KR20080005447A - Method and device for supplying and discharging carriers with electronic components - Google Patents

Abstract

The invention relates to methods for displacing a carrier with electronic components from a supply container to a processing station, methods for displacing a carrier with electronic components from a processing station to a supply container, as well as to methods for supplying to a processing station and discharging from a processing station of carriers with electronic components. The invention also relates to devices for displacing a carrier with electronic components between a supply container and a processing station, and to an assembly of such devices with a processing station for carriers with electronic components.

Description

TECHNICAL AND DEVICE FOR SUPPLYING AND DISCHARGING CARRIERS WITH ELECTRONIC COMPONENTS

The present invention provides a method of moving a carrier with electronic components from a supply container to a processing station, a method of moving a carrier with electronic components from a storage container to a supply container, and supplies a carrier with electronic components to a processing station and feeds them to the processing station. It relates to a method of taking out from the. The invention also relates to an apparatus for moving a carrier with electronic components between a supply container and a processing station and an assembly of a processing station for a carrier with such apparatus and electronic components.

In the processing of a carrier having an electronic component, more specifically, a carrier provided with a semiconductor circuit, a large and complicated equipment is used. Possible treatments for such carriers include inter alia connection (wire bonding, soldering), encapsulating parts (modulating), removing excess material (degating), and inspecting parts. And the like. The carrier may consist of a metal layer (lead frame) or may have a more complicated layered structure (board). Such carriers are generally supplied to and taken out of a supply container (cassette) in which the carriers can be stored in a stacked state without contacting each other. It is common to place the carrier in an unloading device (off loader), in which the carrier is removed from the supply container and placed on the conveyor belt to be subsequently moved by the conveyor belt in the direction of the processing station. After the carrier arrives at the processing station, the carrier is located at the processing station using a manipulator moved towards the carrier at the same time and removed from the processing station after the processing is performed. Finally, the treated carrier is taken out of the loading device, which is usually arranged on the conveyor belt side opposite the unloading device, which carrier is removed from the conveyor belt and placed in the supply container for the processed product. Using this conventional feeding and dispensing system, it is possible to operate a plurality of adjacently located processing stations, so that the conveyor belt runs along all processing stations for operation. With this conventional system, the supply and withdrawal of the carrier can be performed in a reliable manner and the supply and withdrawal of the carrier can be separated (at least substantially) from a separate processing station.

US Pat. No. 6,069,034 discloses an automatic functional device for curing a material so that the part is fixed on the lead frame. Containers (cassettes) in which the lead frames are stacked are arranged at a height at which the blades which are intermittently moved can push the lead frame from the cassette every time by a vertically movable lift plate. The lead frame pushed out of the cassette is then moved to the curing chamber still in the same plane.

It is an object of the present invention to simplify the loading and unloading of a processing station for a carrier with an electronic component which has not been apparent so far compared to the prior art and to provide the means required for this.

For this purpose, the present invention provides a method for moving a carrier according to claims 1 and 8 from a supply container to a processing station. The first plane and the second plane are parallel to each other and may optionally coincide with each other. Thus, unlike in the prior art, "sliding" of the carrier into the encapsulation device can be used when encapsulating the electronic component. Up to now, this has only been done using manipulators which use a gripper to position the carrier in the encapsulation device (mould) in the treatment position. The teachings herein include using the gripper to accurately position the carrier and enable encapsulation. However, through the method of the present invention, it is possible to slide the carrier into the encapsulation device, which enables a significant simplification of the supply of the carrier (as well as the extraction). Since only a separate carrier can be freely moved in a single plane for every operating means, it is possible to make the work faster, more reliable and at a lower cost. The freedom of movement of the operating means, which is limited compared to the prior art, allows the operating means to take a relatively simple form and also to operate the operating means at high speed and accuracy. Another important advantage is that the freedom of movement of the operating means is limited, thereby enabling the supply of carriers to a very limited space. It is also possible for the movement of the carrier during the processing steps B) and C) to be guided by a guide provided for this purpose.

It is further advantageous if the carrier is supported by a gas stream during at least one of the processing steps B) and C) and at least one of the processing steps F) and G). An advantage of the carrier supported by the gas stream and more specifically the air stream is that uniform heating or cooling of the carrier is thus possible. Therefore, the ultra-thin carriers (for example, having a thickness of 0.1 to 0.25 mm in the form of the substrate) can be slid without causing undesirable deformation of the carriers.

