TWI601965B - Component Processor - Google Patents

Description

Component processor

The present invention relates to an element processor, and more particularly to an element processor that mounts an element such as a semiconductor wafer on or from a burn-in board.

The semiconductor element (hereinafter referred to as "element") performs various inspections such as electrical property, heat or pressure reliability inspection after the packaging process is completed.

In this inspection of the semiconductor element, there is a Burn-in Test. The burn-in test inserts a plurality of components in a Burn-in Board, and the burn-in board is housed in the burn-in test apparatus. After applying a predetermined time of heat or pressure, it is discriminated whether or not a defective component is present.

The burner test component processor generally refers to a device that classifies (unloads) the components from the pre-burning plates of the components that are equipped with the burn-in test, according to the inspection results of the respective components such as the pass and the fail. The respective trays are simultaneously reinserted into the components to be subjected to the burn-in test at the empty position (socket) of the pre-burning plate in which the components are placed.

In addition, the performance of the component processor as described above is evaluated by the number of sorting per unit time (UPH: Units Per Hour), and the components are transferred between the constituent elements constituting the component processor, and the pre-burning board is transferred. It takes time to decide UPH.

Therefore, in order to improve the performance of the component sorting device, that is, UPH, it is necessary to improve the structure and configuration of each component.

As described above, as the component processor for improving the UPH, there are Korean registered patent No. 10-1133188 and Korean registered patent No. 10-1177319.

However, the prior art component processor has a problem in that the type of the component to be sorted, that is, the specification is different, and in this case, if the loading section is unloaded When loading the tray corresponding to the specification, the user needs to manually exchange the components in the DC test section, the socket pressurizer on the burn-in board, the moving buffer, etc., which are matched with the component specifications, and therefore there is an exchange. The problem of cumbersome work.

In particular, since the work is performed using the inside of the apparatus to which the weight is placed, there is a problem that the operator is injured due to an erroneous operation.

Further, among the elements to be tested, a so-called BGA element in which a plurality of balls are provided on the bottom surface is used as a pin for bonding to an external terminal instead of a pin protruding to the side.

In addition, inspection of the BGA component is typically performed by inserting into a socket that is provided with a plurality of pins corresponding to the respective balls, so-called pogo pins.

Such a test socket for a BGA component is disclosed in Korean Registered Utility Model No. 20-0463425.

In particular, Korean Registered Utility Model No. 20-0463425 is an adapter provided with a guide for mounting a BGA component on a test socket, thereby always maintaining a state of alignment between the fixed pin and the ball terminal, and can be maintained. The fixed contact state therefore has the effect of achieving an accurate inspection of the components.

However, in the adapter structure disclosed in Korean Laid-Open Utility Model No. 20-0463425, in order to stably mount the component, a side space should be provided between the side of the component and the adapter because the lateral spacing exists between the pin and the ball terminal. The problem of the arrangement state being destroyed.

In addition, when the component is unloaded from the test socket, there is a problem that the component is caught by the adapter to terminate the operation of the device to reduce the efficiency of the inspection work.

An object of the present invention is to provide an element processor in which an element such as a semiconductor wafer is stably mounted on or unloaded from a burn-in board.

The present invention has been made in order to achieve the object as described above, and discloses an element processor including: a loading unit 100 that loads a tray 30 on which an element to be subjected to a burn-in test is mounted; and an XY work table 410 that advances Burning plate 20 moves in the XY direction, wherein the burnt plate The board is equipped with an element that performs a burn-in test at an empty position where the components of the burn-in test are carried out, and an unloading unit that mounts the qualified component on the tray 30 in the mounted component that has been subjected to the burn-in test.

The component processor may further include a DC test portion 170 that receives an element to be subjected to a burn-in test from the loading portion 100 before the pre-burning plate 20 carries an element to be subjected to a burn-in test, and tests the component in advance DC characteristic.

The component processor may further include a sorting unit 300 that sorts the components that are determined to be unqualified by the DC characteristic test result of the DC test unit 170 and that are determined to be unqualified by the burn test result.

The component processor may further include: a first movement buffer 600, which is mounted before the pre-burning plate 20, temporarily carrying an element that performs DC characteristic test by the DC test portion 170; and a second movement buffer 700, The components that have been completed from the XY workbench 410 and have completed the burn-in test are temporarily mounted.

The component processor may further include a kit exchange unit 900 that buffers the DC test section 170, the socket pressurizer 45 on the XY workbench 410, and the first movement buffer according to specifications of components to be burned. At least one of the controller 600 and the second movement buffer 700 is automatically exchanged as a switching kit.

The kit exchange portion 900 may include: a main body portion 901 provided with a buffer space 920 capable of temporarily storing an exchange kit to be exchanged; and an exchange portion 930 that carries out an exchange kit disposed in the main body 40 of the component processor for temporary storage In the buffer space 920, a new switching suite is exchanged for the body 40 of the component processor.

When the exchange kit is the DC test portion 170, the DC test portion 170 is inserted in a moving direction thereof, and an electrical connection portion 171 for electrically connecting with the DC test portion 170 may be disposed in the The body 40 of the component processor.

The component processor may include: a third transfer tool 510 that transfers an element between the loading portion 100 and the DC test portion 170; a fourth transfer tool 520 at the DC test portion 170 and the first Moving the components between the movement buffers 600; the fifth transfer tool 550, transferring the components between the second movement buffers 700 and the unloading portion 200; and one or more sorting tools in the first movement buffer The device 600 and the second movement buffer 700 transfer components between the second movement buffer 700 and the sorting unit 300.

The one or more sorting tools may include: a first sorting tool 560, in the An element is transferred between the first movement buffer 600 and the sorting unit 300; and a second sorting tool 570 transfers the element between the second movement buffer 700 and the sorting unit 300.

The exchange kit is provided in the component housing portion 610 of the first movement buffer 600, the component housing portion 710 of the second movement buffer 700, and one or more fixings provided in the main body 40 of the component processor. a buffer, the component housing portion 610 of the first movement buffer 600, the component housing portion 710 of the second movement buffer 700, and the fixed buffer have the same structure, respectively along the first movement buffer The component housing portion 610 of the first movement buffer 600 and the components of the second movement buffer 700 are realized by the linear movement direction of the component housing portion 610 of the 600 and the component housing portion 710 of the second movement buffer 700. The exchange of the accommodating portion 710, the exchange of the fixed buffer is implemented in at least one of the ends of the first movement buffer 600 and the second movement buffer 700.

The exchange kit is provided in the component housing portion 610 of the first movement buffer 600, the component housing portion 710 of the second movement buffer 700, and one or more fixings provided in the main body 40 of the component processor. a buffer, the component housing portion 610 of the first movement buffer 600, the component housing portion 710 of the second movement buffer 700, and the fixed buffer have the same structure, and components of the second movement buffer 700 The accommodating portion 710 and the fixed damper are exchanged along the linear movement direction of one of the component accommodating portion 610 of the first movement buffer 600 and the component accommodating portion 710 of the second movement damper 700, respectively. And passing through the fixed buffer to the linear movement direction of the remaining one of the component housing portion 610 of the first movement buffer 600 and the component housing portion 710 of the second movement buffer 700.

The component processor may include a socket pressurizing portion 90 disposed on an upper side of the XY working table 410, and pressurized to be disposed on the burn-in board 20 in order to carry out or carry an element in the burn-in board 20 Test the socket.

The socket pressurizing portion 90 may include a loading socket presser 92 formed with a loading opening 92a for guiding an element to be subjected to a burn-in test in the test socket, and an unloading socket presser 91 An unloading opening 91a for guiding the component that has completed the burn-in test in the test socket is formed.

The unloading opening 91a is larger in size than the loading opening 92a so as not to hinder the carrying out of the component in the test socket.

Arranging the along the arrangement direction of the loading unit 100 and the unloading unit 200 The charging socket pressurizer 92 and the unloading socket pressurizer 91 are mounted.

The first transfer tool 530 and the second transfer tool 540 correspond to the loading socket presser 92 and the unloading socket presser 91, and the loading unit 100 and the unloading unit The arrangement direction of the 200 (Y-axis direction) is set at a distance.

The component processor may further include an empty tray supply portion 80 disposed in parallel on one side of the loading portion 100 and for loading a plurality of empty trays 30 to be mounted on the burn-in board 20.

The component processor according to the present invention has an advantage that the component can be mounted or taken out stably and quickly.

