200822974 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種流體喷射裝置，尤其涉及_種通過改 良的結構，引導流體朝垂直方向喷射，使得流體能夠喷射 在基板的整個表面上，從而提高對基板的處理效率之流體 喷射裝置。 【先前技術】 通常，流體噴射裝置是在基板表面噴射藥液等流體的 Γ 裝置。這種流體喷射裝置根據其用途可應用在不同的領 域。 即，可應用於在基板上塗敷藥液以形成塗層的塗敷裝 置，或者可應用在通過噴射清洗液以去除基板上雜質的清 洗裝置等各種裝置上。 圖1是習知流體噴射裝置中噴嘴結構示意圖。 如圖1所示，流體噴射裝置的喷嘴κ設置在基板G的 上邛。並且，通過噴嘴κ向基板G的上面喷射流體w。 因此，可通過從所述噴嘴K噴射出的流體w，對基板 G進行清洗作業或塗敷作業等。 士但是，習知的流體噴射裝置，當通過喷嘴κ喷射出流 Τ時’由於組成流體的分子之間的引力而産生表面張力， k而導致流體向基板内侧方向傾斜一定角度0的現象。 曰因此，習知技術存在流體無法喷射到基板邊緣部E的 =題。而爲了解決這一問題，需要加長流體喷射裝置的噴 5 200822974 【發明内容】 本發明鑒於上述問題而作，1曰μ + 向忭其目的在於提供一種通 過改良流體喷射裝置的嘻嘴4士禮 幻1寅、、、口構’以使從喷嘴喷射出的 流體朝垂直方向均句噴射的流體噴射裝置。 本發明的另一目的在於，接处 ^ . 刃在於，徒供一種能夠向基板垂直 喷射流體，且具有和基柘县声知料處μ + π 4吞敬長厪相對應的噴嘴長度的流體 喷射裝置，從而縮小噴嘴尺寸。200822974 IX. The invention relates to a fluid ejection device, and more particularly to an improved structure for guiding a fluid to be sprayed in a vertical direction so that a fluid can be sprayed on the entire surface of the substrate, thereby improving A fluid ejection device for processing efficiency of a substrate. [Prior Art] Generally, a fluid ejecting apparatus is a crucible device that ejects a fluid such as a chemical liquid on the surface of a substrate. Such a fluid ejection device can be applied in different fields depending on its use. Namely, it can be applied to a coating device which applies a chemical solution on a substrate to form a coating layer, or can be applied to various devices such as a cleaning device which sprays a cleaning liquid to remove impurities on the substrate. 1 is a schematic view showing the structure of a nozzle in a conventional fluid ejecting apparatus. As shown in Fig. 1, the nozzle κ of the fluid ejecting apparatus is disposed on the upper side of the substrate G. Then, the fluid w is ejected onto the upper surface of the substrate G through the nozzle κ. Therefore, the substrate G can be subjected to a cleaning operation, a coating operation, or the like by the fluid w ejected from the nozzle K. However, the conventional fluid ejecting apparatus generates a surface tension k due to the gravitational force between the molecules constituting the fluid when the flow is ejected through the nozzle κ, causing the fluid to incline at a certain angle of 0 toward the inner side of the substrate. Therefore, the conventional technique has a problem that the fluid cannot be ejected to the edge portion E of the substrate. In order to solve this problem, it is necessary to lengthen the spray of the fluid ejecting device. 5 200822974 [Invention] The present invention has been made in view of the above problems, and the purpose of the present invention is to provide a grinding device by modifying the fluid ejecting device. A fluid ejection device that squirts a fluid ejected from a nozzle in a vertical direction. Another object of the present invention is to provide a fluid for jetting a fluid perpendicularly to a substrate and having a nozzle length corresponding to a μ + π 4 swallowing length at the base of the county. Spray the device to reduce the nozzle size.
爲實現上述目的 其包括： 本發明提供一種流體喷射裝置， 噴嘴’其具有用於向基板吐出流體的吐出口；導向 裝置’其設在所述噴嘴的吐出口兩侧端部，用於引導由 所述吐出口噴射出的流體，使其能夠均句地喷射在基板 的整個表面上。 本發明的流體噴射裝置具有如下效果。In order to achieve the above object, the present invention includes: a fluid ejecting apparatus having a nozzle having a discharge port for discharging fluid to a substrate; and a guide device 'provided at both ends of the discharge port of the nozzle for guiding The fluid ejected from the discharge port is capable of being sprayed uniformly over the entire surface of the substrate. The fluid ejection device of the present invention has the following effects.
