TWI629973B - Optical biosensor module and method for making the same - Google Patents

Abstract

An optical biomedical sensor module comprises a circuit board, a stack of light-receiving units disposed on the circuit board, and a light-emitting unit stacked on the light-receiving unit. The light-emitting unit and the light-receiving unit have a corresponding light-blocking structure to prevent the light emitted by the light-emitting unit from directly hitting the light-receiving unit. The invention also provides a method for fabricating the aforementioned optical biomedical sensor module.

Description

Optical biomedical sensor module and manufacturing method thereof

The invention relates to a sensor module, in particular to an optical biomedical sensor module and a manufacturing method thereof.

With the modern people's concept of health management and the rise of wearable devices, sensors for measuring health information such as human heart rhythm or blood oxygen by detecting photoplethysmography (PPG) have been gradually applied to many wearable devices. in.

Referring to FIG. 1 , a conventional optical biomedical sensor module 1 includes a printed circuit board (PCB) 11 , a light receiving member 12 and a light emitting member 13 disposed at the same level of the printed circuit board 11 . A light is disposed on the surface 111 and surrounds the light-receiving member 12 and the light-blocking wall 14 of the light-emitting member 13. In the optical biomedical sensor module 1, the light-receiving member 12 is a sensor using the aforementioned light volume change trace (PPG).

However, as digital electronic products such as wearable devices continue to be thin and light, the existing optical biomedical sensor module 1 is replaced by the light-receiving member 12 and the light-emitting member 13 Both of them are disposed on the mounting surface 111 of the same level of the printed circuit board 11, and it is difficult to further miniaturize the structure of the conventional optical biomedical sensor module 1 when it is applied to a wearable device.

Therefore, improving the structure of the existing optical biomedical sensor module 1 to reduce the size of the components and making the wearable device thinner and thinner is a problem to be solved by those skilled in the art.

Accordingly, it is an object of the present invention to provide an optical biomedical sensor module that can reduce the size of components.

Therefore, the optical biomedical sensor module of the present invention comprises a circuit board, a light receiving unit, and a light emitting unit. The circuit board includes a mounting surface, a first line, and a second line. The light-receiving unit is superposed on the setting surface of the circuit board, and includes a light-receiving member having a light-receiving surface facing away from the installation surface and electrically connected to the first line of the circuit board. The light emitting unit is stacked on the light receiving surface of the light receiving member, and includes a light emitting member having a light emitting surface facing away from the light receiving surface and electrically connected to the second line of the circuit board, and a ring circumference The illuminating member of the illuminating member blocks the wall. In the present invention, the light-receiving member and the illuminating member are opaque, and a top surface of the light-blocking member of the illuminating member is not lower than the illuminating surface.

Further, another object of the present invention is to provide a method of fabricating an optical biomedical sensor module.

Therefore, the manufacturing method of the optical biomedical sensor module of the present invention comprises a preparation step, a die stacking step, and a light blocking wall forming step. The preparation step is to prepare a circuit board including a setting surface, a light collecting member having a light collecting surface, and a light emitting member having a light emitting surface. The die stacking step sequentially stacks the light-receiving member and the light-emitting member on an opaque layer on the mounting surface and a die-bonding region of the light-receiving surface. The light-blocking light-blocking wall forming step is formed on the light-receiving surface to form a light-blocking wall of the light-emitting member surrounding the solid crystal region and the light-emitting member.

The effect of the invention is that the relationship between the light-emitting unit and the light-receiving unit is superimposed, which not only can reduce the size of the component, but also makes the wearable device shorter in size, and can make the light-emitting unit closer to one. The user thereby shortens the optical path of an incident light radiated from the illuminating member to the skin of the user, thereby reducing light loss and achieving a power saving effect.

