KR20100092586A - Plasma display panel and method for fabricating in thereof - Google Patents

Abstract

PURPOSE: The plasma display panel and manufacturing method thereof make low the discharge voltage by adding the charge control agent in the discharge space. CONSTITUTION: The first substrate(170) comprises the first dielectric layer(190) formed on a plurality of discharge electrodes, and discharge electrodes and protective films formed on the first dielectric layer. It leaves the partition wall(140) in interval and the second substrate(110) is attached with the first substrate. The second substrate comprises a plurality of address electrodes, and the second dielectric layer(130) and fluorescent material layer. The charge control agent layer for making low the discharge voltage is formed on the protective film.

Description

Plasma display panel and method for manufacturing the same

The present invention relates to an image display device, and more particularly, to a plasma display device.

With the advent of the multimedia era, display devices that can express more detailed, larger, and more natural colors are required. However, the current CRT (Cathode Ray Tube) has a limit to compose a large screen of 40 inches or more, and the LCD (Liquid Crystal Display), PDP (Plasma Display Panel), and projection TV (Television) are used for high definition video. It is rapidly developing for expansion.

The maximum feature of the display device such as the PDP can be manufactured in a thin thickness compared to the CRT which is self-luminous, and is easy to manufacture a large flat screen (60 to 80 inches), and clearly distinguished from the conventional CRT in terms of style and design. Becomes

The PDP has a lower plate having an address electrode, a top plate having a sustain electrode pair, and a discharge cell defined by a partition wall, and phosphors are coated on the discharge cell to display a screen.

Specifically, when discharge occurs in the discharge space between the upper plate and the lower plate, ultraviolet rays generated at this time are incident on the phosphor to generate visible light, and the screen is displayed by the visible light.

An object of the present invention is to provide a plasma display panel and a method of manufacturing the same, which can reduce the power consumption of the plasma display panel by lowering the discharge voltage and improving the discharge efficiency.

According to an embodiment of the present invention, a plasma display panel includes a plurality of discharge electrodes, a first dielectric layer formed on the discharge electrodes, and a protective film formed on the first dielectric layer. A first substrate; And a second substrate bonded to the first substrate with the barrier ribs interposed therebetween, the second substrate having a plurality of address electrodes, a second dielectric layer, and a phosphor layer. Control Agent (hereinafter referred to as 'CCA') layer is formed.

In this case, the CCA layer may be formed of at least one powder of silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ) that have been hydrophobically treated.

That is, the CCA layer is dispersed in at least one of 0.01 to 10wt% of silica (SiO ₂ ), alumina (Al ₂ O ₃ ) and titania (TiO ₂ ) in the dispersant, the silica (SiO ₂ ), alumina (Al ₂ The organic solvent in which at least one of O ₃ ) and titania (TiO ₂ ) is dispersed may be formed by spraying on the protective layer and then drying.

At this time, the powder size of the CCA layer may be 0.1 to 1㎛, it may be formed to 0.5 to 25% of the protective film area.

In addition, the protective film is formed on the first dielectric layer, and a first protective film made of a magnesium oxide (MgO) thin film; And a second passivation layer formed on the first passivation layer and formed of a single crystalline MgO powder. The CCA layer may be formed on the second passivation layer.

In addition, the method of manufacturing a plasma display panel according to an embodiment of the present invention includes the steps of sequentially forming a plurality of discharge electrodes and a first dielectric layer on a first substrate; Forming a protective film on the first dielectric layer, the protective film including a magnesium oxide (hereinafter referred to as "MgO") thin film; Forming a charge control agent (CCA) layer on the passivation layer to lower the discharge voltage; And bonding the first substrate and the second substrate having a plurality of address electrodes formed therebetween.

In addition, a plasma display panel according to another exemplary embodiment of the present invention may include a first substrate including a plurality of discharge electrodes, a first dielectric layer formed on the discharge electrodes, and a protective film formed on the first dielectric layer. and; And a second substrate bonded to the first substrate with a partition therebetween and having a plurality of address electrodes, a second dielectric layer, and a phosphor layer, wherein the phosphor layer includes a charge control agent for lowering a discharge voltage. (Charge Control Agent; 'CCA') characterized in that the powder is included.

In addition, a method of manufacturing a plasma display panel according to another embodiment of the present invention includes the steps of forming a first substrate having a plurality of discharge electrodes; Forming a second substrate bonded to the first substrate with a partition therebetween and having a phosphor layer including a charge control agent (CCA) powder therein for lowering a discharge voltage; It is made, including.

As described above, the plasma display panel and the method of manufacturing the same according to the present invention can reduce the power consumption of the plasma display panel by lowering the discharge voltage by adding a charge control agent to the discharge space, and improving the discharge efficiency. There is.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments with reference to the accompanying drawings.

Hereinafter, preferred embodiments of the present invention, in which the above object can be specifically realized, are described with reference to the accompanying drawings.

In the accompanying drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity, and the thickness ratios of the layers in the drawings do not represent actual thickness ratios.