In particular, in order to precisely mount components when mounting components mounted on test sockets such as burn-in boards, it is preferable to minimize errors with the adapter components and components incorporated in the socket pressurizer, but in the adapter components and In the case where the error between the elements is minimized, there is a problem that the element is jammed when the element is unloaded, and the element is prevented from being unloaded.

According to this, the component processor according to the present invention is such that the adapter component used when loading the component is different from the adapter component used when the component is unloaded, and thus has the ability to stably perform loading or unloading of the component, and can be quickly loaded or unloaded. The advantages of the components.

According to the component processor of the present invention, in the case where the specifications of the components to be sorted are different, that is, in the case of loading trays having components of different specifications, the automatic exchange of the DC test portion and the XY operation according to the specifications of the components is included. Since the socket pressurizing device on the stage and the kit exchange unit of the buffer unit further shorten the exchange time of the DC test unit and the like, there is an advantage that the processing speed can be remarkably improved.

10‧‧‧ components

20‧‧‧ burned board

30‧‧‧Tray

40‧‧‧ body of component processor

41‧‧‧ openings

42‧‧‧Upper board

45‧‧‧Socket pressurizer

50‧‧‧ rack

80‧‧‧ Empty tray supply department

90‧‧‧Socket pressurization

91‧‧‧Unloading socket pressurizer

91a‧‧‧Unloading opening

92‧‧‧Loading socket pressurizer

92a‧‧‧Opening opening

100‧‧‧Loading Department

110‧‧‧X-Y workbench

150‧‧‧Tray Rotating Department

170‧‧‧Test Department

171‧‧‧Electrical connection

200, 220‧‧‧ Unloading Department

210‧‧‧Loading Department

300, 320‧‧‧ sorting department

310‧‧‧Test Department

410‧‧‧X-Y workbench

411‧‧‧Deburning board installation

412‧‧‧Pre-burning plate lifting section

420‧‧‧Pre-burning plate exchange buffer

421‧‧‧ Burnt plate buffer

430‧‧‧Exchange buffer drive

431‧‧‧Second drive department

432‧‧‧First Drive Department

441‧‧‧First Selection Department

442‧‧‧Second Selection Department

443, 444‧‧‧Auxiliary picker

510, 520, 530, 540, 550, 560, 570‧‧‧ transfer tools

600‧‧‧First mobile buffer

610‧‧‧Component housing department

610a‧‧‧ Containment parts

611‧‧‧First Component Housing

612‧‧‧Second component housing

613‧‧‧ Third Component Housing

620‧‧‧Guide parts

621‧‧‧First guiding part

622‧‧‧Second guiding part

623‧‧‧ Third guiding part

630‧‧‧Mobile devices

631, 632, 633‧‧‧ first to third mobile devices

640‧‧‧Support parts

700‧‧‧Second mobile buffer

710‧‧‧Component housing department

711‧‧‧First Component Housing

712‧‧‧Second component housing

713‧‧‧ Third Component Housing Department

720‧‧‧Guide parts

721‧‧‧First guiding part

722‧‧‧Second guiding part

723‧‧‧ Third guiding part

730‧‧‧Mobile devices

731, 732, 733 ‧ ‧ first to third mobile devices

740‧‧‧Support parts

800‧‧‧ burn-in board loader

810‧‧‧Rack Mounting Department

820‧‧‧ Lifting Department

821‧‧‧Support

830‧‧‧Rack removal department

900‧‧‧Package Exchange Department

901‧‧‧ Main body

902‧‧‧rail

910‧‧‧Exchange Kit Mounting Department

920‧‧‧ buffer space

930‧‧‧Exchange Department

Fig. 1 is a conceptual diagram showing an example of a component processor according to the present invention.

Fig. 2 is a plan view showing the configuration of the element processor of Fig. 1.

Fig. 3 is a cross-sectional view showing the configuration of a first buffer and a second buffer of the element processor of Fig. 1.

Fig. 4 is a layout diagram showing a movement process of the X-Y work table and the burn-in board in the component processor of Fig. 1.

Fig. 5 is a conceptual diagram showing a process of exchanging a burn-in board between an XY stage and a burn-in board exchange buffer in the element processor of Fig. 1, wherein Fig. 5a shows the XY workbench and the burn-in. The state before the pre-burning plate is initially exchanged between the plate exchange buffer portions; the fifth plate shows the state after the pre-burning plate is exchanged between the XY working table and the pre-burning plate exchange buffer portion; the 5c and 5d are in the figure The drawing of the process of exchanging the pre-burning plate between the XY workbench and the pre-burning plate exchange buffer.

Figure 6 is a conceptual diagram showing a pre-burning board exchange process between the pre-burning board exchange buffer portion and the burn-in board loader in the component processor of Fig. 1, wherein Fig. 6a shows the burn-in board exchange buffer The state before the pre-burning plate is exchanged between the portion and the pre-burning plate loader; FIG. 6b is the middle of the rack of the pre-burning plate loader between the pre-burning plate exchange buffer portion and the pre-burning plate loader State; FIG. 6c is a state in which the pre-burning plate has been introduced into the rack of the pre-burning plate loader between the pre-burning plate exchange buffer portion and the pre-burning plate loader; FIG. 6d is a view showing the exchange buffer in the pre-burning plate The intermediate state between the portion and the pre-burning plate loader from the rack of the pre-burning plate loader; FIG. 6e is a view showing the between the pre-burning plate exchange buffer portion and the burn-in plate loader. A conceptual diagram of the state of the burn-in board from the rack of the burn-in board loader.

Fig. 7 is a side view showing the configuration of a burn-in board loader.

Fig. 8a is a side cross-sectional view showing a burn-in board exchange buffer unit and a burn-in board loader having a configuration deformed in the element processor of Fig. 1.

Figure 8b is a side view showing the burn-in board loader of Figure 8a.

Fig. 9 is a conceptual diagram showing a modification of the component inspection device of Fig. 2.

Fig. 10 is a conceptual diagram showing an exchange process in the case where the exchange kit is the test portion in the component inspection device of Fig. 2.

Figure 11 is a partial plan view showing the exchange process of the exchange kit of Figure 10.

Figure 12 is a plan view showing an element processor according to a first embodiment of the present invention.

Fig. 13 is a plan view showing a modification of the element processor of Fig. 12.

Figure 14 is a plan view showing a component processor in accordance with a second embodiment of the present invention.

15a and 15b are partial plan views showing the transfer process of the first transfer tool and the second transfer tool in the component processor of Fig. 14.

Hereinafter, the component processor according to the present invention will be described in detail below with reference to the drawings.

As shown in FIGS. 1 and 2, the component processor according to an embodiment of the present invention includes a loading unit 100, an unloading unit 200, a sorting unit 300, and a plurality of transfer tools 510 and 520 for transferring the components 10. , 530, 540, 550, 560, 570.

The pre-burning plate 20 refers to a plate member on which the first member 10 is mounted in order to perform a burn-in test in a burn-in test device (not shown), and has a socket into which the component 10 is respectively inserted, thereby being capable of high temperature Ability to test electrical and signal characteristics.

The burn-in board 20 is mounted on the X-Y work table 410 provided in the component processor, and the first component 10 is mounted while unloading the second component 10 of the burn-in test.

The XY working table 410 is configured as one of the pre-burning plates 20 to unload the pre-burning plate 20 inserted into the first member 10 while loading the pre-burning plate 20 inserted into the second member 10, as shown in FIG. 1 and FIG. The figure and Fig. 4 include a pre-burning plate exchange device (not shown) for receiving the pre-burning plate 20 exchanged by the component 10 to be executed or the pre-burning plate 20 exchanged by the discharge completion member 10.

In addition, the XY table 410 is driven by an XY table driving portion (not shown) to move the burn-in board 20, and the first member 10 is inserted into the empty position of the burn-in board 20 by the first transfer tool 530 or The second element 10 is carried out from the burn-in board 20.

The XY table driving unit is configured to facilitate the second transfer tool 540 and the first transfer tool 530 to carry out the component 10 from the burn-in board 20 or to mount the burn-in board 20, the second transfer tool 540, and the first transfer unit. The tool 530 is interlocked to move the XY table 410X-Y on which the pre-burning plate 20 is loaded, or to move XY-θ, etc., and has various configurations.

That is, the X-Y workbench drive unit is configured to move the second component 10 from the burn-in board 20 in conjunction with the second transfer tool 540, and simultaneously move the first component 10 in conjunction with the first transfer tool 530. The X-Y work table 410 is inserted into the empty position of the burn-in board 20, and if the first element 10 is inserted into the burn-in board 20, the X-Y work table 410 can be moved to the burn-in board exchange position.