As another function, the carrier with the electronic component can be rotated between the processing steps A) and C) in a plane parallel to the first plane and the second plane, for example by rotating the carrier for example more than 180 °. Do. An important condition of accurate positioning of the carrier in the encapsulation device of the prior art relates to the presence of the positioning pin on which the carrier is positioned in such a way that the positioning pin fits precisely into the opening arranged in the carrier. Positioning in this manner makes it difficult or even impossible to slide into (or out of) the encapsulation device. However, according to the present invention, the electronic component can be positioned at the processing station by moving the positioning member with respect to the carrier placed at the processing position. This means that with respect to the second plane, the movable positioning member is movable by a moving part perpendicular to the second plane (and thus also in the first plane). The positioning member (eg positioning pin) may for example be firmly connected to the movable upper mold part (upper mold) or may be movable in the encapsulation device.

The intermediate position can be switched (eg vertically) between the first plane and the second plane to compensate for the difference in level without the gripper (undesired) that must be applied for this purpose. A simple table that can be moved vertically is sufficient for this purpose. If the first plane and the second plane coincide, this additional possibility is of course unnecessary.

Upon movement between the supply container of the carrier with the electronic components and the processing position of the carrier, the carrier can also pass through an intermediate processing station, which can optionally be combined with the movable table described in the previous section.

In particular, from the method as defined in claim 8, it is clear that the transport path from the supply container to the processing station is very simple compared to the prior art, and the complexity of positioning is somewhat more than in the previous path in the positioning of the supply container. . The advantage is that the carrier (easy to break) is treated in a generally protected state (i.e. stored in the supply container), thereby reducing the chance of damage to the carrier during or as a result of the transfer operation. to be. Another advantage is that the transfer operation is divided into sub-processes, each of which is simpler than the integrated carrier operation according to the prior art. These separate sub-processes can be mechanized and automated relatively easily. In addition, a supply container with a plurality of carriers may be unloaded, thereby driving a very short and very simple (generally straight) transport path between two carriers to be moved continuously from the supply container. This, in addition to the advantages already mentioned in the previous section, results in a short minimum cycle time between two carriers which are fed continuously.

In order to advance (at least partially) the carrier out of the supply container, the carrier with the electronic component can be moved from the intermediate position to the processing position via at least a pair of driven rollers during processing step G). It is also possible for the carrier to pass through the intermediate station in the movement of the carrier between the supply container and the processing position. Such a processing station can realize heating (preheating) of the carrier, for example, so that the carrier is located in the pre-heated state, for example in the encapsulation device.

The present invention also provides a plurality of methods according to claims 14 and 20 for moving the treated carrier with electronic components from the processing station to the supply container. In a preferred embodiment, the carrier with the electronic component is drawn out to the processing station by moving the positioning means relative to the carrier located at the processing position. The advantages described above based on the supply of the carrier to be treated to the encapsulation device can also be realized when removing the carrier after processing from the encapsulation device. Upon discharge, the processed carrier with the electronic component can be rotated between the processing steps K) and M) in a plane parallel to the first and second planes. The movement of the carrier during the processing steps K) and M) can be guided by a guide provided for this purpose, which can also be used for the supply of the carrier. As it is possible to use the guide in the supply of the carrier, the intermediate position may also be switched between the first plane and the second plane at the time of take-out. Sliding of the carrier is generally in the horizontal plane. Therefore, only the take out operation means should provide limited freedom for movement. The above-mentioned advantage is that the movement of the operating means has a relatively limited freedom compared to the prior art, whereby it can take a simple form and function with great accuracy. Another further advantage is that the treated carrier can be rotated in a very limited space during its take out as required. The movement of the carriers during the processing steps P) and Q) can be done in a straight line. During at least one of the processing steps K) and M) and at least one processing step of the processing steps P) and Q), the advantages of the carrier supported by the gas stream are supported by the gas stream during the supply of the carrier. Corresponds to the aforementioned advantages of the carrier.

