KR20030048669A - Manufacturing method of poly(amideimide) - Google Patents
Manufacturing method of poly(amideimide) Download PDFInfo
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- KR20030048669A KR20030048669A KR1020010078641A KR20010078641A KR20030048669A KR 20030048669 A KR20030048669 A KR 20030048669A KR 1020010078641 A KR1020010078641 A KR 1020010078641A KR 20010078641 A KR20010078641 A KR 20010078641A KR 20030048669 A KR20030048669 A KR 20030048669A
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Abstract
Description
본 발명은 폴리아미드이미드의 제조방법에 관한 것으로, 보다 상세하게는 점도 및 강도가 높고, 성형성이 우수하며, 균일한 물성을 지닌 폴리아미드이미드의 제조방법에 관한 것이다.The present invention relates to a method for producing polyamideimide, and more particularly, to a method for producing polyamideimide having high viscosity and strength, excellent moldability, and uniform physical properties.
폴리아미드이미드는 내열특성 및 기계적 강도가 뛰어나기 때문에, 폴리아미드이미드 단독 중합체 뿐만 아니라 폴리아미드이미드 공중합체 및 그의 전구체 고분자는 내마모성, 난연성, 내방사선성, 나크리프성 등의 특성이 요구되는 부품의 공업재료로서 널리 사용되고 있다. 예를 들어, 성형용 폴리아미드이미드는 열변형 온도가 278 ℃이며 장기 사용 온도가 200 ℃이상으로서, 성형물을 제조하는데 사용되는 대표적인 열가소성 플라스틱 중 하나이다.Since polyamideimide has excellent heat resistance and mechanical strength, polyamideimide homopolymers as well as polyamideimide copolymers and their precursor polymers are used for parts requiring properties such as abrasion resistance, flame retardancy, radiation resistance, and creep resistance. It is widely used as an industrial material. For example, molding polyamideimide is one of the representative thermoplastics used for producing moldings, having a heat deformation temperature of 278 ° C and a long service temperature of 200 ° C or higher.
폴리아미드이미드를 제조하는 방법의 예로서, 미국 특허 제 4,016,140 호에는 폴리카르복시산 무수물 유도체와 일차 디아민을 반응시켜 중합체를 형성하는 방법이 개시되어 있다. 또한, 미국 특허 제 4,136,085 호에는 트리멜리트산 무수물(Trimellitic acid anhydride)에 4-트리멜리토일안하이드라이드 할라이드(4-trimellitoyl anyhydride halide) 및 1 종 이상의 방향족 디아민을 첨가하여 유기용매에서 반응시킴으로써 폴리아미드이미드를 제조하는 방법이 개시되어 있다. 그러나, 상기 제조 방법들에 따라 제조된 폴리이미드아미드는 균일한 물성을 지니지 않는다는 문제점이 있다.As an example of a method of making polyamideimide, US Pat. No. 4,016,140 discloses a method of reacting a polycarboxylic acid anhydride derivative with a primary diamine to form a polymer. In addition, U.S. Patent No. 4,136,085 discloses polyamides by adding 4-trimellitoyl anyhydride halide and at least one aromatic diamine to trimellitic acid anhydride to react in an organic solvent. Disclosed is a method of making a mead. However, there is a problem that the polyimideamide prepared according to the above production methods does not have uniform physical properties.
본 발명은 상술한 문제점을 해결하기 위한 것으로서, 점도 및 강도가 높고은 폴리아미드이미드의 제조방법을 제공하는 것을 목적으로 한다.The present invention has been made to solve the above problems, and an object thereof is to provide a method for producing a polyamideimide having high viscosity and strength.
또한, 본 발명의 다른 목적은 성형성이 우수하며, 균일한 물성을 지닌 폴리아미드이미드의 제조방법을 제공하는 것이다.In addition, another object of the present invention is to provide a method for producing polyamideimide having excellent moldability and uniform physical properties.
