CN100537044C - Fluid jet device - Google Patents

Fluid jet device Download PDF

Info

Publication number
CN100537044C
CN100537044C CNB2007101514178A CN200710151417A CN100537044C CN 100537044 C CN100537044 C CN 100537044C CN B2007101514178 A CNB2007101514178 A CN B2007101514178A CN 200710151417 A CN200710151417 A CN 200710151417A CN 100537044 C CN100537044 C CN 100537044C
Authority
CN
China
Prior art keywords
fluid
discharge opening
nozzle
substrate
guider
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CNB2007101514178A
Other languages
Chinese (zh)
Other versions
CN101185920A (en
Inventor
金银洙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WEIHAI DMS OPTICAL ELECTROMECHANICAL Co.,Ltd.
DMS Co Ltd
Original Assignee
Display Manufacturing Services Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Display Manufacturing Services Co Ltd filed Critical Display Manufacturing Services Co Ltd
Publication of CN101185920A publication Critical patent/CN101185920A/en
Application granted granted Critical
Publication of CN100537044C publication Critical patent/CN100537044C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention relates to a fluid injection device comprising a nozzle having an outlet opening used to spit fluid towards the substrate, and a guide apparatus mounted on the injection-side end of the nozzle for guiding the fluid injected from the outlet opening, so that the fulid can be injected uniformly on the whole surface of the substrate. The fluid injection device is increased in the treatment efficiency of the substrate by the improved nozzle structure allowing the fluid to be injected vertically.

