TWI476661B - Sensor structure of touch panel and fabrication method thereof - Google Patents

Sensor structure of touch panel and fabrication method thereof Download PDF

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TWI476661B
TWI476661B TW102110078A TW102110078A TWI476661B TW I476661 B TWI476661 B TW I476661B TW 102110078 A TW102110078 A TW 102110078A TW 102110078 A TW102110078 A TW 102110078A TW I476661 B TWI476661 B TW I476661B
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sensing
conductive material
series
embossed
disposed
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TW102110078A
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TW201437857A (en
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Tak Hon Lee
Wen Rei Guo
Yung Tse Cheng
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Au Optronics Corp
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觸控面板之感測元件結構及其製作方法Sensing element structure of touch panel and manufacturing method thereof

本發明係關於一種觸控面板之感測元件結構及其製作方法,尤指利用浮凸(embossment)結構與具透明特性之導電材料當作感測單元的一種觸控面板之感測元件結構及其製作方法。The present invention relates to a sensing element structure of a touch panel and a manufacturing method thereof, and more particularly to a sensing element structure of a touch panel using an embossment structure and a conductive material having transparent characteristics as a sensing unit. Its production method.

在現今各類型消費性電子產品中,平板電腦、行動電話(mobile phone)與影音播放器等可攜式電子產品已廣泛地使用觸控面板(touch panel)取代傳統的鍵盤,作為人機資料溝通介面,以節省電子產品的體積。In today's various types of consumer electronics, portable electronic products such as tablet computers, mobile phones and video players have widely used touch panels instead of traditional keyboards to communicate as human-machine data. Interface to save the size of electronic products.

習知觸控面板主要係利用透明金屬氧化物材料來製作感測元件,其中,目前最普遍使用的為氧化銦錫等材料。然而,透明金屬氧化物材料的穿透率(transmittance)、面阻值(sheet resistance)及色偏(hue)問題皆受到其膜層厚度的影響,例如,若為了降低面阻值而增加膜層厚度,那麼便會使氧化銦錫的穿透率降低,因此在使用傳統透明金屬氧化物材料當作感測元件的情況下,很難兼顧觸控面板的透明度與電性表現。此外,氧化銦錫為脆性材料,若將其應用在軟性觸控面板中,則會容易發生脆裂(crack)而導致觸控失靈。因此,習知利用透明金屬氧化物材料製作感測元件的作法仍有待進一步的改善。Conventional touch panels mainly use transparent metal oxide materials to fabricate sensing elements. Among them, materials such as indium tin oxide are most commonly used at present. However, the transmittance, sheet resistance, and hue problem of transparent metal oxide materials are affected by the thickness of the film layer, for example, if the film layer is increased in order to lower the surface resistance value. The thickness, then the penetration rate of indium tin oxide is lowered, so in the case of using a conventional transparent metal oxide material as a sensing element, it is difficult to balance the transparency and electrical performance of the touch panel. In addition, indium tin oxide is a brittle material, and if it is applied to a soft touch panel, cracking easily occurs and the touch failure occurs. Therefore, it is conventional to further improve the fabrication of sensing elements using transparent metal oxide materials.

本發明之目的之一在於提供一種利用浮凸結構與具透明特性之導 電材料製作的感測元件結構,使其應用在觸控面板中能有效改善上述習知因感測元件材料而影響觸控面板透明度與電性表現之問題。One of the objects of the present invention is to provide a embossed structure and a guide with transparent properties. The sensing element structure made of the electric material can effectively improve the above-mentioned problems of the transparency and electrical performance of the touch panel due to the sensing material of the sensing element.

為達上述目的,本發明提供一種觸控面板之感測元件結構,該感測元件結構包括複數條第一感測串列,分別沿著第一方向設置於第一基板之第一表面。各第一感測串列包括複數個第一感測單元與複數個第一溝槽,其中該等第一感測單元係沿著第一方向相鄰並排,而各第一感測單元分別包括第一浮凸結構與一種第一導電材料,第一導電材料係容置於第一浮凸結構之容置空間之中。各第一溝槽分別設置於同一第一感測串列之任二相鄰之第一感測單元之間,以使任二相鄰之第一浮凸結構的容置空間藉由各第一溝槽而相通。並且,第一導電材料更設置於第一溝槽中,以使相同的第一感測串列的第一感測單元互相電性連接。To achieve the above objective, the present invention provides a sensing element structure of a touch panel. The sensing element structure includes a plurality of first sensing series disposed on a first surface of the first substrate along a first direction. Each of the first sensing series includes a plurality of first sensing units and a plurality of first trenches, wherein the first sensing units are adjacent to each other along the first direction, and each of the first sensing units respectively includes The first embossed structure and a first conductive material are disposed in the accommodating space of the first embossed structure. Each of the first trenches is disposed between any two adjacent first sensing units of the same first sensing series, so that the accommodating spaces of any two adjacent first embossed structures are respectively provided by the first The grooves are connected. Moreover, the first conductive material is further disposed in the first trench to electrically connect the first sensing units of the same first sensing series to each other.

為達上述目的,本發明另提供一種觸控面板之感測元件結構之製作方法,包括提供第一基板,其具有相對設置一第一表面,接著於第一表面形成複數個第一浮凸結構與複數個第一溝槽,其中第一浮凸結構呈陣列排列且具有一容置空間,而各第一溝槽係設置於沿著第一方向相鄰排列之第一浮凸結構之間,以連通該等第一浮凸結構。然後於第一浮凸結構之容置空間與第一溝槽中填入第一導電材料。再於第一浮凸結構表面形成密封層,以將第一導電材料密封於容置空間與第一溝槽中。In order to achieve the above object, the present invention further provides a method for fabricating a sensing element structure of a touch panel, comprising providing a first substrate having a first surface disposed oppositely, and then forming a plurality of first embossed structures on the first surface And a plurality of first trenches, wherein the first embossed structures are arranged in an array and have an accommodating space, and each of the first trenches is disposed between the first embossed structures arranged adjacently along the first direction, To connect the first embossed structures. Then, the first conductive material is filled in the accommodating space of the first embossed structure and the first trench. Forming a sealing layer on the surface of the first embossed structure to seal the first conductive material in the accommodating space and the first trench.

由於本發明利用浮凸結構與導電材料製作觸控面板的感測元件結構,因此可以同時兼顧透明度與電性表現,且浮凸結構與導電材料皆能適應彎曲或軟性的環境,因此本發明的感測元件結構可以應用於軟性觸控面板中,能大幅改善傳統金屬氧化物材料因脆性特性而導致感測元件脆裂之問題。Since the present invention utilizes the embossed structure and the conductive material to fabricate the sensing element structure of the touch panel, the transparency and electrical performance can be simultaneously considered, and the embossed structure and the conductive material can adapt to the curved or soft environment, and thus the present invention The sensing element structure can be applied to a soft touch panel, which can greatly improve the problem that the conventional metal oxide material is brittle due to brittle characteristics.

100‧‧‧感測元件結構基本單元100‧‧‧Sensor component structure basic unit

110‧‧‧感測元件結構110‧‧‧Sensor component structure

112、112’、112”、112”’‧‧‧第一基板112, 112', 112", 112" '‧‧‧ first substrate

112a、112a’、112a”、112a”’‧‧‧第一基板之第一表面112a, 112a', 112a", 112a" '‧‧‧ first surface of the first substrate

