KR101823189B1 - Inductor Assembly - Google Patents

Abstract

The inductor assembly according to the present invention includes a dielectric body having a lower surface provided with a mounting surface and corresponding upper surfaces, both side surfaces in the longitudinal direction, and both lateral surfaces in the width direction, and a dielectric body formed on both the lower surface and both sides in the longitudinal direction A substrate having an inductor including an external electrode, a substrate having a pad electrically connected to an external electrode of the inductor on an upper surface thereof, and a solder electrically connecting the external electrode and the pad, a, b, d, and e satisfy a relationship of a, b, d, and e when the length of the external electrode in the width direction is b, the length of the pad in the length direction is d, To provide an inductor assembly that meets the equation to increase reliability in orientation when mounted on a substrate to prevent shorting or soldering disturbances between adjacent chips.

Description

Inductor Assembly < RTI ID = 0.0 >

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductor assembly, and more particularly, to an inductor assembly having high directional reliability in which an inductor is mounted on a substrate.

An inductor, which is one of the chip electronic components, is a passive element that removes noise by forming an electronic circuit together with a resistor and a capacitor. The inductor is combined with a capacitor using an electromagnetic characteristic, A resonant circuit for amplifying a signal, a filter circuit, and the like.

In recent years, miniaturization and thinning of IT devices such as various communication devices and display devices are accelerating. Researches on miniaturization and thinning of various devices such as inductors, capacitors, and transistors employed in IT devices are also being continuously carried out. Thus, the inductor has been rapidly switched to a chip capable of miniaturization and high density automatic surface mounting, and the development of a thin film type inductor in which a magnetic powder is mixed with a resin on a coil pattern formed by plating on the upper and lower surfaces of a thin insulating substrate .

In addition, due to the trend toward downsizing and miniaturization, the mounting of electronic components is also highly integrated, thereby minimizing the space between mounted electronic components.

On the other hand, in the case of a conventional chip-type inductor, an inner coil structure exists in the top and bottom of the inductor body. In order to electrically connect the in / out leads, an outer electrode is applied to the outer surface of the main body, . As a result, external electrodes are formed on six outer surfaces of the inductor main body.

In this case, in the case of the conventional chip-type inductor, external electrodes are formed on the upper surface of the ceramic body of the inductor. In this case, the external electrode formed on the upper surface of the ceramic body may come in contact with the metal can, Parts set can cause malfunction.

The applicant of the present invention has proposed a chip type coil component in which the outer electrode on the upper surface of the inductor is removed so that the interference problem such as short circuit does not occur even when the electronic component set is brought into contact with the metal can in Patent Document 10-2012-0122589.

On the other hand, when such a chip-type inductor is mounted on a substrate, the chip is mounted by electrically connecting the pad provided on the substrate and the external electrode through soldering. 1, when there is a distance between the pads 211 provided on the substrate and the external electrodes 131 and 132 of the inductor in the soldering process, Uneven attraction force acts between the external electrode 211 and the external electrodes 131 and 132 of the inductor, and the mounting angle of the inductor is distorted.

If the mounting angle of the inductor is changed as described above, a short circuit between the adjacent chip components and soldering may occur.

Patent Publication No. 10-2012-0122589

SUMMARY OF THE INVENTION The present invention is directed to provide an inductor assembly having high reliability in directionality when an inductor is mounted on a substrate.

The inductor assembly according to the present invention includes a dielectric body having a lower surface provided with a mounting surface and corresponding upper surfaces, both side surfaces in the longitudinal direction, and both lateral surfaces in the width direction, and a dielectric body formed on both the lower surface and both sides in the longitudinal direction A substrate having an inductor including an external electrode, a substrate having a pad electrically connected to an external electrode of the inductor on an upper surface thereof, and a solder electrically connecting the external electrode and the pad, a and the length in the width direction of the external electrode is b, the following formula (1) can be satisfied.

[Equation 1]

The inductor assembly according to the present invention can satisfy the following expression (2), where d is the length in the longitudinal direction of the pad and e is the length in the longitudinal direction of the external electrode.

&Quot; (2) "

In the inductor assembly according to the present invention, the main body may be formed by stacking a plurality of dielectric layers.

In the inductor assembly according to the present invention, the inductor may further include a conductor pattern formed on the dielectric layer and connected to have a coil structure.

In the inductor assembly according to the present invention, the external electrodes may be additionally formed on both sides in the width direction of the main body.