The plasma display panel according to the present invention is characterized in that the protective film has a two-layer structure. Hereinafter, a passivation layer formed on the first dielectric layer 190 of the front substrate 170 may be referred to as a first passivation layer 195a, and a passivation layer formed on the first passivation layer 195a and interviewed with the discharge space may be formed. It is called 2 protective film 195b.

1 is a structural diagram showing an embodiment of a plasma display panel according to the present invention.

As shown in FIG. 1, the plasma display panel of the present invention is formed of a scan electrode and sustain electrodes 180a and 180b made of indium tin oxide (ITO) in one direction on a front substrate 170 and a conventional metal material. Bus electrodes 180a 'and 180b' are formed.

The first dielectric layer 190 and the passivation layer are sequentially formed on the front substrate 170 while covering the scan electrode, the sustain electrode, and the bus electrode.

The front substrate 170 is formed through a process such as milling and cleaning the glass for the display substrate.

Here, the scan electrode 180a and the sustain electrode 180b may be formed by a photoetching method by sputtering ITO (Indium-Tin-Oxide) or SnO ₂ or a lift-off method by CVD. It is formed by such.

The bus electrodes 180a 'and 180b' include silver (Ag) and the like. In addition, a black matrix may be formed on the scan electrode and the sustain electrode, and may include a low melting glass and a black pigment.

The first dielectric layer 190 is formed on the front substrate 170 on which the scan electrode, the sustain electrode, and the bus electrode are formed. Here, the first dielectric layer 190 is made of transparent low melting glass, the specific composition will be described later.

In addition, a protective film made of magnesium oxide or the like is formed on the first dielectric layer 190 to protect the dielectric from the impact of (+) ions during discharge and to increase secondary electron emission.

That is, the passivation film according to the present invention is formed of a first passivation film 195a made of a magnesium oxide (MgO) thin film and a second passivation film 195b formed of a single crystal MgO powder formed on the first passivation film 195a. Can be.

In this case, when the dopant is added to the first passivation layer 195a, the jitter value of the address period is reduced, but when the content of the dopant is greater than a predetermined value, the jitter value may be increased.

Therefore, the dopant is preferably doped in a range where the jitter value is minimized, and it is preferable that the dopant is included in the ratio of 20 to 500 ppm in the first passivation layer 195a at an optimum content. And other materials may be used as dopants instead of silicon to reduce jitter.

The first passivation layer 195a is preferably formed to a thickness of 300 to 700 nanometers (nm). If the thickness of the first passivation layer 195a is 300 nanometers or less, there is a possibility of misdischarge, and if it is 700 nanometers or more, problems in manufacturing process and cost may occur.

In addition, a second passivation layer 195b is formed on the first passivation layer 195a. The second passivation layer 195a may be formed of a single crystal MgO powder doped with Sc. Here, 'size' means the diameter if the crystal shape is spherical, and the length of one side if the cube.

The second passivation layer 195b may be formed only on a part of the surface of the first passivation layer 195a, not the entire surface. That is, the second passivation layer 195b may be formed in an irregular shape as shown, and may be formed in an area of 0.5 to 25% of the surface of the first passivation layer 195a.

That is, the second passivation layer 195b is consequently formed irregularly on the first passivation layer 195a to increase the surface area of the entire passivation layer, thereby increasing secondary electron emission.

As described above, the MgO powder of the single crystal is formed in a cluster form on a part of the first passivation film 195a so that the surface of the passivation film as a whole is not flat and has an uneven shape. Therefore, the surface area where ultraviolet ions collide with the protective film during gas discharge of the plasma display panel increases, so that the amount of secondary electrons can be increased and the discharge start voltage can be lowered. As a result, the discharge efficiency is increased and jitter is reduced. .

On the other hand, according to the present invention, a charge control agent (CCA) particle 195C having high chargeability is coated on the second passivation film 195b.

That is, by spraying the CCA particles 195c onto the second passivation layer 195b in a spray manner, a discharge voltage reduction effect may be generated in a discharge space without reducing efficiency and luminance.

The CCA particles 195c may be formed of at least one powder of silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ) that have been hydrophobically surface-modified.

Details of the CCA particles 195c formed on the second passivation layer 195b will be described later in detail.

On the other hand, an address electrode 120 is formed on one surface of the rear substrate 110 along a direction crossing the sustain electrode pair, and covers a white second on the front surface of the rear substrate 110 while covering the address electrode 120. Dielectric layer 130 is formed.

The second dielectric layer 130 is applied by a printing method or a film laminating method, and then completed through a firing process.

The barrier rib 140 is formed on the second dielectric layer 130 to be disposed between the address electrodes 120. In this case, the partition wall 140 may be stripe-type, well-type, or delta-type, and the partition wall 140 may include CCA particles 195c according to the present invention. May be contained.

In addition, phosphor layers 150a, 150b, and 150c of red (R), green (G), and blue (B) are formed between each partition wall 140. In this case, the phosphor layers 150a, 150b, and 150c may contain CCA particles 195c according to the present invention.

