KR102293096B1 - Drawing apparatus and drawing method - Google Patents

Abstract

A drawing head 31 of the drawing apparatus includes a light source 32 , a light modulation device 341 , and a projection optical system 35 . Light from the light source 32 is guided to the light modulation device 341 . The projection optical system 35 guides the light modulated in the light modulation device 341 to the stage 21 . The projection optical system 35 includes an objective lens group 352 , a focus lens group 351 , and a focus adjustment mechanism 353 . The focus adjustment mechanism 353 adjusts the focus position of the drawing head 31 by changing the position of the focus lens group 351 on the optical axis. The head control unit controls the focus adjustment mechanism 353 based on the pressure around the drawing head 31 measured by the pressure sensor. Thereby, the shift|offset|difference of the focus position of the writing head 31 resulting from the pressure fluctuation|variation around the writing head 31 can be corrected.

Description

DRAWING APPARATUS AND DRAWING METHOD

The present invention relates to a technique for drawing a pattern by irradiating a substrate with light.

Conventionally, there is known a direct drawing apparatus that draws a pattern by irradiating modulated light onto an object on a stage and scanning the irradiation area of the light on the object (for example, Japanese Patent Application Laid-Open No. 2014-197136 (Document 1)) .

In the direct drawing apparatus of Document 1, when the crosslinked structure supporting the drawing head or the crosslinked structure supporting the alignment camera is deformed by the heat of the apparatus itself, the drawing position on the substrate by the drawing head and the viewing position of the alignment camera The positional relationship is disturbed. Then, the fall of the writing precision is suppressed by correct|amending the position shift of the temperature dependence between a writing position and a visual field position based on the position shift amount corresponding to a temperature difference.

On the other hand, in Unexamined-Japanese-Patent No. 2013-210440 (Document 2), the projection exposure apparatus which projects the pattern formed in the mask on the workpiece|work with a projection lens, and exposes is disclosed. In the said projection exposure apparatus, the change of the drawing position of the projection lens by the difference in temperature is measured by imaging the alignment mark formed in the mask, The said change is reflected in the patterning position of an exposure pattern, and exposure is performed.

Further, Japanese Patent Application Laid-Open No. 2002-195913 (Document 3) discloses an exposure apparatus that transfers an image of a circuit pattern onto a wafer by a step-and-repeat method using a reticle on which a circuit pattern of a semiconductor element is formed. has been In the exposure apparatus, a change in the imaging characteristics of the projection optical system due to environmental changes such as temperature or atmospheric pressure is detected from a change in the position of the image when a specific pattern is irradiated onto the projection surface, and the imaging characteristic of the projection optical system is changed to optimize control in the state of Detection of a change in position of an image is performed by analyzing an image acquired by a camera capable of observing the projection plane.

By the way, in the apparatus which draws a circuit pattern directly on a printed circuit board, high definition of drawing is calculated|required with refinement|miniaturization of a circuit pattern. For this reason, even a change in focal length resulting from relatively small temperature fluctuations and pressure fluctuations to the extent that they occur in a clean room may have a large influence on the drawing accuracy. There is known a method of installing an inner cover covering the barrel of the projection optical system in the apparatus to block the space around the barrel from the outside, and reducing temperature fluctuations by means of a temperature controller. it's not easy Moreover, the change in focal length resulting from a pressure fluctuation cannot be reduced by this method.

The present invention relates to a writing apparatus that draws a pattern by irradiating light to a substrate, and an object of the present invention is to correct a shift in the focal position due to a pressure fluctuation.

A writing apparatus according to a preferred aspect of the present invention includes a stage holding a substrate, a writing head irradiating modulated light to the substrate, and moving the stage in a direction parallel to an upper surface of the substrate with respect to the writing head It comprises a stage moving mechanism which moves relatively, a pressure sensor which measures the pressure around the said writing head, and the head control part which controls the said writing head. The drawing head includes a light source, a light modulating device through which light from the light source is guided, and a projection optical system which guides the light modulated by the light modulating device to the stage. The projection optical system includes an objective lens group, a focusing lens group, and a focusing mechanism for adjusting a focal position of the drawing head by changing a position of the focusing lens group on an optical axis. The head control unit controls the focus adjustment mechanism based on an output from the pressure sensor. ADVANTAGE OF THE INVENTION According to this invention, the shift|offset|difference of the focus position due to a pressure fluctuation|variation can be corrected.

Preferably, the drawing head further includes a first temperature sensor for measuring a temperature of the projection optical system. The control of the focus adjustment mechanism by the head control unit is also performed based on the output from the first temperature sensor.

Preferably, the writing head further includes a distance sensor for measuring a distance to the substrate on the stage. Measurement of the distance to the substrate by the distance sensor while writing to the substrate is being performed by scanning the irradiation area of light from the writing head on the substrate by relatively moving the stage by the stage moving mechanism is carried out continuously. The control of the focus adjustment mechanism by the head control unit is also performed based on the output from the distance sensor. While writing on the substrate is being performed, the focus position of the writing head is aligned with the upper surface of the substrate by control of the focus adjustment mechanism by the head control unit.

Preferably, the drawing head further includes a second temperature sensor for measuring a temperature of the distance sensor. The control of the focus adjustment mechanism by the head control unit is also performed based on the output from the second temperature sensor.

Preferably, the drawing apparatus includes: a jig fixed to the stage; and an imaging unit configured to image an irradiation area of light from the drawing head on the jig together with a mark previously formed on the jig; It further comprises an image processing part which acquires the shift|offset|difference of the irradiation position of the said drawing head from the design irradiation position based on the image acquired by the said imaging part. When imaging of the said jig by the said imaging part is implemented, the said focus position of the said drawing head is matched with the said jig by control of the said focus adjustment mechanism by the said head control part.

Preferably, writing on the substrate is completed by relatively moving the stage by the stage moving mechanism to scan the irradiation area of light from the writing head on the substrate only once in a predetermined scanning direction.

Preferably, the pattern to be drawn on the substrate is a circuit pattern. The line of L/S of the said circuit pattern is 7 micrometers - 9 micrometers, and the space is 11 micrometers - 13 micrometers.

Preferably, the focusing lens group is independently moved from the objective lens group by the focusing mechanism.

The present invention provides a stage for holding a substrate, a writing head for irradiating modulated light onto the substrate, and a stage moving mechanism for moving the stage relative to the writing head in a direction parallel to the upper surface of the substrate. It is also related to the writing method which irradiates light to a board|substrate with the writing apparatus provided with and writes a pattern. The drawing head includes a light source, a light modulating device through which light from the light source is guided, and a projection optical system which guides the light modulated by the light modulating device to the stage. The projection optical system includes an objective lens group and a focus lens group. The drawing method comprises: a) measuring a pressure around the drawing head; and b) changing a position on an optical axis of the focus lens group on the basis of the pressure measured in step a) above, whereby the drawing is performed. and adjusting the focal position of the head. ADVANTAGE OF THE INVENTION According to this invention, the shift|offset|difference of the focus position due to a pressure fluctuation|variation can be corrected.

Preferably, the drawing method further comprises the step of c) measuring a temperature of the projection optical system. The adjustment of the focal position of the drawing head in the step b) is also performed based on the temperature measured in the step c).

Preferably, in the writing method, d) in the step b), after the focal position of the writing head is aligned with the upper surface of the substrate, the stage is relatively moved by the stage moving mechanism to move the stage away from the writing head. performing writing on the substrate by scanning an area irradiated with light of , f) in parallel with the step d), by changing the position on the optical axis of the focusing lens group based on the distance measured in the step e) above, the focal position of the drawing head is set on the upper surface of the substrate Further provided with a process of continuously adjusting to.

Preferably, the drawing method further comprises a step of g) measuring a temperature of a distance sensor used for measuring the distance to the substrate in the step e). The adjustment of the focal position of the drawing head in the step b) is also performed based on the temperature measured in the step g).

