifically, toluene diisocyanate (Toluene diisocyanate, TDI), diphenylmethane diisocyanate (Diphenylmethane diisocyanate, MDI), 3,3'-dimethyl-4,4'-biphenyl diisocyanate, 1,4-phenylene diisocyanate, xylylene diisocyanate, tetramethyl xylylene diisocyanate, naphthalene diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, crude TDI, Polymethylene. Polyphenylisocyanate, isophorone diisocyanate (IPDI), hexamethylene diisocyanate, hydrogenated xylylene diisocyanate, and the like. In addition, isocyanurate compounds, carbodiimide compounds, biuret compounds, etc. of these polyisocyanate compounds may be used. The polyisocyanate compound used for the synthesis|combination of a urethane polymer may be single 1 type, and may be 2 or more types. Among them, IPDI is preferred from the viewpoints of properties of the prepolymer, flexibility after curing, non-yellowing property, and safety.

The polyisocyanate compound is preferably a polyfunctional polyisocyanate containing more than trifunctional (preferably trifunctional to hexafunctional). By using the polyfunctional polyisocyanate of trifunctional or more, the adhesive force (adhesive strength) after hardening of an adhesive becomes more excellent. Commercially available polyfunctional polyisocyanates include: Coronate (Coronate) HX (alicyclic polyisocyanate, Nippon Polyurethane Industry Co., Ltd.), Takenate (Takenate) D-170N (alicyclic Polyisocyanate, Takeda Pharmaceutical Co., Ltd.), Sumidur (Sumidur) N-3500 (aliphatic polyisocyanate, Sumika Bayer Amide Co., Ltd.), Sumidur (Sumidur) N-3200 (aliphatic polyisocyanate Isocyanate, Sumika Bayer Amine Co., Ltd.), Duranate (Duranate) 24A-100 and Duranate (Duranate) E-405-80T (Asahi Kasei Chemical Co., Ltd.), etc.

The polyfunctional polyisocyanate compound is preferably used in combination with other polyisocyanate compounds. The other polyisocyanate compound is preferably IPDI. In the case of using a polyfunctional polyisocyanate compound and another polyisocyanate compound in combination, from the viewpoint of properties after the reaction, the amount of the polyfunctional polyisocyanate compound used is preferably such that the number of NCO groups of the polyfunctional polyisocyanate compound becomes polyfunctional. The quantity is 60% or less of the number of objects of the NCO group of the whole isocyanate compound, More preferably, it is the quantity which becomes 5% - 20%.

The terminal NCO prepolymer can be obtained by reacting a polyol, an excess polyisocyanate compound, and a monoalcohol as needed. In this case, the adhesive agent becomes more excellent in the adhesive force (adhesive strength) after hardening.

Examples of monoalcohols include polyoxyalkylene monoalcohols, polyester monoalcohols, polyether/ester monoalcohols, higher saturated monoalcohols, monoalcohols having ethylenically unsaturated double bonds, and the like. When using monoalcohol, it may be single type, and may be two or more types.

Examples of polyoxyalkylene-based monoalcohols include ring-opening and addition of alkylene oxides such as ethylene oxide, propylene oxide, butylene oxide, and tetrahydrofuran, using an alkyl compound containing one active hydrogen as an initiator. It is a polymerized high molecular weight polyoxyalkylene-based monoalcohol containing a hydroxyl group in the molecule. Examples of polyester monoalcohols include oleic acid, linseed oil, and saturated fatty acid or (meth)acrylic acid, cinnamic acid, or higher unsaturated fatty acid having 10 or more carbon atoms, such as lactone-based polyester monool or polyol. ester monoalcohol obtained from carboxylic acids having ethylenically unsaturated double bonds, such as linoleic acid and linoleic acid, etc., and the lactone-based polyester monool and polyol are obtained by combining the terminal hydroxyl groups of known polyester polyols It is obtained by subjecting a cyclic lactone compound to a ring-opening addition copolymerization reaction or an esterification reaction using an alkylated modified product and a monohydroxy compound as an initiator. Examples of the polyether/ester monool include polyoxyalkylene fatty acid ester monool obtained by addition-polymerizing the (mono)alkylene oxide to fatty acid ester monool, and the like. Examples of higher saturated monoalcohols include linear monovalent higher saturated alcohols having 10 or more carbon atoms such as lauryl alcohol, myristyl alcohol, cetyl alcohol, and stearyl alcohol. Examples of the monoalcohol having an ethylenically unsaturated double bond include straight-chain monovalent higher unsaturated alcohols having 10 or more carbon atoms such as oleyl alcohol, linoleyl alcohol, and linoleyl alcohol, and allyl alcohol. Among these, polyoxyalkylene-based monoalcohols are preferable, and polyoxypropylene alkyl ethers are more preferable from the viewpoint of general use and safety. Monoalcohols can also be polymers. When the monoalcohol is a polymer, the number average molecular weight may be, for example, 100 to 10,000, and preferably 500 to 10,000 from the viewpoint of versatility and handling. As a commercial item of the monoalcohol of a polymer, PML-S1004F (Asahi Glass Co., Ltd.) etc. are mentioned. When using monoalcohol as a polymer, from the viewpoint of performance after curing, the amount of monool used is preferably 5% by mass to 50% by mass, more preferably 5% by mass, based on the total amount of polyols. % to 30% by mass.

