201029199 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種太陽能模組之安裝方法，特別是 才曰種將了塑形的太陽能模組安裝於建築物外部、車頂或 任何待安裝物體上之安裝方法。 【先前技街】 以往太陽能模組大約呈矩形平板狀，其結構主要包 3數個呈陣列式排列連接的太陽能晶片、一個設置於太 陽能晶片的上方的第一基板、一個設置於該等太陽能晶片 的下方的第二基板，以及一個位於第一、二基板間並包覆 2該等太陽能晶片的外周的封裝膠。其中，該第―基板必 需為具有高度透光性之基板，通常使用玻璃基板。該第二 基板之材質則較無限帝j，可以為玻璃、金^，或者是塑膠 基板’因&第二基板可以使用可撓性基板。由於上述太陽 能模組呈平板&，而且其第一基板之玻璃材質不具可撓 性，使得該太陽能模組無法隨意彎曲，造成該太陽能模組 之安裝地點受到限制，一般僅能於平面式的地點安裝，例 如平面式的建築物外牆或屋頂。 然而，近年來太陽能模組之應用日益廣泛，因此逐漸 被開發運用在各種物件上，但是並非所有待安裝物件的表 面都呈平面狀，例如有些汽車的車頂會加裳太陽能模組， 以便將太陽能轉換成電能並提供給汽車内部的電子產品 使用，而一般汽車之車頂設計就不是平面狀，將平板狀的° 太陽能模組安裝於非平面狀的車頂時，不僅安裝的困難度 3 201029199 較高，而且太陽能模組無法順著車頂弧度而貼合安裝，亦 會破壞車體之美觀性。由上述說明可知，開發出—種可以' 順著物件之弧曲形狀而安裝太陽能模組之方法，相當重 要。 * 【發明内容】 因此，本發明之目的，即在提供一種可以順應物件表 面弧度而安裝的可塑形太陽能模組之安裝方法。 於是，本發明可塑形太陽能模組之安裝方法，包含： (A) 提供一太陽能模組，所述太陽能模組包括—個位於 頂部的第一基板，該第一基板為熱可塑性材質所製成； (B) 將該太陽能模組設置在一個待安裝物上；及 (C) 加熱該太陽能模組，使該第一基板軟化，該太陽能 模組即順應該待安裝物之外型而安裝。 第一 其中，步驟（C)可以採用單一階段的加熱方式，而且當 基板選用不同材料時會有不同的軟化溫度，因此適用 於步驟（C)之加熱溫度為30~20(rc。此外，亦可以採用兩 溫度以預熱並維持 此第二溫度大於第 階段式加熱，第一階段先加熱至一第一 數分鐘，第二階段加熱至一第二溫度， —溫度並且能使第一基板軟化，本發明實施例的第一溫度 為9(TC ’第二溫度為12(rc，但本發明不以上述溫度^ 制’只要該第二溫度大於第一溫度即可。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中將可 201029199 清楚的呈現。 參閱圖1、2、3,本發明可塑形太陽能模組之安裳方 法之較佳實施例’將一太陽能模組1安裝於一待安裝物2 之表面，而且當該待安裝物2的表面為曲面時，適用本發 明之安裝方法來安裝太陽能模組1，但是本發明不限於弧 曲的安裝表面’平面式的安裝表面亦可使用本發明之方 法，而本實施例之方法包含：201029199 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method for installing a solar module, in particular, a solar module mounted on a building exterior, a roof or any other The installation method on the installation object. [Previous technology street] In the past, the solar module has a rectangular flat shape, and its structure mainly includes three solar arrays arranged in an array, a first substrate disposed above the solar wafer, and a solar wafer disposed on the solar wafer. The lower second substrate, and an encapsulant located between the first and second substrates and covering the outer periphery of the solar wafers. Among them, the first substrate must be a substrate having high light transmittance, and a glass substrate is usually used. The material of the second substrate is more infinite, and may be glass, gold, or a plastic substrate. As the second substrate, a flexible substrate can be used. Since the solar module is a flat panel and the glass material of the first substrate is not flexible, the solar module cannot be bent at will, and the installation location of the solar module is limited, generally only in a planar manner. Location installation, such as a flat building facade or roof. However, in recent years, the application of solar modules has become more and more extensive, so it has been gradually developed and applied to various objects, but not all surfaces of objects to be mounted are flat. For example, some car roofs will be equipped with solar modules, so that Solar energy is converted into electric energy and supplied to the electronic products inside the car. The roof design of the general car is not flat. When installing the flat solar module on a non-planar roof, it is not only difficult to install. 