TWI271298B - A process for forming fully encapsulated over-molding products - Google Patents

A process for forming fully encapsulated over-molding products Download PDF

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TWI271298B
TWI271298B TW93134627A TW93134627A TWI271298B TW I271298 B TWI271298 B TW I271298B TW 93134627 A TW93134627 A TW 93134627A TW 93134627 A TW93134627 A TW 93134627A TW I271298 B TWI271298 B TW I271298B
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Taiwan
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molded article
forming
mold
fully
polymer material
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TW93134627A
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Chinese (zh)
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TW200615113A (en
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Wen-Hong Huang
Shin-Sheng Chan
Hsin-Tien Tsai
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Hannspree Inc
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Priority to JP2005019890A priority patent/JP2006137174A/en
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Abstract

The present invention discloses a process for forming fully encapsulated over-molding products and the products thereof. A polymeric molding is formed and kept at room temperature for 15-30 hours for stabilizing its dimension. The polymeric molding is placed in an over-molding mold which has a concave therein. A 70-90A hardness over-molding material is injected into the concave between the mold and the polymeric molding at an injecting temperature between 160 to 210 DEG C and at a projecting speed between 12 to 28 cm<3>/sec to form an over-molding layer completely covering one side of the polymeric molding.

Description

1271298 九、發明說明: 【發明所屬之技術領域】 本發明係«於-獅齡面包覆之包毅術,_是有關於一種利 用有效控織絲件而賴良好包膠效果之形成全面性包覆之方法。 【先前技術】 、隨著科技的演進,對於產品尤其係電子產品之包膠技術也不斷創新, 以提昇表面處理技術。 * 一般而言’為達成騰、美解目的,因此朝包膠技術,習知 常用之包膠方式,包括:以橡膠漆直接噴附於欲包膠之素材表面、利用呈 黏性騎將包膠材料_於欲⑽之储絲上。'_,利社述兩財 式所形成之包膠品,㈣熱脹冷縮或溼錢鱗自顧素而造成附著 力不足進而產生繼現象。S此,目前業„之製程方式大 列步驟: 一 Γ -利用模具成型素材; -將欲包膠素材置於模具的凹孔中; -在高溫下導入包膠材料於模具和欲包膠素材之間的凹孔中; -自凹孔鬆脫已包膠的元件。 此製程常用於包膠各種電子組件。一般該包膠材料係一橡膠材料,·而 素材係-高分子贿,例如ABS(aeiyl。鐘e butadiene styrene)。該包膠過 程係以軟性㈣包覆在硬性類上來進行成型,祕包覆面積不一,因此 需開,套各自獨立之模具,先在第—械具細完歸件後,再將塑膠件 置入第一套域中進行包膠,此置人方式為緊配合,其挾持鬆緊度會關係 到良率高低,一般來說,抓銷較鬆之情況下,是方便成型的人員作業,但 良率較低,抓鎖若較緊,則成形人員較不易作業,但良率較高。 上述方法之缺點在於使用兩套模具成型,因各有公差值,故良率及精 〇801-A31088TWF(5.0) 5 i 1271298 度直接取決於模具廠技術及射出廢之經驗,除了 而導致成型表面不佳、或者_空氣接成 rm 耐磨易被刮傷;此外,若橡膠與塑膠黏著性差,更 撕下等成龍賴度不佳的_。綜上所述,橡勝 2度越低越軸型,外誠也·,若提高模溫會造核财良,而若 猎由冷康水冷部,其成型情況雖可改善,不過整個製程時間卻要拉長。 7如為因應兩種不同材質融合所產生之形變量,更需針對麵製程 仏件m祕H機本身之敎度、❹之敎度、成型 ,驗寻進行調整。欲形成全面包覆之包滕成型品,除了上述之製程因素不 ,若成型轉件表面欲達到全面包覆,則無法直接由該表面提 錄,啸觀騎糾之衝力。_包雜具之固定亦是 果之=二决上边習知問題’開發出—種可有效達成全面性包膠效 果之包膠技術,乃目前業界努力之主要方向之一。 【發明内容】 有鑑於此,本發明的目的係提供一種全面包覆之包膠成型品及其形成 方法,以提供-種藉由有效控制製程條件以達成良好包膠效果之全面性包 覆之方法。 、為達成上述目的,本發明係提供_種形成全面包覆之包膠成型品的方 法j利用素材換具成形一高分子素材;取出該高分子素材,將其 置於至度下15-30小時以穩定該高分子素材之尺寸;將該高分子素材置入一 具,凹孔之包膠模具中;在射出溫度雛2i〇〇c下,以射出速度⑽ 刀段射出而主人-硬度7〇·9()α之包騎料於該具有凹孔之包膠模 0801-A31088TWF(5.0) 6 1271298 具中’以使該包膠材料填入該凹孔中,並覆蓋於該高分子素材之一表面而 形成一包膠層’該包膠材料係一熱塑性膠材(thermoplastic elastomer,TPE); 硬化該包膠材料。