Preferably, the said drawing apparatus is further equipped with the jig fixed to the said stage, and the imaging part which images the said jig. In the writing method, h) after the focal position of the writing head is aligned with the jig in the step b), an irradiation area of the light from the writing head on the jig is formed in advance on the jig, It further includes a step of capturing an image together with a mark present and i) a step of acquiring a deviation of the irradiation position of the drawing head from a design irradiation position based on the image obtained in the step h).

Preferably, writing on the substrate is completed by relatively moving the stage by the stage moving mechanism to scan the irradiation area of light from the writing head on the substrate only once in a predetermined scanning direction.

Preferably, the pattern drawn on the substrate is a circuit pattern, the L/S line of the circuit pattern is 7 µm to 9 µm, and the space is 11 µm to 13 µm.

Preferably, in step b), the focus lens group moves independently from the objective lens group.

The above-mentioned and other objects, features, aspects, and advantages will become clear by the detailed description of this invention given below with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the structure of the drawing apparatus which concerns on one Embodiment.
2 is a diagram showing the configuration of a computer included in the control unit.
3 is a block diagram illustrating a function of a control unit.
Fig. 4 is a side view showing a drawing head;
It is a side view which shows the edge part vicinity of a stage.
Fig. 6 is a diagram showing the flow of adjustment of the autofocus mechanism.
7 is a diagram showing the flow of writing on a substrate.
8 is a diagram illustrating a calibration pattern.
9 is a diagram illustrating a flow of head calibration.

1 : is a perspective view which shows the structure of the drawing apparatus 1 which concerns on one Embodiment of this invention. In Fig. 1, three directions orthogonal to each other are indicated by arrows as the X-direction, the Y-direction, and the Z-direction (the same applies to other drawings). In the example shown in FIG. 1, an X direction and a Y direction are a horizontal direction, and a Z direction is a vertical direction.

The drawing apparatus 1 is a direct drawing apparatus (so-called direct drawing apparatus) which irradiates spatially modulated substantially beam-shaped light to the photosensitive material on the substrate 9, and performs pattern drawing by scanning the irradiation area of the light on the object. . The board|substrate 9 is a printed wiring board which has flexibility, for example. In the substrate 9, a resist film formed of a photosensitive material is formed on the copper layer. In the drawing apparatus 1, a circuit pattern is drawn on the resist film of the board|substrate 9. In the circuit pattern, for example, the L/S line (ie, pattern width) is 7 µm to 9 µm, and the L/S space (ie, the gap width between patterns) is 11 µm to 13 µm.

The drawing apparatus 1 is arrange|positioned in the clean room from which illustration was abbreviate|omitted. The internal space of the clean room is regulated by a temperature control facility so as to attain a predetermined temperature. The drawing apparatus 1 includes a stage 21 , a stage moving mechanism 22 , a stage raising/lowering mechanism 23 , a drawing unit 3 , a pressure sensor 41 , and a control unit 6 . . The stage 21, the stage moving mechanism 22, the stage raising/lowering mechanism 23, and the drawing part 3 are accommodated in the inside of the housing which abbreviate|omitted illustration. The pressure sensor 41 is mounted, for example, on the inner surface of the housing, and measures the pressure inside the housing (ie, atmospheric pressure). The control unit 6 controls the stage moving mechanism 22 , the stage raising/lowering mechanism 23 , the drawing unit 3 , and the like.

2 : is a figure which shows the structure of the computer 8 with which the control part 6 is equipped. The computer 8 is a normal computer including a processor 81 , a memory 82 , an input/output unit 83 , and a bus 84 . The bus 84 is a signal circuit connecting the processor 81 , the memory 82 , and the input/output unit 83 . The memory 82 stores programs and various types of information. The processor 81 executes various processes (eg, numerical calculation and image processing) while using the memory 82 or the like according to a program or the like stored in the memory 82 . The input/output unit 83 includes a keyboard 85 and a mouse 86 for receiving input from an operator, and a display 87 for displaying output from the processor 81 and the like. Further, the input/output unit 83 includes a transmission unit 88 that transmits an output or the like from the processor 81 , and a reception unit 89 that receives an output from each sensor, which will be described later. In addition, the control part 6 may be a programmable logic controller (PLC:Programmable Logic Controller), a circuit board, etc., and the combination of these and one or more computers may be sufficient as it.

3 is a block diagram showing the function of the control unit 6 realized by the computer 8 . In FIG. 3, the structure other than the control part 6 is also shown collectively. The control unit 6 includes a storage unit 61 , an image processing unit 62 , a head control unit 63 , and a movement control unit 64 . The storage unit 61 is mainly realized by the memory 82, and various information such as measured values sent from the pressure sensor 41, the first temperature sensor 36, and the second temperature sensor 37 (to be described later). remember The image processing unit 62 is mainly realized by the processor 81 , and acquires various types of information from images sent from an imaging unit 51 , which will be described later. The head control unit 63 is mainly realized by the processor 81 and controls the writing head 31 (described later) of the writing unit 3 . The movement control unit 64 is mainly realized by the processor 81 and controls the stage movement mechanism 22 and the like that move the stage 21 .

As shown in FIG. 1 , the stage 21 is a substantially flat holding unit that holds the substrate 9 in a horizontal state from the lower side (that is, the (-Z) side) below the drawing unit 3 . . A surface on the (+Z) side of the substrate 9 held by the stage 21 (hereinafter, referred to as an "upper surface 91") is substantially perpendicular to the Z direction and substantially perpendicular to the X direction and the Y direction. parallel

The stage raising/lowering mechanism 23 moves the stage 21 in the Z direction. The stage moving mechanism 22 moves the stage 21 relative to the drawing unit 3 . In the example shown in FIG. 1, the stage moving mechanism 22 moves the stage 21 together with the stage raising/lowering mechanism 23 in an X direction and a Y direction. In other words, the stage moving mechanism 22 moves the stage 21 relative to the drawing unit 3 in a direction substantially parallel to the upper surface 91 of the substrate 9 .

The stage moving mechanism 22 is a mechanism for moving the stage 21 linearly along a guide rail, for example, and a linear servomotor is used as a drive source, for example. Thereby, the stage 21 moves with high precision. As a drive source of the stage moving mechanism 22, what attached the motor to the ball screw may be used. In the drawing apparatus 1, the stage raising/lowering mechanism 23 may be abbreviate|omitted, and the rotation mechanism which rotates the stage 21 centering around the axis parallel to the Z direction may be provided.

The drawing unit 3 includes a plurality of (five in the example shown in FIG. 1 ) drawing heads 31 arranged in the X direction and the Y direction. The plurality of drawing heads 31 are supported above the stage 21 by a head support 11 formed over the stage 21 . The plurality of drawing heads 31 have substantially the same structure.

In the writing apparatus 1 , the stage moving mechanism 22 is irradiated onto the upper surface 91 of the substrate 9 with light modulated (that is, spatially modulated) from the plurality of writing heads 31 of the writing unit 3 . ) to move the substrate 9 in the Y direction. Thereby, the irradiation area|region of the light from the some writing head 31 is scanned in the Y direction on the board|substrate 9, and drawing of the circuit pattern with respect to the board|substrate 9 is performed. In the following description, the Y direction is also called a "scanning direction", and the X direction is also called a "width direction". The stage moving mechanism 22 is a scanning mechanism that moves the irradiation area of the light from each drawing head 31 on the substrate 9 in the scanning direction.

In the writing apparatus 1, writing with respect to the board|substrate 9 is performed by what is called a single-pass (one-pass) system. Specifically, the stage 21 is relatively moved in the Y direction with respect to the plurality of drawing heads 31 by the stage moving mechanism 22 , and the irradiation area of the light from the plurality of drawing heads 31 is located on the substrate ( 9) is scanned only once in the Y direction (that is, in the scanning direction) on the upper surface 91 of FIG. Thereby, drawing with respect to the board|substrate 9 is completed.