Further, the XY work table 410 is disposed in a main body 40 constituting the component processor according to the present invention, and the main body 40 may include an upper plate 42 formed with an opening portion 41 for making the second transfer tool 540 and The first transfer tool 530 carries out the component 10 from the burn-in board 20 or mounts it on the burn-in board 20 .

Further, a socket presser 45 that pressurizes the socket provided on the burn-in board 20 is provided on the upper side of the X-Y work table 410 so as to carry out the component and the mounting component in the burn-in board 20.

The socket presser 45 is capable of carrying out or mounting an element inserted into the socket of the burn-in board 20, and has various configurations depending on the socket structure of the burn-in board 20.

The loading unit 100 may have various configurations as a configuration for loading the tray 30 (hereinafter referred to as a “loading tray”) in which the plurality of first elements 10 to be mounted on the burn-in board 20 are mounted.

In addition, the unloading unit 200 has a configuration in which a good component (hereinafter referred to as a "good product") is mounted on the tray 30 (hereinafter referred to as an "unloading tray") in the second component 10, and has various configurations. .

As shown in FIG. 2, the configuration of the loading unit 100 and the unloading unit 200 generally includes a pair of guide rails 110 and 210 that move the tray 30 to guide each other, and a driving unit (not shown) for moving the tray 30. .

Further, the loading unit 100 and the unloading unit 200 may be variously arranged according to design conditions. However, as shown in FIGS. 1 and 2, the loading unit 100 and the unloading unit 200 are generally arranged in parallel to be disposed in the testing unit 170. The unloading unit 200, the sorting unit 300, the first movement buffer 600, the second movement buffer 700, and the like are not limited thereto.

Further, after the first component 10 is carried out from the tray 30 in the loading unit 100, the empty tray 30 can be conveyed to the unloading portion 200 by the tray transfer portion (not shown) to mount the second member 10.

At this time, the residual member 10 may be present in the tray 30, so that the tray rotating portion 30 may be additionally provided to remove the tray rotating portion of the residual member 10 in order to remove the component 10 remaining in the tray 30 before the tray 30 is transferred from the loading portion 100 to the unloading portion 200. 150.

As shown in FIGS. 1 and 2, the tray rotating unit 150 is disposed between the loading unit 100 and the unloading unit 200 on the transfer path of the tray 30, and is configured by the tray transfer unit. The tray 30 is received from the loading unit 100 to rotate the tray 30, and then the tray 30 is conveyed to the unloading unit 200.

In this case, an empty tray portion (not shown) may be additionally provided on the tray rotating portion 150 side, and the empty tray portion supplies the empty tray 30 or the like to the sorting unit 300, the unloading unit 200, and the like in addition to the sorting unit 300. The loading unit 100 temporarily mounts the empty tray 30.

Further, according to the component processor of the present invention, the test unit 170 can be additionally provided, and the test unit 170 is loaded from the pre-burning board 20 before being mounted on the burn-in board 20 in order to mount only the first element 10 of the good product on the burn-in board 20. The portion 100 receives the first component 10 and tests the electrical characteristics such as DC characteristics in advance for the component 10.

The test unit 170 is provided between the loading unit 100 and the first movement buffer 600, and is composed of a plurality of sockets that can electrically connect the first element 10. The test unit 170 can have various configurations, and is preferably configured to be laterally disposed. The tray 30 has the same number of sockets in the horizontal direction.

The test result of the test unit 170 for each of the first elements 10 can be utilized as data for sorting in the sorting unit 300 to be described later.

Further, the component processor according to the present invention may include a sorting unit 300 that classifies the first defective component 10 and the second component 10 that are judged to be unqualified by the test result of the test section 170 to be classified. The second failed component 10.

The sorting unit 300 may have various configurations according to the arrangement and classification criteria, and the component 10 may be mounted based on the respective classification criteria: Good, Contact Reject, DC Failure, etc. An appropriate number of trays 30 - sorting trays have a configuration similar to that of the above-described loading unit 100. However, as shown in FIGS. 1 and 2, the loading unit 100 and the unloading unit can be disposed in a state of being fixed to the main body 40. Between 200.

Further, as shown in FIGS. 1 and 2, the sorting unit 300 is similar to the configuration of the loading unit 100 and the unloading unit 200 except for the configuration in which the sorting unit 300 is fixed, and may include the tray 30 to be moved and guided. a pair of rails; and a driving portion (not shown) for moving the tray 30.

The transfer tool is configured to transfer components between the burn-in board 20 and the loading unit 100, the test unit 170, the unloading unit 200, the sorting unit 300, a first movement buffer 600, and a second movement buffer 700, which will be described later. The configuration of 10 can have various configurations depending on the configuration of each configuration.

For example, the transfer tool can include a third transfer tool 510 that transfers the component 10 between the loading portion 100 and the test portion 170; a fourth transfer tool that transfers the component 10 between the test portion 170 and the first movement buffer 600 520: moving between the second movement buffer 700 and the unloading unit 200 a fifth transfer tool 550 that transports the component 10; and one or more sorting tools 560, 570 that transfer the component 10 between the first movement buffer 600 and the second movement buffer 700 and the sorting unit 300.

In addition, the configuration of the transfer tool 510, 520, 530, 540, 550, 560, 570 may include receiving the component 10 of the tray 30 mounted on the loading unit 100 between the first movement buffer 600 and the burn-in board 20. The first transfer tool 530 is inserted into the empty position of the pre-burning plate 20; and the second transfer tool 540 of the second member 10 is transferred from the pre-burning plate 20 between the pre-burning plate 20 and the second moving buffer 700.

Further, the arrangement of the elements 10 mounted on the burn-in board 20 is different from the arrangement of the elements 10 mounted on the tray 30 such as the loading unit 100, and the arrangement on the burn-in board 20 is relatively large.

Therefore, it is preferable that the first transfer tool 530 and the second transfer tool 540 that transport the component 10 to the pre-burning plate 20 or carry out the component 10 from the pre-burning plate 20 are relatively more transferred than the remaining moving tool. Element 10. For example, the first transfer tool 530 and the second transfer tool 540 are 12×2, and the remaining transfer tools may be 8×1, 8×2, and the like.

In the case of constituting the transfer tool as described above, in addition to the position where a relatively large number of components 10 need to be transferred, a transfer tool that transfers a small number of components 10 in a position where a relatively small number of transfer is required can be used, thereby saving manufacturing cost of the device. At the same time, the size and stability of the device can be improved.

Further, in consideration of alternately executing the loading and unloading elements 10 in the burn-in board 20, the first transfer tool 530 and the second transfer tool 540 are integrally moved to each other.

The third transfer tool 510 and the fourth transfer tool 520 also place the test portion 170 on the intermediate transfer member 10, so that the third transfer tool 510 and the fourth transfer tool 520 can be configured to move integrally with each other.

Further, in consideration of the efficiency of the element 10, the lateral number of the component housing grooves (not shown) for mounting the component 10 in the first movement buffer 600 and the second movement buffer 700 is the same as the first transfer tool 530. And the picker of the second transfer tool 540 has the same number of lateral directions.

The sorting tools 560, 570 may be constructed of one or more, etc., and may have various configurations.

In particular, as shown in FIG. 1, FIG. 2, and FIG. 9, in order to quickly sort the components 10 to be classified as unqualified in the first movement buffer 600 and the second movement buffer 700, sorting The tools 560, 570 can include: being transferred between the first movement buffer 600 and the sorting unit 300 A first sorting tool 560 of the component 10; and a second sorting tool 570 that transfers the component 10 between the second moving buffer 700 and the sorting section 300.

The first sorting tool 560 is to be checked by the DC test unit 170 in the component 10 loaded in the first movement buffer 600 while moving between moving the first movement buffer 600 and the sorting unit 300. The qualified component 10 is mounted on a tray or the like designated as a DC failure in the tray disposed in the sorting unit 300, and can be transferred while moving in the sorting tool moving region.

Further, the first sorting tool 560 moves to the DC test unit in addition to the first movement buffer 600 and the sorting unit 300, and can directly mount the component 10 that has been inspected as defective in the DC test unit 170. A tray that is designated as DC unqualified in the tray disposed at the sorting unit 300.

At this time, in consideration of the movement interference with the fourth transfer tool 520, the DC test portion 170 horizontally moves the component 10 inspected to be unacceptable to the lower side, and the first sorting tool 560 can be transferred to the fourth transfer. Tool 520 transfers component 10 without movement interference.

