TWI741715B - Carrier device - Google Patents
Carrier device Download PDFInfo
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- TWI741715B TWI741715B TW109126195A TW109126195A TWI741715B TW I741715 B TWI741715 B TW I741715B TW 109126195 A TW109126195 A TW 109126195A TW 109126195 A TW109126195 A TW 109126195A TW I741715 B TWI741715 B TW I741715B
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- limiting member
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
本發明係關於一種承載裝置,特別是有關於一種半導體製程中用於檢測作業之可拆裝式承載裝置。 The present invention relates to a carrying device, in particular to a removable carrying device used for inspection operations in a semiconductor manufacturing process.
隨著電子產業的蓬勃發展,電子產品也逐漸邁向多功能、高性能的趨勢。目前應用於晶片封裝領域之技術繁多,例如晶片尺寸構裝(Chip Scale Package,簡稱CSP)、晶片直接貼附封裝(Direct Chip Attached,簡稱DCA)或多晶片模組封裝(Multi-Chip Module,簡稱MCM)等覆晶型封裝模組、或將晶片立體堆疊化整合為三維積體電路(3D IC)晶片堆疊模組。 With the vigorous development of the electronics industry, electronic products are gradually moving towards the trend of multi-function and high performance. There are many technologies currently used in the field of chip packaging, such as Chip Scale Package (CSP), Direct Chip Attached (DCA), or Multi-Chip Module (Multi-Chip Module). MCM) and other flip-chip package modules, or the three-dimensional stacking and integration of chips into a three-dimensional integrated circuit (3D IC) chip stacking module.
現行封測廠於封測階段所使用的電性測試設備係採用制式化檢測機台,其針對單一電子封裝件及其終端產品進行檢測。 The electrical testing equipment used by the current packaging and testing plants in the packaging and testing phase adopts standardized testing machines, which test a single electronic package and its terminal products.
惟,習知檢測作業中,電子封裝件之規格常常改變,故封測廠需針對不同電子封裝件之設計需求,配置不同之探針卡(Probe Card),因而需配置匹配該探針卡(Probe Card)之檢測機台,導致更換該檢測機台之步驟十分耗時,且購買各種檢測機台之費用亦十分昂貴,導致難以降低電子封裝件及其終端產品之製作成本。 However, in conventional inspection operations, the specifications of electronic packages often change, so packaging and testing factories need to configure different probe cards according to the design requirements of different electronic packages, so they need to be configured to match the probe card ( Probe Card) testing machine, the steps to replace the testing machine is very time-consuming, and the cost of purchasing various testing machines is also very expensive, which makes it difficult to reduce the production cost of electronic packages and their terminal products.
因此,如何克服上述習知技術之種種缺失,已成目前亟欲解決的課題。 Therefore, how to overcome the various deficiencies of the above-mentioned conventional technologies has become an urgent problem to be solved at present.
為解決上述習知技術之問題,本發明遂提出一種承載裝置,係包括:基座,係具有一用於置放目標物之置放區;限位件,係設於該基座之置放區上以限位該目標物;定位件,係以可自如樞轉之方式樞接至該基座或該限位件,且係用以將該目標物定位於該基座之置放區上;以及蓋體,係樞接至該基座以封蓋該目標物。 In order to solve the above-mentioned problems of the prior art, the present invention proposes a bearing device, which includes: a base with a placement area for placing a target; a limiter, which is placed on the base. The target is limited on the area; the positioning member is pivotally connected to the base or the limiting member in a pivotable manner, and is used to position the target on the placement area of the base And the cover, which is pivotally connected to the base to cover the target.
前述之承載裝置中,該置放區係呈鏤空狀,以與該限位件構成一容置空間。 In the aforementioned carrying device, the placing area is hollow to form an accommodating space with the limiting member.
前述之承載裝置中,該限位件係以可拆裝之方式對應設於該基座上。 In the aforementioned carrying device, the limiting member is correspondingly disposed on the base in a detachable manner.
