SG11202001057VA - Cleaning compositions - Google Patents
Cleaning compositionsInfo
- Publication number
- SG11202001057VA SG11202001057VA SG11202001057VA SG11202001057VA SG11202001057VA SG 11202001057V A SG11202001057V A SG 11202001057VA SG 11202001057V A SG11202001057V A SG 11202001057VA SG 11202001057V A SG11202001057V A SG 11202001057VA SG 11202001057V A SG11202001057V A SG 11202001057VA
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning compositions
- compositions
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/046—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/24—Organic compounds containing halogen
- C11D3/245—Organic compounds containing halogen containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762548474P | 2017-08-22 | 2017-08-22 | |
US201762553281P | 2017-09-01 | 2017-09-01 | |
PCT/US2018/047155 WO2019040394A1 (en) | 2017-08-22 | 2018-08-21 | Cleaning compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001057VA true SG11202001057VA (en) | 2020-03-30 |
Family
ID=65437168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001057VA SG11202001057VA (en) | 2017-08-22 | 2018-08-21 | Cleaning compositions |
Country Status (9)
Country | Link |
---|---|
US (1) | US10787628B2 (en) |
EP (1) | EP3672944B1 (en) |
JP (1) | JP7235336B2 (en) |
KR (1) | KR102720994B1 (en) |
CN (1) | CN110997643B (en) |
IL (1) | IL272498B2 (en) |
SG (1) | SG11202001057VA (en) |
TW (1) | TW201912775A (en) |
WO (1) | WO2019040394A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102267799B1 (en) * | 2016-11-18 | 2021-06-22 | 후지필름 가부시키가이샤 | Chemical solution, pattern formation method, and kit |
TWI846734B (en) | 2018-09-26 | 2024-07-01 | 英屬開曼群島商索理思科技開曼公司 | Method of suspending elemental sulfur in water and geothermal system |
JP7220119B2 (en) * | 2019-05-22 | 2023-02-09 | 信越化学工業株式会社 | Cleaning liquid for temporary adhesive for substrate, method for cleaning substrate, and method for cleaning support or substrate |
CN110591840B (en) * | 2019-09-26 | 2021-08-13 | 麦达可尔(湖北)工业有限公司 | Solvent type cleaning agent |
CN113000475B (en) * | 2019-12-20 | 2022-07-22 | 中微半导体设备(上海)股份有限公司 | Cleaning method for plasma processing equipment component |
CN115976519B (en) * | 2022-08-10 | 2024-08-30 | 武汉梵佳鑫科技有限公司 | Chromium etching solution for stripping development and application thereof |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6717019B2 (en) | 2002-01-30 | 2004-04-06 | Air Products And Chemicals, Inc. | Glycidyl ether-capped acetylenic diol ethoxylate surfactants |
KR101431406B1 (en) | 2005-06-07 | 2014-08-18 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition |
CN101366107B (en) * | 2005-10-05 | 2011-08-24 | 高级技术材料公司 | Oxidizing aqueous cleaner for the removal of post-etch residues |
JP4766115B2 (en) | 2006-08-24 | 2011-09-07 | ダイキン工業株式会社 | Residue removing liquid after semiconductor dry process and residue removing method using the same |
SG177915A1 (en) | 2006-12-21 | 2012-02-28 | Advanced Tech Materials | Liquid cleaner for the removal of post-etch residues |
TW200925268A (en) * | 2007-12-06 | 2009-06-16 | Mallinckrodt Baker Inc | Fluoride-containing photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction |
SG187551A1 (en) * | 2010-07-16 | 2013-03-28 | Advanced Tech Materials | Aqueous cleaner for the removal of post-etch residues |
JP6151484B2 (en) | 2012-06-11 | 2017-06-21 | 東京応化工業株式会社 | Lithographic cleaning liquid and wiring forming method |
JP6157081B2 (en) | 2012-09-24 | 2017-07-05 | 東京応化工業株式会社 | Stripping solution for photolithography and pattern forming method |
KR102338550B1 (en) * | 2013-06-06 | 2021-12-14 | 엔테그리스, 아이엔씨. | Compositions and methods for selectively etching titanium nitride |
TWI558850B (en) | 2014-03-29 | 2016-11-21 | 精密聚合物股份有限公司 | The processing liquid for electronic components and the production method of electronic components |
KR102420338B1 (en) * | 2014-06-04 | 2022-07-13 | 엔테그리스, 아이엔씨. | Anti-reflective coating cleaning and post-etch residue removal composition having metal, dielectric and nitride compatibility |
WO2016003729A1 (en) * | 2014-06-30 | 2016-01-07 | Entegris, Inc. | Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility |
JP2016025321A (en) | 2014-07-24 | 2016-02-08 | 関東化學株式会社 | Etchant composition and etching method |
KR101958691B1 (en) * | 2014-11-27 | 2019-03-15 | 후지필름 가부시키가이샤 | Removal liquid, removal method using same, and method for manufacturing semiconductor substrate product |
TWI690780B (en) * | 2014-12-30 | 2020-04-11 | 美商富士軟片電子材料美國股份有限公司 | Stripping compositions for removing photoresists from semiconductor substrates |
TWI819694B (en) * | 2015-07-14 | 2023-10-21 | 美商富士軟片電子材料美國股份有限公司 | Cleaning compositions and methods of use therefor |
TW201710390A (en) * | 2015-08-31 | 2017-03-16 | Fujifilm Corp | Composition, cured film, method for manufacturing cured film, method for manufacturing semiconductor device, and semiconductor device |
-
2018
- 2018-08-21 KR KR1020207004515A patent/KR102720994B1/en active IP Right Grant
- 2018-08-21 CN CN201880053404.3A patent/CN110997643B/en active Active
- 2018-08-21 WO PCT/US2018/047155 patent/WO2019040394A1/en unknown
- 2018-08-21 TW TW107129129A patent/TW201912775A/en unknown
- 2018-08-21 SG SG11202001057VA patent/SG11202001057VA/en unknown
- 2018-08-21 JP JP2020511465A patent/JP7235336B2/en active Active
- 2018-08-21 EP EP18849218.5A patent/EP3672944B1/en active Active
- 2018-08-21 US US16/106,331 patent/US10787628B2/en active Active
-
2020
- 2020-02-05 IL IL272498A patent/IL272498B2/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201912775A (en) | 2019-04-01 |
KR20200042900A (en) | 2020-04-24 |
WO2019040394A1 (en) | 2019-02-28 |
JP7235336B2 (en) | 2023-03-08 |
EP3672944A4 (en) | 2021-06-02 |
US10787628B2 (en) | 2020-09-29 |
JP2020531654A (en) | 2020-11-05 |
IL272498A (en) | 2020-03-31 |
CN110997643A (en) | 2020-04-10 |
KR102720994B1 (en) | 2024-10-23 |
CN110997643B (en) | 2023-06-06 |
EP3672944B1 (en) | 2024-08-07 |
US20190062674A1 (en) | 2019-02-28 |
IL272498B2 (en) | 2023-05-01 |
IL272498B1 (en) | 2023-01-01 |
EP3672944A1 (en) | 2020-07-01 |
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