TWI230029B - Process for massively producing tape type flexible printed circuits - Google Patents

Abstract

A process for massively producing tape type flexible printed circuits is provided. A flexible insulted film is executed the operations of stacking, etching and insulating in reel-to-reel fashion. Thereafter, the film is pressed to form chain holes and cut along a parallel line of arrangement path of the chain holes to become several strips of flexible circuit tapes. Each flexible circuit tape with flexible printed circuits between two sides of chain holes is whirled on a reel.

Description

1230029

[Field of the Invention] The present invention relates to a mass production process of a film-type flexible circuit board, and particularly relates to a production process of a film-type flexible circuit board applied to an electrical connector, such as the electrical connection between a display driver and a display panel. Foldable = Fold the electrical connection between electronic components, even as a semiconductor package = chip carrier [such as flip chip on the film [Chip 〇n Flim] or tape carrier package [Tape Carrier Package]]. [Prior art] Flexible Printed Circuit,

FPC] is flexible and bendable, and is widely used for electrical connection between two electronic components. A flexible printed circuit board is disclosed in the Republic of China Patent Gazette Publication No. 4 2 2 9 3 3 In a liquid crystal display (Liquid Crystal Display, LCD) module, it is used as an electrical connection between the LCD panel and the rigid printed circuit board.

In the Republic of China Patent Gazette Bulletin No. 4 1 3 9 97 and US Patent No. 6, 2 10, 5 18, the manufacturing method of flexible printed circuit board is disclosed, but the above manufacturing method does not disclose the available The manufacturing process of mass production, so the manufacturing cost of flexible printed circuit boards cannot be effectively reduced. In addition, flexible printed circuit boards with a thickness of 0.2 mm or more have not met the demand in advanced electronic products. How to mass produce thicknesses below 0.2 mm [Flexible film type] Flexible circuit boards are a problem that needs urgent solution. [Objective and Summary of the Invention] The main object of the present invention is to provide a mass production process of a film-type flexible circuit board.

Page 6 1230029 V. Description of the invention (2) Form a metal circuit and a protective adhesive layer on the insulating insulating tape, and cut the flexible insulating tape along the parallel lines of the chain holes to form a plurality of smaller flexible circuit tapes. And rolled up on a reel to manufacture film-type flexible circuit boards in large quantities at low cost.

According to the mass production process of the film-type flexible circuit board of the present invention, a flexible insulating tape such as polyurethane, polyester, or aromatic polyamide fiber is continuously laminated with copper in a roll-to-roll manner. Box and dry film and set the first reference point, and then 'etch to form metal lines, and then continuously attach protective film, after surface treatment, punch holes to form chain holes and cut the flexible insulating tape along parallel lines of chain hole alignment, It is made into a plurality of flexible circuit tapes with a smaller width and rolled up on a roller. Each flexible circuit tape has a plurality of flexible circuit boards between the chain pockets on both sides. Preferably, after cutting, an electrical circuit is included. Inspection steps to detect flexible circuit tape and mark defective products. [Detailed description of the invention] Please refer to the attached drawings. The present invention will list the following examples: The block diagram of the mass production process of the film-type flexible circuit board of the present invention is shown in FIG. This is shown in Figures 2 to 8.

As shown in Figure 1, the mass production process of the film-type flexible circuit board according to the present invention mainly includes: "providing a flexible insulating tape" a, "continuously pressing copper pig and Lianlonghe dry film" b, "E Light-drying film "c," engraved copper foil "d," continuous bonding protective film "e," surface treatment "f," punching to form a chain hole and cutting soft / raw insulating tape "g &" electrical inspection " h and other steps. As shown in FIG. 2, in the step of “providing a flexible insulating tape” a, a flexible insulating tape 20 is prepared, which is flexibly wound on a reel, j,

Page 7 1230029 V. Description of the invention (3) The flexible insulating tape 20 is polyimide (PI), polyethylene terephalate (polyethylene terephalate, commonly known as "polyvinegar") ρ 1 Yester, PET], Polyethylene naphthalate (PEN), Liquid Crystal Polymer (LCP), or Teflon, PTFE. In this embodiment, the material The insulating tape 20 is a polyurethane tape, and its thickness is about 10 ~ 75 // m, and usually its thickness is about 25 // m ° In the step of "continuously laminating copper foil and continuous laminating dry film" b As shown in Figure 3a, first, the flexible insulating tape 20 is rolled out from one roll 11 and rolled up in another roll 11, and the copper foil 30 (copper foil) is also rolled out by a roll. A pressing roller 12 is formed between the two reels 11