以及,自該包膠模具取出已包膠的高分子素材並施行一 冷卻步驟,以得一全面包覆之包膠成型品。 為達成上述目的,本發明另提供一種全面包覆之包膠成型品,包括·· 一高分子素材;一包膠層,至少全面包覆該高分子素材之一表面,該包膠 層係一熱塑性膠材他_〇1)1脱^1_11^11&gt;£)。以及,一互融層,位於該 高分子素材以及該包膠層之間,係由該高分子素材及該包膠層互相熔融而 形成。1271298 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is a comprehensive technique for the use of an effective control of the woven fabric and the effect of a good encapsulation effect. The method of coating. [Prior Art] With the evolution of technology, the encapsulation technology for products, especially electronic products, has also been continuously innovated to enhance surface treatment technology. * Generally speaking, 'for the purpose of achieving enthusiasm and beauty, therefore, the rubber coating technology, the commonly used coating method, including: directly sprayed on the surface of the material to be coated with rubber paint, using a sticky rider bag Glue material _ on the storage wire of (10). '_, Lishe said that the two types of plastic products formed by the two types of financial, (4) thermal expansion and contraction or wet money scales caused by insufficient adhesion and resulting in succession phenomenon. S, the current process of the process of the process of the major steps: a Γ - use the mold to form the material; - the material to be coated in the concave hole of the mold; - at high temperature to introduce the plastic material in the mold and the material to be coated In between the recessed holes; - Loose the encapsulated component from the recessed hole. This process is often used to encapsulate various electronic components. Generally, the rubberized material is a rubber material, and the material is a polymer bribe, such as ABS. (aeiyl. bell e butadiene styrene). The encapsulation process is carried out by soft (4) coating on the hard type, and the secret coating area is different. Therefore, it is necessary to open and set separate molds, first in the first After the return, the plastic parts are placed in the first set of fields for encapsulation. The way of placing the clothes is tight fit. The tightness of the hold will affect the yield. Generally speaking, the catch is loose. It is convenient for the molding personnel to work, but the yield is low, if the locking is tight, the forming personnel are less likely to work, but the yield is higher. The disadvantage of the above method is that two sets of molds are used, because each has a tolerance value. , so the yield and fine 801-A31088TWF (5.0) 5 i 1271 298 degrees directly depends on the mold factory technology and the experience of shooting waste, in addition to the poor molding surface, or _ air rm wear resistance is easy to be scratched; in addition, if the rubber and plastic adhesion is poor, more tear off and so on Poor degree _. In summary, the rubber wins 2 degrees lower and the more the axis type, the outside is also, if the mold temperature is increased, the nuclear wealth will be improved, and if the hunting is done by the cold water cooling department, the molding situation can be improved. However, the entire process time has to be lengthened. 