In the inductor assembly according to the present invention, an insulating layer may be formed on an area of the surface of the dielectric body where the external electrode is not formed.

In the inductor assembly according to the present invention, an insulating layer may be formed on the entire surface of the dielectric body, and an external electrode may be formed on the insulating layer.

The inductor assembly according to the present invention includes a dielectric body having a lower surface provided with a mounting surface and corresponding upper surfaces, both side surfaces in the longitudinal direction, and both lateral surfaces in the width direction, and a dielectric body formed on both the lower surface and both sides in the longitudinal direction A substrate having an inductor including an external electrode, a substrate having a pad electrically connected to an external electrode of the inductor on an upper surface thereof, and a solder electrically connecting the external electrode and the pad, a and the length in the width direction of the external electrode is b, the following equation (3) can be satisfied.

&Quot; (3) "

The inductor assembly according to the present invention can satisfy the following equation (4) when the length of the pad in the longitudinal direction is d and the length of the external electrode in the longitudinal direction is e.

&Quot; (4) "

According to the inductor assembly of the present invention, since the inductor is mounted on the substrate, the reliability of the directionality is high, thereby preventing short-circuit between the adjacent chips and disturbance of soldering.

FIG. 1 is a conceptual diagram for explaining a misalignment when the inductor is mounted on a substrate. FIG.
2 is a perspective view of an inductor assembly in accordance with an embodiment of the present invention.
3 is a cross-sectional view taken along line A-A 'of Fig.
4 and 5 are perspective views of an inductor according to one embodiment of the present invention.
6 is an exploded perspective view of an inductor according to one embodiment of the present invention.
FIG. 7 is a schematic view for explaining a dimensional relationship between an external electrode and a pad in a substrate assembly according to an embodiment of the present invention; FIG.
8 and 9 show the relationship between the length a of the pad in the width direction and the length d in the longitudinal direction and the length b in the width direction and the length e in the longitudinal direction of the external electrode, (&thetas;).

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventive concept as defined by the appended claims. Other embodiments falling within the scope of the inventive concept may readily be suggested, but are also considered to be within the scope of the present invention.

In the following description, the same reference numerals are used to designate the same components in the same reference numerals in the drawings.

FIG. 2 is a perspective view of an inductor assembly 200 according to an embodiment of the present invention, FIG. 3 is a sectional view taken along line A-A 'of FIG. 2, 6 is an exploded perspective view of an inductor 100 according to an embodiment of the present invention.

When directions are defined to clearly explain the embodiment of the present invention, L, W and T denoted on the drawing indicate the longitudinal direction, the width direction and the thickness direction, respectively. Here, the dimension in the longitudinal direction of the inductor 100 may be larger than the dimension in the width direction. Further, the thickness direction can be used in the same concept as the lamination direction in which the dielectric layers are laminated.

2 and 3, an inductor assembly 200 according to an exemplary embodiment of the present invention includes an inductor 100, a substrate 210 on which the inductor 100 is mounted, 210 that are electrically connected to each other.

4 to 6, the inductor 100 according to an embodiment of the present invention includes a dielectric body 110, a plurality of conductor patterns 121, 122 and 123, and conductor patterns 121, 122, and 123, And a plurality of via electrodes 150 connecting the first and second electrodes 150 and 150 to form a coil.

External electrodes 131 and 132 may be formed on the lower surface and both sides of the dielectric body 110 in the longitudinal direction.

Referring to FIG. 5, the external electrodes 131 and 132 may be formed on both sides of the dielectric body 110 in the width direction.

At this time, upper and lower cover layers 111 and 112 are formed on the upper and lower surfaces of the dielectric body 110 to protect the plurality of conductor patterns 121, 122 and 123 printed inside the dielectric body 110 Can be formed.

The upper and lower cover layers 111 and 112 may be formed by laminating a single or a plurality of dielectric layers formed of a ferrite sheet in the thickness direction.

The dielectric body 110 is formed by laminating a plurality of dielectric layers 113 in the thickness direction and firing the dielectric body 110. The shape and dimensions of the dielectric body 110 and the number of layers of the dielectric layer 113 The present invention is not limited thereto.

Meanwhile, the dielectric layer 113 may be a ferrite sheet.

Here, an insulating layer (not shown) may be formed on an outer surface of the dielectric body 110 in a region where the external electrodes 131 and 132 are not formed.