The urethane-based adhesive may also contain an adhesiveness imparting agent as needed. The tackiness imparting agent will not be specifically limited as long as it can impart tackiness to a urethane type adhesive, or can improve tackiness. As an tackiness imparting agent, what was mentioned as the tackiness provision resin which can be contained in an acryl-type adhesive is mentioned, for example.

When the urethane-based adhesive contains an adhesive agent, the content of the adhesive agent is preferably 10% by mass of the total amount of the adhesive composition from the viewpoint of a balance between physical properties and performance after hardening. % to 60% by mass, more preferably 10% to 50% by mass.

The urethane-based adhesive may also contain a reactive monofunctional compound as needed. By including a reactive monofunctional compound, the adhesive becomes more excellent in the adhesive force (adhesive strength) after hardening.

The reactive monofunctional compound is not particularly limited as long as it is a monofunctional compound that is reactive in the urethane reaction and can increase the adhesive force (adhesive strength) of the adhesive after hardening. Specifically, examples include the monoalcohols described above as monoalcohols that can be used in the synthesis of terminal NCO prepolymers, monofunctional isocyanate compounds (reaction products of monoalcohols and diisocyanates, etc.), and other compounds capable of performing aminoformation. Monofunctional composition of ester reaction (amine, amide, thiol, carboxylic acid, etc.), etc. The reactive monofunctional compound used may be single type, or may be two or more types. From the viewpoints of safety and versatility, monofunctional isocyanate compounds are preferred, and reactants of monoalcohols and diisocyanates are more preferred. As a reaction product of a monoalcohol and a diisocyanate, Bayer (Bayer) company brand name "additive (additive) TI" etc. are mentioned.

When the urethane-based adhesive contains a reactive monofunctional compound, the amount of the reactive monofunctional compound used is preferably 5% by mass to 50% by mass of the total amount of the adhesive from the viewpoint of performance after curing. % by mass, more preferably 5% by mass to 30% by mass.

The urethane-based adhesive may contain additives as necessary. Examples of additives include: urethane catalysts, plasticizers (acrylate plasticizers, phthalic acid diesters, epoxidized hexahydrophthalic acid diesters, alkylene dicarboxylates, etc.) acid diesters, alkylbenzenes, etc.), fillers (ground calcium carbonate, fatty acid treated calcium carbonate, fumed silica, precipitated silica, carbon black, talc, titanium oxide, balloon, particles, etc.), antioxidants (hindered phenols, etc.), flame retardants, thixotropy imparting agents (colloidal silica, organic bentonite, fatty acid amides, polyamide waxes, hydrogenated castor oil, etc.), ultraviolet absorbers (benzene triazoles, hindered amines, etc.), anti-aging agents (hindered phenols, mercaptans, thioethers, dithiocarboxylates, thioureas, thiophosphates, thioaldehydes, etc.) , bonding agent (epoxy compound, silane coupling agent, etc.), dehydrating agent, etc.