[Lam i na tor], so that the copper foil 30 is pressed onto the flexible insulating tape 20 ′ and rolled up on another roll 11, wherein the thickness of the copper foil 30 is between 5 and 40 # m, usually The thickness is about 1 8 // m. After that, as shown in FIG. 3b, the soft insulating tape 20 having the copper foil 30 is rolled out by a roller η, and is pressed and dried with a pressing roller 12 '. Film 40 (dry film), wherein the dry film 40 is a photosensitive film, such as a positive photoresistor or a negative photoresistor, after continuous lamination, it will have a soft insulation of copper foil 30 and dry film 40 The adhesive tape 20 is wound up on the reel 11, preferably, after the lamination, a first reference point 21 with a fixed distance is set, such as punching a set hole, etc., so that the exposure of the dry film step is performed in another way In the example, the supplier can provide the soft insulating tape 20 laminated with the copper foil 30 directly, and only a dry film 40 can be laminated in the lamination step b. As shown in Figure 4, in the step of "exposed dry film" c, it is based on

1230029 V. Description of the invention (4) A fiducial point 21 is used to roll the flexible insulating tape 20 to an appropriate length and position it, and then develops the light to develop the dry film 40 to form a patterned dry film 41. The positioning of the first reference point 21, the flexible insulating tape 2 〇 Each light area has a fixed distance from the adjacent exposed area, and each exposed area is aligned consistently and neatly, without bit shifting phenomenon. As shown in Fig. 5, in the step of "carving copper foil" d, it is to roll out and etch the soft insulating tape 20 having a patterned dry film 41, for example, to vaporize a copper etchant to etch Remove the portion not covered by the patterned dry film 4 丨, so that the copper drop 30 forms a patterned metal circuit 3 丨, and then remove the patterned dry film 41 by an alkaline cleaning method, so that the metal circuit 31 is exposed. After drying and setting the second reference point 22, it is wound up to the reel u. In the step "e", it is to roll out the flexible insulating tape 20 with the metal circuit 31 formed thereon, and successively affix the protective film 50 by the pressure bonding method, and the protective film 50 is Polyimide [Polyimide, PI], polyester [Polyester, pET], pEN or other insulating materials, #thickness is about W0 ~ 75 // m, usually its thickness is about 5 " m, the The protective film 50 is formed with a hollow portion 53 and a reference hole in advance ", ♦

The reference hole 52 of the security film 50 is aligned with the flexible insulating tape 20 bis A point 22, and the protective film 50 is pressed, and the protective film 50 is formed on the flexible insulating tape 20.筻 层 51 〔cover laver 1, I, / Only s a ^ dyer J to protect the metal line 31 and make the connection end of the metal line 3 1 exposed ', or you er7 r .4 # 口 泪The protective layer 51 can also be printed with green paint (pnnung) or sprayed with green paint (spray). The square paint is a liquid photosensitive solder resist green paint [Li id ph 乂 liquid Photomagible Solder

As shown in Figure 6,

1230029

As shown in the figure, in the step of "punching to form a chain hole and cutting the flexible insulating adhesive / 8, it is to roll out the surface-treated soft insulating tape 20 and punch out to form an even number of relatively parallel chain holes 6 丨, For example, in this embodiment, the width of the flexible insulating tape 20 is sufficient to arrange three rows of film-type flexible circuit boards 62. Chain holes 6 1 ′ are punched on both sides of the film-type flexible circuit board in each row and along the chain holes. 6 丨 The arranged parallel parallel lines 23 are stripped into the flexible insulating tape 2 in a way of cutting or punching to form a plurality of flexible circuit tapes 6 with a small width, and rolled up in a roll. Wheel 13, and each flexible circuit tape 60 has a plurality of film-type flexible circuit boards 62 between the chain pockets 61 on both sides. After forming the flexible circuit tape 60, it is preferred to perform an electrical inspection step to Detecting soft circuit wins 60 and marking bad film-type flexible circuit board 62, usually through punching through holes in bad film-type flexible circuit board 62, does not need to separate or cut out defective products' Marked defective products are rolled up Round 丨 3. According to the above-mentioned mass production process of the film-type flexible circuit board, a plurality of single-layer circuits of the flexible circuit tape 60 can be prepared simultaneously. The cross-sectional structure of the film-type flexible circuit board 62 is shown in FIG. Advantages, 1230029 V. Description of the invention (6) and can use the same set of production equipment to produce film-type flexible circuit boards of different width specifications (such as 35mm, 48mm, 70mm and other width specifications), when you want to make wider or narrower film type For flexible circuit boards, use an electrical insulating tape with a width of about 2 50mm to perform the previous steps such as "continuously laminated copper foil and continuous laminated dry film" b, "exposed dry film" c, "etched copper foil" d, " "Continuous bonding of protective film" e, "surface treatment" f, etc., only need to change the cutting path of the cutting tool in the step of "punching to form a chain hole and cutting soft insulating tape" g to form a flexible circuit tape of an appropriate width. [For example, a flexible circuit tape 60 that can be cut and divided into three rolls of 70_ width, four rolls of 48mm width, or five rolls of 35mm width is manufactured from an electrically insulating tape with a width of 25min], so the present invention is capable of A set of production equipment mass-produces various types of film-type flexible circuit boards with different width specifications, which has the effect of mass production and elastic manufacturing, and the soft circuit tape 60 is rolled up on a roller 丨 3, which not only has low packaging costs but also Can provide customers with automated assembly. As shown in FIG. 9, according to the above-mentioned film-type flexible circuit board mass production process, the film-type flexible circuit board 62 obtained includes a flexible insulating layer 64 ′ whose material is selected from polyimide, ρι], Polyester [PET], Polyethylene naphthalate (PEN), Liquid Crystal Polymer [Lcp] or Teflon [PTFE], etc. The thickness of the layer 64 is between 1 () ~ 75, and a plurality of metal lines 3 and a protective layer 5 are formed on the flexible insulating layer 64. [For example, the method of bonding and pressing copper pigs with adhesive 63 [adheS1Ve], or The method of directly pressing the flexible insulation layer 64 to the steel box before curing], the thickness of the metal line 31