2‧‧‧ boards

20‧‧‧Setting surface

21‧‧‧First line

211‧‧‧electrode pad

22‧‧‧second line

221‧‧‧electrode pads

3‧‧‧Lighting unit

31‧‧‧Lighting parts

311‧‧‧ Receiving surface

420‧‧‧ space

421‧‧‧ top surface

422‧‧‧ peripheral surface

423‧‧‧ inner enclosure

43‧‧‧First wire

44‧‧‧second wire

45‧‧‧Lighting transparent encapsulant

451‧‧‧ top surface

500‧‧‧Preparation steps

312‧‧‧ Gujing District

313‧‧‧Lighting area

314‧‧‧ bottom

32‧‧‧Light-receiving block

320‧‧‧ space

321‧‧‧ top surface

33‧‧‧First electrode pad

34‧‧‧Second electrode pad

35‧‧‧Wire

36‧‧‧Light-receiving transparent encapsulant

37‧‧‧Opacity layer

361‧‧‧ top surface

4‧‧‧Lighting unit

41‧‧‧Lighting parts

411‧‧‧Glossy

413‧‧‧N type contact pad

414‧‧‧P type contact pad

42‧‧‧Lighting block

501‧‧‧ die stacking step

502‧‧‧First line step

503‧‧‧Lighting block light blocking wall forming step

5031‧‧‧Second step formation

5032‧‧‧Second step in the formation of the upper part

504‧‧‧Second wire step

505‧‧‧Light-receiving member light blocking wall forming step

506‧‧‧ potting step

C‧‧‧ center point

D‧‧‧ Dermis

L‧‧‧ imaginary line

P ₁ ‧‧‧ internal

P ₂ ‧‧‧Extension

X ‧‧‧ distance

y ‧‧‧height

Y ‧‧‧ distance

Θ‧‧‧ angle

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a partial cross-sectional view showing a conventional optical biomedical sensor module; FIG. 2 is a A top view of a first embodiment of the optical biomedical sensor module of the present invention; 3 is a partial cross-sectional view taken along line III-III of FIG. 2, which assists in explaining the connection relationship and relative position between the detailed elements of the first embodiment; FIG. 4 is a top plan view showing the optical type of the present invention. A second embodiment of the medical sensor module; FIG. 5 is a partial cross-sectional view taken along line VV of FIG. 4, which assists in explaining the connection relationship and relative position between the detailed components of the second embodiment; FIG. Is a top view showing a third embodiment of the optical biomedical sensor module of the present invention; FIG. 7 is a partial cross-sectional view taken along line VII-VII of FIG. 6 to assist the third embodiment. FIG. 8 is a partial cross-sectional view showing another aspect of the third embodiment; FIG. 9 is a side cross-sectional view showing the first and second aspects of the present invention. And a relative position between the light-emitting unit and a light-receiving unit of the third embodiment; and FIG. 10 is a top plan view showing a fourth embodiment of the optical biomedical sensor module of the present invention; 11 is along Figure 10 is a partial cross-sectional view taken along line XI-XI, which assists in explaining the connection relationship and relative position between the detailed components of the fourth embodiment; Figure 12 is a flow diagram illustrating the optical biomedical sensor of the present invention Process flow of the module; FIG. 13 is a schematic flow chart showing the manufacturing process of the first embodiment of the present invention; 14 is a schematic flow chart showing the manufacturing process of the second embodiment of the present invention.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to Figures 2 and 3, a first embodiment of the optical biomedical sensor module of the present invention. The optical biomedical sensor module comprises a circuit board 2, a light-receiving unit 3 stacked on the circuit board 2, and a light-emitting unit 4 stacked on the light-receiving unit 3.

Specifically, the circuit board 2 includes a mounting surface 20 and a first line 21 and a second line 22 that are spaced apart from the mounting surface 20 and electrically connected to the light receiving unit 3 and the light emitting unit 4, respectively.

The light-receiving unit 3 is stacked on the setting surface 20 of the circuit board 2, and includes a light-receiving member 31, a light-receiving member light blocking wall 32, a pair of first electrode pads 33, and a pair of second electrodes. Pad 34. The light collecting member 31 is electrically connected to the first line 21 of the circuit board 2 and has a light collecting surface 311. The light receiving surface 311 faces away from the setting surface 20 and includes a die bonding area 312 and a light collecting area 313. The light-receiving area 313 is an area on the light-receiving surface 311 that is not occupied by the light-emitting unit 4. The light-receiving member light blocking wall 32 is disposed on the setting surface 20 and surrounds the light-receiving member 31. In this embodiment, the light-receiving member 31 is a vertical type wafer, and the pair of first electrode pads 33 of the light-receiving unit 3 are disposed outside the die-bonding region 312 and disposed on the light-receiving surface 311. The other is located at the mounting surface 20 adjacent to the circuit board 2, and more preferably, it is directly bonded to an electrode pad 211 of the first line 21. The pair of second electrode pads 34 of the light-receiving unit 3 are disposed on the light-receiving surface 311 at intervals to be spaced apart from the first electrode pad 33, and each of the second electrode pads 34 has a location in the die-bonding region The inner portion P ₁ and the inner portion P ₁ extend from the inner portion P ₁ to the extension portion P ₂ outside the die bonding region 312. The receiver 31 suitable for use in the present embodiment is a sensor capable of receiving and detecting a light volume change trace (PPG) signal.

In detail, in the embodiment, the electrical connection between the light-receiving member 31 and the circuit board 2 is connected to the first electrode on the light-receiving surface 311 by a wire 35 of the light-receiving unit 3 The pad 33 and an electrode pad 211 of the first line 21 of the circuit board 2, and the other is provided by the first electrode pad 33 located on a bottom surface 314 of the light-receiving member 31 facing away from the light-receiving surface 311. The other electrode pad 211 of the first line 21 of the circuit board 2 is bonded with a solder (such as solder) to electrically connect the light-receiving member 31 to the circuit board 2.

The light-emitting unit 4 is stacked on the light-receiving surface 311, and includes a light-emitting member 41, a light-blocking member 42, and an N-type contact pad 413 and a P-type contact pad disposed on the light-emitting member 41. 414. The illuminating member 41 is electrically connected to the second line 22 of the circuit board 2 and has a light-emitting surface 411 facing away from the light-receiving surface 311. Preferably, the light-emitting member 41 is die-bonded to the die-bonding region 312, and is electrically connected to the second line 22 by the N-type contact pad 413 and the P-type contact pad 414. The illuminating member light blocking wall 42 is disposed The light receiving surface 311 is surrounded by the solid crystal region 312 of the light-emitting member 41 and the light-receiving surface 311. It should be noted that the illuminating member 41 is mainly composed of a light-emitting diode (LED) epitaxial structure, and the color and quantity of the illuminating member 41 are not particularly limited, and the color of the illuminating member 41 can be adjusted for visual use. The number of the illuminating members 41 is increased or decreased.

In detail, in the embodiment, the illuminating member 41 is a horizontal type of wafer, so that the N-type contact pad 413 and the P-type contact pad 414 are disposed on the light-emitting surface 411 of the illuminating member 41, and are solidified. The crystal glue (not shown) allows the light-emitting member 41 to be crystallized on the inner portions P ₁ of the second electrode pads 34, and is connected to the N-type contacts of the light-emitting member 41 through a pair of first wires 43 respectively. The pad 413 and the P-type contact pad 414 and the corresponding internal P ₁ of the pair of second electrode pads 34 located in the die bonding region 312 are further connected to the outside of the die bonding region 312 through a pair of second wires 44 respectively. The extension portion P ₂ of the pair of second electrode pads 34 and the corresponding two electrode pads 221 of the second line 22 of the circuit board 2, thereby electrically connecting the light emitting member 41 to the circuit board 2. It should be noted that the light-receiving member 31 and the light-emitting member 41 must be opaque. Moreover, an incident light emitted by the light-emitting member 41 in the die-bonding region 312 cannot be formed by the solid crystal. directly through the region 312 to 311 of the receiving surface, a light-tight structure of this embodiment is that the interior of the primary embodiment of the second electrode pad P ₁ of 34 constituted, the material of the second electrode pad 34 is not enabling the The incident light of the illuminating member 41 penetrates, or a conductive material such as gold or silver which can reflect the incident light, and moreover, the solid crystal adhesive which is opaque, such as silver paste. It should be noted that the bonding state between the light-emitting member 41 and the light-receiving member 31 is not limited to the foregoing, and it may also be that a decentralized Prague is formed on the die-bonding region 312 of the light-receiving member 31. After the distributed brag reflector (DBR), the pair of second electrode pads 34 are formed thereon, and the other surface of the light-emitting member 41 opposite to the light-emitting surface 411 is crystallized on the pair of second electrode pads 34. The internal P ₁ can also achieve the purpose of reflecting the incident light.

