CN212843506U - Wafer curvature detection device - Google Patents
Wafer curvature detection device Download PDFInfo
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- CN212843506U CN212843506U CN202021861104.9U CN202021861104U CN212843506U CN 212843506 U CN212843506 U CN 212843506U CN 202021861104 U CN202021861104 U CN 202021861104U CN 212843506 U CN212843506 U CN 212843506U
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- 238000001514 detection method Methods 0.000 title claims abstract description 54
- 238000007689 inspection Methods 0.000 claims 6
- 235000012431 wafers Nutrition 0.000 description 40
- 239000013078 crystal Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses a wafer curvature detection device, including base, load-bearing platform and downside telescopic link, base top fixed mounting has load-bearing platform, the opening has been seted up on the detection case leading flank, and vertical slide mechanism and transverse sliding mechanism are installed to detection case top surface inboard, vertical slide mechanism and transverse sliding mechanism link together with vertical scanning frame and transverse scanning frame respectively, and transverse scanning frame and vertical scanning frame bottom are provided with the measuring head, surface center department is fixed with measuring platform on the load-bearing platform, and the upper left corner of measuring platform installs the setting element, first slewing mechanism and second slewing mechanism are connected respectively at both ends about the downside telescopic link. This wafer crookedness detection device, the structure sets up rationally, through setting up setting element, horizontal scanning frame and vertical scanning frame, need not fix a position wafer central point when detecting, reduces the operation degree of difficulty, increases detectable wafer scope, improves the detection precision of wafer crookedness.
Description
Technical Field
The utility model relates to a measuring instrument technical field specifically is a wafer curvature detection device.
Background
With the continuous progress of downstream technologies in the electronic and photoelectric industries, the requirement on the processing precision of wafers is higher and higher, and the wafer needs to be processed into an original silicon wafer with high surface precision and surface quality, so as to prepare a flattened, ultra-smooth and low-damage substrate surface for a photoetching process. Currently, chemical mechanical polishing is mainly adopted, and a wafer is attached to a template and moves relative to polishing cloth. If the surface of the wafer has an integral concave or convex phenomenon, the wafer and the template are not tightly attached, and the wafer runs during the processing, which causes great loss. Wafer bow is commonly used to assess the degree of dishing or dishing of a wafer.
The existing wafer curvature detection device mostly takes a wafer central point as a reference or needs to measure the distance between the wafer central point and a preset plane when detecting, so that the central point of a wafer needs to be positioned, but the wafer central point is difficult to position, part of the detection devices can only detect the wafer with a fixed size, and the wafer is irregular in curvature, so that the positioning precision of the central point is difficult to guarantee, and the detection result has large deviation.
In order to overcome the defects existing in the current market, a technology for improving a wafer curvature detection device is urgently needed, the safe operation of wafer curvature detection can be better guaranteed, and the development of the electronic industry is promoted.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer curvature detection device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a wafer curvature detection device comprises a base, a bearing platform and a lower side telescopic rod, wherein the bearing platform is fixedly installed above the base, a detection box is arranged above the bearing platform, the right end of the bearing platform is connected with an operation platform, an opening is formed in the front side surface of the detection box, a display screen is fixed on the right side surface of the detection box, a vertical sliding mechanism and a transverse sliding mechanism are installed on the inner side of the top surface of the detection box, the opening and a sliding cover are mutually matched, a handle is arranged at the center of the sliding cover, the vertical sliding mechanism and the transverse sliding mechanism are respectively connected with a vertical scanning frame and a transverse scanning frame, a measuring head is arranged at the bottom end of the transverse scanning frame and the vertical scanning frame, a first rotating mechanism is installed at the upper left corner of the upper surface of the bearing platform, a measuring platform is fixed at the center of, first slewing mechanism and second slewing mechanism are connected respectively at both ends about the downside telescopic link, are provided with the upside telescopic link directly over the second slewing mechanism, and second slewing mechanism and upside telescopic link side are connected downside axis of rotation and upside axis of rotation respectively, the upside telescopic link is fixed on third slewing mechanism, all installs vacuum chuck in upside axis of rotation and the downside axis of rotation.
Preferably, the detection box is bottomless square box-shaped, and the detection box constitutes complete square box-shaped with load-bearing platform jointly, and the opening of rectangle form is seted up at detection box front side board bottom middle part, and installs the sliding closure on the detection box of opening top, and detection box roof medial surface upper left corner department is fixed with third slewing mechanism.
