CN106814546B - Focal plane detection device, focal plane scaling method and silicon wafer exposure method - Google Patents
Focal plane detection device, focal plane scaling method and silicon wafer exposure method Download PDFInfo
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- CN106814546B CN106814546B CN201510856628.6A CN201510856628A CN106814546B CN 106814546 B CN106814546 B CN 106814546B CN 201510856628 A CN201510856628 A CN 201510856628A CN 106814546 B CN106814546 B CN 106814546B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Automatic Focus Adjustment (AREA)
Abstract
The invention discloses a kind of focal plane detection device, focal plane scaling method and silicon wafer exposure method, which includes light source unit, for being irradiated generation imaging beam to mask plate；Imaging unit, for by the focusing pattern imaging on mask plate in focusing image sensor；Focusing driving unit, for vertical adjusting projection objective or sports platform unit to complete to focus；Sports platform unit, is provided with the reflection unit with reflecrtive mark, and the sports platform unit is used to for the reflection unit being moved to the underface of projection objective；Control unit, for the graph data of focusing imaging sensor acquisition to be analyzed and is handled, and feedback control focusing driving unit.The present invention fast and accurately can be demarcated and be compensated to optimal focal plane offset.
Description
Technical field
The present invention relates to IC manufacturing field, in particular to a kind of focal plane detection device, focal plane scaling method and silicon
Piece exposure method.
Background technique
During photo-etching machine exposal, in order to obtain optimum exposure quality, silicon wafer upper surface must be always positioned at projection object
In the best focal plane of mirror.As shown in Figure 1, existing technological means is usually to pass through litho machine i.e. focusing and leveling subsystem
Optical detector 4 in (FLS, full name in English: Focusing and leveling system) to the position of 2 upper surface of silicon wafer into
Row measures, and the best coke for the projection objective 1 demarcated is adjusted to using the drive silicon wafer 2 of regulating mechanism, that is, sports platform 3
At plan-position.
But above-mentioned measurement method faces following problem: since projection objective 1 is subject to processing, assembles or temperature, air pressure
Etc. external environments influence, so that practical focal plane is drifted about, so the best focal plane of projection objective 1 is total relative to FLS zero plane
It is that there are certain height and dip deviations.It is thus typically necessary to by using FEM (focus exposure matrix, English spelling:
Focus-Exposure-Matrix) mode exposed measures with the best focal plane position of determination, such as the focal plane shift amount
Shown in Fig. 2 a, in FEM exposure process, mask remains at fixed position, and under nominal exposure dosage, work stage is controlled by FLS
System vertically step motion at certain intervals；After silicon wafer 2 exposes at certain altitude, steps at next height and be exposed
When, for the exposure label for avoiding current exposure label covering last time, work stage is also moved a certain distance simultaneously in Y-direction, is exposed
Exposure matrix pattern 6 as shown in Figure 2 a is just formd on silicon wafer 2 afterwards；After developed, by the micro- sem observation exposure matrix
The image quality of mask label pattern 7 in pattern 6, as shown in Figure 2 b to get the optimal imaging position arrived under the label.
It follows that this kind of measurement method for finding optimal focal plane, operation and execution are got up, step is more and must pass through
Multiple technological experiment could be completed to survey school, therefore how fast and accurately optimal focal plane offset to be demarcated and be mended
It repays, is those skilled in the art's technical problem urgently to be resolved.
Summary of the invention
The present invention provides a kind of focal plane detection device, focal plane scaling method and silicon wafer exposure method, can be fast and accurately
Optimal focal plane offset is demarcated and is compensated.
In order to solve the above technical problems, the present invention provides a kind of focal plane detection device, comprising: light source unit, for covering
Template is irradiated generation imaging beam, and focusing figure is had on the mask plate；Imaging unit, for the pattern imaging that will focus
On reflection unit and focusing image sensor；Focusing driving unit, is used for vertical adjusting projection objective or sports platform unit
To complete focusing；Sports platform unit is provided with the reflection unit with reflecrtive mark, for the reflection unit is mobile
To the underface of projection objective；Control unit, for the graph data of focusing imaging sensor acquisition to be analyzed and is handled,
And feedback control focusing driving unit.