4 is a side view showing the configuration of one drawing head 31 . The drawing head 31 includes a light source 32 , an illumination optical system 33 , a light modulator 34 , a projection optical system 35 , a first temperature sensor 36 , and a second temperature sensor 37 . ) and a distance sensor 38 . The light source 32 is, for example, a Light Emitting Diode (LED) light source or a Laser Diode (LD) light source. The light modulating unit 34 includes a light modulating device 341 . The light modulation device 341 is, for example, a DMD (Digital Micromirror Device) in which a plurality of micromirrors are two-dimensionally arranged. The light source 32 and the illumination optical system 33 are fixed to the upper part of the frame 30 .

The projection optical system 35 includes a focus lens group 351 , an objective lens group 352 , and a focus adjustment mechanism 353 . In FIG. 4, illustration of the lens included in the focus lens group 351 is abbreviate|omitted, and the reference|symbol 351 is attached|subjected to the barrel in which the said lens is accommodated. The same applies to the objective lens group 352 . The focus lens group 351 is attached to the upper part of the frame 30 via a focus adjustment mechanism 353 . The optical axis of the focus lens group 351 extends substantially parallel to the horizontal direction (for example, the Y direction). The focus adjustment mechanism 353 linearly moves the focus lens group 351 in the direction parallel to the said optical axis (for example, a Y direction). The focus adjustment mechanism 353 is a combination of, for example, a mechanism for driving a ball screw with a motor and a mechanism for guiding the focus lens group 351 in the Y direction. As a drive source of the focus adjustment mechanism 353, a linear servomotor may be used. The objective lens group 352 is fixed to the side of the frame 30 . The optical axis of the objective lens group 352 extends substantially parallel to the Z direction (that is, the vertical direction). The movement of the focus lens group 351 by the focus adjustment mechanism 353 is performed independently from the objective lens group 352 .

In the drawing apparatus 1, the light emitted from the light source 32 of the drawing head 31 is guided to the light modulator 34 by the illumination optical system 33, and the light modulating device of the light modulator 34 is After being spatially modulated at 341 , it is guided to the substrate 9 on the stage 21 by the projection optical system 35 (ie, the focus lens group 351 and the objective lens group 352 ). In the projection optical system 35 , the focus lens group 351 is moved by the focus adjustment mechanism 353 , and the position of the focus lens group 351 on the optical axis of the drawing head 31 is changed, so that the drawing head The focal position of (31) is adjusted in the vertical direction below the objective lens group (352).

The distance sensor 38 is attached to the objective lens group 352 of the projection optical system 35 . Specifically, the distance sensor 38 is mounted on the lower end of the barrel of the objective lens group 352 . The distance sensor 38 measures the distance from the lower end of the objective lens group 352 to the substrate 9 on the stage 21 (hereinafter referred to as "irradiation distance"). The distance sensor 38 includes a light emitting unit 381 , a light receiving unit 382 , and a sensor frame 383 . The sensor frame 383 is, for example, a substantially plate-shaped member extending in the Y direction, and is fixed to the lower end of the barrel of the objective lens group 352 . The light emitting part 381 is fixed to the (-Y) side end of the sensor frame 383 , and the light receiving part 382 is fixed to the (+Y) side end of the sensor frame 383 . Light emitted from the light emitting unit 381 to the (+Y) side and to the (−Z) side is reflected by the upper surface 91 of the substrate 9 and received by the light receiving unit 382 . The light receiving unit 382 is, for example, a line sensor. And based on the light receiving position in the light receiving part 382 of the board|substrate 9, the irradiation distance mentioned above is calculated|required.

In the drawing apparatus 1, while drawing with respect to the board|substrate 9 is performed, the measurement of the irradiation distance mentioned above by the distance sensor 38 is performed continuously. The irradiation distance (hereinafter, referred to as “measured irradiation distance”) measured by the distance sensor 38 is output to the head controller 63 (refer to FIG. 3 ) of the controller 6 . The head control unit 63 controls the focus adjustment mechanism 353 based on the output from the distance sensor 38 . Thereby, the position of the focus lens group 351 is adjusted, and the focus position of the drawing head 31 is adjusted. In the drawing apparatus 1, while drawing with respect to the board|substrate 9 is performed, the focus adjustment mechanism 353 is continuously controlled by the head control part 63, so that the focus position of the drawing head 31 is the board|substrate ( 9) is fitted to the upper surface 91 of In other words, at the time of drawing in the drawing apparatus 1, autofocus by the distance sensor 38, the focus adjustment mechanism 353, the head control part 63, etc. is implemented. As a result, even when deformation such as warpage occurs in the substrate 9, since the focal position of the writing head 31 can be aligned with the upper surface 91 of the substrate 9, high-precision writing can be realized. . The detailed content of the control of the focus adjustment mechanism 353 by the head control part 63 is mentioned later.

The first temperature sensor 36 is attached to the projection optical system 35 , or is disposed in the vicinity of the projection optical system 35 , and measures the temperature of the projection optical system 35 . In the example shown in FIG. 4 , the first temperature sensor 36 is attached to the objective lens group 352 of the projection optical system 35 . The first temperature sensor 36 is, for example, a thermocouple attached to the outer surface of the barrel of the objective lens group 352 at the lower end of the objective lens group 352 . The temperature of the projection optical system 35 measured by the first temperature sensor 36 (hereinafter referred to as “measured temperature of the projection optical system 35”) is output to the head control unit 63 of the control unit 6 . . Control of the focus adjustment mechanism 353 by the head control part 63 is performed also based on the output from the 1st temperature sensor 36. As shown in FIG.

The second temperature sensor 37 is mounted on the distance sensor 38 or disposed in the vicinity of the distance sensor 38 to measure the temperature of the distance sensor 38 . In the example shown in FIG. 4 , the second temperature sensor 37 is attached to the sensor frame 383 of the distance sensor 38 . The second temperature sensor 37 is, for example, a thermocouple affixed in the vicinity of the light receiving portion 382 of the sensor frame 383 . The temperature of the distance sensor 38 measured by the second temperature sensor 37 (hereinafter referred to as “measured temperature of the distance sensor 38”) is output to the head control unit 63 of the control unit 6 . . Control of the focus adjustment mechanism 353 by the head control part 63 is performed also based on the output from the 2nd temperature sensor 37. As shown in FIG.

As described above, the pressure sensor 41 measures the pressure (that is, atmospheric pressure) inside the housing of the drawing apparatus 1 . Since the pressure inside the housing hardly changes even if the positions inside the housing are different, the pressure measured by the pressure sensor 41 (hereinafter referred to as “measured pressure”) is ) is almost equal to the surrounding pressure. In other words, in the drawing apparatus 1 , the pressure around each drawing head 31 is measured by the pressure sensor 41 . The pressure measured by the pressure sensor 41 is output to the head control unit 63 of the control unit 6 . Control of the focus adjustment mechanism 353 by the head control part 63 is also implemented based on the output from the pressure sensor 41. As shown in FIG. The pressure sensor 41 is, for example, a diaphragm gauge.

5 : is a side view which shows the structure of the edge part vicinity of the (+Y) side of the stage 21. As shown in FIG. As shown in FIG. 5 , the drawing apparatus 1 further includes an imaging unit 51 and a jig 52 . The jig 52 is a flat glass plate fixed to the side surface on the (+Y) side of the stage 21 . The jig 52 protrudes from the side surface of the stage 21 in the (+Y) direction so that the main surface is perpendicular to the Z direction. The upper surface of the jig 52 is located in the same position as the upper surface 91 of the board|substrate 9 mounted on the stage 21 without distortion, such as curvature, in an up-down direction. The jig 52 is a substantially rectangular shape elongate in the X direction in planar view. The jig 52 is formed of a light-transmitting material, and is preferably transparent. A plurality of marks arranged in the X direction are formed on the upper surface of the jig 52 . The mark on the jig 52 is, for example, a cross pattern or a pattern of another shape.