상기 목적을 달성하기 위하여, 본 발명은In order to achieve the above object, the present invention
a) 유기용매 하에서 4-트리멜리토일안하이드라이드 할라이드(4-trimellitoylanhydride halide), 상기 4-트리멜리토일안하이드라이드 할라이드1 당량에 대하여 0.9 내지 1.5 당량비를 갖는 방향족 디아민, 및 상기 4-트리멜리토일안하이드라이드 할라이드 1 당량에 대하여 0.01 내지 0.1 당량비를 갖는 무수아세트산을 중합하여 폴리아미드아믹산을 제조하고;a) 4-trimellitoylanhydride halide in an organic solvent, aromatic diamine having a ratio of 0.9 to 1.5 equivalents relative to 1 equivalent of 4-trimellitoylanhydride halide, and 4-trimelili Polymerizing acetic anhydride having a ratio of 0.01 to 0.1 equivalents to 1 equivalent of tonanhydride halide to prepare a polyamideamic acid;
b) 상기 폴리아미드아믹산을 이미드화하는 공정을 포함하는 폴리아미드이미드의 제조방법을 제공한다.b) a method for producing a polyamideimide comprising the step of imidating the polyamide amic acid.
이하 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail.
상기 a) 단계에서, 4-트리멜리토일안하이드라이드 할라이드(4-trimellitoylanhydride halide), 방향족 디아민, 및 무수아세트산을 상기한 당량비에 따라 중합하여 폴리아미드이미드의 전구체인 폴리아미드아믹산을 제조한다.In the step a), 4-trimellitoylanhydride halide, 4-trimellitoylanhydride halide, aromatic diamine, and acetic anhydride are polymerized according to the above equivalent ratio to prepare polyamideamic acid, which is a precursor of polyamideimide.
이를 위해 우선, 디아민을 유기용매에 녹인 후, 4-트리멜리토일안하이드라이드 할라이드를 적가한다. 상기 4-트리멜리토일안하이드라이드 할라이드를 적가할 때 반응열이 발생하므로, 반응물을 계속 냉각시키면서 적가한다. 무수아세트산은 폴리아미드이미드의 분자량 조절을 목적으로 첨가되며, 반응 초기에 디아민과 같이 투입하거나, 4-트리멜리토일안하이드라이드 할라이드와 함께 상기 디아민에 적가하거나, 또는 4-트리멜리토일안하이드라이드 할라이드를 디아민에 적가한 다음에 투입하여 반응시킬 수 있다.To this end, first, diamine is dissolved in an organic solvent, and then 4-trimelytoyl anhydride halide is added dropwise. Since the heat of reaction is generated when the 4-trimelyltoyl hydride halide is added dropwise, it is added dropwise while continuing to cool the reaction. Acetic anhydride is added for the purpose of controlling the molecular weight of the polyamideimide, and is added with diamine at the beginning of the reaction, or added dropwise to the diamine with 4-trimelytoylanhydride halide, or 4-trimelytoylanhydride The halide can be added dropwise to the diamine followed by reaction.
상기 방향족 디아민은 상기 4-트리멜리토일안하이드라이드 할라이드에 대하여, 1:0.9 내지 1.5의 당량비로 첨가되는 것이 바람직하며, 더욱 바람직하게는 1: 0.9 내지 1.1의 당량비로 첨가된다.The aromatic diamine is preferably added in an equivalent ratio of 1: 0.9 to 1.5, more preferably in an equivalent ratio of 1: 0.9 to 1.1 with respect to the 4-trimelyltoylanhydride halide.
상기 무수아세트산은 상기 4-트리멜리토일안하이드라이드 할라이드에 대하여 1:0.01 내지 0.1의 당량비로 첨가되는 것이 바람직하며, 더욱 바람직하게는 1:0.01 내지 0.05의 당량비로 첨가된다.The acetic anhydride is preferably added in an equivalent ratio of 1: 0.01 to 0.1, more preferably 1: 0.01 to 0.05, relative to the 4-trimelyltoyl anhydride halide.