前述之承載裝置中,該限位件係為環圈狀框體。 In the aforementioned carrying device, the limiting member is a ring-shaped frame.
前述之承載裝置中,該限位件係以可相對該基座旋轉之方式設置。 In the aforementioned carrying device, the limiting member is arranged in a manner capable of rotating relative to the base.
前述之承載裝置中,該限位件之邊緣處係配置一固接該定位件之止動部。 In the aforementioned load-bearing device, the edge of the limiting member is provided with a stopper for fixing the positioning member.
前述之承載裝置中,該定位件之邊緣處係配置一固接該限位件之固定部。 In the aforementioned load-bearing device, the edge of the positioning member is provided with a fixing portion for fixing the limiting member.
前述之承載裝置中,該定位件與該基座之間係配置至少一伸縮結構。 In the aforementioned carrying device, at least one telescopic structure is arranged between the positioning member and the base.
前述之承載裝置中,該蓋體與該基座之間係配置至少一伸縮結構。 In the aforementioned carrying device, at least one telescopic structure is arranged between the cover and the base.
前述之承載裝置中,復包括至少一設於該基座上之固定結構,以限制該目標物之線材之位移範圍。 The aforementioned carrying device further includes at least one fixing structure provided on the base to limit the displacement range of the wire of the target.
由上可知,本發明之承載裝置於使用時,主要藉由該限位件及定位件之配合,以將該目標物定位於該置放區中,再將該承載裝置安裝於檢測機台中,故該承載裝置能提升該目標物之擺放穩定度,使該目標物不易受損。因此,藉由該承載裝置進行半導體封裝檢測作業時,可依據電子封裝件之規格取換不同之探針卡(即該目標物),而不需更換檢測機台,以節省檢測時間,且僅需使用單一檢測機台配合該承載裝置即可進行檢測作業,因而能大幅節省設備費用,以利於降低電子封裝件及其終端產品之製作成本。 It can be seen from the above that, when the carrying device of the present invention is in use, the target is positioned in the placement area mainly by the cooperation of the limiting member and the positioning member, and then the carrying device is installed in the inspection machine. Therefore, the load-bearing device can improve the placement stability of the target, so that the target is not easily damaged. Therefore, when the semiconductor package inspection operation is performed by the carrier device, different probe cards (that is, the target) can be exchanged according to the specifications of the electronic package, without the need to replace the inspection machine, so as to save inspection time and only It is necessary to use a single testing machine to cooperate with the carrying device to perform testing operations, which can greatly save equipment costs and help reduce the production costs of electronic packages and their terminal products.
1:承載裝置 1: Carrying device
10:保護件 10: Protective parts
11:基座 11: Pedestal
11a:置放區 11a: Placement area
112:支撐結構 112: Supporting structure
12:限位件 12: Limit parts
12a:內周面 12a: inner peripheral surface
120:止動部 120: Stop
120a:埠口 120a: Port
120b:軌道 120b: Orbit
121:帶動部 121: Driving Department
13:定位件 13: positioning parts
13a:外周面 13a: outer peripheral surface
130:固定部 130: fixed part
131,141:伸縮結構 131, 141: Telescopic structure
132:操控部 132: Control Department
133:緩衝部 133: Buffer
14:蓋體 14: Lid
142:把手 142: Handle
143:缺口 143: Gap
15,16:固定結構 15,16: fixed structure
151:集束部 151: Cluster
161:引導槽 161: guide slot
2:目標物 2: target
A,A’:目標方向 A,A’: target direction
B,C:下壓方向 B, C: Pressing direction
S:容置空間 S: accommodating space
圖1係為本發明之承載裝置之示意圖。 Figure 1 is a schematic diagram of the carrying device of the present invention.
圖2係為本發明之承載裝置於安裝目標物時之上視平面示意圖。 Figure 2 is a schematic top plan view of the carrying device of the present invention when the target is installed.