According to the above advantages of the supply of carriers to the processing station, these advantages can also be realized when taking out the processed carrier from the processing station. The supply container is configured to receive a plurality of carriers having electronic components in which the other carrier is located on one carrier, thereby performing at least one of the processing steps O) to Q) after performing the processing steps N) to Q). The step may be performed on a carrier having the electronic components fed continuously. Again, it is possible to continuously move the carrier through at least a pair of driven rollers. In movement, the carrier may pass through the intermediate station, for example for clamping the treated carrier and / or for controlled curing of the carrier provided with the encapsulation material. Therefore, undesirable deformation of the carrier and / or formation of undesirable stresses in the carrier can be prevented.

The invention also relates to a combined method of continuously supplying a carrier according to claim 26 to a processing station and then withdrawing from the processing station, in which the first plane and the second plane are for example coincident with each other. Can be. The supply container for supplying the carrier having the electronic component to be processed may be removed from the intermediate station of the processing station after supplying the carrier to the processing station, and the supply station to which the processed carrier with the electronic component is subsequently blown is subsequently processed. It is arranged adjacent to the extraction position of. These two different supply containers, which are usually the same supply container, can be arranged via the joint support structure. It is also possible that multiple processing stations can be provided and unloaded in a single configuration.

The invention also provides an apparatus for moving a carrier having an electronic component according to claim 31 between a supply container and a processing station. By means of an intermittent movement pattern, such a movable support structure, such as a support structure that is movable vertically (straightly), is always alternately adapted to connect other supply containers at at least one height of the processing station. can do. Such a device has the advantages described above with reference to the method according to the invention, namely structural simplification, fast moving speed, high positional accuracy obtained with a relatively limited investment, and a compact configuration of the device. The device of the invention is preferably provided with a guide extending in parallel between the movable support structure and the encapsulation station. In a variant of the embodiment with advantages, gas supply means are provided for generating a gas stream for supporting the carrier. These means may comprise, for example, blow nozzles disposed under the guides.

The encapsulation station is provided with positioning means movable in the encapsulation device relative to the processing position of the carrier, so that the supply and withdrawal of the carrier can be made possible by sliding, and the high positional accuracy of the carrier can still be obtained. Can be. More specifically, the positioning member is movable relative to the plane with the moving part perpendicular to the first plane. The positioning member may for example comprise a positioning pin or may form part of the movable top mold (upper mold part).

In another preferred embodiment, the encapsulation device is provided with a guide that engages at least partially the face of the carrier to be encapsulated, the guide being configured to guide the encapsulation material. Such a guide may be integrated with a feed of an encapsulation to be produced for the face on which encapsulation must be made, also termed top gating. The edge of the carrier is guided to prevent contamination by the encapsulation material, and also the sliding of the carrier into an encapsulation station, such as a so-called transfer molding apparatus, and the sliding of the carrier out of the encapsulation station. Can be enabled.

The movable support structure can support the supply container at at least two levels, a first level for receiving a carrier having an electronic component to be processed, and a second level for receiving a carrier after being processed having an electronic component. . Therefore, in a stacked situation, a plurality of levels are available, and the container can be supported at that level. Thus, the processing capacity of the movable support structure can be increased in a simple manner. For example, as the likelihood of contamination is reduced, the likelihood of interruption may also be reduced.

In a variant of the specific embodiment, the apparatus of the invention moves (straight movement) along the plurality of processing stations so that the plurality of processing stations can be loaded and unloaded in a straight line using one of the devices according to the invention. It is also possible. The combination of the vertically movable support structure and the device movable along the plurality of processing stations form an advantageous variant embodiment. In order to provide both supply and withdrawal of a carrier with one device, a movable support structure is provided with at least two supply containers, a first supply container for receiving a carrier having an electronic component to be processed, and a processed with electronic component. It is advantageously configured to support a second supply container for receiving a later carrier.

If the operating device is heatable, it becomes possible to condition (heat) the product to be moved during the feed to achieve improved quality in the treatment process (specifically encapsulation). In taking out the treated product, it may be advantageous to gradually reduce the temperature of the carrier after the treatment, or to maintain the carrier after the treatment above a predetermined temperature. This serves to further improve the quality of the final product. It should be noted that another method according to the invention is advantageous because it can further be applied to the preheating and / or postheating of the carrier in the supply of the carrier to be treated and the extraction of the treated carrier.