본 발명의 폴리아미드이미드는 상기한 조성비에 따라 제조되므로, 점도, 강도 및 성형성이 우수하고, 일정한 분자량으로 재현성 있게 얻을 수 있으므로, 균일한 물성을 확보할 수 있다.Since the polyamideimide of the present invention is produced according to the composition ratio described above, it is excellent in viscosity, strength and moldability, and can be obtained reproducibly at a constant molecular weight, thereby ensuring uniform physical properties.
상기 a) 단계의 폴리아미드아믹산 제조 반응은 디아민, 4-트리멜리토일안하이드라이드 할라이드, 및 무수 아세트산을 혼합하면서 -10 내지 120 ℃에서 0.5 내지 12 시간 동안 중합시키는 것이 바람직하다. 더욱 바람직하게는, 상기 반응물들을 20 내지 60 ℃에서 2 내지 4 시간 동안 중합시킨다.The polyamide-amic acid preparation reaction of step a) is preferably polymerized at -10 to 120 ℃ for 0.5 to 12 hours while mixing the diamine, 4- trimellitoyl anhydride halide, and acetic anhydride. More preferably, the reactants are polymerized at 20-60 ° C. for 2-4 hours.
상기 4-트리멜리토일안하이드라이드 할라이드로는 4-트리멜리토일안하이드라이드 클로라이드, 4-트리멜리토일안하이드라이드 브로마이드, 또는 4-트리멜리토일안하이드라이드 아이오다이드를 사용할 수 있으며, 바람직하게는 4-트리멜리토일안하이드라이드 클로라이드를 사용할 수 있다.As 4- trimellitoyl anhydride halide, 4- trimellitoyl anhydride chloride, 4- trimellitoyl anhydride bromide, or 4- trimellitoyl anhydride iodide may be used. For example, 4- trimellitoyl anhydride chloride can be used.
상기 방향족 디아민으로는 메타페닐렌디아민, 파라페닐렌디아민, p,p'-옥시비스아닐린, p,p'-메틸렌비스아닐린, p,p'-옥시비닐아닐린, p,p'-옥시디아닐린, 또는 p,p'-술포닐비스아닐린(p-아니노페닐)술폰, 또는 이들의 혼합물을 사용할 수 있으나 이에 한정되는 것은 아니다.Examples of the aromatic diamine include metaphenylenediamine, paraphenylenediamine, p, p'-oxybisaniline, p, p'-methylenebisaniline, p, p'-oxyvinylaniline, p, p'-oxydianiline Or p, p'-sulfonylbisaniline (p-aninophenyl) sulfone, or mixtures thereof, may be used, but is not limited thereto.
상기 유기용매로는 일반적으로 질소를 함유하는 비반응성 극성용매인 N-메틸피롤리돈, N,N'-디메틸아세트아마이드, 및 N,N'-디메틸포름아마이드를 사용한다. 또한, o,m,p-크레졸 및 자일레놀과 같은 페놀류 및 알킬기가 치환된 페놀류를 사용할 수도 있다.As the organic solvent, N-methylpyrrolidone, N, N'-dimethylacetamide, and N, N'-dimethylformamide, which are generally non-reactive polar solvents containing nitrogen, are used. It is also possible to use phenols such as o, m, p-cresol and xenol and phenols substituted with alkyl groups.
상기 폴리아미드아믹산을 제조하는 반응에 있어서 폴리아미드아믹산 중합시의 점도를 낮추기 위하여 상기 용매들 이외에 비용매를 첨가할 수도 있다. 상기 비용매에 잔존하는 수분함량은 0.01 내지 1000 ppm인 것이 바람직하며, 0.01 내지 400 ppm 이면 바람직하다. 상기 용매에 잔존하는 수분함량이 상기 범위를 벗어나는 경우에는, 운송 또는 보관 시 수분이 빠져 나올 수 있기 때문에 생성물의 물성이 저하될 수 있다.In the reaction for producing the polyamide amic acid, a non-solvent may be added in addition to the solvents in order to lower the viscosity during the polyamide amic acid polymerization. The moisture content remaining in the non-solvent is 0.01 It is preferable that it is -1000 ppm, and it is preferable that it is 0.01-400 ppm. If the water content remaining in the solvent is outside the above range, the physical properties of the product may be lowered because water may escape during transport or storage.