It is to be noted that the connection relationship of the illuminating member 41 to the die bonding region 312 is not limited to the connection mode of the first embodiment. For example, the illuminating member 41 can be directly fixed on the light-receiving surface 311 of the light-receiving member 31 by an opaque solid crystal adhesive; or, it can be disposed on the light-receiving surface 311 of the light-receiving member 31. After the opaque layer (not shown), the illuminating member 41 is disposed on the opaque layer (such as a black rubber layer); or, when the illuminating member 41 is horizontal, A light-dissipating metal layer (not shown) is disposed on the light-receiving surface 311 of the light-receiving member 31, and then the light-emitting member 41 is disposed on the metal layer, and a light-receiving member 31 is disposed on the light-receiving member 31. The light-emitting member 41 and the pair of electrode pads are connected to the electrode pad separated from the metal layer by a pair of wires; or, when the light-emitting member 41 is vertical, directly to the light-receiving member 31 A pair of spaced electrode pads are disposed on the one of the electrode pads, and the light emitting member 41 is connected to the other of the electrode pads through a wire; or when the light emitting member 41 is flip chip In the case of a flip chip, a pair of adjacent and spaced electrode pads are formed on the light-receiving member 31, and the light-emitting member 41 is flipped on the pair. Mat. Since the solid crystal mode of the light-emitting member 41 is well known to those skilled in the art and is not the focus of the present invention, it will not be described herein.

It is worth mentioning that in order to protect the light-receiving unit 3, the light-emitting unit 4, and its associated electrical connection structure and circuit (such as the pair of first electrode pads 33 and the pair of second electrode pads 34 in this embodiment) And the wires 35, 43, 44), the light-receiving unit 3 and the light-emitting unit 4 further comprise a light-receiving member transparent encapsulant 36 and a light-emitting member transparent encapsulant 45, respectively. The light-emitting member transparent encapsulant 45 is filled in a space 420 surrounded by the light-blocking member 42 to cover the light-emitting member 41 and cover the die-bonding region 312 of the light-receiving member 31. The light-receiving member transparent encapsulant 36 is filled in a space 320 defined by the light-receiving member light blocking wall 32 and the light-emitting member light blocking wall 42 to cover a portion exposed outside the light-blocking member 42 The light-receiving member 31, in particular, the light-receiving region 313 of the light-receiving surface 311 covers the installation surface 20.

In detail, when the optical biomedical sensor module is disposed facing the skin of a user (not shown), the illuminating member 41 can emit the incident light incident into the skin of the user (Fig. The incident light is converted into an optical signal (not shown) in the skin to reflect the optical signal to the light receiving area 313 of the light receiving surface 311 via the skin to allow the light collecting member 31 to pass. Receive and analyze the optical signal. In the embodiment, the light emitting surface 411 of the illuminating member 41 is lower than a top surface 321 of the light blocking member 32 and a top surface 421 of the light blocking wall 42. The illuminating member blocks the light. The top surface 421 of the wall 42 is higher than the top surface 321 of the light-receiving member light blocking wall 32, and the light-receiving member light blocking wall 32 and the light-emitting member light blocking wall 42 are respectively penetrated by the incident light. Made of glue. Preferably, the height relationship of the light-emitting unit 4 relative to the light-receiving unit 3 is from the setting surface 20 to the light-emitting unit The height of the top surface 421 of the light-blocking member 42 is not more than twice the height of the light-receiving member wall 32 from the setting surface 20 to the top surface 321 thereof. More preferably, the height relationship of the light-emitting unit 4 relative to the light-receiving unit 3 is based on the height of the top surface 421 of the light-blocking wall 42 of the light-emitting member being higher than the light-receiving member. The height of the light wall 32 from the installation surface 20 to the top surface 321 thereof is at least 3% or more.

Therefore, in the embodiment, the light-blocking wall 42 has the highest height (ie, higher than the light-receiving member 32 and the light-emitting surface 411 of the light-emitting member 41). The incident light emitted from the illuminating member 41 is not directly incident on the light-receiving surface 311 of the light-receiving member 31, thereby affecting the light-receiving member 31 to receive the optical signal, thereby effectively enhancing the light-receiving The light-receiving performance of the piece 31. It should be noted that the glue material suitable for the light-receiving member light blocking wall 32 of the first embodiment and the light-blocking member 42 may be a sheet molding compound (SMC). For example, the molding material (SMC) may be an epoxy molding compound (EMC), an epoxy resin, a silicone, or a liquid crystal polymer (LCP). ), polyphthalamide (PPA), or polybutylene terephthalate (PCT). It should be noted that when the above different materials are used as the light-receiving member light blocking wall 32 and the light-emitting member light blocking wall 42, the thickness range is also different. For example, when a liquid crystal polymer (LCP) is used, the thickness thereof is preferably 0.2mm; when epoxy resin is used, the thickness is preferably 0.3mm.

It is worth mentioning here that the light-emitting member 41 of the light-emitting unit 4 is superposed on the light-receiving member 31 of the light-receiving unit 3. In other words, the illuminating member 41 is closer to the skin of the user. Therefore, the optical path of the incident light emitted by the illuminating member 41 to the user's skin can be shortened, thereby reducing the loss of light, and the overall optical biomedical sensor module can achieve power saving effect.

It is worth mentioning here that in order to achieve a good signal-to-noise ratio (SNR), the light-receiving member transparent encapsulant 36 of the light-receiving unit 3 may contain a dye. More specifically, when the light-receiving member transparent encapsulant 36 contains a dye, the optical signal can be moved to the light-receiving member 31 to filter out unnecessary noise to improve the overall module's signal-to-noise ratio. .