The imaging part 51 is attached to the side surface of the (+Y) side of the stage 21 via the imaging part moving mechanism 53 below the jig 52. As shown in FIG. The imaging unit 51 is, for example, a digital camera having a CCD (Charged Coupled Devices) or a CMOS (Complementary Metal Oxide Semiconductor) as an imaging element. The imaging unit 51 is movable in the X direction by the imaging unit moving mechanism 53 . The imaging unit moving mechanism 53 is a combination of, for example, a mechanism for driving a ball screw with a motor and a mechanism for guiding the imaging unit 51 in the X direction. As a drive source of the imaging part moving mechanism 53, a linear servomotor may be used.

In the drawing device 1 , the imaging unit 51 acquires an image from below the jig 52 in a state in which light of a predetermined pattern is emitted from one drawing head 31 toward the jig 52 . . The imaging unit 51 images the irradiation area of the light from the writing head 31 on the jig 52 together with the mark previously formed on the jig 52 . The image acquired by the imaging unit 51 is sent to the control unit 6 , and the image is subjected to arithmetic processing by the image processing unit 62 (refer to FIG. 3 ), whereby the drawing head 31 and the jig 52 are A positional relationship is obtained. As mentioned above, since the jig 52 is fixed to the stage 21, the positional relationship between the drawing head 31 and the stage 21 is also acquired by the said arithmetic process.

Next, control of the focus adjustment mechanism 353 by the head control part 63 is demonstrated in detail, referring FIG.6 and FIG.7. In the drawing apparatus 1, even before drawing is performed on the substrate 9, the autofocus mechanism (that is, the distance sensor 38 and the focus adjustment mechanism 353, etc.) used for the above-described autofocus is adjusted. carried out (see Fig. 6). Then, drawing with respect to the some board|substrate 9 is performed continuously. In FIG. 7, attention is paid to the board|substrate 9 of 1 sheet, and the flow of drawing with respect to the said board|substrate 9 is shown.

In the adjustment of the autofocus mechanism (so-called focus calibration), the focus position of each drawing head 31 is at the same position as the upper surface of the jig 52 in the vertical direction (that is, the substrate 9 without deformation such as warpage) The position of the focus lens group 351 is adjusted so as to be located on the image plane 91).

Adjustment of the autofocus mechanism is performed when the drawing apparatus 1 is installed in a clean room, and the temperature and pressure (that is, atmospheric pressure) in the clean room at the time of installation, and the temperature and pressure (that is, atmospheric pressure) in the clean room at the time of drawing with respect to the board|substrate 9 There is a possibility that it is different from the temperature and pressure in the clean room. When the temperature in the clean room is different, each configuration of the writing head 31 expands or contracts, and there is a possibility that the focal position of the writing head 31 is shifted vertically from the upper surface 91 of the substrate 9 . . Moreover, a shift|offset|difference may generate|occur|produce also in the measurement irradiation distance by the distance sensor 38. As shown in FIG. When the pressures in the clean room are different, there is a possibility that the focal position of the writing head 31 is shifted in the vertical direction from on the upper surface 91 of the substrate 9 due to a change in the density of the atmosphere or the like. For example, when the said pressure becomes high, the focus position of the drawing head 31 shifts downward.

6 is a diagram showing an example of the flow of adjustment of the autofocus mechanism. In FIG. 6, the flow of adjustment of the autofocus mechanism with respect to one drawing head 31 is shown. When the autofocus mechanism is adjusted, the stage 21 is moved in the Y direction by the stage moving mechanism 22 (see FIG. 1 ), and the drawing head 31 is previously positioned above the jig 52 . . Moreover, the imaging part 51 is moved to the X direction by the imaging part moving mechanism 53, and the imaging part 51 is previously located below the said drawing head 31. As shown in FIG. Moreover, in the drawing apparatus 1, adjustment of the autofocus mechanism illustrated in FIG. 6 is performed sequentially with respect to the some drawing head 31. As shown in FIG.

In the adjustment of the autofocus mechanism, first, the pressure around the drawing head 31 is measured by the pressure sensor 41 (refer to FIG. 1 ). The measured pressure acquired by the pressure sensor 41 is sent to the control part 6, and is stored in the memory|storage part 61 (refer FIG. 3) as a "reference pressure" (step S11).

Subsequently, the temperature of the projection optical system 35 is measured by the first temperature sensor 36 . The measurement temperature of the projection optical system 35 acquired by the 1st temperature sensor 36 is sent to the control part 6, and is stored in the memory|storage part 61 as "reference temperature of the projection optical system 35". In addition, the temperature of the distance sensor 38 is measured by the second temperature sensor 37 . The measured temperature of the distance sensor 38 acquired by the second temperature sensor 37 is sent to the control unit 6 and stored in the storage unit 61 as "reference temperature of the distance sensor 38" (step S12). ).

Moreover, by the distance sensor 38, the irradiation distance mentioned above is measured. The measured irradiation distance acquired by the distance sensor 38 is sent to the control part 6, and is stored in the memory|storage part 61 as "standard irradiation distance". Further, the light-receiving position in the light-receiving unit 382 of the distance sensor 38 is also sent to the control unit 6 and stored in the storage unit 61 as a "reference light-receiving position" (step S13). In addition, the execution order of steps S11 - S13 should just be changed suitably. Moreover, two or more steps may be performed in parallel among steps S11 - S13.

Next, the focus lens group 351 is moved by the focus adjustment mechanism 353, and is located at the predetermined adjustment start position. The adjustment start position is, for example, the design position of the focus lens group 351 (that is, the design focus lens group 351 in which the focus position of the drawing head 31 is scheduled to meet the upper surface 91 of the substrate 9 ). ) is the location of ). Then, the light source 32 and the light modulator 34 are driven, and the predetermined calibration pattern 95 illustrated in FIG. 8 is irradiated to the jig 52 . In the example shown in FIG. 8, the calibration pattern 95 is four light spots arranged in grid|lattice form. The calibration pattern 95 is not limited to the shape of FIG. 8, What is necessary is just to change it in various ways.

The imaging unit 51 images the calibration pattern 95 transmitted through the jig 52 , and sends the acquired image to the control unit 6 . At the time of imaging by the imaging unit 51, since no illumination light is irradiated to the mark on the jig 52, the image acquired by the imaging unit 51 includes the image of the calibration pattern 95, but , the mark on the jig 52 is not included. In the control part 6, a contrast evaluation value is calculated|required by the image processing part 62 (refer FIG. 3) based on the image of the calibration pattern 95 acquired by the imaging part 51. FIG. The contrast evaluation value is, for example, the maximum value of the differential value of the contrast in the edge portion of the light point of the calibration pattern 95 .

In the drawing apparatus 1, the change of the position of the focus lens group 351 by the focus adjustment mechanism 353, imaging of the calibration pattern 95 by the imaging part 51, and contrast by the image processing part 62 Acquisition of the evaluation value is repeated a predetermined number of times (two or more times) (step S14). The position change of the focus lens group 351 is performed by step movement moving by a predetermined distance. The predetermined distance is, for example, four times the depth of focus pulse when the moving distance of the focus lens group 351 corresponding to a depth of half of the depth of focus of the drawing head 31 is referred to as a "depth of focus pulse".

In the image processing unit 62 , the contrast evaluation value and the focus lens group 351 are based on the acquired plurality of contrast evaluation values and the plurality of positions of the focus lens group 351 corresponding to the plurality of contrast evaluation values. "Lens position-contrast data" indicating the positional relationship is created (step S15). Then, based on the lens position-contrast data, peak detection processing of the contrast evaluation value is performed by the image processing unit 62 (step S16). The peak detection processing in step S16 is performed, for example, by extracting data near the peak among the lens position-contrast data, and quadratic approximation of the extracted data to find the extreme value. The said peak detection process may be implemented by other various methods.