On the other hand, the point where the address electrode 120 on the back substrate 110 and the pair of sustain electrodes on the front substrate 110 cross each other constitutes a discharge cell.

Here, the surface exposed to the current discharge space includes the passivation layer 195 of the front substrate 170, the partition wall 140, and the phosphor layers 150a, 150b, and 150c.

Accordingly, the partition wall 140 and the phosphor layers 150a, 150b, and 150c also contain the aforementioned CCA particles 195c as in the second passivation layer 195b of the front substrate 170, thereby reducing the discharge voltage. In this way, power consumption of the plasma display panel can be reduced, and discharge efficiency can be improved.

In addition, the front substrate 170 and the rear substrate 110 are bonded to each other with the partition wall 140 interposed therebetween, and are bonded through a sealing material provided at an outer side of the substrate.

In addition, the front substrate 170 and the rear substrate 110 are connected to the driving device.

2 is a view showing a driving device and a connection portion of a plasma display panel according to the present invention.

As shown in FIG. 2, the entire plasma display device 210 according to the present invention includes a panel 220, a driving substrate 230 supplying a driving voltage to the panel 220, and the panel 220. A tape carrier package (hereinafter referred to as 'TCP') 240 which is a kind of flexible substrate connecting the electrodes for each cell of the driving substrate 230 with each other.

As described above, the panel 220 includes the front substrate 170, the rear substrate 110, and the partition wall 140.

In addition, the electrical and physical connection between the panel 220 and the TCP 240 and the electrical and physical connection between the TCP 240 and the driving substrate 230 are anisotropic conductive film (ACF). ).

ACF is a conductive resin film made of nickel (Ni) balls coated with gold (Au).

3 is a view showing a substrate wiring structure of the tape carrier package according to the present invention.

As shown in FIG. 3, the TCP 240 is in charge of the connection between the panel 220 and the driving substrate 230, and the driving driver chip is mounted thereon.

The TCP 240 is connected to the wiring 243 on the flexible substrate 242 and the wiring 243 and receives power from the driving substrate 230 to provide a specific electrode of the panel 220. The driver chip 241 is formed.

Here, since the driving driver chip 241 has a structure in which a plurality of signals of high power are alternately outputted by receiving low voltage and driving control signals, the number of wirings connected to the driving substrate 230 is small and the panel ( The number of wires connected to the 220 side is large.

Therefore, the wiring of the driving driver chip 241 may be connected through the space on the driving substrate 230 side. The wiring 243 may not be divided by a boundary of the center of the driving driver chip 341.

4 is a view schematically showing another embodiment of a plasma display device according to the present invention.

In the present embodiment, the panel 220 is connected to the driving device through a flexible printed circuit (FPC) 250.

Here, the FPC 250 is a film having a pattern formed therein using polymide. In addition, in the present embodiment, the FPC 250 and the panel 220 are connected through the ACF. In addition, in this embodiment, the driving substrate 230 is a natural PCB circuit.

Here, the driving device includes a data driver, a scan driver, a sustain driver, and the like.

The data driver is connected to an address electrode to apply a data pulse. The scan driver is connected to the scan electrode to supply a rising ramp waveform, a ramping ramp waveform, a scan pulse, and a sustain pulse. The sustain driver also applies a sustain pulse and a DC voltage to the common sustain electrode.

The plasma display panel is driven by being divided into a reset period, an address period, and a sustain period.

In the reset period, a rising ramp waveform Ramp-up is simultaneously applied to the scan electrodes. In the address period, the negative scan pulse scan is sequentially applied to the scan electrodes, and at the same time, the positive data pulse is applied to the address electrodes in synchronization with the scan pulse. In the sustain period, a sustain pulse sus is alternately applied to the scan electrodes and the sustain electrodes.

Hereinafter, a manufacturing process of a plasma display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

<First Example >

5A to 5C are cross-sectional views of a first embodiment showing a process of manufacturing a front substrate of a plasma display panel according to the present invention.

According to the first embodiment of the present invention, by applying the CCA particles 195c on the second passivation layer 195b described above, the discharge voltage can be reduced, thereby reducing the power consumption of the plasma display panel and improving the discharge efficiency. have.

Hereinafter, a manufacturing process of the front substrate 170 of the plasma display panel according to the first embodiment of the present invention will be described in detail with reference to FIGS. 5A to 5C.

First, as illustrated in FIG. 5A, the scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b' are formed on the front substrate 170.

Here, the front substrate 170 is manufactured by milling and cleaning the glass or soda lime glass for the display substrate.

In addition, the scan electrode 180a and the sustain electrode 180b may be formed using photoetching by sputtering indium tin oxide (ITO).

In addition, the scan electrode 180a and the sustain electrode 180b may be formed of indium tin oxide (ITO) using an ion plating method, a vacuum deposition method, or the like.

In addition, the scan electrode 180a and the sustain electrode 180b may form SnO ₂ by a lift-off method by CVD.