7 If the shape variables generated by the fusion of two different materials are needed, it is necessary to look at the process of the surface process, the accuracy of the machine, the molding, and the inspection. Adjustments are made. In order to form a fully coated package, in addition to the above-mentioned process factors, if the surface of the molded transfer piece is to be fully covered, it cannot be directly recorded by the surface, and the momentum of the ride is corrected. The fixing of the miscellaneous tools is also the result of the problem. The development of a kind of encapsulation technology that can effectively achieve a comprehensive encapsulation effect is one of the main directions of the industry. [Inventive content] The object of the present invention is to provide a A fully encapsulated encapsulated molded article and a method of forming the same to provide a comprehensive coating method for effectively controlling process conditions to achieve a good encapsulation effect. In order to achieve the above object, the present invention provides a method for forming The method of fully coating the encapsulated molded article uses a material changer to form a polymer material; the polymer material is taken out and placed under a degree of 15-30 hours to stabilize the size of the polymer material; The molecular material is placed in a plastic mold with a concave hole; at the injection temperature of the chick 2i〇〇c, the injection speed (10) is emitted from the knife segment and the master-hardness 7〇·9() α is charged in the package. The recessed hole plastic mold 0801-A31088TWF (5.0) 6 1271298 has a medium 'to make the rubber-filled material fill the concave hole and cover one surface of the polymer material to form a rubberized layer' The material is a thermoplastic elastomer (TPE); the rubberized material is hardened. And, the encapsulated polymer material is taken out from the rubber mold and subjected to a cooling step to obtain a fully coated rubber molding. In order to achieve the above object, the present invention further provides a fully encapsulated encapsulated molded article, comprising: a polymer material; a coating layer covering at least one surface of the polymer material, the adhesive layer being a Thermoplastic glue he _ 〇 1) 1 off ^ 1_11 ^ 11 &gt; £). And an inter-melting layer is formed between the polymer material and the encapsulating layer by melting the polymer material and the encapsulating layer.