Preferably, the mask plate is using the digital mask that can generate focusing figure or comes with focusing figure
Entity mask plate.
Preferably, the light source unit uses semiconductor laser, solid state laser or LED light source.
Preferably, the imaging unit includes: collimation lens set, beam splitter, projection objective and focusing imaging lens；Institute
It states light source unit and generation imaging beam is irradiated to mask plate, it will through beam splitter and projection objective after collimated lens group collimation
Focusing, light beam reflection, the light beam after reflection reflex to the focusing imaging lens through beam splitter to pattern imaging simultaneously on reflection unit
Reflecrtive mark on the picture and reflection unit of figure of focusing is imaged on the focusing image sensor by head.
Preferably, the focusing image sensor uses area array CCD or CMOS.
Preferably, the reflection unit is plane mirror or naked silicon wafer with reflecrtive mark.
Preferably, it is described focusing driving unit be for control the vertical movement of projection objective piezoceramic transducer or
Person is the vertical deviation regulating platform for carrying reflection unit.
A kind of method of focal plane calibration, using the focal plane detection device, comprising: adjust sports platform unit and focusing is driven
Moving cell blur-free imaging on focusing image sensor to reflecrtive mark records the first vertical position of reflection unit at this time；Under
Reflection unit is moved until focusing figure blur-free imaging on focusing image sensor, records the second vertical position of reflection unit at this time
It sets；According to principle of reflection, optimum exposure position is determined.
Preferably, setting spacing between the first, second vertical position as d, then optimum exposure position is second vertical
Below position at d.
Preferably, the imaging of the reflecrtive mark and focusing figure on focusing image sensor does not overlap.
A kind of silicon wafer exposure method, comprising: step 1: by the described in any item focal plane scaling methods of claim 8-10,
The measurement for carrying out focal plane deviation, obtains the first, second vertical position Z0、Z1Between spacing d value；Step 2: upper piece, open light
Source unit carries out 3 points or more of global focusing and leveling and tilt quantity measurement in full sheet；Step 3: tilt quantity is substituted into silicon
The position coordinates of each exposure field of on piece calculate the theoretical defocusing amount Fi (i=0,1,2 ...) of each exposure field；Step 4: stepping to
I-th of exposure field carries out continuous defocus and draws scanning curve, fit peak intensity positions conduct using Fi as scanning center
Initial optimal focal plane position Za, step 5: the actual exposure optimum position under the visual field is Zb=Za+2d；Step 6: enabling focusing
Device steps to ZbPosition executes exposure process；Step 7: making i=i+1, repeat step 4-6.
Compared with prior art, the invention has the following advantages that
1, the present invention generates focusing figure by digitlization mask technique, and by being mounted with to have on sports platform unit
The reflex reflector of reflecrtive mark, can be by focusing figure direct imaging on focusing image detector；
2, the reflex reflector of the invention by being provided with reflecrtive mark, can detect simultaneously on focusing image detector
To the focus plane information of system and the optimal focal plane information of projection objective；
3, the present invention by focusing detector obtain can rapid survey go out silicon wafer face position (i.e. reflection unit institute in place
Set) deviate the deviation of exposure optimal focal plane position, and there is measurement accuracy and measurement reproducibility well.