In a variant embodiment, the movable support structure may be equipped with at least one driven endless conveyor for moving the supply container. The linearly movable operating device can take a very simple form, has the advantage that the operating device does not have to have a product-related configuration for good function, and the simple and universal pusher is independent of the specific shape and dimensions of the carrier. It can be pushed. Another important advantage is that the device according to the invention results in significant space savings over conventional supply and take out means for carriers of electronic components. In the configuration of a plurality of adjacent processing stations, to date, it is common to place loading and unloading stations on opposite sides of a row of processing stations and connect these two stations to a guide that guides along the processing station, which is This means that space is required on three sides of the row of processing stations for the supply and withdrawal of carriers. According to the present invention, only one occupied space is maintained on one of the sides of the row of processing stations. This results in significant savings in the space occupied by the processing device for the electronic component. However, the benefit of this space savings is particularly great in conditions where treatment treatment has to be made in a specially controlled environment (eg a clean room environment).

In order to increase the storage capacity, it is advantageous for the device to be provided with one or more buffering positions for maintaining the supply of one or more supply containers, which buffering positions can be connected to the support structure to exchange the supply containers. In such a device the empty or filled supply container (in the case of supply of carriers or ejection of carriers) can be replaced with a supply container of filled or empty condition.

In another variant embodiment, the apparatus of the present invention is a vertical structure for holding at least one supply container for a carrier having an electronic component to be processed and at least one supply container for a treated carrier having an electronic component in a stacked form. The means of transportation is installed. Therefore, both supply and withdrawal of the carrier can be made at the same position in the apparatus. As a result, the device can be further miniaturized and manufacturing costs can be reduced. Such a variant with vertical movement means for filling or emptying the stacked feed containers can be applied in combination with all of the devices described herein, wherein the supply and take-off of the carrier is made at the same point. For example, the method includes vertically moving a plurality of supply containers, one on top of the other.

The invention also provides an assembly of an encapsulation station and a device as described above according to claim 36. Such an assembly comprises a plurality of substations, for example a heating (preheating) station. Another possibility for a substation relates to an apparatus for limiting the deformation of a carrier due to the processing the carrier undergoes at the processing station. The intermediary position between the processing station and the supply container may be determined by a support that is linearly movable in a direction such that the moving parts are perpendicular to the first and second planes parallel to each other. As mentioned above, the support may also have multiple parallel support positions, one on top of the other.

1 is a perspective view of an embodiment of an assembly of an apparatus and an encapsulation station according to the invention.

2 is a front view of an apparatus for supplying and withdrawing a carrier having an electronic component according to the present invention.

3 is a schematic plan view of an assembly of an apparatus for feeding and withdrawing multiple processing stations and carriers.

4 is a side view of a processing station consisting of a device for the supply and withdrawal of a carrier with electronic components according to the invention and some interconnecting substations.

5 is a side view of another embodiment of an apparatus for supplying and withdrawing a carrier having an electronic component according to the present invention.

6A is a plan view of another embodiment of an apparatus for supplying and withdrawing a carrier having an electronic component according to the present invention, and FIGS. 6B and 6C are for supplying and withdrawing a carrier having an electronic component as shown in FIG. 6A. A schematic side view and schematic front view of a portion of the device, and FIG. 6D is a top view of a subsequent alternative embodiment of the device for supply and withdrawal of a carrier having an electronic component in accordance with the present invention.

Hereinafter, the present invention will be described in more detail based on the non-limiting exemplary embodiment shown in the accompanying drawings.

1 is a perspective view of an assembly 100 of three encapsulation stations 101, 102, 103 assembled to a joint housing 104. This housing 104 is provided with a supply station 105 for a cassette, not shown in the figure, having a carrier to be processed. The feed station is equipped with a lift system for this purpose, whereby the cassette fed by the endless conveyor belts 106, 107 installed at two levels, one above the other, can reach the required height. . After the feed station 105 has placed the cassette at the required height, the carrier is moved out of the cassette (first plane) and slides onto a translatable table 108 that has been moved to the feed station 105 for this purpose. Can be. The transition table 108 has two support levels 109, 110 through which the carrier can slide. The conversion table 108 is moved to one of the encapsulation stations 101, 102, 103 to accommodate the treated carrier (provided with the encapsulation material) on the empty support level 109 or 110. Alternatively, the loaded carrier is supplied to one of the encapsulation stations 101, 102, 103. For this purpose, the switching table 108 is provided with a lift device, whereby the switching table 108 can be moved vertically. The encapsulation stations 101, 102, 103 are configured such that the carrier can slide in or slide out in the horizontal plane of the switching table 108. There is no vertical movement during loading and unloading of the encapsulation stations 101, 102, 103. And, when the processed carrier exits the cassette and slides onto the switching table 108 and also exits the switching table 108 and slides into the cassette, vertical movement of the carrier is also not achieved. However, this is less innovative than the loading and unloading of the encapsulation stations 101, 102, 103 can be realized with only the horizontal movement of the carrier. The transition table 108 may also be implemented in such a way that one of the support levels 109, 110 is provided with an anti-twist unit or any other unit such as, for example, a heat treatment station. In addition, the switching table 108 may take a form rotatable about a vertical axis.