為使本發明之上述及其他目的、特徵、構造、功效和優點能更明顯易 懂,下文特舉數個較佳實施例,並配合所附圖式做詳細說明。 【實施方式】 清茶照第1圖,第1圖係顯示本發明之高分子素材之成型步驟示意圖, 其係糊-素機具1G成型—高分子储2G,射素材2G係以選用熱變 ^ ^ : ^nmipoly carbonate, PC)^ ABS (acrylonitrile butad職styrene);另外,若為前述物質之組合物則更佳。在本發明中為抗The above and other objects, features, structures, advantages and advantages of the present invention will become more apparent and understood. [Embodiment] Fig. 1 of the tea, Fig. 1 is a schematic view showing the molding steps of the polymer material of the present invention, which is a paste-based machine 1G molding-polymer storage 2G, and a projection material 2G system to select a heat change ^^ : ^nmipoly carbonate, PC)^ ABS (acrylonitrile butad styrene); further, it is more preferably a composition of the foregoing. In the present invention

衡後述包職健性騎包麟職生之⑽應力輕_題,因此素材 係以選用聚碳酸酯(poly carb〇nate,PC)加上A3S GE C28〇〇之複合材較佳, 其物性表如表一麟,素材2G更可視實際使科之需要,添加人殖n 補強劑、加工助劑、流動促進劑或顏料等其他添加劑。於素材20成 其取出並錄常溫25度左柏測树,使其尺核 ^ = 進行包膠作業。 貝《再 0801-A31088TWF(5.0) 7 1271298 GE C2800 物性表After the balance is described, it is better to use the polycarbonate (poly carb〇nate, PC) plus A3S GE C28 复合 composite material, and its physical properties are better. For example, Table 1 Lin, material 2G can be more practical to meet the needs of the department, adding human enzymes n reinforcing agents, processing aids, flow promoters or pigments and other additives. In the material 20, it is taken out and recorded at a normal temperature of 25 degrees, and the tree is measured to make the nucleus ^ = for the rubber-clad operation.贝"再0801-A31088TWF(5.0) 7 1271298 GE C2800 Property Table

IZOD 硬度 料管溫度 彈性強度 850 kg/gm2 熱變形温度IZOD hardness Tube temperature Elastic strength 850 kg/gm2 Heat distortion temperature

接著请茶照第2圖’第2圖係顯示本發明之包膠成型品之包膠步驟示 思圖。將素材20置於具有凹孔4〇之包勝模具3〇巾,利用公模具施之抓 銷(未圖不)將素材20固定於模穴中,並以公模具3〇a頂針定位,其配合方 式為緊配合。此外,公模具30a上更包括複數個貫穿之射膠孔6〇,而包膠· 模具之凹孔係位於母模具3〇b上。 接著仍請參照第2圖,以進行本發明之另一特徵步驟,在射出溫度 160-210°C下,經由該些射膠孔6〇以射出速度12_28 cm3/sec分段射出而注 入一硬度70_90A之包膠材料於公模具3〇a、母模具幾和欲包膠之素材2〇 間的凹孔40中,以形成包膠層5〇於素材2〇之一表面,其中更包括一素材 20與包膠層’50之互融層45形成於兩者間。上述分段射出之射出速度會依 實際狀況而有所不同,在本例中,以使用19〇噸pc專用射出機為例(最大 射出壓力2800Kg/cm2,最大射出速度95cm3/sec),可分成五段來進行射出,傷^ 弟 ^又為 15.2-17.1 cm3/sec,第二段為 ιι·4-12·35 cm3/sec,第三段為 11.4-23.75 cm3/sec,第四段為 ΐ5·2-23·75 Cm3/sec,第五段為 H.4-17.1 cm3/sec。上述射出溫度並以i85_205cC較佳,而包膠層5〇係一熱塑性膠材 (thermoplastic elastomer,TPE)。此外,於包膠過程中,母模具3〇b溫度係控 制在30-70°C,並以在35-45°C較佳,38-43。0更佳。公模具30b若跑普通 , 水係控制在10-3(TC,並以在15-25°C較佳、18-23°C更佳。上述射出時間 k 係以5_15秒較佳、10-12秒更佳;冷卻時間係以10_3〇秒較佳、20-30秒更 佳。 0801-A31088TWF(5.0) 8 1271298 於本發明中,包膠層50可為一熱塑性膠材,此熱塑性膠材可為:聚對 笨二曱酸二乙酯塑膠(polyethylenetherephthalate,PET)、聚壤酸鹽、聚酿胺、 聚酮、聚對苯二甲酸二丁酯塑膠(polybuthylenetherephthalate,PBT)、聚_酉同 8¾ 酮(polyetherketone etherketone ketone,ΡΕΚΕΚΚ)、聚鱗 g同酉同 (polyetherketone ketone,ΡΕΚΚ)、聚苯硫化物、聚苯乙醚、聚笨硫化楓、聚 楓、聚醚楓、聚醯亞胺、聚醚醯亞胺、聚醯胺醯亞胺、聚醯亞胺楓、熱塑 性聚胺基曱酸酯(thermoplastic polyurethane,TPU),或前述物質之組合物。 在本例中,係使用協祐公司出品之TPU85A,其物性如下:硬度為蕭氏硬度 A型87、比重U2、收縮率ι·〇_ι·8 %。此外,TPU85A並具有以下特性: 耐磨性佳(25mm2),抗撕裂性佳(7〇N/mm),抗張強度及延伸破斷率大,彎曲 強度佳,耐低温(-35〜50。〇,長期壓縮變形率低,耐油,耐潤滑油及耐脂 肪族碳氫有機溶劑,抗氧,抗臭氧及耐老化,耐·^。此外,τρυ85Α較佳 之實施條件為:乾燥溫度驗削。「乾燥_ 2_術、射出溫度195_22〇。0、 射出壓力30·18〇 kg/cm2、健3〇]4〇 kgW、被壓5_4〇 k於&amp;以及模溫 最後#錢第3圖,第3圖係顯示本發明之包膠成型品之剖面示^ 圖。於30-45T下硬化包騎料5〇。自包膠模具3〇取出已包膠的素材\ 得—全面包覆之包膠成形品7G,其中所形成之包膠厚心 2 2微米。此外’純膠成型品表面殘留有油_如··脫模劑),, 利用贺塗-層橡轉遮鱗不良面,骑—步地提升良率。 