Description

Fluid ejection apparatus
Technical field
The present invention relates to a kind of fluid ejection apparatus, relate in particular to a kind of structure by improvement, the guiding fluid sprays towards vertical direction, makes fluid can be injected on the whole surface of substrate, thereby improves the fluid ejection apparatus to the treatment effeciency of substrate.
Background technology
Usually, fluid ejection apparatus is the device at fluids such as substrate surface injection soups.This fluid ejection apparatus can be applicable to different fields according to its purposes.
That is, can be applicable on substrate, apply soup, perhaps can be applicable to by jet cleaning liquid with on the various devices such as cleaning device of removing impurity on the substrate to form the applying device of coating.
Fig. 1 is a nozzle arrangements schematic diagram in the existing fluid ejection apparatus.
As shown in Figure 1, the nozzle K of fluid ejection apparatus is arranged on the top of substrate G.And, by nozzle K injection fluid W above substrate G.
Therefore, can carry out washing and cleaning operation or coating operation etc. to substrate G by the fluid W that ejects from described nozzle K.
But existing fluid ejection apparatus when ejecting fluid by nozzle K, owing to the gravitation between the molecule of forming fluid produces surface tension, thereby causes the phenomenon of fluid side direction inclination certain angle θ in substrate.
Therefore, prior art exists fluid can't be ejected into the problem of the E of substrate edges portion.And, need the nozzle length of lengthening fluid ejection apparatus in order to address this problem.
Summary of the invention
The present invention does in view of the above problems, and its purpose is to provide a kind of nozzle arrangements by the improvement fluid ejection apparatus, so that the fluid ejection apparatus that the fluid that goes out from nozzle ejection evenly sprays towards vertical direction.
Another object of the present invention is to, providing a kind of can vertically spray fluid to substrate, and has the fluid ejection apparatus with the corresponding nozzle length of substrate length, thereby dwindles jet size.
For achieving the above object, the invention provides a kind of fluid ejection apparatus, it comprises:
Nozzle, it has and is used for to the spue discharge opening of fluid of substrate; Guider, the discharge opening both side ends that it is located at described nozzle is used to guide the fluid that is ejected by described discharge opening, makes on its whole surface that can be injected in substrate equably.
Fluid ejection apparatus of the present invention has following effect.
The first, owing to guider is set, the fluid that is ejected by discharge opening can vertically be injected on the substrate at the nozzle discharge opening two ends of fluid ejection apparatus.Therefore, can prevent the phenomenon that substrate edge part is not processed.
The second, owing to can vertically spray fluid, nozzle also can have and the corresponding length of substrate, therefore can reach the effect of dwindling jet size.
Description of drawings
Fig. 1 is a nozzle arrangements schematic diagram in the fluid ejection apparatus of prior art.
Fig. 2 is a nozzle stereogram in the fluid ejection apparatus of one embodiment of the present invention.
Fig. 3 is the schematic diagram that shows nozzle bottom structure in the fluid ejection apparatus shown in Figure 2.
Fig. 4 is the fluid state schematic diagram that is sprayed by nozzle shown in Figure 2.
Fig. 5 is a nozzle arrangements schematic diagram in the fluid ejection apparatus of another embodiment of the present invention.
Fig. 6 is the fluid state schematic diagram that is sprayed by nozzle shown in Figure 5.
The specific embodiment
Below, the structure of present invention will be described in detail with reference to the accompanying fluid ejection apparatus.
At first, Fig. 2 is the nozzle stereogram of the fluid ejection apparatus of one embodiment of the present invention, and Fig. 3 is the schematic diagram that shows nozzle bottom structure in the fluid ejection apparatus shown in Figure 2, and Fig. 4 is the fluid state schematic diagram that is sprayed by nozzle shown in Figure 2.
As shown in Figure 2, fluid ejection apparatus 1 of the present invention can be arranged on the top by conveying roller R substrate conveying G.
Described fluid ejection apparatus 1 comprises: nozzle 2, and it has the discharge opening 5 that is used for spraying fluid W above substrate G; Guider, discharge opening 5 two ends that it is located at described nozzle 2 are used to guide the injection direction of fluid, make the fluid W that is ejected by described discharge opening 5 evenly be injected on the whole surface of described substrate G.
In having the fluid ejection apparatus of this structure, described discharge opening 5 is formed on the bottom of nozzle 2 along the length direction of nozzle 2, and it is used for the fluid W by nozzle 2 inside is ejected into substrate G.
And the two ends of described discharge opening 5 are provided with guider, and it is used to make the fluid W that is ejected by discharge opening 5 evenly to spray to vertical direction.
As shown in Figures 2 and 3, the related guider of one embodiment of the present invention comprises, the first flow that is formed at described discharge opening 5 one ends is concentrated groove 7 and is formed at groove 9 in second flow set of described discharge opening 5 other ends.
Preferably, it is wideer than the width t1 of described discharge opening 5 that described first flow is concentrated the width t2 of groove 9 in the groove 7 and second flow set.
More specifically, as shown in Figure 4, described first flow concentrates the pairing area of unit length D1 of groove 9 in the groove 7 and second flow set bigger than the pairing area of the unit length D2 of discharge opening 5, therefore when spraying fluid W, compared to described discharge opening 5, fluid can be concentrated relatively by described first flow and concentrate groove 9 injections (W1, W2) in the groove 7 and second flow set.
Promptly, because first flow is concentrated the groove 9 concentrated fluid W that spray in the groove 7 and second flow set, therefore between the molecule of the fluid that ejects by discharge opening 5 between gravitation and the molecule of concentrating the fluid that groove 9 ejects in the groove 7 and second flow set by described first flow gravitation compare, gravitation is bigger between the latter's the molecule.
Therefore, the molecule of the fluid W that is ejected by described discharge opening 5 attracted under graviational interaction by described first flow and concentrates the fluid molecule place that groove 9 ejects in the groove 7 and second flow set, thereby can prevent that the fluid W that ejected by discharge opening 5 is to the inboard phenomenon that tilts of substrate.
In addition, as shown in Figure 3, groove 9 is a square structure in the concentrated groove 7 of first flow in the preferred embodiments of the present invention and second flow set, but the present invention is not limited thereto, as long as form the bigger area that spues, thereby make the Fluid Volume of this part of process more concentrated compared to the Fluid Volume through discharge opening, the structure of Any shape all can adopt.
Though not shown, the fluid ejection apparatus of the preferred embodiment of the present invention, groove can also be the shape to the lateral direction inclination of substrate in its each flow set.
That is,, make it to spray, just can obtain than the better effect of the foregoing description to the lateral direction of substrate if change the flow direction that ejects by groove in described each flow set.
Fig. 5 and Fig. 6 are the schematic diagrames of another embodiment of the present invention.Wherein, Fig. 5 is the nozzle arrangements schematic diagram of another embodiment of the present invention, and Fig. 6 is the fluid state schematic diagram that is sprayed by nozzle shown in Figure 5.
The preferred embodiments of the present invention propose to increase as guider the area at discharge opening two ends, thereby make flow concentrate on the structure of both side ends, though and another embodiment of the present invention proposes its structure and technique of above liquor ejecting device is basic identical, but as guider the structure of guiding parts is set in addition, and this point is exactly and the foregoing description difference.
That is, as shown in Figure 5, the fluid ejection apparatus that another embodiment of the present invention is related is provided with guider at discharge opening 14 two ends.
That is, the guider of the fluid ejection apparatus 10 of present embodiment comprises, is arranged on first guider 11 of described discharge opening 14 1 ends and is arranged on second guider 13 of the other end.
Wherein, first guider 11 and second guider 13 can comprise, are provided with and are fixed on first fixed cell 15 and second fixed cell 18 of described discharge opening 14 both side ends respectively; End from described first fixed cell 15 and second fixed cell 18 extends downward vertically respectively, is used for towards first pilot unit 17 and second pilot unit 19 of vertical direction guiding fluid W.
Wherein, described first guider 11 and second guider 13 can form one with nozzle 12, also can form and be combined in nozzle 12 separately.
Therefore, the fluid W by the discharge opening 14 of described nozzle 12 is sprayed can spray under its both sides and described first pilot unit 17 and second pilot unit, 19 contacted states.
At this moment, produce tension force between the fluid W that sprays by described discharge opening 14 and first pilot unit 17 and second pilot unit 19, and described tension force is greater than the surface tension between the molecule of fluid W.
Therefore, by described first pilot unit 17 and second pilot unit 19, fluid W that the discharge opening 14 by described nozzle 12 ejects can be prevented to the inboard phenomenon that tilts of substrate, thereby on the whole zone on the width L direction, fluid can be sprayed equably at substrate G.
Above preferred embodiments of the present invention have been disclosed for illustrative to those of ordinary skill in the art, should be appreciated that and can make various modifications and change in the scope that does not break away from spirit of the present invention.Therefore, all various modifications and changes of being done in claim scope of the present invention all belong to protection scope of the present invention.