When the indium tin oxide (ITO) is formed using the photoetching method, the ITO is deposited on the front substrate 170 when the scan electrode 180a and the sustain electrode 180b are formed, and the photo is deposited on the deposited ITO. The resist is applied and dried. Thereafter, the patterned photomask is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the scan electrode 180a and the sustain electrode 180b.

In addition, in the case of forming the scan electrode 180a and the sustain electrode 180b by using the lift-off method, the photoresist is coated on the front substrate 170, and then, the SnO ₂ is formed on the coated photoresist. The photomask on which the pattern is formed is placed and exposed by irradiation with light. After the exposure process, the uncured portion is developed. Thereafter, after the development process, SnO ₂ is deposited, and then the photoresist is removed to form the scan electrode 180a and the sustain electrode 180b.

In addition, a black matrix may be formed on the scan electrode 180a and the sustain electrode 180b, and may include a low melting glass and a black pigment.

The bus electrodes 180a 'and 180b' may be formed of silver (Ag) using a screen printing method or a photosensitive paste method.

In addition, the bus electrodes 180a 'and 180b' may be formed using a photoetching method by sputtering Cr / Cu / Cr or Cr / Al / Cr.

When the bus electrodes 180a 'and 180b' are formed by using the screen printing method, a conductive material paste such as silver (Ag) is printed on the front substrate 170 through a screen mask, and then dried and baked. Form.

In addition, when the bus electrodes 180a 'and 180b' are formed by using the photosensitive paste method, photosensitive silver (Ag) is printed and coated on the front substrate 170 and dried. Subsequently, a photo mask having a predetermined pattern is placed on the coated silver and exposed to light. After the exposure process, the uncured portion is developed and then dried and baked again to form the bus electrodes 180a 'and 180b'.

In addition, when the bus electrodes 180a 'and 180b' are formed using the photoetching method, the Cr / Cu / Cr or Cr / Al / Cr is deposited on the front substrate 170, and the deposited Cr The photoresist is applied and dried on / Cu / Cr or Cr / Al / Cr. Thereafter, a photo mask having a predetermined pattern is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the bus electrodes 180a 'and 180b'.

The scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b' are discharge electrodes, and the plasma display panel according to the present invention does not use ITO material and the bus electrode 180a does not use an ITO material. Only 180b 'may form an ITO-less structure discharge electrode integrating the functions of the scan electrode 180a and the sustain electrode 180b.

Subsequently, as illustrated in FIG. 5B, a first dielectric layer 190 is formed on the front substrate 170 on which the scan electrode 180a, the sustain electrode 180b, and the bus electrodes 180a 'and 180b' are formed.

The first dielectric layer 190 may be formed by using a screen printing method, a coater method, and a method of laminating the green sheet.

The coater method may use any one of two methods, a roll or a slot.

Subsequently, a protective film is formed on the first dielectric layer 190 as shown in FIG. 5C.

Here, the protective film according to the present invention includes a first protective film 195a and a second protective film 195b.

The first passivation layer 195a is formed on the first dielectric layer 190. And, a dopant such as silicon (Si) may be included. The first passivation layer 195a may be formed by chemical vapor deposition (CVD), electron beam (E-beam), ion-plating, sol-gel, sputtering, or the like.

At this time, when silicon is doped in the first passivation layer 195a, the jitter value of the address period is reduced. However, when the silicon content is larger than a predetermined value, the jitter value may be increased. Therefore, the silicon is preferably doped in a range where the jitter value is minimized, and it is preferable that the silicon is included in the protective film at an optimum content of 20 to 500 parts per million (ppm). And other materials may be used as dopants instead of silicon to reduce jitter.

The second passivation layer 195b is formed on the first passivation layer 195a as shown in the figure.

Here, the second passivation film 195b includes a single crystal MgO powder.

In this case, the second passivation layer 195b may be formed only on a part of the surface of the first passivation layer 195a, not the entire surface. That is, the second passivation layer 195b may be formed in an irregular shape as shown, and may be formed in an area of 0.5 to 25% of the surface of the first passivation layer 195a.

On the other hand, as shown in Figure 5 (c), on the second protective film 195b according to the present invention, a charge control agent (CCA) particles (95C) having a high chargeability is applied according to the present invention do.

That is, by spraying the CCA particles 195c on the second passivation layer 195b in a spray manner, a discharge voltage reduction effect may be generated in a discharge space without reducing efficiency and luminance.

Currently, after the address discharge is completed, the scan electrode 180a and the sustain electrode 180b have charges of different polarities (for example, the scan electrode 180a has to accumulate positive charges, and the sustain electrode 180b Negative charges must be accumulated] to allow continuous discharge when sustain pulses are applied.

At this time, the wall charge is accumulated in a region where the scan electrodes and the sustain electrodes 180a and 180b of the first dielectric 190 are positioned before the actual discharge occurs, and when a voltage is applied to the address electrode 120, the actual discharge occurs. . In other words, the wall charge is maintained just before the discharge start voltage (memory effect) when the next discharge occurs.