、 哭,:本形ΐ之包膠成型品7G可應用於顯示器、特別是平面顯示 之外' fw|4'(pDp)、有機發光顯示器(〇咖: 應用《他電器用品之=一^ 部上所述,猎由本發明之形成全面包覆之包膠成型品的方法,可得到 〇801-A31〇88TWF(5.0) 9 1271298Next, please refer to the second picture of the tea photo, Fig. 2, showing the encapsulation step of the encapsulated molded article of the present invention. The material 20 is placed on a Baosheng mold 3 towel having a concave hole 4〇, and the material 20 is fixed in the cavity by a male mold, and the ejector pin is positioned by the male mold 3〇a. The cooperation method is tight fit. In addition, the male mold 30a further includes a plurality of through-holes 6 贯穿, and the recesses of the plastic mold are located on the mother mold 3〇b. Then, referring to FIG. 2, another characteristic step of the present invention is performed. At the injection temperature of 160-210 ° C, a hardness is injected through the injection holes 6 〇 at an injection speed of 12_28 cm 3 /sec. The encapsulating material of 70_90A is in the concave hole 40 between the male mold 3〇a, the mother mold and the material to be coated, to form the rubberized layer 5 on one surface of the material 2, which further includes a material. 20 and the interlaminar layer 45 of the rubberized layer '50 are formed therebetween. The shooting speed of the above-mentioned segmental injection will vary depending on the actual situation. In this example, the use of a 19-inch pc-specific injection machine (maximum injection pressure of 2800 Kg/cm2, maximum injection speed of 95 cm3/sec) can be divided into Five segments are used for injection, and the injury ^ is also 15.2-17.1 cm3/sec, the second segment is ιι·4-12·35 cm3/sec, the third segment is 11.4-23.75 cm3/sec, and the fourth segment is ΐ5. · 2-23·75 Cm3/sec, the fifth paragraph is H.4-17.1 cm3/sec. The above-mentioned injection temperature is preferably i85_205cC, and the encapsulating layer 5 is a thermoplastic elastomer (TPE). Further, in the encapsulation process, the temperature of the master mold 3〇b is controlled at 30-70 ° C, and preferably at 35-45 ° C, more preferably 38-43. If the male mold 30b is running normally, the water system is controlled at 10-3 (TC, preferably at 15-25 ° C, preferably at 18-23 ° C. The above-mentioned injection time k is preferably 5-15 seconds, 10-12. Preferably, the cooling time is preferably 10_3 sec., more preferably 20-30 sec. 0801-A31088TWF(5.0) 8 1271298 In the present invention, the encapsulating layer 50 can be a thermoplastic rubber material, and the thermoplastic rubber material can be For: polyethylene anti-polyphthalate plastic (PET), poly-alkaline acid, poly-brown amine, polyketone, polybutylthenetherephthalate (PBT), poly- 酉 酉 83⁄4 Ketone (polyetherketone etherketone ketone, ΡΕΚΕΚΚ), polyscaleketone ketone (ΡΕΚΚ), polyphenyl sulfide, polyphenylene ether, polystyrene sulfide, poly maple, polyether maple, polyimine, polyether An imine, a polyamidimide, a polyimine maple, a thermoplastic polyurethane (TPU), or a combination of the foregoing. In this example, it is produced by Xieyou. TPU85A, its physical properties are as follows: hardness is Xiao's hardness A type 87, specific gravity U2, shrinkage ·〇_ι·8 %. In addition, TPU85A has the following characteristics: Good wear resistance (25mm2), good tear resistance (7〇N/mm), high tensile strength and elongation breakage, good bending strength , low temperature resistance (-35~50. 