KR101057674B1 - Printed Circuit Board Manufacturing Method - Google Patents

Abstract

The present invention provides a method for manufacturing a printed circuit board having a double-sided simultaneous thin substrate that is significantly improved in productivity compared to the conventional single-sided work and is advantageous for thin plate workability. Through this manufacturing method, productivity can be significantly improved compared to the conventional single-sided work, that is, by simultaneously working on both sides, the productivity can be doubled and the current equipment can be used as it is without the investment of new equipment. In addition, the productivity is doubled, it is advantageous for the sheet workability, and in the existing method, there was a problem of polishing due to the thin plate, the present invention solves this problem.

Printed circuit board

Description

Printed Circuit Board Manufacturing Method {METHOD OF MANUFACTURING PCB}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board manufacturing method, and more particularly, to a printed circuit board manufacturing method having a double-sided simultaneous thin substrate which is significantly improved in productivity compared to the conventional single-sided work and is advantageous for sheet workability.

Recently, printed circuit boards are making efforts to manufacture printed circuit boards having a much thinner substrate than conventional ones. Conventionally, a printed circuit board having such a thin substrate has been generally manufactured by manufacturing a product through a cross-sectional operation in which a circuit is formed on each cross section by using a carrier layer to support the thin, and then laminated.

However, this cross-sectional work had a problem of low productivity, and also in the conventional method, there was a problem of polishing due to the thin plate.

The present invention, which was devised to solve the above problems, provides a method for manufacturing a printed circuit board having a double-sided simultaneous thin substrate which is significantly improved in productivity compared to the existing single-sided work and is advantageous for thin plate workability. For the purpose of.

In order to achieve the above object, according to an embodiment of the present invention, the first carrier copper foil layer and the first thin copper foil layer grafted to each other, the second carrier copper foil layer and the second thin copper foil layer Laminating each other via one prepreg layer ((a) step); Forming a first circuit and a second circuit on the first thin copper foil layer and the second thin copper foil layer, respectively (step (b)); A third carrier copper foil layer and a third thin copper foil layer grafted to each other, and a second prepreg layer, a release member, and a second b prepreg layer between a fourth carrier copper foil layer and a fourth thin copper foil layer grafted to each other. Laminating each other (step (c)); Forming a third circuit and a fourth circuit on the third thin copper foil layer and the fourth thin copper foil layer, respectively (d); By removing the release member, the portion A consisting of the 2a prepreg layer, the third carrier copper foil layer, the third thin copper foil layer, and the third circuit, the 2b prepreg layer, the fourth carrier copper foil layer, Obtaining a portion B consisting of the fourth thin copper foil layer and the fourth circuit (step (e)); Stacking the printed circuit board formed by the steps (a) and (b) and the portion A with the third circuit board facing the first circuit with the third propreg layer ((f ) step); Stacking (b) the printed circuit board formed by the step (f) and the B portion with the fourth circuit facing the second circuit, via the fourth prepreg layer; The 2nd prepreg layer, the 3rd carrier copper foil layer, the 2b prepreg layer, and the 4th carrier copper foil layer were removed, and laser or mechanical through-hole processing, copper plating resist formation, and copper plating were performed, and the 3rd circuit and the 1st Connecting the circuits to each other and connecting the fourth circuit and the second circuit ((h) step); Removing the overhang copper plating (step (i)); ((J) step) forming a strip or a copper frame on the third thin copper foil layer and the four thin copper foil layer, respectively; And ((k) step) separating the first carrier copper foil layer and the first thin copper foil layer by applying a physical force, and the second carrier copper foil layer and the second thin copper foil layer (step (k)). Provided is a circuit board manufacturing method.

Next, after step (k), each of the separated printed circuit boards is subjected to flash etching, whereby the fourth thin copper foil layer, the third thin copper foil layer, and the first thin copper foil, on which the strip or copper frame is not formed, are performed. And removing the second thin copper foil layer (step (l)).