The second transfer tool 570 is loaded between the second movement buffer 700 and the sorting unit 300 in the component 10 of the second movement buffer 700, and is mounted on the component according to the classification level other than the qualified component. In the one or more trays or the like of the sorting unit 300, the element 10 can be transferred while moving in the sorting tool moving area.

As described above, if the sorting tools 560, 570 are composed of the first sorting tool 560 and the second sorting tool 570, the components can be classified more quickly.

In addition, when the component 10 is directly mounted on the tray of the sorting unit 300 by the first sorting tool 560 and the second sorting tool 570, all of the trays in the tray of the sorting unit 300 are mounted. In the case of the component of the classification level, the case where the first transfer tool 560 and the second transfer tool 570 cannot transfer the component may occur.

According to this, when the sorting unit 300 mounts all the components of the sorting level in one of the trays of the sorting unit 300, the sorting unit 300 has a buffer tray for temporary loading in the tray, or at another classification level. After the pallet is temporarily loaded with the components, the components that are mounted on the pallets of the classification class are replaced by the components that are temporarily loaded after the new pallets are exchanged.

In addition, the configuration of the transfer tool may include: one or more pickers respectively having a tip for vacuum pressing the adsorption element 10 at the end; and a picker transfer device for moving the picker in the -Z, YZ or XYZ directions; .

In particular, the transfer picker can arrange the selectors in a row, or can be arranged in a plurality of columns of 12×2 or the like.

In addition, the component processor according to the present invention may include a first movement buffer 600 and a second movement buffer 700, wherein the first movement buffer 600 and the second movement buffer 700 are to be in the slave loading unit 100 When one element 10 is mounted on the burn-in board 20 or when the second element 10 is carried out from the burn-in board 20 to the unloading unit 200, the mounting and unloading speeds are increased, and are provided between the mounting unit 100 and the burn-in board 20, and the burn-in board 20 is provided. The first element 10 and the second element 10 are temporarily mounted and transported with the unloading unit 200.

The first movement buffer 600 and the second movement buffer 700 are movably disposed in the main body 40, move the component exchange position 3 of the exchange element with the burn-in board 20, and exchange the components with the loading unit 100 or the unloading unit 200. The component exchange position 1 and the sorting position 2 of the component are exchanged with the sorting unit 300, and the exchange of the component 10 is smoothly performed without interruption, and the sorting operation speed can be remarkably improved.

The first movement buffer 600 constitutes a position to be moved: a loading position (element exchange position) 1 that is received by the second transfer tool 540 from the test unit 170 to receive the first element 10; and by the sorting tools 560, 570 The first defective component 10 is transferred to the sorting position 2 of the sorting tray 30 of the sorting unit 300; the remaining first component 10 from which the first defective component 10 is removed is mounted on the XY operation by a third transfer tool 510 to be described later. The mounting position (element exchange position) 3 of the burn-in board 20 of the stage 410.

As shown in FIG. 3, the first movement buffer 600 includes a component housing portion 610 on which the component 10 is mounted, a guide member 620 that movably supports the component housing portion 610 in the main body 40, and a guide member 620 through the guide member 620. A moving device (not shown) in which the component housing portion 610 moves.

In the component accommodating portion 610, it is preferable that the number of lateral direction of the component accommodating grooves for mounting the component 10 is larger than the number of lateral components of the component accommodating grooves for mounting the component 10 on the tray 30, and further mounting in the mounting position 3 A large number of components 10.

Here, the component accommodating portion 610 is configured to mount the component 10, and the component 10 is directly mounted, or may be different depending on the type of the component 10 to be sorted, and may further include a component housing groove. A separate housing member 610a.

As shown in Figs. 1 and 2, the first movement buffer 600 is preferably composed of three so that the processes are simultaneously performed in the respective positions (1, 2, 3). At this time, the guidance The member 620 is configured not to interfere with the other guiding members 620 when moving.

That is, as shown in FIG. 3, the configuration of the first movement buffer 600 may include: a first element housing portion 611 supported by the first guiding member 621 and horizontally moved; supported by the second guiding member 622 and horizontally moved The second component housing portion 612 is a third component housing portion 613 supported by the third guiding member 623 and horizontally moved.

The first to third guiding members 621, 622, and 623 are configured to guide the respective element housing portions 611, 612, and 613 horizontally, and may have various configurations. As shown in FIG. 4, the first guide The member 621 is disposed at an upper portion of the support member 640 of the main body 40, that is, at an upper end, the second guide member 622 is disposed at an intermediate portion of the support member 640, that is, disposed in the middle, and the third guide member 623 is disposed at the support member 640. The lower side, that is, the upper plate 42 of the lower end or body 40 is disposed. Here, the first to third guiding members 621, 622, and 623 may be configured in pairs, and the element housing portion 620 may be stably supported.

In addition, the moving device 630 that horizontally moves the first to third guiding members 621, 622, 623 may have various configurations according to the driving manner, and may include the first to third horizontally moving the first to third guiding members 621, 622, 623, respectively. One to third mobile devices 631, 632, 633. At this time, the first to third moving means 631, 632, 633 may be constituted by an engine that generates a rotational force, and a belt coupled to the first to third guiding members 621, 622, 623, in particular, may be composed of a timing belt and a pulley. .

The operation of the first mobile buffer 600 as described above will be described in detail as follows.

The first movement buffer 600 performs a loading process in the loading position 1, that is, the first component 10 is loaded from the test portion 170 to the component housing portion 610. At this time, the first component 10 loaded in the component housing portion 610 includes the first defective component 10 which is determined to be unacceptable by the testing portion 170, and therefore screening is required.

Therefore, the first movement buffer 600 moves to the sorting position 2 in order to screen out the first defective element 10 after the loading of the component 10 in the loading position 1.

If the first movement buffer 600 is located at the sorting position 2, the first sorting process is performed, that is, the first defective element 10 is transferred to the sorting unit 300 by the transfer tool in the component housing portion 610. At this time, each of the first defective components 10 is mounted on the tray 30 of the sorting unit 300 in accordance with the failure criterion.

Here, the first in the original price storage unit 610 is removed in the sorting position 2 The position of the defective element 10 is filled with a first normal element 10 (buffering process) from a first fixed buffer (not shown), wherein the first fixed buffer is preliminarily equipped with a component judged as qualified by the test result of the test portion 170 (hereinafter, referred to as "first normal element") 10.

In addition, the first fixed buffer is disposed in the main body 40 to carry the test result as the first normal component 10, and in the case of being idle initially or in operation, the first moving buffer 600 is located at the sorting position 2. The component housing portion 610 of the first movement buffer 600 can mount the first normal component 10.

When the first sorting process is completed in the first movement buffer 600, the sorting position 2 is moved to the mounting position 3. Then, the mounting process of the first normal element 10 mounted on the first movement buffer 600 by the transfer tool on the burn-in board 20 is performed.

Further, when all of the component housing portions 610 of the first movement buffer 600 are emptied, the loading process is re-executed in order to move the first component 10 to the loading position 1 in the mounting position 3.

The second movement buffer 700 has a configuration similar to that of the first movement buffer 600, and is repeatedly moved to a position at which the second element 10 is mounted by the second transfer tool 540 from the burn-in board 20 (component exchange) Position) 3; the second defective component 10 is transferred by the transfer tool to the tray 30 of the sorting unit 300 - the sorting position 2 of the sorting tray; the remaining portion of the second defective component 10 is removed by the fifth transfer tool 550 The two elements 10 are mounted on the unloading position (element exchange position) 1 of the tray 30-unloading tray.

As shown in FIG. 3, the second movement buffer 700 having the above configuration has a configuration similar to that of the first movement buffer 700, and includes an element housing portion 710 on which the component 10 is mounted, and is movably supported on the main body 40. The guiding member 720 of the component housing portion 710; the moving device 730 that horizontally moves the component housing portion 710 by the guiding member 720.

Preferably, the component accommodating portion 710 has a lateral direction of the component accommodating groove for mounting the component 10 more than the lateral direction of the component accommodating groove for mounting the component 10 of the tray 30, and is mounted more than the mounting position 3. Number of components 10.

Here, the component accommodating portion 710 is configured to mount the component 10, and the component 10 is directly mounted, or the type of the component 10 to be sorted is different depending on the type of the component 10, and thus the component accommodating groove can be formed separately. The housing member 610a is configured.

