JPS59192863U - Chip-shaped electronic components - Google Patents

Chip-shaped electronic components

Info

Publication number
JPS59192863U
JPS59192863U JP8784383U JP8784383U JPS59192863U JP S59192863 U JPS59192863 U JP S59192863U JP 8784383 U JP8784383 U JP 8784383U JP 8784383 U JP8784383 U JP 8784383U JP S59192863 U JPS59192863 U JP S59192863U
Authority
JP
Japan
Prior art keywords
chip
shaped electronic
electronic components
conductive layer
resin molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8784383U
Other languages
Japanese (ja)
Inventor
島　利浩
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP8784383U priority Critical patent/JPS59192863U/en
Publication of JPS59192863U publication Critical patent/JPS59192863U/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例のチップ形電子部品の平面図
、第２図は第１図の導電パッド部分の拡大断面図、第３
図は第１図のチップ形電子部品の正面図、第４図は本考
案の他の実施例のチップ形電子部品の平面図である。 １：集積回路素子（チップ形電子部品）、３゜１２：樹
脂成形部、４ａ：導電パッド（導電層）、４ｂ：導電パ
ターン（導電層）、１１：放熱板、１３：導電層。FIG. 1 is a plan view of a chip-shaped electronic component according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view of the conductive pad portion of FIG. 1, and FIG.
The figure is a front view of the chip-shaped electronic component of FIG. 1, and FIG. 4 is a plan view of the chip-shaped electronic component of another embodiment of the present invention. 1: Integrated circuit element (chip type electronic component), 3° 12: Resin molded part, 4a: Conductive pad (conductive layer), 4b: Conductive pattern (conductive layer), 11: Heat sink, 13: Conductive layer.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）素子本体と、この素子本体を封止する樹脂成形部
と、この樹脂成形部の外面に形成された導電層とを具備
することを特徴とするチップ形電子部品。(1) A chip-shaped electronic component comprising an element body, a resin molded part for sealing the element body, and a conductive layer formed on the outer surface of the resin molded part. （２）導電層の一部は素子本体に電気的に接続されてい
ることを特徴とする実用新案登録請求の範囲第１項記載
のチップ形電子部品。(2) The chip-shaped electronic component according to claim 1, wherein a part of the conductive layer is electrically connected to the device body. （３）樹脂成形部は、その外面に連接された放熱板を有
し、この放熱板上に絶縁被膜を介して導電層が形成され
ていることを特徴とする実用新案登録請求の範囲第１項
記載のチップ形電子部品。(3) The resin molded part has a heat dissipation plate connected to its outer surface, and a conductive layer is formed on the heat dissipation plate via an insulating coating. Chip-type electronic components described in Section 1.
JP8784383U 1983-06-10 1983-06-10 Chip-shaped electronic components Pending JPS59192863U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8784383U JPS59192863U (en) 1983-06-10 1983-06-10 Chip-shaped electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8784383U JPS59192863U (en) 1983-06-10 1983-06-10 Chip-shaped electronic components

Publications (1)

Publication Number Publication Date
JPS59192863U true JPS59192863U (en) 1984-12-21

Family

ID=30217756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8784383U Pending JPS59192863U (en) 1983-06-10 1983-06-10 Chip-shaped electronic components

Country Status (1)

Country Link
JP (1) JPS59192863U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5066168A (en) * 1973-10-12 1975-06-04
JPS5976455A (en) * 1982-10-26 1984-05-01 Tdk Corp Hybrid integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5066168A (en) * 1973-10-12 1975-06-04
JPS5976455A (en) * 1982-10-26 1984-05-01 Tdk Corp Hybrid integrated circuit

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