圖3A至圖3B係為本發明之承載裝置之限位件與定位件於作動時之局部側面示意圖。 3A to 3B are partial side views of the limiting member and the positioning member of the carrying device of the present invention when in operation.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following specific examples illustrate the implementation of the present invention. Those familiar with the art can easily understand the other advantages and effects of the present invention from the contents disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用 以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「第一」、「第二」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當視為本發明可實施之範疇。 It should be noted that the structure, ratio, size, etc. shown in the accompanying drawings in this manual are only used to match the content disclosed in the manual for the understanding and reading of those familiar with the art, not for use In order to limit the conditions under which the present invention can be implemented, it does not have a technically essential meaning. Any structural modification, proportional relationship change, or size adjustment does not affect the effects and objectives that can be achieved by the present invention. All should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms "on", "first", "second" and "one" cited in this specification are only for ease of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall be regarded as the scope of the implementation of the present invention without substantial change in the technical content.
圖1係為本發明之承載裝置1之立體示意圖。如圖1所示,所述之承載裝置1係包括:一基座11、一限位件12、一定位件13以及一蓋體14。
FIG. 1 is a three-dimensional schematic diagram of the carrying device 1 of the present invention. As shown in FIG. 1, the carrying device 1 includes: a
所述之基座11係大致呈矩形座體,其用以承載一目標物2,如圖2所示,且可安裝於一測試機台(圖略)上。
The
於本實施例中,該目標物2係為探針卡(Probe Card),以供測試機台進行檢測。
In this embodiment, the
再者,該基座11之中央處係定義有一供置放該目標物2之置放區11a。例如,該置放區11a係呈圓形鏤空狀,且於該鏤空處之底部形成有一如框架狀之支撐結構112。具體地,於該置放區11a中置放一底部鏤空之盆狀保護件10,且該支撐結構112係呈對稱式框架而配置於該保護件10底部,以穩定承載該目標物2。應可理解地,有關該置放區11a之態樣之種類繁多,並不限於上述,特此敘明。
Furthermore, a
所述之限位件12係為環圈狀框體,其以可拆裝之方式對應該置放區11a而設於該基座11上,以利於替換不同尺寸之限位件12。
The limiting
於本實施例中,該限位件12係靠合該保護件10之壁面,以置放於該基座11之上表面,使該限位件12不會從該置放區11a掉落,且利於拆裝。例如,該限位件12係大致對齊該置放區11a之邊緣以於該置放區11a中構成一容
置空間S而框住該目標物2,因而有利於安裝該目標物2。具體地,該限位件12可相對該基座11旋轉,以轉動至所需之位置。應可理解地,有關該限位件12之種類繁多,並不限於上述,特此敘明。
In this embodiment, the limiting
再者,該限位件12之邊緣之至少一處可依需求配置至少一止動部120,以止動該定位件13。例如,該止動部120係為轉角溝槽,如圖3A所示,該止動部120係具有一埠口120a及一連通該埠口120a且相對該埠口120a轉向之軌道120b。具體地,該埠口120a係連通該限位件12之頂面,且該軌道120b係沿該限位件12之內周面12a斜向延伸形成。