第一，由於在流體噴射裝置的噴嘴吐出口兩端設置 導向裳置，可以使由吐出口喷射出的流體能夠垂直喷射 在基:反上。因此，可防止基板邊緣部分未被處理的現象。 第—’由於可垂直噴射流體，噴嘴也可具有與基板 相應的長度，因此可達到縮小噴嘴尺寸的效果。 【實施方式】 下面’參照附圖詳細說明本發明流體喷射裝置的結 構0 百先’圖 2是本發明一 的喷嘴立體圖，圖3是顯示 較佳實施例的流體喷射裝置 圖2所示流體喷射裝置中喷 6 200822974 幫底α卩…構的示意圖’圖*是由圖2所示喷嘴所喷射的 流體狀態示意圖。 如圖2所示’本發明的流體喷射裝置1可設置在由 輸送輥R輸送的基板G的上方。 所述流體噴射裝置1包括··噴嘴2，其具有用於向 基板G上面噴射流體W的吐出口 5 ;導向裝置，其設在 所述喷嘴2的吐出口 5兩端，用於引導流體的喷射方向， 使传由所述吐出口 5噴射出的流體W均勻喷射在所述基 板G的整個表面上。 在具有這種結構的流體噴射裝置中，所述吐出口 5 著喷_ 2的長度方向形成在喷嘴2的底部，其用於將 通過喷嘴2内部的流體w噴射到基板g上。 而且所述吐出口 5的兩端設有導向裝置，其用於 使由吐出口 5噴射出的流體W向垂直方向均勻喷射。First, since the guide skirt is provided at both ends of the nozzle discharge port of the fluid ejecting apparatus, the fluid ejected from the discharge port can be vertically sprayed on the base: Therefore, the phenomenon that the edge portion of the substrate is not treated can be prevented. First—Because the fluid can be jetted vertically, the nozzle can also have a length corresponding to the substrate, so that the effect of reducing the size of the nozzle can be achieved. [Embodiment] Hereinafter, a structure of a fluid ejecting apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 2 is a perspective view of a nozzle of the present invention, and FIG. 3 is a fluid ejecting apparatus showing the fluid ejecting apparatus of the preferred embodiment. The schematic diagram of the structure of the sprayer 6 200822974 is a schematic diagram of the fluid state ejected by the nozzle shown in Fig. 2. As shown in Fig. 2, the fluid ejecting apparatus 1 of the present invention can be disposed above the substrate G conveyed by the conveying roller R. The fluid ejecting apparatus 1 includes a nozzle 2 having a discharge port 5 for ejecting a fluid W onto a substrate G, and a guide device provided at both ends of the discharge port 5 of the nozzle 2 for guiding a fluid In the ejection direction, the fluid W ejected from the discharge port 5 is uniformly sprayed on the entire surface of the substrate G. In the fluid ejecting apparatus having such a configuration, the discharge port 5 is formed in the longitudinal direction of the nozzle 2 at the bottom of the nozzle 2 for ejecting the fluid w passing through the inside of the nozzle 2 onto the substrate g. Further, both ends of the discharge port 5 are provided with guide means for uniformly injecting the fluid W ejected from the discharge port 5 in the vertical direction.
圖及圖3所不，本發明一較佳實施例所涉及的 :向裝置包括，形成於所述吐出口 5一端的第一流量集 槽7及形成於所述吐出口 5另一端的第二流量集中槽 較佳地，所述第一、、六旦 9 ^ ^ t2 "•里木中槽7及第二流量集中槽 的見度t2比所述吐出口 5的寬度tl更寬。 更具體而言，如圖4所示^ 、 及第二流量集中槽9的單位長戶=第—流量集中槽7 出口 5的單位長度D2所對應：所對應的面積比吐 流體W日夺，相較於所述吐出：、面積更大’因此當贺射 5 ’流體會相對集中通過 7 200822974 所述第一流量集中槽7及第二流量集中槽9喷射（wl、 W2 ) 〇 即，由於第一流量集中槽7及第二流量集中槽9集 中喷射流體W ’因此由吐出口 5喷射出的流體的分子之 間引力與由所述第一流量集中槽7及第二流量集中槽9 噴射出的流體的分子之間引力相比，後者的分子之間引 力更大。 因此，由所述吐出口 5喷射出的流體W的分子在引 力作用下被吸引到由所述第一流量集中槽7及第二流量 集中槽9喷射出的流體分子處，從而可防止由吐出口 5 噴射出的流體W向基板内侧傾斜的現象。3 and 3, the device according to the present invention includes a first flow collecting groove 7 formed at one end of the discharge port 5 and a second flow formed at the other end of the discharge port 5 Preferably, the flow concentration groove has a width t1 of the first, six deniers, and a second flow concentration groove that is wider than a width t1 of the discharge port 5. More specifically, as shown in FIG. 4, and the unit length of the second flow concentration groove 9 = the first flow rate of the flow rate concentration groove 7 is corresponding to the unit length D2: the corresponding area is larger than the discharge fluid W. Compared with the spouting: the area is larger, so when the Hei 5' fluid is relatively concentrated, the first flow concentration tank 7 and the second flow concentration tank 9 are sprayed (wl, W2) by 7 200822974, ie The first flow concentration groove 7 and the second flow concentration groove 9 concentrate the injection fluid W'. Therefore, the attraction between the molecules of the fluid ejected from the discharge port 5 and the first flow concentration groove 7 and the second flow concentration groove 9 are injected. The gravitational force between the molecules of the latter is greater than the gravitational force between the molecules of the fluid. Therefore, molecules of the fluid W ejected from the discharge port 5 are attracted by the gravitational force to the fluid molecules ejected by the first flow rate concentration groove 7 and the second flow rate concentration groove 9, thereby preventing spitting. The phenomenon that the fluid W ejected from the outlet 5 is inclined toward the inner side of the substrate.