Claims (4)

1. a fluid ejection apparatus is characterized in that, comprising:
Nozzle, it has and is used for to the spue discharge opening of fluid of substrate;
Guider, the discharge opening both sides that it is located at described nozzle are used to guide the fluid that ejects from described discharge opening, make on its whole surface that can be injected in substrate equably;
Described guider comprises groove in the concentrated groove of first flow and second flow set, it is formed at the both side ends of described discharge opening respectively, and for to make the discharge-amount of its fluid emitted dose greater than described discharge opening, the pairing area of its unit length is greater than the pairing area of the unit length of discharge opening.
2. fluid ejection apparatus according to claim 1 is characterized in that:
Groove tilts to the outside of substrate in the concentrated groove of described first flow and second flow set.
3. fluid ejection apparatus according to claim 1 is characterized in that:
Described guider comprises first guider and second guider that is separately positioned on described nozzle discharge opening both side ends.
4. fluid ejection apparatus according to claim 3 is characterized in that:
Described first guider and second guider comprise respectively,
First fixed cell and second fixed cell, it is separately fixed at the both side ends of described discharge opening;
First pilot unit and second pilot unit, it extends under a side direction of described first fixed cell and second fixed cell respectively, thus the fluid that guiding is spued by described discharge opening two ends vertically sprays.
CNB2007101514178A 2006-11-24 2007-09-28 Fluid jet device Active CN100537044C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060116841A KR100828664B1 (en) 2006-11-24 2006-11-24 Apparatus for jetting fluid
KR1020060116841 2006-11-24