Preferably, measuring platform is square plate-like, and the measuring platform leading flank is relative with the opening, and the measuring platform upper left corner outside is fixed with the setting element, and the setting element is the shape of falling L shape folded plate, and the height of setting element is a little more than measuring platform's height.
Preferably, the front end of the transverse scanning frame is slidably mounted in the transverse sliding mechanism, the right end of the vertical scanning frame is slidably mounted in the vertical sliding mechanism, and the measuring heads are mounted at equal intervals at the bottoms of the transverse scanning frame and the vertical scanning frame.
Preferably, the vertical sliding mechanism and the transverse sliding mechanism jointly form a reverse L shape, the joint of the vertical sliding mechanism and the transverse sliding mechanism is fixed at the right lower corner of the top surface of the detection box, and the length of the vertical sliding mechanism and the length of the transverse sliding mechanism are larger than the side length of the measurement platform.
Preferably, the top of the first rotating mechanism is movably connected with a lower side telescopic rod, the top end of the lower side telescopic rod is connected with a second rotating mechanism, the right end of the second rotating mechanism is fixedly connected with a lower side rotating shaft, and the lower side telescopic rod is perpendicular to the lower side rotating shaft.
Preferably, vacuum suction cups are fixed on the side surface of the lower rotating shaft at equal intervals.
Compared with the prior art, the beneficial effects of the utility model are that: this wafer crookedness detection device, the structure sets up rationally, through setting up setting element, horizontal scanning frame and vertical scanning frame, need not fix a position wafer central point when detecting, reduces the operation degree of difficulty, increases detectable wafer scope, improves the detection precision of wafer crookedness, through setting up slewing mechanism, telescopic link and vacuum chuck, realizes the automatic upset of wafer, avoids manual operation to harm the wafer, the safe operation that assurance wafer crookedness that can be better detected promotes the development of electron trade.
Drawings
FIG. 1 is a front view of the structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
fig. 3 is a front view showing the structure of the present invention.
In the figure: 1. the base, 2, operation platform, 3, the display screen, 4, the detection case, 5, load-bearing platform, 6, measuring platform, 7, the opening, 8, the sliding closure, 9, the handle, 10, the setting element, 11, horizontal scanning frame, 12, the measuring head, 13, vertical scanning frame, 14, vertical sliding mechanism, 15, horizontal sliding mechanism, 16, first slewing mechanism, 17, the downside telescopic link, 18, the second slewing mechanism, 19, vacuum chuck, 20, the upside axis of rotation, 21, the upside telescopic link, 22, the third slewing mechanism, 23, the downside axis of rotation.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a wafer bending degree detection device comprises a base 1, a bearing platform 5 and a lower side telescopic rod 17, wherein the bearing platform 5 is fixedly installed above the base 1, a detection box 4 is arranged above the bearing platform 5, the right end of the bearing platform 5 is connected with an operation platform 2, an opening 7 is formed in the front side face of the detection box 4, a display screen 3 is fixed on the right side face of the detection box 4, a vertical sliding mechanism 14 and a transverse sliding mechanism 15 are installed on the inner side of the top face of the detection box 4, the detection box 4 is in a bottomless square box shape, the detection box 4 and the bearing platform 5 jointly form a complete square box shape, a rectangular opening 7 is formed in the middle of the bottom end of the front side plate of the detection box 4, a sliding cover 8 is installed on the detection box 4 above the opening 7, a third rotating mechanism 22 is fixed at the upper left corner of the inner side face of the top plate of the detection box 4, the front end of a transverse scanning frame 11 is slidably arranged in a transverse sliding mechanism 15, the right end of a vertical scanning frame 13 is slidably arranged in a vertical sliding mechanism 14, measuring heads 12 are arranged at the bottoms of the transverse scanning frame 11 and the vertical scanning frame 13 at equal intervals, the structure is reasonable, by arranging a positioning piece 10, the transverse scanning frame 11 and the vertical scanning frame 13, the central point of a wafer is not required to be positioned during detection, the operation difficulty is reduced, the range of the wafer to be detected is enlarged, and the detection precision of the curvature of the wafer is improved, the vertical sliding mechanism 14 and the transverse sliding mechanism 15 are respectively connected with the vertical scanning frame 13 and the transverse scanning frame 11, the measuring heads 12 are arranged at the bottom ends of the transverse scanning frame 11 and the vertical scanning frame 13, the vertical sliding mechanism 14 and the transverse sliding mechanism 15 jointly form a reverse L shape, and the joint of the vertical sliding mechanism 14 and the transverse sliding, the length of the vertical sliding mechanism 14 and the length of the horizontal sliding mechanism 15 are larger than the side length of the measuring platform 6, the first rotating mechanism 16 is installed at the upper