另外，如圖3所示，本發明的較佳實施例中的第一 流量集中槽7及第二流量集中槽9爲方形結構，但是本 發明並不局限於此，只要形成較大的吐出面積，從而使 經過該部分的流體量相較於經過吐出口的流體量更爲集 中，任何形狀的結構均可采用。 雖然未圖不，本發明較佳實施例的流體喷射裝置， 其各流量集中槽還可以Η ^ l j Μ疋向基板的外側方向傾斜的形 狀。 即，如果改變由戶斤；+、々丄 ^ ^^各流量集中槽噴射出的流體方 向’使之向基板的外伽. J 7向噴射，就能取得比上述實施 例更好的效果。 々也 圖5及圖6是本取 %明另一實施例的示意圖。其中， 圖5是本發明另一實 、 例的贺嘴結構示意圖，圖6是由 8 200822974 圖5所示喷嘴所喷射的流體狀態示意圖。 本發明的較佳實施例提出作爲導向裝置增加吐出口 兩端的面積’從而使流量集中在兩側端部的結構，而本 發明的另一實施例卻提出雖然其結構與上述流體喷射裝 置基本相同，但作爲導向裝置另設置導向部件的結構， 而這一點就是與上述實施例不同之處。 即，如圖5所示，本發明另一實施例所涉及的流體 喷射裝置，在吐出口 14兩端設有導向裝置。 ( 即，本實施例的流體喷射裝置10之導向裝置包括， * 設置在所述吐出口 14 一端的第一導向裝置11及設置在 另一端的第二導向裝置13。 其中，第一導向裝置^及第二導向裝置13可包括， 分別設置並固定在所述吐出口 14兩側端部的第一固定單 元15及弟一固定單元18;分別從所述第一固定年元I5 及第二固定單元18的一端向下垂直延伸，用於朝垂直方 向引導流體W的第一導向單元17及第二導向單元19。 v 其中，所述第一導向裝置11及第二導向裝置13可 與喷嘴12形成一體，也可以單獨形成並結合在喷嘴12。 因此，由所述噴嘴12的吐出口 1 4所喷射的流體W ’ 可在其兩側與所述第一導向單元17及第二導向單元19 相接觸的狀態下噴射。 此時，由所述吐出口 14喷射的流體W與第一導向 單元17及第二導向單元19之間産生張力，而所述張力 大於流體W的分子之間的表面張力。 9 200822974In addition, as shown in FIG. 3, the first flow concentration groove 7 and the second flow concentration groove 9 in the preferred embodiment of the present invention have a square structure, but the present invention is not limited thereto, as long as a large discharge area is formed. Thus, the amount of fluid passing through the portion is more concentrated than the amount of fluid passing through the discharge port, and any shape of the structure can be employed. Although not shown, in the fluid ejecting apparatus of the preferred embodiment of the present invention, each of the flow concentration grooves may have a shape inclined toward the outer side of the substrate. That is, if the fluid direction ejected by the flow concentrating grooves of each of the households; +, 々丄 ^ ^^ is caused to be ejected toward the outer side of the substrate, a better effect than the above embodiment can be obtained. 5 and FIG. 6 are schematic views of another embodiment of the present invention. 5 is a schematic view showing the structure of the nozzle of another embodiment of the present invention, and FIG. 6 is a schematic view showing the state of the fluid ejected by the nozzle shown in FIG. The preferred embodiment of the present invention proposes a structure in which the area of both ends of the discharge port is increased as a guide means to concentrate the flow rate at both end portions, and another embodiment of the present invention proposes that the structure is substantially the same as that of the above fluid ejecting apparatus. However, the structure of the guide member is additionally provided as the guide means, and this is different from the above embodiment. That is, as shown in Fig. 5, in the fluid ejecting apparatus according to another embodiment of the present invention, guide means are provided at both ends of the discharge port 14. (That is, the guiding device of the fluid ejection device 10 of the present embodiment includes, * a first guiding device 11 disposed at one end of the ejection opening 14 and a second guiding device 13 disposed at the other end. wherein, the first guiding device ^ And the second guiding device 13 may include: a first fixing unit 15 and a first fixing unit 18 respectively disposed at two end portions of the discharge port 14; respectively, from the