Publications (2)

Publication Number Publication Date
CN101185920A CN101185920A (en) 2008-05-28
CN100537044C true CN100537044C (en) 2009-09-09

Family

ID=39478667

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007101514178A Active CN100537044C (en) 2006-11-24 2007-09-28 Fluid jet device

Country Status (3)

Country Link
KR (1) KR100828664B1 (en)
CN (1) CN100537044C (en)
TW (1) TWI325793B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110020507A (en) * 2009-08-24 2011-03-03 주식회사 디엠에스 Apparatus for jetting fluid
KR101313262B1 (en) * 2010-07-12 2013-09-30 삼성전자주식회사 Chemical Vapor Deposition Apparatus and Method of Forming Semiconductor Thin Film Using The Same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2976085B2 (en) * 1993-07-16 1999-11-10 東京エレクトロン株式会社 Processing equipment
JP3652596B2 (en) 1999-10-25 2005-05-25 東京エレクトロン株式会社 Liquid processing equipment
KR101145851B1 (en) * 2005-10-28 2012-05-17 주식회사 케이씨텍 Jet nozzle for washing substrate

Also Published As

Publication number Publication date
TW200822974A (en) 2008-06-01
CN101185920A (en) 2008-05-28
TWI325793B (en) 2010-06-11
KR100828664B1 (en) 2008-05-09

Similar Documents

Publication Publication Date Title
US8439478B2 (en) Ink-jet wiping apparatus, and wiping method using this
JP5926725B2 (en) Dry ice snow spraying device
CN100537044C (en) Fluid jet device
KR101408766B1 (en) Air Knife
KR100828665B1 (en) Nozzle for jetting fluid
CN103660568A (en) Liquid jet head and liquid jet apparatus
CN101113522A (en) Spraying device for printed circuit board etching
CN102632714B (en) Jet head liquid and liquid jet method
JP2008034436A (en) Etching device
KR20140134378A (en) Apparatus for jetting fluid and apparatus for cleaning a substrate having the same
CN103052449B (en) With turn to fluid collection systems by controlled for the fluid jet equipment being administered to substrate
KR100451386B1 (en) Substrate Processing Apparatus and Substrate Processing Method
KR101652481B1 (en) chemical coating apparatus using double slit nozzle
CN106476437B (en) Fluid ejection head and liquid ejection apparatus
KR200305052Y1 (en) Slit Type Device Nozzle for Jetting Fluid
CN101632991B (en) Fluid injection device
JP2003045844A (en) Substrate treatment apparatus
KR100817880B1 (en) Nozzle of high pressure washing system
KR20190059430A (en) Cavitation Nozzle and Strip Cleaning Device
KR100684048B1 (en) Apparatus for jetting fluid
TWI603421B (en) Wet chemistry process apparatus
KR101315256B1 (en) Air-Knife Injection device for uniform drying of a glass panel
JP3809229B2 (en) Equipment for removing contaminants such as water droplets and dust
KR101394264B1 (en) Apparatus for jetting fluid
KR20130125175A (en) Liquid jetting apparatus

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: WEIHAI DIANMEISHI OPTO-MECHATRONICS CO., LTD.

Effective date: 20140226

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20140226

Address after: Gyeonggi Do, South Korea

Patentee after: Display Production Service Co., Ltd.

Patentee after: Weihai dianmei Shiguang electromechanical Co Ltd

Address before: Gyeonggi Do, South Korea

Patentee before: Display Production Service Co., Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 264205 No. 88-1, Bekaert Road, Weihai Economic and Technological Development Zone, Weihai City, Shandong Province

Patentee after: WEIHAI DMS OPTICAL ELECTROMECHANICAL Co.,Ltd.

Patentee after: DMS Co.,Ltd.

Address before: Gyeonggi Do, South Korea

Patentee before: DMS Co.,Ltd.

Patentee before: WEIHAI DMS OPTICAL ELECTROMECHANICAL Co.,Ltd.