That is, the present invention is to reduce the discharge start voltage by supplying the above charges of the wall charges, and the CCA particles 195c are coated on the second protective film 195b in the discharge space.

As described above, the CCA particles 195c may adsorb impurity gas in the discharge space, thereby affecting wall charge as the surface resistance of the second passivation layer 195b increases, thereby lowering the discharge start voltage.

In addition, the CCA particles 195c may have charges in the second passivation layer 195b in the discharge space, thereby affecting wall charges according to an electric field application effect, thereby lowering the discharge start voltage.

As described above, the CCA particles 195c form an organic material on the surface of the core material through hydrophobic surface modification based on the inorganic material, which is a core material by synthesizing the inorganic material and the organic material.

In the present invention, the core material may be formed of at least one powder of silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ) that have been hydrophobically surface-modified, among which a specific resistance is relatively high. Large silica (SiO ₂ ) is preferred.

Such silica (SiO ₂ ) may be formed by the following process.

That is, when silicon tetrachloride SiCl ₄ and 2H ₂ and O ₂ are mixed and heated at approximately 500 to 1000 ° C., CC ₂ particles 195c, fumed silica SiO ₂ and hydrochloric acid 4HCl are added. Formed, thereby obtaining silica (SiO ₂ ).

In addition, when the sodium water glass Na ₂ O * 3.3SiO ₂ and sulfuric acid H ₂ SO ₄ are mixed and agitated, SiO ₂ , which is CCA particles 195c, and silica silica, sodium sulfate Phosphorus Na ₂ SO ₄ and H ₂ O, which is water, are formed, thereby obtaining silica (SiO ₂ ).

In addition, the silica (SiO ₂ ) may be subjected to hydrophobic surface modification by the process shown in FIG. 8. At this time, when the surface of the CCA particles 195c according to the present invention is hydrophobicly treated by the process shown in FIG.

As described above, the CCA particles 195c are added to the dispersant in an amount of 0.01 to 10 wt% to disperse, and the organic solvent in which the CCA particles 195c are dispersed is sprayed onto the second passivation layer 195b. . The dispersant may be acrylic, epoxy, urethane, acrylic urethane, alkyd, poly amid polymer, polycarboxylic acid, or mixtures thereof. use.

Then, when dried to approximately 100 ~ 200 ℃, the CCA particle layer (195c) for lowering the discharge voltage according to the present invention is formed.

In this case, the powder size of the CCA particles (195c) may be 0.1 to 1㎛, it may be formed by scattering so that the CCA particles (195c) occupy 0.5 to 25% of the area of the second protective film (195b). .

<Second Example >

6A through 6F are flowcharts illustrating an embodiment of a method of manufacturing a back substrate of a plasma display panel according to the present invention.

In the second embodiment of the present invention, the partition wall 140 is formed by mixing the CCA particles 195d according to the present invention with the partition material, thereby reducing the discharge voltage by the CCA particles 195d, thereby reducing the power of the plasma display panel. Consumption can be reduced and discharge efficiency can be improved.

First, as shown in FIG. 6A, the address electrode 120 is formed on the rear substrate 110. Here, the back substrate 110 forms a glass for display substrate or soda-lime glass through a process such as milling or cleaning.

The address electrode 120 may be formed of silver (Ag) using a screen printing method or a photosensitive paste method.

In addition, the address electrode 120 may be formed using a photoetching method by sputtering Cr / Cu / Cr or Cr / Al / Cr.

In this case, when the address electrode 120 is formed using the screen printing method, a conductive material paste such as silver (Ag) is printed on the rear substrate 110 through a screen mask, and then dried and baked. do.

In addition, when the address electrode 120 is formed using the photosensitive paste method, photosensitive silver (Ag) is printed and coated on the back substrate 110 and dried. Subsequently, a photo mask having a predetermined pattern is placed on the coated silver and exposed to light. After the exposure process, the uncured portion is developed and then dried and baked again to form the address electrode 120.

In addition, when the address electrode 120 is formed using the photoetching method, the Cr / Cu / Cr or Cr / Al / Cr is deposited on the rear substrate 110, and the deposited Cr / Cu / The photoresist is applied and dried on Cr or Cr / Al / Cr. Thereafter, a photo mask having a predetermined pattern is placed on the photoresist and exposed to light. After the exposure process, the uncured portion is developed and then etched to form the address electrode 120.

Referring to FIG. 6B, the second dielectric layer 130 is formed by using any one of a screen printing method, a coater method, and a green sheet method by laminating a filler such as low melting glass and TiO ₂ . can do.

The coater method may use any one of two methods, a roll or a slot.

Subsequently, partition walls are formed to distinguish each discharge cell from those shown in Figs. 6C to 6E.

At this time, the partition material 140a according to the second embodiment of the present invention comprises a mother glass, a filler, and 0.01 to 10 wt% of CCA particles 195d.

In this case, the mother glass may include PbO, SiO ₂ , B ₂ O _3, and Al ₂ O ₃ , and the filler may include TiO ₂ and Al ₂ O ₃ .