When the peak of the contrast evaluation value is detected in step S16 (step S17), the position of the focus lens group 351 corresponding to the peak is stored in the storage unit 61 as a "reference position" (step S18), Adjustment of the autofocus mechanism is normally completed.

On the other hand, when the peak of the contrast evaluation value is not detected in step S16 (step S17), it is confirmed that the number of times of movement of the focus lens group 351 has not reached the upper limit (step S19), and the focus adjustment mechanism 353 is sent to The change of the position of the focus lens group 351 by the sequencing, imaging of the calibration pattern 95 by the imaging unit 51, and acquisition of the contrast evaluation value by the image processing unit 62 are performed once (step S20). The moving distance of the focus lens group 351 in step S20 is smaller than the moving distance in step S14, for example, becomes a distance equal to the depth of focus pulse.

Then, returning to step S15, lens position-contrast data including the contrast evaluation value obtained in step S20 is newly created (step S15), and peak detection processing of the contrast evaluation value is performed (step S16). When the peak of the contrast evaluation value is detected, the reference position of the focus lens group 351 is stored in the storage unit 61 as described above, and the adjustment of the autofocus mechanism is normally completed (steps S17 and S18). On the other hand, when the peak of the contrast evaluation value is not detected (step S17), steps S19, S20, S15 to S17 are repeated until the number of times of movement of the focus lens group 351 reaches the upper limit. And when the peak of the contrast evaluation value is not detected even when the number of times of movement of the focus lens group 351 reaches the upper limit, an error warning of abnormal termination is issued to the operator of the drawing apparatus 1 or the like, and the autofocus mechanism is adjusted This ends.

When the adjustment of the autofocus mechanism is normally completed, drawing is performed on the substrate 9 . 7 : is a figure which shows an example of the flow of drawing with respect to the board|substrate 9 of 1 sheet. In the drawing apparatus 1, first, correction of the reference position of the focus lens group 351 and correction of the reference light-receiving position of the distance sensor 38 are performed according to changes in pressure and temperature from the time of adjustment of the autofocus mechanism. After carrying out, drawing with respect to the board|substrate 9 is performed. As mentioned above, in the drawing apparatus 1, drawing with respect to the some board|substrate 9 is performed continuously after adjustment of an autofocus mechanism. Therefore, immediately after the end of the adjustment of the autofocus mechanism, the amount of correction for the reference position of the focus lens group 351 and the reference light receiving position of the distance sensor 38 is relatively small, but when the elapsed time from the end of the adjustment of the autofocus mechanism becomes large, The correction amount may be relatively large.

When drawing with respect to the board|substrate 9 is performed, the drawing head 31 is located above the board|substrate 9 as shown in FIG. And the pressure (that is, atmospheric pressure) is measured by the pressure sensor 41, and the measured pressure acquired by the pressure sensor 41 is sent to the head control part 63 of the control part 6 (step S31). ). Moreover, the temperature measurement by the 1st temperature sensor 36 and the 2nd temperature sensor 37 is performed, and the projection optical system 35 acquired by the 1st temperature sensor 36 and the 2nd temperature sensor 37 The measured temperature and the measured temperature of the distance sensor 38 are sent to the head control unit 63 (step S32). In addition, the execution order of steps S31 and S32 should just be changed suitably. In addition, step S31 and step S32 may be performed in parallel.

In the head control unit 63, the reference position of the focus lens group 351 is corrected based on the measurement pressure acquired in steps S31 and S32 and the measurement temperature of the projection optical system 35 (step S33). Then, the focus lens group 351 is moved to the corrected reference position (hereinafter, referred to as a "correction reference position") by the focus adjustment mechanism 353 (step S34). In step S33, for example, the focus lens group 351 is moved from the reference position by the correction distance dF (nm) shown in Formula (1).

dF = Kp × dP + Kt1 × dT1 ㆍㆍㆍ (Equation 1)

dP in the formula (1) is a pressure difference (hPa), which is a difference between the reference pressure and the measured pressure obtained in step S31, and Kp is a coefficient (nm) representing the moving distance of the focus lens group 351 per unit pressure difference /hPa). In addition, dT1 in Equation 1 is the temperature difference (deg) of the projection optical system 35 which is the difference between the said reference temperature of the projection optical system 35 and the measurement temperature of the projection optical system 35 acquired in step S32, Kt1 is a coefficient (nm/deg) indicating the moving distance of the focusing lens group 351 per unit temperature difference of the projection optical system 35 .

The coefficients Kp and Kt1 are acquired in advance and stored in the storage unit 61 . The coefficient Kp performs the focus calibration described above in a plurality of states in which the pressure in the housing of the drawing apparatus 1 measured by the pressure sensor 41 differs, for example, and the change in the pressure and the focus lens group (351) is obtained as the slope of the approximate curve after linear approximation of the relationship of the change in position. The coefficient Kt1 performs the above-described focus calibration in a plurality of states in which the temperatures of the projection optical system 35 measured by the first temperature sensor 36 differ, for example, and the temperature change and the focus lens group (351) is obtained as the slope of the approximate curve after linear approximation of the relationship of the change in position.

Further, in the head control unit 63, the reference light receiving position in the light receiving unit 382 of the distance sensor 38 is corrected based on the measured temperature of the distance sensor 38 acquired in step S32 (step S32). S35). In step S35, for example, the reference light-receiving position shifts by the correction distance dD (pixel) shown in the formula (2). In the following description, the reference light-receiving position after correction is referred to as a correction reference light-receiving position.

dD = Kt2 × dT2 ㆍㆍㆍ (Equation 2)

dT2 in Equation 2 is the temperature difference (deg) of the distance sensor 38 that is the difference between the reference temperature of the distance sensor 38 and the measured temperature of the distance sensor 38 obtained in step S32, Kt2 is , is a coefficient (pixel/deg) indicating the movement distance of the reference light-receiving position per unit temperature difference of the distance sensor 38 .

The coefficient Kt2 is acquired in advance and stored in the storage unit 61 . Coefficient Kt2 is calculated|required as follows, for example. First, in a plurality of states in which the temperature of the distance sensor 38 measured by the second temperature sensor 37 is different, the jig 52 (see FIG. 5 ) is removed from the light emitting part 381 of the distance sensor 38 . The light is emitted toward the jig 52 , and the light-receiving unit 382 receives the reflected light from the upper surface of the jig 52 to obtain a light-receiving position. Then, the relationship between the change in temperature and the change in the light receiving position in the light receiving unit 382 is linearly approximated, and the slope of the approximate curve is obtained as a coefficient Kt2.

In the state where the focusing lens group 351 is positioned at the correction reference position, the focal position of the drawing head 31 meets the upper surface 91 of the substrate 9 without deformation such as warpage (that is, the substrate 9). is located at the same position in the vertical direction as the upper surface 91 of the Further, in the distance sensor 38 , the light emitted from the light emitting unit 381 and reflected by the upper surface 91 of the substrate 9 without deformation such as warpage is received at the correction reference light receiving position of the light receiving unit 382 . do. In addition, the execution order of steps S33-S34 and step S35 should just be changed suitably. In addition, steps S33 to S34 and step S35 may be executed in parallel.

In the drawing apparatus 1, when steps S32 to S35 are completed for each of the plurality of drawing heads 31, the stage moving mechanism 22 is controlled by the movement control unit 64, and the Y of the substrate 9 is movement in the direction is initiated. Further, in each of the writing heads 31, the light modulator 34 is controlled by the head control unit 63 based on the writing data previously stored in the storage unit 61, and the substrate 9 in motion is Light modulated from each writing head 31 is irradiated to the upper surface 91, and pattern writing is performed (step S36).