2 shows a cassette 1 having a plurality of carriers 2 to be processed and a cassette 3 for the purpose of containing the treated carriers. The cassettes 1, 3 are held fixed by the support structure 5 via the clamping device 4. The support structure 5 can move vertically by operating the endless conveyor belt 6 driven by the motor 7 (see arrow P1). By moving the support structure 5, the cassette 1 can be positioned at a position where the carrier 2 can slide out at the correct height, and the cassette 3 is placed at a position where the processed carrier can slide in. Can be located. The support structure 5, the conveyor belt 6 and the motor 7 are connected to the frame 8, which is operated in a horizontal direction by the second conveyor belt 9 by operating the motor 10. Arrow P2). By moving the frame 8, the support structure 5 can be connected to a plurality of adjacently located processing stations not shown in FIG. 2.

3 shows a plan view of three processing stations 20 in which conveyor belts 21 are arranged adjacently. The conveyor belt 21 is driven by the motor 22 (like the second conveyor belt 9 and the motor 10 of FIG. 2). By moving the conveyor belt 21, the frame 23 located on the conveyor belt 21 is moved at the same time. The cassette is mounted on the frame 23, and only the upper cassette 24 is shown in the figure. In order to push the carrier out of the cassette 24, the frame is provided with a pusher 25 which can move in a straight reciprocating manner. If a gripper (not shown) is provided on the pusher 25, it is possible to move the processed carrier from the processing station 20 to the cassette 24 using the pusher 25.

FIG. 4 shows a device 30 for supply and withdrawal of a carrier with an electronic component 32 according to the invention, wherein the processing station 31 is connected to a few substations 33, 34). The carrier supply and take-out device 30 uses a mechanism as described with reference to FIG. 2, for which purpose the carrier 32 is positioned at the height of the passage opening 36 in the case of the processing station 31. The carrier 32 is supplied from the upper cassette 35 which becomes the height (refer to arrow P3). Then, the pusher 37 driven by the rotor arm 38 connected to the electric motor 39 pushes the carrier 32 out of the cassette 35 (see arrow P4). The carrier will be engaged by a pair of rollers 40 forming part of the processing station 31. The pair of rollers 40 driven by the electric motor 41 carry the carrier 32 to the heating plate 42 to preheat the carrier 32. The carrier 32 is preheated and then advanced toward the transfer mold 34, in which the electronic components located on the carrier 32 are encapsulated into the epoxy resin housing 43. In order to transfer the heating plate 42 to the transfer mold 34, transfer means (not shown) may be used as necessary. After completing the encapsulation process, the second pusher 44 carries the carrier provided with the encapsulation material 43 back to the first substation 33. The first substation 33 in FIG. 4 takes a plurality of forms in such a way that it can be moved vertically (see arrow P5). This carrier with the epoxy resin housing 43 is clamped in the substation 33 in the lower part for some time to prevent deformation (twisting) of the carrier with the epoxy resin housing 43. After the carrier with the epoxy resin housing 43 remains in the substation 33 for a sufficiently long time, the carrier with the epoxy resin housing 43 is taken out to the cassette 45 through, for example, a pair of rollers 40. The cassette 45 is of course first positioned for this purpose at a height that connects to the passage opening 36 of the processing station 31.