Examples of the urethane catalyst include DBU-based catalysts, amine-based catalysts, organic carboxylic acid metal salts, imidazole-based catalysts, and the like. Examples of the DBU-based catalyst include DBU[1,8-diazabicyclo[5.4.0]undecene-7], DBU phenate, DBU octanoate, DBU formate, and the like. Examples of amine-based catalysts include monoamines (triethylamine, etc.), diamines (N,N,N',N'-tetramethylethylenediamine, etc.), triamines (tetramethylguanidine, etc.) , cyclic amines (triethylenediamine, etc.), alcohol amines (dimethylaminomethanol, etc.), ether amines (bis(2-dimethylaminoethyl) ether, etc.), etc. Examples of metal organic carboxylic acid salts include Sn-based (dibutyltin dilaurate, tin octoate, etc.), Pb-based (lead octoate, etc.), Zn-based (zinc octoate, etc.), and the like. As an imidazole type catalyst, 2-methylimidazole, 1, 2- dimethylimidazole, etc. are mentioned.

The method for preparing the urethane-based adhesive is not particularly limited. For example, a one-pack type urethane adhesive can be produced by mixing the polymer component contained in the urethane adhesive and other components as needed. The urethane-based adhesive may be a solvent-free adhesive that does not substantially contain a solvent. If the urethane-based adhesive does not substantially contain a solvent, when the adhesive is hardened by heat, environmental pollution due to generation of odor, volatile organic compounds (VOC), and the like can be suppressed.

(Filler) The adhesive layer may contain a filler. By containing the filler in the adhesive layer, effects such as roughening the outer surface (the surface opposite to the substrate side) of the adhesive layer can be obtained. The material of the filler is not particularly limited, and may be organic substances such as resins, inorganic substances such as metals and metal oxides, or a combination of organic substances and inorganic substances. In addition, the filler contained in the adhesive layer may be a single type or two or more types.

The volume average particle diameter of the filler is not particularly limited. For example, it can be selected from the range of 1 μm to 20 μm. The volume average particle diameter of the filler in this specification is the particle diameter (D50) when the accumulation from the small diameter side becomes 50% in the volume-based particle size distribution measured by the laser diffraction method.

From the viewpoint of affinity with the adhesive contained in the adhesive layer, the filler is preferably resin particles. Examples of the resin constituting the resin particles include acrylic resins, olefin resins, styrene resins, acrylonitrile resins, silicone resins, and the like. From the viewpoint of suppressing residues on the molded package, an acrylic resin is preferable.

<Base Material> The material of the base material is not particularly limited. From the viewpoint of mold followability, resin is preferable. Examples of the resin include polyesters such as polyethylene terephthalate (PET), polyimides, polyamides, polyester ethers, polyamideimides, and fluorine-containing resins. When using resin, it is preferable that it has sufficient heat resistance with respect to the heating temperature in a sealing process.

If necessary, treatment for improving the adhesion between the base material and the adhesive layer may be performed on the surface of the base material on which the adhesive layer is provided. As the method of treatment, surface treatment such as corona treatment and plasma treatment, application of primer (primer), and the like can be mentioned.

If necessary, a back surface treatment agent for adjusting the self-rolling unwinding property of the adhesive film may be provided to the back surface of the substrate (the surface opposite to the adhesive layer side). Examples of the back surface treatment agent include monomers such as silicone resins, fluorine-containing resins, polyvinyl alcohol, and resins having an alkyl group, modified products, and mixtures.

If necessary, an antistatic agent may be added to the back surface of the base material or the surface on which the adhesive layer is provided in order to suppress the generation of static electricity when the adhesive film is unwound or peeled from the adherend. Examples of antistatic agents include: quaternary ammonium salts, pyridinium salts, cationic antistatic agents having cationic groups such as primary to tertiary amino groups, sulfonate groups, sulfate ester groups, phosphate ester groups, etc. Anionic antistatic agents with anionic bases such as salt bases, amphoteric antistatic agents such as amino acid series and amino acid sulfate series, amino alcohol series, glycerin series, polyethylene glycol series and other nonionic antistatic agents Nonionic antistatic agents, polymer antistatic agents obtained by increasing the molecular weight of these antistatic agents, and the like. These antistatic agents are also preferable in terms of good transparency. [Example]

Hereinafter, the release film of this embodiment is demonstrated based on an Example. However, this embodiment is not limited to the following examples.