As shown in FIGS. 1 to 2, the second movement buffer 700 is preferably composed of three. Constructed to perform the process at each location (1, 2, 3). At this time, the guide member 720 is configured not to interfere with the other guide members 720 when moving.

That is, as shown in FIG. 3, the second movement buffer 700 may be configured to include: a first component housing portion 711 supported by the first guiding member 721 and horizontally moved; supported by the second guiding member 722 and horizontally moved The second component housing portion 712 is a third component housing portion 713 supported by the third guiding member 723 and horizontally moved.

The first to third guiding members 721, 722, and 723 are configured to guide the respective buffers 711, 712, and 713 horizontally, and may have various configurations. As shown in FIG. 4, the first guiding member 712 is provided. At the upper portion of the support member 740 of the main body 40, that is, at the upper end, the second guide member 722 is disposed at an intermediate portion of the support member 740 of the first guide member 721, that is, at the middle portion, and the third guide member 723 is disposed at the support member 740. The lower portion, that is, the upper plate 42 disposed at the lower end or body 40. Here, the first to third guiding members 721, 722, and 723 may constitute a pair to stably support the component housing portion 720.

In addition, the moving device 730 that horizontally moves the first to third guiding members 721, 722, 723 may have various configurations according to the driving manner, and may include the first to horizontally move the first to third guiding members 721, 722, 723, respectively. To the third mobile device 731, 732, 733. At this time, the first to third moving means 731, 732, 733 may be constituted by an engine that generates a rotational force, and a belt coupled to the first to third guiding members 721, 722, 723, in particular, may be composed of a timing belt and a pulley. .

The second movement buffer 700 having the above configuration operates in a similar manner to the first movement buffer 600, and performs a process of loading the second element 10 from the burn-in board 20 in the mounting position 3. a loading process of the component housing portion 710; a second sorting process of transferring the second defective component 10 to the sorting portion 300 at the sorting position 2; and transferring the remaining second component 10 to the unloading portion 200 in the unloading position 1 The unloading process of the tray 30.

In the mounting process, the same number of components as the number of components mounted in the first movement buffer 600 are transferred at a time, for example, one-time transfer is arranged in an element such as 12×2.

In the second sorting process, the second defective component 10 is transferred to the sorting section 300 by the transfer tool in the component housing portion 710. At this time, each of the second defective components 10 is mounted on the tray 30 of the sorting unit 300 in accordance with the failure criterion.

Here, in the sorting position 2, the position of the second defective element is removed in the component housing portion 710, and the second fixed buffer (not shown) on which the second normal component 10 is mounted in advance may be filled. Two normal components 10 - buffering process.

In addition, the second fixed buffer is disposed in the main body 40 to carry the second normal component 10 in advance, and in the case of being idle initially or in operation, the second mobile buffer 700 may be located at the sorting position 2 The second accommodating unit 10 is mounted on the component accommodating portion 710 of the second damper 700.

Fig. 5 is a conceptual diagram showing a process of exchanging a burn-in board between the X-Y stage and the burn-in board exchange buffer in the element processor of Fig. 1. Fig. 5a shows the state before the pre-burning plate is initially exchanged between the XY working table and the burn-in board exchange buffer portion, and Fig. 5b shows the state after the pre-burning plate is exchanged between the XY working table and the burn-in board exchange buffer portion. In the state, the fifth and fifth diagrams are diagrams for the process of exchanging the pre-burning plate between the XY table and the pre-burning plate exchange buffer. Fig. 6 is a conceptual diagram showing a pre-burning board exchange process between a pre-fired board exchange buffer portion and a burn-in board loader in the component processor of Fig. 1, and Fig. 6a shows a burn-in board exchange buffer portion. The state before the pre-burning plate is exchanged with the pre-burning plate loader, and FIG. 6b is the intermediate state of the rack in which the pre-burning plate is introduced into the pre-burning plate loader between the pre-burning plate exchange buffer portion and the pre-burning plate loader. Figure 6c is a state in which the pre-burning plate has been introduced into the rack of the pre-burning plate loader between the pre-burning plate exchange buffer portion and the pre-burning plate loader, and Fig. 6d is a view showing the pre-burning plate exchange buffer portion. An intermediate state between the pre-burning plate and the pre-burning plate loader from the rack of the pre-burning plate loader, and FIG. 6e is a view showing the pre-burning plate exchange buffer portion and the pre-burning plate loader. A conceptual diagram of the state of the burn-in board from the rack of the burn-in loader. Fig. 7 is a side view showing the configuration of a burn-in board loader.

Further, when the exchange of the first element 10 and the second element 10 is completed in the burn-in board 20 on the XY stage 410, the XY stage 410 and the burn-in board loader 800 exchange the new burn-in on which the second element 10 is mounted. Board 20.

However, when the pre-burning plate 20 on the XY working table 410 is exchanged, the loading of the first member 10 and the unloading of the second member 10 are terminated, so that the loader unloading of the member 10 is delayed by the equivalent of the exchange of the XY working table 410. The time to burn the board 20.

Therefore, if the exchange time of the burn-in board 20 on the XY working table 410 is shortened, the processing speed of the component processor can be improved, and the so-called UPH, according to the component processor of the present invention, alternately temporarily stores the burn-in of the first component 10 a plate 20 and a pre-burning plate 20 on which the second component 10 is mounted, Further, a burn-in board exchange buffer unit 420 that inserts the burn-in board 20 of the first element 10 inserted into the XY stage and the pre-burn board on which the plurality of burn-in boards 20 are mounted may be additionally included. The pre-burning plates 20 of the second component 10 of the loader 800 are exchanged.

The pre-burning plate exchange buffer unit 420 has a configuration in which the pre-burning plate 20 is interposed between the pre-burning plate loader 800 and the X-Y work table 410, and has various configurations depending on the design.

The burn-in board exchange buffer portion 420 may be provided in the main body 40 according to the configuration of the apparatus, in particular, on the outermost end side in the moving area of the X-Y work table 410 or inside the burn-in board 800.

Further, in order to shorten the exchange time of the burn-in board 20, the XY stage 410 and the burn-in board exchange buffer unit 420 preferably exchange the burn-in board 20 on which the first element 10 is mounted and the second element 10 on the same. Pre-burning plate 20.

In addition, in order to simultaneously exchange the pre-burning plate 20, the XY working table 410 may include a pair of pre-burning plate mounting portions 411 on which the pre-burning plates 20 are mounted up and down; and an upper side between the pair of pre-burning plate mounting portions 411. The burn-in plate lifting portion 412 of the burn-in board 20 attached to the burn-in board mounting portion 411 is moved in at least one of the lower sides.

At this time, the pre-burning plate exchange buffer portion 420 may include a pair of pre-burning plate buffer portions 421 on the upper and lower sides of the pre-burning plate 20 corresponding to the pre-burning plate mounting portion 411 of the X-Y work table 410.

The pre-burning plate buffering portion 421 may have any configuration as long as it can mount the calcining plate 20, and preferably does not interfere with the movement of the first selecting portion 441 and the second selecting portion 442 to be described later.

Further, as shown in FIGS. 5a to 5d, the transfer of the burn-in board 20 between the XY work table 410 and the burn-in board exchange buffer portion 420 is performed by the first selection portion 441 and the second selection portion 442. It is realized that the configurations and installation positions of the first selection unit 441 and the second selection unit 442 can have various configurations depending on the design.

The exchange process of the burn-in board 20 between the X-Y work table 410 and the burn-in board exchange buffer unit 420 having the above configuration can be realized in various forms according to the respective configurations, and an example thereof will be described in detail below with reference to the drawings.

As shown in FIGS. 5a and 5b, the X-Y work table 410 first receives the burn-in board 20 on which the second element 10 is mounted from the burn-in board exchange buffer unit 420. At this time, when the X-Y work table 410 and the burn-in board exchange buffer unit 420 have a configuration in which the burn-in board 20 can be disposed up and down, X-Y is used. The stage 410 may receive the burn-in board 20 from the burn-in board exchange buffer portion 420 in one of the upper side or the lower side, and in particular, receive supply in the upper side as described in FIGS. 6a and 6e.

The X-Y work table 410 that receives the burn-in board 20 on which the second element 10 is mounted is driven in the X-Y direction so that the second element 10 is unloaded through the opening 41 and the first element 10 is loaded.

In order to unload the second element 10 and load the first element 10, the pre-burning plate exchange buffer unit 420 receives the burn-in board 20 on which the second element 10 is mounted from the burn-in board loader 800 when the X-Y stage 410 moves.