201029199 is higher, and the solar module can't fit along the roof arc, which will also damage the aesthetics of the car body. As can be seen from the above description, it has become important to develop a method of mounting a solar module along the curved shape of the object. * SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of mounting a shapeable solar module that can be mounted to conform to the curvature of an object surface. Therefore, the method for installing the shapeable solar module of the present invention comprises: (A) providing a solar module, the solar module comprising: a first substrate at the top, the first substrate being made of a thermoplastic material (B) placing the solar module on a to-be-installed object; and (C) heating the solar module to soften the first substrate, and the solar module is mounted in conformity with the shape to be mounted. In the first step, the step (C) can adopt a single-stage heating method, and when the substrate is made of different materials, there are different softening temperatures, so the heating temperature suitable for the step (C) is 30 to 20 (rc. Two temperatures may be employed to preheat and maintain the second temperature greater than the first stage heating, the first stage is first heated to a first few minutes, the second stage is heated to a second temperature, the temperature is allowed to soften the first substrate The first temperature of the embodiment of the present invention is 9 (TC 'the second temperature is 12 (rc, but the present invention does not use the above temperature control' as long as the second temperature is greater than the first temperature. [Embodiment] The foregoing and other technical contents, features and effects of the present invention will be apparently shown in the following detailed description of a preferred embodiment of the reference drawings. Referring to Figures 1, 2, and 3, the shapeable solar module of the present invention A preferred embodiment of the method for mounting a solar module 1 is mounted on the surface of a workpiece 2 to be mounted, and when the surface of the object to be mounted 2 is curved, the mounting method of the present invention is applied for installation. The solar module 1, but the invention is not limited to the curved mounting surface. The planar mounting surface can also use the method of the present invention, and the method of this embodiment includes:
(1)進行步驟61 :提供該太陽能模組丨，該太陽能模組 1在尚未安裝時為平板狀，並且包含：數個呈陣列式排列 連接的太陽能晶片11、一個設置於太陽能晶片u的上方 的第一基板12、一個設置於該等太陽能晶片丨丨的下方的 第二基板13，以及一個位於第一、二基板12、13間並包 覆該等太陽能晶片11的封裝膠14。所述太陽能晶片U皆 包括一條左右間隔地設在表面並約呈黑色的膠帶工u，由 於每-太陽能晶片11都設有二條用來和相鄰之晶片電連(1) Step 61: Providing the solar module 丨, the solar module 1 is flat when not installed, and includes: a plurality of solar wafers 11 arranged in an array, one disposed above the solar wafer u The first substrate 12, a second substrate 13 disposed under the solar wafer cassettes, and an encapsulant 14 between the first and second substrates 12, 13 and covering the solar wafers 11. The solar wafers U each include a tape disposed on the surface at intervals of about black, and each of the solar chips 11 is provided with two strips for electrically connecting to adjacent wafers.