In addition, after the step (l), it is preferable to further include a step (m) step of performing the PSR and the post-process for each printed circuit board.

Further, the A part and the B part may be made through the same steps (c) and (d), or may be made through separate steps (c) and (d), respectively. .

Further, between the first carrier copper foil layer and the first thin copper foil layer, between the second carrier copper foil layer and the second thin copper foil layer, between the third carrier copper foil layer and the third thin copper foil layer, and the first It is preferable that the temporary welding between a 4 carrier copper foil layer and a said 4th thin copper foil layer is temporally welded.

Further, the first carrier copper foil layer, the second carrier copper foil layer, the third carrier copper foil layer, and the fourth carrier copper foil layer have a thickness of 18 micrometers, and the first thin copper foil layer and the second thin foil It is preferable that a copper foil layer, the said 3rd thin copper foil layer, and the said 4th thin copper foil layer have thickness of 3 micrometers.

It is also possible to perform the steps (f) and (g) in reverse order.

According to the method of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

First, productivity can be significantly improved compared to conventional cross section work. In other words, since both sides work at the same time, the productivity can be improved by twice.

Second, while the existing equipment can be used as it is without the investment of new equipment, the productivity is doubled.

Third, it is possible to manufacture a printed circuit board having a thin substrate in favor of thin sheet workability. In other words, in the past, when the thin plate operation, the thin copper foil layer is too thin to be folded or wrinkled adversely affects the workability, but the present invention solves this problem.

Fourth, the conventional method, there was a problem of polishing due to the thin plate, the present invention solves this.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a schematic diagram briefly showing a process of a printed circuit board manufacturing method having a double-sided simultaneous thin substrate according to an embodiment of the present invention. That is, Figure 1 (a) is a view for explaining the step (a) of the process of the printed circuit board manufacturing method having a double-sided simultaneous thin substrate according to an embodiment of the present invention, Figure 1 (b), (B) is a view illustrating a step of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention, Figure 1 (c) is a double-sided simultaneous in accordance with an embodiment of the present invention A step (c) of the process of manufacturing a printed circuit board manufacturing method having a thin substrate, Figure 1 (d) is a manufacturing method of a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention FIG. 1 (d) is a diagram illustrating step (d) of the process, and FIG. 1 (e) is a diagram illustrating step (e) of the process of the method of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention. 1 (f, g) illustrates a double-sided simultaneous thin substrate according to an embodiment of the present invention. Is a diagram illustrating steps (f) and (g) of the process of manufacturing a printed circuit board, and FIG. 1 (h) shows a method of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention. FIG. 1 (i) is a view illustrating step (h) during the process of FIG. 1, and (i) illustrates step (i) during the process of the method of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention. 1 (j) is a view for explaining step (j) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention, and FIG. 1 is a view illustrating a step (k) of a process of a printed circuit board manufacturing method having a double-sided simultaneous thin substrate according to an embodiment of the present invention, and FIG. A diagram illustrating step (l) in the process of the method of manufacturing a printed circuit board having a simultaneous thin substrate. And, in (m) 1 is a view for explaining the step of (m) steps in the method for producing a printed circuit board having a double-sided simultaneous thin substrate according to one embodiment of the present invention.

First, as shown in (a) of FIG. 1, the first carrier copper foil layer 10 and the first thin copper foil layer 20 which are in contact with each other, the second carrier copper foil layer 30 and the second which are in contact with each other. The thin copper foil layer 40 is laminated with each other via the first prepreg layer 50 ((a) step).

Here, the temporary welding between the first carrier copper foil layer 10 and the first thin copper foil layer 20 and the temporary welding between the second carrier copper foil layer 30 and the second thin copper foil layer 40 are preferably welded by heat. Do. However, the present invention is not limited thereto, but it is possible to work on both sides simultaneously, that is, two sheets at the same time, as described below. Various modifications and variations will be possible if the seam can be separated. For example, they may be brought into contact with each other via an adhesive that can be separated from each other even with a small physical force.