112b、112b’‧‧‧第一基板之第二表面112b, 112b'‧‧‧ second surface of the first substrate

114‧‧‧第一感測單元114‧‧‧First sensing unit

116‧‧‧第一浮凸結構116‧‧‧First embossed structure

116a‧‧‧容置空間116a‧‧‧ accommodating space

118‧‧‧第一導電材料118‧‧‧First conductive material

120‧‧‧浮凸材料層120‧‧‧ embossed material layer

120a‧‧‧凸起部分120a‧‧‧ raised part

120b‧‧‧平坦部分120b‧‧‧flat part

122‧‧‧第一溝槽122‧‧‧First trench

124‧‧‧第一密封層124‧‧‧First sealing layer

126‧‧‧凹穴126‧‧‧ recess

128、128a、128b、128c‧‧‧第一感測串列128, 128a, 128b, 128c‧‧‧ first sensing series

130‧‧‧第一導線結構130‧‧‧First wire structure

130a‧‧‧寬導線部分130a‧‧ Wide wire section

130b‧‧‧細導線部分130b‧‧‧fine wire section

132‧‧‧軋紋滾軸132‧‧‧Rolling Roller

136‧‧‧黏著層136‧‧‧Adhesive layer

138‧‧‧保護層138‧‧‧protection layer

140、218‧‧‧第二導電材料140, 218‧‧‧Second conductive material

142‧‧‧信號感測區142‧‧‧Signal Sensing Area

144‧‧‧周邊線路區144‧‧‧ Peripheral area

200‧‧‧感測元件結構基本單元200‧‧‧Basic unit of sensing component structure

212‧‧‧第二基板212‧‧‧second substrate

212a‧‧‧第二基板之第一表面212a‧‧‧ First surface of the second substrate

214‧‧‧第二感測單元214‧‧‧Second sensing unit

216‧‧‧第二浮凸結構216‧‧‧Second embossed structure

216a‧‧‧容置空間216a‧‧‧ accommodating space

220‧‧‧浮凸材料層220‧‧‧ embossed material layer

222‧‧‧第二溝槽222‧‧‧Second trench

224‧‧‧第二密封層224‧‧‧Second sealing layer

226‧‧‧凹穴226‧‧‧ recess

228、228a、228b、228c‧‧‧第二感測串列228, 228a, 228b, 228c‧‧‧ second sensing series

230‧‧‧第二導線結構230‧‧‧Second wire structure

240‧‧‧導電橋接元件240‧‧‧ Conductive bridging elements

242‧‧‧貫穿孔242‧‧‧through holes

600、700、800、900‧‧‧感測元件結構/觸控面板600, 700, 800, 900‧‧‧Sensor component structure / touch panel

610‧‧‧信號感測區610‧‧‧Signal Sensing Area

612‧‧‧周邊線路區612‧‧‧ Peripheral area

H‧‧‧浮凸結構深度H‧‧‧ embossed structure depth

Y‧‧‧第一方向Y‧‧‧First direction

X‧‧‧第二方向X‧‧‧second direction

第1圖為本發明觸控面板之感測元件結構的第一實施例之俯視示意圖。1 is a top plan view showing a first embodiment of a sensing element structure of a touch panel of the present invention.

第2圖為第1圖所示觸控面板之感測元件結構沿著切線2-2’的剖面示意圖。Fig. 2 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 1 along a tangent line 2-2'.

第3圖為本發明感測元件結構的製程示意圖。Fig. 3 is a schematic view showing the process of the structure of the sensing element of the present invention.

第4圖為包含本發明觸控面板之感測元件結構之第二實施例的俯視示意圖。4 is a top plan view showing a second embodiment of a sensing element structure including the touch panel of the present invention.

第5圖為第4圖所示觸控面板之感測元件結構沿著切線5-5’的剖面示意圖。Fig. 5 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 4 along the tangential line 5-5'.

第6圖為包含本發明觸控面板之感測元件結構之第三實施例的俯視示意圖。Figure 6 is a top plan view showing a third embodiment of a sensing element structure including the touch panel of the present invention.

第7A圖為第6圖所示觸控面板之感測元件結構沿著切線7-7’的剖面示意圖。Fig. 7A is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 6 along a tangent line 7-7'.

第7B圖為第7A圖所示感測元件結構的第一變化實施例的剖面示意圖。Fig. 7B is a schematic cross-sectional view showing a first modified embodiment of the structure of the sensing element shown in Fig. 7A.

第7C圖為第7A圖所示感測元件結構的第二變化實施例的剖面示意圖。Fig. 7C is a schematic cross-sectional view showing a second modified embodiment of the structure of the sensing element shown in Fig. 7A.

第7D圖為第7A圖所示感測元件結構的第三變化實施例的剖面示意圖。Fig. 7D is a schematic cross-sectional view showing a third modified embodiment of the structure of the sensing element shown in Fig. 7A.

第8圖為包含本發明觸控面板之感測元件結構之第四實施例的俯視示意圖。Figure 8 is a top plan view showing a fourth embodiment of a sensing element structure including the touch panel of the present invention.

第9圖為第8圖所示觸控面板之感測元件結構沿著切線9-9’的剖面示意圖。Fig. 9 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 8 along a tangential line 9-9'.

第10圖為包含本發明觸控面板之感測元件結構之第五實施例的俯視示意圖。FIG. 10 is a top plan view showing a fifth embodiment of a sensing element structure including the touch panel of the present invention.

第11圖為第10圖所示觸控面板之感測元件結構沿著切線11-11’的剖面示意圖。Figure 11 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Figure 10 along the tangential line 11-11'.

第12圖為為本發明感測單元圖形之變化實施例的示意圖。Figure 12 is a schematic view showing a modified embodiment of the sensing unit pattern of the present invention.

請參考第1圖與第2圖,其中第1圖為本發明觸控面板之感測元件結構的第一實施例之俯視示意圖,而第2圖為第1圖所示觸控面板之感測元件結構沿著切線2-2’的剖面示意圖。在第1圖與第2圖中,感測元件結構110具有單一方向之第一感測串列128,例如包括複數個第一感測串列128a、128b、128c,皆沿著第一方向Y延伸排列。各第一感測串列128分別包括複數個第一感測單元114,沿著第一方向Y相鄰並排成一直行,設置於第一基板112的第一表面112a上,且各第一感測單元114分別包括一第一浮凸結構116與一第一導電材料118。各第一浮凸結構116包括一容置空間116a,而第一導電材料118係容置於第一浮凸結構116之容置空間116a之中。第一感測串列128另包括複數個第一溝槽122,分別設置於同一第一感測串列128之任二相鄰之第一感測單元114之間,使得任二相鄰之第一浮凸結構116之容置空間116a可以藉由各第一溝槽122而相通;亦即,第一浮凸結構116具有半開放的形狀,藉由第一溝槽122而彼此串接。第一導電材料118更設置於第一溝槽中122中,因此,在同一第一感測串列128中的各第一感測單元114中的第一導電材料118與第一溝槽122內的第一導電材料118流動相通,而彼此互相電性連接或電性導通。值得注意的是,在第1圖中,雖然僅以三條第一測感串列128a、128b、128c且個別具有三個感測單元114作代表說明,但實際上一感測元件結構110的第一測感串列128的數量以及各第一測感串列128所包含的第一感測單元114與第一溝槽122的數量並不以第1圖所示者為限。Please refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a top view of the first embodiment of the sensing element structure of the touch panel of the present invention, and FIG. 2 is a sensing diagram of the touch panel shown in FIG. 1 . A schematic cross-sectional view of the component structure along the tangent 2-2'. In Figures 1 and 2, the sensing element structure 110 has a first sensing series 128 in a single direction, for example comprising a plurality of first sensing series 128a, 128b, 128c, all along a first direction Y Extend the arrangement. Each of the first sensing series 128 includes a plurality of first sensing units 114 respectively adjacent to each other along the first direction Y, disposed on the first surface 112a of the first substrate 112, and each first The sensing unit 114 includes a first embossed structure 116 and a first conductive material 118, respectively. Each of the first embossed structures 116 includes an accommodating space 116a, and the first conductive material 118 is received in the accommodating space 116a of the first embossed structure 116. The first sensing series 128 further includes a plurality of first trenches 122 respectively disposed between any two adjacent sensing units 114 of the same first sensing series 128, such that any two adjacent ones The accommodating space 116a of the embossed structure 116 can communicate with each other through the first trenches 122; that is, the first embossed structures 116 have a semi-open shape and are connected to each other by the first trenches 122. The first conductive material 118 is disposed in the first trench 122, and thus, in the first conductive material 118 and the first trench 122 in each of the first sensing units 114 in the same first sensing series 128. The first conductive materials 118 are in fluid communication and electrically connected or electrically connected to each other. It should be noted that in FIG. 1 , although only three first sensing series 128a, 128b, 128c and three sensing units 114 are representatively represented, in fact, the first sensing element structure 110 The number of sensed series 128 and the number of first sensing units 114 and first trenches 122 included in each first sensing series 128 are not limited to those shown in FIG.