The light-emitting member transparent encapsulant 45 constitutes a light-emitting surface (ie, the top surface 451) of the light-emitting unit 4, and the light-receiving member transparent encapsulant 36 constitutes a light-incident surface of the light-receiving unit 3 (ie, The top surface 361 of the light-emitting member transparent encapsulant 45 is recessed toward the light-emitting member 41, and the top surface 361 of the light-receiving member transparent encapsulant 36 blocks the light-receiving member. The space 320, which is defined by the wall 32 and the light-blocking wall 42 of the illuminator, is recessed (Fig. 3 only shows that the top surfaces 361, 451 are planar, non-recessed curved surfaces). For the incident light, the top surface 451 of the light-emitting member transparent encapsulant 45 in a concave shape can be regarded as a concave lens for increasing the incident light of the light-emitting member 41 from the transparent transparent adhesive 45 of the light-emitting member. Divergence angle. In addition, for the optical signal reflected by the user's skin to the light-receiving member 31, the top surface 361 of the light-receiving member transparent encapsulant 36 may be regarded as a convex lens for lifting. Light effect. Moreover, the illuminating member is transparently packaged The recessed top surface 451 of the glue 45 is higher than the recessed top surface 361 of the light-receiving member transparent encapsulant 36.

Referring to FIG. 4 and FIG. 5, a second embodiment of the optical biomedical sensor module of the present invention is substantially the same as the first embodiment, and the difference lies in the light collection of the second embodiment. The unit 3 includes only the pair of first electrode pads 33, and does not include the pair of second electrode pads 34 (see FIG. 3). The light-emitting unit 4 is electrically connected only to the second line 22 by the pair of first wires 43. (See Figure 3). In detail, in the second embodiment, the illuminating member 41 is directly crystallized on the opaque layer 37 of the solid crystal region 312 of the light receiving surface 311, and the illuminating member 41 and the opaque layer 37 are The light-emitting member 42 is directly surrounded by the light-blocking wall 42. That is, one circumferential surface of the light-emitting member 41 and one circumferential surface of the light-impermeable layer 37 are connected to the light-emitting member light blocking wall 42. The pair of first wires 43 are respectively separated. The N-type contact pads 413 and the P-type contact pads 414 on the light-emitting member 41 are directly connected to the electrode pads 221 of the second line 22 of the circuit board 2 through the light-emitting member light blocking walls 42. The opaque layer 37 may be an opaque solid crystal glue, a black rubber, a metal heat dissipation layer, or a stacked structure of the foregoing layers.

Referring to FIG. 6 and FIG. 7 , a third embodiment of the optical biomedical sensor module of the present invention is substantially the same as the first embodiment, and the main difference is that the light emitting unit 4 does not need to be The pair of first wires 43 as shown in FIG. 3 are electrically connected to the pair of second electrode pads 34. Specifically, the pair of second electrode pads 34 of the light-receiving unit 3 are disposed on the light-receiving surface 311 at intervals, and the light-emitting member 41 is flip chipped on the pair of second electrode pads 34. Above, that is, the N-type contact pad 413 and the P-type contact pad 414 (see FIG. 2) on the illuminating member 41 are respectively disposed downward, and respectively connected to the interior P _{1 of} the pair of second electrode pads 34. electrically connected, and each second electrode pad 34 having the extending portion extending to the outside of the mounting area 312 P _2, the second embodiment may be connected by the pair of extending portions P ₂ of the electrically to the circuit board 2 The second line (the second line is not shown in Figures 6 and 7). Wherein the pair of second electrodes, the pair of _second connecting portion extending from the second line P may be as the first embodiment by the second pair of wires 44 are respectively connected to the first mounting area 312 of the outer pad 34 The pair of extensions P ₂ and the second line 22 of the circuit board 2; or the inside of the light-receiving member 31 forms a pair of internal connection lines (not shown) connected to the pair of second electrode pads 34; The outer surface of the light-receiving member 31 is formed with a 3D printed circuit (not shown), and the pair of extending portions P ₂ extend through the peripheral surface of the light-receiving surface 311 and the light-receiving member 31 to the light-receiving member 31. The bottom surface 314 is electrically connected to the corresponding electrode pads 221 of the second line 22 of the circuit board 2. With reference to FIG. 8 , in another embodiment of the present embodiment, preferably, the top surface 361 of the light-receiving member transparent encapsulant 36 may also be lower than the light-emitting surface 411 of the light-emitting member 41 . Moreover, the light-emitting surface of the light-emitting unit 4 defined by the light-emitting member transparent encapsulant 45 is higher than the light-incident surface (light-receiving surface) defined by the light-receiving member transparent encapsulant 36 of the light-receiving unit 3. It should be noted that, in this embodiment, the light-emitting unit 4 may be a structure in which the light-emitting member 41, the light-blocking member 42 and the light-emitting member transparent adhesive 45 are integrally formed, for example, a chip scale package. Package, CSP) component.