At this time, it is possible to prevent the dielectric body 110 from being contaminated from external moisture, foreign matter, etc. by the insulating layer (not shown).

The insulating layer (not shown) may be formed by applying a material such as silicon or epoxy, or may be formed by coating a glass.

On the other hand, an insulating layer (not shown) may be formed on the entire surface of the dielectric body 110, and the external electrodes 131 and 132 may be formed on the insulating layer (not shown). In other words, the insulating layer (not shown) may be formed to surround the entire surface of the dielectric body 110, and then the external electrodes 131 and 132 may be formed. Accordingly, it is possible to block foreign substances penetrating through the external electrodes 131 and 132, thereby protecting the dielectric body 110 more efficiently.

The conductive patterns 121, 122, and 123 may be formed by printing a conductive paste containing a conductive metal to a predetermined thickness on each of the dielectric layers 113.

For example, the conductive patterns 121, 122 and 123 may be made of a material containing silver (Ag), copper (Cu), or an alloy thereof, but the present invention is not limited thereto.

The total number of stacked layers of the dielectric layers 113 on which the conductor patterns 121, 122, and 123 are formed can be variously determined in consideration of electrical characteristics such as inductance values required by the designed inductor 100.

On the other hand, at least two of the conductor patterns 121, 122 and 123 are formed of first and second connection patterns 121 and 122 having lead portions respectively led out through both end faces of the dielectric body 110 .

The lead portions may be electrically connected to the external electrodes 131 and 132 formed on both end faces of the dielectric body 110, respectively.

The via electrode 150 can be formed by filling a via hole formed in the dielectric layer 113 with a conductive paste having excellent electrical conductivity.

The conductive paste may be made of at least one of silver (Ag), silver-palladium (Ag-Pd), nickel (Ni), and copper (Cu) or an alloy thereof. However, the present invention is not limited thereto.

The external electrodes 131 and 132 may be formed on both sides of the dielectric body 110 in the longitudinal direction. That is, on three surfaces of the surface of the dielectric body 110. Also, the external electrodes 131 and 132 may be electrically connected to the lead portions drawn out to the outside of the first and second connection patterns 124 and 125, respectively.

The external electrodes 131 and 132 may be made of a conductive metal material having excellent electrical conductivity.

For example, the external electrodes 131 and 132 may be made of a material including at least one of silver (Ag) and copper (Cu), or an alloy thereof, but the present invention is not limited thereto.

A nickel (Ni) layer (not shown) and a tin (Sn) layer (not shown) may be sequentially formed on the outer surfaces of the external electrodes 132 and 132 as necessary.

3, the length h1 of the external electrodes 131 and 132 in the thickness direction is determined by the length of the conductor pattern 121 located farthest from the lower surface of the dielectric body 110 at the lower surface of the dielectric body 110. [ And a length h3 from the lower surface of the dielectric body 110 to the upper surface of the dielectric body 110. In other words, That is, the external electrodes 131 and 132 may not be formed on the upper surface of the dielectric body 110.

Accordingly, when the electronic components are highly integrated in response to miniaturization of the electronic product, contact between the external electrode formed on the inductor 100 and the metal can covering the electronic product set can be prevented, and problems such as shorts and malfunctions occur .

In addition, since the external electrodes 131 and 132 are not formed on the upper surface of the inductor 100, problems such as space can be solved and the effective area of the product can be increased.

In addition, the production cost of the product can be reduced.

The substrate 210 may include a pad 211 electrically connected to the external electrodes 131 and 132 on one side.

The pad 211 may be made of a conductive metal material having excellent electrical conductivity.

For example, the pad 211 may be made of a material including at least one of silver (Ag) and copper (Cu), or an alloy thereof, but the present invention is not limited thereto.

A nickel (Ni) layer (not shown) and a tin (Sn) layer (not shown) may be sequentially formed on the outer surface of the pad 211 from the inside as necessary.

The solder 220 may electrically connect the pad 211 and the external electrodes 131 and 132.

Here, the solder 220 may be formed by a wave soldering method or a reflow soldering method.

Wave soldering, also called flow soldering, refers to a method in which a component is placed on a substrate, temporarily soldered with an adhesive or the like, and then soldered to the surface of a circulating molten solder. Reflow soldering is a method in which Refers to a method of bonding solder to a portion to be bonded in a manufacturing process, that is, solder is melted and printed after printing creamy solder in advance on the pad.