Further, as shown in FIG. 5c, when the unloading of the second element 10 and the loading of the first element 10 are completed, the pre-burning plate of the first element 10 is mounted in order to receive the other pre-burning plate 20 on which the second element 10 is mounted. 20 moves to the side of the burn-in board exchange buffer unit 420.

At this time, as shown in Fig. 5c, the XY stage 410 moves toward the burn-in board exchange buffer unit 420 side, and the burn-in board 20 on the XY stage 410 exchanges the burn-in board with the burn-in board buffer unit 420. 20 is moved downward by the pre-burning plate lifting portion 412.

Further, as shown in Fig. 5d, the XY table 410 moving to the side of the burn-in board exchange buffer unit 420 receives the burn-in board 20 located on the upper side of the burn-in board exchange buffer unit 420, and is placed on the lower side of the XY stage 410. The burnt plate 20 moves to the burn-in board exchange buffer portion 421 located below the burn-in board exchange buffer portion 420.

Further, it is preferable that the pre-burning plate 20 exchange between the X-Y work table 410 and the burn-in board exchange buffer portion 420 is simultaneously performed to shorten the exchange time.

Further, as shown in FIGS. 1 and 2, the component processor according to the present invention includes a burn-in board loader 800 disposed on one side to continuously receive the burn-in board 20.

The burn-in board loader 800 is configured to load the burn-in board 20 inserted into the first component 10 in order to load the burn-in board 20 of the second component 10, and to transfer it to the burn-in test configuration, that is, for continuous use and The configuration in which the XY workbench 410 exchanges the burn-in board 20 can have various configurations.

When the first element 10 is mounted on all of the burn-in plates 20 of the rack 50, the rack 50 on which the first element 10 is mounted and the other rack 50 on which the second element 10 to be unloaded are mounted are completed. replace.

However, the X-Y work table 410 or the like should stand by until the rack 50 replacement is completed in the burn-in board loader 800 until the new burn-in board 20 is received, so there is a problem that the processing speed of the element processor is lowered.

Accordingly, as shown in FIG. 7, the burn-in board loader 800 of the component processor according to the present invention may include, in order not to affect the loading and unloading of the component 10 on the burn-in board 20 and to exchange the rack 50, In the Y-axis direction of the XY table 410, the rack 50 on which the plurality of burn-in plates 20 are mounted is mounted on the pair of rack mounting portions 810 at the plurality of ends, and is disposed between the pair of rack mounting portions 810 and from the teeth. The strip mounting portion 810 carries out the elevating portion 820 in which the rack 50 moves the rack 50 up and down.

The rack mounting portion 810 may have any configuration as long as it can mount the rack 50.

In particular, the rack mounting portion 810 is preferably formed in a pair, and is provided on both sides of the lifting portion 820 around the lifting portion 820.

When the XY working table 410 and the burn-in board exchange buffer unit 420 are carried out from the rack mounting portion 810 and the rack 50 is moved up and down, the lift unit 820 is exchanged with the burn-in board exchange buffer unit 420. Burn the board 20.

Further, the burn-in board loader 800 includes a pair of rack carry-out portions 830, and the racks 50 respectively mounted on the rack mounting portion 810 are carried out corresponding to the pair of rack mounting portions 810.

The rack carrying-out unit 830 is configured to carry the rack 50 from the rack mounting portion 810 to the support portion 821 of the lifting portion 820 or reversely mount the rack 50 from the lifting portion 820 to the rack mounting portion 810.

The exchange process of the burn-in board 20 between the burn-in board exchange buffer unit 420 and the burn-in board loader 800 configured as described above can be realized in various forms according to the respective configurations, and an example thereof will be described in detail below with reference to the drawings.

As shown in FIGS. 6c and 6d, the burn-in board buffer unit 420 is first received from the burn-in board loader 800 to receive the burn-in board 20 on which the second element 10 is mounted. In this case, when the XY workbench 410 and the burn-in board exchange buffer unit 420 are configured such that the burn-in board 20 can be disposed above and below, the burn-in board exchange buffer unit 420 is loaded from the burn-in board in one of the upper side or the lower side. The receiver 800 receives the pre-burning plate 20, in particular, in consideration of the pre-burning plate exchange between the XY working table 410 and the pre-burning plate exchange buffer portion 420, preferably receiving the supply on the upper side.

In other words, the burn-in board 20 on which the second element 10 is mounted is carried out from the burn-in board loader 800, passes through the burn-in board buffer unit 421 located on the upper side of the burn-in board exchange buffer unit 420, and is conveyed to the upper side of the XY work table 410. The burn-in board mounting portion 411 and the burn-in board 20 on which the first element 10 is mounted are discharged to the burn-in board loader 800 through the burn-in board mounting portion 411 located on the lower side of the XY table 410.

Further, the burn-in board exchange buffer portion 420 exchanges the burn-in board 20 with the pre-burning board loader 800 after the completion of the exchange of the burn-in board with the X-Y work table 410, and the process shown in Figs. 6a and 6b.

The pre-burning plate exchange buffer portion 420 is a pre-burning plate 20 received from the XY working table 410, in particular, a pre-burning plate attached to the pre-burning plate buffer portion 421 located at the lower side is introduced into the pre-burning plate loader 800. The empty position of the rack 50. Here, in order to enable the introduction or removal of the pre-burning plate 20, the rack 50 is lifted and lowered by the lifting portion 820, and in order to smoothly exchange the pre-burning plate 20, it is preferably one of the uppermost side or the lowermost side. The pre-burning plate 20 is not filled on the side.

The burn-in board exchange buffer unit 420 carries out the new burn-in board 20 on which the second element 10 is mounted from the rack 50. Here, the burn-in board 20 is carried out from the rack 50, and is attached to the burn-in board exchange buffer portion 420, in particular, the burn-in board buffer portion 421 located on the upper side.

As shown in FIGS. 6a to 6d, the exchange process of the burn-in board 20 between the burn-in board exchange buffer portion 420 and the burn-in board loader 800 as described above is that the burn-in board 20 is exchanged by the burn-in board. One or more auxiliary pickers 443, 444 between the buffer portion 420 and the burn-in board loader 800 are transferred to implement the above process.

At this time, the auxiliary selectors 443, 444 are configured to move the interval between the burn-in board exchange buffer portion 420 and the burn-in board loader 800 at a plurality of auxiliary movements corresponding to the respective auxiliary pickers 443, 444. The pre-burning plate 20 is transferred in the space.

Fig. 8a is a side cross-sectional view showing a burn-in board exchange buffer unit and a burn-in board loader having a configuration deformed in the element processor of Fig. 1. Figure 8b is a side view showing the burn-in board loader of Figure 8a.

Further, as shown in FIGS. 8a and 8b, the component processor according to the present invention has the pre-burning plate loader 800 not provided with a lifting portion for moving the rack 50 up and down, but only the teeth are mounted only. The rack mounting portion 810 of the strip 50 is configured to move the calcining plate exchange buffer portion 420 up, down, left, and right in order to carry out the calcining plate 20 from the rack 50 mounted on each of the rack mounting portions 810.

That is, as shown in Fig. 8b, the burn-in board loader 800 shown may be constituted by a rack mounting portion 810 on which a plurality of racks 50 can be mounted, and in the present embodiment, nine racks 50 can be mounted.

Further, as shown in FIGS. 8a and 8b, the component processor according to the present invention may additionally include an exchange buffer drive section 430 for vertical and horizontal movement of the pre-burning board exchange buffer section 420.

The exchange buffer drive unit 430 carries out the pre-burning plate 20 from the rack 50 mounted on each of the rack mounting portions 810, and drives the pre-burning plate exchange buffer unit 420 to move vertically and horizontally, that is, vertically and horizontally. It has various compositions.

An example of the exchange buffer drive unit 430 may include: a first drive unit 432 that drives the burn-in board exchange buffer unit 420 to move up and down with reference to the upper and lower sides of the rack 50 mounted on the burn-in board loader 800; The burn-in loader 800 arranges the horizontal direction of the rack 50 as the second drive unit 431 that drives the pre-burning plate exchange buffer unit 420 to move horizontally.

As shown in FIGS. 8a and 8b, the first driving unit 432 and the second driving unit 431 support the pre-burning plate exchange buffer unit 420, and are constituted by a screw jack or a linear type mobile device to make a burn-in. The board exchange buffer unit 420 moves in the up and down direction and the horizontal direction.