During the drawing of the pattern on the substrate 9 , as described above, autofocus by the distance sensor 38 , the focus adjustment mechanism 353 , the head control unit 63 , etc. is parallel to the drawing on the substrate 9 . is carried out continuously. Specifically, while drawing with respect to the board|substrate 9 is performed, the measurement of the irradiation distance by the distance sensor 38 is performed continuously. In the measurement of the irradiation distance, the amount of deviation of the light receiving position in the light receiving unit 382 from the corrected reference light receiving position is obtained, and based on the deviation amount, the amount of deviation of the measured irradiation distance from the reference irradiation distance (that is, the substrate ( 9) of the upper surface 91 of the deformation amount in the vertical direction) is calculated|required.

Then, based on the amount of deviation of the measurement irradiation distance from the reference irradiation distance, the focus adjustment mechanism 353 is controlled by the head control unit 63, and the focus lens group 351 moves the distance corresponding to the deviation amount. is moved from the calibration reference position by as much as The position change of the focus lens group 351 is also continuously performed in parallel with the drawing with respect to the board|substrate 9. As shown in FIG. Thereby, the focal position of the drawing head 31 is moved to an up-down direction, and it matches with the upper surface 91 of the board|substrate 9. As shown in FIG. As a result, even when deformation such as warpage occurs in the substrate 9, since the focal position of the writing head 31 can be continuously aligned with the upper surface 91 of the substrate 9, the High-precision rendering is realized.

In the drawing apparatus 1, as mentioned above, drawing with respect to the some board|substrate 9 is performed continuously, and at the time of drawing start of each board|substrate 9, above-mentioned step S31-S35 is implemented. Thereby, during continuous writing on the plurality of substrates 9 , at least among the pressure around the writing head 31 (that is, the pressure in the clean room), the temperature of the projection optical system 35 , and the temperature of the distance sensor 38 . Even when there is a change in one or more, high-precision writing on each substrate 9 is realized.

In addition, in the drawing apparatus 1, step S31-S35 does not necessarily need to be implemented at the time of drawing start of each board|substrate 9. As shown in FIG. Steps S31 to S35 are not performed until, for example, writing on the substrate 9 of a predetermined number of sheets is finished, after being implemented at the time of starting of writing of the substrate 9 of one sheet. ), may be performed at the start of writing on the next substrate 9 after the completion of writing. Moreover, it is preferable that adjustment of the autofocus mechanism of steps S11 - S20 is performed, for example, at the time of starting of the drawing apparatus 1, and every completion|finish of drawing with respect to the board|substrate 9 of a predetermined number.

As described above, the writing apparatus 1 includes the stage 21 , the writing head 31 , the stage moving mechanism 22 , the pressure sensor 41 , and the head control unit 63 . The stage 21 holds the substrate 9 . The writing head 31 irradiates the light modulated on the board|substrate 9. The stage moving mechanism 22 moves the stage 21 relative to the drawing head 31 in a direction parallel to the upper surface 91 of the substrate 9 . The pressure sensor 41 measures the pressure around the drawing head 31 . The head control unit 63 controls the drawing head 31 . The drawing head 31 includes a light source 32 , a light modulation device 341 , and a projection optical system 35 . Light from the light source 32 is guided to the light modulation device 341 . The projection optical system 35 guides the light modulated in the light modulation device 341 to the stage 21 . The projection optical system 35 includes an objective lens group 352 , a focus lens group 351 , and a focus adjustment mechanism 353 . The focus adjustment mechanism 353 adjusts the focus position of the drawing head 31 by changing the position of the focus lens group 351 on the optical axis. The head control unit 63 controls the focus adjustment mechanism 353 based on the output from the pressure sensor 41 .

Thereby, the shift|offset|difference of the focus position of the writing head 31 resulting from the pressure fluctuation|variation around the writing head 31 can be corrected. As a result, the focus position of the drawing head 31 can be accurately matched with the upper surface 91 of the board|substrate 9, and high-precision drawing with respect to the board|substrate 9 can be implement|achieved. In addition, in the drawing apparatus 1, after the adjustment of the autofocus mechanism (so-called focus calibration) shown in steps S11 to S20 described above is performed once, instead of the focus calibration, the calculation processing by the head control unit 63 is performed. Since the shift in the focus position can be corrected by this, the time required for correction of the shift in the focus position can be shortened. As a result, productivity of the drawing apparatus 1 can be improved.

As described above, the drawing head 31 preferably further includes a first temperature sensor 36 that measures the temperature of the projection optical system 35 . Moreover, it is preferable to perform control of the focus adjustment mechanism 353 by the head control part 63 also based on the output from the 1st temperature sensor 36. As shown in FIG. Thereby, the shift|offset|difference of the focus position of the drawing head 31 resulting from the temperature fluctuation|variation of the projection optical system 35 can be corrected. As a result, the precision of drawing with respect to the board|substrate 9 can be improved.

As described above, the drawing head 31 preferably further includes a distance sensor 38 that measures the distance to the substrate 9 on the stage 21 . In addition, while drawing is being performed on the substrate 9 by relatively moving the stage 21 by the stage moving mechanism 22 and scanning the irradiation area of the light from the writing head 31 on the substrate 9, the distance The measurement of the distance to the substrate 9 by the sensor 38 is continuously performed, and the control of the focus adjustment mechanism 353 by the head control unit 63 is also performed based on the output from the distance sensor 38 . It is preferable to be In addition, while drawing on the substrate 9 is being performed, the focus position of the drawing head 31 is determined by the control of the focus adjustment mechanism 353 by the head control unit 63 to the upper surface of the substrate 9 ( 91) is preferred. In this way, when autofocusing is performed at the time of drawing with respect to the board|substrate 9, high-precision drawing can be implement|achieved also about the board|substrate 9 which deformation|transformation, such as curvature, generate|occur|produced.

More preferably, the drawing head 31 further includes a second temperature sensor 37 that measures the temperature of the distance sensor 38 , so that the focus adjustment mechanism 353 is controlled by the head controller 63 . is also implemented based on the output from the second temperature sensor 37 . Thereby, the shift|offset|difference of the light receiving position in the light receiving part 382 resulting from the temperature fluctuation|variation of the distance sensor 38 (that is, the shift|offset|difference of the measurement irradiation distance acquired by the distance sensor 38) can be corrected. As a result, the precision of drawing with respect to the board|substrate 9 can be improved.

As described above, in the writing apparatus 1, the stage 21 is relatively moved by the stage moving mechanism 22, and the irradiation area of the light from the writing head 31 is directed on the substrate 9 in a predetermined scanning direction. By scanning only once, it is preferable that drawing with respect to the board|substrate 9 is completed. In order to realize such single-pass writing, it is necessary for the projection optical system 35 to include a relatively large lens. In a large lens, since the depth of focus is generally shallow, the focal position of the drawing head 31 is liable to shift from the upper surface 91 of the substrate 9 . As mentioned above, in the writing apparatus 1, since the focal position of the writing head 31 can be matched with the upper surface 91 of the board|substrate 9 with high precision, the structure of the writing apparatus 1 is single It is especially suitable for the drawing apparatus in which the drawing of a pass method is implemented.

As mentioned above, Preferably, the pattern drawn on the board|substrate 9 is a circuit pattern, the L/S line of the said circuit pattern is 7 micrometers - 9 micrometers, and the space is 11 micrometers - 13 micrometers. In order to realize such high-definition writing, the projection optical system 35 needs to be equipped with a relatively large lens. In a large lens, since the depth of focus is generally shallow, the focal position of the drawing head 31 is liable to shift from the upper surface 91 of the substrate 9 . As mentioned above, in the drawing apparatus 1, since the focal position of the drawing head 31 can be matched with the upper surface 91 of the board|substrate 9 with high precision, the structure of the drawing apparatus 1 is fixed. It is especially suitable for the drawing apparatus in which thin drawing is performed.

As described above, the focus lens group 351 is preferably moved independently from the objective lens group 352 by the focus adjustment mechanism 353 . Thereby, the focus adjustment mechanism 353 can be downsized. The structure in which the focus lens group 351 is moved independently from the objective lens group 352 is particularly suitable for a drawing apparatus in which the focus lens group 351 has a relatively large lens.