Furthermore, at least one
又,該限位件12可依需求配置一如握把之帶動部121,以利於扳動或轉動該限位件12。
In addition, the limiting
所述之定位件13係為環形框體,其以可自如樞轉之方式樞接至該基座11之一側及/或該限位件12之一側,以靠近或遠離該限位件12進行位移,且該定位件13係用以將該目標物2定位於該基座11之置放區11a上。
The positioning
於本實施例中,該定位件13於相對於樞接處之另一側係設有可供握持之操控部132,如把手,以便於操作人員握持該操控部132而掀起或蓋下該定位件13。
In this embodiment, the positioning
再者,該基座11與該定位件13之間可依需求配置至少一如油壓桿或氣壓桿之伸縮結構131。例如,該伸縮結構131係為伸縮桿機制,其相對兩端分別以可位移方式連接該基座11及該定位件13,以伸縮作用該定位件13位移。應可理解地,有關伸縮結構131之種類繁多,如彈簧機制,並不限於上述。
Furthermore, at least one
又,該定位件13可配置至少一固定部130,其對應該限位件12之止動部120,以令該固定部130接合該止動部120,使該定位件13與該限位件12相互固接。例如,該固定部130係為凸柱狀,其形成於該定位件13之外周面13a上,以
從該止動部120之埠口120a進出該軌道120b。具體地,如圖3A至圖3B所示,當蓋下該定位件13後,該固定部130會從該埠口120a進入該軌道120b之其中一側,再將該限位件12沿目標方向A(如圖3A所示或如圖1所示之順時針方向)轉動,以令該固定部130位於該軌道120b之另一側,使該固定部130無法從該埠口120a離開該軌道120b,因而固接該定位件13與該限位件12,亦即,該定位件13不會受該伸縮結構131作用而向上彈開。
In addition, the positioning
另外,該定位件13朝向該限位件12之表面可具有複數凸柱狀緩衝部133,如橡膠或其它彈性材質等,其沿環狀框之底面間隔排列,故當該定位件13下壓該目標物2時,可藉由該些緩衝部133抵壓接觸該目標物2,以避免該目標物2刮損或裂開。
In addition, the surface of the positioning
因此,當置放該目標物2至該容置空間S中時,先將該定位件13朝該限位件12之方向樞轉(如圖1所示之下壓方向B)而蓋合於該支撐結構112之上方,使該定位件13壓制該目標物2之周緣處,以令該目標物2(探針卡)之主要探針外露於該定位件13,再轉動該限位件12以固定該定位件13。相反地,當檢測作業完成或需更換該目標物2時,朝該目標方向A之反方向(如圖3B所示之目標方向A’或可於圖1中呈現逆時針方向)轉動該限位件12,以令該固定部130位於該軌道120b之埠口120a處,使該固定部130可從該埠口120a離開該軌道120b,即該定位件13將受該伸縮結構131作用而向上彈開,以將該定位件13樞轉掀起,亦即,使用者能由該容置空間S中取換該目標物2。
Therefore, when the
所述之蓋體14係樞接至該基座11,以靠近或遠離該基座11進行位移。
The
於本實施例中,該蓋體14在相對於樞接處之另一側係設有可供握持之把手142,以便於操作人員握持該把手142而掀起或蓋下該蓋體14。因此,當置放該目標物2至該容置空間S時,先將該定位件13抵靠該目標物2,再
將該蓋體14朝該基座11之方向轉動(如圖1所示之下壓方向C)而蓋合於該基座11之上方,使該蓋體14封蓋該目標物2而達到防塵之目的,以令該目標物2可於該檢測機台內進行運作。另一方面,當檢測作業完成或需更換該目標物2時,可將該蓋體14及該定位件13依序樞轉掀起,以由該容置空間S中取換該目標物2。
In this embodiment, the
再者,該基座11與該蓋體14之間亦可依需求配置至少一如油壓桿或氣壓桿之伸縮結構141。例如,該伸縮結構141係為伸縮桿機制,其相對兩端分別以可位移方式連接該基座11及該蓋體14,以於該蓋體14作動過程中,可相對應伸縮及轉動。應可理解地,有關伸縮結構141之種類繁多,如彈簧機制,並不限於上述。
Furthermore, at least one
又,該蓋體14與該基座11之間可分別設有對應之固接結構(如嵌合、卡合、扣接、螺接等),使該蓋體14於蓋下狀態時可暫時固接該基座11,以避免該承載裝置1於檢測過程或運輸過程中因發生該蓋體14鬆動而使異物進入該容置空間S中之狀況,避免該目標物2受損。
In addition, the
另外,該蓋體14之其中一側係設有一缺口143,以供該目標物2之線材(圖略)通過。例如,於該基座11上可配置一對應該缺口143之固定結構16,其上緣可具有複數引導槽161,以引導該目標物2之如無線射頻線纜(RF cable)之線材通過而電性連接檢測機台。具體地,當該蓋體14蓋上後,該缺口143配合容置該固定結構16,以限制該目標物2之線材之位移範圍,使該目標物2之線材受制於該蓋體14與該固定結構16而不會走位,且可避免該線材產生彎折,因而可維持該線材之訊號傳輸之穩定度。
In addition, one side of the
應可理解地,依該目標物2之配線種類,該承載裝置1可於該基座11上設計各種固定結構,如具有集束部151之排線型固定結構15,以將該目
標物2之排線型線材整合於該集束部151中而達到避免該目標物2之排線型線材產生彎折之目的。
It should be understood that, depending on the type of wiring of the
因此,本發明之承載裝置1於使用時,可藉由該限位件12及定位件13之配合,以將該目標物2定位於該容置空間S中,再將該承載裝置1安裝於檢測機台中,並將該目標物2之線材電性連接該檢測機台或電子封裝件,故該承載裝置1不僅能提升該目標物2之擺放穩定度,使該目標物2不易受損,且能藉由固定結構15,16確保該目標物2之線材之良好狀態而穩定傳輸訊號,以確保檢測作業之可靠度。