It should be noted that, in the optical biomedical sensor module of the present invention, the light-emitting member 41 of the first embodiment to the third embodiment is stacked on the light-receiving member 31. In order to avoid the arrangement of the illuminating member 41, the optical signal reflected by the skin is prevented from entering the light absorbing member 31. Therefore, in the embodiments, the size of the light-receiving member 41 can be selected to determine the size of the light-receiving member 31 such that the light-receiving region 313 on the light-receiving surface 311 of the light-receiving member 31 is sufficient to receive reflection from the skin. The optical signal. In detail, the light-receiving area 313 in the embodiments has a peripheral surface 422 of the light-blocking wall 42 facing away from the inner surface 423 of the light-blocking wall 42 to the inner surface 423. a distance X between an edge of the light member 31, the light-blocking wall 42 has a height y from the light-receiving surface 311 to the top surface 421 of the light-blocking wall 42 of the light-emitting member, and the light-receiving surface 311 is defined A thickness of a dermis layer D of the user's skin is a distance Y ; wherein a center point C of the light-emitting surface 411 to the inner circumference surface 423 of the light-emitting member light blocking wall 42 and one of the top surfaces 421 thereof An imaginary line L at the joint is formed at an angle θ with the light exit surface 411. As can be seen from FIG. 9, the distance X can represent the following relation (1): X = 2 × x ₁ + x ₂ .................. (1) wherein, a definition is associated with the distance X The constant factor K , the illuminating member 41 has a viewing angle (θ _v ), the relationship between x ₁ and x ₂ can be represented by the distance Y , the height y , and the constant factor K represents the following relation (2): It should be noted that when the angle θ is greater than 30 degrees, the constant factor K is equal to the angle θ, and when the angle θ is less than or equal to 30 degrees, the constant factor K is equal to 90 degrees - the view angle θ _v /2. Therefore, the distance ( X ) of the light-receiving area 313 can be determined by the relationship (2), so that the light-receiving member 31 can effectively receive the light signal reflected by the skin of the user. The illuminating member 41 can be placed at the center of the light-receiving member 31, and a part of the signal can be discarded to place the illuminating member 41 at a corner of the light-receiving member 31, as long as the illuminating member 41 and the light-receiving member 31 are disposed. There may be at least one dimensional relationship that conforms to the aforementioned distance X.

Referring to FIG. 10 and FIG. 11 , a fourth embodiment of the optical biomedical sensor module of the present invention is substantially the same as the third embodiment, and the main difference is that the light output of the light emitting member 41 is The surface 411, the top surface 321 of the light-receiving member light blocking wall 32, and the top surface 421 of the light-emitting member light blocking wall 42 are of equal height. In detail, in the present embodiment, a pair of first electrode pads 33 are formed on the bottom surface of the light-receiving member 31, and the light-receiving unit 3 is the pair of first electrode pads located on the bottom surface 314 of the light-receiving member 31. 33 is electrically connected to the corresponding electrode pad 211 of the first line 21 of the circuit board 2; and a pair of inner connecting lines connected to the pair of second electrode pads 34 are formed inside the light collecting member 31. The flip chip type illuminating member 41 is fixed on the corresponding pair of second electrode pads 34 by the N-type contact pads 413 and the P-type contact pads 414 (see FIG. 2) located at the bottom surface thereof. And the pair of inner connecting lines extending to the bottom surface of the light receiving member 31 by the pair of second electrode pads 34 are electrically connected to the opposite electrode pads 221 of the second line 22 of the circuit board 2. Referring to FIG. 11 , in the embodiment, the top surface 361 of the light-receiving member transparent encapsulant 36 is flush with the light-emitting surface 411 of the light-emitting member 41 , that is, the light-emitting surface of the light-emitting unit 4 and the light-receiving unit. The light-incident surface (light-receiving surface) defined by the transparent encapsulant 36 of 3 is flush. Moreover, in this embodiment, the light emitting unit 4 can be the light emitting member 41 and the hair The light-blocking wall 42 is integrally formed, such as a chip scale package (CSP) component.

Similarly, in order to prevent the arrangement of the illuminating member 41 from obstructing the light signal reflected from the skin from entering the light-receiving member 31, the size of the light-receiving member 31 may be determined according to the size of the illuminating member 41. The light-receiving area 313 on the light-receiving surface 31 of the piece 31 has a distance X sufficient to receive the light signal reflected from the skin. In the fourth embodiment, since the included angle is less than 30 degrees, when the distance X is calculated by the above relation (2), the constant factor K is equal to 90 degrees - the viewable angle θ _v /2.

In order to more clearly show the connection relationship between the components of the optical biomedical sensor module of the embodiments, a production flow of the embodiments will be further described below.

Referring to FIG. 12, the manufacturing process of the optical biomedical sensor module of the present invention substantially includes a preparation step 500, a die stacking step 501, a light-blocking light-blocking wall forming step 503, and a light-receiving step. A light blocking wall forming step 505, and an encapsulating step 506.

The preparation step 500 is to prepare the circuit board 2 having the setting surface 20, the first line 21 and the second line 22, the light-receiving member 31 having the crystal-receiving area opaque to the light-receiving surface, and at least A illuminating member 41.

The die stacking step 501 is to first fix the light-receiving member 31 to the setting surface 20 of the circuit board 2, and then fix the light-emitting member 41 to the solid crystal region having opacity. The light collecting member 31 is on. In this embodiment, the solid crystal region that is opaque is formed by the pair of second electrode pads 34, and may also be provided by or in combination with an opaque solid crystal glue or an opaque layer (such as black). A glue layer or a metal layer is in the die bond region.

The light-emitting member light-blocking wall forming step 503 is formed on the light-receiving surface by a dispensing robot dispenser or an automatic dispenser and a pick & place machine. The solid crystal region on the 311 and surrounding the opaque light, that is, the illuminating member 41 and the opaque layer are included, so that the light emitted by the illuminating member cannot be directly emitted to the light collecting surface. The illuminating member light blocking wall forming step 503 can also directly match a illuminating member having a light blocking wall of the illuminating member.

The light-receiving member light-blocking wall forming step 505 is formed on the setting surface of the circuit board 2 through a press molding method or an automatic dispenser with a pick & place machine. The light-receiving member 31 is surrounded by 20, wherein it is particularly noted that the light-blocking wall of the light-receiving member can also be formed on the circuit board when the circuit board 2 is provided.

The filling step 506 is to fill the light-receiving member transparent encapsulant 36 and the transparent encapsulant of the illuminating member into the spaces 320 and 420 surrounded by the light-receiving member light blocking wall 32 and the illuminating member light blocking wall 42 respectively. 45, respectively, covering the light-receiving member 31 and the light-emitting member 41. Wherein, when the illuminating member is a illuminating member having a light blocking wall, the surface of the illuminating member may already have a transparent encapsulant 45 thereon, and only needs to be defined between the light blocking wall of the light receiving member and the light blocking wall of the illuminating member. The space is filled into the light-receiving member transparent encapsulant 36.

