TW278200B - Door drive mechanisms for substrate carrier and load lock - Google Patents

Door drive mechanisms for substrate carrier and load lock

Info

Publication number
TW278200B
TW278200B TW084109347A TW84109347A TW278200B TW 278200 B TW278200 B TW 278200B TW 084109347 A TW084109347 A TW 084109347A TW 84109347 A TW84109347 A TW 84109347A TW 278200 B TW278200 B TW 278200B
Authority
TW
Taiwan
Prior art keywords
load lock
carrier
lock chamber
door
wafers
Prior art date
Application number
TW084109347A
Other languages
Chinese (zh)
Inventor
S Muka Richard
W Pippins Michael
A Drew Mitchell
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/498,859 external-priority patent/US5607276A/en
Priority claimed from US08/499,069 external-priority patent/US5613821A/en
Priority claimed from US08/498,597 external-priority patent/US5609459A/en
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Application granted granted Critical
Publication of TW278200B publication Critical patent/TW278200B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A system is provided for batch loading semiconductor wafers into a load lock from a portable carrier used for supporting a plurality of the wafers in spaced, stacked, relationship and transporting them, possibly in a particle free environment. The carrier is supported adjacent a load lock chamber which may alsohave a particle free environment. A multilevel end effectorassociated with the load lock chamber includes a plurality ofspaced end effector sets, each set being adapted to support awafer thereon and aligned with an associated wafer supported inthe carrier. The wafers are engaged and simultaneously retrieved as a grouping, then held in the load lock chamber for subsequenttransport, one at a time, into an adjacent transport chamber for delivery to a specified one of a plurality of processing stations of a cluster tool. An isolation housing or mini-environment sealingly isolates the load lock chamber and the interior of the carrier from the surrounding atmosphere. After transfer of the plurality of wafers from the carrier to the load lock chamber, the carrier and the load lock chamber are sealed and the load lock chamber and transport chambers are evacuated. A variety of mechanisms are provided for moving the end effector sets, both elevationally and into and out of the carrier and load lock chamber, and for moving a carrier door and a load lock door between closed, sealed, positions and open positions and to a parked position remote from the region between the carrier and the load lock chamber. Mechanisms are also provided for individually moving a carrier door and a load lock door between closed, sealed, positions and open positions and then, as a unit, to a parked position remote from the region between the carrier and the load lock chamber.
TW084109347A 1995-07-06 1995-09-07 Door drive mechanisms for substrate carrier and load lock TW278200B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US49898795A 1995-07-06 1995-07-06
US08/498,859 US5607276A (en) 1995-07-06 1995-07-06 Batchloader for substrate carrier on load lock
US08/499,069 US5613821A (en) 1995-07-06 1995-07-06 Cluster tool batchloader of substrate carrier
US08/498,597 US5609459A (en) 1995-07-06 1995-07-06 Door drive mechanisms for substrate carrier and load lock

Publications (1)

Publication Number Publication Date
TW278200B true TW278200B (en) 1996-06-11

Family

ID=27504398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084109347A TW278200B (en) 1995-07-06 1995-09-07 Door drive mechanisms for substrate carrier and load lock

Country Status (7)

Country Link
EP (1) EP0886617A1 (en)
JP (1) JP4306798B2 (en)
KR (1) KR19990028767A (en)
CN (1) CN1195332A (en)
AU (1) AU6408996A (en)
TW (1) TW278200B (en)
WO (1) WO1997002199A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818806A3 (en) * 1996-07-12 1999-12-29 Motorola, Inc. Method and apparatus for transporting and using a semiconductor substrate carrier

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
DE19805624A1 (en) * 1998-02-12 1999-09-23 Acr Automation In Cleanroom Lock for opening and closing clean room transport boxes
US6610150B1 (en) * 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
JP4628530B2 (en) * 2000-08-25 2011-02-09 株式会社ライト製作所 Transport container lid attaching / detaching device
SG115630A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
KR101131417B1 (en) * 2003-11-12 2012-04-03 주성엔지니어링(주) Loadlock and loadlock chamber using the same
JP4748816B2 (en) * 2008-11-28 2011-08-17 Ｔｄｋ株式会社 Closed container lid opening and closing system
JP5279576B2 (en) * 2009-03-27 2013-09-04 大日本スクリーン製造株式会社 Substrate processing equipment
JP4919123B2 (en) 2010-03-08 2012-04-18 Ｔｄｋ株式会社 Processing substrate storage pod and lid opening / closing system of processing substrate storage pod
US10741432B2 (en) * 2017-02-06 2020-08-11 Applied Materials, Inc. Systems, apparatus, and methods for a load port door opener
US10510573B2 (en) * 2017-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Loading apparatus and operating method thereof
KR102200250B1 (en) * 2020-05-29 2021-01-11 주식회사 싸이맥스 Load port module provided with a Foup loadlock door, and a method for opening and closing the Load port module door and the Foup loadlock door
KR102247183B1 (en) * 2020-05-29 2021-05-04 주식회사 싸이맥스 Wafer processing equipment with efficient installation area
CN114777490B (en) * 2022-06-21 2022-09-09 上海陛通半导体能源科技股份有限公司 Semiconductor device capable of realizing automatic omnidirectional opening and closing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4550242A (en) * 1981-10-05 1985-10-29 Tokyo Denshi Kagaku Kabushiki Kaisha Automatic plasma processing device and heat treatment device for batch treatment of workpieces
JPH0461146A (en) * 1990-06-22 1992-02-27 Mitsubishi Electric Corp Shifter for semiconductor wafer
JPH04206547A (en) * 1990-11-30 1992-07-28 Hitachi Ltd Interdevice transfer method
JP3275390B2 (en) * 1992-10-06 2002-04-15 神鋼電機株式会社 Portable closed container circulation type automatic transfer system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818806A3 (en) * 1996-07-12 1999-12-29 Motorola, Inc. Method and apparatus for transporting and using a semiconductor substrate carrier

Also Published As

Publication number Publication date
EP0886617A1 (en) 1998-12-30
WO1997002199A1 (en) 1997-01-23
KR19990028767A (en) 1999-04-15
JP4306798B2 (en) 2009-08-05
CN1195332A (en) 1998-10-07
JPH11513006A (en) 1999-11-09
AU6408996A (en) 1997-02-05

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