JPS58141536A - Attracting head of semiconductor wafer - Google Patents

Abstract

PURPOSE:To realize perfect automatic operation of semiconductor wafer carrier by perfectly collecting gas from the sucking hole and thereby eliminating necessity of moving other semiconductor wafers placed on the support with gas flow. CONSTITUTION:A semiconductor wafer 16 is attracted, on the basis of the Bernoulli's theorem, by stable N<2> gas flow which blows gradiently toward the circumference from a blowing hole 11 through a gas introducing hole 18 and is collected from a sucking hole 12 through a vacuumed exhausting hole 19 after passing a groove 15. The attracting head moves carrying a semiconductor wafer 16 up to the support. Moreover, the attracting head moves downward, a self weight shutter 14 abuts on the support, a forcible shutter 13 moves downward isolating the wafer 16 from a sucking force. At this time, the semiconductor wafer 16 tries to move like a leaf of tree owing to an air resistance at the lower part, but since it is surrounded by the self weight shutter 14 and thereby an air resistance is unified and the wafer is placed to the desired position accurately under the restriction of the forcible shutter 13.

Description

[Detailed description of the invention] The present invention relates to improvements in suction heads for semiconductor wafers.

Recently, automation of the semiconductor manufacturing process has been promoted, and when wafers are transferred to an epitaxial growth apparatus, etc., a suction head is used to transfer the wafers without contact. As shown in Fig. 1, such a suction head has two air outlet holes (2) arranged radially on the surface of the head (1) diagonally in the direction of the outer periphery like a five-point mark (N).
2 gas is blown out at °C, and the semiconductor wafer (3) is adsorbed without contact with the semiconductor wafer (3) based on the principle of Bell Y.

In such a suction head, N2 gas is blown out from the blow-off hole (2) around the head, so there is a disadvantage that ``3), etc. must be moved to the semiconductor wafers arranged in ``'', and the advantage of automation is lost. Also, the semiconductor wafer (31 (-) always has a cutout called a facet for alignment.
This is due to the fact that the semiconductor wafer (31) sways or rotates once, causing the position to shift, which also loses the advantage of automation.

The present invention has been made in view of the above drawbacks, and it is an object of the present invention to provide a suction head for semiconductor wafers that completely eliminates the conventional drawbacks. An embodiment of the present invention will now be described in detail with reference to FIGS. 2-8 and 1-5.

The suction head for semiconductor work according to the present invention includes -, a rad body (1G, a ladle number of gas blow-off holes provided on the suction surface of the head body f+01), and a plurality of gases thrown onto the circumferential edge of the main body (1α). Suction hole 1121. Forced shutter t131g and heavy shutter f+41 provided around the head body (1α)
．． 1': wt1 has been removed.

The head body (1 (b) has a Teflon finish on the surface, and the suction surface is slightly from the center, and multiple gases are blown out from the center to the [7 and where 7). Air outlet (
11) is inclined so that the lj space is blown out in the direction of the outer circumference, and is 7'C.
There is.

The gas suction hole 1121 is an extension of the radius of one group of blowout holes -1,
A groove 051 is provided on the g1 suction surface between the g1 and the corresponding blowout hole to stabilize the flow.

Forced shutter 1'131 to the attracted semiconductor wire-
The peripheral edge of (16) comes into contact with the suction surface to adjust the height of the suction surface, thereby adjusting the suction force. The work that leads you to the right position.

The dead weight shutter old 1 is 0 up and down from the beast spoon of I' body.
), when transporting the sea urchin (16) (2 is a dead weight shutter (141 is a comb that makes it easy to collect the gas after dropping it), and when the glaze is removed, the old dead weight shutter is used) is a mounting table ( (not shown) is in contact with -C while 1- falls % adjacent sea urchin 2, -
Carving the gas at 0θ・\! ＃I "'fru.

A light-emitting power receiving sensor (17) is installed at the center of the eight suction tracks to detect the suction of the wafer (161).

According to the suction head of the present invention, the third factor (as shown by the arrow) is that the N2 gas is slanted toward the outer periphery through the gas outlet (181) and the outlet (11). 11!i
l is evacuated from the °C suction hole 112 to discharge rJl!
Stable JJ flow C to recover N gas through 1
From the second point, the semiconductor substrate is adsorbed using Pernoulli's principle. At this time, the forced shifter (131) at the peripheral end of the semiconductor wafer is brought into contact with the taper of the head to prevent the roll of the wafer flf+l from turning.Next, the suction head is moved, and the Transfer the wafer (1 (9) to the mounting table -1-1.
1 in contact with the mounting table and lower the forced shutter i+31.
ni-furu. At this time, the semiconductor wafer (1°) tries to move like a leaf due to the air resistance at the bottom of the wafer, but by surrounding it with the self-weight shutter (1), the air resistance becomes uniform and the forced shutter (1 “
(It is placed exactly in the desired position.

As detailed above, according to the present invention, in order to completely recover the gas through the suction hole, another semiconductor wafer placed on the mounting table is moved by the gas flow at a rate of ζ2%.・Have the advantage of not having to worry about it. In addition, the forced shutter X and self-weight shutter allow semiconductor wafers! Since the wafer can be placed on the mounting table 11, the semiconductor wafer transfer device can be fully operated with two movements.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view illustrating the conventional suction head 4 to 3, and Figures 2R and 3 are top views 1 and 3 illustrating the suction head of the present invention. "Klzo and 1...1 drawing. Explanation of main drawing numbers + 1 (Di He 2 Do Honhai, It II Ha II J tender,
TI2 is a suction hole, 031 is a forced shutter, 1141 is a dead weight shutter, (161 is a half-body wafer. Applicant: Sanyo Electric Co., Ltd. and 1 other attorney, 1 patent attorney: Shizuo Sano

Claims (1)

[Claims] 1. A head surface [equipped with a plurality of radial C2 air outlet holes and a suction hole provided on an extension of the air outlet holes. A suction head for a semiconductor wafer, characterized in that a semiconductor wafer is suctioned by a gas flow from the blow-off hole, and the large gas flow is collected into a suction hole. 2. Claim 1 provides that the groove is provided from the blow-off hole to the suction hole to define a path for the gas flow, and a downward suction head for a semiconductor wafer.