接的導線’而膠帶U1黏貼於導線上方並將導線遮播住， 使晶片呈現較為美觀之表面D 該第一基板12可以為單一或至少二種以上之環氧樹 脂混合製成’並且具有熱可塑形性，第—基板12之材料 組成可視其使料境㈣配各成分比例，並且在溫度 30〜贿時可被軟化。所述第—基板12之材料選自下列： 脂肪族縮水甘油醋型環氧樹脂、脂肪族縮水甘油醚型環氧 樹脂、脂環族型環氧樹脂，及上述之一組合。用於混合盘 固化上述環氧樹脂所搭配使用的固化劑為有機酸針固化 5 201029199 劑’並選自下列有機酸酐：四氫鄰苯二甲酸酐、六氫鄰苯 二曱酸酐、曱基四氫鄰苯二甲酸酐、甲基六氫苯二曱酸 酐’及上述之一組合。該第二基板13為塑膠製成的可撓 性薄膜基板，其材質例如鐵氟龍、聚乙烯（polyethylene, PE)乙締 _四氟乙稀共聚物（ethylene-tetrafluoroethylene， ETFE)、聚氟乙烯聚合物（Tedlar)等，且第二基板13的厚 度為0.010mm〜〇.5mm。本發明第二基板13可以如實施例 所述而使用可撓性基板，另外，亦可以使用可受熱軟化之 材質製成。所述封裝膠14之材料是選自：乙烯醋酸乙烯 共聚物（EVA)、聚乙烯醇縮丁醛（pvB)，或熱塑性聚胺基甲 酸酯（TPU)。 (2)進行步驟62:首先在該待安裝物2的表面塗佈一 層熱溶膠層3’續將太陽能模組1擺放在該熱熔膠層3的 上方。 ⑶進行步驟63 :由於第二基板13為可撓性基板，所 以本來就可以彎曲，而第—基板12 $熱可塑形性，所以 此加熱步較為了使該第—基板12成為可塑形之軟化狀 態’才能將該太陽能模組！塑形而順著待安裝物2的表面 曲度而貼合安裝’&步驟包含以下子步驟： (31)首先取—石夕膠製成的電熱片4,並將該電熱片4 接上一圖未示出的電源供寤# ^ ^ 电々供應，透過電源供應器輸入電流 至該電熱片4，使電執片4 ♦、田庙 …、月4之度升尚至一第一溫度並維 持5分鐘，本實施例之第_、、田 币 /皿度為90 C，此步驟用於將電 熱片4預熱。 201029199 (3_2)將預熱到90°C的電熱片4覆蓋在第一基板12之 表面，並在該電熱片4的表面覆蓋—片加壓片5，本實施 例之加壓片5為石夕謬製成之可耐熱柔軟材質，其耐熱溫度 、約為150C ’厚度約為2公分。在此步驟中，電熱片4之 . 熱能會傳遞到該太陽能模組1與熱熔膠層3，因此太陽能 模組1之第一基板12及該熱熔膠層3會初步受熱而軟化。 此外，藉由加壓片5之重量施加於該太陽能模組丨，使太 陽能模組1加熱塑形時，能受到重物壓迫而順應待安裝物 馨 2之表面曲度而貼合，避免模組在塑形過程中有翹曲現象 產生。 (3-3)調升該電源供應器之電流流量，使該電熱片4溫 度升尚至一第二溫度並維持2分鐘，本實施例之第二溫度 為120°C。在此步驟中，太陽能模組i之第一基板12及該 熱熔膠層3皆受熱而完全呈現軟化狀態，此時受到上方之 加壓片5之重量下壓，該太陽能模組i會順著該待安裝物 2之表面曲度而貼合。 ❹ （4)進行步驟64 .碟認該太陽能模組1與待安裝物2 密合之後，關掉該電源供應器之電源，並將太陽能模組j 靜置10分鐘以等待其冷卻，該熱熔膠層3冷卻固化後， 該太陽能模組1就固定地結合於該待安裝物2的表面，而 第一基板12冷卻固化後’已被塑形成弧曲狀。 (5)進行步驟65 :確認太陽能模組i之溫度已低於9〇 °C，再將該等電熱片4與加壓片5移開，如此該太陽能模 組1即安裝完成’最後再檢查模組之安裝貼合是否有缺陷。 7 201029199 * 需要說明的是，本實施例之加熱步驟分為兩個階段， 先加熱到第一溫度9(rc預熱並維持數分鐘之後，再加熱到 第二溫度12(TC，但是本發明實施時，也可以為單一階段 的加熱方式，亦即直接將電熱片4加熱到12〇。(：時，就蓋 上加壓片5,或者電熱片4與加壓片5依序覆蓋後再作加 熱動作亦可。此外，加熱步驟之進行方式不限於本實施例 之方式，例如也可以將一個紅外線加熱燈直接照射該太陽 能模組1’使模組溫度升高，達到該第一基板12之軟化溫 度，另外，也可以利用一圖未示出之熱風搶朝該太陽能模 組1吹送熱風，如此也可以達到加熱效果。 綜上所述，本發明藉由該第一基板12由環氧樹脂材 料製成，於適當的溫度作用下會軟化而可變形，因此將該 太陽能模組1設置於待安裝物2的表面之後，對該太陽能 模組1加熱，即可使太陽能模組1順著該待安裝物2之表 面曲度而貼合地安裝，應用本發明之安裝方法，使太陽能 模組1之安裝地點不受限制，打破傳統只能侷限於平面式 物件之缺失，因此本發明可應用的安裝地點較為廣泛，確 實達到本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一太陽能模組之剖視示意圖； 201029199 圖2是一方塊流程示意圖，顯示本發明可塑形太陽能 模組之安裝方法之一較佳實施例的各步驟，並且用於將圖 1之太陽能模組安裝於一待安裝物上；及 圖3是該較佳實施例進行時的裝置示意圖。 201029199 【主要元件符號說明】 I ......…太陽能模組 II —…“太陽能晶片 111…“膠帶 12.....…·第一基板 13"…—第二基板 14.........封裝膠 2 —……待安裝物 3 *.......熱溶膠層 4 ·………電熱片 5 *… + "-**加壓片 61〜65 μ步驟The wire U1 is adhered to the wire and the wire is covered, so that the wafer presents a more beautiful surface D. The first substrate 12 can be made of a single or at least two epoxy resins mixed together and has heat. The shape of the material of the first substrate 12 can be made to make the material (four) match the proportion of each component, and can be softened at a temperature of 30 to bribe. The material of the first substrate 12 is selected from the group consisting of an aliphatic glycidol vinegar type epoxy resin, an aliphatic glycidyl ether type epoxy resin, an alicyclic type epoxy resin, and a combination thereof. The curing agent used in the mixing disc to cure the above epoxy resin is an organic acid needle curing 5 201029199 agent' and is selected from the following organic acid anhydrides: tetrahydrophthalic anhydride, hexahydrophthalic anhydride, fluorenyl four Hydrogen phthalic anhydride, methyl hexahydrophthalic anhydride' and a combination of the above. The second substrate 13 is a flexible film substrate made of plastic, such