FIG. 5 shows an apparatus 50 having a stationary lift system 51 for cassettes 52, 53, which is connected to a buffer system 54, whereby the cassette is empty. A cassette 56 with 55 or carrier 57 still to be processed can be supplied to the lift system 51 (see arrows P6 and P7, respectively). Using the lift system 51, an empty cassette 58 or a cassette 59 having a treated carrier 60 may be taken out of the lift system 51 (see arrows P8 and P9, respectively). . For the stationary lift system 51, a movable substation 61 in which a preheat plate 62 and a crimping component 63 are installed to prevent deformation of the carrier provided with the encapsulation material 64. (See arrow P10) is connected. The movable substation 61 may carry the carrier 65 to be processed to a processing station not specifically shown in FIG. 5, and may move each of the carriers provided with the encapsulation material 64. The carrier can be conveyed back to the stationary lift system 51.

FIG. 6A shows an apparatus 70 having two processing stations 71, 72 in which a carrier 74 with electronic components 75 can be supplied from a supply container 73. To this end, the supply container 73 is positioned by the lift device 76 at a height such that the carrier 74 is positioned at the level at which the processing at the processing stations 71, 72 takes place. By moving the operating device 77 in the horizontal plane along the arrow Z1, the carrier 74 can move between the position adjacent to the supply container 73 and the processing stations 71, 72. By means of the linear mover 78 (pushers and / or pullers), the carrier 74 can be pushed into the processing station 71, 72 and the supply container 73, and the processing station 71, 72 and the supply container ( 73 may be withdrawn outside. For the latter function, the withdrawal of the carrier 74 out of the processing station 71, 72 and the supply container 73 is for this purpose followed by the rear of the processing station 71, 72 and the supply container 73. It is also possible to apply different pushers (not shown) which can be located at.

6B is a side view of the apparatus 70 in which the frame 79 is shown in addition to the four supply containers 73. The supply container 73 is supported by four floors 80 which form part of the lift system. By varying the height of the floor 80, the carrier height can be removed from the supply container 73, or the working height of the conveyor 81 schematically showing the opening position of the supply container 73 for containing the treated carrier. In this way, the feed in the Z1 direction (see Fig. 6A) can be realized. 6C is a schematic front view of a lift apparatus with a floor 80 on which a supply container 73 is located. The supply container 73 in this case takes the form of a double in order to keep two carriers at the same level. In addition, the supply container 73 having the carrier still to be treated and the supply container 73 having the carrier already processed are different in this manner, regardless of whether the supply container 73 is in combination with the empty supply container 73. It should be noted that all may be located. All of these supply containers 73 can always be positioned at the required working height via the aforementioned lift device.

FIG. 6D shows a device 85 similar to the device 70 as shown in FIG. 6A. Accordingly, corresponding components are given corresponding reference numerals. Carrier 74 with electronic component 75 can be supplied from supply container 73 to two processing stations 71, 72. To this end, the supply container 73 is again positioned by the lift device 76 to a height at which the carrier 74 is positioned at the level at which the processing is done at the processing stations 71 and 72. By moving the operating device 86 in the horizontal plane according to the arrow Z1, the carrier 74 can move between the positions adjacent to the supply container 73 and the processing stations 71, 72. By the double displacer 87, the carrier 74 can be pushed into the processing station 71, 72 and the supply container 73, and also the processing station 71, 72 and the supply container 73. Can be withdrawn outside of. Unlike the apparatus 70 shown in FIG. 6A, the operating device 86 shown in FIG. 6D uses the device 70 for loading and unloading to the processing stations 71, 72, which also take the dual form. Two holder positions for the carrier 74 are installed so that they can be made more quickly than that. Since the orientation of the two carriers located in the processing stations 71, 72 is generally in the form of facing each other, the supply and withdrawal of the carrier 74 must be adjusted accordingly. To this end, the operating device 86 can rotate as indicated by the attitude of the operating device 86 'shown in dashed lines. Therefore, the operating device 86 can be loaded from two sides.