Moreover, it is more preferable that the moving direction of the focus lens group 351 by the focus adjustment mechanism 353 is a horizontal direction. Accordingly, even when the focus lens group 351 is enlarged and heavy in weight, it is possible to facilitate the movement of the focus lens group 351 by the focus adjustment mechanism 353 compared to the case where the movement direction is up and down. have.

The writing method of irradiating light to the board|substrate 9 with the writing apparatus 1 and writing a pattern is the process (step S31) of measuring the pressure around the writing head 31, and the pressure measured by step S31 The step of adjusting the focal position of the drawing head 31 by changing the position of the focusing lens group 351 on the optical axis based on the (step S33) is provided. Thereby, as mentioned above, the shift|offset|difference of the focus position of the writing head 31 resulting from the pressure fluctuation|variation around the writing head 31 can be corrected. As a result, the focus position of the drawing head 31 can be accurately matched with the upper surface 91 of the board|substrate 9, and high-precision drawing with respect to the board|substrate 9 can be implement|achieved.

In the writing apparatus 1, also in the process of adjusting the deviation in the horizontal direction of the irradiation position of the light from the writing head 31, and the said irradiation position in design (so-called head calibration), the above-mentioned pressure and temperature It is preferred that a correction based on it be carried out. The said head calibration is implemented at the time of maintenance of the drawing apparatus 1, for example. When the head calibration is performed, the drawing head 31 to be adjusted is moved above the jig 52 , and the imaging unit 51 is located below the drawing head 31 .

9 is a diagram showing an example of the flow of head calibration. First, the pressure (ie, atmospheric pressure) is measured by the pressure sensor 41 , and the measured pressure acquired by the pressure sensor 41 is sent to the head control unit 63 of the control unit 6 (step S41 ). ). Moreover, the temperature measurement by the 1st temperature sensor 36 is performed, and the measured temperature of the projection optical system 35 acquired by the 1st temperature sensor 36 is sent to the head control part 63 (step S42). . In addition, the execution order of steps S41 and S42 should just be changed suitably. In addition, step S41 and step S42 may be performed in parallel.

In the head control unit 63, the reference position of the focus lens group 351 is corrected based on the measurement pressure acquired in steps S41 and S42 and the measurement temperature of the projection optical system 35 (step S43). Then, the focus lens group 351 is moved to the correction reference position by the focus adjustment mechanism 353 (step S44). In step S43, similarly to step S33 described above, the focus lens group 351 is moved from the reference position by the correction distance dF (nm) shown in the formula (1). Thereby, the focal position of the drawing head 31 is matched with the upper surface of the jig 52 .

When the focus lens group 351 is positioned at the correction reference position, light is irradiated from the drawing head 31 to the jig 52 , and a predetermined calibration pattern (not shown) is irradiated to the jig 52 . And by the imaging part 51, the irradiation area of the light from the writing head 31 on the jig 52 is imaged together with the said mark previously formed on the jig 52 (step S45). . Illumination light is irradiated to the mark from the light source fixed to the distance sensor 38, for example.

The image acquired by the imaging unit 51 is sent to the image processing unit 62 of the control unit 6 . The image processing unit 62 is configured to, based on the image acquired by the imaging unit 51 , the actual irradiation position of the drawing head 31 and the design irradiation position of the drawing head 31 (hereinafter referred to as “design irradiation position”). '). In other words, based on the image acquired in step S45, the image processing part 62 acquires the deviation in the horizontal direction from the design irradiation position of the irradiation position of the drawing head 31 (step S46).

Then, based on the said shift|offset|difference, the drawing head 31 is moved horizontally by the head moving mechanism (not shown) so that the irradiation position of the drawing head 31 may coincide with the design irradiation position (step S47). In the drawing apparatus 1, the above-described steps S41 to S47 are performed for each of the plurality of drawing heads 31, thereby adjusting the positions of the plurality of drawing heads 31 in the horizontal direction (that is, head calibration). ) is terminated.

As described above, the drawing apparatus 1 preferably further includes the jig 52 , the imaging unit 51 , and the image processing unit 62 . The jig 52 is fixed to the stage 21 . The imaging unit 51 images the irradiation area of the light from the writing head 31 on the jig 52 together with the mark previously formed on the jig 52 . The image processing unit 62 acquires a deviation from the design irradiation position of the irradiation position of the drawing head 31 based on the image acquired by the imaging unit 51 . In the drawing apparatus 1, when imaging of the jig 52 by the imaging part 51 is implemented, the focus of the drawing head 31 is controlled by the focus adjustment mechanism 353 by the head control part 63. It is preferred that the position be fitted to the jig 52 . Thereby, since the shift|offset|difference of the irradiation position of the writing head 31 from the design irradiation position can be acquired with high precision, high-precision head calibration can be implement|achieved. As a result, the precision of drawing with respect to the board|substrate 9 can be improved.

In the above-mentioned drawing apparatus 1 and drawing method, various changes are possible.

The first temperature sensor 36 does not need to be attached to the position illustrated in FIG. 4 , and may be attached to, for example, another portion of the objective lens group 352 or the focus lens group 351 . Similarly, the second temperature sensor 37 does not need to be affixed to the position illustrated in FIG. 4 , and may be affixed to the light emitting part 381 or the light receiving part 382 , for example. The 1st temperature sensor 36 and the 2nd temperature sensor 37 may be sensors other than a thermocouple. What is necessary is just to change suitably also about the position and type of the pressure sensor 41. As shown in FIG.

In the drawing head 31 , instead of the DMD, for example, another apparatus such as GLV (Grating Light Valve) (registered trademark) may be formed as the light modulation device 341 .

In addition, in the drawing head 31 , the focus lens group 351 does not necessarily need to be moved independently from the objective lens group 352 , but is moved together with the objective lens group 352 by the focus adjustment mechanism 353 . may be

In the adjustment of the autofocus mechanism described above, parameters other than the contrast evaluation value are obtained from the image acquired by the imaging unit 51 in step S14, and the peak detection processing in step S16 is performed using the parameters. may be carried out. In addition, the acquisition of the reference pressure, the reference temperature, and the reference light-receiving position in steps S11 to S13 may be performed after the reference position of the focus lens group 351 is acquired in step S18.

Correction of the reference position of the focus lens group 351 in step S33 may be implemented using a formula other than Formula (1). Alternatively, a table indicating the relationship between the pressure around the drawing head 31 and the temperature of the projection optical system 35 and the position of the focus lens group 351 is stored in the storage unit 61 in advance, and using the table Correction of the reference position of the focus lens group 351 may be performed. In the correction of the reference position of the focus lens group 351 , the temperature of the projection optical system 35 is not necessarily used, for example, the correction may be performed based only on the pressure around the drawing head 31 . The same applies to correction of the reference position of the focus lens group 351 in step S43.

The correction of the reference light-receiving position in step S35 may be performed using a formula other than the formula (2). Alternatively, a table indicating the relationship between the temperature of the distance sensor 38 and the reference light-receiving position is stored in the storage unit 61 in advance, and the reference light-receiving position may be corrected using the table. Further, correction of the reference light-receiving position of the distance sensor 38 may be omitted.

Drawing with respect to the board|substrate 9 in the writing apparatus 1 does not necessarily need to be performed by a single-pass system, and may be implemented by what is called a multi-pass system. In this case, first, the substrate 9 is moved in the Y direction by the stage moving mechanism 22 , so that the irradiation area of light from the plurality of writing heads 31 is on the upper surface 91 of the substrate 9 in the Y direction. is injected with Then, by the stage moving mechanism 22, the board|substrate 9 is moved by a predetermined distance (for example, the distance substantially equivalent to the writing width by one writing head 31) in the X direction. Next, the board|substrate 9 is moved to a Y direction again, and the irradiation area|region of the light from the some writing head 31 is scanned on the upper surface 91 of the board|substrate 9 in a Y direction. Then, by repeating the scanning of light by the movement of the substrate 9 in the Y direction (that is, the scanning direction) and the step movement of the substrate 9 in the X direction (that is, the width direction), the substrate 9 is The drawing of the circuit pattern is performed.