left corner of the upper surface of the bearing platform 5, the measuring platform 6 is fixed at the center of the upper surface of the bearing platform 5, the positioning piece 10 is installed at the upper left corner of the measuring platform 6, the measuring platform 6 is in a square plate shape, the front side surface of the measuring platform 6 is opposite to the opening 7, the positioning piece 10 is fixed at the outer side of the upper left corner of the measuring platform 6, the positioning piece 10 is in an inverted L-shaped folded plate shape, the height of the positioning piece 10 is slightly higher than that of the measuring platform 6, the upper end and the lower end of the lower side telescopic rod 17 are respectively connected with the first rotating mechanism 16 and the second rotating mechanism 18, the upper side telescopic rod 21 is arranged right above the second rotating mechanism 18, the side surfaces of the second rotating mechanism, 17 tops of downside telescopic link are connected with second slewing mechanism 18, 18 right-hand member fixedly connected with downside axis of rotation 23 of second slewing mechanism, downside telescopic link 17 is mutually perpendicular with downside axis of rotation 23, through setting up slewing mechanism, telescopic link and vacuum chuck 19, realize the automatic upset of wafer, avoid manual operation damage wafer, upside telescopic link 21 is fixed on third slewing mechanism 22, vacuum chuck 19 all is installed on upside axis of rotation 20 and the downside axis of rotation 23, equidistant vacuum chuck 19 that is fixed with on the downside axis of rotation 23 side.
The working principle is as follows: when the wafer curvature detection device is used, a wafer to be detected is sent into the detection box 4 from the opening 7 and placed on the measurement platform 6, the wafer to be detected is in contact with two sides of the positioning piece 10, then the sliding cover 8 is pulled downwards through the handle 9 to close the opening 7, the transverse scanning frame 11 drives the measuring head 12 to move along the transverse sliding mechanism 15, the wafer is scanned from the left direction and the right direction, then the vertical scanning frame 13 drives the measuring head 12 to move along the vertical sliding mechanism 14, the wafer is scanned from the front direction and the rear direction, latticed data are obtained, data at the intersection points of the grids can be verified mutually to ensure the detection precision, then the third rotating mechanism 22 rotates the upper side telescopic rod 21, the upper side rotating shaft 20 and the diagonal line of the measurement platform 6 are enabled to be parallel, the upper side telescopic rod 21 moves downwards to the vacuum suction cup 19 on the upper side rotating shaft 20, meanwhile, the first rotating mechanism 16 rotates the lower side telescopic rod 17, the lower side rotating shaft 23 is made to be parallel to the diagonal line of the measuring platform 6, the lower side telescopic rod 17 moves upwards to enable the vacuum sucker 19 on the lower side rotating shaft 23 to be adsorbed on the other side of the round crystal to be measured, the vacuum sucker 19 on the upper side rotating shaft 20 is separated from the round crystal to be measured and returns to the original position, then the second rotating mechanism 18 rotates the lower side rotating shaft 23 to enable the round crystal to be measured to be overturned, finally, the overturned round crystal to be measured is placed on the measuring platform 6, the reverse side of the round crystal to be measured is scanned, scanning data are comprehensively analyzed to obtain the curvature of the round.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a wafer curvature detection device, includes base (1), load-bearing platform (5) and downside telescopic link (17), its characterized in that: a bearing platform (5) is fixedly arranged above the base (1), a detection box (4) is arranged above the bearing platform (5), the right end of the bearing platform (5) is connected with an operation platform (2), an opening (7) is formed in the front side surface of the detection box (4), a display screen (3) is fixed on the right side surface of the detection box (4), a vertical sliding mechanism (14) and a transverse sliding mechanism (15) are arranged on the inner side of the top surface of the detection box (4), the opening (7) is matched with a sliding cover (8), a handle (9) is arranged at the center of the sliding cover (8), the vertical sliding mechanism (14) and the transverse sliding mechanism (15) are respectively connected with a vertical scanning frame (13) and a transverse scanning frame (11), a measuring head (12) is arranged at the bottom ends of the transverse scanning frame (11) and the vertical scanning frame (13), a first rotating mechanism (16) is arranged at the upper left corner of the upper surface of the bearing platform, bearing platform (5) upper surface center department is fixed with measuring platform (6), and measuring platform (6) upper left corner installs setting element (10), first slewing mechanism (16) and second slewing mechanism (18) are connected respectively at both ends about downside telescopic link (17), are provided with upside telescopic link (21) directly over second slewing mechanism (18), and second slewing mechanism (18) and upside telescopic link (21) side connect downside axis of rotation (23) and upside axis of rotation (20) respectively, upside telescopic link (21) are fixed on third slewing mechanism (22), all install vacuum chuck (19) on upside axis of rotation (20) and downside axis of rotation (23).
