TWI534304B - 銅電解電鍍浴及銅電解電鍍法 - Google Patents

銅電解電鍍浴及銅電解電鍍法 Download PDF

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Publication number
TWI534304B
TWI534304B TW099134584A TW99134584A TWI534304B TW I534304 B TWI534304 B TW I534304B TW 099134584 A TW099134584 A TW 099134584A TW 99134584 A TW99134584 A TW 99134584A TW I534304 B TWI534304 B TW I534304B
Authority
TW
Taiwan
Prior art keywords
copper
plating
electrolytic plating
copper electrolytic
plating bath
Prior art date
Application number
TW099134584A
Other languages
English (en)
Chinese (zh)
Other versions
TW201131023A (en
Inventor
礒野敏久
立花真司
大村直之
星俊作
Original Assignee
上村工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上村工業股份有限公司 filed Critical 上村工業股份有限公司
Publication of TW201131023A publication Critical patent/TW201131023A/zh
Application granted granted Critical
Publication of TWI534304B publication Critical patent/TWI534304B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW099134584A 2009-10-15 2010-10-11 銅電解電鍍浴及銅電解電鍍法 TWI534304B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009238460A JP5471276B2 (ja) 2009-10-15 2009-10-15 電気銅めっき浴及び電気銅めっき方法

Publications (2)

Publication Number Publication Date
TW201131023A TW201131023A (en) 2011-09-16
TWI534304B true TWI534304B (zh) 2016-05-21

Family

ID=43878464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099134584A TWI534304B (zh) 2009-10-15 2010-10-11 銅電解電鍍浴及銅電解電鍍法

Country Status (5)

Country Link
US (1) US20110089044A1 (ja)
JP (1) JP5471276B2 (ja)
KR (3) KR20110041417A (ja)
CN (1) CN102071443B (ja)
TW (1) TWI534304B (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
KR102301625B1 (ko) * 2014-04-25 2021-09-10 가부시끼가이샤 제이씨유 동의 고속 충전 방법
US10154598B2 (en) * 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
JP2016132822A (ja) * 2015-01-22 2016-07-25 富士電機株式会社 電気銅メッキ浴及び電気銅メッキ装置、並びに電気銅メッキ方法
US10100421B2 (en) 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
US10006136B2 (en) 2015-08-06 2018-06-26 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US9932684B2 (en) 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
TWI608132B (zh) 2015-08-06 2017-12-11 羅門哈斯電子材料有限公司 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法
US10190228B2 (en) * 2016-03-29 2019-01-29 Rohm And Haas Electronic Materials Llc Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
CN105887144B (zh) * 2016-06-21 2018-09-21 广东光华科技股份有限公司 电镀铜镀液及其电镀铜工艺
TWI754729B (zh) 2017-04-20 2022-02-11 日商上村工業股份有限公司 電鍍銅浴及電鍍銅皮膜
CN111247633A (zh) * 2017-10-19 2020-06-05 朗姆研究公司 单一金属的多浴电镀
CN109778260A (zh) * 2017-11-10 2019-05-21 丹阳市金地生态园林发展有限公司 一种含环氧氯丙烷的金属合金抗氧化电镀液
CN108950614B (zh) * 2018-06-15 2021-11-26 惠州市荣安达化工有限公司 一种vcp高效镀铜光亮剂
CN110042444B (zh) * 2019-05-10 2022-03-08 九江德福科技股份有限公司 一种提高铜箔表面均匀性的添加剂配方
CN114980569A (zh) * 2021-02-20 2022-08-30 嘉联益电子(昆山)有限公司 具导通孔的电路板线路结构的制作方法及所制成的具导通孔的电路板线路结构
CN114134544A (zh) * 2021-12-31 2022-03-04 三门峡毕昇制版科技股份有限公司 一种电子雕刻印刷凹版碱性镀铜添加剂
CN115233263B (zh) * 2022-06-29 2024-04-05 南通赛可特电子有限公司 一种整平剂、制备方法及应用

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DE3538147A1 (de) * 1985-10-26 1987-04-30 Lpw Chemie Gmbh Zinkbad fuer die abscheidung von glaenzenden zinkschichten und verfahren zur abscheidung solcher zinkschichten
JP2000297395A (ja) * 1999-04-15 2000-10-24 Japan Energy Corp 電気銅めっき液
CN1205360C (zh) * 1999-06-17 2005-06-08 德古萨电解技术有限公司 用于电沉积有光泽的金和金合金镀层的酸性浴液及其所用的光泽剂
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
KR100877923B1 (ko) * 2001-06-07 2009-01-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 전해 구리 도금법
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
DE10163892A1 (de) * 2001-12-27 2003-07-17 Basf Ag Derivate von Polymeren für die Metallbehandlung
CN1497069A (zh) * 2002-06-03 2004-05-19 希普雷公司 匀平剂化合物
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
DE10325101A1 (de) * 2003-06-03 2004-12-30 Atotech Deutschland Gmbh Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)
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EP1741804B1 (en) * 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method

Also Published As

Publication number Publication date
KR20110041417A (ko) 2011-04-21
JP2011084779A (ja) 2011-04-28
TW201131023A (en) 2011-09-16
US20110089044A1 (en) 2011-04-21
KR102215340B1 (ko) 2021-02-15
CN102071443B (zh) 2016-03-02
JP5471276B2 (ja) 2014-04-16
KR20170035353A (ko) 2017-03-30
KR20190120132A (ko) 2019-10-23
CN102071443A (zh) 2011-05-25

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