Claims (45)

A carrier moving method for moving a carrier having an electronic component from a supply container to a processing station, A) the supply container with the carrier with the electronic component to be processed to a specific height such that the carrier with the electronic component to be processed is at least substantially in plane with the intermediate position of the processing station. Positioning; B) moving the carrier having the electronic component to be processed from the supply container to the intermediate position in the first plane; And C) advancing the carrier having the electronic component to be processed from the intermediate position to the processing position of the processing station in a second plane parallel to the first plane Including; After providing the carrier according to step C), the processing station performs an encapsulation process that at least partially encapsulates the electronic component, Carrier movement method. The method of claim 1, The movement of the carrier during the steps B) and C) is guided by a guide provided for this purpose. The method according to claim 1 or 2, Wherein the carrier is supported by a gas stream during one or more steps of steps B) and C). The method according to any one of claims 1 to 3, And said carrier with electronic components rotates between said steps A) and C) in a plane parallel to said first plane and said second plane. The method according to any one of claims 1 to 4, And the carrier having the electronic component is positioned at the processing station by moving a positioning element with respect to the carrier placed at the processing position. The method according to any one of claims 1 to 5, And the intermediate position can switch between the first plane and the second plane. The method according to any one of claims 1 to 6, And the carrier passes through an intermediate processing station upon movement of the carrier with the electronic component between the supply container and the processing position. A carrier movement method for moving a carrier having an electronic component from a supply container to a processing station, D) positioning said supply container with said carrier having electronic components to process adjacent said intermediate station of said processing station; E) arranging the supply container at a height such that, with respect to the intermediate position, the carrier having the electronic component to be processed lies within a first plane connected to the intermediate position; F) moving said carrier with electronic components to be processed from said supply container to said intermediate position via linear movement in said first plane; And G) moving the carrier with the electronic component to be processed from the intermediate position to the processing position of the processing station in a second plane parallel to the first plane Including; The processing station performing an encapsulation process for at least partially encapsulating the electronic component with respect to the carrier placed in the processing position according to step G), Carrier movement method. The method of claim 8, The carrier having an electronic component is located in the processing station by moving a positioning member with respect to the carrier placed in the processing position. The method according to claim 8 or 9, The movement of the carrier during the steps F) and G) is guided by a guide provided for this purpose. The method according to any one of claims 8 to 10, Wherein the carrier is supported by a gas stream during one or more steps of steps F) and G). The method according to any one of claims 8 to 11, And the carrier passes through an intermediate processing station upon movement of the carrier with electronic components between the intermediate position and the processing position. The method according to any one of claims 8 to 12, And the intermediate position can switch between the first plane and the second plane. A carrier moving method for moving a processed carrier having an electronic component from a processing station to a supply container, wherein K) moving said processed carrier with electronic components from a processing position to an intermediate position in a second plane of said processing station; L) specifying the supply container for the processed carrier with electronic components such that the receiving position of the supply container for the treated carrier with electronic components lies in a first plane parallel to the second plane. Positioning at height; And M) moving the processed carrier with the electronic component from the intermediate position to the receiving position of the supply container in the first plane Including; Before carrying out the carrier after the treatment according to step K), the carrier with the electronic component is subjected to an encapsulation process of at least partially encapsulating the electronic component, Carrier movement method. The method of claim 14, The carrier having an electronic component is taken out of the processing station by moving a positioning member with respect to the carrier placed at the processing position. The method according to claim 14 or 15, And said carrier after being processed with electronic components rotates between said steps K) and M) in a plane parallel to said first plane and said second plane. The method according to any one of claims 14 to 16, The carrier movement method is guided by a guide provided for this purpose during the steps K) and M). The method according to any one of claims 14 to 17, Said carrier being supported by a gas stream during at least one of said steps K) and M). The method according to any one of claims 14 to 18, And the intermediate position is switchable between the first plane and the second plane. A carrier movement method for moving a carrier having an electronic component from a processing station to a supply container, N) positioning said supply container adjacent said intermediate station of said processing station to receive said processed carrier with electronic components; O) arranging said supply container at a height such that, relative to said intermediate position, an open receiving position of said supply container lies in a first plane; P) moving the processed carrier, having the electronic component from the processing position, from the processing station to the intermediate position in a second plane parallel to the first plane; And Q) moving the processed carrier with the electronic component from the intermediate position to the supply container via linear movement in the first plane Including; The movement of the carrier during the steps P) and Q) is a smoothly connected movement, Before carrying out the carrier after the processing according to