In addition, an electrical connection method having different options according to different forms of the light-receiving member and the light-emitting member is selectively selected in the process step; that is, the providing surface has a pair of the first electrode pads 33 and a pair of the first The light-receiving member 31 of the light-receiving unit of the two-electrode pad 34; the pair of first electrode pads 33 are electrically connected to the electrode pad 221 of the second line 22 of the circuit board 2, the pair of second electrode pads 34 and The electrode pad 211 of the first line 21 of the circuit board 2 is electrically connected to the pair of the electrode pads 211 of the first line 21 of the circuit board 2 and the light-receiving surface 311 of the light-receiving member 31. The second electrode pad 34 is electrically connected.

In addition, regarding the selection of the suitable illuminating member 41 and the light-receiving member 31, the main consideration is to prevent the arrangement of the illuminating member 41 from obstructing the light signal reflected from the skin from entering the light-receiving member 31, that is, the size of the illuminating member 41 is required. The size of the light-receiving member 31 is determined such that the light-receiving area 313 on the light-receiving surface 31 of the light-receiving member 31 has the distance X sufficient to receive the light signal reflected from the skin.

Referring to FIG. 9, when the light-blocking member 42 is disposed on the light-receiving member 31 in the light-blocking member wall forming step 503, the distance X is reserved, that is, the light-blocking member is blocked. The peripheral surface 422 of the 42 extends to the distance X of the edge of the light-receiving member 31, and the light-blocking wall 42 has a height y , and the light-receiving surface 311 reaches the dermis layer D of the skin of the user. The thickness is deeper than the distance Y , and the imaginary line L of the center point C of the light-emitting surface 411 to the junction of the inner peripheral surface 423 of the light-emitting member light-blocking wall 42 and the top surface 421 thereof is sandwiched by the light-emitting surface 411. The angle θ. As shown in FIG. 9, the distance X is expressed as X = 2 × x ₁ + x ₂ , wherein the relationship between the view angle θ _v , x ₁ and x ₂ of the illuminating member 41 can be obtained by the distance Y and the height y . And the correlation constant factor K of the distance X is expressed as

When the angle θ is greater than 30 degrees, the constant factor K is equal to the angle θ. When the angle θ is less than or equal to 30 degrees, the constant factor K is equal to 90 degrees - the view angle θ _v /2, so that the How many distances X need to be reserved for the light zone 313, so that the light-receiving member 31 can effectively receive the light signal reflected by the user's skin.

Furthermore, referring to FIG. 13 and referring to FIG. 2 and FIG. 3 simultaneously, the manufacturing process of the first embodiment of the present invention is substantially the same as the manufacturing process of FIG. 12, except that the die stacking is performed. Step 501, the light-emitting member light-blocking wall forming step 503, and the light-receiving member light-blocking wall forming step 505, and further comprising a first wire bonding step 502 implemented after the die-stacking step 501 And a second wire bonding step 504 implemented in the light-blocking light-blocking wall forming step 503. Specifically, the die stacking step 501 is to sequentially stack the first electrode pad 33 and the light emitting member 41 on the bottom surface 314 of the light-receiving member 31 on the setting surface 20 of the circuit board 2, respectively. The electrode pad 211 of the first line 21 and the inner portion P ₁ of the pair of second electrode pads 34 on the light-receiving surface 311 of the light-receiving member 31 are arranged such that the light-emitting member 41 is located at the light-receiving portion 41. The surface 311 of the surface 311 is disposed in the solid crystal region 312, and the light-emitting surface 411 is turned away from the light-receiving surface 311. Specifically, the pair of second electrode pads 34 are the opaque layer of the first embodiment, and the die stacking step 501 is performed by the solid crystal method on the bottom surface 314 of the light collecting member 31. electrode pad 33 and the light emitting element 41, are overlaid on the first line disposed on the surface 20 of the electrode 21 and the pad 211 for receiving the inner surface of the second electrode pad P ₁ of 34 on 31 on.

The first bonding step 502 is to connect the pair of first wires 43 to the N-type contact pads 413 and the P-type contact pads 414 and the pair of second electrode pads respectively on the light-emitting surface 411 of the light-emitting member 41. The extension P _{2 of} 34.

The light-emitting member light-blocking wall forming step 503 is formed on the light-receiving surface by a dispensing robot dispenser or an automatic dispenser and a pick & place machine. 311 and surrounding the illuminating member 41, the inner portion P ₁ of the pair of second electrode pads 34 and the pair of first wires 43 to expose the extending portion P _{2 of} the pair of second electrode pads 34 to the illuminating member The light blocking wall 42 is outside.

The second wire bonding step 504 connects the wire 35 of the light-receiving unit 3 and the pair of second wires 44 of the light-emitting unit 4 to the outside of the solid crystal region 312 of the light-receiving surface 311 by wire bonding. An electrode pad 33 and the first line 21 of the circuit board 2, the extension portion P ₂ of the pair of second electrode pads 34 outside the die bonding region 312, and the second line 22 of the circuit board 2.

The light-receiving member light-blocking wall forming step 505 is formed on the setting surface of the circuit board 2 through a press molding method or an automatic dispenser with a pick & place machine. 20 is attached to the light collecting member 31.

Referring to FIG. 14 and referring to FIG. 4 and FIG. 5 simultaneously, the manufacturing process of the second embodiment of the present invention is substantially the same as the manufacturing process of FIG. 12, and the difference is that the hair is The light member blocking wall forming step 503 is divided into a sub-step forming substep 5031, an upper forming sub-step 5032, and a second bonding step 504 between the lower forming sub-step 5031 and the upper forming sub-step 5032. .

Specifically, after the die stacking step 501 is completed, the lower portion of the light-emitting member light-blocking wall forming step 503 is performed to form a sub-step 5031, and the lower portion of the light-blocking member 42 is formed by an automatic dispenser. The light-emitting surface 41 is surrounded by the light-receiving surface 311.