〇, long-term compression deformation rate, oil resistance, resistance to lubricating oil and aliphatic hydrocarbon-resistant organic solvents, anti-oxidation, anti-ozone and anti-aging, resistance · · · In addition, τρ υ 85 Α better implementation The conditions are: dry temperature inspection. "Dry _ 2_ surgery, injection temperature 195_22 〇. 0, injection pressure 30 · 18 〇 kg / cm 2, health 3 〇] 4 〇 kgW, pressed 5_4 〇 k in &amp; Temperature Finally #钱第3图, Fig. 3 shows a cross-sectional view of the encapsulated molded article of the present invention. The hardened package is 5〇 at 30-45T. The rubberized material is taken out from the rubberized mold 3〇 \得—All-coated rubber-coated molded product 7G, in which the thickness of the encapsulated rubber is 2 2 μm. In addition, 'the surface of the pure molded product has oil _如·· release agent), and the coating is layered The rubber turns to the scales, and rides to improve the yield. Cry, the 7G of this shape can be applied to the display, especially the flat display 'fw|4' (pDp ), organic light-emitting display (〇咖: Applying the method of “Electrical Appliances==1”, hunting the method of forming a fully encapsulated encapsulated molded article of the present invention, can obtain 〇801-A31〇88TWF(5.0) 9 1271298

具有良好包膠效果之句RA 包膠成型品60,純括彻本發财法卿紅全面包覆的 膠層50,勺扉^ ·回 材2〇、全面包覆素材2〇的一表面之包 : ' 已乡層〇係—熱塑性膠材(thermoplastic elastomer, ΤΡΕ),以及互 融層45 ’設置於素材20以及包膠層%之間。 及互 明’任何數個錄纽_露如上,純並非肋限定本發 本發明之^範圍些許之更動與_應不脫離本發明之範圍, …蔓乾1U視中請專利範圍所界^者及其均等物為準。 【圖式簡單說明】 第1圖係顯示本發明之高分子素材之成型步驟示意圖。 ^圖係顯示本發明之包膠成型品之包膠步驟示意圖。 第3圖係顯示本發明之包膠成型品之剖面示意圖。 【主要元件符號說明】 20〜素材; 30〜包膠模具; 30a〜公模具; 30b〜母模具; 40〜凹孔; 45〜互融層; 50〜包膠層; 60〜射膠孔; 70〜包膠成型品。 0801-A31088TWF(5.0) 10The phrase RA with a good encapsulation effect is 60 pieces of plastic molding. It is purely covered with a 50-layer adhesive layer of the full-fledged red, and the back of the material is 2〇, and the surface of the material is completely covered. Package: 'The thermoplastic layer (thermoplastic elastomer, ΤΡΕ), and the inter-melting layer 45' are placed between the material 20 and the encapsulation layer%. And mutual understanding 'any number of records _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ And their equivalents shall prevail. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a molding step of the polymer material of the present invention. The figure shows a schematic diagram of the encapsulation step of the encapsulated molded article of the present invention. Fig. 3 is a schematic cross-sectional view showing the encapsulated molded article of the present invention. [Main component symbol description] 20~material; 30~ plastic mold; 30a~ male mold; 30b~ mother mold; 40~ recessed hole; 45~ mutual fusion layer; 50~ rubberized layer; 60~ shot glue hole; ~ Plastic coated products. 0801-A31088TWF(5.0) 10