Detailed description of the invention
Fig. 1 is FLS schematic illustration in the prior art；
Fig. 2 a is the schematic diagram of silicon wafer in the prior art；
Fig. 2 b is the portion A enlarged drawing in Fig. 2 a；
Fig. 3 is the structural schematic diagram of focal plane detection device in the embodiment of the present invention 1；
Fig. 4 is the schematic diagram of focusing figure in the embodiment of the present invention 1；
Fig. 5 is the imaging schematic diagram of focusing figure and reflecrtive mark on projected image sensor in the embodiment of the present invention 1；
Fig. 6 is the imaging schematic diagram of reflecrtive mark in the embodiment of the present invention 1；
Fig. 7 is the imaging schematic diagram of focusing figure in the embodiment of the present invention 1；
Fig. 8 is focusing curve schematic diagram in the embodiment of the present invention 1；
Fig. 9 is the structural schematic diagram of focal plane detection device in the embodiment of the present invention 2；
Figure 10 is the structural schematic diagram of focal plane detection device in the embodiment of the present invention 3.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.It should be noted that attached drawing of the present invention is all made of simplified form and uses non-essence
Quasi- ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Embodiment 1
As shown in figure 3, the present embodiment provides a kind of focal plane detection devices, comprising: light source unit (not shown), imaging
Unit, focusing driving unit 109, sports platform unit 107 and control unit 110, wherein the light source unit is used for mask plate
101 are irradiated generation imaging beam, and focusing figure 101a is had on the mask plate 101；The imaging unit will be for that will adjust
Burnt figure 101a is imaged on reflection unit 108 and focusing image sensor 106；The focusing driving unit 109 is for vertical
Projection objective 104 is adjusted to complete to focus；The reflection unit with reflecrtive mark 108a is provided on the sports platform unit 107
108, for 108 horizontal direction of reflection unit and vertical direction to be moved to the underface of projection objective 104；The control is single
Graph data of the member 110 for acquiring to focusing imaging sensor 106 is analyzed and is handled, and feedback control focusing driving is single
Member 109.
Specifically, the mask plate 101 is using the digital mask for being able to produce focusing figure 101a, focusing figure 101a
As shown in figure 3, including several focusing points 1011, the focusing point 1011 is evenly distributed on the focusing graph edge to Y-direction along X
In boundary, that is, exposure field boundary 1012, it is equal to but is not limited to 5 × 5 focusing points 1011 in the present embodiment, it specifically can be according to reality
Border situation generates suitable focusing figure 101a using digital mask.
With continued reference to Fig. 3, the imaging unit includes: collimation lens set 102 for collimation, beam splitter 103, numerical aperture
The projection objective 104 that diameter and exposure resolution ratio match and the focusing with good optical property and suitable enlargement ratio at
As camera lens 105.The light source unit is irradiated generation imaging beam to mask plate 101, and collimated lens group 102 will have one
The imaging beam of numerical aperture is converted into directional light, which schemes focusing after beam splitter 103 and projection objective 104
Shape 101a is imaged on reflection unit 108 and reflects, and the light beam after reflection reflexes to the focusing through beam splitter 103 and is imaged
Focusing figure 101a and reflecrtive mark 108a is imaged on the focusing image and sensed by camera lens 105, the focusing imaging lens 105
On device 106.
Preferably, the reflection unit 108 has high reflectance, it can be the plane mirror or naked with reflecrtive mark
Silicon wafer.The focusing driving unit 109 is the piezoceramic transducer for controlling the vertical movement of projection objective 104.
The receiving end of the focusing image sensor 106 and reflection unit 108 are conjugated, and specifically, the focusing image passes
Sensor 106 uses area array CCD or CMOS, shows the picture of the focusing figure 101a on digital mask simultaneously in focussing process
With the picture of reflecrtive mark 108a.
Described control unit 110 is used for the reception and processing of imaging data, generallys use PC machine, is integrated with data processing
Software, for calling specific focusing algorithm.Further, after the focusing image sensor 106 is collected into figure, pass through height
Fast Ethernet imports data in control unit 110, passes focussing signals after being analyzed and processed by control unit 110 to data
Focusing driving unit 109 is passed, focusing driving unit 109 carries out mobile and then completes focusing task according to focussing signals.
It should be noted that the figure of the reflecrtive mark 108a can be identical as the focusing figure 101a, but the two
Picture on the focusing image sensor 106 picture do not overlap.It is specific as shown in Figure 5, wherein thin shade focus 22 is anti-
Picture point of the reflecrtive mark 108a of 108 upper surface of injection device on focusing image sensor 106, shade focus 21 are focusing figure
Picture point of the focusing point on focusing image sensor 106 on shape 101a, both in the visual field model of focusing image sensor 106
It encloses in 23.By the way that the grayscale information of thin shade focus 22 and shade focus 21 is imported control unit 110 respectively, algorithm is carried out
It analyzes and controls focusing driving unit 109 and carry out vertical movement, and successively adjust thin shade focus 22 and shade focus 21
To the position of optimum image plane, optimal focal plane position can be calculated according to the vertical amount of movement for driving unit 109 of focusing during this
It sets.