The second bonding step 504 is performed by connecting the wire 35 of the light-receiving unit 3 and the pair of first wires 43 of the light-emitting unit 4 to the outside of the solid crystal region 312 of the light-receiving surface 311. The first electrode pad 33 and the first line 21 of the circuit board 2, the N-type contact pad 413 on the light-emitting surface 411 of the light-emitting member 41, the P-type contact pad 414, and the first portion of the circuit board 2 The second line 22 is such that the pair of first wires 43 span the previously formed lower portion of the light-blocking wall 42 of the illuminator.

The upper portion of the illuminating member wall forming step 503 is formed by the automatic dispensing machine. An upper portion of the illuminating member 42 is formed on the lower portion of the illuminating member 42 to obtain the illuminating member. Light blocking wall 42.

Referring to FIG. 6 and FIG. 7 simultaneously, the manufacturing process of the third embodiment of the present invention is substantially the same as the manufacturing process of the first embodiment (FIG. 13), and the difference is that the die stacking step 501 and the The second wire bonding step 504, and the third embodiment does not implement the first wire bonding step 502. Specifically, the die stacking step of the third embodiment The light-emitting member 41 in 501 is directly flipped on the pair of second electrode pads 34 of the light-receiving member 31 by flip chip. Further, regarding the electrical connection relationship between the illuminating member 41 and the circuit board 2, it has been described in the foregoing manufacturing process, and details are not described herein again. Therefore, the manufacturing process of the third embodiment of the present invention does not need to implement the first wire bonding step 502, and the second wire bonding step 504 is only to connect the wire 35 of the light receiving unit 3 to the light receiving member 31. The first electrode pad 33 outside the crystal region 312 and the first line 21 of the circuit board 2.

Referring to FIG. 10 and FIG. 11 simultaneously, the manufacturing process of the fourth embodiment is substantially the same as the manufacturing process of the third embodiment, and the difference is that the die stacking step 501 of the fourth embodiment, and This second wire bonding step 504 is not implemented. Specifically, the light-receiving member 31 of the die-stacking step 501 of the fourth embodiment is directly connected to the first line 21 of the circuit board 2 by the pair of first electrode pads 33 on the bottom surface 314. The electrode pads 211 are electrically connected.

In the embodiment of the present invention, the light-emitting unit 4 is stacked on the light-receiving surface 311 of the light-receiving member 31, so that the light-emitting member 41 and the light-receiving member 31 are vertically The overlapping relationship not only reduces the two-dimensional space of each embodiment to achieve the effect of reducing the size of the component, but also makes the wearing device shorter, and enables the illuminating member 41 facing the user's skin to be closer to the user. Thereby, the optical path of the incident light is shortened and the loss of light is reduced to achieve a power saving effect.

In addition, the first embodiment to the third embodiment allow the illuminating member to block The top surface 421 of the light-emitting member 42 is higher than the top surface 321 of the light-blocking member 32 and the light-emitting surface 411 of the light-emitting member 41. The top surface 421 of the light-blocking wall 42 is compared with the light-receiving unit 3 The light-emitting member 41 of the light-emitting unit 4 has the highest height, so that the incident light emitted by the light-emitting member 41 is not directly incident on the light-receiving surface 311 of the light-receiving member 31 to interfere with the light-receiving. The optical signal received by the device 31. On the other hand, in the embodiments, the light-receiving member 31 and the light-emitting member 41 are opaque, and the incident light emitted from the light-emitting member 41 can be prevented from directly entering the light-receiving surface 311 of the light-receiving member 31. The signal interference to the light-receiving member 31 is also reduced.

Moreover, in the embodiments, the light-receiving member transparent encapsulant 36 contains a dye to thereby filter out unnecessary noise and the like. In addition, the top surface 361 of the light-receiving member transparent encapsulant 36 and the top surface 451 of the transparent encapsulant 45 of the light-emitting member may also increase the incident light emitted by the light-emitting member 41 from the transparent portion. The divergence angle of the encapsulant 45 and the light-receiving effect of the light-receiving member 31 are improved.

In summary, the optical biomedical sensor module of the present invention has the light-emitting unit 4 and the light-receiving unit 3 in a superimposed relationship, which can reduce the component size of the module to make the wearable device shorter in size. The optical path between the illuminating member 41 and the user can be shortened to reduce the light consumption and save power. Moreover, the illuminating surface of the illuminating unit 4 defined by the illuminating member transparent encapsulant 45 is not lower than the receiving surface. The light-receiving member of the light unit 3 is transparent to the light-incident surface (light-receiving surface) defined by the transparent encapsulant 36, and the top surface 421 of the light-blocking member 42 is not lower than the light-emitting surface 411 and the light-blocking wall of the light-receiving member. 32 top surface 321 and let the light-receiving member 31 and light The light is opaque between the members 41, so that the incident light of the illuminating member 41 can be prevented from traveling laterally or toward the light receiving surface 311 to reduce signal interference with the light absorbing member 31. In addition, the first light receiving the dye The encapsulant 36 can also filter the noise, and the recessed light-receiving member and the top surface 361, 451 of the transparent encapsulant 36, 45 of the illuminating member can respectively increase the emission angle of view of the incident light of the illuminating member 41 and enhance the light-receiving. The light-receiving effect of the piece 31 is such that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the simple equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still Within the scope of the invention patent.