In addition, by adsorbing impurity gas in the discharge space, the CCA particles 195d according to the second embodiment of the present invention may affect the wall charge as the surface resistance of the partition wall 140 increases, thereby lowering the discharge start voltage. In addition, the barrier 140 in the discharge space may have a charge, thereby affecting the wall charge according to the electric field application effect, thereby lowering the discharge start voltage.

As described above, the CCA particles 195d form organic material on the surface of the core material through hydrophobic surface modification based on the inorganic material, which is a core material by synthesizing the inorganic material and the organic material.

In the present invention, the core material may be formed of at least one powder of silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ) that have been hydrophobically surface-modified, among which a specific resistance is relatively high. Large silica (SiO ₂ ) is preferred.

After the vehicle (including the binder and / or the solvent) is mixed with the partition material 140a including the CCA particles 195d to make the partition 140a for manufacturing the partition wall 140 according to the present invention, as shown in FIG. 6C. Likewise, after the barrier 140a is coated on the second dielectric layer 130, the barrier 140 is dried for a predetermined time.

Thereafter, the coating and drying processes are repeatedly performed to form a constant thickness (for example, 150-200 μm), and the partition material 140a is patterned to form the partition wall 140 according to the second embodiment of the present invention. To form.

In this case, as shown in FIGS. 9D and 9E, the patterning process is performed by covering and exposing a mask 155 and then developing.

That is, when the mask 155 is positioned and exposed to a portion corresponding to the address electrode, only the portion irradiated with light remains after the development and baking process to form the partition wall 140.

In addition, although not shown in FIG. 6, after the partition wall 140 is completed without including the CCA particles 195d in the partition material 140a, the CCA particles 195d are disposed on the completed partition wall 140. It can also be formed by spraying.

That is, the CCA particles (195d) are added to the dispersant in an amount of 0.01 to 10 wt% to disperse, and the organic solvent in which the CCA particles (195c) are dispersed is sprayed onto the finished partition wall 140 and dried. It may be formed.

<Third Example >

In the third embodiment of the present invention, the phosphor layer 150 is formed by mixing the CCA particles 195d according to the present invention to a phosphor paste, thereby reducing the discharge voltage by the CCA particles 195d, The power consumption can be reduced, and the discharge efficiency can be improved.

That is, as shown in FIG. 6F, phosphors 150a, 150b, and 150c are coated on the side of the partition wall 140 and the region of the second dielectric 130 in contact with the discharge space and the phosphor layer 150. ).

That is, the phosphor layer 250 is coated with phosphors of R, G, and B in order according to each discharge cell, and is applied by screen printing or photosensitive paste.

At this time, the phosphor layer 150 according to the present invention comprises each of the red, green and blue fluorescent material, and 0.01 to 20 wt% CCA particles (195d).

(Y, Gd) BO ³ : Eu ³⁺ is used as the red (R) fluorescent material, Zn ₂ SiO ₄ : Mn ²⁺ is used as the green (G) fluorescent material, and BaMgAl is used as the blue (B) fluorescent material. ₁₀ O ₁₇ : Uses Eu2 ⁺ a lot.

As the CCA particles 195d according to the third embodiment of the present invention adsorb impurity gas in the discharge space, the surface resistance of the phosphor 150 is increased, thereby affecting the wall charge and lowering the discharge start voltage. Since the electric charges are applied to the phosphor 150 in the space, the discharge start voltage can be lowered by affecting the wall charges according to the electric field application effect.

As described above, the CCA particles 195d form organic material on the surface of the core material through hydrophobic surface modification based on the inorganic material, which is a core material by synthesizing the inorganic material and the organic material.

In the present invention, the core material may be formed of at least one powder of silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ) that have been hydrophobically surface-modified, among which a specific resistance is relatively high. Large silica (SiO ₂ ) is preferred.

A vehicle (including a binder and / or a solvent) is mixed with the phosphor paste containing the CCA particles 195d as described above, the phosphor paste is applied to the discharge space in the partition wall 140, and then dried and fired. The phosphor layer 150 according to the third embodiment of the present invention may be formed.

In addition, although not shown in FIG. 6, after the phosphor layer 150 is completed without including the CCA particles 195d in the phosphor paste, the CCA particles 195d may be placed on the completed phosphor layer 150. It can also be formed by spraying.

That is, the CCA particles (195d) is added to the dispersant in an amount of 0.01 to 10wt% to disperse, and the organic solvent in which the CCA particles (195c) are dispersed is sprayed onto the finished phosphor layer 150 and dried. It may be formed by.

Hereinafter, referring to FIG. 7 and Table 1, the characteristics of the PDP containing the CCA particles according to the present invention and the characteristics of the PDP containing the CCA particles according to the present invention are compared.

7 is a graph showing opposing voltages of the PDP without the CCA particles according to the present invention and the protective layer and the phosphor layer of the PDP containing the CCA particles according to the present invention.

Table 1 is an example showing the characteristics of the PDP containing the CCA particles according to the present invention and the characteristics of the PDP containing the CCA particles according to the present invention.