또한, 상기 b) 단계에서, a) 단계에서 제조된 폴리아미드아믹산을이미드화(imidization)하여 폴리아미드이미드를 제조한다.In addition, in step b), the polyamide-amic acid prepared in step a) is imidized to prepare polyamideimide.
상기 폴리아미드아믹산을 이미드화 하는 방법으로는, 폴리아미드아믹산을 제조하였을 때와 동일한 반응조건 하에서 반응온도를 올려 이미드화하는 방법 또는 유기 용매에 녹아있는 상기 폴리아미드아믹산을 비용매에 침전, 중화, 건조, 및 에이징을 통하여 이미드화하는 방법을 사용할 수 있다.As a method of imidizing the polyamide-amic acid, a method of increasing the reaction temperature under the same reaction conditions as when polyamide-amic acid is prepared or imidizing the polyamide-amic acid dissolved in an organic solvent in a non-solvent The method of imidizing through neutralization, drying, and aging can be used.
상기 폴리아미드아믹산의 이미드화 공정 중에서 승온하여 제조된 폴리아미드아믹산을 이미드화하는 경우, 온도는 50 내지 60 ℃까지 승온하는 것이 바람직하며,50 내지 55 ℃까지 승온하는 것이 더욱 바람직하다.When imidating the polyamide-amic acid produced by heating up in the imidation process of the said polyamide-amic acid, it is preferable to heat up to 50-60 degreeC, and it is more preferable to heat up to 50-55 degreeC.
상기 폴리아미드아믹산을 비용매에 침전, 중화, 건조, 및 에이징을 통하여 이미드화하는 경우, 사용가능한 비용매로는 물, 에탄올, 메탄올, 또는 아세톤과 같이 일반적으로 사용되는 비용매를 사용할 수 있으며, 바람직하게는 상기 폴리아미드아믹산 용액과 5 ㏁/㎤ 이상인 순수를 1: 3 내지 10의 당량비로 사용한다. 상기 5 ㏁/㎤ 이상인 순수를 사용할 경우, 물 속의 금속이온이 침전물에 흡착되어 최종생성물의 물성을 더욱 좋게 한다. 상기 침전공정에는 폴리아미드아믹산 용액을 비용매에 침전시키는 것과 동시에, 침전물을 분쇄하고, 교반하는 것이 필요하므로, 호모믹서와 같은 장치를 사용한다. 폴리아미드아믹산을 침전시킨 다음, 비용매에 침전된 상기 침전물을 저항이 5 ㏁/㎤ 이상인 순수로 필터링하고 세정하여 중화한다. 상기 침전물의 pH 3.5 이상이 될 때까지, 침전물의 필터링과 중화를 반복한다. 상기 침전물을 중화시킨 다음, 아스피레이터를 사용한 건조오븐에 상기 중화물을 넣고, 60 내지 150 ℃의 온도에서 0.5 내지 12 시간 동안 건조한다. 그런 다음, 건조된 상기 중화물을 200 내지 240 ℃의 열풍오븐에 넣고, 0.5 내지 4시간 동안 에이징(aging) 하여 폴리아미드이미드 분말을 제조한다.In the case where the polyamideamic acid is imidized by precipitation, neutralization, drying, and aging in a non-solvent, as a non-solvent that can be used, a non-solvent generally used such as water, ethanol, methanol, or acetone may be used. Preferably, the polyamide-amic acid solution and pure water having 5 kW / cm 3 or more are used in an equivalent ratio of 1: 3 to 10. When using pure water of 5 kPa / cm 3 or more, metal ions in water are adsorbed on the precipitate to further improve the physical properties of the final product. In the precipitation step, the polyamide-amic acid solution is required to be precipitated in the non-solvent, and the precipitate is pulverized and stirred. Therefore, an apparatus such as a homomixer is used. After precipitating the polyamideamic acid, the precipitate precipitated in the non-solvent is neutralized by filtering and washing with pure water having a resistance of 5 kW / cm 3 or more. The precipitate is filtered and neutralized until the precipitate has a pH above 3.5. After neutralizing the precipitate, the neutralizer is put in a drying oven using an aspirator, and dried at a temperature of 60 to 150 ° C. for 0.5 to 12 hours. Then, the dried neutralized product is placed in a hot air oven at 200 to 240 ° C., and aged for 0.5 to 4 hours to prepare a polyamideimide powder.