first fixed year element I5 and the second fixing One end of the unit 18 extends vertically downward for guiding the first guiding unit 17 and the second guiding unit 19 of the fluid W in a vertical direction. v wherein the first guiding device 11 and the second guiding device 13 are connectable to the nozzle 12 Formed integrally, it may be separately formed and combined with the nozzle 12. Therefore, the fluid W' ejected from the discharge port 14 of the nozzle 12 may be on both sides thereof with the first guide unit 17 and the second guide unit 19 At the time of contact, the fluid W sprayed from the discharge port 14 generates tension between the first guide unit 17 and the second guide unit 19, and the tension is greater than the surface between the molecules of the fluid W. Tension 9 20082 2974
，通過所述第一導向單元17及第二導向單元 19 ’可防止由所述噴嘴12的吐出口 14噴射出 向基板内側傾斜的現象，從而在基板 W 的整個區域上可均勻地喷射流體。見度…上 》、以上對本發明的較佳實施例進行了說明，對於所屬 ^域的技術人員來說，應該理解在不脫離本發明精 去口 I^FI | \-i , 4 ^ ，可作出各種修飾及變更。因此，凡在本發明的 榷矛丨J尊、七金々田！ ‘ 水辄圍内所作的各種修改及變更，均屬於本發明 的保護範圍。 【圖式簡單說明】 圖1是習知流體噴射裝置中喷嘴結構示意圖。 圖2是本發明一較佳實施例的流體喷射裝置中喷嘴立 體圖。 ' 圖3是顯示圖2所示流體喷射裝置中噴嘴底部結構的 示意圖。 圖4是由圖2所示喷嘴所喷射的流體狀態示意圖。 圖5是本發明另一實施例的流體喷射裝置中喷嘴結構 示意圖。 圖6是由圖5所示噴嘴所喷射的流體狀態示意圖。 【主要元件符號說明】 1、1 〇 流體喷射裝置 11 第一導向裝置 13 第二導向裝置 K、2、12 噴嘴 200822974 E 邊緣部 W 流體 G 基板 Θ 角度 R 輸送輥 5、14 吐出口 7 第一流量集中槽 9 第二流量集中槽 tl、t2 寬度 D1、D2 單位長度 15 第一固定單元 18 第二固定單元 17 第一導向單元 19 第二導向單元 L 寬度 11By the first guiding unit 17 and the second guiding unit 19', it is possible to prevent the ejection from the discharge port 14 of the nozzle 12 from being inclined toward the inside of the substrate, so that the fluid can be uniformly ejected over the entire area of the substrate W. The above description of the preferred embodiment of the present invention has been described. For those skilled in the art, it should be understood that without departing from the invention, I^FI | \-i , 4 ^ can be used. Make various modifications and changes. Therefore, in the invention, the 榷 spear 丨 J, the seven gold 々田! ‘All modifications and changes made in the sampan are within the scope of protection of this invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a nozzle in a conventional fluid ejecting apparatus. Fig. 2 is a perspective view of a nozzle in a fluid ejecting apparatus according to a preferred embodiment of the present invention. Fig. 3 is a schematic view showing the structure of the nozzle bottom in the fluid ejecting apparatus shown in Fig. 2. Figure 4 is a schematic view of the state of the fluid ejected by the nozzle shown in Figure 2. Fig. 5 is a schematic view showing the structure of a nozzle in a fluid ejecting apparatus according to another embodiment of the present invention. Figure 6 is a schematic view showing the state of the fluid ejected by the nozzle shown in Figure 5. [Description of main component symbols] 1. 1 〇 Fluid ejection device 11 First guiding device 13 Second guiding device K, 2, 12 Nozzle 200822974 E Edge portion W Fluid G Substrate 角度 Angle R Conveying roller 5, 14 Discharge port 7 First Flow concentration tank 9 Second flow concentration groove t1, t2 Width D1, D2 Unit length 15 First fixing unit 18 Second fixing unit 17 First guiding unit 19 Second guiding unit L Width 11