Index CCA Class Efficiency (@ Vs, m) Surface discharge voltage Shield opposing voltage Phosphor opposing voltage One Not added 1.655 276.4 199.8 294.6 2 SiO ₂ 1.779 240.6 172.8 283.8 3 Al ₂ O ₃ 1.765 244.6 174.4 278.8

First, referring to FIG. 7, the PDP to which the CCA particles are added according to the present invention shows that the protective film counter voltage and the phosphor counter voltage are lower than those of the PDP to which the conventional CCA particles are not added.

Therefore, since the surface discharge voltage is (Vxy + Vzy) / 2, it can be seen that the PDP to which the CCA particles are added according to the present invention has a lower discharge voltage than the PDP to which the conventional CCA particles are not added.

In addition, referring to Table 1, in the case of the PDP containing no conventional CCA particles, the efficiency is' 1.655 ', the surface discharge voltage is' 276.4', the protective film opposing voltage is' 199.8 ', and the phosphor opposing voltage is' 294.6 '.

In contrast, in the case of the PDP to which the alumina (Al ₂ O ₃ ) CCA particles according to the present invention are added, the efficiency is '1.765', the surface discharge voltage is '244.6', the protective film opposing voltage is '174.4', and the phosphor opposing As the voltage is '278.8', it can be seen that the efficiency is increased and the surface discharge voltage, the protective film opposing voltage, and the phosphor opposing voltage are reduced than the PDP in which the conventional CCA particles are not included.

In the case of the PDP to which silica (SiO ₂ ) CCA particles are added, the efficiency is' 1.779 ', the surface discharge voltage is'240.6', the protective film opposing voltage is' 172.8 ', and the phosphor opposing voltage is' As 283.8 ', it turns out that efficiency is raised compared with the PDP which does not contain the conventional CCA particle, and the surface discharge voltage, the protective film opposing voltage, and the phosphor opposing voltage were reduced.

Meanwhile, the front substrate 170 completed by the processes of FIGS. 5 and 6 is bonded and sealed with the rear substrate 110 with the partition wall 140 interposed therebetween, after exhausting impurities therein, the partition wall When the discharge gas 160 of Xe + Ne or Xe + He or Xe + Ne + He is injected into the discharge cell 140 and then sealed, the plasma display panel of FIG. 1 is completed.

Hereinafter, the sealing process of the front substrate 170 and the back substrate 110 will be described in detail.

The sealing process is usually performed by screen printing, dispensing, or the like.

The screen printing method is a method of printing a sealing material having a desired shape by holding a patterned screen at a predetermined interval, placing the patterned screen on a substrate, and pressing and transferring a paste necessary for forming the sealing material. The screen printing method has advantages of simple production equipment and high use efficiency of materials.

The dispensing method is a method of forming a sealing material by directly discharging a thick film paste onto a substrate using air pressure using CAD wiring data used for screen mask fabrication. The dispensing method has the advantage of reducing the manufacturing cost of the mask and having a large degree of freedom in the shape of the thick film.

9A is a view illustrating a process of bonding the front substrate and the back substrate of the plasma display panel.

FIG. 9B is a cross-sectional view taken along the line AA ′ of FIG. 9A.

As shown, the sealing material 600 is applied to the front substrate 170 or the rear substrate 110. Specifically, the substrate is printed or dispensed at the same time with a predetermined interval at the outermost side of the substrate and applied.

Next, the sealing material 600 is fired. In the firing process, the organic material included in the sealing material 600 is removed, and the front substrate 170 and the rear substrate 110 are bonded.

In this firing process, the width of the sealing material 600 may be widened and the height may be low.

In the present embodiment, the sealing material 600 is printed or coated, but may be formed in the form of a sealing tape and adhered to the front substrate 170 or the rear substrate 110. And the characteristic of a protective film etc. is improved at predetermined temperature through an aging process.

In addition, a front filter may be formed on the front substrate 170.

The front filter is provided with an electromagnetic shielding film for shielding electromagnetic radiation emitted from the panel to the outside. The electromagnetic shielding film may be patterned in a specific form in order to shield electromagnetic waves while ensuring the visible light transmittance required by the display device.

In addition, a near infrared shielding film, a color correction film, an antireflection film, and the like may be formed on the front filter.

It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit and essential features of the present invention. For example, it will be very easy for those skilled in the art to use the above-described embodiments in combination with each other.

Accordingly, the above detailed description should not be construed as limiting in all aspects and should be considered as illustrative.

The scope of the invention should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the invention are included in the scope of the invention.

1 is a structural diagram showing an embodiment of a plasma display panel according to the present invention.

2 is a view showing a driving device and a connection portion of a plasma display panel according to the present invention.

3 is a view showing a substrate wiring structure of a typical tape carrier package.

4 is a view schematically showing another embodiment of a plasma display device according to the present invention.

5A through 5C are flowcharts illustrating an embodiment of a method of manufacturing a front substrate of a plasma display panel according to the present invention.