由第2圖可知,第一浮凸結構116是由浮凸材料層120所構成,其中浮凸材料層120係設置於第一基板112的第一表面112a上,其具有平坦部分120b與凸起部分120a,相鄰的凸起部分120a會如同杯壁而環繞部分之平坦部分120b,形成一容置空間116a,容置空間116a僅在與第一溝槽122 相接處具有開口,使得容置於其內的第一導電材料118可以經由第一溝槽122而流通於相鄰的第一浮凸結構116之中。此外,感測元件結構110另包括第一密封層124設置在浮凸材料層120表面,其覆蓋在各第一浮凸結構116與第一溝槽122的表面,將容置空間116a與第一溝槽122內的第一導電材料118密封在各第一感測串列128中。在本實施例中,第一導電材料118可包括任何具透明特性之導電材料的組合,例如為包括具導電性的奈米銀絲(silver nanowire)、奈米金屬顆粒(nano metal particles)或奈米石墨材料的溶液等,上述具導電性的奈米材料與溶劑之組合在一定比例或條件下,透過人眼視覺會認為第一導電材料118具有透明特性或是具有高透光性。藉由散佈在第一導電材料118內的奈米銀絲、奈米金屬顆粒或奈米石墨,可以使位於第一感測串列128中的整個第一導電材料118具有導電性,以讓第一感測串列128中的各第一感測單元114互相電性連接。舉例而言,本實施例的第一浮凸結構116之容置空間116a的深度H為約15至30微米,但不以此為限;各第一浮凸結構116內之第一導電材料118可以完全填充滿容置空間116a,也可不完全填充滿容置空間116a,例如第一導電材料118在容置空間116a內的填充高度可以小於或等於約1微米,但不以此為限。As can be seen from FIG. 2, the first embossed structure 116 is composed of the embossed material layer 120, wherein the embossed material layer 120 is disposed on the first surface 112a of the first substrate 112, and has a flat portion 120b and a protrusion. In the portion 120a, the adjacent convex portion 120a surrounds the flat portion 120b of the cup wall, forming an accommodating space 116a, and the accommodating space 116a is only in the first groove 122. The junction has an opening such that the first electrically conductive material 118 received therein can flow through the first first relief structure 116 via the first trench 122. In addition, the sensing element structure 110 further includes a first sealing layer 124 disposed on the surface of the embossing material layer 120, covering the surfaces of each of the first embossed structures 116 and the first trenches 122, and accommodating the space 116a with the first A first electrically conductive material 118 within the trench 122 is sealed in each of the first sensing series 128. In this embodiment, the first conductive material 118 may comprise any combination of conductive materials having transparent properties, such as comprising silver nanowires, nano metal particles or nano. The solution of the graphite material or the like, the combination of the above-mentioned conductive nano material and the solvent may have a transparent property or a high light transmittance through the human eye through a certain ratio or condition. The entire first conductive material 118 located in the first sensing series 128 can be made conductive by the nano silver wire, the nano metal particles or the nano graphite dispersed in the first conductive material 118. Each of the first sensing units 114 in the sensing series 128 is electrically connected to each other. For example, the depth H of the accommodating space 116a of the first embossed structure 116 of the present embodiment is about 15 to 30 micrometers, but not limited thereto; the first conductive material 118 in each of the first embossed structures 116 The filling space 116a may be completely filled or may not be completely filled. For example, the filling height of the first conductive material 118 in the accommodating space 116a may be less than or equal to about 1 micrometer, but not limited thereto.

本發明觸控面板之感測元件結構110另可包括複數個第一導線結構130,分別位於各第一感測串列128之一端或二端都具備,例如第1圖繪示出各第一導線結構130係分別對應於一條第一感測串列128中,且設於第一感測串列128之下側或上側,亦即一條第一感測串列128的上側與下側分別連接一第一導線結構130,其中第一導線結構130係與所對應之第一感測串列128的第一導電材料118相接觸以電性連接於該第一感測串列128。在其他實施例中,一條第一感測串列128可僅有一側與一第一導線結構130相連接。第一導線結構130較佳包含金屬材料或具透明特性的導電材料組合,例如銀,其可以網版印刷方式製作於第一基板112的第一表面112a上,但不 以此為限,例如也可以利用黃光製程製或油墨印刷(Ink-jet printing)技術來製作第一導線結構130。為了達到使第一導線結構130與其對應之第一感測串列128的第一導電材料118相接觸,第一導線結構130的厚度較佳大於第一浮凸結構116的高度,例如可等於或大於第一浮凸結構116的高度與第一密封層124厚度的總和。再者,在與第一感測串列128相接處,第一導線結構130可具有一寬導線部分130a,其寬度約相同於容置空間116a的寬度,寬導線部分130a係與浮凸材料層120的凸起部分120a相接並圍繞第一導電材料118。各第一導線結構130另包括一細導線部分130b,分別與所對應的寬導線部分130a相接,細導線部分130b可再與外部之其他導線或訊號讀取元件相電性連接,以將第一感測單元114所感測之訊號傳送出去。因此,在本發明感測元件結構110中,設置有第一感測串列128之部分可以視為信號感測區142,其約略相同於第一密封層124所覆蓋之區域,而第一基板112沒有被第一密封層124所覆蓋的區域可以視為周邊線路區144,亦即第一導線結構130所設置的區域。各第一感測串列128所對應的第一導線結構130的數量與形狀並不以本實施例為限,例如在其他實施例中,一條第一感測串列128可同時對應兩條第一導線結構130,分別位於該第一感測串列128的兩端。The sensing element structure 110 of the touch panel of the present invention may further include a plurality of first wire structures 130 respectively disposed at one or both ends of each of the first sensing series 128. For example, FIG. 1 depicts the first The wire structures 130 are respectively disposed in a first sensing series 128 and are disposed on the lower side or the upper side of the first sensing series 128, that is, the upper side and the lower side of the first sensing series 128 are respectively connected. A first wire structure 130, wherein the first wire structure 130 is in contact with the first conductive material 118 of the corresponding first sensing series 128 to be electrically connected to the first sensing series 128. In other embodiments, one of the first sensing series 128 can be connected to a first wire structure 130 on only one side. The first wire structure 130 preferably comprises a metal material or a combination of conductive materials having transparent properties, such as silver, which can be formed on the first surface 112a of the first substrate 112 by screen printing, but not To this end, for example, the first wire structure 130 can also be fabricated using a yellow light process or an ink printing (Ink-jet printing) technique. In order to achieve contact between the first conductive structure 118 and the corresponding first conductive material 118 of the first sensing series 128, the thickness of the first conductive structure 130 is preferably greater than the height of the first embossed structure 116, for example, may be equal to or Greater than the sum of the height of the first relief structure 116 and the thickness of the first sealing layer 124. Furthermore, at the junction with the first sensing series 128, the first wire structure 130 may have a wide wire portion 130a having a width approximately the same as the width of the accommodating space 116a, and the wide wire portion 130a is embossed with the embossed material. The raised portions 120a of the layer 120 meet and surround the first conductive material 118. Each of the first wire structures 130 further includes a thin wire portion 130b respectively connected to the corresponding wide wire portion 130a, and the thin wire portion 130b can be electrically connected to other wires or signal reading elements of the outside to The signal sensed by a sensing unit 114 is transmitted. Therefore, in the sensing element structure 110 of the present invention, the portion in which the first sensing series 128 is disposed can be regarded as the signal sensing region 142 which is approximately the same as the region covered by the first sealing layer 124, and the first substrate The area that is not covered by the first sealing layer 124 can be considered as the peripheral line area 144, that is, the area in which the first wire structure 130 is disposed. The number and shape of the first wire structures 130 corresponding to the first sensing series 128 are not limited to the embodiment. For example, in other embodiments, one first sensing series 128 can simultaneously correspond to two A wire structure 130 is respectively located at both ends of the first sensing series 128.