Claims (1)

127 12^%3134627號申請專利範圍修正本 修正曰期:95.4.25 一’™—一— -—— 十、申請專利範圍:(心正替換頁 1·一種形成全面包覆之包膠成型品的方法,包括·· 利用一素材模具成形一高分子素材; 取出該高分子素材,將其置於室溫下15-30小時以穩定該高分子素材之 尺寸; 將該高分子素材置入一具有凹孔之包膠模具中; 在射出溫度160-210°C下,以射出速度12-28cm3/sec分段射出而注入一 硬度70-90A之包膠材料於該具有凹孔之包膠模具中,以使該包膠材料填入 該凹孔中,並覆盖於該高分子素材之一表面而形成一互融層及一包膠層, 該互融層係該高分子素材與該包膠層互熔而形成,該包膠材料係一熱塑性 膠材(thermoplastic elastomer,TPE); 硬化該包膠材料;以及 自該包膠模具取出已包膠的高分子素材並施行一冷卻步驟,以得一全 面包覆之包膠成型品。 2·如申請專利範圍第丨項所述之形成全面包覆之包膠成型品的方法,其 中該包膠模具包括一公模具以及一母模具,該公模具上設置至少一抓銷以 將該高分子素材固定於該包膠模具的模穴中。 3. 如申請專利範圍第2項所述之形成全面包覆之包膠成型品的方法,其 中該公模具上更包括至少一貫穿該公模具之射膠孔。 4. 如申請專利範圍第2項所述之形成全面包覆之包膠成型品的方法,其 中該包膠模具之凹孔係位於該母模具上。 5·如申請專利範圍第2項所述之形成全面包覆之包膠成型品的方法,其 中進行包膠時母模之溫度大抵為3〇_7(rc,公模之溫度大抵為1〇_3〇它。 6·如申請專利範圍第!項所述之形成全面包覆之包膠成型品的方法,其 中該冷卻步驟係在溫度30_45。(:下冷卻2〇-3〇秒。 ’、 7_如申請專利範圍第丨項所述之形成全面包覆之包膠成型品的方法,其 0801-A31088TWF2 11 1271298 中該包膠層的厚度大抵為〇·6-2微米。 8.如申請專利範圍第1項所述之形成全面包覆之包膠成型品的方法,其 中該素材係聚碳酸酯(poly carbonate,PC)、ABS (acrylonitrile butadiene styrene)或前述物質之組合物。 9·如申請專利範圍第1項所述之形成全面包覆之包膠成型品的方法,其 中該熱塑性膠材(thermoplastic elastomer,ΤΡΕ)係擇自由聚對苯二甲酸二乙 酯塑膠(polyethylenetherephthalate,PET)、聚碳酸鹽、聚醯胺、聚_、聚對 苯二甲酸二丁 S旨塑膠(polybuthylenetherephthalate,PBT)、聚驗 _ 鱗 g同酮 (polyetherketone etherketone ketone, PEKEKK)、聚醚酮酮(polyetherketone ketone,ΡΕΚΚ)、聚苯硫化物、聚苯乙醚、聚苯硫化楓、聚楓、聚醚楓、聚 醯亞胺、聚醚醯亞胺、聚醯胺醯亞胺、聚醯亞胺楓、熱塑性聚胺基曱酸酯 (thermoplastic polyurethane,TPU),和前述物質之組合物所組成之族群。 10. 如申請專利範圍第1項所述之形成全面包覆之包膠成型品的方法, 其中該熱塑性膠材係一熱塑性聚氨基曱酸酯(thermoplastic p〇lyurethane, TPU) ° 11. 如申請專利範圍第1項所述之形成全面包覆之包膠成型品的方法, 其中該高分子素材更包括填充料、補強劑、加工助劑、流動促進劑或顏料。 12·如申請專利範圍第1項所述之形成全面包覆之包膠成型品的方法, 其中該包膠成型品係為液晶顯示器之一外觀構件。 13.如申睛專利範圍第12項所述之形成全面包覆之包膠成型品的方 法’其中該外觀構件係為液晶顯示器附設喇叭部之外殼。 0801-A31088TWF2 12127 12^%3134627 Application for the scope of patent amendments This revision period: 95.4.25 A 'TM-I---- Ten, the scope of application for patents: (Heart replacement page 1) A plastic coated molding that forms a comprehensive coating The method comprises: forming a polymer material by using a material mold; taking the polymer material and placing it at room temperature for 15-30 hours to stabilize the size of the polymer material; placing the polymer material in a In a plastic mold having a concave hole; at an injection temperature of 160-210 ° C, an injection molding material having a hardness of 70-90 A is injected in a section at an injection speed of 12-28 cm 3 /sec in the plastic mold having a concave hole. The encapsulating material is filled in the recessed hole and covers a surface of the polymer material to form an interbed layer and a clad layer, and the interpolymer layer is the polymer material and the encapsulation layer. Forming a layer of mutual fusion, the encapsulating material is a thermoplastic elastomer (TPE); hardening the encapsulating material; and taking the encapsulated polymer material from the encapsulating mold and performing a cooling step to obtain A fully coated encapsulated molded article. The method for forming a fully coated encapsulated molded article according to the invention of claim 2, wherein the overmold