JPS5997073A - High density mountable radiation detecting element - Google Patents

Abstract

PURPOSE:To make it possible to accurately detect incident X-rays while preventing the warpage generation of a collimator, by securing semiconductive radiation elements symmetrically to both side surfaces of the collimator. CONSTITUTION:A mount plate 2 and a semiconductive radiation detecting element 1 equipped with a signal lead wire 3 and a signal outtake terminal 4 are integrally secured to both sides of a conductive collimator 5 having large radiation inhibiting capacity. By forming the detecting element as mentioned above, the stress generated by the shrinkage of an adhesive to the collimator is balanced at the front and the back sides thereof and, therefore, the warpage generation of the collimator can be prevented. As a result, an incident X-ray amount can be accurately detected.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field to Which the Invention Pertains] The present invention relates to a radiation detection element for high-density mounting that is useful when applied to an X-ray imaging apparatus.

[Prior art and its problems]

A conventional radiation detection element has a configuration as shown in FIGS. 1 and 2. And 81 yen 1 The detection element shown in the figure has an electrode lead line 3 as shown in the figure! The mount plate 2 with the pole count prongs 4 attached thereto and the semiconductor radiation detection element 1 are fixed to one side of the collimator 50 and have an integrated configuration. The detection element shown in FIG.
It is housed in a housing 6 as shown in FIG. 2, and detects X-rays irradiated from the direction of the arrow. The detected signal is transmitted to the signal processing section 8. In such a conventional structure, the collimator is first required to be completely flat without warping, and even after the mount plate and semiconductor radiation detection element are fixed to one side of the collimator with adhesive, etc., there is no warping. It is required that the surface be flat and free from any blemishes. However, when a semiconductor radiation detection element is fixed to one side of a collimator, there is a high risk that warpage will occur due to shrinkage of the adhesive or the like. If the detection element shown in Figure 1 is warped and is stored in the housing in that state, the incident X-rays of the semiconductor radiation detection element, which should be parallel to the incident X-rays, The parallelism with respect to the X-ray beam is no longer maintained, and the amount of incident X-rays cannot be detected accurately.

If the X-ray imaging device cannot accurately detect the X-ray dose, artifacts (artificial pseudo-images unrelated to the subject) will occur in the image, leading to image deterioration. It is desired to develop a new detection element that improves this problem.

[Purpose of the invention]

An object of the present invention is to improve the problems of the prior art as described above and to provide a radiation detection element for high-density mounting that is useful when applied to an X-ray imaging apparatus.

[Summary of the invention]

The present invention maintains the parallelism of the semiconductor radiation detection element to incident X-rays by symmetrically integrating and fixing semiconductor radiation detection elements on both sides of a collimator made of a material that has a high blocking ability against radiation. It is.

[Embodiments of the invention]

Embodiments of the present invention will be described with reference to FIGS. 3, 4, and 5. In the present invention, a conductive collimator (for example, W or Mo) 5 having a large radiation blocking ability is attached with a mount plate 2 and a semiconductor radiation detection element 1 symmetrically fixed to each other with a signal lead line 3 and a signal take-out terminal 4 on both sides. It is a detection element with an integrated structure. As shown in FIG. 4, a semiconductor radiation detection element having an Au thin film 8 and an A/thin film 9, which serve as contacts and electrodes, is fixed to a collimator with a thin layer of conductive paste 10 interposed therebetween. The M electrode is grounded, and the AJ electrodes of the semiconductor radiation detection elements on both sides of the flimator are grounded from the electrode tabs 11 of the collimator. Mounting plates 2 with signal lead-out lines and signal extraction terminals are also fixed on both sides of the collimator with adhesive, and are connected to the Au electrodes of the semiconductor radiation detection element by Au vapor deposition or conductive paste, and the signals of the Au electrodes are connected to the signals. It is taken out by the takeout terminal. The surface of the element is coated to protect and insulate the electrodes.

If the structure is such that the semiconductor radiation detection element mounting plates are symmetrically fixed on both sides of the collimator, the stress on the collimator caused by shrinkage of adhesive etc. will be balanced between the front and back sides, so it will be applied to only one side of the collimator. Warpage that occurs when the semiconductor radiation detection element mount plate is fixed can be eliminated.

As shown in FIG. 5, this detection element is housed in a housing in which a collimator is arranged to prevent the semiconductor radiation detection elements from directly collapsing into each other. The semiconductor radiation detection element detects the amount of X-rays incident parallel to the collimator, and a detection signal is transmitted to the signal processing section 7.

[Modified example of the invention]

Note that the shape of the mount plate shown in the above embodiment can be made arbitrary. For example, as shown in FIG. 6, several signal extraction terminals can be provided and used selectively. Further, the meter placed in the housing can also be placed after the detection element is housed. Furthermore, although the Mt pole of the detection element is grounded from the electrode tab of the collimator, it is also possible to use a conductive material for the casing that houses the detection element and to ground it through the casing.

〔Effect of the invention〕

According to the present invention, it is possible to prevent warpage that occurs when a semiconductor radiation detection element mount plate is fixed to one side of a conventional collimator, thereby maintaining the parallelism of the semiconductor radiation detection element to incident X-rays. be able to.

That is, since the incident X-ray dose can be detected accurately,
When applied to an X-ray imaging device, artifacts conventionally caused by deviations in parallelism of a semiconductor radiation detection element with respect to incident X-rays disappear, and image quality can be improved. In order to prevent image quality from deteriorating, the collimator that fixes the semiconductor radiation detection element is likely to require high processing precision, but in the present invention, the number of collimators that fix the semiconductor radiation detection element is half of all collimators. The remaining half of the collimators are arranged between adjacent detection elements in the housing, but due to the structure of this collimator, high processing precision is not required for the collimator that fixes the semiconductor radiation detection element.

In this way, the number of collimators that require high processing accuracy is halved, so costs can be reduced. Me 1r white

[Brief explanation of drawings]

1 and 2 are diagrams showing the configuration of a conventional radiation detection element, and FIGS. 3, 4, and 5 are diagrams illustrating an embodiment of the radiation detection element for high-density mounting of the present invention. Figure 6
The figure is a diagram for explaining the present invention in detail. 1... Semiconductor radiation detection element, 2... Mount plate 3
...Signal extraction t7 line, 4...Signal extraction terminal 5
... Collimator, 6... Housing 7... Signal processing unit, 8... Au thin film 9... Al thin film, 10...
...Conductive paste 11...Electrode tab, 12...
・Adhesive 13...Coating layer. Agent: Patent Attorney Noriyuki Chika (and 1 other person) No. 1
Figure 2 Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] A radiation detection element for high-density mounting, characterized in that the semiconductor radiation detection element is fixed symmetrically to both sides of a collimator made of a material having a high radiation blocking ability.