as Teflon, polyethylene (PE), ethylene-tetrafluoroethylene (ETFE), and polyvinyl fluoride. A polymer (Tedlar) or the like, and the thickness of the second substrate 13 is 0.010 mm to 55 mm. The second substrate 13 of the present invention may be a flexible substrate as described in the embodiment, or may be made of a material which can be softened by heat. The material of the encapsulant 14 is selected from the group consisting of ethylene vinyl acetate copolymer (EVA), polyvinyl butyral (pvB), or thermoplastic polyurethane (TPU). (2) Step 62 is performed: first, a layer of hot sol layer 3 is applied to the surface of the object to be mounted 2, and the solar module 1 is placed on top of the hot melt adhesive layer 3. (3) Step 63: Since the second substrate 13 is a flexible substrate, it can be bent originally, and the first substrate 12 is thermally deformable, so that the heating step makes the first substrate 12 softenable. State 'can only use this solar module! Forming and fitting along the surface curvature of the object to be mounted 2 '& steps include the following sub-steps: (31) First, take the electric heating sheet 4 made of Shixi glue, and connect the electric heating sheet 4 A power supply not shown in Fig. # ^ ^ is supplied by electric power, and the current is input to the heating sheet 4 through the power supply, so that the electric power meter 4 ♦, Tian Temple..., the degree of the month 4 is raised to a first temperature. And maintaining for 5 minutes, the first _, the field currency / dish degree of this embodiment is 90 C, this step is used to preheat the heating sheet 4. 201029199 (3_2) The heating sheet 4 preheated to 90 ° C is covered on the surface of the first substrate 12, and the surface of the heating sheet 4 is covered with a sheet pressing sheet 5, and the pressing sheet 5 of the present embodiment is a stone. The heat-resistant and soft material made of Xixi has a heat-resistant temperature of about 150 cm and a thickness of about 2 cm. In this step, the thermal energy of the heating sheet 4 is transmitted to the solar module 1 and the hot melt adhesive layer 3, so that the first substrate 12 of the solar module 1 and the hot melt adhesive layer 3 are initially heated and softened. In addition, when the weight of the pressing piece 5 is applied to the solar module 丨, when the solar module 1 is heated and shaped, it can be pressed by the weight to conform to the surface curvature of the object 2 to be mounted, and the mold is avoided. The group has warpage during the shaping process. (3-3) The current flow rate of the power supply is raised so that the temperature of the heater chip 4 is raised to a second temperature for 2 minutes, and the second temperature of the embodiment is 120 °C. In this step, the first substrate 12 of the solar module i and the hot melt adhesive layer 3 are all heated and fully softened. At this time, the weight of the upper pressing piece 5 is pressed down, and the solar module i is smoothed. The surface curvature of the object to be mounted 2 is attached to it. ❹ (4) proceed to step 64. After the solar module 1 is in close contact with the object to be mounted 2, turn off the power of the power