The present invention also provides a kind of focal plane scaling methods to be specifically included using above-mentioned focal plane detection device:
It is as shown in Figure 6: to adjust sports platform unit 107 and focusing driving unit 109 to reflecrtive mark 108a in focusing image
Blur-free imaging on sensor 106 records the first vertical position Z of reflection unit 108 at this time0；
It is as shown in Figure 7: move down reflection unit 108 until focusing figure 101a on focusing image sensor 106 clearly at
Picture records the second vertical position Z of reflection unit 108 at this time1；Specifically, when reflection unit 108 is displaced downwardly to the second vertical position
Z1When, focusing figure 101a be able to blur-free imaging, if the second vertical position Z at this time1With the first vertical position Z0Spacing be d, this
When focusing figure 101a theoretical conjugate image position equally in the first vertical position Z0Place, but according to the principle of reflection of light,
The position of the practical conjugate image of focusing figure 101a should be in the second vertical position Z1At the d distance of lower section, i.e. Z2It is best at position
Exposure position.
Therefore, after completing this focusing, according to principle of reflection, it may be determined that optimum exposure position Z2For the figure 101a that focuses
When blur-free imaging at the position of lower section d distance.
The present invention by for the focusing of different object planes (mask plate 101 and reflection unit 108), can be completed periodically twice
To the purpose of the calibration measurement of drift value Δ f, this is consistent with the target for carrying out FEM exposure experiments, but substantially reduces
The school time is surveyed, is more feasible in maskless lithography system, in addition the stated accuracy of drift value Δ f can be completely by focusing algorithm
Accuracy guarantee, error are less than 300nm.
Therefore, it is based on above-mentioned focal plane scaling method, the present invention also provides a kind of silicon wafer exposure methods, specifically include following step
It is rapid:
Step 1: by above-mentioned focal plane scaling method, carrying out the measurement of focal plane deviation, obtain the first, second vertical position
Z0、Z1Between spacing d value, usually um magnitude；
Step 2: upper piece, light source unit is opened, carries out 3 points or more of global focusing and leveling and tilt quantity in full sheet
Rx, Ry measurement；
Step 3: tilt quantity Rx, Ry are substituted into the position coordinates of each exposure field on silicon wafer, calculate the theory of each exposure field
Defocusing amount Fi (i=0,1,2 ...)；
Step 4: stepping to i-th of exposure field, using Fi as scanning center, carry out continuous defocus and draw as shown in Figure 8
Scanning curve fits peak intensity positions as initial optimal focal plane position Za,
Step 5: the actual exposure optimum position under the visual field is Zb=Za+2d；
Step 6: enabling focus control, step to ZbPosition executes exposure process；
Step 7: making i=i+1, repeat step 4-6.
Embodiment 2
As shown in figure 9, the focusing driving unit 109 in the present embodiment is using the vertical deviation tune with vertical focusing action
Platform is saved, described control unit 110 is connected directly to the vertical deviation regulating platform, output focusing control amount is directly assigned vertical
It is displaced regulating platform, is acted using the precise displacement that vertical deviation regulating platform completes silicon wafer vertical position as executive component, in other words,
Sports platform unit 107 in the present embodiment is only mobile by 108 horizontal direction of reflection unit.
Embodiment 3
As shown in Figure 10, the digital mask in embodiment 1, the entity mask are replaced using entity mask plate in the present embodiment
Plate selects transmission-type or reflection type mask plate 101, is carried by mask platform 101b.Focusing figure on the entity mask plate
101a is the IC integrated circuit technology figure of development to be exposed, this figure can utilize the focusing algorithm of specific control unit 110
It is analyzed and processed with image processing system.