According to the above configuration, the component processor according to the present invention moves the pre-burning plate exchange buffer unit 420 up and down and left and right in a state in which the rack 50 is fixed, and carries out the pre-burning plate 20, thereby shortening the time for carrying out the pre-burning plate 20. Can significantly improve the processing speed of the component processor.

Further, since the burn-in board exchange buffer unit 420 is configured to move up, down, left, and right, and the configuration of the burn-in board loader 800 does not need to be provided with a lift unit, the configuration of the burn-in board loader 800 can be simplified and increased. Since the number of racks 50 mounted on the pre-burning plate loader 800 is increased, the exchange cycle of the rack 50 is lengthened, and work efficiency can be improved.

In addition, the burn-in board exchange buffer unit 420 and the exchange buffer drive unit 430 may be combined with the burn-in board loader 800 to form a burn-in board loading module.

Further, the component processor having the above-described configuration differs in the type of the component to be sorted, that is, the specification. In this case, in the case of the loading unit 100 and the unloading unit 200, if the loading corresponds to the In the specification tray 30, the components corresponding to the component specifications in the device such as the DC test unit 170, the socket presser 45 on the burn-in board, and the buffer unit 600 and 700 are manually exchanged by the user, so that the exchange operation is cumbersome. The problem.

As shown in FIGS. 1 and 9, the component processor according to the present invention may additionally include a kit exchange unit 900, and at least automatically exchange DC test according to the specifications of the component when the specifications of the components to be sorted are different. The portion 170, the socket presser 45 on the XY table 410, and a part of the buffer portions 600, 700.

The kit exchange unit 900 is configured to automatically exchange at least the DC test unit 170 and the X-Y work table 410 according to the specifications when the specifications of the components to be sorted are different. The socket pressurizer 45 and a part of the buffer portions 600, 700 are provided, and may have various configurations.

Here, the exchange kit as an exchange item may be the DC test unit 170, the socket presser 45 on the X-Y work table 410, the buffer units 600, 700, and the like.

Here, in the case of the buffer portions 600 and 700, the exchange kit may be the component housing portions 610 and 710 constituting a part of the buffer portion, the first fixed buffer, the second fixed buffer, or the like, as compared with the entire buffer portion.

As shown in FIG. 10, the kit exchange unit 900 may include, as a specific example thereof, a main body portion 901 provided with a buffer space 920 capable of temporarily storing an exchange kit to be exchanged; and an exchange kit disposed at the main body 40 is brought in. The exchange unit 930 is stored in the buffer space 920 and exchanges a new exchange kit.

The main body portion 901 may have any configuration as long as it has one or more new exchange kits to be exchanged and includes a free space in which the exchange kit provided in the main body 40 is carried out and mounted.

Further, it is preferable that the main body portion 901 is movably disposed up and down in order to facilitate exchange of the exchange kit.

The exchange unit 930 has a configuration in which the exchange kit provided in the main body 40 is carried out and temporarily stored in the buffer space 920, and a new exchange kit is exchanged. The exchange unit 930 has various configurations depending on the type, configuration, and exchange method of the exchange kit.

At this time, in order to facilitate the exchange of the exchange kit, it is preferable to provide one or more guide rails 902 for guiding the linear movement of the exchange kit in the main body 40.

In addition, in the case of the DC test unit 170 in the exchange kit, an electrical connection is required, but as shown in FIGS. 10 and 11 , an electrical connection portion 171 may be provided in the main body 40, and the electrical connection portion 171 is a DC test portion 170. The moving direction is inserted and electrically connected to the DC test portion 170.

The electrical connection portion 171 is configured to be electrically connected to the DC test unit 170 in order to enable DC test by the DC test unit 170, and may be constituted by one or more terminal members.

Further, in the exchange kit, the buffer units 600 and 700 may have various configurations depending on the configuration and position of the buffer units 600 and 700.

The buffer portions 600 and 700 are configured as temporary storage elements, and are disposed in the main body 40 in various numbers and in a movable or fixed state at various positions.

As an example, as shown in FIGS. 1 and 9, the buffer portions 600 and 700 are provided. A first movement buffer 600, a second movement buffer 700, and more than one fixed buffer may be included.

At this time, the exchange kit may be the component housing portion 610 of the first movement buffer 600, the component housing portion 710 of the second movement buffer 700, and one or more fixed buffers.

Further, as shown in FIG. 1, the component housing of the first movement buffer 600 is realized along the linear movement direction of the component housing portion 610 of the first movement buffer 600 and the component housing portion 710 of the second movement buffer 700. The exchange of the component storage unit 710 of the second movement buffer 700 and the exchange of one or more fixed buffers (but also the case where the exchange buffer is not provided) may be performed in the first movement buffer 600 and the second movement buffer. It is implemented in at least one of the ends of the device 700.

Further, as shown in FIG. 2, the component housing portion 610 of the first movement buffer 600, the component housing portion 710 of the second movement buffer 700, and one or more fixed buffers (however, the exchange buffer may not be provided) The exchange is performed at least along the linear movement direction of one of the component housing portion 610 of the first movement buffer 600 and the component housing portion 710 of the second movement buffer 700, and passes through a fixed buffer (providing a fixed buffer In this case, it is discharged to the linear movement direction of the remaining one of the component housing portion 610 of the first movement buffer 600 and the component housing portion 710 of the second movement buffer 700.

In addition, the condition exchange unit 900 is preferably movably disposed adjacent to the main body 40 at a position facing the sorting unit 300 with reference to the arrangement direction of the loading unit 100 and the unloading unit 200.

As described above, the kit exchange unit 900 is more easily exchanged in the case where the position of the loading unit 100 and the unloading unit 200 is adjacent to the main body 40 and is movably disposed in a position facing the sorting unit 300. The exchange of the kits makes it easier for the operator to exchange, and the device can be compactly constructed.

Further, in the case of various types of components, it is preferable to provide a plurality of exchange kits to be exchanged, and the exchange kit mounting portion 910 on which the plurality of exchange kits to be exchanged are mounted is separated from the main body portion 901 and separated in a separated state. It is additionally installed in the component separation device.

Preferably, the exchange kit mounting unit 910 is provided with a plurality of exchange packages to be exchanged, and the exchange package mounting unit 910 and the main body on which a plurality of exchange packages to be exchanged are mounted for exchange. The portion 901 is separately detachably attached to the component separating device in a separated state, thereby simplifying the kit switching portion 900 while maximizing the space use efficiency of the device.

In other words, the kit exchange unit 900 and the exchange kit mounting unit 910 move to the component processor to exchange the exchange kit only when the exchange kit needs to be exchanged, thereby simplifying the overall configuration and maximizing the space use efficiency of the apparatus.

Further, the present invention can variously modify the component processor shown in Fig. 1.

As an example, as shown in Fig. 12, the component processor according to the first modification of the present invention may include an empty tray supply portion 80 which is disposed in parallel on the loading unit 100 side in the configuration shown in Fig. 1. The plurality of empty trays 30 to be mounted on the pre-burning plate 20 are loaded.

Here, the DC test section 170 is not included as shown in FIG. 12, or may be included as shown in FIG.

The component processor according to the first modification of the present invention can perform only the function of mounting the component 10 on the burn-in board 20 or the function of loading the component 10 from the burn-in board 20 to be mounted on the tray 30.

In order to perform such a function, the loading unit 10 and the unloading unit 200 are configured such that all of the trays 30 in which the components 10 are mounted are mounted, or the empty trays 30 are loaded for mounting the components 10 .

Further, in the case where the component processor according to the first modification of the present invention performs only the function of loading the component 10 from the burn-in board 20 and mounting it on the tray 30, it can be classified into the sorting unit 300 based on the inspection result.

Further, the component processor according to the first modification of the present invention preferably performs only component loading or component unloading on the test socket, which is based on the component loader or the unloading, using the socket pressurizer combining the adapter components of different specifications. .

If a socket pressurizer that incorporates adapter components of different specifications is used according to component loading or unloading, the component is precisely mounted on the test socket using the adapter component with the smallest component error when the component is loaded, and the component and the component are fully assembled when the component is unloaded. The error does not hinder the uninstallation.

Here, the socket pressurizer has a configuration in which a test socket provided on a burn-in board or the like is mounted to be able to mount or carry out components, and various configurations are possible depending on the configuration of the test socket.

Additionally, the socket pressurizer is provided with an adapter member that is guided to position the component in the exact position of the test socket even if the component is in contact with the terminal for the component The position of the terminal (spring pin, etc.) that is connected.