請參考第3圖,第3圖為本發明感測元件結構以捲對捲(roll-to-roll)方式製作的製程示意圖。本發明感測元件結構110的製作方式可以捲對捲方式製作。首先如步驟502,提供第一基板112,然後以例如塗佈或其他方式在第一基板112的第一表面112a形成浮凸材料層120,然後在製程步驟504中以軋紋(embossing)加工方式利用軋紋滾軸132在浮凸材料層120表面軋印出呈陣列排列之第一浮凸結構116以及第一溝槽122(未示於第3圖中),接著如製程步驟506所示,於第一基板112上的第一感測單元114的第一浮凸結構116以及任二相鄰第一感測單元114之間的第一溝槽122內填入第一導電材料118,以形成第一感測串列128。然後,如步驟508,以第 一密封層124將填入了第一導電材料118的第一浮凸結構116與第一溝槽122密封,便完成了本發明觸控基板之感測元件結構110的基本元件之製作。值得注意的是,在填入第一導電材料118時,第一導電材料118可能因含有溶劑而為流體狀態,可以在密封之前或之後對第一導電材料118進行烘烤而將溶劑蒸發或固化,例如加熱或以紫外光照射第一導電材料118,使第一導電材料118固化。在不同實施例中,第一導電材料118本身也可以為透明流體,在填入第一浮凸結構116之後不對其進行蒸發或固化製程,讓第一導電材料118以流體狀態存在於浮凸結構116內。之後,依據所需的觸控面板大小,可以利用切割等方式將整面的第一基板112切割成複數片以形成複數個感測元件結構110。此外,第一導線結構130可以在切割第一基板112之前或之後形成於第一基板112的表面,以與對應之第一感測串列128相接。Please refer to FIG. 3, which is a schematic diagram of a process for fabricating a sensing element structure in a roll-to-roll manner. The sensing element structure 110 of the present invention can be fabricated in a roll-to-roll manner. First, as in step 502, the first substrate 112 is provided, and then the embossed material layer 120 is formed on the first surface 112a of the first substrate 112 by, for example, coating or otherwise, and then embossed in the process step 504. The first embossed structure 116 and the first trenches 122 (not shown in FIG. 3) arranged in an array are embossed on the surface of the embossed material layer 120 by the embossing roller 132, and then, as shown in the process step 506, Forming a first conductive material 118 in the first embossed structure 116 between the first embossed structure 116 of the first sensing unit 114 and any two adjacent first sensing units 114 on the first substrate 112 to form The first sense train 128. Then, as in step 508, to A sealing layer 124 seals the first embossed structure 116 filled with the first conductive material 118 and the first trench 122, thereby completing the fabrication of the basic components of the sensing element structure 110 of the touch substrate of the present invention. It should be noted that when filling the first conductive material 118, the first conductive material 118 may be in a fluid state due to the inclusion of a solvent, and the first conductive material 118 may be baked before or after sealing to evaporate or cure the solvent. The first conductive material 118 is cured by, for example, heating or irradiating the first conductive material 118 with ultraviolet light. In different embodiments, the first conductive material 118 itself may also be a transparent fluid. After filling the first embossed structure 116, it is not evaporated or cured, and the first conductive material 118 is present in a fluid state on the embossed structure. 116 inside. Then, according to the required size of the touch panel, the entire first substrate 112 can be cut into a plurality of pieces by cutting or the like to form a plurality of sensing element structures 110. In addition, the first wire structure 130 may be formed on the surface of the first substrate 112 before or after the first substrate 112 is cut to be in contact with the corresponding first sensing series 128.

請再同時參閱第1圖與第2圖,在製程步驟504中,當利用軋紋滾軸132在浮凸材料層120表面軋印出第一浮凸結構116與第一溝槽122時,會同時在相鄰第一感測串列128之間的第一基板112上形成複數個封閉凹穴126,其係由封閉的凸起部分120a與平坦部分120b所構成,在本實施例中,凹穴126內不需另外填入其他材料,但在製程步驟508的密封製程中,第一密封層124會同時密封住凹穴126。需注意的是,本發明感測元件結構110在第一感測串列128之間的設計並不以上述為限,舉例而言,在一其他實施例中,凹穴126內也可以注入導電材料,例如在製程步驟506中將第二導電材料140注入凹穴126中,其中第一導電材料118與第二導電材料140可為相同或不相同之材料。然後在製程步驟508中同時密封凹穴126與容置空間116a之第一導電材料118與第二導電材料140。在另一其他實施例中,凹穴126內可以注入透明不導電流體或其他材料再加以密封,以平衡凸起部分120a兩側的壓力。在又另一實施例中,可以利用具有不同於第一實施例之軋紋的軋紋滾軸132在浮凸材料層120表面軋印出僅具有第一浮凸結構116與第一 溝槽122但沒有凹穴126的圖案,亦即在相鄰的第一感測串列128之間的浮凸材料層120皆為凸起部分120a。Please refer to FIG. 1 and FIG. 2 at the same time. In the process step 504, when the first embossed structure 116 and the first trench 122 are embossed on the surface of the embossed material layer 120 by the embossing roller 132, At the same time, a plurality of closed recesses 126 are formed on the first substrate 112 between the adjacent first sensing series 128, which are formed by the closed convex portion 120a and the flat portion 120b. In this embodiment, the concave portion is concave. No additional material needs to be filled in the pocket 126, but in the sealing process of the process step 508, the first sealing layer 124 will simultaneously seal the recess 126. It should be noted that the design of the sensing element structure 110 of the present invention between the first sensing series 128 is not limited to the above. For example, in other embodiments, the recess 126 may also be electrically conductive. The material, such as in process step 506, injects second conductive material 140 into recess 126, wherein first conductive material 118 and second conductive material 140 may be the same or different materials. The first conductive material 118 and the second conductive material 140 of the recess 126 and the accommodating space 116a are then simultaneously sealed in the process step 508. In still other embodiments, a transparent electrically non-conductive fluid or other material may be injected into the pocket 126 to seal against the pressure on both sides of the raised portion 120a. In still another embodiment, the embossing roller 132 having a embossing different from the first embodiment may be used to emboss the surface of the embossed material layer 120 with only the first embossed structure 116 and the first The trenches 122, but without the pattern of recesses 126, i.e., the embossed material layer 120 between adjacent first sensed series 128, are raised portions 120a.

本發明之觸控面板之感測元件結構並不以上述實施例為限。下文將依序介紹本發明之其它較佳實施例之觸控面板的感測元件結構及其製作方法,且為了便於比較各實施例之相異處並簡化說明,在下文之各實施例中使用相同的符號標注相同的元件,且主要針對各實施例之相異處進行說明,而不再對重覆部分進行贅述。The sensing element structure of the touch panel of the present invention is not limited to the above embodiment. Hereinafter, the sensing element structure of the touch panel of the other preferred embodiments of the present invention and a manufacturing method thereof will be sequentially described, and in order to facilitate comparison of the differences of the embodiments and simplify the description, the following embodiments are used. The same reference numerals are given to the same elements, and the differences between the embodiments are mainly described, and the repeated parts are not described again.

請參考第4圖與第5圖,第4圖為包含本發明觸控面板之感測元件結構之第二實施例的俯視示意圖,而第5圖為第4圖所示觸控面板之感測元件結構沿著切線5-5’的剖面示意圖。若以第1圖與第2圖所示的本發明感測元件結構110當作感測元件結構之基本單元,那麼在本實施例中,本發明觸控面板之感測元件結構600可以包含兩個感測元件結構110之基本單元,並且互相以不同方向交疊而構成分別呈Y方向與X方向延伸的感測串列。為便於區別,以下實施例將包含了沿著第一方向Y延伸排列的感測元件結構之基本單元以標號100表示,而包含沿著第二方向X延伸排列的感測元件結構之基本單元則以標號200表示,其中不再贅述感測元件結構基本單元100與第一實施例相同之部分。在本實施例中,感測元件結構基本單元100設置於第一基板112’的第一表面112a’上,而感測元件結構基本單元200的結構類似於感測元件結構基本單元100,係設置於第一基板112’的第二表面112b’上,其中第一表面112a’與第二表面112b’係平行相對設置。Please refer to FIG. 4 and FIG. 5 , FIG. 4 is a schematic top view of a second embodiment of a sensing element structure including the touch panel of the present invention, and FIG. 5 is a sensing of the touch panel shown in FIG. 4 . A schematic cross-sectional view of the component structure along the tangent 5-5'. If the sensing element structure 110 of the present invention shown in FIGS. 1 and 2 is used as the basic unit of the sensing element structure, in this embodiment, the sensing element structure 600 of the touch panel of the present invention may include two The basic units of the sensing element structures 110 are overlapped with each other in different directions to form sensing series extending in the Y direction and the X direction, respectively. For convenience of distinction, the following embodiments include a basic unit including a sensing element structure extending along a first direction Y, indicated by reference numeral 100, and a basic unit including a sensing element structure extending along a second direction X. Indicated by reference numeral 200, the same parts of the sensing element structure basic unit 100 as the first embodiment will not be described again. In this embodiment, the sensing element structure basic unit 100 is disposed on the first surface 112a' of the first substrate 112', and the structure of the sensing element structure basic unit 200 is similar to the sensing element structure basic unit 100. On the second surface 112b' of the first substrate 112', wherein the first surface 112a' and the second surface 112b' are disposed opposite to each other in parallel.