In conclusion focal plane detection device of the invention, comprising: light source unit, for being irradiated production to mask plate 101
Raw imaging beam；Imaging unit, for the focusing figure 101a on mask plate 101 to be imaged on focusing image sensor 106；
Focusing driving unit 109, for vertical adjusting projection objective 104 or sports platform unit 107 to complete to focus；Sports platform unit
107, it is provided with the reflection unit 108 with reflecrtive mark 108a, the sports platform unit 107 is used to fill the reflection
Set 108 underfaces for being moved to projection objective 104；Control unit 110, the figure for being acquired to focusing imaging sensor 106
Data are analyzed and are handled, and feedback control focusing driving unit 109.The present invention can be fast and accurately to optimal focal plane
Offset is demarcated and is compensated.
Obviously, those skilled in the art can carry out various modification and variations without departing from spirit of the invention to invention
And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it
Interior, then the invention is also intended to include including these modification and variations.
Claims (10)
1. a kind of focal plane detection device characterized by comprising
Light source unit has focusing figure for being irradiated generation imaging beam to mask plate on the mask plate；
Imaging unit, for pattern imaging will to be focused in reflection unit and focusing image sensor；
Focusing driving unit, for vertical adjusting sports platform unit to complete to focus；
Sports platform unit is provided with the reflection unit with reflecrtive mark, for the reflection unit to be moved to projection
The underface of object lens；
Control unit, for the graph data of focusing imaging sensor acquisition to be analyzed and handled, and feedback control is focused
Driving unit；
Wherein, adjust sports platform unit and focusing driving unit to reflecrtive mark the blur-free imaging on focusing image sensor, note
Record the first vertical position of reflection unit at this time；
Reflection unit is moved down until focusing figure blur-free imaging on focusing image sensor, records the second of reflection unit at this time
Vertical position；
According to principle of reflection, optimum exposure position is determined；
The spacing between the first, second vertical position is set as d, then optimum exposure position is at the d of the second vertical position lower section.
2. focal plane detection device as described in claim 1, which is characterized in that the mask plate use can generate focusing figure
Digital mask or come with focusing figure entity mask plate.
3. focal plane detection device as described in claim 1, which is characterized in that the light source unit using semiconductor laser,
Solid state laser or LED light source.
4. focal plane detection device as described in claim 1, which is characterized in that the imaging unit includes: collimation lens set, divides
Shu Jing, projection objective and focusing imaging lens；The light source unit is irradiated generation imaging beam to mask plate, collimated
Pattern imaging will be focused on reflection unit through beam splitter and projection objective after microscope group collimation while light beam reflects, the light after reflection
Beam reflexes to the focusing imaging lens through beam splitter, and the reflecrtive mark on the picture and reflection unit of figure of focusing is imaged on institute
It states on focusing image sensor.
5. focal plane detection device as described in claim 1, which is characterized in that the focusing image sensor uses area array CCD
Or CMOS.
6. focal plane detection device as described in claim 1, which is characterized in that the reflection unit is flat with reflecrtive mark
Face mirror or naked silicon wafer.
7. focal plane detection device as described in claim 1, which is characterized in that the focusing driving unit is to project for controlling
The piezoceramic transducer of the vertical movement of object lens either carries the vertical deviation regulating platform of reflection unit.
8. a kind of method of focal plane calibration, using focal plane detection device as claimed in any one of claims 1 to 7, feature
It is, focusing driving unit is for vertical adjusting sports platform unit to complete to focus, comprising:
Adjusting sports platform unit and focusing the driving unit blur-free imaging on focusing image sensor to reflecrtive mark, record is at this time
First vertical position of reflection unit；
Reflection unit is moved down until focusing figure blur-free imaging on focusing image sensor, records the second of reflection unit at this time
Vertical position；
According to principle of reflection, optimum exposure position is determined；
Wherein, the spacing between the first, second vertical position is set as d, then optimum exposure position is d below the second vertical position
Place.
9. focal plane scaling method as claimed in claim 8, which is characterized in that the reflecrtive mark and focusing figure are schemed in focusing
As the imaging on sensor does not overlap.