상기 폴리아미드이미드의 이미드화율은 제조할 폴리아미드이미드의 용도에 따라, 폴리아미드아믹산의 이미드화 단계에서 조절할 수 있다. 일반적으로, 성형용 폴리아미드이미드를 제조하기 위해서는 이미드화율을 95 내지 100 %로 조절하고, 코팅용 폴리아미드를 제조하기 위해서는 이미드화율을 0 내지 70 %로 조절하는 것이 바람직하다. 폴리아미드아믹산을 비용매에 침전, 중화, 건조 및 에이징하여 폴리아미드이미드를 제조하는 공정은 상기 폴리아미드아믹산을 부분적으로 이미드화할 때 사용하는 것이 바람직하다.The imidation ratio of the polyamideimide can be adjusted in the imidization step of the polyamideamic acid according to the use of the polyamideimide to be produced. In general, it is preferable to adjust the imidation ratio to 95 to 100% in order to manufacture the polyamideimide for molding, and to adjust the imidation ratio to 0 to 70% in order to prepare the polyamide for coating. The process of preparing polyamideimide by precipitating, neutralizing, drying and aging the polyamideamic acid in a non-solvent is preferably used when partially imidating the polyamideamic acid.
이하 실시예를 통하여 본 발명을 더욱 상세하게 설명한다. 단, 실시예는 본 발명을 예시하기 위한 것이지 본 발명이 이들만으로 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to the following examples. However, an Example is for illustrating this invention and this invention is not limited only to these.
(실시예 1)(Example 1)
교반기, 질소퍼징장치, 온도계, 및 냉각장치를 갖춘 2 ℓ반응기에 메타페닐렌디아민 4.39 g(0.0406 몰), p,p'-옥시디아닐린 32.36 g(0.163 몰), 및 무수아세트산 0.842 g(0.0061 몰)을 넣은 다음, 수분함량이 350 ppm인 N-메틸피롤리돈을 첨가하였다. 상기 혼합물에 4-트리멜리토일안하이드라이드 클로라이드 41.5 g(0.197 몰)을 50 ℃ 하에서 1 시간 동안 여러 차례 나누어 첨가하였다. 4-트리멜리토일안하이드라이드 클로라이드를 첨가한 다음, 상기 혼합물을 3 시간 동안 교반하여 폴리아미드아믹산을 제조하였다. 다음, 25 ℃에서 제조된 상기 폴리아미드아믹산의 고유점도를 부르크너 점도계로 측정하였다. 본 실시예 1에 따르는 폴리아미드아믹산의 고유점도는 12500 cps였다.2.39 g (0.0406 mol) of metaphenylenediamine, 32.36 g (0.163 mol) of p, p'-oxydianiline, and 0.842 g (0.0061) in a 2 L reactor equipped with a stirrer, nitrogen purge, thermometer, and chiller Mole) and then N-methylpyrrolidone having a water content of 350 ppm was added. To the mixture was added 41.5 g (0.197 mol) of 4-trimelyloyl anhydride chloride in several portions under 50 ° C. for 1 hour. 4-trimelyloyl anhydride chloride was added, and then the mixture was stirred for 3 hours to prepare polyamideamic acid. Next, the intrinsic viscosity of the polyamideamic acid prepared at 25 ° C. was measured with a Brunner viscometer. The intrinsic viscosity of the polyamide-amic acid according to Example 1 was 12500 cps.