supply, and let the solar module j stand for 10 minutes to wait for the cooling, the heat After the molten layer 3 is cooled and solidified, the solar module 1 is fixedly bonded to the surface of the object to be mounted 2, and the first substrate 12 is cooled and solidified and has been shaped into an arc shape. (5) Step 65: confirm that the temperature of the solar module i is lower than 9 ° C, and then remove the heating sheet 4 and the pressing sheet 5, so that the solar module 1 is installed and finished 'final re-inspection Whether the module is fitted or not is defective. 7 201029199 * It should be noted that the heating step of this embodiment is divided into two stages, first heating to the first temperature 9 (rc is preheated and maintained for several minutes, and then heated to the second temperature 12 (TC, but the invention In the implementation, it can also be a single-stage heating method, that is, directly heating the heating sheet 4 to 12 〇. (: When the pressure piece 5 is covered, or the heating sheet 4 and the pressure piece 5 are sequentially covered, In addition, the manner in which the heating step is performed is not limited to the embodiment. For example, an infrared heating lamp may directly illuminate the solar module 1 ′ to raise the temperature of the module to reach the first substrate 12 . In addition, the hot air can also be blown toward the solar module 1 by hot air not shown in the figure, so that the heating effect can also be achieved. In summary, the present invention is made of the first substrate 12 from epoxy. The resin material is made to soften and deform under the action of a suitable temperature. Therefore, after the solar module 1 is placed on the surface of the object to be mounted 2, the solar module 1 is heated to make the solar module 1 Waiting The surface curvature of the package 2 is mounted in a snug manner, and the installation method of the present invention is applied to make the installation location of the solar module 1 unrestricted, and the breaking tradition can only be limited to the absence of the planar object, so the present invention can be applied. The installation site is more extensive and does achieve the object of the present invention. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the scope and invention of the invention according to the present invention. The simple equivalent changes and modifications of the descriptions are still within the scope of the present invention. [Simplified Schematic] FIG. 1 is a schematic cross-sectional view of a solar module; 201029199 FIG. 2 is a block flow diagram, Illustrating the steps of a preferred embodiment of a method of mounting a shapeable solar module of the present invention, and for mounting the solar module of FIG. 1 on a to-be-installed object; and FIG. 3 is when the preferred embodiment is performed Schematic diagram of the device. 201029199 [Explanation of main component symbols] I .........Solar module II -... "Solar wafer 111..." Tape 12........·First Substrate 13"...-Second substrate 14...Package 2 -......To be mounted 3 *.......Hot sol layer 4 ·.........Electric heating sheet 5 *... + "-**Pressure film 61~65 μ steps
1010