感測元件結構基本單元200包括複數條沿著第二方向X延伸且彼此平行排列之第二感測串列228,其中第二方向X係與第一方向Y相交,例如兩者為互相垂直。第4圖以三條第二感測串列228a、228b、228c做為代表。 各第二感測串列228包括複數個第二感測單元214,彼此互相電性連接且沿著第二方向X相鄰並排成一直行。各第二感測單元214分別包括一第二浮凸結構216與第二導電材料218,其中第二浮凸結構216係由浮凸材料層220所構成,而第二導電材料218係設置於第二浮凸結構216之容置空間216a之內。各第二感測串列228另包括複數個第二溝槽222,設置於同一第二感測串列228的相鄰二第二感測單元214之間,以使第二浮凸結構216之容置空間216a相通。由第4圖與第5圖可知,第一感測單元114與第二感測單元214在垂直於第一基板112’之第一表面112a,的方向上係互相錯位而不重疊的,但第一溝槽122與第二溝槽222則是在垂直於第一表面112a’的方向部分重疊。The sensing element structure base unit 200 includes a plurality of second sensing series 228 extending along the second direction X and arranged in parallel with each other, wherein the second direction X intersects the first direction Y, for example, the two are perpendicular to each other. Figure 4 is represented by three second sensing series 228a, 228b, 228c. Each of the second sensing series 228 includes a plurality of second sensing units 214 electrically connected to each other and adjacent to each other along the second direction X. Each of the second sensing units 214 includes a second embossed structure 216 and a second conductive material 218, wherein the second embossed structure 216 is formed by the embossed material layer 220, and the second conductive material 218 is disposed at the second The embossed structure 216 is within the accommodating space 216a. Each of the second sensing series 228 further includes a plurality of second trenches 222 disposed between adjacent two second sensing units 214 of the same second sensing series 228 such that the second embossed structures 216 The accommodation space 216a is in communication. As can be seen from FIGS. 4 and 5, the first sensing unit 114 and the second sensing unit 214 are offset from each other in a direction perpendicular to the first surface 112a of the first substrate 112' without overlapping, but A trench 122 and a second trench 222 are partially overlapped in a direction perpendicular to the first surface 112a'.

感測元件結構基本單元200另包括第二密封層224覆蓋於第二浮凸結構216表面,以將第二導電材料218密封於容置空間216a與第二溝槽222中。再者,感測元件結構基本單元200另可包括複數個第二導線結構230,分別設於各第二感測串列228之一端,與所對應之第二感測串列228的第二導電材料218相接觸以電性連接於該第二感測串列228。此外,第二感測串列228之間的凹穴226可以不填入任何材料,也可以填入透明非導電材料或第二導電材料218,或者在製作第二浮凸結構216時,使第二感測串列228之間不形成任何凹穴226。The sensing element structure base unit 200 further includes a second sealing layer 224 covering the surface of the second embossing structure 216 to seal the second conductive material 218 in the accommodating space 216a and the second trench 222. In addition, the sensing element structure base unit 200 may further include a plurality of second wire structures 230 respectively disposed at one end of each of the second sensing series 228 and the second conductive portion of the corresponding second sensing series 228. The material 218 is in contact to electrically connect to the second sensing series 228. In addition, the recess 226 between the second sensing series 228 may not be filled with any material, or may be filled with a transparent non-conductive material or a second conductive material 218, or may be made when the second embossed structure 216 is fabricated. No pockets 226 are formed between the two sensing trains 228.

由於本實施例之感測元件結構600包含互相垂直相交的第一感測串列128與第二感測串列228以及對應之第一導線結構130與第二導線結構230,因此本發明感測元件結構600亦可視為能提供完整觸控功能的觸控面板,其中,包含第一感測串列128與第二感測串列228的部分係當作信號感測區610,而設置第一導線結構130與第二導線結構230之部分係當作周邊線路區612。藉由Y與X方向的第一感測串列128與第二感測串列228可以計算出使用者的觸控位置。在不同實施例中,第一感測串列128之兩側分別 對應連接二條第一導線結構130,以及第二感測串列228之兩側亦可分別對應連接二條第二導線結構230,例如第1圖所示,但不以此為限。由上述可知,本實施例感測元件結構600係利用在第一基板112之相反表面分別製作走向相垂直之感測元件結構基本單元100、200,以提供X方向與Y方向之感測功能。類似於前一實施例,感測元件結構600可利用捲對捲方式製作,例如先以第3圖的製程流程在第一基板112’的第一表面112a’製作感測元件結構基本單元100,之後再以類似流程在第一基板112’的第二表面112b’製作感測元件結構基本單元200,然後再依需要切割第一基板112’成所需要的尺寸。Since the sensing element structure 600 of the present embodiment includes the first sensing series 128 and the second sensing series 228 that intersect each other perpendicularly and the corresponding first and second wire structures 130 and 230, the present invention senses The component structure 600 can also be regarded as a touch panel capable of providing a complete touch function, wherein the portion including the first sensing series 128 and the second sensing series 228 is regarded as the signal sensing area 610, and the first is set. Portions of the wire structure 130 and the second wire structure 230 are considered to be peripheral line regions 612. The touch position of the user can be calculated by the first sensing series 128 and the second sensing series 228 in the Y and X directions. In different embodiments, the two sides of the first sensing series 128 are respectively The two first wire structures 130 are connected to each other, and the two second wire structures 230 are respectively connected to the two sides of the second sensing line 228, for example, but not limited thereto. As can be seen from the above, the sensing element structure 600 of the present embodiment utilizes the sensing element structure basic units 100, 200 which are perpendicular to the opposite surfaces of the first substrate 112 to provide sensing functions in the X direction and the Y direction. Similar to the previous embodiment, the sensing element structure 600 can be fabricated by a roll-to-roll method. For example, the sensing element structure basic unit 100 is first fabricated on the first surface 112a' of the first substrate 112' by the process flow of FIG. The sensing element structure base unit 200 is then fabricated on the second surface 112b' of the first substrate 112' in a similar process, and then the first substrate 112' is cut to a desired size as needed.

請參考第6圖與第7A圖,第6圖為包含本發明觸控面板之感測元件結構之第三實施例的俯視示意圖,而第7A圖為第6圖所示觸控面板之感測元件結構沿著切線7-7’的剖面示意圖。本實施例感測元件結構700與前一實施例不同處在於感測元件結構基本單元100與感測元件結構基本單元200係分別製作於不同之基板上,例如先將感測元件結構基本單元100製作於第一基板112之第一表面112a上,將感測元件結構基本單元200製作於第二基板212的第一表面212a上,然後再利用一黏著層136將第二基板212固定於第一基板112相反於第一表面112a之第二表面112b上,其中第一感測串列128與第二感測串列228分別沿著垂直相交的第一方向Y與第二方向X延伸排列,而黏著層136為透明材質可包含固態或液態光學膠(optical clear adhesive,OCA)等透明材料。藉此,便完成了本發明第三實施例之感測元件結構700所構成的觸控面板。Please refer to FIG. 6 and FIG. 7A. FIG. 6 is a top view of a third embodiment of a sensing element structure including the touch panel of the present invention, and FIG. 7A is a sensing of the touch panel shown in FIG. A schematic cross-sectional view of the component structure along the tangent 7-7'. The sensing element structure 700 of the present embodiment is different from the previous embodiment in that the sensing element structure basic unit 100 and the sensing element structure basic unit 200 are respectively fabricated on different substrates, for example, the sensing element structure basic unit 100 is firstly used. On the first surface 112a of the first substrate 112, the sensing element structure basic unit 200 is formed on the first surface 212a of the second substrate 212, and then the second substrate 212 is fixed to the first surface by an adhesive layer 136. The substrate 112 is opposite to the second surface 112b of the first surface 112a, wherein the first sensing series 128 and the second sensing series 228 respectively extend along the first direction Y and the second direction X perpendicular to each other, and The adhesive layer 136 is a transparent material and may comprise a transparent material such as a solid or liquid optical adhesive (OCA). Thereby, the touch panel constructed by the sensing element structure 700 of the third embodiment of the present invention is completed.

