JPS57115444A - Thermoplastic resin composition for expansion molding - Google Patents

Thermoplastic resin composition for expansion molding

Info

Publication number
JPS57115444A
JPS57115444A JP93681A JP93681A JPS57115444A JP S57115444 A JPS57115444 A JP S57115444A JP 93681 A JP93681 A JP 93681A JP 93681 A JP93681 A JP 93681A JP S57115444 A JPS57115444 A JP S57115444A
Authority
JP
Japan
Prior art keywords
polymerization
bulk
thermoplastic resin
resin composition
graft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP93681A
Other languages
Japanese (ja)
Inventor
Yozo Kitagawa
Shunsuke Kobayashi
Kenichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Nippon Synthetic Chemical Industry Co Ltd
Original Assignee
Nippon Synthetic Chemical Industry Co Ltd
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Synthetic Chemical Industry Co Ltd, Japan Synthetic Rubber Co Ltd filed Critical Nippon Synthetic Chemical Industry Co Ltd
Priority to JP93681A priority Critical patent/JPS57115444A/en
Publication of JPS57115444A publication Critical patent/JPS57115444A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To prepare a composition capable of giving foamed product having excellent appearance and weather resistance at high rate of extrusion, and containing a graft polymer having a base rubber consisting of a non-dione-type rubber polymer obtained by solution polymerization, bulk polymerization, or bulk-suspension polymerization.
CONSTITUTION: The objective composition is prepared by compounding a foaming agent to a thermoplastic resin composition containing a graft polymer obtained by the graft polymerization of an aromatic vinyl compound or a monomer mixture composed of an aromatic vinyl compound and a vinyl monomer copolymerizable therewith to a non-diene-type rubber polymer by solution polymerization, bulk polymerization or bulk-suspension polymerization.
COPYRIGHT: (C)1982,JPO&Japio
JP93681A 1981-01-06 1981-01-06 Thermoplastic resin composition for expansion molding Pending JPS57115444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP93681A JPS57115444A (en) 1981-01-06 1981-01-06 Thermoplastic resin composition for expansion molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP93681A JPS57115444A (en) 1981-01-06 1981-01-06 Thermoplastic resin composition for expansion molding

Publications (1)

Publication Number Publication Date
JPS57115444A true JPS57115444A (en) 1982-07-17

Family

ID=11487553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP93681A Pending JPS57115444A (en) 1981-01-06 1981-01-06 Thermoplastic resin composition for expansion molding

Country Status (1)

Country Link
JP (1) JPS57115444A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131887A (en) * 1978-04-04 1979-10-13 Oki Electric Ind Co Ltd Manufacture of bipolar cmos-type integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131887A (en) * 1978-04-04 1979-10-13 Oki Electric Ind Co Ltd Manufacture of bipolar cmos-type integrated circuit

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