2. The wafer bow inspection device of claim 1, wherein: detection case (4) are no end square box-like, and detection case (4) constitute complete square box-like jointly with load-bearing platform (5), and opening (7) of rectangle form are seted up at detection case (4) preceding curb plate bottom middle part, and install sliding closure (8) on opening (7) top detection case (4), and detection case (4) roof medial surface upper left corner department is fixed with third slewing mechanism (22).
3. The wafer bow inspection device of claim 1, wherein: measuring platform (6) are square plate-like, and measuring platform (6) leading flank is relative with opening (7), and measuring platform (6) upper left corner outside is fixed with setting element (10), and setting element (10) are the shape of falling L shape folded plate, and the height that highly is a little higher than measuring platform (6) of setting element (10).
4. The wafer bow inspection device of claim 1, wherein: the front end of the transverse scanning frame (11) is slidably mounted in the transverse sliding mechanism (15), the right end of the vertical scanning frame (13) is slidably mounted in the vertical sliding mechanism (14), and the measuring heads (12) are mounted at equal intervals at the bottoms of the transverse scanning frame (11) and the vertical scanning frame (13).
5. The wafer bow inspection device of claim 1, wherein: the vertical sliding mechanism (14) and the transverse sliding mechanism (15) jointly form a reverse L shape, the joint of the vertical sliding mechanism (14) and the transverse sliding mechanism (15) is fixed at the right lower corner of the top surface of the detection box (4), and the length of the vertical sliding mechanism (14) and the length of the transverse sliding mechanism (15) are larger than the side length of the measuring platform (6).
6. The wafer bow inspection device of claim 1, wherein: the top of the first rotating mechanism (16) is movably connected with a lower side telescopic rod (17), the top end of the lower side telescopic rod (17) is connected with a second rotating mechanism (18), the right end of the second rotating mechanism (18) is fixedly connected with a lower side rotating shaft (23), and the lower side telescopic rod (17) is perpendicular to the lower side rotating shaft (23).
7. The wafer bow inspection device of claim 1, wherein: vacuum suction cups (19) are fixed on the side surface of the lower rotating shaft (23) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021861104.9U CN212843506U (en) | 2020-08-31 | 2020-08-31 | Wafer curvature detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021861104.9U CN212843506U (en) | 2020-08-31 | 2020-08-31 | Wafer curvature detection device |
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| CN212843506U true CN212843506U (en) | 2021-03-30 |
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| CN202021861104.9U Active CN212843506U (en) | 2020-08-31 | 2020-08-31 | Wafer curvature detection device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113108742A (en) * | 2021-06-15 | 2021-07-13 | 江苏龙共真空技术有限公司 | Solar cell silicon wafer size detection device |
| CN115638757A (en) * | 2022-11-11 | 2023-01-24 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
-
2020
- 2020-08-31 CN CN202021861104.9U patent/CN212843506U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113108742A (en) * | 2021-06-15 | 2021-07-13 | 江苏龙共真空技术有限公司 | Solar cell silicon wafer size detection device |
| CN113108742B (en) * | 2021-06-15 | 2021-08-13 | 江苏龙共真空技术有限公司 | Solar cell silicon wafer size detection device |
| CN115638757A (en) * | 2022-11-11 | 2023-01-24 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
| CN115638757B (en) * | 2022-11-11 | 2023-11-28 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
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Address after: 214400, 1st to 2nd floors, Building 3, Xiakewan Chuangzhi Park, No. 215 Qingtong Road, Qingyang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: Jiangsu General Semiconductor Co.,Ltd. Country or region after: China Address before: No.a130-10, 1st floor, No.2 entrepreneurship center, No.96 Ruida Road, high tech Industrial Development Zone, Zhengzhou City, Henan Province, 450001 Patentee before: Henan general intelligent equipment Co.,Ltd. Country or region before: China |
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