值得注意的是,雖然本實施例中的第二感測串列228係設置於第二基板212相反於第一基板112的第一表面212a上,但感測元件結構基本單元100、第一基板112和黏著層136的相對位置以及感測元件結構基本單元200、第二基板212和黏著層136的相對位置並不限於第7圖所示者,例如在 固定感測元件結構基本單元100、200時,可以使感測元件結構基本單元200或100上下顛倒,例如使第二感測串列228位於第二基板212與黏著層136之間,或是使第一感測串列128位於第一基板112與黏著層136之間。請參考第7B圖、第7C圖以及第7D圖,第7B圖至第7D圖分別為第7A圖所示感測元件結構的第一變化實施例、第二變化實施例及第三變化實施例的結構示意圖。如第7B圖所示,此第一變化實施例與第7A圖所示本發明第三實施例之不同處在於其感測元件結構基本單元200係上下顛倒設置,亦即使第二感測串列228的第二浮凸結構216和第二導電材料218設置於第二基板212與黏著層136之間;第7C圖所示之第二變化實施例與第7A圖之差異在於感測元件結構基本單元100係上下顛倒設置,亦即使第一浮凸結構116和第一導電材料118設置於第一基板112與黏著層136之間;而第7D圖所示之第三變化實施例與第7A圖之差異在於感測元件結構基本單元100和200皆為上下顛倒設置。It should be noted that, although the second sensing series 228 in the embodiment is disposed on the first surface 212a of the first substrate 112 opposite to the second substrate 212, the sensing element structure base unit 100 and the first substrate are The relative positions of the 112 and the adhesive layer 136 and the relative positions of the sensing element structure base unit 200, the second substrate 212, and the adhesive layer 136 are not limited to those shown in FIG. 7, for example, When the sensing element structure base unit 100, 200 is fixed, the sensing element structure basic unit 200 or 100 may be turned upside down, for example, the second sensing series 228 is located between the second substrate 212 and the adhesive layer 136, or The first sensing series 128 is located between the first substrate 112 and the adhesive layer 136. Please refer to FIG. 7B , FIG. 7C and FIG. 7D , and FIG. 7B to FIG. 7D are respectively a first variation embodiment, a second variation embodiment and a third variation embodiment of the sensing element structure shown in FIG. 7A . Schematic diagram of the structure. As shown in FIG. 7B, the first variation embodiment is different from the third embodiment of the present invention shown in FIG. 7A in that the sensing element structure basic unit 200 is upside down, even if the second sensing series is The second embossed structure 216 and the second conductive material 218 are disposed between the second substrate 212 and the adhesive layer 136; the second variation shown in FIG. 7C differs from the seventh embodiment in that the sensing element has a basic structure. The unit 100 is placed upside down, even if the first embossed structure 116 and the first conductive material 118 are disposed between the first substrate 112 and the adhesive layer 136; and the third variation embodiment and the seventh embodiment shown in FIG. 7D The difference is that the sensing element structure basic units 100 and 200 are both upside down.

請參考第8圖與第9圖,第8圖為包含本發明觸控面板之感測元件結構之第四實施例的俯視示意圖,第9圖為第8圖所示觸控面板之感測元件結構沿著切線9-9’的剖面示意圖。本實施例感測元件結構800與第三實施例的不同處在於用透明材質的保護層138取代第7圖中的第二基板212與黏著層136。因此,其製程可包括在將感測元件結構基本單元100製作於第一基板112”的第一表面112a”後,先於第一密封層124表面形成平坦的保護層138,完整覆蓋感測元件結構基本單元100的表面與側邊,然後再將感測元件結構基本單元200以例如捲對捲方式製作在保護層138相反於感測元件結構基本單元100的表面上。因此,本實施例之第一感測串列128與第二感測串列228係由下而上依序設置於第一基板112’’之第一表面112a’’之上。Please refer to FIG. 8 and FIG. 9 , FIG. 8 is a schematic top view of a fourth embodiment of a sensing element structure including the touch panel of the present invention, and FIG. 9 is a sensing element of the touch panel shown in FIG. 8 . A schematic cross-sectional view of the structure along the tangential line 9-9'. The difference between the sensing element structure 800 of the present embodiment and the third embodiment is that the second substrate 212 and the adhesive layer 136 in FIG. 7 are replaced by a protective layer 138 of a transparent material. Therefore, the process may include forming a flat protective layer 138 on the surface of the first sealing layer 124 after the sensing element structure basic unit 100 is formed on the first surface 112a of the first substrate 112", completely covering the sensing element. The surface and sides of the basic unit 100 are structured, and then the sensing element structure basic unit 200 is fabricated in a roll-to-roll manner, for example, on the surface of the protective layer 138 opposite to the sensing element structure base unit 100. Therefore, the first sensing series 128 and the second sensing series 228 of the embodiment are disposed on the first surface 112a'' of the first substrate 112'' sequentially from bottom to top.

請參考第10圖與第11圖,第10圖為包含本發明觸控面板之感測 元件結構之第五實施例的俯視示意圖,第11圖為第10圖所示觸控面板之感測元件結構沿著切線11-11’的剖面示意圖。本發明第五實施例的感測元件結構900的第一感測單元114、第一溝槽122及第二感測單元214皆直接製作於第一基板112”’的第一表面112a”’上,且第一感測單元114與第二感測單元214係彼此錯位並排呈矩陣排列。浮凸材料層120同時構成了第一浮凸結構116、第一溝槽122和第二浮凸結構216,因此第一感測串列128a、128b、128c具有類似於第1圖之結構,但相鄰第二浮凸結構216之間沒有設置第二溝槽,因此各第二感測單元214的第二導電材料218係被密封在各第二浮凸結構216內。與前述實施例相較,本實施例之感測元件結構900另包括複數個導電橋接元件240,分別設於同一第二感測串列228的任二相鄰之第二感測單元214之間,導電橋接元件240係藉由第一密封層124的貫穿孔242而與第二感測單元214的第二導電材料118相接觸,用來電性連接相鄰之第二感測單元214,以使同一第二感測串列228之第二感測單元214彼此相電性連接。據此,各第二感測串列228係由複數個第二感測單元214與複數個導電橋接元件240所構成,第10圖以三條第二感測串列228a、228b、228c示意。值得注意的是,雖然第二感測串列228係與第一感測串列128交錯設置於第一基板112”’之第一表面112a”’上,但由於導電橋接元件240係跨設於第一溝槽122上方,因此不會與第一感測串列128相電性連接。導電橋接元件240的製作方式舉例為在形成第一密封層124之後,進行一雷射穿孔或蝕刻製程以在第一密封層124中形成複數個貫穿孔242,然後進行一網版印刷製程,於貫穿孔242與第一密封層124表面形成導電橋接元件240。此外,本實施例感測元件結構900另可包括保護層138設置於第一密封層124與導電橋接元件240表面,覆蓋第二感測串列228與第一感測串列128,以提供保護。Please refer to FIG. 10 and FIG. 11 , and FIG. 10 is a sensing method including the touch panel of the present invention. A top view of a fifth embodiment of the device structure, and FIG. 11 is a cross-sectional view of the sensing element structure of the touch panel shown in FIG. 10 along a tangential line 11-11'. The first sensing unit 114, the first trench 122, and the second sensing unit 214 of the sensing device structure 900 of the fifth embodiment of the present invention are directly fabricated on the first surface 112a"' of the first substrate 112"' The first sensing unit 114 and the second sensing unit 214 are misaligned with each other and arranged in a matrix. The embossed material layer 120 simultaneously constitutes the first embossed structure 116, the first trench 122, and the second embossed structure 216, and thus the first sensing series 128a, 128b, 128c have a structure similar to that of FIG. 1, but A second trench is not disposed between the adjacent second emboss structures 216, and thus the second conductive material 218 of each of the second sensing units 214 is sealed within each of the second emboss structures 216. The sensing element structure 900 of the present embodiment further includes a plurality of conductive bridging elements 240 disposed between any two adjacent sensing units 214 of the same second sensing series 228, as compared with the previous embodiments. The conductive bridging element 240 is in contact with the second conductive material 118 of the second sensing unit 214 through the through hole 242 of the first sealing layer 124 for electrically connecting the adjacent second sensing unit 214 so that The second sensing units 214 of the same second sensing series 228 are electrically connected to each other. Accordingly, each of the second sensing series 228 is comprised of a plurality of second sensing units 214 and a plurality of conductive bridging elements 240, and FIG. 10 is illustrated with three second sensing series 228a, 228b, 228c. It should be noted that although the second sensing series 228 is interleaved with the first sensing series 128 on the first surface 112a"' of the first substrate 112"', the conductive bridging element 240 is disposed across The first trench 122 is above, and thus is not electrically connected to the first sensing series 128. The conductive bridging element 240 is formed by performing a laser perforation or etching process to form a plurality of through holes 242 in the first sealing layer 124 after forming the first sealing layer 124, and then performing a screen printing process. The through hole 242 forms a conductive bridging element 240 with the surface of the first sealing layer 124. In addition, the sensing device structure 900 of the present embodiment may further include a protective layer 138 disposed on the surface of the first sealing layer 124 and the conductive bridging element 240, covering the second sensing series 228 and the first sensing series 128 to provide protection. .