In addition, the thickness of the 1st ultra-thin copper 20 and the 2nd thin copper foil layer 40 here is 3 micrometers normally, The 1st carrier copper foil layer 10 and the 2nd carrier copper foil layer It is preferable that the thickness of 30 is 18 micrometers normally.

In this way, the first prepreg layer PPG is placed in the middle while the thin copper foil layer having the carrier copper foil layer is placed on both sides.

Next, as shown in FIG. 1B, first and second circuits 60 are formed on the first thin copper foil layer 20 and the second thin copper foil layer 40, respectively ( (b) step). In this example, a circuit is formed using the MSAP method.

Next, as shown in (c) of FIG. 1, the third carrier copper foil layer 110 and the third thin copper foil layer 120 welded to each other, the fourth carrier copper foil layer 130 and the first welded copper foil The four thin copper foil layers 140 are laminated to each other via the second a prepreg layer 151, the release member 153, and the second b prepreg layer 152 (step (c)).

Here, the release member 153 is a junction between the second a prepreg layer 151 and the release member 153, and the second b prepreg layer 152 and the release member 153, as shown in FIG. 1E. As such, any component that can be easily removed can be used.

Like step (a), that is, between the first carrier copper foil layer 10 and the first thin copper foil layer 20, the second carrier copper foil layer 30 and the second thin copper foil layer 40 Similarly to the provisional gap therebetween, the gap between the third carrier copper foil layer 110 and the third thin copper foil layer 120 and between the fourth carrier copper foil layer 130 and the fourth thin copper foil layer 140. It is preferable to be welded by tangent and heat.

In addition, the third carrier copper foil layer 110 and the fourth carrier copper foil layer 130 also have a thickness of 18 micrometers, and the third thin copper foil layer 120 and the fourth thin copper foil layer ( 140 also preferably has a thickness of 3 micrometers.

This step is the same as the step (a) except that the second prepreg layer 151, the release member 153, and the second b prepreg layer 152 are interposed instead of the first prepreg layer 50. Since the same steps are performed once more separately, other explanations are omitted.

Next, as shown in FIG. 1D, a third circuit and a fourth circuit 160 are formed on the third thin copper foil layer 120 and the fourth thin copper foil layer 140, respectively ( (d) step). Since this step also separates the same step as step (b) again, the description thereof is omitted.

Next, as shown in FIG. 1E, the release member 153 is removed to the 2a prepreg layer, the third carrier copper foil layer, the third thin copper foil layer, and the third circuit. A portion formed, and a B portion composed of the 2b prepreg layer, the fourth carrier copper foil layer, the fourth thin copper foil layer, and the fourth circuit are obtained (step (e)).

Such A and B portions are not only thin copper foil layers, but are supported by a 2a prepreg layer and a third carrier copper foil layer, a 2b prepreg layer and a fourth carrier copper foil layer. The case of adversely affecting workability such as folding can be avoided at the source.

Further, the A part and the B part may be made through the same steps (c) and (d), but may be made through separate steps (c) and (d), respectively. Do.

Here, the order of steps (a) and (b) and steps (c), (d) and (e) may be changed according to the choice of a person skilled in the art, and a process that proceeds simultaneously may be possible.

Next, as shown in (f, g) of FIG. 1, the third circuit 160 is disposed to face the first circuit 60, and the third propreg layer 210 is interposed therebetween. The printed circuit board formed by the steps (a) and (b) and the A portion are laminated (step (f)), and the fourth circuit 160 is faced with the second circuit 60. 4 Laminates the printed circuit board formed through the step (f) and the part B through the prepreg layer 220 (step (g)).

Here, for the sake of explanation, steps (f) and (g) are given in order, but of course, steps (f) and (g) may be reversed.

Next, as shown in FIG. 1H, the second a prepreg layer 151 and the third carrier copper foil layer 110, and the second b prepreg layer 152 and the fourth carrier copper foil layer 130. ), Laser or mechanical through-hole processing, copper plating resist formation and copper plating 200 are performed to connect the third circuit 160 and the first circuit 60 to each other, and the fourth circuit 160 and the first circuit. The two circuits 60 are connected (step (h)).