1230029 V. Description of the invention (7) = Electric 4H, the thickness of the protection Λ51 is formed on the hollow part 53 of the film-type protective layer 51, J: ° · 2mm ': the second line 31 is here, this can be mass-produced The adhesive layer 32 or the protruding electrode, because of the surface; the electrical connector with the circuit board, is widely used in LCD displays (handheld computers, palm-top computers) and mobile phones and other semiconductor packaged chips Carrier. In addition, the adhesive of the present invention is processed from the right side to the right side of the "continuously bonded protective film" 6 and the "surface flexible insulating tape 2 〇Λ to a metal circuit with an appropriate number of layers formed on the edge tape" g and " Electric Yu Jie was in "Punching to form a chain hole and cut the flexible circuit structure of the flexible circuit inspection tape-". "Later, you can prepare multiple pieces with multiple layers. Therefore, the companion of the present invention shall prevail. Anyone familiar with this ^ ^ see any changes made within the scope defined by the scope of the appended patent application" without departing from the present invention The spirit and the perimeter. 7 History and modification are all protected by the present invention. 1230029 Schematic illustration [Schematic description] Figure 1: Block diagram of the mass production process of the film-type flexible circuit board according to the present invention; Figure 2: According to the mass production process of the film-type flexible circuit board of the present invention, a perspective view of a roll of flexible insulating tape wound up is provided; Figure 3a: Mass-production process of the film-type flexible circuit board according to the present invention, The schematic side view of the flexible insulating tape in the step of continuously laminating copper foil; FIG. 3b: According to the mass production process of the film-type flexible circuit board of the present invention, the schematic side view of the flexible insulating tape in the step of continuously laminating dry film; Fig. 4: According to the mass production process of the film-type flexible circuit board of the present invention, a schematic side view of the flexible insulating tape in the exposure step; Fig. 5 ·· According to the mass-production process of the film-type flexible circuit board of the present invention, the Soft Schematic view of the side of the insulating insulating tape during the etching step;

FIG. 6: A side view of the film-type flexible circuit board according to the present invention in a mass production process. FIG. 7: A film-type flexible circuit board in accordance with the present invention. Side view of the flexible insulating tape in the surface treatment step; Figure 8: According to the mass production process of the film-type flexible circuit board of the present invention, the forward schematic view of the flexible insulating tape in the punching and cutting step; and Figure 9: The mass production process of the film-type flexible circuit board of the present invention produces a cross-sectional view of the film-type flexible circuit board. [Illustration of drawing number] a Provide soft insulation tape b Continuous lamination of copper foil and continuous lamination dry film

Page 13 13 Roller 22 Second reference point 32 Plating layer 5 0 Protective film 5 3 Hollow section 6 2 Film-type flexible circuit board

First reference point of lamination roller. Metal circuit patterned dry film standard L 1230029. Brief description of the figure. C. Exposed dry film. D. Engraved copper knot. E. Continuous bonding of protective film. F. Surface treatment. Tape h Electrical inspection 11 Roller 12 2 0 Flexible insulating tape 2 1 2 3 Cutting parallel lines 3 0 Copper foil 31 4 0 Dry film 41 51 Protective layer 52 6 0 Flexible circuit tape 61 Chain pocket 6 3 Adhesive 6 4 Flexible insulation Lldci gu