10. a kind of silicon wafer exposure method, it is characterised in that: including
Step 1: by the described in any item focal plane scaling methods of claim 8-9, carrying out the measurement of focal plane deviation, obtain the
One, the second vertical position Z0、Z1Between spacing d value；
Step 2: upper piece, light source unit is opened, carries out 3 points or more of global focusing and leveling and tilt quantity measurement in full sheet；
Step 3: tilt quantity being substituted into the position coordinates of each exposure field on silicon wafer, calculates the theoretical defocusing amount Fi (i of each exposure field
=0,1,2 ...)；
Step 4: stepping to i-th of exposure field, using Fi as scanning center, carry out continuous defocus and draw scanning curve, fit
Peak intensity positions are as initial optimal focal plane position Za,
Step 5: the actual exposure optimum position of i-th of exposure field is Zb=Za+2d；
Step 6: enabling focus control, step to ZbPosition executes exposure process；
Step 7: making i=i+1, repeat step 4-6.
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109212916B (en) * | 2017-06-30 | 2022-02-15 | 上海微电子装备（集团）股份有限公司 | Exposure developing device and method |
| CN107908076B (en) * | 2017-10-12 | 2019-09-24 | 浙江大学 | A kind of vortex light shear interference focus adjustment method in light field regulation photoetching |
| CN108200424B (en) * | 2017-11-17 | 2020-06-19 | 天津津航技术物理研究所 | Debugging method and system for aligning visual axes of multiple TDI CCD detectors |
| CN109581827B (en) * | 2019-01-10 | 2020-06-09 | 中国科学院光电技术研究所 | Photoetching projection objective lens optimal focal plane detection device and method |
| CN112305862B (en) * | 2019-07-25 | 2021-06-18 | 上海微电子装备（集团）股份有限公司 | Workpiece table position calibration method, FLS vertical positioning tool and workpiece table measuring system |
| CN110375962B (en) * | 2019-08-15 | 2024-05-31 | 中科院南京天文仪器有限公司 | Device and method for calibrating focal plane of optical system based on front-end cluster illumination |
| CN113124751B (en) * | 2019-12-31 | 2022-07-29 | 上海微电子装备（集团）股份有限公司 | Scattering measurement device and scattering measurement method |
| CN111458991A (en) * | 2020-04-14 | 2020-07-28 | 湖南印之明智能制造有限公司 | Focal length adjusting method suitable for photoetching machine |
| CN112505664B (en) * | 2020-11-27 | 2023-07-14 | 北京航天计量测试技术研究所 | Laser radar light path adjustment method |
| CN112731773B (en) * | 2020-12-31 | 2024-04-16 | 中国科学院微电子研究所 | Electron beam exposure machine, focusing method and device |
| CN114518221B (en) * | 2022-03-16 | 2024-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Method and device for detecting focal plane inclination value of objective lens based on exposure system |
| CN115103121A (en) * | 2022-07-05 | 2022-09-23 | 长江三峡勘测研究院有限公司（武汉） | Slope oblique photography device, image data acquisition method and image data acquisition instrument |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359188A (en) * | 2007-08-02 | 2009-02-04 | 优志旺电机株式会社 | Exposure apparatus of belt type workpiece and focusing regulation method thereof |
| CN102207694A (en) * | 2010-03-31 | 2011-10-05 | 上海微电子装备有限公司 | Imaging adjustment unit and focusing and leveling control system using the unit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4311713B2 (en) * | 2003-03-10 | 2009-08-12 | キヤノン株式会社 | Exposure equipment |
| KR20090064024A (en) * | 2007-12-14 | 2009-06-18 | 주식회사 동부하이텍 | System for compensating focus of exposure fitting, method for compensating focus of exposure fitting, apparatus for detecting focus of exposure fitting, method for detecting focus of exposure fitting |
-
2015
- 2015-11-30 CN CN201510856628.6A patent/CN106814546B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101359188A (en) * | 2007-08-02 | 2009-02-04 | 优志旺电机株式会社 | Exposure apparatus of belt type workpiece and focusing regulation method thereof |
| CN102207694A (en) * | 2010-03-31 | 2011-10-05 | 上海微电子装备有限公司 | Imaging adjustment unit and focusing and leveling control system using the unit |
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