상기 교반물에 초순수 1000 ㎖에 천천히 부어 침전물을 얻었다. 상기 침전물을 필터링한 뒤, 필터링한 침전물을 다시 1000 ㎖ 초순수에 투입하여 30 분간 교반하여 중화시켰다. 침전과 교반을 5회 반복한 뒤 측정한 중화물의 pH는 3.9였다. 상기 중화물을 60 ℃ 건조오븐에서 12 시간 동안 건조하였다. 건조된 중화물의 고유점도를 측정하고, 220 ℃ 열풍오븐에서 4 시간 동안 에이징하여 폴리아미드이미드 분말을 얻었다. 이어서, 에이징한 상기 폴리아미드이미드의 고유점도를 측정한 다음, 상기 폴리아미드이미드 분말을 압출성형기를 이용하여 350 ℃ 온도에서 350 ㎏/㎠의 압력을 가하여 시편을 제조하였다. 에이징 실시 후 측정된 본 실시예 1의 폴리아미드이미드의 고유점도는 0.53 ㎗/g이었다.The precipitate was slowly poured into 1000 ml of ultrapure water to obtain a precipitate. After filtering the precipitate, the filtered precipitate was added to 1000 mL ultrapure water again and stirred for 30 minutes to neutralize. After repeated precipitation and stirring five times, the pH of the neutralized product was 3.9. The neutralized product was dried in a 60 ° C. drying oven for 12 hours. The intrinsic viscosity of the dried neutralized material was measured and aged in a 220 ° C. hot air oven for 4 hours to obtain a polyamideimide powder. Subsequently, the intrinsic viscosity of the aged polyamideimide was measured, and then a specimen was prepared by applying the polyamideimide powder to a pressure of 350 kg / cm 2 at a temperature of 350 ° C. using an extruder. The intrinsic viscosity of the polyamideimide of Example 1 measured after the aging was 0.53 dl / g.
(실시예 2)(Example 2)
무수아세트산 0.842 g(0.0061 몰), 및 4-트리멜리토일안하이드라이드 클로라이드 41.5 g(0.197 몰) 대신에, 무수아세트산 1.408 g(0.0102몰), 4-트리멜리토일안하이드라이드클로라이드 40.648 g(0.193 몰)을 첨가한 것을 제외하고는 상기 실시예 1과 동일하게 실시하였다. 25 ℃에서 부르크너 점도계로 측정한 본 실시예 2의 폴리아미드아믹산의 고유점도는 8100 cps, 에이징 후에 측정한 본 실시예 2의 폴리아미드이미드 분말의 고유점도는 0.50 ㎗/g이었다.Instead of 0.842 g (0.0061 mole) of acetic anhydride and 41.5 g (0.197 mole) of 4-trimelytoyl anhydride chloride, 1.408 g (0.0102 mole) of acetic anhydride, 40.648 g (0.193 mole) of 4-trimelitoyl anhydride chloride It carried out similarly to Example 1 except having added mole). The intrinsic viscosity of the polyamide-amic acid of the present Example 2 measured by the Brunner viscometer at 25 degreeC was 8100 cps, and the intrinsic viscosity of the polyamide-imide powder of this example 2 measured after aging was 0.50 dl / g.
(비교예 1)(Comparative Example 1)
메타페닐렌디아민 4.39 g(0.0406 몰), p,p'-옥시디아닐린 32.36 g(0.163 몰), 무수아세트산 0.842 g(0.0061 몰), 및 4-트리멜리토일안하이드라이드 클로라이드 41.5 g(0.197 몰)을 대신하여, 무수아세트산을 첨가하지 않고, 메타페닐렌디아민 4.758 g(0.044몰), p,p'-옥시디아닐린 35.241 g(0.176몰), 및 4-트리멜리토일안하이드라이드클로라이드 42.11 g(0.20 몰)을 첨가한 것을 제외하고는 상기 실시예 1과 동일하게 실시하였다. 25 ℃에서 브루크너 점도계로 측정한 본 비교예 1의 폴리아미드아믹산의 고유점도값은 6500 cps였고, 에이징 후에 측정한 본 비교예 1의 폴리아미드이미드의 고유점도는 0.41 ㎗/g이었다.4.39 g (0.0406 mole) of metaphenylenediamine, 32.36 g (0.163 mole) of p, p'-oxydianiline, 0.842 g (0.0061 mole) of acetic anhydride, and 41.5 g (0.197 mole) of 4-trimelitoylanhydride chloride ), 4.758 g (0.044 mol) of metaphenylenediamine, 35.241 g (0.176 mol) of p, p'-oxydianiline, and 42.11 g of 4-trimelitoyl anhydride chloride, without adding acetic anhydride The same procedure as in Example 1 was carried out except that (0.20 mol) was added. The intrinsic viscosity value of the polyamide-amic acid of this comparative example 1 measured by the Bruckner viscometer at 25 degreeC was 6500 cps, and the intrinsic viscosity of the polyamide-imide of this comparative example 1 measured after aging was 0.41 dl / g.