The stage moving mechanism 22 does not necessarily move the stage 21 . For example, above the fixed stage 21 , the plurality of drawing heads 31 are moved to the upper surface of the substrate 9 . You may move in the direction parallel to (91).

What is necessary is just to change the number of the drawing heads 31 provided in the drawing part 3 suitably. One may be sufficient as the number of the drawing heads 31, and two or more may be sufficient as it.

In the drawing apparatus 1, L/S of the circuit pattern drawn on the board|substrate 9 should just be changed suitably. Moreover, patterns other than a circuit pattern may be drawn on the board|substrate 9. As shown in FIG.

The board|substrate 9 on which drawing is performed in the drawing apparatus 1 is not necessarily limited to a printed wiring board. In the drawing apparatus 1, for example, a semiconductor substrate, a glass substrate for a flat panel display device such as a liquid crystal display device or a plasma display device, a glass substrate for a photomask, a substrate for a solar cell panel, etc. Drawing may be performed.

The configuration in the above embodiment and each modification may be appropriately combined as long as they do not contradict each other.

Although the invention has been described and described in detail, the foregoing description is illustrative and not restrictive. Therefore, it can be said that many modifications and aspects are possible without departing from the scope of the present invention.

1: drawing device
9: substrate
21 : Stage
22: stage moving mechanism
31: drawing head
32: light source
35: projection optical system
36: first temperature sensor
37: second temperature sensor
38: distance sensor
41: pressure sensor
51: imaging unit
52: jig
62: image processing unit
63: head control
91: (substrate) upper surface
341: optical modulation device
351: focus lens group
352: objective lens group
353: focus adjustment mechanism
S11 to S20, S31 to S36, S41 to S47: Step

Claims (17)

A writing apparatus for writing a pattern by irradiating a substrate with light,
a stage for holding the substrate;
a writing head irradiating modulated light to the substrate;
a stage moving mechanism for moving the stage relative to the writing head in a direction parallel to the upper surface of the substrate;
a pressure sensor for measuring the pressure around the outside of the drawing head;
a head control unit for controlling the drawing head;
The drawing head is
light source,
a light modulation device through which light from the light source is induced;
and a projection optical system for guiding the light modulated by the light modulation device to the stage;
The projection optical system,
an objective lens group;
a focusing lens group,
a focusing mechanism for adjusting a focal position of the drawing head by changing a position on the optical axis of the focusing lens group;
The head control unit controls the focus adjustment mechanism based on an output from the pressure sensor. The method of claim 1,
the drawing head further includes a first temperature sensor for measuring a temperature of the projection optical system;
The drawing apparatus characterized in that control of the said focus adjustment mechanism by the said head control part is implemented also based on the output from the said 1st temperature sensor. The method of claim 1,
The drawing head further includes a distance sensor for measuring a distance to the substrate on the stage;
Measurement of the distance to the substrate by the distance sensor while writing to the substrate is being performed by scanning the irradiation area of light from the writing head on the substrate by relatively moving the stage by the stage moving mechanism carried out continuously,
The control of the focus adjustment mechanism by the head control unit is also performed based on the output from the distance sensor,
The drawing apparatus according to claim 1, wherein the focus position of the drawing head is aligned with the upper surface of the board by control of the focus adjustment mechanism by the head controller while drawing on the substrate is being performed. 4. The method of claim 3,
The drawing head further includes a second temperature sensor for measuring a temperature of the distance sensor,
The drawing apparatus characterized in that control of the said focus adjustment mechanism by the said head control part is implemented also based on the output from the said 2nd temperature sensor. The method of claim 1,
a jig fixed to the stage;
an imaging unit configured to image an irradiation area of light from the drawing head on the jig together with a mark previously formed on the jig;
an image processing unit for acquiring a deviation from a design irradiation position of the irradiation position of the drawing head based on the image acquired by the imaging unit;
The drawing apparatus characterized in that when the imaging of the jig by the imaging unit is performed, the focus position of the drawing head is aligned with the jig under control of the focus adjustment mechanism by the head control unit. The method of claim 1,
The writing apparatus according to claim 1, wherein writing on the substrate is completed by relatively moving the stage by the stage moving mechanism and scanning the area irradiated with light from the writing head only once in a predetermined scanning direction on the substrate. The method of claim 1,
The said pattern drawn on the said board|substrate is a circuit pattern, the L/S line of the said circuit pattern is 7 micrometers - 9 micrometers, The space is 11 micrometers - 13 micrometers, The writing apparatus characterized by the above-mentioned. 8. The method according to any one of claims 1 to 7,
and the focusing lens group is independently moved from the objective lens group by the focusing mechanism. A writing apparatus comprising: a stage for holding a substrate; a writing head for irradiating modulated light to the substrate; and a stage moving mechanism for moving the stage relative to the writing head in a direction parallel to the upper surface of the substrate As a writing method of writing a pattern by irradiating light to the substrate,
The drawing head is
light source,
a light modulation device through which light from the light source is induced;
and a projection optical system for guiding the light modulated by the light modulation device to the stage;
The projection optical system,
an objective lens group;
having a focusing lens group,
a) measuring the pressure around the outside of the drawing head;
b) adjusting the focus position of the drawing head by changing the position on the optical axis of the focus lens group based on the pressure measured in step a). 10. The method of claim 9,
c) further comprising the step of measuring the temperature of the projection optical system;
The drawing method characterized in that the adjustment of the focal position of the drawing head in the step b) is also performed based on the temperature measured in the step c). 10. The method of claim 9,
d) In the step b), after the focal position of the writing head is aligned with the upper surface of the substrate, the stage is relatively moved by the stage moving mechanism to scan the irradiation area of the light from the writing head on the substrate The process of performing drawing on the said board|substrate by doing, and
e) continuously measuring the distance from the writing head to the substrate on the stage in parallel with the step d);
f) In parallel with step d), by changing the position on the optical axis of the focusing lens group based on the distance measured in step e), the focal position of the drawing head is set on the upper surface of the substrate A drawing method characterized by further comprising a step of continuously matching. 12. The method of claim 11,
g) further comprising a step of measuring a temperature of a distance sensor used for measuring the distance to the substrate in step e),
The drawing method characterized in that the adjustment of the focal position of the drawing head in the step b) is also performed based on the temperature measured in the step g). 10. The method of claim 9,
The drawing device is
a jig fixed to the stage;
Further comprising an imaging unit for imaging the jig,
The drawing method is
h) After the focus position of the drawing head is aligned with the jig in the step b), an irradiation area of light from the drawing head on the jig is imaged together with a mark previously formed on the jig process and
i) A drawing method characterized by further comprising a step of acquiring a deviation of the irradiation position of the drawing head from a design irradiation position based on the image acquired in the step h). 10. The method of claim 9,
The writing method according to claim 1, wherein the writing on the substrate is completed by relatively moving the stage by the stage moving mechanism and scanning the area irradiated with light from the writing head only once in a predetermined scanning direction on the substrate. 10. The method of claim 9,
The said pattern drawn on the said board|substrate is a circuit pattern, the L/S line of the said circuit pattern is 7 micrometers - 9 micrometers, and the space is 11 micrometers - 13 micrometers, The writing method characterized by the above-mentioned. 16. The method according to any one of claims 9 to 15
In the step b), the drawing method, wherein the focus lens group moves independently from the objective lens group. The method of claim 1,
a housing for accommodating the stage, the drawing head, and the stage moving mechanism;
and the pressure sensor is mounted on an inner surface of the housing.

Images