step P), the carrier with the electronic component is subjected to an encapsulation process of at least partially encapsulating the electronic component, Carrier movement method. The method of claim 20, The carrier having an electronic component is taken out of the processing station by moving a positioning member with respect to the carrier placed at the processing position. The method of claim 20 or 21, The movement of the carrier is guided by a guide provided for this purpose during steps P) and Q). The method according to any one of claims 20 to 22, And the carrier is supported by the gas stream during at least one of the steps P) and Q). The method according to any one of claims 20 to 23, wherein And the carrier passes through an intermediate station upon movement of the carrier with the electronic component between the processing position and the extraction position. The method according to any one of claims 20 to 24, And the intermediate position is switchable between the first plane and the second plane. A carrier supply and takeout method for supplying a carrier having an electronic component to a processing station and withdrawing from the processing station, The carrier having the electronic component to be processed is supplied according to the carrier movement method according to any one of claims 1 to 7, and after the processing is completed, the carrier after the treatment with the electronic component is processed according to claim 14 to claim 7. Taken out according to the carrier movement method of any one of claims 19, Carrier supply and takeout method. A carrier supply and takeout method for supplying a carrier having an electronic component to a processing station and withdrawing from the processing station, The carrier having the electronic component to be processed is supplied according to the carrier movement method according to any one of claims 8 to 13, and after the processing is completed, the carrier after the treatment with the electronic component is processed according to claims 20 to 13. Taken out according to the carrier movement method of any one of claims 25, Carrier supply and takeout method. The method of claim 26 or 27, And the first plane and the second plane coincide with each other. The method according to any one of claims 26 to 28, The supply container for supplying the carrier having the electronic component to be processed is removed from the intermediate position after the carrier is provided to the processing station, Wherein the supply container which takes in the carrier after being processed with the electronic component is subsequently located adjacent to the intermediate position, Carrier supply and takeout method. The method according to any one of claims 26 to 29, wherein A supply container for supplying a carrier having an electronic component to be processed, and a supply container to which a processed carrier having an electronic component is supplied are moved through a joint support structure. A carrier moving device for moving a carrier having an electronic component between a supply container and a processing station, A movable support structure for positioning the supply container relative to the processing station; And One or more manipulators that move the carrier with electronic components between the supply container and the processing station and are movable only in parallel planes Including; The processing station is an encapsulation station performing an encapsulation process of at least partially encapsulating the electronic component; Carrier moving device. The method of claim 31, wherein And a guide extending in parallel between said movable support structure and said encapsulation station. 33. The method of claim 31 or 32, And a gas supply means for supporting the carrier to be moved. The method according to any one of claims 31 to 33, wherein The said encapsulation station is provided with the positioning member which is movable in the said encapsulation apparatus with respect to the process position of the said carrier. The method according to any one of claims 31 to 34, wherein Wherein the encapsulation device is provided with a guide engaged on at least partially encapsulated surface of the carrier, the guide configured to guide the encapsulation material. 36. The method of any of claims 31-35, And the operating device is heatable. The method according to any one of claims 31 to 36, The movable support structure is configured to support at least a first supply container for receiving the carrier with the electronic component to be processed and a second container for receiving the carrier after being processed with the electronic component. Moving device. The method according to any one of claims 31 to 37, And the movable support structure is provided with one or more driven endless conveyors for moving the supply container. The method according to any one of claims 31 to 38, One or more buffering positions are provided for holding a supply of the supply container, the buffering positions being connectable to the movable support structure for exchanging the supply containers. . The method according to any one of claims 31 to 39, Carrier movement provided with at least one said supply container for said carrier having electronic components to be processed and a vertical moving means for holding at least one said supply container for said processed carrier with electronic components in a stacked state. Device. 41. An assembly of a processing station and a carrier moving device according to any one of claims 31-40. The encapsulation station is equipped with one or more conveyors for transferring carriers with electronic components between substations for performing subprocesses, The linear movement direction of the operating device parallel to the parallel plane is at least substantially perpendicular to the conveying direction of the conveyor of the processing station, Assembly. The method of claim 41, wherein An apparatus for limiting deformation of the carrier due to the processing carried by the carrier at the processing station comprises: between the processing station and an apparatus for moving the carrier with electronic components between a supply container and the processing station, And arranged. 43. The method of claim 41 or 42, The intermediate position between the processing station and the supply container is determined by a support that is movable in a straight line perpendicular to a parallel plane. The method of claim 43, And the support comprises a plurality of parallel support positions with other support positions formed above one support position. The method according to any one of claims 41 to 44, And a gas supply means for supporting the carrier to be moved.

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