6A through 6F are flowcharts illustrating an embodiment of a method of manufacturing a back substrate of a plasma display panel according to the present invention.

7 is a graph showing opposing voltages of the PDP without the CCA particles according to the present invention and the protective layer and the phosphor layer of the PDP containing the CCA particles according to the present invention.

8 is an explanatory diagram showing a hydrophobic surface modification process of CCA particles according to the present invention.

9A is a view illustrating a process of bonding the front substrate and the back substrate of the plasma display panel.

FIG. 9B is a cross-sectional view taken along line AA ′ of FIG. 7A.

Claims (20)

A first substrate having a plurality of discharge electrodes, a first dielectric layer formed on the discharge electrodes, and a protective film formed on the first dielectric layer; And And a second substrate bonded to the first substrate with a partition therebetween and having a plurality of address electrodes, a second dielectric layer, and a phosphor layer. And a charge control agent (CCA) layer formed on the passivation layer to lower the discharge voltage. According to claim 1, The CCA layer is formed of at least one powder of hydrophobically surface modified silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ). The method of claim 2, The CCA layer is dispersed in at least one of 0.01 to 10wt% of silica (SiO ₂ ), alumina (Al ₂ O ₃ ) and titania (TiO ₂ ) in the dispersant, the silica (SiO ₂ ), alumina (Al ₂ O ₃ ) and an organic solvent in which at least one of titania (TiO ₂ ) is dispersed is spray-sprayed on the protective film, and then dried to form a plasma display panel. According to claim 1, The powder size of the CCA layer is a plasma display panel, characterized in that 0.1 to 1㎛. According to claim 1, The CCA layer is formed by 0.5 to 25% of the area of the protective film plasma display panel. The method of claim 1, wherein the protective film, A first passivation layer formed on the first dielectric layer and formed of a magnesium oxide (MgO) thin film; And And a second protective film formed on the first protective film and made of a single crystalline MgO powder. The CCA layer is formed on the second passivation layer. Sequentially forming a plurality of discharge electrodes and a first dielectric layer on the first substrate; Forming a protective film on the first dielectric layer, the protective film including a magnesium oxide (hereinafter referred to as "MgO") thin film; Forming a charge control agent (CCA) layer on the passivation layer to lower the discharge voltage; And And bonding the first substrate and the second substrate on which a plurality of address electrodes are formed with the partitions interposed therebetween. The method of claim 7, wherein The CCA layer is formed of a hydrophobic surface-modified silica (SiO ₂ ), alumina (Al ₂ O ₃ ) and titania (TiO ₂ ) of at least one powder of the manufacturing method of the plasma display panel. The method of claim 8, wherein the CCA layer forming step, mixing and dispersing at least one powder of silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ) in a dispersant in an amount of 0.01 to 10 wt%; Spray-spraying the organic solvent mixed with at least one of the silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ) onto the protective film; And And drying the dispersed organic solvent. The method of claim 7, wherein The powder size of the CCA layer, 0.1 to 1㎛ the manufacturing method of the plasma display panel. The method of claim 7, wherein The CCA layer is a plasma display panel manufacturing method, characterized in that formed in 0.5 to 25% of the protective film area. The method of claim 7, wherein the protective film forming step, Forming a first passivation layer including magnesium oxide (hereinafter referred to as "MgO") on the first dielectric layer; And Forming a second protective film including a single crystalline MgO powder on the first protective film; And the CCA layer is formed on the second passivation film. A first substrate having a plurality of discharge electrodes, a first dielectric layer formed on the discharge electrodes, and a protective film formed on the first dielectric layer; And And a second substrate bonded to the first substrate with a partition therebetween and having a plurality of address electrodes, a second dielectric layer, and a phosphor layer. The phosphor layer may include a charge control agent (CCA) powder for lowering a discharge voltage. The method of claim 13, The CCA is at least one powder of hydrophobic surface-modified silica (SiO ₂ ), alumina (Al ₂ O ₃ ), and titania (TiO ₂ ). The method of claim 13, The CCA is a plasma display panel, characterized in that contained in 0.01 to 10wt% of the phosphor of the phosphor layer. The method of claim 13, The powder size of the CCA, characterized in that 0.1 to 1㎛ plasma display panel. Forming a first substrate provided with a plurality of discharge electrodes; And Forming a second substrate bonded to the first substrate with a partition therebetween and having a phosphor layer including a charge control agent (CCA) powder therein for lowering a discharge voltage; Method of manufacturing a plasma display panel comprising a. 18. The method of claim 17, The CCA is a method of manufacturing a plasma display panel, characterized in that the hydrophobically surface-modified silica (SiO ₂ ), alumina (Al ₂ O ₃ ) and titania (TiO ₂ ) powder. 18. The method of claim 17, The CCA is 0.01 to 10wt% of the phosphor layer of the phosphor layer, characterized in that the manufacturing method of the plasma display panel. 18. The method of claim 17, The powder size of the CCA is 0.1 to 1㎛ manufacturing method of the plasma display panel.

Images