Here, removing the 2nd prepreg layer 151 and the 3rd carrier copper foil layer 110, and the 2nd prepreg layer 152 and the 4th carrier copper foil layer 130 is the 3rd carrier copper foil layer 110 ) And provide a constant physical force for the temporary welding between the third thin copper foil layer 120 and to separate from each other, and a constant physical force for the temporary welding between the fourth carrier copper foil layer 130 and the fourth thin copper foil layer 140. Means to separate from each other by providing.

Here, since processing the through-holes, forming a copper plating resist, and performing the copper plating 200 is generally known, the detailed description thereof will be omitted, and the processing of the through-holes, laser processing, or mechanical processing can be used. Various modifications and variations are possible as long as the configuration enables the third circuit and the first circuit to be connected to each other and the fourth circuit and the second circuit to be conducted.

Next, as shown in FIG. 1 (i), the overhang copper plating is removed (step (i)). For example, overhang copper plating can be removed by mechanical polishing.

Next, as shown in FIG. 1J, a strip or a copper frame 300 is formed on the third thin copper foil layer 120 and the fourth thin copper foil layer 140 (( j) step). Typically, by using the MSAP method on the third thin copper foil layer 120 and the fourth thin copper foil layer 140, a copper frame (copper frame) is formed on the strip or outside the unit, respectively, Stiffness) can be improved to manufacture a printed circuit board having a thin substrate.

Then, after improving the stiffness, as shown in Fig. 1 (k), by applying a predetermined physical force between the first carrier copper foil layer 10 and the first thin copper foil layer 20, the second carrier copper foil Separating between the layer 30 and the second thin copper foil layer 40 (step (k)).

As described above, the temporary welding between the first carrier copper foil layer and the first thin copper foil layer and the temporary welding between the second carrier copper foil layer and the second thin copper foil layer are welded by heat to provide a predetermined physical force. The parts which are welded together can be easily separated without damaging the elements.

Next, as shown in (l) of FIG. 1, after step (k), each of the separated printed circuit boards is subjected to flash etching, so that the strip or the copper frame is not formed. The fourth thin copper foil layer 140, the third thin copper foil layer 130, the first thin copper foil layer 20, and the second thin copper foil layer 40 are removed ((l) step).

In addition, as shown in (m) of FIG. 1, after the step (l), the PSR 400 and the post-process are further performed on each printed circuit board (step (m)). Since this process uses a known technique, the description thereof will be omitted. In addition, although the PSR 400 and the post process are further performed on the lower part in FIG. 1 (l), the PSR 400 and the post process are performed on the upper part in FIG. 1 (l). Further implementation, it is a matter of course that the result as shown in Fig. 1 (m) can be obtained.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications, changes and variations are possible within the scope of the claims to be described.

1 (a) is a view for explaining the step (a) of the process of the printed circuit board manufacturing method having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (b) is a view for explaining the step (b) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (c) is a view for explaining the step (c) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (d) is a view for explaining the step (d) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (e) is a view for explaining the step (e) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (f, g) is a view for explaining the steps (f) and (g) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (h) is a view for explaining the step (h) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (i) is a view for explaining the step (i) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (j) is a view for explaining the step (j) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

FIG. 1 (k) is a diagram illustrating step (k) of a process of a method of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention.