Therefore, when the carrying device 1 of the present invention is in use, the
綜上所述,本發明之承載裝置1於進行半導體封裝檢測作業時,可依據電子封裝件之規格取換不同之探針卡(即該目標物2),而不需更換檢測機台,以節省檢測時間,且僅需使用單一檢測機台配合該承載裝置1即可進行檢測作業(如依據該目標物2之規格,直接替換該承載裝置1),因而能大幅節省設備費用,以利於降低電子封裝件及其終端產品之製作成本。 To sum up, the carrier device 1 of the present invention can be used to exchange different probe cards (that is, the target 2) according to the specifications of the electronic package during semiconductor package inspection operations, without the need to replace the inspection machine. Save inspection time, and only need to use a single inspection machine to cooperate with the carrying device 1 to perform inspection operations (for example, directly replace the carrying device 1 according to the specifications of the target 2), which can greatly save equipment costs and help reduce The production cost of electronic packages and their end products.
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above-mentioned embodiments are used to exemplify the principles and effects of the present invention, but not to limit the present invention. Anyone familiar with this technique can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.
1:承載裝置 1: Carrying device
10:保護件 10: Protective parts
11:基座 11: Pedestal
11a:置放區 11a: Placement area
112:支撐結構 112: Supporting structure
12:限位件 12: Limit parts
12a:內周面 12a: inner peripheral surface
120:止動部 120: Stop
121:帶動部 121: Driving Department
13:定位件 13: positioning parts
13a:外周面 13a: outer peripheral surface
130:固定部 130: fixed part
131,141:伸縮結構 131, 141: Telescopic structure
132:操控部 132: Control Department
133:緩衝部 133: Buffer
14:蓋體 14: Lid
142:把手 142: Handle
143:缺口 143: Gap
15,16:固定結構 15,16: fixed structure
151:集束部 151: Cluster
161:引導槽 161: guide slot
A:目標方向 A: Target direction
B,C:下壓方向 B, C: Pressing direction
S:容置空間 S: accommodating space
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW109126195A TWI741715B (en) | 2020-08-03 | 2020-08-03 | Carrier device |
CN202010800867.0A CN114076837A (en) | 2020-08-03 | 2020-08-11 | Bearing device |
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TW109126195A TWI741715B (en) | 2020-08-03 | 2020-08-03 | Carrier device |
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TWI741715B true TWI741715B (en) | 2021-10-01 |
TW202206820A TW202206820A (en) | 2022-02-16 |
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CN114076837A (en) | 2022-02-22 |
TW202206820A (en) | 2022-02-16 |
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