(비교예 2)(Comparative Example 2)
메타페닐렌디아민 4.39 g(0.0406 몰), p,p'-옥시디아닐린 32.36 g(0.163 몰), 무수아세트산 0.842 g(0.0061 몰), 및 4-트리멜리토일안하이드라이드 클로라이드 41.5 g(0.197 몰)을 대신하여, 무수아세트산을 첨가하지 않고, 메타페닐렌디아민 4.325g(0.04몰), p,p'-옥시디아닐린 32.037g(0.16몰),및 4-트리멜리토일안하이드라이드 클로라이드 45.27g(0.215몰)을 첨가한 것을 제외하고는 상기 실시예 1과 동일하게 실시하였다. 25℃에서 측정한 본 비교예 2의 폴리아미드아믹산의 고유점도는 7700 cps였고, 에이징 후에 측정한 본 비교예 2의 폴리아미드이미드의 고유점도는 0.44 ㎗/g이었다.4.39 g (0.0406 mole) of metaphenylenediamine, 32.36 g (0.163 mole) of p, p'-oxydianiline, 0.842 g (0.0061 mole) of acetic anhydride, and 41.5 g (0.197 mole) of 4-trimelitoylanhydride chloride 4.325 g (0.04 mol) of metaphenylenediamine, 32.037 g (0.16 mol) of p, p'-oxydianiline, and 45.27 g of 4-trimelitoyl anhydride chloride, without adding acetic anhydride, instead of The same procedure as in Example 1 was carried out except that (0.215 mol) was added. The intrinsic viscosity of the polyamide amic acid of Comparative Example 2 measured at 25 ° C. was 7700 cps, and the intrinsic viscosity of the polyamideimide of Comparative Example 2 measured after aging was 0.44 dl / g.
본 발명의 실시예 및 비교예에 따른 폴리아미드이미드의 물성을 하기 평가항목에 따라 측정한 다음, 하기 표 1에 나타내었다.The physical properties of the polyamideimide according to the Examples and Comparative Examples of the present invention were measured according to the following evaluation items, and are shown in Table 1 below.
(평가항목)(Evaluation item)
1) 고유점도: 본 실시예 및 비교예의 폴리아미드이미드 분말 0.1 g을 N,N'-디메틸아세트아미드 10 ㎖에 녹여 30 ℃로 유지되는 항온조에서우베로드(Ubbelohde) 점도계로 측정하였다.1) Intrinsic Viscosity: 0.1 g of the polyamideimide powder of this example and the comparative example was dissolved in 10 ml of N, N'-dimethylacetamide, and measured by a Ubbelohde viscometer in a thermostat maintained at 30 ° C.
2) 용액점도: 본 실시예 및 비교예의 폴리아미드아믹산 용액의 점도를 25 ℃에서 브루크너 점도계로 측정하였다.2) Solution Viscosity: The viscosities of the polyamide-amic acid solutions of this example and the comparative example were measured by a Bruckner viscometer at 25 ° C.
3) 파단신도 및 인장강도: 본 실시예 및 비교예의 폴리아미드이미드의 파단신도 및 인장강도를 ASTM D1708 방법으로 측정하였다.3) Elongation at Break and Tensile Strength: The elongation at break and tensile strength of the polyamideimide of this Example and Comparative Example were measured by the ASTM D1708 method.
