JPS58103102U - thick film integrated circuit - Google Patents
thick film integrated circuitInfo
- Publication number
- JPS58103102U JPS58103102U JP1982000342U JP34282U JPS58103102U JP S58103102 U JPS58103102 U JP S58103102U JP 1982000342 U JP1982000342 U JP 1982000342U JP 34282 U JP34282 U JP 34282U JP S58103102 U JPS58103102 U JP S58103102U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- integrated circuit
- film integrated
- film element
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の厚膜集積回路における厚膜素子の平面図
、第2図は、本考案の厚膜集積回路における調整用厚膜
素子の平面図、そして第3図は本考案の厚膜集積回路に
おいて従来よりも仏法な調整を行なった場合の調整用厚
膜素子部分の縦断面図である。
ia、 lb・・・導体ランド、2・・・厚膜体、3
・・・厚膜素子、4a、 4b・・・接着樹脂、5・
・・チップ抵抗、6・・・抵抗体、7・・・セラミック
基板。FIG. 1 is a plan view of a thick film element in a conventional thick film integrated circuit, FIG. 2 is a plan view of an adjustment thick film element in a thick film integrated circuit of the present invention, and FIG. 3 is a plan view of a thick film element of the present invention. FIG. 7 is a longitudinal cross-sectional view of a thick film element for adjustment when a more advanced adjustment than the conventional one is performed in an integrated circuit. ia, lb...conductor land, 2...thick film body, 3
...Thick film element, 4a, 4b...Adhesive resin, 5.
...Chip resistor, 6...Resistor, 7...Ceramic substrate.
Claims (1)
て、前記調整用厚膜素子の導体ランドをチップ部品が搭
載できる形状、寸法に形成したことを特徴とする厚膜集
積回路。1. A thick film integrated circuit having a thick film element for adjusting circuit functions, characterized in that a conductive land of the thick film element for adjustment is formed in a shape and size that allows chip components to be mounted thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982000342U JPS58103102U (en) | 1982-01-07 | 1982-01-07 | thick film integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982000342U JPS58103102U (en) | 1982-01-07 | 1982-01-07 | thick film integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58103102U true JPS58103102U (en) | 1983-07-13 |
Family
ID=30013424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982000342U Pending JPS58103102U (en) | 1982-01-07 | 1982-01-07 | thick film integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58103102U (en) |
-
1982
- 1982-01-07 JP JP1982000342U patent/JPS58103102U/en active Pending
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