Page 14

Claims (1)

1230029 —L said · _ VI. Patent application scope 3. The mass production process of the film-type flexible circuit board as described in item 1 of the patent application scope. After the punching and cutting step (g), it further includes an electrical inspection step , Used to detect flexible circuit tape and mark defective products. 4, The film-type soft as described in item 1 of the scope of the patent application; the mass production process of the flexible circuit board 'wherein the flexible insulating tape is polyimide (PI), polyester [polyester] PET], Polyethylene n aphtha late (PEN), Liquid Crystal Polymer [LCP] or Teflon [PTFE] tape. 5. The mass production process of the film-type flexible circuit board according to item 1 of the scope of patent application, wherein the protective film is made of polyimide [PI] or polyester [PET]. .6. The mass production process of the film-type flexible circuit board according to item 1 of the scope of the patent application. After the remaining step (d), it further includes: setting a second reference point on the flexible insulating tape for Positioning of the protective film. 7. A flexible circuit tape having a plurality of film-type flexible circuit boards arranged in a series, each of the film-type flexible circuit boards includes: a flexible insulating layer having a thickness of 10 to 75 // m; a plurality of Metal lines formed on the flexible insulating layer, the thickness of which is 5 to 40 // m; a protective layer formed on the flexible insulating layer, the thickness of which is 10 to 7 5 // m, where the protection The layer system has cut-outs to expose the connection ends of the metal circuits; wherein the film-type flexible circuit boards in each line are formed in two Page 16 1230029 Amendment ^ ------ ventricular plate 911030S9 Sixth, the scope of patent application Side chain points. In the 8th warranty, please apply the soft circuit adhesive described in item 7 of the patent scope, wherein the two or two layers are a polyimide polyimide [p 丨], polyester [], or a photosensitive solder mask green paint. Of protective layer. 9 The flexible circuit tape according to item 7 of the scope of the patent application, wherein a plating layer or a protruding electrode is formed on the exposed connection end of the subordinate circuit. A mass production process of a film-type flexible circuit board, the steps include: (a) providing a flexible insulating tape, a copper foil is formed on the surface, and it is rolled up on a roll; (b) after the flexible insulating tape is rolled out by a reel, the dry film is continuously laminated on the soft insulating tape, and then rolled up in a reel; and (c) after the soft insulating tape is rolled out by the reel, the light is continuously exposed The dry film is rolled up on a reel; (d) After the soft insulating tape is rolled out by the roll, the copper foil is etched to form a circuit pattern and the dry film is removed, and then rolled up on a roll; (e) by After the roller rolls out the soft insulating tape, a protective layer is formed on the soft insulating tape, and then it is rolled up in a roll; (f) after the soft insulating tape is rolled out by a reel, the soft insulating tape is surface treated, and then rolled up in a reel; and (g) the punching project is performed after the soft insulating tape is rolled out by the reel. The soft insulating tape forms keyholes in an even number of rows, and cuts or punches the soft insulating tape along parallel lines of the chain hole arrangement to form a plurality of smaller flexible circuit tapes, which are rolled up on a reel. And each flexible circuit tape has a plurality of chain holes on both sides Page 17 1230029 "Repair" 91103QR9 year I patent application scope 1 film-type flexible circuit board. 2. The mass production process of the film-type flexible circuit board as described in Item 10 of the scope of the patent application, wherein steps (b) to (f) are repeatedly performed until a proper number of metal lines are formed on the flexible insulating tape. . 1 2: According to the film-type flexible circuit board described in the scope of the patent application, the production process, after the punching and cutting step (g), it further includes an electrical inspection step to detect and mark the flexible circuit tape Defective. 13: The mass production process of the film-type flexible circuit board as described in the item No. 丨 0 of the patent application scope, wherein the step (6) of forming a protective layer is a protective film bonding, green paint printing or green paint spraying. 14. According to the mass production process of the film-type flexible circuit board described in Item 10 of the scope of the patent application, wherein the flexible insulating tape is polyimide [PI], polyester [PIYester, pet ], Tape of polyethylene naphthalate (PEN), liquid crystal polymer [Liquid Crystal LCP] or Teflon [Tefion, pTFE]. 15. The mass production process of the film-type flexible circuit board as described in item 10 of the scope of the patent application, wherein the protective layer is made of polyimide [ρι], polyester [PET] or a photosensitive solder mask green paint.