4) 수분함량: 본 실시예 및 비교예의 폴리아미드이미드 분말의 수분함량을 칼-피셔 수분 측정기로 측정하였다.4) Water content: The water content of the polyamideimide powder of this example and the comparative example was measured by Karl-Fischer moisture meter.
또한, 하기 표 1에 나타낸 TMAc, AA, ODA, 및 m-PDA는 각각 4-트리멜리토일안하이드라이드 클로라이드, 무수아세트산, p,p'-옥시디아닐린, 및 메타페닐렌디아민을 약칭한 것이다.In addition, TMAc, AA, ODA, and m-PDA shown in Table 1 are abbreviations of 4-trimelitoyl anhydride chloride, acetic anhydride, p, p'-oxydianiline, and metaphenylenediamine, respectively. .
상기 표 1에서와 같이, 본 발명의 실시예 1 내지 2의 폴리아미드이미드는 비교예 1 내지 2에 비하여 인장강도는 최대 2배 이상, 파단신도는 최대 4배 가량 크게 나타났다. 따라서, 종래의 제조방법에 의해 제조된 폴리아미드이미드에 비하여강도 및 가공성이 향상되었음을 확인할 수 있다. As shown in Table 1, the polyamideimide of Examples 1 to 2 of the present invention showed a maximum tensile strength of at least 2 times and an elongation at break of up to 4 times as compared with Comparative Examples 1 and 2. Therefore, it can be confirmed that the strength and workability are improved compared to the polyamideimide prepared by the conventional manufacturing method.
본 발명의 폴리아미드이미드 제조방법은 점도 및 강도가 크고 성형성이 우수하며 균일한 물성을 지닌 성형용 폴리아미드이미드를 제조할 수 있다.The polyamideimide production method of the present invention can produce a polyamideimide for molding having a high viscosity and strength, excellent moldability and uniform physical properties.
또한, 본 발명의 제조방법에 따라 제조된 폴리아미드이미드는 내열코팅 재료, 절연코팅 재료, 및 압축성형 또는 사출성형을 통해 강성 플라스틱 재료 및 금속 대체용으로 사용할 수 있다.In addition, the polyamideimide prepared according to the production method of the present invention can be used as a replacement for rigid plastic materials and metals through heat-resistant coating material, insulating coating material, and compression molding or injection molding.
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KR100948137B1 (en) * | 2003-11-14 | 2010-03-18 | 주식회사 코오롱 | Polyamideimide resin having improved dimensional stability |
KR101041342B1 (en) * | 2008-04-16 | 2011-06-14 | 손미향 | Manufacturing method buoyancy substance for buoyance suit |
KR101041244B1 (en) * | 2008-04-16 | 2011-06-14 | 손미향 | Manufacturing method buoyancy substance for buoyance suit |
KR20190139778A (en) * | 2018-06-08 | 2019-12-18 | 스미또모 가가꾸 가부시키가이샤 | Method for producing polyamideimide-based resin |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100883263B1 (en) | 2003-01-14 | 2009-02-10 | 주식회사 코오롱 | Manufacturing method of polyamideimide with the improved adhesion strength and heat resistance |
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US4136085A (en) * | 1978-01-20 | 1979-01-23 | Standard Oil Company (Indiana) | Process for controlling the melt flow of amide-imide polymers |
JPS5714622A (en) * | 1980-06-30 | 1982-01-25 | Toray Ind Inc | Production of polyamideimide resin |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100948137B1 (en) * | 2003-11-14 | 2010-03-18 | 주식회사 코오롱 | Polyamideimide resin having improved dimensional stability |
KR101041342B1 (en) * | 2008-04-16 | 2011-06-14 | 손미향 | Manufacturing method buoyancy substance for buoyance suit |
KR101041244B1 (en) * | 2008-04-16 | 2011-06-14 | 손미향 | Manufacturing method buoyancy substance for buoyance suit |
KR20190139778A (en) * | 2018-06-08 | 2019-12-18 | 스미또모 가가꾸 가부시키가이샤 | Method for producing polyamideimide-based resin |
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