<Example 1> Prepare 100 parts by mass of adhesive A, 0.5 parts by mass of catalyst, and 275 parts by mass of solvent (mixture of toluene and methyl isobutyl ketone, mass ratio: 1:1), and stir with a disperser And the composition for adhesive layer formation was prepared. The composition for forming an adhesive layer was applied on the entire surface of one of the substrates (PET film with a thickness of 50 μm) so that the thickness of the adhesive layer became 3 μm, and heated at 120° C. for 1 minute to form an adhesive layer. layer to make a support. Next, as shown in Fig. 2, a copper foil with a length of 232 mm, a width of 67 mm, and a thickness of 9 μm ("F2-WS", Furukawa Electric Co., Ltd.) was bonded to the surface of the support. The adhesive layer forms an electromagnetic wave shielding sheet and is stamped into a specific shape to make a release film.

<Example 2> 100 parts by mass of adhesive B, 10 parts by mass of crosslinking agent A, and 227 parts by mass of solvent (mixture of toluene and methyl ethyl ketone, mass ratio: 8:2) were prepared by a disperser The composition for forming an adhesive layer was prepared by stirring. The composition for forming an adhesive layer was applied to the entire surface of one of the substrates (PET film with a thickness of 38 μm) so that the thickness of the adhesive layer became 3 μm, and heated at 100° C. for 1 minute to form an adhesive layer. layer to make a support. Next, an aluminum layer was formed on the entire surface of the adhesive layer by ion plating to have a thickness of 1 μm, and an electromagnetic wave shielding sheet was formed, which was punched into a specific shape to produce a release film.

<Example 3> Prepare 100 parts by mass of adhesive C, 17.4 parts by mass of crosslinking agent B, 10 parts by mass of filler, and 87 parts by mass of solvent (mixture of toluene and methyl ethyl ketone, mass ratio: 8:2), The composition for forming an adhesive layer was prepared by stirring with a disperser. Except having used this composition for adhesive layer formation, it carried out similarly to Example 2, and produced the release film.

<Comparative example 1> Using the composition for adhesive layer formation prepared similarly to Example 2, it carried out similarly to Example 2, formed the adhesive layer on the base material, and produced the support body. Next, the electromagnetic wave shielding sheet was formed on the adhesive layer similarly to Example 1, and the release film was produced.

The details of each material used for preparation of the release film are as follows. (Adhesive) ･Adhesive A: Addition reaction type silicone adhesive, trade name "LTC755", solid content 30% by mass, Toray Dow Corning Co., Ltd. ･Adhesive B: Acrylic Adhesive, trade name "S-43", solid content 24% by mass, Soken Chemical Co., Ltd., mixed monomer/adhesive C containing butyl acrylate (BA) and 4-hydroxybutyl acrylate (4HBA): Acrylic adhesive, trade name "FS-1208", solid content 45% by mass, Lion Specialty Chemicals Co., Ltd., various mixed monomers containing methacrylate (catalyst) ･Platinum catalyst (Brand name "NC-25", Toray Dow Corning Co., Ltd.) (Crosslinking agent) ･Crosslinking agent A: Brand name "Coronate HL", solid content 75 mass %, Tosoh Co., Ltd., 75% ethyl acetate solution of trimethylolpropane/hexamethylene diisocyanate trimer adduct, number of isocyanate groups in one molecule: 3 ･Crosslinking agent B: Brand name "Duranate (Duranate) E405-80T", solid content 80% by mass, Asahi Kasei Chemical Co., Ltd., polyisocyanate-based crosslinking agent (hexamethylene diisocyanate crosslinking agent (HMDI)), Number of isocyanate groups per molecule: 2 ･Filler: Cross-linked acrylic medium-dispersed particles, trade name "MZ-10HN", volume average particle diameter 10 μm, Soken Chemical Co., Ltd.

<Evaluation test> The following evaluation test was performed using the produced release film.