1 (l) is a view for explaining the step (l) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention,

1 (m) is a view for explaining the step (m) of the process of manufacturing a printed circuit board having a double-sided simultaneous thin substrate according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10 first carrier copper foil layer

20 1st thin copper foil layer

30 2nd carrier copper foil layer

40 second thin copper foil layer

50 first prepreg layer

60 first circuit and second circuit

110 3rd carrier copper foil layer

120 third thin copper foil layer

130 fourth carrier copper foil layer

140 4th thin copper foil layer

151 Second A Prepreg Layer

152 2nd prepreg layer

153 Release member

160 third and fourth circuits

200 copper plating

210 third prepreg layer

220 fourth prepreg layer

300 strips or copper frame

400 PSR

Claims (7)

(A) laminating each other with a first prepreg layer interposed between the first carrier copper foil layer and the first thin copper foil layer grafted to each other, and the second carrier copper foil layer and the second thin copper foil layer grafted to each other ((a) step); Forming a first circuit and a second circuit on the first thin copper foil layer and the second thin copper foil layer, respectively (step (b)); A third carrier copper foil layer and a third thin copper foil layer grafted to each other, and a second prepreg layer, a release member, and a second b prepreg layer between a fourth carrier copper foil layer and a fourth thin copper foil layer grafted to each other. Laminating each other (step (c)); Forming a third circuit and a fourth circuit on the third thin copper foil layer and the fourth thin copper foil layer, respectively (d); By removing the release member, the portion A consisting of the 2a prepreg layer, the third carrier copper foil layer, the third thin copper foil layer, and the third circuit, the 2b prepreg layer, the fourth carrier copper foil layer, Obtaining a portion B consisting of the fourth thin copper foil layer and the fourth circuit (step (e)); Stacking the printed circuit board formed by the steps (a) and (b) and the portion A with the third circuit board facing the first circuit with the third propreg layer ((f ) step); Stacking (b) the printed circuit board formed by the step (f) and the B portion with the fourth circuit facing the second circuit, via the fourth prepreg layer; The 2nd prepreg layer, the 3rd carrier copper foil layer, the 2b prepreg layer, and the 4th carrier copper foil layer were removed, and laser or mechanical through-hole processing, copper plating resist formation, and copper plating were performed, and the 3rd circuit and the 1st Connecting the circuits to each other and connecting the fourth circuit and the second circuit ((h) step); Removing the copper plating (step (i)); ((J) step) forming a strip or a copper frame on the third thin copper foil layer and the four thin copper foil layer, respectively; And Applying a physical force to separate between the first carrier copper foil layer and the first thin copper foil layer, and between the second carrier copper foil layer and the second thin copper foil layer ((k) step), A printed circuit board manufacturing method having a double-sided simultaneous thin substrate. The method of claim 1, After step (k), each of the separated printed circuit boards is subjected to flash etching, whereby the fourth thin copper foil layer, the third thin copper foil layer, the first thin copper foil layer, and the first thin copper foil layer on which the strip or copper frame is not formed A method of manufacturing a printed circuit board having a double-sided simultaneous thin substrate, further comprising the step of removing the two thin copper foil layers ((l) step). The method of claim 2, After the step (l), for each of the printed circuit board, further comprising the step of performing a PSR and a post-process (m) step of a printed circuit board manufacturing method having a double-sided simultaneous thin substrate. The method of claim 1, Both the A and B portions are made through the same steps (c) and (d), or are made through separate steps (c) and (d), respectively. Method of manufacturing a printed circuit board having a simultaneous thin substrate. The method of claim 1, Between the first carrier copper foil layer and the first thin copper foil layer, between the second carrier copper foil layer and the second thin copper foil layer, between the third carrier copper foil layer and the third thin copper foil layer, and the fourth carrier The temporary welding between a copper foil layer and a said 4th thin copper foil layer is welded by heat, The manufacturing method of the printed circuit board which has a double-sided simultaneous thin board | substrate. The method of claim 1, The first carrier copper foil layer, the second carrier copper foil layer, the third carrier copper foil layer and the fourth carrier copper foil layer have a thickness of 18 micrometers, Wherein the first thin copper foil layer, the second thin copper foil layer, the third thin copper foil layer and the fourth thin copper foil layer have a thickness of 3 micrometers. Way. The method of claim 1, A method for manufacturing a printed circuit board having a double-sided simultaneous thin substrate, characterized in that steps (f) and (g) are performed in reverse order.

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