However, in the inductor assembly according to an embodiment of the present invention, the soldering method is not limited to the wave soldering or the reflow soldering method.

1, when the solder 220 electrically connecting the pads 211 and the external electrodes 131 and 132 is in a molten state during the soldering process, An engaging angle θ is generated when the inductor 100 is mounted as the attracting force of the coil 220 acts unbalanced.

7 and 8 are schematic views for explaining the dimensional relationship between the external electrodes 131 and 132 and the pads 221 in the substrate assembly 100 according to the embodiment of the present invention. The length a in the width direction and the length d in the longitudinal direction of the external electrodes 131 and 132 and the length b in the width direction and the length e in the length direction of the external electrodes 131 and 132, ?) of the reference data.

The angular deviation angle θ is caused by the dimensionless mismatch between the pad 211 and the external electrodes 131 and 132. When the angle of deflection θ is 5 degrees or more The inductor 100 may be brought into contact with another adjacent chip mounted on the substrate 210 to cause short and soldering disturbances.

When the length of the pad 211 in the width direction is a and the length of the external electrodes 131 and 132 in the width direction is b in order to minimize the angle deviation angle θ, 1 can be satisfied.

[Equation 1]

In addition, more preferably, the length of the pad 211 in the longitudinal direction is d, and the length of the external electrodes 131 and 132 in the longitudinal direction is e.

&Quot; (2) "

Referring to FIG. 8, it can be seen that when the above equations (1) and (2) are satisfied, the angular deviation angle? Can be kept less than 5 degrees.

On the other hand, in order to minimize the angle of deviation?, The following equation (3) may be satisfied.

&Quot; (3) "

In addition to this, more preferably, the following expression (4) can also be satisfied.

&Quot; (4) "

Referring to FIG. 9, it can be seen that when the above-mentioned equations (3) and (4) are satisfied, the angular deviation angle? Can be kept less than 5 degrees.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. And will be apparent to those skilled in the art.

100: inductor
110: dielectric body
113: dielectric layer
121, 122, 123: Conductor pattern
131, 132: external electrode
150: via electrode
200: Inductor assembly
210: substrate
211: Pad
220: Solder

Claims (11)

An inductor including a lower surface provided as a mounting surface and a top surface, both side surfaces in the longitudinal direction, and both side surfaces in the width direction, and an external electrode formed on both the lower surface and both longitudinal sides of the main body;
And a pad electrically connected to an external electrode of the inductor on an upper surface thereof; And
And a solder for electrically connecting the external electrode and the pad,
The length of the pad in the width direction is a, and the length of the external electrode in the width direction is b, the inductor assembly satisfies the following expression (1).
[Equation 1]

The method according to claim 1,
The length of the pad in the longitudinal direction is d, and the length of the external electrode in the longitudinal direction is e, the inductor assembly satisfies the following formula (2).
&Quot; (2) "

The method according to claim 1,
Wherein the main body is formed by stacking a plurality of dielectric layers.
The method of claim 3,
Wherein the inductor further comprises a conductor pattern formed on the dielectric layer and connected to have a coil structure.
The method according to claim 1,
Wherein the external electrodes are additionally formed on both lateral sides of the body.
The method according to claim 1,
Wherein an insulating layer is formed on an area of the surface of the dielectric body where the external electrode is not formed.
The method according to claim 1,
An inductor assembly having an insulating layer formed on the entire surface of the dielectric body, and external electrodes formed on the insulating layer.
An inductor including a lower surface provided as a mounting surface and a top surface, both side surfaces in the longitudinal direction, and both side surfaces in the width direction, and an external electrode formed on both the lower surface and both longitudinal sides of the main body;
And a pad electrically connected to an external electrode of the inductor on an upper surface thereof; And
And a solder for electrically connecting the external electrode and the pad,
And the length of the pad in the width direction is a and the length of the external electrode in the width direction is b.
&Quot; (3) "

9. The method of claim 8,
The length of the pad in the longitudinal direction is d, and the length of the external electrode in the longitudinal direction is e, the inductor assembly satisfies the following expression (4).
&Quot; (4) "

9. The method of claim 8,
Wherein the main body is formed by stacking a plurality of dielectric layers.
11. The method of claim 10,
Wherein the inductor further comprises a conductor pattern formed on the dielectric layer and connected to have a coil structure.

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