值得注意的是,本發明各浮凸結構並不限於前述實施例所揭露之菱形形狀,為了增加側向電容的敏感度以提高觸控面板效能,可以增加各感 測單元的側向投射面積,例如使各感測單元之圖形複雜化以增加其周長,進而增加側向電容的投射面積。請參考第12圖,第12圖顯示了感測單元圖形之變化實施例的示意圖。與第1圖相較,第12圖所示變化實施例之各第一浮凸結構116具有類似雪花之圖形,因形狀彎曲而大幅增加了第一感測單元114的側向投射面積。It should be noted that the embossed structures of the present invention are not limited to the diamond shape disclosed in the foregoing embodiments. In order to increase the sensitivity of the lateral capacitance to improve the performance of the touch panel, various sensations may be added. The lateral projection area of the measuring unit, for example, complicates the pattern of each sensing unit to increase its circumference, thereby increasing the projected area of the lateral capacitance. Please refer to FIG. 12, which shows a schematic diagram of a variation of the sensing unit pattern. Compared with Fig. 1, each of the first embossed structures 116 of the modified embodiment shown in Fig. 12 has a snowflake-like pattern, which greatly increases the lateral projection area of the first sensing unit 114 due to the curved shape.

綜上所述,本發明觸控面板之感測元件結構中的感測串列主要係使用包含如奈米銀絲、奈米金屬顆粒或奈米石墨材料等具透明特性的導電材料當作電性元件,並利用浮凸結構與密封層來定義出各感測串列的形狀與位置。由於上述導電材料具有良好的穿透率與低色偏特性,也可以提供良好的電性效果,因此可以兼顧高穿透率、低面阻值與低色偏要求,且含有奈米銀絲、奈米金屬顆粒或奈米石墨材料等具透明特性的導電材料的成本也較傳統金屬氧化物材料更低廉,因此本發明可以降低觸控面板的製作成本。再者,因為浮凸結構的設計可應用於軟性顯示面板中,因此本發明結構也可以應用於軟性觸控面板中,有效避免習知因氧化銦錫脆性高而造成脆裂之問題。此外,本發明結構可利用捲對捲方式製作,可以依需要設計調整浮凸結構的形狀與密度,且能大量連續生產感測串列,避免使用傳統結構中的黃光製程,因而能夠有效提生產能和降低成本。另一方面,周邊線路區的導線結構也可以網版印刷製程製作,其具有高彈性調整及客製能力,例如可以在各感測串列之兩側或一側分別設置導線結構,同樣為本發明的優勢之一。In summary, the sensing series in the sensing element structure of the touch panel of the present invention mainly uses a conductive material having transparent properties such as nano silver wire, nano metal particles or nano graphite material as electricity. The element is shaped and the embossed structure and the sealing layer are used to define the shape and position of each sensing series. Since the above conductive material has good transmittance and low color shifting characteristics, it can also provide a good electrical effect, so that high transmittance, low surface resistance and low color shift can be achieved, and the nano silver wire is contained. The cost of a transparent conductive material such as a nano metal particle or a nano graphite material is also lower than that of a conventional metal oxide material. Therefore, the present invention can reduce the manufacturing cost of the touch panel. Furthermore, since the design of the embossed structure can be applied to a flexible display panel, the structure of the present invention can also be applied to a flexible touch panel, thereby effectively avoiding the problem of brittle cracking due to high brittleness of indium tin oxide. In addition, the structure of the present invention can be fabricated by a roll-to-roll method, and the shape and density of the embossed structure can be adjusted as needed, and the sensing series can be continuously produced in a large amount, thereby avoiding the use of the yellow light process in the conventional structure, thereby effectively Production capacity and cost reduction. On the other hand, the wire structure of the peripheral circuit area can also be produced by a screen printing process, which has high flexibility adjustment and customary capability. For example, a wire structure can be respectively disposed on both sides or one side of each sensing series, and the same is One of the advantages of the invention.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

110‧‧‧感測元件結構110‧‧‧Sensor component structure

112‧‧‧第一基板112‧‧‧First substrate

112a‧‧‧第一基板之第一表面112a‧‧‧ First surface of the first substrate

114‧‧‧第一感測單元114‧‧‧First sensing unit

116‧‧‧第一浮凸結構116‧‧‧First embossed structure

116a‧‧‧容置空間116a‧‧‧ accommodating space

118‧‧‧第一導電材料118‧‧‧First conductive material

120‧‧‧浮凸材料層120‧‧‧ embossed material layer

122‧‧‧第一溝槽122‧‧‧First trench

124‧‧‧第一密封層124‧‧‧First sealing layer

126‧‧‧凹穴126‧‧‧ recess

128、128a、128b、128c‧‧‧第一感測串列128, 128a, 128b, 128c‧‧‧ first sensing series

130‧‧‧第一導線結構130‧‧‧First wire structure

130a‧‧‧寬導線部分130a‧‧ Wide wire section

130b‧‧‧細導線部分130b‧‧‧fine wire section

140‧‧‧第二導電材料140‧‧‧Second conductive material

142‧‧‧信號感測區142‧‧‧Signal Sensing Area

144‧‧‧周邊線路區144‧‧‧ Peripheral area

Claims (19)