mold comprises a male mold and a female mold, and the male mold is provided with at least one scratch pin to the polymer material. The method of forming a fully-coated encapsulated molded article as described in claim 2, wherein the male mold further comprises at least one shot extending through the male mold 4. A method for forming a fully-coated encapsulated molded article as described in claim 2, wherein the recessed hole of the overmold is placed on the master mold. The method for forming a fully-coated encapsulated molded article, wherein the temperature of the master mold when the rubber is encapsulated is about 3 〇 7 (rc, and the temperature of the male mold is about 1 〇 3 〇 。 。 。 。 。 。 。 。 。 。 。 。 The method for forming a fully coated encapsulated molded article described in the scope of the patent application, wherein the cooling step is at a temperature of 30 to 45. (: cooling is performed for 2〇-3〇 seconds. ', 7_ as claimed in the patent scope The method of forming a fully coated encapsulated molded article as described in the item The thickness of the rubberized layer in the 0801-A31088TWF2 11 1271298 is substantially 〇6-2 μm. 8. The method for forming a fully coated encapsulated molded article according to the first aspect of the patent application, wherein the material Polycarbonate (PC), ABS (acrylonitrile butadiene styrene) or a combination of the foregoing. The method of forming a fully coated encapsulated molded article according to claim 1, wherein Thermoplastic elastomer (poly) is a polyethylene-polyethylene terephthalate (PET), polycarbonate, polyamide, poly-, polybutylene-terephthalate plastic (polybuthylenetherephthalate) , PBT), poly- ketone (polyetherketone etherketone ketone, PEKEKK), polyetherketone ketone (polyetherketone ketone, ΡΕΚΚ), polyphenyl sulfide, polyphenylene ether, polyphenyl sulfide, poly maple, polyether maple , polyimine, polyether oximine, polyamidimide, polyimine maple, thermoplastic polyurethane (TPU), and combinations of the foregoing The group of people. 10. The method of forming a fully coated encapsulated molded article according to claim 1, wherein the thermoplastic adhesive is a thermoplastic p〇lyurethane (TPU). The method for forming a fully coated encapsulated molded article according to the first aspect of the invention, wherein the polymer material further comprises a filler, a reinforcing agent, a processing aid, a flow promoter or a pigment. 12. The method of forming a fully-coated encapsulated molded article according to claim 1, wherein the encapsulated molded article is an appearance member of a liquid crystal display. A method of forming a fully-coated encapsulated molded article as described in claim 12, wherein the appearance member is an outer casing to which a liquid crystal display is attached with a horn. 0801-A31088TWF2 12
TW93134627A 2004-11-12 2004-11-12 A process for forming fully encapsulated over-molding products TWI271298B (en)

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