(1) Peeling force between the adhesive layer and the electromagnetic wave shielding sheet In Example 1 and Comparative Example 1 where the electromagnetic wave shielding sheet was formed by a lamination method, the release film produced was placed in an environment of 170°C, and after a specific After a period of time, the peeling force (N/50 mm) was measured using a Tengsilon universal material testing machine (manufactured by A&D Co., Ltd.) under the peeling conditions of a peeling angle of 180° and a peeling speed of 0.3 m/min. The results are shown in Table 1. In Example 2 and Example 3 where the electromagnetic wave shielding sheet was formed by ion plating, the produced release film was cut into a specific size and placed on a heating plate at 170° C. with the adhesive layer on top. A specific amount of sealing material (trade name "CEL-9750", Hitachi Chemical Co., Ltd.) was dispersed on the adhesive layer, and a PET film with a thickness of 100 μm was placed. Next, a weight of 4 kg was placed on the PET film, and left for 3 minutes until the sealing material hardened. Then, the release film was cut into a width of 50 mm, and put into an environment of 170°C. After 1 minute, the peeling force was measured using a Tengsilon universal material testing machine (manufactured by A&D Co., Ltd.) under the peeling conditions of a peeling angle of 180° and a peeling speed of 0.3 m/min. The results are shown in Table 1.

(2) Transferability of electromagnetic wave shielding sheet Cut the release films produced in Example 1 and Comparative Example 1 into specific sizes, place them on a heating plate at 170°C with the adhesive layer on top, and apply a specific amount of The sealing material (trade name "CEL-9750", Hitachi Chemical Co., Ltd.) was dispersed on the adhesive layer, and a PET film with a thickness of 100 μm was placed. Next, a weight of 4 kg was placed on the PET film, and left for 3 minutes until the sealing material hardened. Then, the electromagnetic wave shielding sheet was peeled off from the support (base material and adhesive layer), and the transferability of the electromagnetic wave shielding sheet was visually confirmed. In Examples 2 and 3, the electromagnetic wave shielding sheet was peeled off from the support (substrate and adhesive layer) in the same manner as the evaluation of the peeling force between the adhesive layer and the electromagnetic wave shielding sheet, and the electromagnetic wave shielding sheet was visually observed. The transferability of the electromagnetic shielding sheet was confirmed.

Regarding the transferability of the electromagnetic wave shielding sheet, it was evaluated as "possible" when the electromagnetic wave shielding sheet could be peeled off from the support without wrinkles, bending, damage, etc., and when the electromagnetic wave shielding sheet was wrinkled, bent, damaged, etc. The case where peeling from the support was evaluated as "impossible". The results are shown in Table 1.

[Table 1]

As shown in the results in Table 1, the release film of the example in which the peeling force between the adhesive layer and the electromagnetic wave shielding sheet was 0.10 N/50 mm to 2.00 N/50 mm had good transferability to the electromagnetic wave shielding sheet. On the other hand, in the release film of the comparative example in which the peeling force between the adhesive layer and the electromagnetic wave shielding sheet was less than 0.10 N/50 mm, wrinkles were generated on the peeled electromagnetic wave shielding sheet, and the transferability of the electromagnetic wave shielding sheet was lower than that of the examples. Difference.

The entire disclosure of Japanese Patent Application No. 2016-091947 is incorporated in this specification by reference. All documents, patent applications and technical specifications described in this specification are incorporated by reference to the same extent as if each document, patent application and technical specification were specifically and individually stated to be incorporated by reference. to this manual.

10‧‧‧Release film 20‧‧‧Support 30‧‧‧Electromagnetic wave shielding sheet 40‧‧‧adhesive layer 50‧‧‧substrate

FIG. 1 is a schematic cross-sectional view showing an example of the structure of a release film according to this embodiment.

Fig. 2 is a schematic plan view showing an example of the structure of the release film of the present embodiment.

10‧‧‧Release film

20‧‧‧Support

30‧‧‧Electromagnetic wave shielding sheet

40‧‧‧adhesive layer

50‧‧‧substrate

Claims (3)

A release film, comprising: a support body, including a base material and an adhesive layer arranged on the base material; and an electromagnetic wave shielding sheet, arranged on the adhesive layer of the support body, and the adhesive layer and the adhesive layer The peeling force between the electromagnetic wave shielding sheets is 0.10N/50mm-2.00N/50mm, wherein the thickness of the electromagnetic wave shielding sheet is 0.01μm-12μm, and the thickness of the adhesive layer is 1μm-3μm. The release film as described in claim 1 of the patent application, wherein the adhesive layer includes at least one selected from the group consisting of silicone adhesives and acrylic adhesives. The release film according to claim 1 or claim 2 of the patent application, which is used in the manufacture of a semiconductor device, the manufacture of which includes transferring the electromagnetic wave shielding sheet to a sealing material for sealing a semiconductor element A step of.

Images