Claims (15)

An optical biomedical sensor module includes: a circuit board including a setting surface, a first line, and a second line; a light receiving unit stacked on the setting surface of the circuit board And comprising a light-receiving member having a light-receiving surface facing away from the setting surface and electrically connected to the first line of the circuit board; and a light-emitting unit stacked on the light-receiving surface of the light-receiving member And comprising: a light-emitting member having a light-emitting surface facing away from the light-receiving surface and electrically connected to the second line of the circuit board; and a light-blocking member blocking the light-emitting member of the light-emitting member; wherein the light-receiving member The illuminating member is opaque; and wherein a top surface of the light blocking wall of the illuminating member is not lower than the illuminating surface. The optical biomedical sensor module of claim 1, wherein the light-receiving surface comprises a solid crystal region located in the light-blocking wall of the light-emitting member, the light-receiving unit further comprising a pair of first The illuminating unit further includes an N-type contact pad and a P-type contact pad; wherein the pair of first electrode pads of the light-receiving unit are electrically connected to the first line of the circuit board; and wherein the illuminating member A die is deposited on the die attach region and electrically connected to the second line of the circuit board by the N-type contact pad and the P-type contact pad. The optical biomedical sensor module of claim 2, wherein the light-receiving unit further comprises a pair of second electrode pads; wherein the pair of second electrode pads of the light-receiving unit are spaced apart Set in The light-receiving surface, and each of the second electrode pads has an inner portion in the solid crystal region and an extension portion extending from the inner portion to the outside of the solid crystal region; and wherein the N-type contact pad of the light-emitting unit And the P-type contact pads respectively corresponding to the internal portions of the pair of second electrode pads, and the extensions of the pair of second electrode pads are electrically connected to the second line of the circuit board. The optical biomedical sensor module according to any one of claims 1 to 3, wherein the light-receiving unit further comprises a light-receiving member light blocking wall surrounding the light-receiving member, and the light-emitting member The top surface of the light blocking wall is not lower than a top surface of the light blocking wall of the light receiving member. The optical biomedical sensor module of claim 4, wherein the light-receiving surface further comprises a light-receiving area surrounding the solid crystal region, the light-receiving region having a light blocking by the light-emitting member The peripheral surface of one of the walls faces away from the inner surface of one of the light blocking walls of the illuminator and extends to an edge of the light-receiving member ( X ), and the light-blocking wall of the illuminating member has a light-receiving surface to the illuminating member a height ( y ) of a top surface of the light blocking wall, and a thickness of a dermis layer defining the light receiving surface to a user's skin is a distance ( Y ); wherein a definition is related to the distance ( X ) a constant factor ( K ), the illuminating member has a viewing angle (θ _v ), and an imaginary line of a center point of the illuminating surface to a junction of the inner circumferential surface of the illuminating member light blocking wall and one of the top surfaces thereof is An angle (θ) is formed with the light exit surface, and the distance ( X ) is expressed as: And wherein, when the angle (θ) is greater than 30 degrees, the constant factor ( K ) is equal to the angle (θ), and when the angle (θ) is less than or equal to 30 degrees, the constant factor ( K ) is equal to 90 degrees - The view angle (θ _v )/2. The optical biomedical sensor module of claim 4, wherein the illuminating unit further comprises a illuminating member transparent encapsulant, wherein the illuminating member transparent encapsulant is filled around the light blocking wall of the illuminating member A space to cover the illuminating member. The optical biomedical sensor module of claim 4, wherein the light-receiving unit further comprises a light-receiving member transparent encapsulant, and the light-receiving member transparent encapsulant is filled in the light-receiving member to block light A space defined by the wall and the light blocking wall of the illuminating member covers the light collecting member and covers the setting surface. The optical biomedical sensor module of claim 7, wherein the light-emitting transparent encapsulant has a top surface that is recessed toward the light-emitting member, and the light-receiving member transparent encapsulant has a facing The top surface of the light member is recessed. The optical biomedical sensor module of claim 4, wherein the illuminating member emits an incident light, and the light blocking wall and the light blocking wall of the illuminating member are respectively incident light A gel that cannot penetrate. The optical biomedical sensor module of claim 4, wherein a height of the setting surface to the top surface of the light blocking wall of the illuminating member is higher than the setting surface to the light receiving member A height of the top surface of the light wall is at least 3% and does not exceed twice the height of the top surface of the setting surface to the light blocking wall of the light-receiving member. A manufacturing method of an optical biomedical sensor module, comprising: a preparation step of preparing a circuit board including a setting surface, a light collecting member having a light collecting surface, and a light emitting surface having a light emitting surface And a step of stacking the crystals, respectively, sequentially separating the light-receiving member and the light-emitting member Stacked on the opaque layer on the mounting surface and a die-bonding area of the light-receiving surface. The method for fabricating an optical biomedical sensor module according to claim 11, further comprising a step of forming a light blocking wall of the illuminating member, forming a illuminating member blocking the solid crystal region and the illuminating member The light wall is provided on the light collecting surface or a light emitting member having a light blocking wall of the light emitting member. The method for fabricating an optical biomedical sensor module according to claim 12, further comprising a light-receiving member light-blocking wall forming step of forming a light-receiving member wall of the light-receiving member A circuit board having a predetermined light-receiving member light blocking wall is provided on the mounting surface of the circuit board. The method for fabricating the optical biomedical sensor module of claim 13, further comprising a step of filling a glue, the space defined by the light blocking wall of the light receiving member and the light blocking wall of the light emitting member The light-receiving member transparent encapsulant is poured into the cover to cover the light-receiving member. The method for fabricating an optical biomedical sensor module according to claim 14, wherein the light-receiving surface further comprises a light-receiving area surrounding the solid crystal region, wherein the light-receiving region has a light-emitting region The peripheral surface of one of the light blocking walls extends away from the inner surface of one of the light blocking walls of the light emitting member to a distance ( X ) of the edge of the light collecting member, and the light blocking wall of the light emitting member has a light receiving surface a height ( y ) of a top surface of the light blocking wall of the light-emitting member, and a thickness of a dermis layer defining the light-receiving surface to a skin of a user is a distance ( Y ); wherein a distance is defined X ) an associated constant factor ( K ), the illuminating member has a viewing angle (θ _v ), a center point of the illuminating surface to a junction of the inner circumferential surface of the illuminating member light blocking wall and one of the top surfaces thereof The imaginary line is at an angle (θ) to the light exit surface, and the distance ( X ) is expressed as: And wherein, when the angle (θ) is greater than 30 degrees, the constant factor ( K ) is equal to the angle (θ), and when the angle (θ) is less than or equal to 30 degrees, the constant factor ( K ) is equal to 90 degrees - The view angle (θ _v )/2.