一種觸控面板之感測元件結構,包括:複數條第一感測串列,分別沿著一第一方向設置於一第一基板之一第一表面,各該第一感測串列包括:複數個第一感測單元沿著該第一方向相鄰並排,其中各該第一感測單元分別包括:一第一浮凸(embossment)結構,具有一容置空間;以及一第一導電材料,容置於該第一浮凸結構之該容置空間中;複數個第一溝槽,分別設置於同一該第一感測串列之任二相鄰之該等第一感測單元之間,以使任二相鄰之該等第一浮凸結構之該等容置空間藉由各該第一溝槽而相通,且該第一導電材料更設置於該等第一溝槽中,以使該等第一感測單元互相電性連接;複數條第二感測串列,分別沿著一第二方向設置,其中該第二方向與該第一方向相交,各該第二感測串列包括互相電性連接之複數個第二感測單元,沿著該第二方向相鄰並排,其中各該第二感測單元分別包括:一第二浮凸結構,具有一容置空間;以及一第二導電材料,容置於該第二浮凸結構之該容置空間中;以及複數個第二導線結構,分別位於各該第二感測串列之一端,與該第二感測串列中之該第二導電材料相接觸以電性連接該第二感測串列。 The sensing component structure of the touch panel includes: a plurality of first sensing series disposed on a first surface of a first substrate along a first direction, each of the first sensing series comprising: The plurality of first sensing units are adjacent to each other along the first direction, wherein each of the first sensing units comprises: a first embossment structure having an accommodating space; and a first conductive material And accommodating the accommodating space of the first embossed structure; the plurality of first trenches are respectively disposed between the first sensing units adjacent to any two of the first sensing series The accommodating spaces of the first embossed structures adjacent to each other are communicated by the first trenches, and the first conductive material is further disposed in the first trenches to The first sensing units are electrically connected to each other; the plurality of second sensing series are respectively disposed along a second direction, wherein the second direction intersects the first direction, and each of the second sensing strings The column includes a plurality of second sensing units electrically connected to each other, adjacent to each other along the second direction, Each of the second sensing units includes: a second embossed structure having an accommodating space; and a second conductive material received in the accommodating space of the second embossed structure; and a plurality of The second wire structure is respectively located at one end of each of the second sensing series, and is in contact with the second conductive material in the second sensing series to electrically connect the second sensing series. 如請求項1所述之感測元件結構,另包括一第一密封層,覆蓋於該等第一浮凸結構之表面。 The sensing element structure of claim 1, further comprising a first sealing layer covering the surface of the first embossed structures. 如請求項1所述之感測元件結構,其中該第一導電材料包括奈米銀絲(silver nanowire)、奈米金屬顆粒(nano metal particles)或奈米石墨材料。 The sensing element structure of claim 1, wherein the first conductive material comprises a silver nanowire, a nano metal particle or a nano graphite material. 如請求項1所述之感測元件結構,其另包括複數個第一導線結構,分別位於各該第一感測串列之一端,與該第一感測串列之該第一導電材料相接觸以電性連接該第一感測串列。 The sensing element structure of claim 1, further comprising a plurality of first wire structures respectively located at one end of each of the first sensing series, and the first conductive material of the first sensing series The contacts are electrically connected to the first sensing series. 如請求項1所述之感測元件結構,其中各該第二感測串列另包括複數個第二溝槽,設於同一該第二感測串列之任二相鄰之該等第二浮凸結構之間,以使該等第二浮凸結構之該等容置空間相通,且該等第二溝槽中另容置有該第二導電材料。 The sensing element structure of claim 1, wherein each of the second sensing series further comprises a plurality of second trenches disposed on any two of the second sensing series adjacent to the second Between the embossed structures, the accommodating spaces of the second embossed structures are in communication, and the second conductive materials are further disposed in the second trenches. 如請求項5所述之感測元件結構,其中該等第二感測串列係設置於該第一基板之一第二表面,其中該第一基板之該第二表面與該第一表面係相對設置。 The sensing element structure of claim 5, wherein the second sensing series is disposed on a second surface of the first substrate, wherein the second surface of the first substrate and the first surface system Relative settings. 如請求項5所述之感測元件結構,更包括:一第二基板,設置於該第一基板相反於該第一表面之一第二表面,且該等第二感測串列係設置於該第二基板上;以及一黏著層,設置於該第一基板與該第二基板之間。 The sensing element structure of claim 5, further comprising: a second substrate disposed on the first substrate opposite to the second surface of the first surface, and the second sensing series is disposed on The second substrate; and an adhesive layer disposed between the first substrate and the second substrate. 如請求項5所述之感測元件結構,其中該等第一感測串列與該等第二感測串列係由下而上依序設置於該第一基板之該第一表面之上。 The sensing element structure of claim 5, wherein the first sensing series and the second sensing series are sequentially disposed from bottom to top on the first surface of the first substrate . 如請求項8所述之感測元件結構,另包括一保護層設置於該等第一感測串列之上,且該等第二感測串列係設置在該保護層之表面上。 The sensing element structure of claim 8, further comprising a protective layer disposed on the first sensing series, and the second sensing series is disposed on a surface of the protective layer. 如請求項1所述之感測元件結構,更包括複數個導電橋接元件,設於同一該第二感測串列之任二相鄰之該等第二感測單元之間,用來電性連接相鄰之該等第二感測單元,以使同一該第二感測串列之該等第二感測單元彼此電 性連接,其中各該導電橋接元件與該等第一感測串列不連接。 The sensing element structure of claim 1, further comprising a plurality of conductive bridging elements disposed between the second sensing units adjacent to any two of the second sensing series for electrically connecting Adjacent to the second sensing units, such that the second sensing units of the same second sensing series are electrically connected to each other A sexual connection, wherein each of the conductive bridging elements is not connected to the first sensing series. 如請求項10所述之感測元件結構,其中該等第二感測串列係與該等第一感測串列交錯設置於該第一基板之該第一表面上。 The sensing element structure of claim 10, wherein the second sensing series are interleaved with the first sensing series on the first surface of the first substrate. 如請求項11所述之感測元件結構,更包括一保護層,覆蓋於該等第二感測串列與該等第一感測串列之上。 The sensing element structure of claim 11, further comprising a protective layer covering the second sensing series and the first sensing series. 如請求項1所述之感測元件結構,更包括一第二密封層,覆蓋於該等第二感測串列之表面。 The sensing element structure of claim 1, further comprising a second sealing layer covering the surface of the second sensing series. 一種觸控面板之感測元件結構之製作方法,包括:提供一第一基板,具有一第一表面;於該第一表面形成複數個第一浮凸結構與複數個第一溝槽,其中該等第一浮凸結構係呈陣列排列且分別具有一容置空間,而各該第一溝槽係設置於沿著一第一方向相鄰排列之該等第一浮凸結構之間,以連通該等第一浮凸結構;於該等第一浮凸結構之該等容置空間與該等第一溝槽中填入一第一導電材料;於該等第一浮凸結構表面形成一密封層,以將該第一導電材料密封於該等容置空間與該等第一溝槽中;於該第一表面形成複數個第二浮凸結構,其中該等第二浮凸結構係呈陣列排列且分別具有一容置空間;於該等第二浮凸結構之該等容置空間填入一第二導電材料;於該密封層形成複數個貫穿孔;以及進行一網版印刷製程,以於該密封層上形成複數個橋接元件,其中各橋接 元件設置於沿著一第二方向相鄰排列之該等第二浮凸結構之間,且分別藉由該等貫穿孔而與該等第二浮凸結構中之該第二導電材料電性相接,其中該第二方向與該第一方向相交。 A method for fabricating a sensing component of a touch panel includes: providing a first substrate having a first surface; forming a plurality of first embossed structures and a plurality of first trenches on the first surface, wherein The first embossed structures are arranged in an array and each have an accommodating space, and each of the first trenches is disposed between the first embossed structures adjacently arranged along a first direction to communicate The first embossed structures; the first accommodating spaces of the first embossed structures and the first trenches are filled with a first conductive material; and a seal is formed on the surfaces of the first embossed structures a layer, the first conductive material is sealed in the first accommodating space and the first trenches; and a plurality of second embossed structures are formed on the first surface, wherein the second embossed structures are in an array Aligning and respectively having an accommodating space; filling the second conductive material in the accommodating spaces of the second embossed structures; forming a plurality of through holes in the sealing layer; and performing a screen printing process to Forming a plurality of bridging elements on the sealing layer, wherein each Meet The components are disposed between the second embossed structures adjacently arranged along a second direction, and electrically connected to the second conductive material in the second embossed structures by the through holes respectively And wherein the second direction intersects the first direction. 如請求項14所述之感測元件結構之製作方法,其中形成該等第一浮凸結構、填入該第一導電材料以及密封該第一導電材料之步驟係利用一捲對捲(roll-to-roll)製程所完成。 The method of fabricating the sensing element structure of claim 14, wherein the step of forming the first embossed structure, filling the first conductive material, and sealing the first conductive material utilizes a roll-to-roll (roll- To-roll) The process is completed. 如請求項14所述之感測元件結構之製作方法,更包括在該第一基板之該第一表面上形成複數個第一導線結構,以分別電性連接該等第一浮凸結構之其中一者內之該第一導電材料。 The method for fabricating the sensing device structure of claim 14, further comprising forming a plurality of first wire structures on the first surface of the first substrate to electrically connect the first embossed structures, respectively. The first conductive material within one. 如請求項16所述之感測元件結構之製作方法,其中形成該等第一導線結構之方式包括進行一網版印刷製程。 The method of fabricating the sensing element structure of claim 16, wherein the forming the first wire structure comprises performing a screen printing process. 如請求項14所述之感測元件結構之製作方法,其中該第一導電材料包括奈米銀絲、奈米金屬顆粒或奈米石墨材料。 The method of fabricating the sensing element structure of claim 14, wherein the first conductive material comprises nano silver wire, nano metal particles or nano graphite material. 如請求項14所述之感測元件結構之製作方法,其中於該等第一浮凸結構之該等容置空間與該等第一溝槽中填入該第一導電材料之步驟包括:於該等第一浮凸結構之該等容置空間與該等第一溝槽中填入流體狀態之該第一導電材料;以及對流體狀態之該第一導電材料進行一固化製程。The method of fabricating the sensing device structure of claim 14, wherein the step of filling the first accommodating space of the first embossed structure with the first conductive material comprises: The first accommodating spaces of the first embossed structures and the first conductive material filled with the fluid state in the first trenches; and the first conductive material in the fluid state are subjected to a curing process.
TW102110078A 2013-03-21 2013-03-21 Sensor structure of touch panel and fabrication method thereof TWI476661B (en)

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TWI514213B (en) * 2013-10-01 2015-12-21 E Ink Holdings Inc Touch structure and manufacturing method for the same
CN105487727A (en) * 2014-09-17 2016-04-13 宸鸿科技(厦门)有限公司 Capacitive touch panel and manufacturing method thereof
CN109254690B (en) * 2018-09-29 2020-11-03 广州视睿电子科技有限公司 Touch film, manufacturing method thereof and touch module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100182267A1 (en) * 2009-01-16 2010-07-22 Samsung Mobile Display Co., Ltd. Touch screen panel with a window
US20110210935A1 (en) * 2010-03-01 2011-09-01 Cando Corporation Sensory structure of capacitive touch panel and capacitive touch panel having the same
US20110268936A1 (en) * 2010-04-28 2011-11-03 Kang Sung-Ku Touch screen panel and fabricating method for the same
TW201234243A (en) * 2011-02-01 2012-08-16 Ind Tech Res Inst Projective capacitive touch sensor structure and fabricating method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471772B (en) * 2011-07-14 2015-02-01 Rtr Tech Technology Co Ltd Automated process of touch panel
CN102662522B (en) * 2012-04-16 2015-11-18 姜洪波 Prepare the method for flexible touch screen and the equipment of preparation touch control electrode coiled material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100182267A1 (en) * 2009-01-16 2010-07-22 Samsung Mobile Display Co., Ltd. Touch screen panel with a window
US20110210935A1 (en) * 2010-03-01 2011-09-01 Cando Corporation Sensory structure of capacitive touch panel and capacitive touch panel having the same
US20110268936A1 (en) * 2010-04-28 2011-11-03 Kang Sung-Ku Touch screen panel and fabricating method for the same
TW201234243A (en) * 2011-02-01 2012-08-16 Ind Tech Res Inst Projective capacitive touch sensor structure and fabricating method thereof

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