The adapter member has a configuration in which the component is mounted at an accurate position on the test socket, and has a configuration such as a beveled surface when viewed from the upper side.

As another example, as shown in FIG. 14, FIG. 15a, and FIG. 15b, the component processor according to the second modification of the present invention is characterized in that the component processor shown in FIG. 1 has a load. The socket pressurizing unit 92 and the socket pressurizing unit 90 of the unloading socket presser 91 are used.

Here, the DC test unit 170 has an optional configuration and can be set as needed.

The socket pressurizing unit 90 includes a loading socket presser 92 and an unloading socket presser 91, and pressurizes a test socket (not shown) to assist in loading or unloading the component when the component is loaded or unloaded. There may be various configurations depending on the socket structure.

The loading socket presser 92 is configured to position the component at the exact position of the test socket disposed on the burn-in board 20 when the component is loaded, and an adapter component is disposed on the inner side to accurately mount the component on the test socket after landing. .

In particular, the adapter member is formed with an opening 92a that is approximately equivalent to the size of the component plane so that the component is accurately mounted on the test socket after landing.

The unloading socket presser 91 is a configuration for mounting the component at an accurate position of the test socket provided on the burn-in board 20 when the component is unloaded.

The unloading socket presser 91 is opened up and down to carry out the component, and the size of the opening 91a is preferably larger than the loading receptacle presser 92 described above so as not to impede the unloading of the component.

For reference, when the socket pressurizer has a single configuration, in order to accurately mount the component in an accurate position, if the opening of the socket pressurizer adapter member is small, there is a problem that the unloading of the component is hindered at the time of unloading.

However, if the socket pressurizing unit 90 has the loading socket presser 92 and the unloading socket presser 91, the component can be mounted at a more accurate position when the component is mounted, and can be smoothly executed when the component is unloaded. The components are loaded and unloaded so as not to interfere with unloading.

Further, as shown in Fig. 14, it is preferable that the loading socket presser 92 and the unloading socket presser 91 are arranged in the arrangement direction of the loading unit 100 and the unloading unit 200, that is, Y perpendicular to the X-axis direction. Axis direction configuration.

At this time, as shown in FIG. 14, FIG. 15a and FIG. 15b, it is preferable that the first transfer tool 530 is disposed at a distance in the Y direction corresponding to the loading socket presser 92 and the unloading pressurizer 91. And a second transfer tool 540.

Further, the component processor according to the second modification of the present invention may include an empty tray supply portion 80 which is disposed in parallel with one side of the loading portion 100 in a similar manner to the configuration of the component processor according to the second modification. A plurality of empty trays 30 to be mounted on the pre-burning plate 20 are loaded.

The above is only a part of a preferred embodiment that can be implemented by the present invention, and the scope of the present invention is not limited by the above embodiments. The technical idea of the present invention described above and its fundamental technical idea should be all included in The scope of the invention.

10‧‧‧ components

20‧‧‧ burned board

30‧‧‧Tray

40‧‧‧ body of component processor

41‧‧‧ openings

42‧‧‧Upper board

45‧‧‧Socket pressurizer

110‧‧‧X-Y workbench

150‧‧‧Tray Rotating Department

170‧‧‧Test Department

200‧‧‧Unloading Department

210‧‧‧Loading Department

300‧‧‧Sorting Department

410‧‧‧X-Y workbench

510, 520, 530, 540, 550, 560, 570‧‧‧ transfer tools

600‧‧‧First mobile buffer

610‧‧‧Component housing department

700‧‧‧Second mobile buffer

710‧‧‧Component housing department

800‧‧‧ burn-in board loader

810‧‧‧Rack Mounting Department

820‧‧‧ Lifting Department

900‧‧‧Package Exchange Department

910‧‧‧Exchange Kit Mounting Department

Claims (13)

An element processor includes: a loading unit that loads a tray on which components to be subjected to a burn-in test are loaded; and an XY operation table that moves the burn-in board in an XY direction, wherein the burn-in board is equipped with components that are tested in the burn-in test The unloading unit performs the burning machine test on the empty position; the unloading unit mounts the qualified component on the tray in the mounted burn-in test component; and the DC test unit mounts the burnt plate on the burnt plate. Before the component of the machine test, the component to be subjected to the burn-in test is received from the loading portion, and the DC characteristic is tested in advance; the first moving buffer is temporarily mounted by the DC test portion before being mounted on the burn-in board a component for performing a DC characteristic test; a second movement buffer temporarily carrying an element that has been completed from the XY workbench and having completed the burn-in test; and a kit exchange unit that is configured according to a specification of the component to be subjected to the burn-in test At least one of the DC test unit, the socket pressurizer on the XY workbench, the first movement buffer, and the second movement buffer is automatically exchanged as an exchange kit. The component processor according to claim 1, further comprising: a sorting unit that classifies the component that is determined to be unqualified by the DC characteristic test result of the DC test unit and the test result of the burn test result It is an unqualified component. The component processor according to claim 1, wherein the kit exchange portion includes: a main body portion provided with a buffer space capable of temporarily storing an exchange kit to be exchanged; and an exchange portion that is carried out at the component A switching suite of the body of the processor is temporarily stored in the buffer space and a new switching suite is exchanged for the body of the component processor. The component processor according to claim 1, wherein when the exchange kit is the DC test portion, the DC test portion is inserted into a moving direction thereof, and can be used for testing with the DC An electrical connection portion electrically connected to the portion is provided in a main body of the component processor. The component processor according to claim 1, further comprising: a third transfer tool, transferring the component between the loading portion and the DC test portion; a fourth transfer tool that transfers an element between the DC test portion and the first movement buffer; a fifth transfer tool that transfers an element between the second movement buffer and the unloading portion; and one or more a sorting tool that transfers an element between the first movement buffer and the second movement buffer and the sorting unit. The component processor of claim 5, wherein the one or more sorting tools comprise: a first sorting tool, transferring components between the first moving buffer and the sorting section And a second sorting tool that transfers the component between the second movement buffer and the sorting section. The component processor according to claim 1, wherein the exchange kit is provided in an element housing portion of the first movement buffer, a component housing portion of the second movement buffer, and One or more fixed buffers of the main body of the component processor, the component housing portion of the first movement buffer, the component housing portion of the second movement buffer, and the fixed buffer have the same structure, respectively Performing the component storage portion of the first movement buffer and the component storage portion of the second movement buffer in the linear movement direction of the first movement buffer to perform the element storage portion and the second movement buffer of the first movement buffer The exchange of the component storage unit, the exchange of the fixed buffer is performed in at least one of the ends of the first movement buffer and the second movement buffer. The component processor according to claim 1, wherein the exchange kit is provided in an element housing portion of the first movement buffer, a component housing portion of the second movement buffer, and One or more fixed buffers of the main body of the component processor, the component housing portion of the first movement buffer, the component housing portion of the second movement buffer, and the fixed buffer have the same structure, The component storage portion of the first movement buffer, the component storage portion of the second movement buffer, and the fixed buffer are exchanged along the component housing portion and the second portion of the first movement buffer, respectively a linear movement direction of one of the component accommodating portions of the movement damper is introduced, and the remaining one of the component accommodating portion of the first movement damper and the component accommodating portion of the second movement damper passes through the fixed damper The line type moves in the direction of discharge. The component processor according to the first aspect of the invention, further comprising: a socket pressurizing portion provided on an upper side of the XY working table, and pressurized in order to carry out or mount an element in the burn-in board a test socket of the burn-in board, the socket pressurizing portion comprising: a load socket presser, a loading opening formed to guide an element to be subjected to a burn-in test at the test socket; and an unloading With the socket presser, an unloading opening for guiding the component that has completed the burn-in test in the test socket is formed. The component processor according to claim 9, wherein the unloading opening has a size larger than the loading opening so as not to hinder the carrying out of the component in the test socket. The component processor according to claim 9, wherein the loading socket pressurizer and the unloading socket pressurizer are disposed along an arrangement direction of the loading portion and the unloading portion. The component processor according to claim 11, wherein the first transfer tool and the second transfer tool are corresponding to the loading socket pressurizer and the unloading socket pressurizer, The arrangement direction of the loading unit and the unloading unit, that is, the Y-axis direction, is spaced apart. The component processor according to any one of claims 1 to 12, further comprising: an empty tray supply portion disposed in parallel on one side of the loading portion and configured to be loaded on the loading Multiple empty trays for pre-burning plates.